WO2014199992A1 - Feuille adhésive et procédé de production d'un composant électronique par utilisation d'une feuille adhésive - Google Patents

Feuille adhésive et procédé de production d'un composant électronique par utilisation d'une feuille adhésive Download PDF

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Publication number
WO2014199992A1
WO2014199992A1 PCT/JP2014/065369 JP2014065369W WO2014199992A1 WO 2014199992 A1 WO2014199992 A1 WO 2014199992A1 JP 2014065369 W JP2014065369 W JP 2014065369W WO 2014199992 A1 WO2014199992 A1 WO 2014199992A1
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WIPO (PCT)
Prior art keywords
adhesive sheet
pressure
sensitive adhesive
meth
mass
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PCT/JP2014/065369
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English (en)
Japanese (ja)
Inventor
友也 津久井
久米　雅士
齊藤　岳史
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電気化学工業株式会社
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Application filed by 電気化学工業株式会社 filed Critical 電気化学工業株式会社
Priority to KR1020157034254A priority Critical patent/KR102215979B1/ko
Priority to CN201480031673.1A priority patent/CN105264035B/zh
Priority to JP2015522795A priority patent/JP6429397B2/ja
Publication of WO2014199992A1 publication Critical patent/WO2014199992A1/fr
Priority to PH12015502734A priority patent/PH12015502734A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Definitions

  • the present invention relates to an adhesive sheet and a method for manufacturing an electronic component using the adhesive sheet.
  • the adhesive sheet is usually bonded after the circuit is formed, and then cut into element pieces (dicing), washed, dried, stretched (expanded) the adhesive sheet, and peeled off the element pieces from the adhesive sheet. (Pickup), mounting and other processes.
  • dicing and / or conveying pressure-sensitive adhesive sheet used in these steps Patent Document 1 describes an example in which polyvinyl chloride is used as a base material.
  • Patent Document 2 discloses a composition using a (meth) acrylic acid ester copolymer as the pressure-sensitive adhesive composition.
  • the plasticizer migrates from the base material to the pressure-sensitive adhesive layer over time, which causes a problem in chip pickup performance in the pickup process.
  • the adhesive sheet is heated to about 75 ° C. after being attached to the adherend, and then dicing is performed. Dicing may be performed. Heating is performed in order to increase adhesion between the adherend and the pressure-sensitive adhesive sheet and prevent chip jumping when the adherence between the adherend and the pressure-sensitive adhesive sheet is not good. When heating is performed, dicing is performed. The pick-up property of later chips may deteriorate.
  • the composition of the pressure-sensitive adhesive is adjusted so that the pick-up property of the chip after dicing is not deteriorated even if the heating is performed, the adhesiveness when the heating is not performed may be deteriorated. Because of these circumstances, it has been difficult to use the same adhesive sheet in a production line without heating and a production line with heating, and separate adhesive sheets designed with and without heating. There was no choice but to use.
  • the present invention has been made in view of such circumstances, and does not cause deterioration of the pick-up property of the chip in the pick-up process with time, and can be used in both a heating line with and without heating before dicing.
  • An adhesive sheet is provided.
  • the pressure-sensitive adhesive composition is a (meth) acrylic ester. It contains 100 parts by weight of a copolymer and 0.01 to 5 parts by weight of an isocyanate curing agent.
  • the (meth) acrylic acid ester copolymer contains 40 to 90% by weight of butyl (meth) acrylate units, methyl (meth A pressure-sensitive adhesive sheet having 5 to 55% by mass of acrylate units, 0.1 to 10% by mass of monomer units having a hydroxyl group, and a weight average molecular weight of 400,000 to 1,000,000 is provided.
  • the inventors of the present invention conducted intensive research to solve the problem of deterioration of pick-up property of the chip over time, and used a pressure-sensitive adhesive composition based on a (meth) acrylate copolymer as a base resin, and It has been found that by using a polyester plasticizer as the plasticizer, deterioration of the chip pick-up property over time can be prevented.
  • the (meth) acrylic acid ester copolymer of the above composition was used as the base resin,
  • the isocyanate curing agent of the above content is included and the content of the epoxy curing agent is limited to the above range, both chip retention and pick-up properties are improved regardless of the presence or absence of heating. As a result, the present invention has been completed.
