CN103959444B - The manufacture method of the electronic component of bonding sheet and use bonding sheet - Google Patents
The manufacture method of the electronic component of bonding sheet and use bonding sheet Download PDFInfo
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- CN103959444B CN103959444B CN201280058909.1A CN201280058909A CN103959444B CN 103959444 B CN103959444 B CN 103959444B CN 201280058909 A CN201280058909 A CN 201280058909A CN 103959444 B CN103959444 B CN 103959444B
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- methyl
- mass
- bonding sheet
- mass parts
- acrylate copolymer
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- 239000003795 chemical substances by application Substances 0.000 claims abstract description 43
- 238000005520 cutting process Methods 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 36
- -1 (methyl) methyl Chemical group 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 25
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
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- 229910052731 fluorine Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N fumaric acid Chemical compound OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- ANJPRQPHZGHVQB-UHFFFAOYSA-N hexyl isocyanate Chemical class CCCCCCN=C=O ANJPRQPHZGHVQB-UHFFFAOYSA-N 0.000 description 1
- 235000013980 iron oxide Nutrition 0.000 description 1
- DCYOBGZUOMKFPA-UHFFFAOYSA-N iron(2+);iron(3+);octadecacyanide Chemical compound [Fe+2].[Fe+2].[Fe+2].[Fe+3].[Fe+3].[Fe+3].[Fe+3].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] DCYOBGZUOMKFPA-UHFFFAOYSA-N 0.000 description 1
- VBMVTYDPPZVILR-UHFFFAOYSA-N iron(2+);oxygen(2-) Chemical class [O-2].[Fe+2] VBMVTYDPPZVILR-UHFFFAOYSA-N 0.000 description 1
- 239000000865 liniment Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N o-xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- WQDGUYZIAJKLAB-UHFFFAOYSA-N octan-2-yl nitrite Chemical group CCCCCCC(C)ON=O WQDGUYZIAJKLAB-UHFFFAOYSA-N 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 150000004812 organic fluorine compounds Chemical class 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000005518 polymer electrolyte Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000000630 rising Effects 0.000 description 1
- 150000003902 salicylic acid esters Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 150000003463 sulfur Chemical class 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910001929 titanium oxide Inorganic materials 0.000 description 1
- 230000002936 tranquilizing Effects 0.000 description 1
- 239000003204 tranquilizing agent Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Abstract
The present invention provides a kind of bonding sheet, its in pickup process to the pick of wafer will not deterioration, and have heating process and without on two kinds of production lines of heating process before being usable in cutting.A kind of bonding sheet, have on the base material film containing polrvinyl chloride and polyesters plasticizer formed by adhesive phase formed by adhesive composition, its adhesive composition contains it (methyl) acrylate copolymer of 100 mass parts, isocyanates firming agent with 0.1～7 mass parts, (methyl) acrylate copolymer contains it (methyl) methyl acrylate units of 35～85 mass %, the acrylic acid 2 Octyl Nitrite unit of 10～60 mass %, the monomeric unit with carboxyl of 0.5～10 mass %, and 0.01～5 monomeric units with hydroxyl of mass %；Relative to above-mentioned (methyl) acrylate copolymer composition of 100 mass parts, the content of the epoxy resin firming agent of above-mentioned adhesive composition is 0～0.25 mass parts.
Description
Technical field
The present invention relates to bonding sheet and use the manufacture method of electronic component of this bonding sheet.
Background technology
Generally, semiconductor crystal wafer is fitted bonding sheet after the circuitry is formed, is then cut off (cutting) and becomes element die,
Cleaned, dry, the extension (expansion) of bonding sheet, from the stripping (pickup) of the element die of bonding sheet, peace
Each operations such as dress.Use and/or the bonding sheet of conveying, patent as the cutting used in these operations
Document 1 has been recorded the example using polrvinyl chloride on base material.
Additionally, in patent documentation 2, disclose use (methyl) acrylate as adhesive composition common
The compositions of polymers, patent documentation 3 then discloses the bonding sheet that ionomer resin is used in substrate layer.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 6-61346 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2001-89731 publication
Patent documentation 3: Japanese Unexamined Patent Publication 2007-31535 publication
Summary of the invention
Invent problem to be solved
There are the following problems as the bonding sheet of base material for existing polrvinyl chloride: i.e., plasticizer can through time from
Base material moves to adhesive phase, and the pick in pickup process chips there will be problem.
During additionally, bonding sheet to be used in the cutting of the adherend of wafer and base plate for packaging, have and bonding sheet is pasted
It is heated to about 75 DEG C after being combined in adherend to cut again, and does not heat and directly carry out cutting two kinds of feelings
Shape.Heating be the cohesiveness between adherend and bonding sheet the best time, in order to improve adherend and bonding sheet
Cohesiveness, the operation carried out to prevent wafer from dispersing.But after heating, picking up of the wafer after cutting
Taking property may deteriorate.Even if if after the composition of binding agent is adjusted to carrying out heating and also will not make cutting
The degree that the pick of wafer deteriorates, then it may happen that cohesiveness when heating deteriorates.Owing to depositing
In above-mentioned deficiency, therefore, existing bonding sheet is difficult to the production line that dual-purpose heats and the life having heating to nothing
Produce on line, can only use respectively specifically for without heating or having the different bonding sheets heated and design.
The present invention is in view of the foregoing, it is provided that the pick of the wafer in pickup process will not produce through time bad
Change, and have heating process before cutting can be used in and without the bonding sheet on two kinds of production lines of heating process, with
And use the manufacture method of the electronic component of above-mentioned bonding sheet.
