WO2014181855A1 - Procédé de fabrication d'un film de verre et procédé de fabrication d'un dispositif électronique - Google Patents

Procédé de fabrication d'un film de verre et procédé de fabrication d'un dispositif électronique Download PDF

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Publication number
WO2014181855A1
WO2014181855A1 PCT/JP2014/062435 JP2014062435W WO2014181855A1 WO 2014181855 A1 WO2014181855 A1 WO 2014181855A1 JP 2014062435 W JP2014062435 W JP 2014062435W WO 2014181855 A1 WO2014181855 A1 WO 2014181855A1
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WIPO (PCT)
Prior art keywords
glass
glass film
film
supporting
electronic device
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PCT/JP2014/062435
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English (en)
Japanese (ja)
Inventor
康夫 山崎
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日本電気硝子株式会社
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Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Priority to JP2014523140A priority Critical patent/JP6350277B2/ja
Publication of WO2014181855A1 publication Critical patent/WO2014181855A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays

Definitions

  • the present invention relates to a glass film and a method for producing an electronic device, and more specifically, a technique for separating a glass film laminate used for producing an electronic device or the like into a glass film and a supporting glass after treatment with heating. About.
  • the organic EL display has the property that it can be folded and rolled up, making it easy to carry, and can be used not only on flat surfaces but also on curved surfaces. Expected to be used for various purposes.
  • a light emitter used in an organic EL display is deteriorated by contact with a gas such as oxygen or water vapor. Therefore, since a high gas barrier property is required for a substrate used for an organic EL display, it is expected to use a glass substrate.
  • a glass substrate is low in flexibility and is easily damaged when a tensile stress acts on the surface of the glass substrate by bending the glass substrate. It was difficult to adopt a glass substrate.
  • Patent Document 1 proposes a glass film having a thickness of 200 ⁇ m or less, and such an extremely thin glass film has such flexibility that it can be used for an organic EL display, for example.
  • a glass substrate used for an electronic device such as a flat panel display or a solar cell is subjected to various processing related to electronic device manufacturing such as processing and cleaning.
  • the glass substrate used in these electronic devices is thinned, the glass is a brittle material, which leads to breakage due to a slight change in stress, which makes handling extremely difficult when performing various electronic device manufacturing related processes described above.
  • a glass film having a thickness of 200 ⁇ m or less is rich in flexibility, it is difficult to perform positioning when performing processing, and there is a problem that displacement or the like occurs during patterning.
  • Patent Document 2 proposes a glass film laminate in which a glass film is laminated on a supporting glass. According to this, even if a glass film having no strength or rigidity is used alone, the supporting glass has high rigidity, so that the entire glass film laminate can be easily positioned during processing. Moreover, after completion
  • the supporting glass protrudes from the glass film and is laminated, and the end piece of the supporting glass is provided with a thin portion, and at least a part of the end piece of the glass film is provided.
  • the glass film laminated body which is spaced apart from support glass on the thin part is proposed.
  • JP 2010-132531 A International Publication No. 2011/048979 JP 2012-131664 A
  • the glass film is peeled from the supporting glass by inserting a jig such as a resin sheet or a razor from a thin portion.
  • a jig such as a resin sheet or a razor from a thin portion.
  • the jig and the supporting glass or the jig and the glass film are rubbed, and the supporting glass or the glass film may be damaged. If the glass film is scratched, the quality of the manufactured electronic device may be deteriorated and may be damaged in some cases.
  • wound arises in support glass there exists a possibility that recycling of support glass may become difficult. Therefore, it is desired to peel off the supporting glass and the glass film from the glass film laminate by a simple and inexpensive method after the processing related to the electronic device manufacturing involving heating without deteriorating the quality.
  • the present invention was made to solve the problems of the prior art as described above, and even after processing related to electronic device manufacturing involving heating, without deteriorating the glass film or supporting glass, It is an object of the present invention to provide a method for producing a glass film and a method for producing an electronic device that can easily and inexpensively peel a glass film from a supporting glass.
  • the invention according to claim 1 includes a first step of producing a glass film laminate by laminating a glass film substrate and a supporting glass, which are glass films before production-related processing, and the glass in the glass film laminate.
  • the invention according to claim 2 is characterized in that, in the third step, one of the glass film and the supporting glass is held in a flat shape, while the other is given a tension in a direction away from the other, It is related with the manufacturing method of the glass film characterized by peeling off the other from.
