WO2014202217A3 - Kühlvorrichtung für ein stromumrichtermodul - Google Patents

Kühlvorrichtung für ein stromumrichtermodul Download PDF

Info

Publication number
WO2014202217A3
WO2014202217A3 PCT/EP2014/001659 EP2014001659W WO2014202217A3 WO 2014202217 A3 WO2014202217 A3 WO 2014202217A3 EP 2014001659 W EP2014001659 W EP 2014001659W WO 2014202217 A3 WO2014202217 A3 WO 2014202217A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling device
cooling
current converter
converter module
heat exchanger
Prior art date
Application number
PCT/EP2014/001659
Other languages
English (en)
French (fr)
Other versions
WO2014202217A2 (de
Inventor
Christoph Meyer
Original Assignee
VENSYS Elektrotechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VENSYS Elektrotechnik GmbH filed Critical VENSYS Elektrotechnik GmbH
Priority to EP14755771.4A priority Critical patent/EP3036765A2/de
Priority to CN201480045729.9A priority patent/CN105474385A/zh
Publication of WO2014202217A2 publication Critical patent/WO2014202217A2/de
Publication of WO2014202217A3 publication Critical patent/WO2014202217A3/de
Priority to US14/974,672 priority patent/US20160181177A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0246—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid heat-exchange elements having several adjacent conduits forming a whole, e.g. blocks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Die Erfindung betrifft eine Kühlvorrichtung für ein Stromumrichtermodul. Um die Temperaturdifferenz am Wärmetauscher in einer Kühlvorrichtung für ein Stromumrichtermodul möglichst gering zu halten, ist die Kühlvorrichtung versehen mit mit einem flüssiges Kühlmittel führenden Kühlflüssigkeitskanal, der zu einem Kühlkreislauf verschaltet ist, mit einem Wärmetauscher, der in dem Kühlkreislauf verschaltet ist und an dem wärmeleitend ein Leistungsbauelement gekoppelt ist, und mit einem Kühler zum Kühlen des flüssigen Kühlmittels, der in dem Kühlkreislauf verschaltet ist, wobei in dem Wärmetauscher mehrere Rohrleitungen derart parallel geschaltet sind ist, dass die Temperaturdifferenz am Wärmetauscher ein vorgegebenes Maß nicht überschreitet.
PCT/EP2014/001659 2013-06-18 2014-06-18 Kühlvorrichtung für ein stromumrichtermodul WO2014202217A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP14755771.4A EP3036765A2 (de) 2013-06-18 2014-06-18 Kühlvorrichtung für ein stromumrichtermodul
CN201480045729.9A CN105474385A (zh) 2013-06-18 2014-06-18 用于电流转换器模块的冷却装置
US14/974,672 US20160181177A1 (en) 2013-06-18 2015-12-18 Cooling Device for a Current Converter Module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013010087.9 2013-06-18
DE102013010087.9A DE102013010087A1 (de) 2013-06-18 2013-06-18 Kühlvorrichtung für ein Stromumrichtermodul

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/974,672 Continuation US20160181177A1 (en) 2013-06-18 2015-12-18 Cooling Device for a Current Converter Module

Publications (2)

Publication Number Publication Date
WO2014202217A2 WO2014202217A2 (de) 2014-12-24
WO2014202217A3 true WO2014202217A3 (de) 2015-03-05

Family

ID=51417243

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2014/001659 WO2014202217A2 (de) 2013-06-18 2014-06-18 Kühlvorrichtung für ein stromumrichtermodul

Country Status (5)

Country Link
US (1) US20160181177A1 (de)
EP (1) EP3036765A2 (de)
CN (1) CN105474385A (de)
DE (1) DE102013010087A1 (de)
WO (1) WO2014202217A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190115284A1 (en) * 2017-10-16 2019-04-18 David Herbert Livingston Cooling device and method for heat-generating components
US11925713B1 (en) 2023-03-03 2024-03-12 King Faisal University Reinforced porous collagen sheet

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051509A (en) * 1975-12-26 1977-09-27 Bbc Brown Boveri & Company Limited Apparatus for cooling electrical devices at different electrical potentials by means of a flowing medium
WO2007110718A2 (en) * 2006-03-25 2007-10-04 Clipper Windpower Technology, Inc Thermal management system for wind turbine
US20110284197A1 (en) * 2010-05-21 2011-11-24 Denso Corporation Heat Exchanger

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100423243C (zh) * 2003-10-20 2008-10-01 中国科学院广州能源研究所 微型高效自循环电子冷却器
US20050224212A1 (en) * 2004-04-02 2005-10-13 Par Technologies, Llc Diffusion bonded wire mesh heat sink
JP4305406B2 (ja) * 2005-03-18 2009-07-29 三菱電機株式会社 冷却構造体
CN101179917A (zh) * 2006-11-08 2008-05-14 财团法人工业技术研究院 一种环路型潜热散热方法和环路型潜热散热模块
JP2008221951A (ja) * 2007-03-09 2008-09-25 Sumitomo Light Metal Ind Ltd 自動車用電子部品の冷却装置
ITVI20080106A1 (it) * 2008-05-09 2009-11-10 Refcomp Spa Piastra di raffreddamento per un convertitore di frequenza e compressore impiegante tale piastra di raffreddamento
CN102097403A (zh) * 2010-11-25 2011-06-15 昆明理工大学 芯片热沉及带芯片热沉的芯片冷却装置
WO2012108053A1 (ja) * 2011-02-10 2012-08-16 三菱電機株式会社 冷却装置および電力変換装置
JP2012174856A (ja) * 2011-02-21 2012-09-10 Hitachi Cable Ltd ヒートシンク及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051509A (en) * 1975-12-26 1977-09-27 Bbc Brown Boveri & Company Limited Apparatus for cooling electrical devices at different electrical potentials by means of a flowing medium
WO2007110718A2 (en) * 2006-03-25 2007-10-04 Clipper Windpower Technology, Inc Thermal management system for wind turbine
US20110284197A1 (en) * 2010-05-21 2011-11-24 Denso Corporation Heat Exchanger

Also Published As

Publication number Publication date
DE102013010087A1 (de) 2014-12-18
WO2014202217A2 (de) 2014-12-24
CN105474385A (zh) 2016-04-06
EP3036765A2 (de) 2016-06-29
US20160181177A1 (en) 2016-06-23

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