WO2016068552A3 - 랙 마운트 서버 시스템 및 그 제어방법 - Google Patents

랙 마운트 서버 시스템 및 그 제어방법 Download PDF

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Publication number
WO2016068552A3
WO2016068552A3 PCT/KR2015/011296 KR2015011296W WO2016068552A3 WO 2016068552 A3 WO2016068552 A3 WO 2016068552A3 KR 2015011296 W KR2015011296 W KR 2015011296W WO 2016068552 A3 WO2016068552 A3 WO 2016068552A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
rack housing
server system
cooling zone
rackmount server
Prior art date
Application number
PCT/KR2015/011296
Other languages
English (en)
French (fr)
Other versions
WO2016068552A2 (ko
Inventor
이성균
Original Assignee
(주)두비컴퓨팅
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)두비컴퓨팅 filed Critical (주)두비컴퓨팅
Priority to US15/521,453 priority Critical patent/US10750634B2/en
Publication of WO2016068552A2 publication Critical patent/WO2016068552A2/ko
Publication of WO2016068552A3 publication Critical patent/WO2016068552A3/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20754—Air circulating in closed loop within cabinets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control Of Temperature (AREA)

Abstract

냉각장치의 장애가 일어나도 전산장비의 손상이 일어나지 않고, 유지보수가 쉬우며, 전력 소비량을 최소화하고, 구조가 간단하며, 효율적인 냉각을 수행하는 랙 마운트 서버 시스템 및 그 제어방법을 제시한다. 그 시스템 및 방법은 랙 하우징 및 랙 하우징의 내부에 위치하고, 서버가 수납되며, 강제로 냉각되는 냉각존을 포함하고, 랙 하우징은 냉각존을 냉각시키기 위한 열교환기 및 증발기를 포함하며, 냉각존의 내부온도 및 상기 냉각존의 외부온도에 따라, 상기 냉각구조의 냉각방식을 달리할 수 있다.
PCT/KR2015/011296 2014-10-27 2015-10-26 랙 마운트 서버 시스템 및 그 제어방법 WO2016068552A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/521,453 US10750634B2 (en) 2014-10-27 2015-10-26 Rackmount server system and method for controlling same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0145685 2014-10-27
KR1020140145685A KR101718414B1 (ko) 2014-10-27 2014-10-27 랙 마운트 서버 시스템 및 그 제어방법

Publications (2)

Publication Number Publication Date
WO2016068552A2 WO2016068552A2 (ko) 2016-05-06
WO2016068552A3 true WO2016068552A3 (ko) 2016-06-23

Family

ID=55858489

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/011296 WO2016068552A2 (ko) 2014-10-27 2015-10-26 랙 마운트 서버 시스템 및 그 제어방법

Country Status (3)

Country Link
US (1) US10750634B2 (ko)
KR (1) KR101718414B1 (ko)
WO (1) WO2016068552A2 (ko)

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KR101816060B1 (ko) 2016-09-12 2018-01-08 주식회사 씨엔씨알 서버랙
CN106965693A (zh) * 2017-03-21 2017-07-21 薛建仁 一种带制冷装置的充电桩或充电站
KR101912684B1 (ko) 2017-04-12 2018-10-29 대한실드엔지니어링(주) 입체 냉각 구조를 갖는 emp 랙 장착형 자체 냉각시스템
KR102061934B1 (ko) 2017-07-26 2020-01-02 이성균 냉각부를 활용한 전산랙 장치
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Also Published As

Publication number Publication date
US10750634B2 (en) 2020-08-18
KR101718414B1 (ko) 2017-03-22
KR20160049212A (ko) 2016-05-09
WO2016068552A2 (ko) 2016-05-06
US20170325354A1 (en) 2017-11-09

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