  • the invention according to claim 3 is characterized in that, in the third step, the glass is held in a flat shape, and tension is applied to the support glass in a direction away from the glass film.
  • the present invention relates to a film manufacturing method.
  • the invention according to claim 4 relates to a method for producing a glass film, wherein the fluid contains water.
  • the invention according to claim 5 relates to a method for producing a glass film, wherein the fluid is a liquid.
  • the invention according to claim 6 relates to a method for producing a glass film, wherein the glass film substrate and the supporting glass each have a surface roughness Ra of 2.0 nm or less on the surfaces in contact with each other. .
  • the invention according to claim 7 includes a first step of laminating a glass film substrate and a supporting glass, which are glass films before processing related to electronic device manufacturing, to produce a glass film laminate, and the glass film laminate.
  • An element is formed on the glass film substrate of the glass film laminate by performing an electronic device manufacturing-related process involving heating to the glass film substrate, and the element is sealed with a sealing substrate to support glass.
  • the sealing substrate is a cover glass, and the cover glass is laminated on a carrier glass.
  • an interface between the cover glass and the carrier glass is used.
  • the present invention relates to a method for manufacturing an electronic device, wherein the other is peeled off from one of the cover glass and the carrier glass while applying a fluid having pressure.
  • the glass film and the supporting glass that have been subjected to the treatment with heating can be easily and inexpensively peeled without being damaged.
  • the fluid can be reliably sprayed on the interface between the glass film and the supporting glass.
  • the glass film and support glass which were processed with heating can be more reliably peeled without being damaged.
  • water can be provided to the interface of a glass film and support glass. Thereby, a hydrolysis reaction can be caused at the interface between the glass film and the supporting glass, and the peeling of the glass film and the supporting glass can be facilitated.
  • the stress applied to the interface between the glass film and the supporting glass can be increased. Thereby, peeling of a glass film and support glass can be performed more efficiently.
  • the glass film and the supporting glass are directly fixed without using an adhesive or the like, the glass film and the supporting glass subjected to the treatment with heating are damaged. It can peel without.
  • the glass film and the supporting glass that have been subjected to the treatment with heating can be easily and inexpensively peeled without being damaged.
  • the schematic diagram which shows the manufacturing method of the electronic device which concerns on one Embodiment of this invention The schematic diagram for demonstrating the manufacturing method of a glass film and support glass.
  • the perspective schematic diagram which shows the arrangement condition of the nozzle with respect to the glass film laminated body in the manufacturing method of the electronic device which concerns on one Embodiment of this invention, (a) When arrange
  • the schematic diagram which shows the peeling condition (when the cover glass of an electronic device is laminated
  • the method for manufacturing an electronic device includes a first step of laminating a glass film 11 and a supporting glass 12 to produce a glass film laminate 1, and heating to the glass film 11.
  • the device 51 is formed on the glass film 11 of the glass film laminate 1 by performing an electronic device manufacturing-related process involving the process, and the device 51 is sealed with the cover glass 2 to produce the electronic device 3 with supporting glass.
  • the surface roughness Ra of the side which the glass film 11 and the support glass 12 contact mutually is 2.0 nm or less, respectively.
  • the glass film 11 is made of silicate glass or silica glass, preferably borosilicate glass, most preferably non-alkali glass. If the glass film 11 contains an alkali component, cations are dropped on the surface, so-called soda blowing phenomenon occurs, and the structure becomes rough. In this case, if the glass film 11 is curved and used, there is a possibility that it will be damaged from a portion that has become rough due to deterioration over time.
  • the alkali-free glass referred to here is a glass that does not substantially contain an alkali component (alkali metal oxide), and specifically, a glass having an alkali component of 3000 ppm or less. .
  • the content of the alkali component of the alkali-free glass used in the present invention is preferably 1000 ppm or less, more preferably 500 ppm or less, and even more preferably 300 ppm or less.
  • the thickness of the glass film 11 is preferably 300 ⁇ m or less, more preferably 5 to 200 ⁇ m, and most preferably 5 to 100 ⁇ m. Thereby, the thickness of the glass film 11 can be made thinner and appropriate flexibility can be provided. Although the glass film 11 having a thinner thickness is difficult to handle and is prone to problems such as misalignment and bending during patterning, processing related to electronic device manufacturing can be performed by using the support glass 12 described later. It can be done easily. If the thickness of the glass film 11 is less than 5 ⁇ m, the strength of the glass film 11 tends to be insufficient, and the glass film 11 may be difficult to peel from the support glass 12.