  • a particularly important point in the present invention is that only a combination of a (meth) acrylic acid ester copolymer of a specific composition and a curing agent of a specific composition is good for both chip retention and pick-up properties regardless of whether there is heating or not.
  • a pressure-sensitive adhesive sheet having excellent properties can be obtained.
  • the present inventors conducted experiments with combinations of (meth) acrylic acid ester copolymers of various compositions and curing agents of various compositions, and the composition of either copolymer or curing agent is within the above range. When it came off, since the chip holding property and / or pick-up property when there was no heating and / or heating was deteriorated, a desired pressure-sensitive adhesive sheet could not be obtained.
  • the butyl (meth) acrylate unit is 50 to 80% by mass, and the methyl (meth) acrylate unit is 15 to 45% by mass.
  • the monomer having a hydroxyl group is 2-hydroxyethyl acrylate.
  • the base film contains 25 to 45 parts by mass of a polyester plasticizer with respect to 100 parts by mass of polyvinyl chloride.
  • the polyester plasticizer is an adipic acid polyester.
  • the pressure-sensitive adhesive sheet is a dicing tape
  • the dicing tape is (a) an affixing step of adhering the dicing tape to a semiconductor wafer or substrate and a ring frame, and (b) a semiconductor by dicing the semiconductor wafer or substrate.
  • An electronic device including a dicing process for forming a chip or a semiconductor component, (c) an expanding process for stretching the adhesive sheet to widen the distance between the semiconductor chips or the semiconductor parts, and (d) a pickup process for picking up the semiconductor chip or the semiconductor component from the adhesive sheet.
  • the method further includes a heating step of heating the adherend to which the pressure-sensitive adhesive sheet has been attached after the attaching step and before the dicing step to 60 to 100 ° C.
  • the monomer unit means a structural unit derived from a monomer. Unless otherwise indicated, parts and% in this specification are based on mass.
  • (meth) acrylate is a general term for acrylate and methacrylate.
  • a compound containing (meth) such as (meth) acrylic acid is a general term for a compound having “meth” and a compound not having it.
  • the pressure-sensitive adhesive sheet of one embodiment of the present invention is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer made of a pressure-sensitive adhesive composition on a base film containing polyvinyl chloride and a polyester-based plasticizer.
  • 100 parts of a meth) acrylate ester copolymer and 0.01 to 5 parts of an isocyanate-based curing agent, and the (meth) acrylate ester copolymer contains 50 to 80% by mass of butyl (meth) acrylate units, It contains 15 to 45% of methyl (meth) acrylate units and 0.1 to 10% of monomer units having hydroxyl groups.
  • Base Film As the base film, a film containing polyvinyl chloride and a polyester plasticizer as a plasticizer for polyvinyl chloride is used.
  • the polyester plasticizer include dicarboxylic acids such as aliphatic dicarboxylic acids having 2 to 10 carbon atoms such as adipic acid, azelaic acid, sebacic acid, phthalic acid, isophthalic acid, terephthalic acid, and / or aromatic dicarboxylic acids.
  • polyesters obtained by polycondensation of an acid and a glycol having 2 to 10 carbon atoms such as ethylene glycol, propylene glycol, butylene glycol, neopentyl glycol, hexanediol and the like.
  • dicarboxylic acid aliphatic dicarboxylic acids such as adipic acid and sebacic acid are preferable, and adipic acid is particularly preferable in terms of versatility, cost, and stability over time.
  • the glycol either a straight chain or a side chain can be used and is appropriately selected as necessary.
  • the glycol preferably has 2 to 6 carbon atoms.
  • the number average molecular weight of the polyester plasticizer is not particularly limited, but usually about 500 to 4000 is used.
  • the polyester plasticizer is preferably 25 to 45 parts by mass, more preferably 30 to 40 parts by mass with respect to 100 parts by mass of polyvinyl chloride.
  • additives such as antioxidants, ultraviolet absorbers, light stabilizers, antistatic agents, flame retardants, and coloring agents such as dyes and pigments can be added to the base film as necessary. These additives are used in normal amounts depending on the type.
  • the antioxidant is not particularly limited as long as it is known as an antioxidant in conventional resins or resin compositions.
  • Typical antioxidants include those generally used in the past, such as phenolic (monophenolic, bisphenolic, polymeric phenolic), sulfur, and phosphorus.