The technological means of solution problem
According to the present invention, it is provided that a kind of bonding sheet, it has containing polrvinyl chloride and polyesters plasticizer
Formed on base material film is contained by the most above-mentioned adhesive composition of adhesive phase formed by adhesive composition
(methyl) acrylate copolymer of 100 mass parts, and the isocyanates firming agent of 0.1～7 mass parts,
Above-mentioned (methyl) acrylate copolymer contains (methyl) methyl acrylate units of 35～85 mass %,
The 2-EHA unit of 10～60 mass %, the monomer list with carboxyl of 0.5～10 mass %
Unit, and the monomeric unit with hydroxyl of 0.01～5 mass %, relative to the above-mentioned (first of 100 mass parts
Base) acrylate copolymer composition, the content of the epoxy resin firming agent of above-mentioned adhesive composition be 0～
0.25 mass parts.
Additionally, according to the present invention, it is provided that a kind of bonding sheet, it has and is utilizing metal ion will have ethylene
The ionomer of the crosslinking copolymers of unit, methacrylic acid unit and (methyl) acrylate unit
In the substrate film that resin is formed formed by adhesive phase formed by adhesive composition, the most above-mentioned bonding
Agent compositions contains (methyl) acrylate copolymer of 100 mass parts, different with 0.1～7 mass parts
Cyanate firming agent, above-mentioned (methyl) acrylate copolymer contains (methyl) of 35～85 mass %
Methyl acrylate units, the 2-EHA unit of 10～60 mass %, 0.5～10 mass %
There is the monomeric unit of carboxyl, and the monomeric unit with hydroxyl of 0.01～5 mass %, relative to 100
Above-mentioned (methyl) acrylate copolymer composition of mass parts, the epoxy resin of above-mentioned adhesive composition
The content of firming agent is 0～0.25 mass parts.
The present inventor studies intensively, result to solve the problem of the pick deterioration of wafer
Find as adhesive composition will (methyl) acrylate copolymer be used as base resin, and conduct can
Mould agent and use polyesters plasticizer, the then problem that can prevent the pick deterioration of wafer.
Further, the production line without heating process can be used in simultaneously in order to develop and have the production line of heating process
Bonding sheet studied, found that by (methyl) acrylate copolymer of above-mentioned composition for base
Bottom resin so that it is the isocyanates firming agent containing above-mentioned content, and containing epoxy resin firming agent
Amount limit within the above range in the case of, regardless of whether heating, all can have good wafer retentivity and
Pick, then completes the present invention.
The emphasis of the present invention is: by (methyl) acrylate copolymer and the specific composition of specific composition
The combination of firming agent, just can obtain regardless of whether heat and can have good wafer retentivity and pick
Bonding sheet etc. advantageous characteristic.(methyl) acrylate that the present inventor employs various composition is common
The combination of the firming agent of polymers and various compositions carried out experiment, if but copolymer and firming agent any
One composition outside the above range, all can make at the wafer retentivity without heating and/or when having a heating and/or
Pick deteriorates, therefore, it is impossible to obtain desired bonding sheet.It is of particular importance that make compositions the most not
Containing epoxy resin firming agent, even if or also its content is controlled containing epoxy resin firming agent
In above-mentioned scope.This is because, when containing the epoxy resin firming agent beyond above-mentioned scope, wafer keeps
Property can severe exacerbation.
Preferably, in above-mentioned (methyl) acrylate copolymer, above-mentioned (methyl) acrylic acid methyl ester.
Unit is 35～62.5 mass %, and aforesaid propylene acid 2-Octyl Nitrite unit is 20～60 mass %.
Preferably, relative to above-mentioned (methyl) acrylate copolymer composition of 100 mass parts, above-mentioned
The content of the above-mentioned epoxy resin firming agent of adhesive composition is 0～0.1 mass parts.
Preferably, the monomer with above-mentioned carboxyl is acrylic acid.
Preferably, the monomer with above-mentioned hydroxyl is acrylic acid 2-hydroxy methacrylate.
Preferably, relative to the polrvinyl chloride of 100 mass parts, above-mentioned base material film contains 25～45 mass
The above-mentioned polyesters plasticizer of part.
Preferably, above-mentioned polyesters plasticizer is adipic acid kind polyester.
Preferably, it is provided that the manufacture method of a kind of electronic component, including: by above-mentioned bonding sheet laminating glued
Thing and the bonding process of ring stand, cut above-mentioned adherend and become the cutting action of wafer, and from above-mentioned bonding sheet
Pick up the pickup process of above-mentioned wafer.
Preferably, after above-mentioned bonding process, before above-mentioned cutting action, more above-mentioned for posting
The above-mentioned adherend of bonding sheet is heated to the heating process of 60～100 DEG C.
Detailed description of the invention
Hereinafter, the various embodiments of the present invention are illustrated.Following embodiment can also be combined with each other.
In this specification, monomeric unit refers to the construction unit obtained from monomer.Part in this specification and %,
If without recording especially, then it represents that quality standard.In this specification, (methyl) acrylate refers to acrylate
And the general name of methacrylate.Similarly, such as (methyl) acrylic acid etc., the compound of " methyl " is contained
Also it is the general name of the compound containing " methyl " and the compound not containing " methyl ".
The bonding sheet of an embodiment of the present invention, it has containing polrvinyl chloride and the base of polyesters plasticizer
On material film formed by adhesive phase formed by adhesive composition, the most above-mentioned adhesive composition contains
(methyl) acrylate copolymer of 100 mass parts, and the isocyanates firming agent of 0.1～7 mass parts,
Above-mentioned (methyl) acrylate copolymer contains (methyl) methyl acrylate units of 35～85 mass %,
The 2-EHA unit of 10～60 mass %, the monomer list with carboxyl of 0.5～10 mass %
Unit, and the monomeric unit with hydroxyl of 0.01～5 mass %, relative to the above-mentioned (first of 100 mass parts
Base) acrylate copolymer composition, the content of the epoxy resin firming agent of above-mentioned adhesive composition be 0～
0.25 mass parts.