  • silicate glass, silica glass, borosilicate glass, non-alkali glass, or the like is used similarly to the glass film 11.
  • the thickness of the support glass 12 is preferably 400 ⁇ m or more. When the thickness of the supporting glass 12 is less than 400 ⁇ m, there is a possibility that a problem may occur in terms of strength when the supporting glass 12 is handled alone.
  • the thickness of the support glass 12 is preferably 400 to 700 ⁇ m, and most preferably 500 to 700 ⁇ m. This makes it possible to reliably support the glass film 11 with the support glass 12 and to effectively suppress breakage of the glass film 11 that may occur when the glass film 11 is peeled from the support glass 12. It becomes. When the glass film laminate 1 is placed on a setter (not shown) during the electronic device manufacturing related process, the thickness of the support glass 12 may be less than 400 ⁇ m (for example, 300 ⁇ m or the like, the same thickness as the glass film 11). .
  • the glass film 11 and the support glass 12 used in the present invention are preferably formed by a down draw method, and more preferably formed by an overflow down draw method.
  • the overflow downdraw method shown in FIG. 2 is a molding method in which both surfaces of the glass plate do not come into contact with the molded member at the time of molding, and the both surfaces (translucent surface) of the obtained glass plate are hardly scratched and polished. Even if not, high surface quality can be obtained.
  • the glass film 11 and the supporting glass 12 used in the present invention may be formed by a float method, a slot down draw method, a roll out method, an up draw method, a redraw method, or the like. In the overflow down draw method shown in FIG.
  • the glass ribbon G immediately after flowing down from the lower end portion 81 of the wedge-shaped molded body 8 is drawn downward while the shrinkage in the width direction is restricted by the cooling roller 82 to be predetermined.
  • the thickness becomes thin.
  • the glass ribbon G that has reached the predetermined thickness is gradually cooled in a slow cooling furnace (annealer) (not shown), the thermal distortion of the glass ribbon G is removed, and the glass ribbon G is cut into a predetermined size, whereby the glass film 11 and Each of the support glasses 12 is formed.
  • the 1st process based on this invention is laminated
  • the surface roughness Ra of the contact surface 11a of the glass film 11 with the support glass 12 and the contact surface 12a of the support glass 12 with the glass film 11 exceeds 2.0 nm, the adhesion between the contact surface 11a and the contact surface 12a is increased.
  • the glass film 11 and the supporting glass 12 may be difficult to be firmly laminated without an adhesive.
  • the surface roughness Ra of each of the contact surfaces 11a and 12a of the glass film 11 and the supporting glass 12 used in the present invention is 1 respectively. It is preferably 0.0 nm or less, more preferably 0.5 nm or less, and most preferably 0.2 nm or less.
  • the surface roughness of the effective surface 11b of the glass film 11 shown in FIG. 1 and FIG. 3 is not particularly limited, but in the second step to be described later, the processing related to electronic device manufacturing such as film formation is performed.
  • the roughness Ra is preferably 2.0 nm or less, more preferably 1.0 nm or less, further preferably 0.5 nm or less, and most preferably 0.2 nm or less.
  • the surface roughness of the conveyance surface 12b of the support glass 12 is not particularly limited.
  • the glass film 11 having substantially the same area is laminated on the support glass 12, but in order to further facilitate the peeling of the glass film 11 from the support glass 12, the glass film 11 is supported by the support glass 12. It may be laminated so as to protrude from.
  • the protruding amount of the glass film 11 from the supporting glass 12 is preferably 1 to 20 mm, more preferably 1 to 10 mm, and most preferably 1 to 5 mm. Even if the protruding amount of the glass film 11 is about 1 mm, the end portion of the glass film 11 can be used as the starting point of the peeling, while the protruding amount of the glass film 11 exceeds 20 mm. May cause damage or drooping.
  • the portion of the glass film 11 protruding from the support glass 12 may be all four sides of the glass film laminate 1, or may be only two sides or only one side facing each other.
  • the support glass 12 may be laminated so as to protrude from the glass film 11.
  • the pressure of the sprayed fluid can act efficiently as a starting point of peeling. Further, as shown in FIG. 1, it is more efficient to spray the fluid from the laminated surface of the support glass 12 and the glass film 11 while inclining it.