  • the ultraviolet absorber examples include salicylate-based, benzophenone-based, benzotriazole-based, and cyanoacrylate-based, and benzophenone-based ultraviolet absorbers and benzotriazole-based ultraviolet absorbers are particularly preferable from the viewpoint of the ultraviolet absorption effect.
  • a benzotriazole-based ultraviolet absorber is preferred.
  • a light stabilizer such as a hindered amine or hindered phenol can be used.
  • the addition amount of the light stabilizer is not particularly limited, and may be a commonly used amount.
  • the antistatic agent is not particularly limited, and examples thereof include a quaternary amine salt monomer.
  • the quaternary amine salt monomer include dimethylaminoethyl (meth) acrylate quaternary chloride, diethylaminoethyl (meth) acrylate quaternary chloride, methylethylaminoethyl (meth) acrylate quaternary chloride, p- Examples thereof include dimethylaminostyrene quaternary chloride and p-diethylaminostyrene quaternary chloride, and dimethylaminoethyl methacrylate quaternary chloride is preferably used.
  • the flame retardant is not particularly limited, for example, brominated flame retardants, inorganic flame retardants such as aluminum hydroxide, magnesium hydroxide, antimony trioxide, melamine cyanurate, urea, triazine ring-containing compounds including melamine derivatives, Organic flame retardants, such as phosphate esters, such as aromatic polyphosphate, are mentioned.
  • any of known or well-known colorants such as organic pigments, inorganic pigments, dyes, and carbon black can be used.
  • the color is arbitrary and can be, for example, white, ivory, black, red, blue, yellow, green, and the like.
  • a colorant may be added to all layers, or a colorant may be added to only a part of the layers.
  • pigments include, for example, phthalocyanine, azo, condensed azo, azo lake, anthraquinone, perylene / perinone, indigo / thioindigo, isoindolinone, azomethine azo, dioxazine, quinacridone, Organic pigments such as aniline black, triphenylmethane, carbon black, titanium oxide, iron oxide, iron hydroxide, chromium oxide, spinel firing, chromic acid, chromium vermilion, bitumen , Aluminum powder system, bronze powder system and the like. These pigments may be in any form, and these pigments may be subjected to various dispersion treatments by various known methods.
  • the thickness of the base film is not particularly limited and can be appropriately determined.
  • the thickness is 40 to 250 ⁇ m, preferably 50 to 200 ⁇ m, and more preferably 60 to 150 ⁇ m.
  • Examples of the base film forming method include a calendar forming method, a T-die extrusion method, an inflation method, and a casting method.
  • the base film may be subjected to an antistatic treatment on the pressure-sensitive adhesive contact surface and / or non-contact of the base film in order to prevent charging when the release film is peeled off.
  • the antistatic agent may be kneaded into the resin.
  • an antistatic agent such as a quaternary amine salt monomer can be used.
  • Examples of the quaternary amine salt monomer include dimethylaminoethyl (meth) acrylate quaternary chloride, diethylaminoethyl (meth) acrylate quaternary chloride, methylethylaminoethyl (meth) acrylate quaternary chloride, p- There are dimethylaminostyrene quaternary chloride and p-diethylaminostyrene quaternary chloride, and dimethylaminoethyl methacrylate quaternary chloride is preferred.
  • the adhesive may be applied to one side of the base film, and the slip agent and / or the antistatic agent may be applied to the back side thereof.
  • an antistatic agent may be kneaded into the resin of the base film to form a sheet.
  • a slipping agent can be applied to the adhesive non-contact surface of the base film, or a slipping agent can be kneaded into the base film.
  • the slip agent is not particularly limited as long as it is a substance that reduces the friction coefficient of the pressure-sensitive adhesive sheet and the expanding device.
  • silicone compounds such as silicone resins and (modified) silicone oils, fluororesins, hexagonal boron nitride, carbon black, And molybdenum disulfide. These friction reducing agents may mix a plurality of components. Since manufacture of an electronic component is performed in a clean room, it is preferable to use a silicone compound or a fluororesin.
  • a copolymer having a silicone macromonomer unit is particularly preferred because it has good compatibility with the antistatic layer and can achieve a balance between antistatic properties and expandability.
  • the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer contains 100 parts by weight of a (meth) acrylic acid ester copolymer and 0.01 to 5 parts by weight of an isocyanate curing agent.