1. base material film
As base material film, use containing polrvinyl chloride and as gathering that the plasticizer of polrvinyl chloride is used
The base material film of esters plasticizer, or use by utilizing metal ion will have ethylene unit, methacrylic acid
The copolymer of unit and (methyl) acrylate unit carries out the ionomer resin institute shape cross-linked
The base material film become.
As polyesters plasticizer, can enumerate such as by adipic acid, Azelaic Acid, decanedioic acid, O-phthalic
The aliphatic dicarboxylic acid of the charcoal atomic numbeies 2～10 such as acid, M-phthalic acid, p-phthalic acid and/or aromatic series
The dicarboxylic acids such as dicarboxylic acids, with charcoal atomic numbeies such as ethylene glycol, propylene glycol, butanediol, neopentyl glycol, hexanediol
The glycol generation polycondensation of 2～10 and the polyester that generates.As above-mentioned dicarboxylic acids, preferably adipic acid, decanedioic acid
Deng aliphatic dicarboxylic acid, particularly consider on versatility, price and ageing stability, preferably adipic acid.Make
For glycol, it is possible to use straight-chain or branched material, can the most suitably select.Above-mentioned glycol,
Preferably containing the material that charcoal atomic number is 2～6.The number-average molecular weight of polyesters plasticizer is not particularly limited,
Generally use the polyesters plasticizer that number-average molecular weight is about 500～4000.As containing of polyesters plasticizer
Amount, relative to polrvinyl chloride 100 parts, preferably 25～45 parts, more preferably 30～40 parts.
So-called ionomer resin, is the gold of the multipolymer resin with carboxylic vinyl compound unit
Belong to the general name of salt.So-called ionomer resin, be by such as ethylene-methyl acrylate copolymer and ethylene-
Methacrylate, is polymerized with as ternary alkyl acrylate or alkyl methacrylate etc.,
And make the metal ion of gains and lithium, sodium ion, potassium ion and/or zinc ion etc. cross-link and obtain
Material.As the metal ion of the carboxyl of crosslinked ionomers resin, such as, there are sodium ion, potassium ion, zinc
Ion etc..In the middle of these metal ions, preferably contain the ionomer resin of zinc ion, this resinoid
Impact on the fraction defective of electronic component is less.
As have ethylene unit, methacrylic acid unit and (methyl) acrylate unit from
Copolymer resin, for instance that ethylene-methyl methacrylate-(methyl) propyl acrylate ionomer resin, ethylene
-methacrylic acid-(methyl) butyl acrylate ionomer resin, ethylene-methyl methacrylate-(methyl) third
Olefin(e) acid own ester ionomer resin, ethylene-methyl methacrylate-(methyl) acrylic acid 2-methyl ester propyl ester ionomer tree
Fat, ethylene-methyl methacrylate-(methyl) acrylic acid 2-ethylpropyl ionomer resin, ethylene-methyl-prop
Olefin(e) acid-(methyl) acrylic acid 2-ethyl butyl ester ionomer resin, ethylene-methyl methacrylate-(methyl) third
Olefin(e) acid 2-methyl ester own ester ionomer resin, ethylene-methyl methacrylate-(methyl) acrylic acid own ester of 3-methyl ester
Ionomer resin, ethylene-methyl methacrylate-(methyl) 2-EHA ionomer resin and
Ethylene-methyl methacrylate-(methyl) acrylic acid 1,2-dimethyl butyl ester ionomer resin etc..At these from poly-
In resin, the ethylene-methyl methacrylate-propylene that easily produce and produce the fewest cutting swarf is preferably used
Acid 2-methyl ester propyl ester ionomer resin.
It addition, can optionally can add on base material film antioxidant, UV absorbent, light stabilizer,
The various additives such as coloring agent, fire retardant such as antistatic additive, dyestuff or pigment.These additives regard its kind
Use with convention amount.
Further below these additives are illustrated.Have no particular limits as antioxidant, permissible
It it is the known antioxidant in existing resin or resin combination.As typical antioxidant, permissible
Enumerate: phenols (single phenols, bisphenols, polymer electrolyte phenols), sulfur class, Phosphorus etc. typically used
Antioxidant.
Additionally, as UV absorbent, salicylic acid esters, benzophenone, benzotriazole can be enumerated
And cyanoacrylate.From the viewpoint of ultra-violet absorption fruit, preferably benzophenone ultraviolet
Absorbent and Benzotriazole Ultraviolet Stabilizer, particularly preferred Benzotriazole Ultraviolet Stabilizer.
As light stabilizer, it is possible to use the such as light stabilizer such as hindered amines, Hinered phenols.Light stabilizer
Addition be not particularly limited, the amount being typically used.
As antistatic additive, it is not particularly limited, quarternary ammonium salt monomer etc. can be enumerated.As quarternary ammonium salt
Monomer, can enumerate such as: (methyl) dimethylaminoethyl acrylate level Four chloride, (methyl) propylene
Acid lignocaine ethyl ester level Four chloride, (methyl) acrylic acid methyl-ethylamino ethyl ester level Four chloride, right
Dimethylamino styrene level Four chloride and to lignocaine styrene level Four chloride etc., is preferably used methyl
Dimethylaminoethyl acrylate level Four chloride.