  • the amount of protrusion of the support glass 12 from the glass film 11 is preferably 0.5 to 10 mm, and more preferably 0.5 to 1 mm.
  • the area of the effective surface 11b of the glass film 11 can be secured more widely.
  • the support glass 12 protrudes from the glass film 11 in all four sides, and also the glass film 11 protrudes from the support glass 12 only in one side. In the remaining three sides, it is more preferable that the supporting glass 12 protrudes from the glass film 11.
  • the step of laminating the glass film 11 on the supporting glass 12 may be performed under reduced pressure. Thereby, the bubble produced when the glass film 11 and the support glass 12 are laminated
  • the 2nd process in the manufacturing method of the electronic device which concerns on this invention is the glass of the glass film laminated body 1 produced at the 1st process as shown in FIG. 4 by performing the electronic device manufacture related process accompanied by a heating.
  • the element 51 is formed on the effective surface 11b of the film 11 and the element 51 formed on the effective surface 11b of the glass film 11 is sealed with a sealing substrate to produce the electronic device 3 with supporting glass.
  • Examples of the electronic device manufacturing related process involving heating in the second step include a film forming process by a CVD method, sputtering, or the like.
  • liquid crystal elements As elements formed on the effective surface 11b of the glass film 11, liquid crystal elements, organic EL elements, touch panel elements, solar cell elements, piezoelectric elements, light receiving elements, battery elements such as lithium ion secondary batteries, MEMS elements, and semiconductors An element etc. are mentioned.
  • the cover glass 2 made of silicate glass, silica glass, borosilicate glass, non-alkali glass or the like is used as in the case of the glass film 11 described above.
  • the cover glass 2 it is preferable to use a glass having a difference in thermal expansion coefficient at 30 to 380 ° C. with respect to the glass film 11 within 5 ⁇ 10 ⁇ 7 / ° C. Thereby, even if the temperature of the surrounding environment of the produced electronic device 5 changes, it is hard to produce the thermal warp by the difference of an expansion coefficient, the crack of the glass film 11 and the cover glass 2, etc., and it is set as the electronic device 5 which is hard to be damaged. It becomes possible. And it is the most preferable to use the glass which has the same composition as the cover glass 2 and the glass film 11 from a viewpoint of suppressing the difference in an expansion coefficient.
  • the thickness of the cover glass 2 is preferably 300 ⁇ m or less, more preferably 5 to 200 ⁇ m, and most preferably 5 to 100 ⁇ m. Thereby, thickness of a cover glass can be made thinner and appropriate flexibility can be provided. When the thickness of the cover glass 2 is less than 5 ⁇ m, the strength of the cover glass 2 tends to be insufficient.
  • an organic EL panel is shown in FIG.
  • the anode layer 52a, the hole transport layer 52b, the light emitting layer 52c, the electron transport layer 52d, and the cathode layer 52e are stacked in this order on the effective surface 11b of the glass film 11 by a known film formation method such as CVD or sputtering.
  • the organic EL element 52 which is an example of 51 is formed.
  • the organic EL element 52 is sealed by bonding the cover glass 2 and the glass film 11 using a known laser sealing or the like, and the electronic device 3 with supporting glass (here, organic EL with supporting glass). Panel).
  • the cover glass 2 and the glass film 11 are directly bonded. However, even if the cover glass 2 and the glass film 11 are bonded appropriately using a known glass frit, a spacer, or the like. good.
  • the electronic device 5 is supported on the supporting glass 12 while spraying the liquid 4 as the fluid on the interface 13 between the glass film 11 and the supporting glass 12 of the supporting glass-equipped electronic device 3. It is the process of peeling from.
  • the fluid sprayed on the interface 13 is the liquid 4, but the shape of the fluid sprayed on the interface 13 may be any shape such as granular, mist, or steam.
  • gases such as air, nitrogen gas, carbon dioxide gas, and rare gas can be used.
  • a gas can be preferably used when a device formed on a glass film, various wirings, a sealing agent or the like is easily damaged by a liquid.
  • the gas has an advantage that the sprayed pressure is more easily dispersed than the liquid, and is less likely to be damaged. It also has an effect of preventing the occurrence of a cavitation effect that occurs when a liquid is sprayed at a high pressure.