  • the (meth) acrylic acid ester copolymer has a butyl (meth) acrylate unit of 40 to 90%, a methyl (meth) acrylate unit of 5 to 55%, and a monomer unit having a hydroxyl group of 0.1 to 10%. It is a copolymer containing.
  • the butyl (meth) acrylate unit is 40 to 90%. If it falls below this range, the chip retainability deteriorates, and if it exceeds this range, the pick-up property falls. Further, it is more preferably 50 to 80%. Within this range, excellent performance can be exhibited in terms of both chip retention and pickup properties. Specifically, for example, 50, 55, 57.5, 60, 62.5, 65, 67.5, 70, 72.5, 75, 80%, between any two of the numerical values exemplified here It may be within the range.
  • the methyl (meth) acrylate unit is 5 to 55%. If it falls below this range, the pick-up property is lowered, and if it exceeds this range, the chip retainability is lowered.
  • it is more preferably 15 to 45%. Within this range, excellent performance can be exhibited in terms of both chip retention and pickup properties. Specifically, for example, it is 15, 20, 25, 30, 35, 40, 45%, and may be within a range between any two of the numerical values exemplified here.
  • Examples of the monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 2-hydroxyvinyl ether.
  • the monomer unit having a hydroxyl group is 0.1 to 10%. If it falls below this range, the chip retainability is lowered, and if it exceeds this range, the pickup property is lowered. More preferably, it is 1 to 7% by mass. Within this range, excellent performance can be exhibited in terms of both chip retention and pickup properties. Specifically, it is 1, 2, 3, 4, 5, 6, 7 mass%, for example, and may be in the range between any two of the numerical values exemplified here.
  • Methods for producing a (meth) acrylic acid ester polymer include emulsion polymerization and solution polymerization).
  • the isocyanate curing agent is 0.01 to 10 parts per 100 parts of the (meth) acrylic acid ester copolymer. If it falls below this range, the pick-up property decreases, and if it exceeds this range, the chip retainability deteriorates. More preferably, it is 0.1 to 5 parts. Within this range, excellent performance can be exhibited in terms of both chip retention and pickup properties. Specifically, for example, it is 0.1, 0.5, 1, 1.5, 2, 3, 4, 5 and may be within the range between any two of the numerical values exemplified here. .
  • the isocyanate curing agent a compound having a plurality of isocyanate groups is used.
  • the compound having a plurality of isocyanate groups include aromatic isocyanates, alicyclic isocyanates, and aliphatic isocyanates.
  • aromatic isocyanate examples include tolylene diisocyanate, 4,4-diphenylmethane diisocyanate, and xylylene diisocyanate.
  • alicyclic isocyanate examples include isophorone diisocyanate and methylene bis (4-cyclohexyl isocyanate).
  • aliphatic isocyanate examples include hexamethylene diisocyanate and trimethylhexamethylene diisocyanate.
  • isocyanate compounds may be dimers or trimers, or may be adducts obtained by reacting with polyol compounds.
  • a tackifying resin may be added to adjust the pressure-sensitive adhesive strength.
  • the tackifying resin is not particularly limited.
  • rosin resin, rosin ester resin, terpene resin, terpene phenol resin, phenol resin, xylene resin, coumarone resin, coumarone indene resin, styrene resin aliphatic petroleum resin, aromatic petroleum resin , Aliphatic aromatic copolymer petroleum resins, alicyclic hydrocarbon resins, and modified products, derivatives, hydrogenated products, and the like thereof.
  • the blending amount of the tackifying resin is not particularly limited, and is preferably 200 parts or less, preferably 30 parts or less, with respect to 100 parts of the (meth) acrylic acid ester copolymer.
  • additives such as a curing agent, a polymerization initiator, a softening agent, an anti-aging agent, a filler, an ultraviolet absorber, a light stabilizer, a photopolymerizable compound, and a photoinitiator are added to the pressure-sensitive adhesive composition. May be.
  • Manufacture of adhesive sheet> As a method of forming a pressure-sensitive adhesive layer on a base film and forming a pressure-sensitive adhesive sheet, for example, a method of directly applying a pressure-sensitive adhesive on a base film with a coater such as a gravure coater, comma coater, bar coater, knife coater or roll coater Alternatively, there is a method in which a pressure-sensitive adhesive is applied to a release film and bonded to a base film after drying.
