WO2014185390A1 - Joint pour dispositif électronique - Google Patents
Joint pour dispositif électronique Download PDFInfo
- Publication number
- WO2014185390A1 WO2014185390A1 PCT/JP2014/062652 JP2014062652W WO2014185390A1 WO 2014185390 A1 WO2014185390 A1 WO 2014185390A1 JP 2014062652 W JP2014062652 W JP 2014062652W WO 2014185390 A1 WO2014185390 A1 WO 2014185390A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gasket
- substrates
- fastening
- electronic device
- width
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 description 13
- 239000003792 electrolyte Substances 0.000 description 11
- 230000006835 compression Effects 0.000 description 9
- 238000007906 compression Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000002165 photosensitisation Effects 0.000 description 5
- 239000003504 photosensitizing agent Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000011245 gel electrolyte Substances 0.000 description 4
- 239000011244 liquid electrolyte Substances 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- XMBWDFGMSWQBCA-UHFFFAOYSA-M iodide Chemical compound [I-] XMBWDFGMSWQBCA-UHFFFAOYSA-M 0.000 description 3
- 229940006461 iodide ion Drugs 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 2
- -1 iodide ions Chemical class 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WRTMQOHKMFDUKX-UHFFFAOYSA-N triiodide Chemical compound I[I-]I WRTMQOHKMFDUKX-UHFFFAOYSA-N 0.000 description 1
- 229940006158 triiodide ion Drugs 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
- F16J15/104—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing characterised by structure
- F16J15/106—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing characterised by structure homogeneous
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/064—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces the packing combining the sealing function with other functions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
- H01G9/2068—Panels or arrays of photoelectrochemical cells, e.g. photovoltaic modules based on photoelectrochemical cells
- H01G9/2077—Sealing arrangements, e.g. to prevent the leakage of the electrolyte
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
Definitions
- the present invention relates to a sealing technique for an electronic device having a structure in which an encapsulating substance such as an electrolyte is interposed between substrates.
- the present invention relates to a gasket that can be used as a sealing means for sealing gas between opposing substrates of a display.
- the dye-sensitized solar cell has an advantage that the manufacturing cost is lower than that of a silicon (Si) pn junction solar cell. Since this type of dye-sensitized solar cell has a structure in which a liquid or gel electrolyte is sealed between two electrode substrates, the sealing performance of the gasket for sealing the electrolyte and the resistance to the electrolyte are high. Improvement is important in the reliability and durability of the dye-sensitized solar cell.
- the dye-sensitized solar cell has a pair of transparent substrates 101 and 102 arranged to face each other as shown in an example of the basic structure in FIG.
- a transparent electrode 103 made of a transparent conductive film is formed on a surface facing the transparent substrate 102, and a porous electrode made of titanium oxide (TiO 2 ) particles 104a having a photosensitizing dye 104b adsorbed on the transparent electrode 103.
- TiO 2 titanium oxide
- a semiconductor layer 104 is provided, and a counter electrode 105 made of a transparent conductive film and a catalyst layer is formed on a surface of the other transparent substrate 102 facing the one transparent substrate 101, and the porous semiconductor layer 104 and the counter electrode
- a liquid or gel electrolyte 106 containing, for example, iodine and iodide is enclosed in a sealed gap defined between the liquid crystal 105 and the air gap 105.
- This type of dye-sensitized solar cell generates electricity by the following operation.
- the light such as hitting first sunlight transparent substrate 101
- the photosensitizing dye 104b absorbs light electrons e - to release, the emitted electrons e - titanium oxide particles 104a
- the electrode moves to the transparent electrode 103 and reaches the counter electrode 105 via the external load R.
- the oxidized triiodide ion I 3 ⁇ diffuses to the counter electrode 105 and is reduced by receiving an electron e ⁇ from the counter electrode 105 to become iodide ion I ⁇ .
- the reduced iodide ion I ⁇ is oxidized again by the photosensitizing dye 104b.
- an adhesive such as a UV curable adhesive has been mainly used as a sealing material for sealing the electrolyte 106 interposed between the outer peripheral portions of the transparent substrates 101 and 102 (Patent Document 1 below). reference).