  • the peeling effect is higher than that of the gas, and the case where the adhesive force between the glass film 11 and the support glass 12 is high is more preferable. In the case of liquid, there is an effect that static electricity is hardly generated. It is also possible to use a gas-liquid mixture of the liquid 4 and the gas.
  • the water jet here is a method in which water is generally jetted onto an object in a high-speed, high-pressure water stream. It is also possible to eject steam having pressure onto the object using a steam ejector that discharges water in the form of steam.
  • a nozzle can be connected to a pipe maintaining water at a high temperature and high pressure, and steam can be injected from the nozzle.
  • an air blade having a plurality of holes for injecting air.
  • an air pipe connected to an air source such as a compressor can be employed. Air preferably has a relative humidity of 10% or more and an injection pressure of 0.1 MPa or more.
  • the liquid 4 containing water is sprayed from the nozzle 41 to the interface 13 between the glass film 11 and the support glass 12 to separate the glass film 11 and the support glass 12.
  • the electronic device manufacturing process includes a device manufacturing-related process including heating such as a film forming process, it is manufactured with a heating process of at least 100 ° C. or higher. For example, in a TFT manufacturing process of a liquid crystal display or an organic EL display, an amorphous silicon TFT is heated to 300 ° C.
  • a low temperature polysilicon TFT is heated to at least 400 ° C. or higher.
  • a TFT composed of indium, gallium, zinc, and oxygen it is heated to at least 300 ° C. or higher.
  • the touch sensor substrate is heated to at least 150 ° C. in the manufacturing process.
  • the fixing force between the glass film 11 and the supporting glass 12 becomes stronger as the heating temperature becomes higher and the heating holding time becomes longer, and the glass film is peeled off from the supporting glass 12 in the step of peeling the glass film 11. It has been found by the inventors' research that 11 is broken and the success probability of peeling of the glass film 11 is reduced.
  • the present inventors conducted research to establish a method for peeling without destroying the glass film 11 and the supporting glass 12 after undergoing production-related treatment with heating, and as a result of earnest efforts, When peeling is performed in a state in which a liquid containing at least water is applied to the interface 13 between the glass film 11 and the support glass 12 on the glass film laminate 1 that has undergone the electronic device manufacturing related process accompanied by heating, the glass film 11 and the support are supported.
  • the present inventors have found that the glass 12 can be easily peeled off and have reached the present invention.
  • the method of spraying the liquid 4 containing water on the interface 13 shown in the present embodiment by the water jet technique combines the effect of the hydrolysis reaction by the water and the pressurizing effect by the momentum of the liquid 4 to efficiently peel off. Therefore, the glass film 11 and the supporting glass 12 after being subjected to the electronic device manufacturing related process accompanied by heating are optimal as a method for peeling without breaking.
  • the dehydration reaction and hydrolysis reaction of the Si—OH group at the interface 13 between the glass film 11 and the support glass 12 described above are not limited to Si, but include Al, In, Sn, Zn, Ti, Zr, Ga, and the like. It is considered that the OH group existing on the surface of the thin film is similarly generated. In addition, similar condensation and decomposition reactions occur even if the surface of not only the OH group but also the metal or metal nitride is hydrogen-terminated. For example, in the case of silicon nitride, a reaction of Si—NH + HO—Si ⁇ Si—N—Si + H 2 O occurs.
  • a metal such as Si, Al, Mg, Y, La, Pr, Sc, W, Hf, In, Sn, Nd, Ta, Ce, Nb, Ti, Ni, Zn, or an oxide thereof. Even if a nitride is formed, the same effect can be expected.
  • the glass film 11 and the support glass 12 can be easily peeled off even if an electronic device manufacturing related process involving heating is performed.
  • the glass film 11 and the support glass 12 can be more easily peeled off more efficiently.
  • the fixation of the glass film and the supporting glass by the electronic device manufacturing related process involving heating is a problem, but the fixation due to causes other than heating may be a problem. That is, in the production of liquid crystal displays and organic EL elements, a photoresist or a color filter is formed on the glass film, but these organic materials remain unintentionally at the end of the glass film laminate, There is a case where it enters into the laminated surface and sticks. And even if the method of spraying the liquid 4 by the method of a water jet is fixation by such a cause, a fixed component can be removed by spraying the liquid 4, and a glass film can be peeled.
  • the surface roughness of the surfaces of the glass film 11 and the supporting glass 12 that are in contact with each other that is, the contact surfaces 11a and 12a
  • each Ra is 2.0 nm or less.
