PH12015502734B1 - Adhesive sheet and method of manufacturing electronic component using the same - Google Patents

Adhesive sheet and method of manufacturing electronic component using the same Download PDF

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Publication number
PH12015502734B1
PH12015502734B1 PH12015502734A PH12015502734A PH12015502734B1 PH 12015502734 B1 PH12015502734 B1 PH 12015502734B1 PH 12015502734 A PH12015502734 A PH 12015502734A PH 12015502734 A PH12015502734 A PH 12015502734A PH 12015502734 B1 PH12015502734 B1 PH 12015502734B1
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PH
Philippines
Prior art keywords
meth
mass
adhesive sheet
adhesive
parts
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PH12015502734A
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PH12015502734A1 (en
Inventor
Tomoya TSUKUI
Masashi Kume
Takeshi Saito
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Denka Company Ltd
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Publication of PH12015502734B1 publication Critical patent/PH12015502734B1/en
Publication of PH12015502734A1 publication Critical patent/PH12015502734A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)

Abstract

To provide an adhesive sheet that prevents the deterioration of the chip pick-up performance in the pick-up step over time and that can be shared between a manufacturing line with the warming step and a manufacturing line without the warming step prior to the dicing step. The adhesive sheet include a base film Including polyvinyl chloride and a polyester-based plasticizer, and an adhesive layer of an adhesive composition on the base film. The adhesive composition contains 100 parts by mass of a (meth) acrylic acid ester copolymer and 0.01 to 5 parts by mass of an isocyanate curing agent. The (meth) acrylic acid ester copolymer contains 40 to 90 pcnt by mass of a butyl (meth) acrylate unit, 5 to 55 pcnt by mass of a methyl (meth) acrylate unit, and 0.1 to 10 pcnt by mass of a monomer unit having a hydroxyl group. The weight-average molecular weight of the (meth) acrylic acid ester copolymer is 400,000 to 1,000,000.

Description

. » in respective usual amounts.
Furthermore, the antioxidant is not limited as long as it has been known as an antioxidant for a resin or a resin composition.
A typical antioxidant may be a phenol-based antioxidant (monophenol -based, bisphenol-based, polymer-type phenol-based), a sulfur-based antioxidant, and a phosphorus-based antioxidant, which have been generally used.
As the ultraviolet absorber, a salicylate-based ultraviolet absorber, a benzophenone-based ultraviolet absorber, : a benzotriazol-based ultraviolet absorber, and a cyanoacrylate-based ultraviolet absorber are possible.
Particularly, in terms of the ultraviolet absorption effect, the benzophenone-based ultraviolet absorber and the benzotriazol-based ultraviolet absorber are preferable, and more particularly, the benzotriazol-based ultraviolet absorber is desirable.
As the light stabilizer, for example, a hindered amine light stabilizer and a hindered phenol light stabilizer are possible.
The additive amount of the light stabilizer is not limited but may be an amount to be usually used.
The antistat is not limited, but a quaternary amine salt monomer is possible. As the quaternary amine salt monomer, for example, a dimethylaminoethyl (meth)acrylate quaternary
¥ ’ chloride, a diethylaminoethyl (meth) acrylate quaternary chloride, a methylethylaminoethyl (meth)acrylate quaternary chloride, a p-dimethylaminostyrene quaternary chloride, and a p-diethylaminostyrene quaternary chloride are possible.
Particularly, the dimethylaminoethyl (meth)acrylate quaternary chloride is desired.
The flame retardant is not limited, but, for example, a bromine-based flame retardant; an inorganic flame retardant such as aluminium hydroxide, magnesium hydroxide, antimony trioxide and so forth; a triazine ring-containing compound including - melamine cyanurate, urea, a melamine derivative and so forth; and an organic flame retardant including phosphate such as aromatic polyphosphate, are possible.
As the coloring agent, any well-known coloring agents such as an organic pigment, an inorganic pigment, dye, carbon black and so forth are possible. The color may be optional, for example, white, ivory, black, red, blue, yellow, green and so forth are - 20 possible. When the base film is multilayered, all the layers may contain color agents, or only part of themmay contain color agents.