As fire retardant, it is not particularly limited, can enumerate such as: brominated flame retardant, aluminium hydroxide, hydrogen
The mineral-type fire retardant such as magnesium oxide, antimony trioxide；Spread out containing melamine cyanurate, carbamide, tripolycyanamide
Biology waits the compound Han triazine ring；The organic fire retardants such as phosphate ester such as aromatic polyphosphate ester.
As coloring agent, it is possible to use organic pigment, mineral-type pigment, dyestuff, white carbon black etc. are known or all
Any coloring agent known.Color is any, for example, it is possible to be white, milky, black, redness, green,
Yellow and green etc..In the case of base material film is made multiple structure, coloring can be added in all layers
Agent, or only can also add coloring agent in a part of layer.As pigment, can enumerate such as: phthalocyanine
Class, azo, condensation azo, azo lake class, Anthraquinones, perylene and pyrene ketone, indigo and sulfur
Indigoid, iso-indole ketone, azomethine azo, dioxazine, quinoline Azone class, nigrosine class, triphen
The organic pigments such as methane class, white carbon black class；Titanium oxide, iron oxides, hydrated ferric oxide. class, chromium oxide class,
Spinel-type burns till class, chromic acid class, chrome vermilion class, prussian blue, aluminium powder class, bronze powder class etc.
Pigment.
The form of these pigment is regardless of, and these pigment can be to implement various by various known methods
Pigment after dispersion process.
As the thickness of base material film, be not particularly limited, suitably can adjust according to demand, can be such as 40～
250 μm, preferably 50～200 μm, more preferably 60～150 μm.
As the manufacturing process of base material film, such as, there are calendaring molding method, T die head extrusion method, plavini and water
Casting.
Charged during in order to prevent stripping film from peeling off, it is also possible at the binding agent contact surface of base material film and/or non-
Contact surface implements antistatic treatment.Antistatic additive kneading can be entered in resin.Antistatic treatment can use level Four
The antistatic additive of monomeric amine salt etc..
As quaternary ammonium compound salt monomer, such as, there are (methyl) DMAM level Four chloride, (first
Base) acrylic acid diethyl aminoethyl level Four chloride, (methyl) acrylic acid Methylethyl aminoethyl level Four
Chloride, to dimethyl amido styrene level Four chloride and to diethyl amido styrene level Four chloride
Deng, preferably dimethylaminoethyl acrylate methyl base aminoethyl level Four chloride.
The using method of lubricant and antistatic additive is not particularly limited, such as can be in the one side of base material film
Coating adhesive, and at its backsize lubricant and/or antistatic additive, it is possible to by lubricant and/or anti-quiet
Electricity agent kneading enters film forming in the resin of base material film.
At base material film a lamination binding agent, and average surface roughness (Ra) can be made at another side and is
The embossing face of 0.3～1.5 μm.Embossing face is set by the mechanical stage side at extension fixture, can exist easily
Base material film is expanded by the expansion process after cutting.
In order to improve the autgmentability after cutting, can in the binding agent noncontact topcoating of base material film lubricant,
Or lubricant kneading is entered in base material film.
As long as lubricant can reduce the material of bonding sheet and the coefficient of friction of extension fixture, there is no spy
Do not limit, for instance that the organo-silicon compound such as organic siliconresin or (modified) organic silicone oil, fluorine resin,
Hexagonal boron, white carbon black and molybdenum bisuphide etc..These antifriction liniments can be mixed by Multiple components.
Owing to the manufacture of electronic component is carried out in dust free room, organo-silicon compound or fluorine-containing tree are therefore preferably used
Fat.
In organo-silicon compound, owing to having copolymer and the antistatic layer of silicone macromolecule monomeric unit
The compatibility is good, it is possible to takes into account antistatic behaviour and autgmentability, therefore can be preferably used.
2. adhesive phase
In the present embodiment, (methyl) that the adhesive composition of adhesive phase contains 100 mass parts is constituted
Acrylate copolymer, and the isocyanates firming agent of 0.1～7 mass parts, and relative to 100 matter
Above-mentioned (methyl) acrylate copolymer composition of amount part, the content of epoxy resin firming agent is 0～0.25
Mass parts.
<2-1. (methyl) acrylate copolymer>
(methyl) acrylate copolymer contain 35～85 mass % (methyl) methyl acrylate units,
The 2-EHA unit of 10～60 mass %, 0.5～10 monomer lists with carboxyl of mass %
Unit, and the monomeric unit with hydroxyl of 0.01～5 mass %.
(methyl) methyl acrylate units is 35～85 mass %.Reduce less than this scope then pick,
Reduce higher than this scope then wafer retentivity.Furthermore it is preferred that be 35～62.5 mass %.In this range
Can be shown that wafer retentivity and the advantageous characteristic of pick both sides.Specifically, for example, 35 mass %,
40 mass %, 45 mass %, 47.5 mass %, 50 mass %, 52.5 mass %, 55 mass %,
57.5 mass %, 60 mass %, 62.5 mass %, 65 mass %, 70 mass %, 75 mass % and
80 mass %, it is also possible in the range of between any two numerical value in illustrated numerical value.
2-EHA unit is 10～60 mass %.Reduce less than this scope then pick, high
Reduce in this scope then wafer retentivity.Furthermore it is preferred that be 20～60 mass %.Can show in this range
Wafer retentivity and the advantageous characteristic of pick both sides are shown.Specifically, for example, 10 mass %,
20 mass %, 30 mass %, 35 mass %, 40 mass %, 45 mass %, 50 mass % and 60 matter
Amount %, it is also possible in the range of between any two numerical value in illustrated numerical value.