  • the glass film 11 of the electronic device 3 with supporting glass is fixed by the vacuum suction pads 32 a, 32 a... Of the substrate holding mechanism 32 using the first substrate holding mechanism 31 and the second substrate holding mechanism 32.
  • the process of spraying the liquid 4 onto the interface 13 while peeling the support glass 12 with the vacuum suction pads 31a, 31a... Of the substrate holding mechanism 31 is shown. If the support glass 12 is not pulled in this way, there arises a problem that the support glass 12 and the glass film 11 that have been peeled once are re-bonded.
  • the jet of the liquid 4 can be sent to the deep part. Moreover, peeling by the method of a water jet can further be accelerated
  • the pressure of the liquid 4 is the static pressure of the liquid 4 in the nozzle 41.
  • the diameter of the nozzle 41 for ejecting the liquid 4 is preferably at least 1.0 mm, for example 0.05 to 0 A nozzle 41 with a diameter of 3 mm can be used.
  • FIG. 6 shows an example in which the liquid 4 is applied to one side of the rectangular glass film laminate 1 by a water jet technique using one nozzle 41.
  • FIG. 6 shows an example in which the liquid 4 is applied to one side of the rectangular glass film laminate 1 by a water jet technique using one nozzle 41.
  • the plurality of nozzles 41, 41,... are arranged, and the liquid 4 is sprayed simultaneously on the plurality of sides, whereby peeling can be performed more efficiently.
  • a wide slit-type nozzle 42 as shown in FIG. 7B can be used. Further, as shown in FIG. 7C, it is possible to attach the nozzle 41 to the rotary shaft 43 so that the nozzle 41 can swing on a plane.
  • the nozzle 41 is made with respect to the side of the glass film laminate 1.
  • the peeling can be performed without scanning, and the time required for peeling can be shortened and the equipment can be simplified.
  • the nozzle 41 is configured to eject the liquid 4 toward the interface 13 at an angle parallel to the contact surface 11 a of the planar glass film 11, but the angle of the nozzle 41 with respect to the interface 13 Can be changed every moment according to the progress of peeling. For example, at the start of jetting of the liquid 4, the contact of the glass film 11 is performed so that the angle of the nozzle 41 is inclined with respect to the contact surface 11 a until peeling starts and the liquid 4 reaches a deeper portion of the interface 13. You may make it change the angle of the nozzle 41 so that it may approximate to the angle parallel to the surface 11a.
  • nozzles having different diameters until the start of peeling and after the start of peeling For example, a thin nozzle diameter may be used before the start of peeling, and a thicker diameter may be used after the start of peeling in order to promote peeling.
  • the pressure of the liquid 4 can be changed every moment as the peeling progresses. For example, at the start of jetting of the liquid 4, the pressure can be increased until the peeling starts to promote the start of the peeling. For example, when an organic component such as a photoresist or a color filter adheres to the end portion of the laminated body of glass films, peeling is likely to start by increasing the pressure. Next, the pressure can be lowered after the start of peeling so as not to damage the substrate or the device, and the pressure can be raised again as the peeling proceeds deeper.
  • the first substrate holding mechanism 31 preferably has a plurality of vacuum suction pads 31a arranged, and the vacuum force pads 31a, 31a... Can adjust the pulling force and the distance between the separated substrates.
  • a configuration is preferable.
  • the distance between the peeled support glass 12 and the glass film 11 is preferably at least a gap larger than the diameter of the nozzle 41. However, if the gap is too large, the tensile stress applied to the glass is increased and the glass tends to break.
  • the vacuum suction pad 31a can be connected to an air cylinder, for example, to adjust the tensile tension.
  • a pressure reducing mechanism such as a vacuum pump, a mechanism having an ejector function for reducing pressure by feeding compressed air, and the like can be adopted.
  • the vacuum suction pad 31a can be circular, but an oval or substantially rectangular pad is used to prevent the glass film 11 or the support glass 12 from being undesirably lifted and damaged by the fluid sprayed. It is also possible to fix the substrate end so that it does not float up.
  • a plurality of vacuum suction pads 32a arranged, a plate having a vacuum suction function, or an adhesive resin sheet may be used.
  • a plate-like vacuum suction mechanism because the substrate is easily bent.
  • a vacuum suction pad when it is difficult to fix a flat plate with a plate by forming a device on a glass film.
  • a protective film is applied to the site where damage is to be avoided. It may be pasted.