  • the pressure-sensitive adhesive composition may be printed on the substrate film by convex plate printing, concave plate printing, flat plate printing, flexographic printing, offset printing, screen printing, or the like.
  • the thickness of the pressure-sensitive adhesive layer is preferably 1 to 100 ⁇ m, and more preferably 5 to 40 ⁇ m. If the pressure-sensitive adhesive layer is thin, the adhesive strength is reduced, and chip retention during dicing and peeling from the ring frame may occur. If the pressure-sensitive adhesive layer is thick, the adhesive strength is high, and pickup failure may occur.
  • an adhesive sheet is affixed on a to-be-adhered body and a ring frame.
  • the adherend include a semiconductor wafer and a package substrate.
  • the heating step can be performed by heating the adherend to 60 to 100 ° C.
  • the adherend is diced into a chip with the adherend attached to the adhesive sheet.
  • Each chip formed by dicing becomes an electronic component. Dicing can be performed using a dicing blade. Since the pressure-sensitive adhesive sheet is excellent in chip retention before irradiation with ultraviolet rays and / or radiation, it is possible to prevent the chips from peeling off (chip jumping) during dicing.
  • the chip is picked up from the adhesive sheet after the dicing step.
  • this step can be performed, for example, by the following method.
  • Ultraviolet rays and / or radiation (not shown) are irradiated from the base film side of the pressure-sensitive adhesive sheet, and then the pressure-sensitive adhesive sheet is radially expanded to widen the chip interval, and then the chip is pushed up with a needle or the like (not shown). Then, the chip is picked up by a vacuum collet or air tweezers (not shown) and picked up.
  • a well-known thing can be used for the light source of an ultraviolet-ray and / or a radiation.
  • As the radiation electron beams, ⁇ rays, ⁇ rays, and ⁇ rays are preferably used.
  • the vinyl group in the pressure-sensitive adhesive composition can be three-dimensionally reticulated to reduce the pressure-sensitive adhesive strength of the pressure-sensitive adhesive composition.
  • the pressure-sensitive adhesive composition has an initial high adhesive force, it can exhibit excellent chip retention, and after being irradiated with ultraviolet rays and / or radiation. Since the adhesive strength of the pressure-sensitive adhesive composition is reduced, the pick-up property of the chip can be improved.
  • the chip picked up in the pick-up process can be mounted on a lead frame or a circuit board.
  • the numerical values for the compositions in Tables 1 and 2 represent parts by mass.
  • the numerical value about a plasticizer represents the mass part of a plasticizer when a polyvinyl chloride resin is 100 parts.
  • the numerical value about a crosslinking agent represents the mass part of a crosslinking agent when a (meth) acrylic acid ester copolymer is 100 parts. Details of the plasticizer and the curing agent are as follows.
  • Adipic acid polyester manufactured by Dainippon Ink & Chemicals, Inc., trade name: Polycizer W2310, number average molecular weight 2300 ⁇
  • Terephthalic acid polyester Commercial product (polyethylene terephthalate) ⁇
  • Isocyanate-based curing agent Trimethylolpropane adduct of 2,4-tolylene diisocyanate, commercial product
  • a polyvinyl chloride resin, a plasticizer shown in Tables 1 and 2, and other stabilizers, pigments and fillers were blended. This resin mixture was kneaded with a Banbury mixer and then formed into a thickness of 70 ⁇ m by calendering to obtain a base film.
  • the pressure-sensitive adhesive composition having the composition shown in Tables 1 and 2 was applied onto a PET release film so that the thickness of the pressure-sensitive adhesive layer after drying was 15 ⁇ m, and the pressure-sensitive adhesive sheet was laminated on the base film. Obtained. The following evaluation was performed about the obtained adhesive sheet.
  • the increase in adhesive strength over time was evaluated according to the following criteria. ⁇ (excellent): The rate of increase is less than 5%. ⁇ (Good): The rate of increase is 5% or more and less than 10%.
  • the conditions for the dicing process were as follows.
  • Dicing machine DAD341 manufactured by DISCO Dicing blade: NBC-ZH205O-27HEEE made by DISCO Dicing blade shape: outer diameter 55.56 mm, blade width 35 ⁇ m, inner diameter 19.05 mm
  • Dicing blade rotation speed 40,000 rpm
  • Dicing blade feed rate 50 mm / sec.