As the pigment, for example, an organic pigment such as a phthalocyanine pigment, an azo pigment, a condensed azo pigment, an azo lake pigment, an anthraquinone pigment, a perylene-perynone pigment, an indigo-thioindigo pigment, an isoindolinone pigment, an azomethine-azo pigment, a dioxazine pigment, a quinacridone pigment, an aniline black pigment, a triphenylmethane pigment, a carbon black pigment; and a titanium oxide pigment, an iron oxide pigment, an iron hydroxide pigment, a chromium oxide pigment, a spinel-form calcination pigment, a chromic acid pigment, a chrome vermilion pigment, an iron blue pigment, an aluminum powder pigment, a bronze power pigment and so forth are possible. These pigments may have any morphology, and be subjected to various dispersion treatments by using various well-known methods.
The thickness of the base film is not limited but may be appropriately determined, for example, 40 to 250 um, preferably 50 to 200um, more preferably 60 to 150 um.
A forming method of the base film may include a calendar molding method, a T die extrusion method, an inflation method and a casting method.
In order to prevent the base film from being charged when a release film is peeled therefrom, the surface of the base film - 20 which contacts and/or does not contact the adhesive may be subjected toan antistatic treatment. The antistat may be kneaded into the resin. It is possible to use the antistat such as a quaternary amine salt monomer in the antistatic treatment.
As the quaternary amine salt monomer, for example, a dimethylaminoethyl (meth)acrylate quaternary chloride, a diethylaminoethyl (meth)acrylate quaternary chloride, a methylethylaminoethyl (meth)acrylate quaternary chloride, a p-dimethylaminostyrene quaternary chloride, and a p-diethylaminostyrene quaternary chloride are possible.
Particularly, the dimethylaminoethyl (meth)acrylate quaternary chloride is desired.
The method of using the lubricant and the antistat is not limited. For example, an adhesive may be applied to one side of the base film while the lubricant and/or the antistat may be applied to the other side. Alternatively, the lubricant and/or the antistat may be kneaded into the resin of the base film, and a then formed as a sheet.
The adhesive may be stacked on one side of the base film while the other side may be formed as an embossed surface having 0.3 to 1.5 um of an average surface roughness (Ra). By setting the embossed surface in the machine table side of an expansion device, it is possible to easily expand the base film in the expanding step after the dicing step. . 20
In order to improve the performance of the expanding step after the dicing step, the lubricant may be applied to the surface of the base film which does not contact the adhesive, or kneaded into the base film. "The lubricant is not limited as long as it can reduce the coefficient of the friction between the adhesive sheet and the expansiondevice. As the lubricant, for example, a silicone resin, a silicone compound such as (denatured) silicone oil, a fluororesin, hexagonal boron nitride, carbon black, molybdenum disulfide and so forth are possible. One or more these lubricants may be mixed. Electronic components are manufactured in a clean room, and therefore it is preferable to use a silicone compound or a fluororesin. Among the silicone compounds, particularly, a copolymer containing a silicone macromonomer unit is preferable because it is well compatible with the antistatic layer, thereby to achieve a balance between the antistat performance and the expansibility. <2. Adhesive layer>
With the present embodiment, the adhesive composition forming the adhesive layer includes 100 parts by mass of (meth)acrylic acid ester copolymer, and 0.01 to 5 parts by mass of the isocyanate curing agent. <2-1. (Meth)acrylic acid ester copolymers - 20 The (meth)acrylic acid ester copolymer is a copolymer containing 40 to 90 % by mass of a butyl (meth)acrylate unit, 5 to 55 % by mass of a methyl (meth)acrylate unit, and 0.1 to 10 % by mass of a monomer unit having a hydroxyl group.
The content of the butyl (meth)acrylate unit is 40 to 90 % by mass. If the content is below this range, the chip retention performance deteriorates. On the other hand, if the content is beyond the range, the chip pick-up performance deteriorates.
More preferably, the content of the butyl (meth)acrylate unit is 50 to 80 % by mass. It is possible to exhibit both good chip retention performance and good chip pick-up performance as long as the content is within the range. To be more specific, the content of the butyl (meth)acrylate unit may be, for example, 50, 55, 57.5, 60, 62.5, 65, 67.5, 70, 72.5, 75, and 80 % by mass, and be within the range between any two of these numerical values.
The content of the methyl (meth)acrylate unit may be 5 to 55 % by mass. If the content is below this range, the chip pick-up performance deteriorates. On the other hand, if the content is - beyond the range, the chip retention performance deteriorates.