  • Each of the first and second substrate holding mechanisms 31 and 32 is used for fixing the glass film 11 and the supporting glass 12 in a flat shape, and used for pulling the glass film 11 and the supporting glass 12. Since there is a case where both uses are switched, there may be a common configuration without making a difference between the configurations of the substrate holding mechanisms 31 and 32.
  • the glass film 11 is peeled from the support glass 12 by holding the glass film laminate 1 in a vertical posture and spraying the liquid 4 from above. Thereby, the liquid 4 can be provided to a deeper portion of the interface 13 between the support glass 12 and the glass film 11.
  • the glass film 11 may be peeled from the support glass 12 while keeping the glass film laminate 1 in a horizontal posture.
  • the desired electronic device 5 can finally be manufactured by peeling the support glass 12 from the electronic device 3 with a support glass by a 3rd process.
  • the element 51 (specifically organic EL element 52) is formed on the glass film 11, and the case where the glass film 11 which comprises the electronic device 5, and the support glass 12 are peeled is illustrated.
  • the glass film 11 and the supporting glass 12 can be peeled by the method according to the present invention even when the element 51 is not formed on the glass film 11.
  • the glass film laminate 1 is produced by directly laminating the glass film 11 and the supporting glass 12 before the treatment with heating, the glass film laminate 1 is subjected to the treatment with heating. Even if it did, according to the method concerning this invention, the glass film 11 and the support glass 12 after heat processing can be peeled, and the glass film 11 by which heat processing was performed easily can be manufactured.
  • the manufacturing method of the glass film which concerns on one Embodiment of this invention is the 1st process of laminating
  • the liquid 4 having a pressure is applied to the interface 13 between the glass film 11 and the support glass 12 in the glass film laminate 1 in the third step.
  • the other is peeled off from either one of the glass film 11 and the supporting glass 12.
  • the glass film 11 and the support glass 12 which were processed with the heating can be peeled simply and cheaply without being damaged. .
  • an element on the glass film 11 of the glass film laminate 1 is obtained by performing an electronic device manufacturing related process that involves heating the glass film 11 in the glass film laminate 1.
  • 51 (specifically, organic EL element 52) is formed, and element 51 is sealed with cover glass 2 to produce electronic device 3 with supporting glass.
  • supporting from electronic device 3 with supporting glass is performed.
  • the manufacturing method of the glass film mentioned above is very suitable for applying as a manufacturing method of an electronic device.
  • the liquid 4 which is a fluid contains water. And by such a structure, water can be provided to the interface 13 between the glass film 11 and the support glass 12, thereby causing a hydrolysis reaction at the interface 13 between the glass film 11 and the support glass 12, The glass film 11 and the supporting glass 12 can be more easily separated.
  • the fluid is the liquid 4.
  • FIG. 8 shows another embodiment according to the present invention.
  • the embodiment shown in FIG. 8 is different from the above-described embodiment in that the cover glass 2 is laminated on the carrier glass 21.
  • the carrier glass 21 is a glass plate laminated on the cover glass 2 in order to ensure the handleability of the cover glass 2 and the like, similarly to the relationship of the support glass 12 with respect to the glass film 11.
  • FIG. 1 For example, in the case of manufacturing a liquid crystal panel as the electronic device 5, a TFT glass treatment is performed on the glass film 11 side, a color filter is formed on the cover glass 2 side, and then a cover glass laminated on the carrier glass 21 through a spacer. 2 can seal the element 51 (liquid crystal element).
  • the electronic device 3 with supporting glass is configured to also include the carrier glass 21.
  • the support glass 12 is pulled by the first substrate holding mechanism 31 and the carrier glass 21 is fixed by the second substrate holding mechanism 32 to keep the glass film 11 flat.
  • the support glass 12 is peeled off by spraying the water 4 as the liquid 4 onto the interface 13.
  • the glass film 11 is fixed in a flat shape by fixing the cover glass 2. May be.
  • the glass film 11 may be fixed directly or both the glass film 11 and the cover glass 2 may be fixed.
  • the glass film 11 is fixed in a flat shape by the substrate holding mechanism 31, and the carrier glass 21 is pulled by the substrate holding mechanism 32, and liquid is applied to the interface 22 between the carrier glass 21 and the cover glass 2.
  • the carrier glass 21 is peeled off by spraying 4 water.