  • Dicing size 1.5 mm square.
  • Cutting depth into adhesive sheet 15 ⁇ m
  • Cutting water temperature 25 ° C
  • Cutting water volume 1.0 l / min
  • Chip skipping is less than 5% ⁇ (Good): Chip skipping is 5% or more and less than 10% ⁇ (Not possible): Chip skipping is 10% or more
  • Chip pickup success rate is 95% or more
  • Chip pickup success rate is 80% or more and less than 95%
  • Chip pickup success rate is less than 80%
  • Comparative Examples 5 to 6 the types and composition ratios of the monomer units constituting the (meth) acrylic acid ester copolymer are the same as those in Examples, but the ratio of the weight average molecular weight was not appropriate, No result was obtained.
  • Comparative Examples 7 to 8 the types and composition ratios of the monomer units constituting the (meth) acrylic acid ester copolymer are the same as those in the example, but the ratio of the isocyanate curing agent was not appropriate, so that it was good. Results were not obtained.
  • Comparative Example 9 since a non-polyester plasticizer was used, the increase in adhesive strength with time was large.
  • the pressure-sensitive adhesive composition is a (meth) acrylic ester. 100 parts by weight of the copolymer and 0.01 to 5 parts by weight of an isocyanate curing agent.
  • the (meth) acrylic acid ester copolymer has a methyl (meth) acrylate unit of 5 to 55% by weight and a hydroxyl group.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)

Abstract

L'invention porte sur une feuille adhésive telle qu'il n'y ait pas de diminution dans le temps des propriétés de prise d'une puce pendant une étape de prise, et qui peut être utilisée dans des lignes de production possédant et ne possédant pas un chauffage avant le découpage en dés. La feuille adhésive possède une couche adhésive comprenant une composition adhésive sur un film formant substrat contenant du poly(chlorure de vinyle) et un plastifiant polyester, la composition adhésive contenant 100 parties en masse d'un copolymère d'un ester de l'acide (méth)acrylique et 0,01 à 5 parties en masse d'un agent de durcissement de type isocyanate, et le copolymère d'un ester de l'acide (méth)acrylique ayant une masse moléculaire moyenne en masse de 400 000 à 1 000 000 et contenant 40 à 90 % en masse d'un motif (méth)acrylate de butyle, 5 à 55 % en masse d'un motif (méth)acrylate de méthyle, et 0,1 à 10 % en masse d'un motif monomère ayant un groupe hydroxyle.
PCT/JP2014/065369 2013-06-11 2014-06-10 Feuille adhésive et procédé de production d'un composant électronique par utilisation d'une feuille adhésive WO2014199992A1 (fr)

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KR1020157034254A KR102215979B1 (ko) 2013-06-11 2014-06-10 점착 시트 및 점착 시트를 사용한 전자 부품의 제조 방법
CN201480031673.1A CN105264035B (zh) 2013-06-11 2014-06-10 粘合片以及使用该粘合片的电子元件的制造方法
JP2015522795A JP6429397B2 (ja) 2013-06-11 2014-06-10 粘着シート
PH12015502734A PH12015502734A1 (en) 2013-06-11 2015-12-07 Adhesive sheet and method of manufacturing electronic component using the same

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JP2016216577A (ja) * 2015-05-18 2016-12-22 ロンシール工業株式会社 粘着テープ基材用フィルム
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CN111356669A (zh) * 2018-03-07 2020-06-30 电化株式会社 陶瓷树脂复合体与金属板的临时粘接体、其制造方法、包含该临时粘接体的运输体、及其运输方法
KR102328619B1 (ko) * 2020-06-18 2021-11-18 주식회사 씨앤제이글로벌 친환경 종이 빨대용 코팅제

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WO2017150018A1 (fr) * 2016-02-29 2017-09-08 リンテック株式会社 Feuille de traitement de semi-conducteurs
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CN105264035A (zh) 2016-01-20
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PH12015502734A1 (en) 2016-03-14
CN105264035B (zh) 2017-10-13
TW201500514A (zh) 2015-01-01
JPWO2014199992A1 (ja) 2017-02-23
KR20160018505A (ko) 2016-02-17
JP6429397B2 (ja) 2018-11-28

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