EA201891963A2 - Система и способ охлаждения силовых электронных устройств - Google Patents

Система и способ охлаждения силовых электронных устройств

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Publication number
EA201891963A2
EA201891963A2 EA201891963A EA201891963A EA201891963A2 EA 201891963 A2 EA201891963 A2 EA 201891963A2 EA 201891963 A EA201891963 A EA 201891963A EA 201891963 A EA201891963 A EA 201891963A EA 201891963 A2 EA201891963 A2 EA 201891963A2
Authority
EA
Eurasian Patent Office
Prior art keywords
elements
power electronic
electronic devices
power transistor
capacitor
Prior art date
Application number
EA201891963A
Other languages
English (en)
Other versions
EA201891963A3 (ru
Inventor
Рудольф Гаррига
Майкл Кьюбик
Original Assignee
Клин Уэйв Текнолоджиз, Инк.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Клин Уэйв Текнолоджиз, Инк. filed Critical Клин Уэйв Текнолоджиз, Инк.
Publication of EA201891963A2 publication Critical patent/EA201891963A2/ru
Publication of EA201891963A3 publication Critical patent/EA201891963A3/ru

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Изобретение предлагает системы и способы охлаждения силовых электронных устройств с оптимизированной электромеханической структурой. Силовое электронное устройство может содержать один или более силовых транзисторных элементов, один или более конденсаторных элементов, один или более силовых соединительных элементов, которые могут быть электрически связаны с одним или более силовыми транзисторными элементами и одним или более конденсаторными элементами, и один или более теплоотводящих элементов. Один или более силовых транзисторных элементов и один или более конденсаторных элементов могут находиться в тепловой связи с одним или более теплоотводящими элементами, и каждый из них может быть расположен, по существу, на противоположных сторонах одного или более теплоотводящих элементов, так что тепло может передаваться от одного или более силовых транзисторных элементов и одного или более конденсаторных элементов к одному и тому же из одного или более теплоотводящих элементов.
EA201891963A 2011-05-05 2011-09-19 Система и способ охлаждения силовых электронных устройств EA201891963A3 (ru)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161482878P 2011-05-05 2011-05-05

Publications (2)

Publication Number Publication Date
EA201891963A2 true EA201891963A2 (ru) 2019-03-29
EA201891963A3 EA201891963A3 (ru) 2019-06-28

Family

ID=47107982

Family Applications (2)

Application Number Title Priority Date Filing Date
EA201891963A EA201891963A3 (ru) 2011-05-05 2011-09-19 Система и способ охлаждения силовых электронных устройств
EA201391645A EA031483B1 (ru) 2011-05-05 2011-09-19 Система и способ охлаждения силовых электронных устройств

Family Applications After (1)

Application Number Title Priority Date Filing Date
EA201391645A EA031483B1 (ru) 2011-05-05 2011-09-19 Система и способ охлаждения силовых электронных устройств

Country Status (9)

Country Link
US (3) US9516789B2 (ru)
EP (1) EP2705737A4 (ru)
JP (1) JP6072773B2 (ru)
KR (1) KR101936281B1 (ru)
CN (1) CN103782670B (ru)
BR (1) BR112013028489A2 (ru)
CA (1) CA2835079A1 (ru)
EA (2) EA201891963A3 (ru)
WO (1) WO2012150953A1 (ru)

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JP6926686B2 (ja) * 2017-06-02 2021-08-25 株式会社デンソー 電源装置
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US10765042B1 (en) 2019-02-22 2020-09-01 Ford Global Technologies, Llc Integrated power module and capacitor module thermal and packaging design
US11856687B2 (en) * 2021-12-21 2023-12-26 Semikron Elektronik Gmbh & Co. Kg Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device

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Also Published As

Publication number Publication date
US20170150639A1 (en) 2017-05-25
EA201391645A1 (ru) 2014-08-29
US9516789B2 (en) 2016-12-06
WO2012150953A1 (en) 2012-11-08
JP6072773B2 (ja) 2017-02-01
EP2705737A1 (en) 2014-03-12
KR101936281B1 (ko) 2019-01-08
KR20140041525A (ko) 2014-04-04
CA2835079A1 (en) 2012-11-08
US20180295741A1 (en) 2018-10-11
JP2014514775A (ja) 2014-06-19
US9854718B2 (en) 2017-12-26
CN103782670B (zh) 2017-05-31
BR112013028489A2 (pt) 2017-01-10
CN103782670A (zh) 2014-05-07
US10314209B2 (en) 2019-06-04
EA201891963A3 (ru) 2019-06-28
US20140347820A1 (en) 2014-11-27
EP2705737A4 (en) 2016-03-02
EA031483B1 (ru) 2019-01-31

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