As having the monomer of carboxyl, can enumerate such as (methyl) acrylic acid, butenoic acid, maleic acid, maleic acid
Acid anhydride, itaconic acid, fumaric acid, acrylamide base N-glycolic and cinnamic acid.There is the monomeric unit of carboxyl
It is 0.5～10 mass %.Reduce less than this scope then wafer retentivity, reduce higher than this scope then pick.
Furthermore it is preferred that be 2～10 mass %.Can be shown that wafer retentivity and pick both sides in this range
Advantageous characteristic.Specifically, for example, 0.5 mass %, 1 mass %, 2 mass %, 3 mass %,
4 mass %, 5 mass %, 6 mass %, 7 mass %, 8 mass %, 9 mass %, 10 mass %,
In the range of can also be between any two numerical value in illustrated numerical value.
As having the monomer of hydroxyl, can enumerate such as (methyl) acrylic acid 2-hydroxy methacrylate, (methyl) propylene
Acid 2-hydroxy propyl ester, (methyl) acrylic acid 2-hydroxybutyl and 2-hydroxy ether.There is the monomer list of hydroxyl
Unit is 0.01～5 mass %.Reduce less than this scope then pick, drop higher than this scope then wafer retentivity
Low.Furthermore it is preferred that be 0.1～2 mass %.Can be shown that wafer retentivity and pickup in this range
The advantageous characteristic of property both sides.Specifically, for example, 0.01 mass %, 0.05 mass %, 0.1 mass %,
0.25 mass %, 0.5 mass %, 0.75 mass %, 1 mass %, 2 mass %, 3 mass %, 4
Quality %, 5 mass %, it is also possible in the range of between any two numerical value in illustrated numerical value.
As the preparation method of (methyl) acrylate copolymer, there is the method such as emulsion polymerization, polymerisation in solution.
<2-2. isocyanates firming agent>
Relative to (methyl) acrylate copolymer of 100 mass parts, isocyanates firming agent be 0.1～
7 mass parts.Reduce less than this scope then pick, reduce higher than this scope then wafer retentivity.Additionally,
It is preferably 0.5～2 mass %.Can be shown that wafer retentivity and pick both sides' is excellent in this range
More characteristic.Specifically, for example, 0.1 mass parts, 0.5 mass parts, 1 mass parts, 1.5 mass parts,
2 mass parts, 3 mass parts, 4 mass parts, 5 mass parts, 6 mass parts, 7 mass parts, it is also possible in institute
In the range of between any two numerical value in exemplary values.
As isocyanates firming agent, it is possible to use have the compound of multiple NCO.As tool
Have the compound of multiple NCO, such as have aromatic series kind isocyanate, alicyclic kind isocyanate and
Aliphatic category isocyanates.
As aromatic series kind isocyanate, for instance that toluene di-isocyanate(TDI), 4,4-diphenyl methane two is different
Cyanate, XDI.
As aliphatic category isocyanates, for instance that isophorone diisocyanate, di-2-ethylhexylphosphine oxide (4-ring
Hexyl isocyanates).
As aliphatic isocyanates, for instance that hexamethylene diisocyanate, tri-methyl hexamethylene two
Isocyanates.
These isocyanate compounds, can be dimer or trimer, can also be in addition and polynary alcoholization
The adduct that compound reacts and obtains.
<2-3. epoxy resin firming agent>
Relative to above-mentioned (methyl) acrylate copolymer composition of 100 mass parts, epoxy resin solidifies
The content of agent is 0～0.25 mass parts.Reduce higher than this scope then wafer retentivity.Furthermore it is preferred that be 0～
0.1 mass parts.Can be shown that wafer retentivity and the advantageous characteristic of pick both sides in this range.Excellent
Elect 0 mass parts as.If 0 mass parts, then can improve productivity and reduce cost.Specifically, such as
It is 0 mass parts, 0.05 mass parts, 0.1 mass parts, 0.15 mass parts, 0.2 mass parts, 0.25 mass
Part, it is also possible in the range of between any two numerical value in illustrated numerical value.
As epoxy resin firming agent, for instance that bisphenol A type epoxy compound, bisphenol F type epoxy
Compound, N, N-glycidyl aniline, N, N-glycidyl toluidines, m-N, N-glycidyl group amine
Base phenylglycidyl ether, p-N, N-glycidyl amido phenylglycidyl ether, isocyanuric acid
Three-glycidyl ester, N, N, N ', N '-four glycidyl group two aminodiphenylmethane, N, N, N ', N '-
Four glycidyl group-m-xylenedimaine, N, N, N ', N ', N "-five glycidyls two stretch ethyl triamine.
These compounds can be used alone, it is also possible to is used in combination of two or more.
The tackifying resin for adjusting bonding strength can also be added in adhesive composition.As thickening tree
Fat, can enumerate: such as, rosin resin, rosin ester resin, terpene resin, terpene phenol resin, phenol
Resin, xylene resin, coumarone resin, coumarone indeneresin, styrene resin, aliphatic petroleum tree
Fat, aromatic petroleum resin, aliphatic aromatic combined polymerization Petropols, alicyclic hydrocarbon resin and they
Modifier, derivant or hydrogen addition product etc..
The use level of tackifying resin is not particularly limited, relative to (methyl) acrylic polymer 100
Mass parts, is preferred containing 200 mass parts, preferably 30 mass parts.
<2-4. additive etc.>
Can also add in adhesive composition such as firming agent, polymerization initiator, softening agent, antiager,
Filler, UV absorbent, and light stabilizer, photopolymerizable compound, light trigger etc. are various adds
Add agent.