- a sealing material using a UV curable adhesive may swell or deteriorate due to contact with the electrolyte 106 over a long period of time, and the sealing performance may be reduced. As a result, the electrolyte 106 may leak, If the electrolyte 106 is deteriorated by water vapor transmitted from the outside, there is a problem that not only the photoelectric conversion efficiency is lowered, but also the reliability and durability of the dye-sensitized solar cell are remarkably lowered.
- the substrates 101 and 102 are bonded to each other by a sealing material made of a UV curable adhesive, there is a problem that they cannot be disassembled and have poor maintainability.
- the gap between the transparent substrates 101 and 102 is very small, that is, the gasket 107 is very thin with a rubber thickness on the order of ⁇ m. Since 101 and 102 are made of a glass substrate, the transparent substrates 101 and 102 may be damaged by the compression reaction force of the gasket 107 unless the fastening force by the bolt 108 and the nut 108a is reduced.
- the gasket 107 is necessary for sealing in the vicinity 107a of the bolts / nuts 108, 108a shown in FIG.
- the fastening force is reduced due to slight bending of the transparent substrates 101 and 102.
- the gasket 107 and the transparent substrate 101 are reduced. , 102 may be formed, and the surface pressure required for sealing may not be ensured.
- gaskets used in electronic devices such as the above-described dye-sensitized solar cells are very thin with a thickness of the order of ⁇ m, only a flat surface (plane) is used for space saving. Since it is necessary to ensure the surface pressure, it is difficult to provide a bead like the metal gasket described in Patent Documents 3 and 4.
- the present invention has been made in view of the above points, and its technical problem is that a thin gasket used for an electronic device such as a dye-sensitized solar cell requires a small fastening force. It is to secure the pressure.
- an electronic device gasket according to the invention of claim 1 is enclosed between a pair of substrates which are arranged to face each other and are connected to each other by a plurality of fastening members.
- An electronic device having a structure in which a substance is encapsulated, wherein the gasket is interposed between the pair of substrates and seals the periphery of the encapsulated substance, and has a constant thickness and is relatively near the fastening member.
- the contact width is gradually different in the circumferential direction so that the width becomes relatively narrower as the distance from the fastening member increases.
- the gasket interposed between the pair of substrates facing each other has a smaller contact width with the substrate as the distance from the fastening member increases, so that the compression reaction force of the gasket decreases between the fastening positions of the fastening members. .
- the bending of the substrate due to the compression reaction force of the gasket between the fastening positions by the fastening member is suppressed, and as a result, the fastening member can secure the surface pressure only by a flat surface (plane). Since the reduction of the compression amount of the gasket between the fastening positions due to is suppressed and the reduction of the surface pressure at the position away from the fastening member is suppressed, the variation in the surface pressure of the gasket is reduced.
- the substrate is prevented from being damaged or deformed by the compression reaction force of the gasket between the fastening positions of the fastening members, and the surface pressure necessary for sealing is ensured even with a small fastening force. be able to.
- FIG. 1 is a separated perspective view of a substrate and a gasket schematically showing a preferred embodiment of a gasket for electronic devices according to the present invention. It is a top view of the use condition which shows schematically a desirable embodiment of a gasket for electronic devices concerning the present invention. It is explanatory drawing which shows roughly an example of the basic structure of a dye-sensitized solar cell as an electronic device. It is a top view which shows roughly an example of the conventional gasket for electronic devices.
- the electronic device shown in FIGS. 1 and 2 is, for example, a dye-sensitized solar cell.
- Reference numerals 1 and 2 are substrates whose planar projection shapes are substantially rectangular, and are arranged to face each other in the thickness direction.
- One of the substrates 1 is a transparent substrate made of glass, a transparent electrode made of a transparent conductive film formed on the inner surface thereof, and titanium oxide provided on the transparent electrode and adsorbing a photosensitizing dye.
- the other substrate 2 has a laminated structure in which a counter electrode made of a transparent conductive film and a catalyst layer is formed on the inner surface.
- the substrates 1 and 2 are fastened to each other by screw members (for example, bolts and nuts) 3 near the corners.