More preferably, the content of the methyl (meth) acrylate unit is to 45 % by mass. It is possible to exhibit both good chip 15 retention performance and good chip pick-up performance as long as the content is within the range. To be more specific, the content of the methyl (meth)acrylate unit may be, for example, 15, 20, 25, 30, 35, 40, and 45 % by mass, and be within the range between any two of these numerical values.
Bh 20
As the monomer having a hydroxyl group, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth) acrylate, and 2-hydroxyvinyl ether are possible. The content of the monomer unit having a hydroxyl group may be 0.1 to 10 % by mass. If the content is below this range, the chip retention performance deteriorates. On the other hand, if the content is beyond the range, the chip pick-up performance plurality of isocyanate groups may be used. As the compound containing a plurality of isocyanate groups, aromatic isocyanate, alicyclic isocyanate, and aliphatic isocyanate are possible.
The aromatic isocyanate may include, for example, tolylene diisocyanate, 4,4-diphenylmethane diisocyanate, and xylylene diisocyanate.
The alicyclic isocyanate may include, for example, isophorone diisocyanate and methylene bis (4-cyclohexylisocyanate) .
The aliphatic isocyanate may include, for example, hexamethylene diisocyanate, and trimethyl hexamethylene diisocyanate.
Each of these isocyanate compounds may be a dimer or a trimer, or an adduct obtained by reacting with a polyol compound. - 20 In order to adjust the adhesive strength, a tackifying resin may be added to the adhesive composition. The tackifying resin is not limited, but, for example, a rosin resin, a rosin ester resin, a terpene resin, a terpene phenol resin, a phenol resin, a xylene resin, a cumarone resin, a coumarone-indene resin, a styrene resin, an aliphatic petroleum resin, an aromatic petroleum resin, an aliphatic/aromatic-copolymerized petroleum resin, an alicyclic hydrocarbon resin, and modified materials,
derivatives and hydrogenated materials thereof are possible.
The content of the tackifying resin is not limited, but preferably is 200 parts by mass or less, more preferably 30 parts by mass or less with respect to 100 parts by mass of the (meth)acrylic acid ester copolymer. <2-3. Additives>
Various additives, such as a curing agent, a polymerization initiator, a softener, an age resistor, afiller, an ultraviolet absorber, a light stabilizer, a photopolymerizable compound, and a photoinitiator may be added to the adhesive composition. <3. Manufacture of adhesive sheet»
The method of manufacturing an adhesive sheet by forming an adhesive layer on a base film may include, for example, a method of directly coating the base film with the adhesive by using a coater such as an engraved-roll coater, a comma coater, a bar coater, a knife coater and a roll coater; and a method of coating oo 20 a release filmwith the adhesive and drying the adhesive, and then bonding it to the base film. The adhesive composition may be printed on the base film by relief printing, intaglio printing, planographic printing, flexographic printing, offset printing or screen printing.
The thickness of the adhesive layer is preferably 1 to 100 um, more preferably 5 to 40um. If the adhesive layer is thin,
« the adhesive strength is low, and therefore the chip retention performance in the dicing step is not good, so that chips are likely topeel off fromthe ring frame. On the other hand, if the adhesive layer is thick, the chip pick-up performance is 1likely to deteriorate. <4. Manufacture of electronic componentss
Hereinafter, a method of manufacturing electronic components by using the above-described adhesive sheet will be described. As described above, this method includes the bonding step, the dicing step and the pick-up step. In addition, the - warming step is optionally added after the bonding step and before the dicing step. Hereinafter, each step will be explained. (1) Bonding step
In the bonding step, first, the adhesive sheet is bonded to the adherend and the ring frame. As an adherend, a semiconductor wafer and a package substrate are possible. (2) Warming step
Next, when the adhesion of the adhesive sheet to the adherend is not good, the warming step is performed to improve the adhesion.