<the 3. manufacture of bonding sheet>
As formation adhesive phase on base material film with the method making bonding sheet, such as, there is use intaglio plate coating
Machine, comma coating machine, rod coater, knife type coater or roll coater are directly coated with viscous on base material
The method of mixture composite, or by adhesive coated to stripping film and dried, then it is fitted in base material
The method of film.Further, it is also possible to utilize surface printing, intaglio, offset printing, flexographic printing, glue
Adhesive composition is printed onto on base material film by version printing or silk screen printing etc..
The thickness of adhesive phase preferably from about 1～100 μm, more preferably 5～40 μm.If adhesive phase is too
Thin, then bonding force can be occurred to reduce, chip retentivity during cutting can be affected, and there will be from ring stand stripping
From situation.And if adhesive phase is the thickest, then can pick up the best situation.
<the 4. manufacture of electronic component>
Hereinafter, the method illustrating to use above-mentioned bonding sheet to manufacture electronic component.The method as described below, is wrapped
Include bonding process, cutting action and pickup process.It addition, after above-mentioned bonding process and above-mentioned cutting
Before operation, optionally carry out heating process.
Illustrate below for each operation.
(1) bonding process
First, in bonding process, bonding sheet is fitted on adherend and ring stand.Can enumerate as adherend
Semiconductor crystal wafer or base plate for packaging.
(2) heating process
Then, when cohesiveness between adherend and bonding sheet is the best, in order to improve both cohesivenesses,
Carry out heating process.Heating process can be carried out by above-mentioned adherend is heated to 60～100 DEG C.
(3) cutting action
Then, in cutting action, the cutting of adherend is carried out when adherend fits in bonding sheet,
Become wafer.Each wafer formed by cutting will become electronic component.Cutting can use and cut
Cutting blade is carried out.Owing to the wafer retentivity at ultraviolet and/or lonizing radiation pre-irradiation bonding sheet is excellent, because of
This, when cutting, it is possible to suppression wafer peels off (wafer disperses).
(4) pickup process
Then, in the pickup process after cutting action, from bonding sheet, above-mentioned wafer is picked up.Concrete and
Speech, this operation such as can make to carry out using the following method.From the base material film side irradiation ultraviolet radiation of bonding sheet and/or
Lonizing radiation (not shown), expand as radial afterwards by bonding sheet, and widen wafer interval after, by wafer use
Pin etc. (not shown) instrument up pushes up.Afterwards, with vacuum collet chuck (collet) or pneumatic tweezers (air tweezer)
Adsorb wafer Deng (not shown) instrument, and pick up wafer.Ultraviolet and/or the light source of lonizing radiation, can use
Known product.As ultraviolet source, there are low pressure mercury lamp, high-pressure mercury-vapor lamp, extra-high-pressure mercury vapour lamp, gold
Belong to halide lamp.As lonizing radiation, suitably use electron beam, alpha ray, β ray, gamma-rays.
By irradiation ultraviolet radiation and/or lonizing radiation, the vinyl in adhesive composition can be made to reach three dimensional network
Shape, makes the bonding force of adhesive composition reduce.Whereby, before irradiation ultraviolet radiation and/or lonizing radiation,
Owing to adhesive composition has high adhesion originally, accordingly, it is capable to the wafer retentivity that display is excellent, when
After irradiation ultraviolet radiation and/or lonizing radiation, owing to the bonding force of adhesive composition reduces, therefore can improve crystalline substance
The pick of sheet.
In pickup process, the wafer of pickup, can be installed on ring stand or circuit substrate.
Embodiment
Adhesive composition and bonding sheet in embodiment, comparative example manufacture according to following formula.Main
The result of formula and each experimental example is shown in table 1 to table 4.
Table 1 to table 4 relates to the numerical value of composition, represents with mass parts.Relate to the numerical value of plasticizer, represent
Be Corvic be the mass parts of plasticizer when 100 parts.Relate to the numerical value of cross-linking agent, expression
Be (methyl) acrylate copolymer be the mass parts of cross-linking agent when 100 parts.Specifically used plasticizer,
Resin molding and firming agent are as follows:
Adipate polyester: Dainippon Ink. & Chemicals Inc's system, trade name POLYCIZER
W2310, number average molecular weight 2300
P-phthalic acid kind polyester: commercially available product (polyethylene terephthalate)
Resin molding A: ionomer resin masking, with ethylene-methyl methacrylate-acrylic acid 2-methyl ester propyl ester altogether
The Zn salt of polymers is as main body.MFR 2.8g/10min (JIS K7210 method, 210 DEG C), DUPONT-MITSUI
POLYCHEMICALS Co., Ltd. system, commercially available product.In table 3 this is expressed as " ionomer A ".
Resin molding B: ionomer resin masking, based on the Zn salt of ethylene-methacrylic acid copolymer,
MFR 2.8g/10min (JIS K7210 method, 210 DEG C), DUPONT-MITSUI POLYCHEMICALS strain
Formula commercial firm system.In table 4 this is expressed as " ionomer B ".
Isocyanates firming agent: the trimethylolpropane adduct of 2,4 toluene diisocyanate, city
Sell product.
Epoxy resin firming agent: TETRAD-X, Rhizoma Sparganii gas chemicals.
" base material film " in table 1 and table 2 is containing polrvinyl chloride (PVC) and table 1 and table 2 institute
The film of the plasticizer shown.
Adipic acid kind polyester, p-phthalic acid kind polyester are all the example of polyesters plasticizer.
Acrylic acid methyl ester., methyl methacrylate, butyl acrylate are all (methyl) acrylic ester unit
Example.