- the screw member 3 corresponds to the fastening member described in claim 1.
- a substance M such as a liquid or gel electrolyte containing iodine and iodide is sealed between the substrates 1 and 2, and the periphery thereof is sealed with the gasket 4 according to the present invention.
- the gasket 4 is disposed inside the fastening position by the screw member 3, and the planar shape forms a rounded rectangular shape.
- this gasket 4 has a barrier property against water vapor and is inert to the electrolyte, preferably a metal foil (for example, aluminum foil) having a thickness of about 60 ⁇ m or an LCP (liquid crystal polymer: for example, Primer Co., Ltd.).
- EPDM ethylene propylene diene rubber
- VMQ vinyl methyl
- a gasket body 42 integrally formed of a fluorine-based synthetic resin material (PTFE, Saran, etc.).
- the gasket main body 42 is in intimate contact with the inner surfaces of the substrates 1 and 2, and a liquid rubber is applied in a thin film on both surfaces of the frame-like base material 41 by a screen printing method or the like. It is formed with a constant thickness of about 50 ⁇ m. Further, the gasket body 42 has a flat contact surface with the substrates 1 and 2 and is relatively wide at the corner portion 42a passing near the inside of the fastening position by the screw member 3, and between the corner portions 42a and 42a. The width continuously changes so that the width becomes relatively narrow at the side portion 42b.
- the width is wide in the vicinity of the fastening position by the screw member 3, and the width is narrower as it is farther from the fastening position, that is, the narrowest at the intermediate position in the longitudinal direction of the side portion 42b.
- the width continuously changes so that the maximum width dimension at the corner portion 42a is, for example, 8.5 mm, and the minimum width dimension at the side portion 42b is, for example, 2 mm.
- the gasket body 42 is formed so that the outer peripheral edge 42c forms a rectangle with rounded corners, while the inner peripheral edge 42d has a shape in which each side of the rectangle with rounded corners is curved in an arc shape. Yes. Further, the inner peripheral edge of the frame-like base material 41 of the gasket 4 is also formed in the same shape as the inner peripheral edge 42 d of the gasket body 42.
- the gasket main body 42 on both surfaces of the frame-like base material 41 is in close contact with the substrates 1 and 2 to enclose liquid or gel electrolyte enclosed between the substrates 1 and 2.
- the substance M is prevented from leaking outside.
- the gasket 4 has the widest contact width with the substrates 1 and 2 in the vicinity of the fastening position by the screw member 3 (corner portion 42a) and the narrowest at the intermediate position in the longitudinal direction of the side portion 42b.
- the compression reaction force of the gasket 4 (gasket main body 42) caused by being clamped between the fastening substrates 1 and 2 by the fastening force of the member 3 is also smallest at the intermediate position in the longitudinal direction of the side portion 42b.
- the compression reaction force of the gasket 4 (gasket body 42) is suppressed between the fastening positions by the screw member 3, thereby preventing the substrates 1 and 2 from being damaged, and even with a small fastening force,
- the surface pressure required for sealing can be secured, and as a result, the number of screw members 3 can be reduced.
- the surface pressure on the substrates 1 and 2 is almost uniform over the entire circumference. can do.
- the electronic device is a dye-sensitized solar cell.
- the gasket 4 of the present invention the electronic device is enclosed between opposing substrates of, for example, an organic EL (electroluminescence) display. It can also be applied as a gas sealing means.