The warming step is achieved by warming the adherend to 60 to 100 degrees Celsius. (3) Dicing step
Next, in the dicing step, the adherend bonded to the adhesive sheet is diced into chips. Each chip formed by this dicing step becomes an electronic component. The dicing may be achieved by using a dicing blade. The adhesive sheet exhibits good chip retention performance prior to exposure to ultraviolet light and/or radiation, and therefore can prevent the chips from peeling off in the dicing step. : (4) Pick-up step
Next, in the pick-up step, the chips are picked from the adhesive sheet after the dicing step. Hereinafter, the pick-up step will be explained in detail. First, the base film side of - the adhesive sheet is exposed to ultraviolet 1light and/or radiation; next, the adhesive sheet is radially enlarged to increase the distance between each chip; and then, the chips are pushed up by a needle and so forth. Then, the chips are adsorbed by using a vacuum collet or air tweezers, and picked. A conventionally known light source of ultraviolet light and/or radiation may be used. As an ultraviolet light source, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high pressure mercury lamp, and a metal halide lamp are possible. As radiation, electron ray, o ray, Pp ray and y ray are preferable.
By the exposure to ultraviolet light and/or radiation, the vinyl group contained in the adhesive composition is three-dimensionally reticulated, and therefore it is possible to reduce the adhesive strength of the adhesive composition. By this means, the adhesive composition prior to exposure to ultraviolet light and/or radiation has the initial high adhesive strength, and therefore exhibits good chip retention performance. Then, after the exposure to ultraviolet light and/or radiation, the adhesive strength of the adhesive composition is reduced, and therefore it is possible to improve the chip pick-up performance.
The chips picked in the pick-up step may be mounted on a lead frame or a circuit board. <Examples>
Hereinafter, the method of manufacturing the adhesive composition and the adhesive sheet according to examples and comparative examples will be described. Major contents and the results of experimental examples are shown in Tables 1 and 2.
The numerical values of the compositions shown in Tables 1 and 2 are expressed by parts by mass. To be more specific, each of the numerical values of the plasticizers represents the parts a 20 by mass of the plasticizer with respect to 100 parts by mass of the polyvinyl chloride resin. Each of the numerical values of the crosslinking agents represents the parts by mass of the crosslinking agent with respect to 100 parts by mass of the (meth)acrylic acid ester copolymer. Details of the plasticizers and the curing agents are as follows. ‘Adipic polyester: produced by Dainippon Ink And Chemicals,
Incorporated; Trade name POLYCIZER W2310; number average i & molecular weight 2300. ‘Terephthalate polyester: commercially available product (polyethylene terephthalate). ‘Isocyanate curing agent: trimethylolpropane adduct of 2,4-tolylene diisocyanate, commercially available product.
Table 1 \. OO ee ©owents 00 0 0000 0 v Ta Ts T «TT ST aT v1 8s 8 Ton gf 13 [T5617 [38 | 3 oe] [EE RT FREE ny Jo fs]olsfos]iJsJafsfsfofsfafsTsfslefsls]s] mEnachYUC [BUTYEMETHACRYLATEl 6 TT 0 16 [0 To 1 oo Jo [w]| 9106 [oot ool oloTlo[0] cdma | SON | weaonoun [JoJo fofofolofolomfofofofofoJofofoafoo] mem ooo Jofefofeefe]efeJefefofofofofofolo]
Xt aiy [oueifo fc os tucson fos cnc como cn concn so cn - oma pany | SEES [or [or Jor Jerfar Tar [or Jas Jer Jarforfar for Jor Tor omar [a ]s [or] rae JoJalolelelolole]efofelefef[ofolelefeleo]o] mm EEE wot [O|o[o|efolelofofe/ofefo[e|ofeleloolalo]
Evan | _covimue_|@[ofofoleloolo[eloleo]efofofa[ofe]a]0] wmv; | Ceeomonc |©|o]oolofolo]o[ofo]ole|elo]ofe[e[o]o[0]
Tere S28 |eleleloje|ojolole(o(ofele|ojole]o]o]o]0]
Table 2
Ear ee _ADIPIC POLYESTER | 365 | 36.5 [ 365 | 365 | 36.5 | 365 | 365 | 365] 0 vos run pusnozen | EIA [0 [0 [6 [oo [ooo] 0]
DIOCTYLPHTHALATE | 0 | 0 | 0 | o [ 0 [ 0 | 0 | 0 [365]
BUTYLIACRYLATE [35 [ 95 | 70 | 67 [70 | 70 | 70 | 70 | 70
METHYLACRYLATE [60 | 0 | 30 | 22 | 25 | 25 | 25 [ 25 [ 25 evo | s [so mss [sss] (METHIACRYLIC ACRYLATE
E (0 fo loo] 0]
ADHESIVE 2opEsen BUILME A | 0 J 0] 0 | 0
COMPOSITION | “ermorviare | © [0 [of ojofofofo]o]
A omni nn
CULAR : omen |” SCA Co [eon curmc acent | JSOCVAMTE, | or | or for for for | ol [ERSTE Se 0 [0 [0 [0 [0 [000] 0
CHIP RETENTION 0 wriour | Serromune | * [0x0 «loo x]
WARMING CHIP PICK-UP [0 | (oo emus ERS To [ooo] [0 oofol|olo] le] arog, Sule’ [ojo ole x jo :
CHIP PICK-UP comme: [© |= |o[x]ofo[~]o]0
PERFORMANCE
First, the polyvinyl chloride resin, the plasticizers as shown in Tables 1 and 2, a stabilizer, a pigment and a filler were blended. This resin mixture was mixed with a Banbury mixer, and molded with a thickness of 70 um by the calendar process, so that a base film was obtained.