Acrylic acid is the example of the monomeric unit with carboxyl.
Acrylic acid 2-hydroxy methacrylate, 2-hydroxyethyl methacrylate are the example of the monomeric unit with hydroxyl.
First, it is mixed with the plasticizer shown in Corvic and table 1 to table 4, and other tranquilizers,
Pigment and filler.After this resin compound utilizes class's background of cloth mixer mixing, use calendering processing method
Define the base material film of 70 μ m thick.
Then, by the adhesive composition of composition shown in table 1 to table 4, it is coated on PET stripping film,
And to make the thickness of dried adhesive phase reach 15 μm, thus obtain lamination bonding sheet on base material film.
The bonding sheet obtained is carried out following evaluation.
(1) to bonding force through time rising degree evaluation
Bonding sheet is fitted on Silicon Wafer minute surface, comes and goes pressing once with 2kg roller, after placing 20 minutes,
Bonding force is measured under conditions of 180 ° of strippings, draw speed 300mm/ minute.Silicon Wafer employs 725
The wafer (6 English) of μ m-thick.
It addition, make placed the test body of 7 days after above-mentioned condition pressing, to this test body also with equally
Method measure its bonding force.Place the bonding force (X) of the test body of 20 minutes and place the examination of 7 days
Test the bonding force (Y) of body, try to achieve climbing according to following calculating formula.
Climbing=(100 × (Y-X))/X
The climbing calculated according to following benchmark, have rated bonding force through time the degree that rises.
◎ (excellent): climbing does not reaches 5%.
Zero (good): climbing is more than 5% not reach 10%.
× (the best): climbing is more than 10%.
(2) wafer retentivity and the evaluation of die pick
The bonding sheet of gained is fitted in the diameter 8 inches × thickness 0.1mm being formed with dummy circuit
On Silicon Wafer and ring stand.It is then used by baking box to heat 30 minutes at 75 DEG C.Then carry out cutting, pickup etc.
Each operation.
The condition of cutting action is as follows:
Cutter sweep: DISCO company DAD341
Cutting blade: DISCO company NBC-ZH205O-27HEEE
Cutting blade shape: wide 35 μm of external diameter 55.56mm, blade, internal diameter 19.05mm
Cutting blade rotating speed: 40,000rpm
Cutting blade pace: 50mm/sec
Cut lengths: 1.5mm side
Approach to bonding sheet: 15 μm
Cutting water temperature: 25 DEG C
The cutting water yield: 1.0L/min
The condition of pickup process is as follows:
Pick device: Canon Machinery company CAP-300I I
Amount of expansion: 8mm
Thimble shape: 70 μm R
Thimble number: 1
Thimble jack-up height: 1.5mm
In cutting action and pickup process, carry out following evaluation.
(2-1) wafer retentivity
The quasiconductor that wafer retentivity is maintained on bonding sheet based on the semiconductor wafer after cutting action
The Retention of wafer, is evaluated according to following benchmark.
◎ (excellent): wafer disperses and do not reaches 5%.
Zero (good): it is more than 5% not reach 10% that wafer disperses.
× (the best): it is more than 10% that wafer disperses.
(2-2) die pick
Pick pickup rate based on the semiconductor wafer in pickup process, is commented according to following benchmark
Valency.
The pickup success rate of ◎ (excellent): wafer is more than 95%.
Zero (good): the pickup success rate of wafer is more than 80% not reach 95%.
× (the best): the pickup success rate of wafer is not for reach 80%.
As shown in table 1, table 2, can know clearly in all of embodiment (embodiment 1 to embodiment 14)
In, bonding force through time the degree that rises little, and regardless of whether there is heating, can obtain wafer retentivity and
The result that pick is the most superior.
Comparing embodiment 1 to embodiment 3, learns that the amount of epoxy resin firming agent is 0.1 mass parts
Time, wafer retentivity can become the best.
Comparing embodiment 1 to embodiment 14, learns in the case of using adipic acid kind polyester, bonding force warp
The degree of Shi Shangsheng becomes the least.
In comparative example 1, the amount of epoxy resin firming agent is too much, therefore, and the crystalline substance when without heating
Sheet retentivity is bad.
In comparative example 2 to comparative example 7, constitute the kind of the monomeric unit of (methyl) acrylate copolymer
Class is identical with embodiment, but because its ratio is inappropriate, does not the most obtain good result.
In comparative example 8 to comparative example 12, constitute the monomeric unit of (methyl) acrylate copolymer
Kind differs with embodiment, thus does not obtains good result.
In comparative example 13, use is not the plasticizer of polyesters, therefore, bonding force through time rise
Degree big.
As shown in table 3 to table 4, can know clearly in all of embodiment (embodiment 15 to embodiment 29)
In, regardless of whether there is heating, wafer retentivity and the most superior result of pick can be obtained.
Comparing embodiment 15 to embodiment 17, learns that the amount of epoxy resin firming agent is 0.1 mass
During part, wafer retentivity can become the best.
In comparative example 14, the amount of epoxy resin firming agent is too much, therefore, when without heating
Wafer retentivity is the best.
The kind of the monomeric unit of (methyl) acrylate copolymer is constituted in comparative example 15 to comparative example 20
Class is identical with embodiment, but because its ratio is inappropriate, does not the most obtain good result.
In comparative example 21 to comparative example 25, constitute the monomeric unit of (methyl) acrylate copolymer
Kind differs with embodiment, thus does not obtains good result.
In comparative example 26, because the binary system of the Zn salt that ionomer resin is ethylene-methacrylic acid copolymer,
So not obtaining good result.