- the inner peripheral edge has a curved shape, but the contact width gradually increases in the circumferential direction even if the outer peripheral edge has a curved shape, or both the inner peripheral edge and the outer peripheral edge have a curved shape. Different shapes can be realized.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Hybrid Cells (AREA)
- Photovoltaic Devices (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
L'objectif de la présente invention est de maintenir la pression de surface nécessaire avec une petite force de fixation pour un joint mince utilisé pour un dispositif électronique, par exemple une cellule solaire sensibilisée aux colorants. Pour réaliser cet objectif, l'invention concerne un joint (4) qui est placé entre une paire de substrats (1, 2) pour sceller autour d'une substance étanche (M) dans un dispositif électronique ayant une structure dans laquelle la substance étanche (M) est scellée entre la paire de substrats (1, 2) agencés l'un en face de l'autre et couplés mutuellement avec une pluralité d'organes de fixation (3), le joint ayant une épaisseur constante et étant réalisé dans une forme telle que la largeur de contact par rapport aux substrats (1, 2) change graduellement dans la direction circonférentielle pour avoir une largeur relativement importante près des organes de fixation (3) et une largeur relativement moindre loin des organes de fixation (3).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015517078A JP6339999B2 (ja) | 2013-05-17 | 2014-05-13 | 電子デバイス用ガスケット |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-105009 | 2013-05-17 | ||
JP2013105009 | 2013-05-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014185390A1 true WO2014185390A1 (fr) | 2014-11-20 |
Family
ID=51898368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/062652 WO2014185390A1 (fr) | 2013-05-17 | 2014-05-13 | Joint pour dispositif électronique |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6339999B2 (fr) |
WO (1) | WO2014185390A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017032035A (ja) * | 2015-07-30 | 2017-02-09 | Kyb株式会社 | シール構造およびシール方法 |
JP2020047804A (ja) * | 2018-09-20 | 2020-03-26 | 積水化学工業株式会社 | 電気モジュール及び電気モジュールの製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006185646A (ja) * | 2004-12-27 | 2006-07-13 | Three Bond Co Ltd | 色素増感型太陽電池 |
JP2007220606A (ja) * | 2006-02-20 | 2007-08-30 | Dainippon Printing Co Ltd | 色素増感型太陽電池モジュール |
JP2008226553A (ja) * | 2007-03-09 | 2008-09-25 | Electric Power Dev Co Ltd | 色素増感型太陽電池の封止部および色素増感型太陽電池 |
WO2010050207A1 (fr) * | 2008-10-30 | 2010-05-06 | 株式会社フジクラ | Dispositif de conversion photoélectrique |
WO2011024812A1 (fr) * | 2009-08-26 | 2011-03-03 | Nok株式会社 | Joint métallique et procédé de fabrication d'un moule pour joint métallique |
JP2012089403A (ja) * | 2010-10-21 | 2012-05-10 | Sony Corp | 太陽電池及び太陽電池の製造方法 |
JP2012113946A (ja) * | 2010-11-24 | 2012-06-14 | Sony Corp | 封止構造体およびその製造方法 |
-
2014
- 2014-05-13 JP JP2015517078A patent/JP6339999B2/ja active Active
- 2014-05-13 WO PCT/JP2014/062652 patent/WO2014185390A1/fr active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006185646A (ja) * | 2004-12-27 | 2006-07-13 | Three Bond Co Ltd | 色素増感型太陽電池 |
JP2007220606A (ja) * | 2006-02-20 | 2007-08-30 | Dainippon Printing Co Ltd | 色素増感型太陽電池モジュール |
JP2008226553A (ja) * | 2007-03-09 | 2008-09-25 | Electric Power Dev Co Ltd | 色素増感型太陽電池の封止部および色素増感型太陽電池 |
WO2010050207A1 (fr) * | 2008-10-30 | 2010-05-06 | 株式会社フジクラ | Dispositif de conversion photoélectrique |
WO2011024812A1 (fr) * | 2009-08-26 | 2011-03-03 | Nok株式会社 | Joint métallique et procédé de fabrication d'un moule pour joint métallique |
JP2012089403A (ja) * | 2010-10-21 | 2012-05-10 | Sony Corp | 太陽電池及び太陽電池の製造方法 |
JP2012113946A (ja) * | 2010-11-24 | 2012-06-14 | Sony Corp | 封止構造体およびその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017032035A (ja) * | 2015-07-30 | 2017-02-09 | Kyb株式会社 | シール構造およびシール方法 |
JP2020047804A (ja) * | 2018-09-20 | 2020-03-26 | 積水化学工業株式会社 | 電気モジュール及び電気モジュールの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6339999B2 (ja) | 2018-06-06 |
JPWO2014185390A1 (ja) | 2017-02-23 |
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