Next, a PET release film was coated with the adhesive composition shown in Tables 1 and 2 such that the thickness of the adhesive layer after drying was 15 um, so that an adhesive sheet stacked on the base film is obtained. The resultant - adhesive sheet was evaluated as follows. (1) Evaluation of increase in adhesive strength over time
The adhesive sheet was bonded to the mirror surface of a silicon wafer, was pressure bonded by reciprocating a roller of 2 kg once, and was left for 20 minutes. After that, the adhesive strength was measured under conditions: a peel angle of 180 degrees; and a tensile speed of 300 mm/min. The silicon wafer (6 inches) having a thickness of 725 pm was used. In addition, a sample was prepared, which was left for 7 days after the pressure bonding under the above-described conditions, and the adhesive strength of this sample was measured by the same way. The rate of increase was calculated based on adhesive strength (X) of the sample left for 20 minutes and adhesive strength (Y) of the sample left for 7 days, according to the following equation.
Rate of increase = (100x(Y-X))/X
An increase in the adhesive strength over time was evaluated based on the calculated rate of increase, according to the following criteria.
E (excellent): the rate of increase is lower than 5%
G (good): the rate of increase is 5% or higher and lower than 10% :
B (Bad): the rate of increase is 10% or higher (2) Evaluation of chip retention performance and pick-up performance - The resultant adhesive sheet was bonded to a ring frame, and a silicon wafer having a diameter of 8 inches and a thickness of 0.1 mm on which a dummy circuit pattern was formed. After that, it was warmed to 75 degrees Celsius in an oven for 30 minutes as needed. Then, the dicing step and the pick-up step were performed.
The conditions of the dicing step were as follows: - 20 Dicing apparatus: DAD341 manufactured by DISCO
Corporation;
Dicing blade: NBC-ZH2050-27HEEE manufactured by DISCO
Corporation;
The shape of the dicing blade: outer diameter of 55.56 mm, cutting blade width of 35 um, inner diameter of 19.05 mm;
The number of rotations: 40,000 rpm;
Feed rate: 50 mm/sec;
Dicing size: 1.5 mm x 1.5 mm;
The depth of cutting into the adhesive sheet: 15 um;
The temperature of cutting water: 25 degree Celsius; and
The amount of cutting water: 1.0 1/min. 5 .
The conditions of the pick-up step were as follows:
Pick-up apparatus: CAP-300ITI manufactured by Canon
Machinery Inc.;
The amount of expansion: 8 mm;
The shape of needle pin: 70 umR;
The number of needle pins: one; and o The number of needle pins: one; and
The height of the needle pin pushed up: 1.5 mm.
The following evaluations were performed in the dicing step and the pick-up step. (2-1) Chip retention performance
After the dicing step, the chip performance was evaluated ; 20 based on the survival rate of the semiconductor chips that were retained on the adhesive sheet, according to the following criteria.
E (Excellent): 5% or less of chips peel off;
G (Good): 5% or more and less than 10 % of chips peel off; and
B (Bad): 10 % or more chips peel off.
(2-2) Chip pick-up performance
In the pick-up step, the chip pick-up performance was evaluated based on the percentage of the semiconductor chips that : were successfully picked, according to the following criteria.