Claims (14)
1. a bonding sheet, it is characterised in that: have containing polrvinyl chloride and the base material of polyesters plasticizer
The adhesive phase formed by adhesive composition formed on film,
Wherein said adhesive composition contains (methyl) acrylate copolymer of 100 mass parts, with
The isocyanates firming agent of 0.1～7 mass parts；
Described (methyl) acrylate copolymer contains (methyl) acrylic acid methyl ester. of 35～85 mass %
Unit, the 2-EHA unit of 10～60 mass %, 0.5～10 mass % there is carboxyl
Monomeric unit, and the monomeric unit with hydroxyl of 0.01～5 mass %；
Relative to (methyl) acrylate copolymer composition described in 100 mass parts, described binding agent combines
The content of the epoxy resin firming agent of thing is 0～0.25 mass parts.
Bonding sheet the most according to claim 1, wherein in described base material film, relative to 100 mass
The described polrvinyl chloride of part, containing the described polyesters plasticizer of 25～45 mass parts.
Bonding sheet the most according to claim 1, wherein said polyesters plasticizer is adipic acid system polyester.
Bonding sheet the most according to claim 1, wherein in described (methyl) acrylate copolymer,
Described (methyl) methyl acrylate units is 35～62.5 mass %, described 2-EHA list
Unit is 30～60 mass %.
Bonding sheet the most according to claim 1, wherein in described adhesive composition, relative to 100
Described (methyl) acrylate copolymer composition of mass parts, the content of described epoxy resin firming agent is
0～0.1 mass parts.
Bonding sheet the most according to claim 1, the monomer wherein with described carboxyl is acrylic acid.
Bonding sheet the most according to claim 1, the monomer wherein with described hydroxyl is acrylic acid 2-
Hydroxy methacrylate.
8. a bonding sheet, it is characterised in that: have and utilizing metal ion will have ethylene unit, methyl
The ionomer resin of the crosslinking copolymers of acrylic acid units and (methyl) acrylate unit is formed
Substrate film on formed the adhesive phase formed by adhesive composition,
Wherein said adhesive composition contains (methyl) acrylate copolymer of 100 mass parts, with
The isocyanates firming agent of 0.1～7 mass parts；
Described (methyl) acrylate copolymer contains (methyl) acrylic acid methyl ester. of 35～85 mass %
Unit, the 2-EHA unit of 10～60 mass %, 0.5～10 mass % there is carboxyl
Monomeric unit, and the monomeric unit with hydroxyl of 0.01～5 mass %；
Relative to (methyl) acrylate copolymer composition described in 100 mass parts, described binding agent combines
The content of the epoxy resin firming agent of thing is 0～0.25 mass parts.
Bonding sheet the most according to claim 8, wherein in described (methyl) acrylate copolymer,
Described (methyl) methyl acrylate units is 35～62.5 mass %, described 2-EHA list
Unit is 30～60 mass %.
Bonding sheet the most according to claim 8, wherein in described adhesive composition, relative to
Described (methyl) acrylate copolymer composition of 100 mass parts, containing of described epoxy resin firming agent
Amount is 0～0.1 mass parts.
11. bonding sheets according to claim 8, the monomer wherein with described carboxyl is acrylic acid.
12. bonding sheets according to claim 8, the monomer wherein with described hydroxyl is acrylic acid 2
-hydroxy methacrylate.
The manufacture method of 13. 1 kinds of electronic components, including:
Bonding sheet according to any one of claim 1 to 12 is fitted in the laminating on adherend and ring stand
Operation；
Cut described adherend and become the cutting action of wafer；And,
The pickup process of described wafer is picked up from described bonding sheet.
The manufacture method of 14. electronic components according to claim 13, wherein described bonding process it
Before rear and described cutting action, also include being heated to the described adherend being fitted with described bonding sheet 60～
The heating process of 100 DEG C.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-264440 | 2011-12-02 | ||
| JP2011264440 | 2011-12-02 | ||
| PCT/JP2012/080642 WO2013080979A1 (en) | 2011-12-02 | 2012-11-27 | Adhesive sheet, and method for producing electronic component using adhesive sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103959444A CN103959444A (en) | 2014-07-30 |
| CN103959444B true CN103959444B (en) | 2016-11-30 |
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|---|---|---|---|---|
| CN1683464A (en) * | 2004-04-15 | 2005-10-19 | 日东电工株式会社 | Adhesive composition for optical member, adhesive layer for optical member and its producing method, optical member with adhesive, and image display device |
| CN101321839A (en) * | 2005-12-07 | 2008-12-10 | 电气化学工业株式会社 | Pressure-sensitive adhesive sheet and process for producing electronic part therewith |
| CN102067245A (en) * | 2008-07-04 | 2011-05-18 | 户田工业株式会社 | Transparent electrically conductive transfer plate and production method therefor, transparent electrically conductive base, method for producing transparent electrically conductive base using transparent electrically conductive transfer plate, and molded product using the transparent conductive substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1683464A (en) * | 2004-04-15 | 2005-10-19 | 日东电工株式会社 | Adhesive composition for optical member, adhesive layer for optical member and its producing method, optical member with adhesive, and image display device |
| CN101321839A (en) * | 2005-12-07 | 2008-12-10 | 电气化学工业株式会社 | Pressure-sensitive adhesive sheet and process for producing electronic part therewith |
| CN102067245A (en) * | 2008-07-04 | 2011-05-18 | 户田工业株式会社 | Transparent electrically conductive transfer plate and production method therefor, transparent electrically conductive base, method for producing transparent electrically conductive base using transparent electrically conductive transfer plate, and molded product using the transparent conductive substrate |
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