E (Excellent): the success rate of the pick-up is 95 % or more;
G (Good) : the success rate of the pick-up is 80 % or more and less than 95 %; and
B (Bad): the success rate of the pick-up is less than 80 %.
Kokokarall/é oo As clear from Table 1, all Examples show that an increase in the adhesive strength over time is low and that both the chip retention performance and the chip pick-up performance are excellent irrespective of whether with or without the warming step.
By comparison between Examples 1 and 20, it was found that an increase in the adhesive strength over time was significantly low by using the adipic polyester. Comparative examples 1 to 4 do not show good results because even though the kinds of monomer oo 20 units constituting the (meth)acrylic acid ester copolymer are the same as in the Examples, the percentages of the respective monomer units are not appropriate. Comparative examples 5 and 6 do not show good results because even though the kinds and composition ratios of monomer units constituting the (meth)acrylic acid ester copolymer are the same as in the Examples, the percentages of the weight-average molecular weights are not appropriate.
Comparative examples 7 and 8 do not show good results because even though the kinds and composition ratios of monomer units constituting the (meth)acrylic acid ester copolymer are the same as in the Examples, the percentages of the isocyanate curing agent are not appropriate. Comparative example 9 shows that an increase in the adhesive strength over time is high because the plasticizer used is not a polyester-based polyester.
Here, the present invention can also provide an adhesive sheet including a base film including polyvinyl chloride and a polyester-based plasticizer, and an adhesive layer of an adhesive composition on the base film. The adhesive composition contains 100 parts by mass of a (meth)acrylic acid ester copolymer and 0.01 to 5 parts by mass of an isocyanate «curing agent.
The (meth) acrylic acid ester copolymer contains 5 to 55 % by mass of a methyl (meth)acrylate unit, 0.1 to 10 % by mass of a monomer unit having a hydroxyl group, and the remainder consists of butyl (meth) acrylate and inevitable impurities. The weight-average molecular weight of the (meth)acrylic acid ester copolymer is 400,000 to 1,000,000. p= 20
ADHESIVE SHEET AND METHOD OF MANUFACTURING ELECTRONIC
COMPONENT USING THE SAME 7 = Eg > > \ EY
Technical field Ln \ % : 5 wo oo oe
The present invention relates to an adhesive sheet and a method of manufacturing electronic components using the adhesive sheet.
Background art
Usually, after an adhesive sheet 1s bonded to a semiconductor wafer on which a circuit pattern has been formed, the semigonductor wafer undergoes the following steps: cutting the wafer into chips (dicing step); washing and drying the sheet; expanding the sheet (expanding step); peeling the chips off the sheet (pick-up step); and mounting the chips. An adhesive sheet for dicing and/or conveyance is disclosed as, for example, in
Patent Literature 1, which is used in those steps and includes a base material of polyvinyl chloride.
In addition, an adhesive composition containing a (meth)acrylic acid ester copolymer is disclosed as, for example, in Patent Literature 2.
L ™
Citation list
Patent Literature
PTL1: Japanese Patent Application Laid-Open No. 2006-049509
PTL2: Japanese Patent Application Laid-Open No. 2007-246633
Summary of Invention
Problems to be solved by the invention
However, such a conventional adhesive sheet including a base material of polyvinyl chloride has a problem that a - plasticizer is transferred from the base material to an adhesive layer with the passing of time, and therefore the chip pick-up performance in the pick-up step is poor. In addition, for use in dicing an adherend such as a wafer or a package substrate, the adhesive sheet may be bonded to the adherend and then be diced after warming to 75 degrees Celsius, or the adhesive sheet may be diced without the warming. When the adhesion of the adhesive sheet to the adherend is not good, the warming is performed to ’ 20 improve the adhesion to prevent chips from peeling off. As a result, however, the chip pick-up performance after the dicing step is likely to deteriorate. Moreover, even if warming is conducted, the adhesive composition may be adjusted in order to prevent the deterioration of the chip pick-up performance after dicing. However, with this adjusted adhesive composition, the adhesion is still likely to deteriorate if the warming is not performed. With this sort of problem, conventionally, it has been t » difficult to use the same adhesive sheet in both a manufacturing line with the warming step and a manufacturing line without the warming step, and therefore there has been no option but to use different adhesive sheets for manufacturing lines with and without the warming step.
The present invention has been made to solve the above-described problem, and it is therefore an object of the present invention to provide an adhesive sheet that prevents the deterioration of the chip pick-up performance in the pick-up step over time and that can be used in both a manufacturing line with o the warming step and a manufacturing line without the warming step prior to the dicing step.
Solution to Problem
The present invention provide an adhesive sheet including: a base film including polyvinyl chloride and a polyester-based plasticizer; and an adhesive layer of an adhesive composition on - 20 the base film, wherein: the adhesive composition contains 100 parts by mass of a (meth)acrylic acid ester copolymer and 0.01 to 5 parts by mass of an isocyanate curing agent; the (meth)acrylic acid ester copolymer contains 40 to 90 % by mass of a butyl (meth) acrylate unit, 5 to 55 % by mass of a methyl (meth)acrylate unit, and 0.1 to 10 % by mass of a monomer unit having a hydroxyl group; and a weight-average molecular weight of the (meth)acrylic acid ester copolymer is 400,000 to t ¥ 1,000,000.
The inventers dedicated to studying to solve the problem of the deterioration of the chip pick-up performance over time.
As a result, we found that it was possible to prevent the deterioration of the chip pick-up performance over time by using an adhesive composition containing a (meth)acrylic acid ester copolymer as a base resin, and a polyester-based plasticizer. We further studied to develop an adhesive sheet that can be used in both of the manufacturing lines with and without the warming step.
As a result, we succeeded in finding that both the chip retention - and the chip pick-up have been improved irrespective of whether a manufacturing line involves the warming step or not, by using the (meth)acrylic acid ester copolymer having the above-described composition as the base resin; containing the above-described content of the isocyanate curing agent in the adhesive composition; and limiting the content of the epoxy curing agent to the above-described range. Thus, we have accomplished the present invention. oo 20
An important point of the prevent invention is that, only when the (meth)acrylic acid ester copolymer with a specified composition and the curing agent with a specified composition are combined, is it possible to achieve the adhesive sheet which is advantageously characterized in that both the chip pick-up performance and the chip retention performance are good irrespective of whether with or without the warming step. The
‘ . inventers conducted experiments on combinations of (meth)acrylic acid ester copolymers with various compositions and curing agents with various compositions. When either of the composition of the copolymer or the composition of the curing agent did not fall within the above-described range, the chip retention performance and/or the chip pick-up performance with or without the warming step involved were deteriorated, and therefore it was not possible to achieve a desired adhesive sheet.
Hereinafter, various embodiments of the present invention will be illustrated. The following embodiments may be combined oo with each other. It is preferred that the (meth)acrylic acid ester copolymer contains 50 to 80 % by mass of the butyl (meth) acrylate unit and 15 to 45 % by mass of the methyl (meth)acrylate unit. It is preferred that the monomer having a hydroxyl group is 2-hydroxyethyl acrylate. It is preferred that the base film contains 25 to 45 parts by mass of the polyester-based plasticizer with respect to 100 parts by mass of the polyvinyl chloride. It is preferred that the 7 20 polyester-based plasticizer is adipic acid-based polyester. It is preferred that he adhesive sheet is a dicing tape used in a method of manufacturing electronic components, the method including: a) a bonding step of bonding the dicing tape to a semiconductor wafer or a substrate and a ring frame; b) a dicing step of dicing the semiconductor wafer or the substrate to produce semiconductor chips or semiconductor parts; c) an expansion step of expanding the adhesive sheet to increase a distance between
: » the semiconductor chips or the semiconductor parts; and d) a pick-up step of picking up the semiconductor chips or the semiconductor parts from the adhesive sheet. It is preferred that the method further includes a step of warming the adherend to which the adhesive sheet is bonded, to 60 to 100 degrees Celsius after the bonding step and before the dicing step.
Description of Embodiments
Note that “monomer unit” in the specification means a structural unit derived from a monomer. “part” and “percent (%)” ) in the specification are expressed by mass unless otherwise noted.
In the specification, acrylate and methacrylate are collectively referred to as “ (meth)acrylate”. Likewise, compounds with and without “meth” are correctively referred to as compound with “meth” such as (meth)acrylic acid.
According to one embodiment of the present invention, an adhesive sheet includes a base film including polyvinyl chloride oT 20 and a polyester-based plasticizer, and an adhesive layer of an adhesive composition on the base film. The adhesive composition contains 100 parts by mass of a (meth)acrylic acid ester copolymer and 0.01 to 5 parts by mass of an isocyanate curing agent.
The (meth) acrylic acid ester copolymer contains 50 to 80 % by mass of a butyl (meth)acrylate unit, 15 to 45 % by mass of a methyl (meth) acrylate unit, and 0.1 to 10 % by mass of a monomer unit having a hydroxyl group.
<1. Base film>
The base film may include polyvinyl chloride and a polyester-based plasticizer as a plasticizer for the polyvinyl chloride. The polyester-based plasticizer may include polyester which is obtained by polycondensing dicarboxylic acid, for example C2 to C10 aliphatic dicarboxylic acid and/or aromatic dicarboxylic acid such as adipic acid, azelaic acid, sebacic acid, phthalic acid, isophthalic acid, terephthalic acid and so forth with C2 to C10 glycol such as ethylene glycol, propylene glycol, butylene glycol, neopentyl glycol, hexanediol and so forth. As the dicarboxylic acid, the aliphatic dicarboxylic acid such as the adipic acid and the sebacic acid is preferred, and, particularly, the adipic acid is desired in terms of versatility, the price and the temporal stability. As the glycol, both a straight-chain glycol and a side-chain glycol are possible and selected as needed. As the glycol, a C2 to C6 glycol is preferable.
The number average molecular weight of the polyester-based plasticizer is not limited, but, usually, may be 500 to 4000. It oo 20 is preferred that 25 to 45 parts by mass of the polyester-based plasticizer is contained with respect to 100 parts by mass of the polyvinyl chloride, and 30 to 40 parts by mass is more preferable.
Moreover, various additives such as an antioxidant, an ultraviolet absorber, a light stabilizer, an antistat, a flame retardant, and a coloring agent such as dye and a pigment may be added to the base film as needed. These additives may be used

Claims (7)

CLAIMS:
1. An adhesive sheet comprising: a base film containing polyvinyl chloride and ‘2 2 i = 3 i polyester-based plasticizer; and = % 2 an adhesive layer consisting of an adhesive “ | 2 = \/ 32 composition on the base film, wherein: - 3 o WJ ° the adhesive composition contains 100 parts by maSs of a (meth)acrylic acid ester copolymer and 0.01 to 5 parts by mass of an isocyanate curing agent; the (meth)acrylic acid ester copolymer contains 40 to 90% by mass of a butyl (meth)acrylate unit, 5 to 55% by mass of a methyl (meth)acrylate unit, and 0.1 to 10% by mass of a monomer unit having a hydroxyl group; and a weight-average molecular weight of the(meth)acrylic acid ester copolymer is 400,000 to 1,000,000.
2. The adhesive sheet according to claim 1, wherein the (meth)acrylic acid ester copolymer contains 50 to 80% by mass of the butyl (meth)acrylate unit, and 15 to 45% by mass of the methyl (meth)acrylate unit.
3. The adhesive sheet according to one of claims 1 and 2, wherein the monomer having a hydroxyl group is 2- hydroxyethyl acrylate.
4. The adhesive sheet according to claim 1, wherein the base film contains 25 to 45 parts by mass of the
- 4 ¢ polyester-based plasticizer with respect to 100 parts by mass of the polyvinyl chloride.
5. The adhesive sheet according to claim 1, wherein the polyester-based plasticizer includes adipic acid-based polyester.
6. The adhesive sheet according to claim 1, wherein the adhesive sheet is a dicing tape used in a method of manufacturing electronic components, the method including: a) a bonding step of bonding the dicing tape to a semiconductor wafer or a substrate and a ring frame; b) a dicing step of dicing semiconductor wafer or the substrate to produce semiconductor chips or semiconductor parts; «c¢) an expansion step of expanding the adhesive sheet to increase a distance between the semiconductor chips or the semiconductor parts; and d) a pick-up step of picking up the semiconductor chips or the semiconductor parts from the adhesive sheet.
7. The adhesive sheet according to claim 6, further comprising a warming step of warming the adherend to which the adhesive sheet has been bonded to 60 to 100 degrees Celsius after the bonding step and before the dicing step.
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