  • the carrier glass 21 is preferably made of the same material as the glass film 11, the cover glass 2 and the support glass 12 described above, and a glass having the same thickness as the support glass 12.
  • the carrier glass 21 and the cover glass 2 are preferably made of the same glass material.
  • the cover glass 2 and the carrier glass 21 are also peeled in the same step as the glass film 11 and the supporting glass 12 are peeled off. Even when the cover glass 2 and the carrier glass 21 are peeled, the carrier glass 21 is peeled while being pulled.
  • the desired electronic device 5 can finally be manufactured by peeling the support glass 12 and the carrier glass 21 from the electronic device 3 with a support glass by a 3rd process.
  • the supporting glass 12 and the carrier glass 21 peeled off in the third step can be reused by being laminated on the glass film 11 and the cover glass 2 again in the first step.
  • the method for manufacturing an electronic device according to the present invention can perform the first step, the second step, and the third step in succession, as schematically shown in FIG.
  • the manufacturing method of the electronic device which concerns on this invention is not limited to the structure performed continuously from a 1st process to a 3rd process,
  • the glass film laminated body 1 manufactured after the 1st process is used.
  • a configuration may be employed in which the second process and the third process are performed by packing and shipping and separately in an electronic device manufacturing related processing facility.
  • the support glass 12 and the carrier glass 21 are peeled off by packing and shipping the electronic device 3 with the support glass manufactured after the second step, and performing the third step in a separate facility. 5 may be manufactured.
  • the sealing substrate is the cover glass 2, and the cover glass 2 is laminated on the carrier glass 21. 2 and the carrier glass 21, while applying the liquid 4 which is a fluid having a pressure, the other is peeled off from one of the cover glass 2 and the carrier glass 21.
  • the cover glass 2 which protects the electronic device 5 is laminated
  • a glass film laminate was formed by laminating a glass film (Nippon Electric Glass Co., Ltd. glass cord OA-10G) having a thickness of 100 ⁇ m, a width of 678 mm, and a length of 878 mm on a supporting glass having a thickness of 500 ⁇ m, a width of 680 mm, and a length of 880 mm.
  • a tin-added indium oxide (ITO) film having a thickness of 150 nm was formed as a transparent conductive film on the glass film in the glass film laminate by sputtering.
  • substrate (glass film laminated body) at the time of film-forming was 300 degreeC.
  • the positive hole injection layer, the light emitting layer, the electron carrying layer, the electron injection layer, and the cathode electrode were formed into a film in order with the vacuum evaporation system, and the organic EL element was produced. Thereafter, it was sealed with a cover glass (glass cord OA-10G manufactured by Nippon Electric Glass Co., Ltd.) having a thickness of 100 ⁇ m, a width of 678 mm, and a length of 878 mm to produce an organic EL device.
  • This cover glass is laminated on a carrier glass having a thickness of 0.5 mm, a width of 680 mm, and a length of 880 mm.
  • a glass film (glass code OA-10G) manufactured by Nippon Electric Glass Co., Ltd. was also used for the support glass and the carrier glass.
  • a vacuum suction plate was used as the second substrate holding mechanism, and a vacuum suction pad was used as the first substrate holding mechanism.
  • the vacuum suction plate was a surface plate in which grooves having a width of 1 mm and a depth of 1 mm were dug into an aluminum surface plate in a lattice shape, and was adsorbed at a pressure of 0.08 MPa using a vacuum pump. 80 vacuum suction pads having a diameter of 40 mm were used, and each pad was pulled with a force of 0.5 N. Further, the distance between the peeled supporting glass and the glass film and the distance between the carrier glass and the cover glass were set to 3 mm.
  • vacuum suction pads were used for the second substrate holding mechanism and the first substrate holding mechanism.
  • 80 vacuum suction pads with a diameter of 40 mm were used, and tension was applied to each pad in a direction of separating with a force of 0.5 N. Further, the distance between the peeled supporting glass and the glass film and the distance between the carrier glass and the cover glass were set to 3 mm.
  • Example 1 In the case of Example 1, the carrier glass is first fixed by the vacuum suction plate of the second substrate holding mechanism to fix the glass film in a flat shape, and the first direction in which the support glass is separated from the glass film. While pulling with the vacuum suction pad of the substrate holding mechanism, water was sprayed on the interface between the glass film and the supporting glass by a water jet technique to peel the supporting glass.
  • the glass film is fixed in a flat shape by the vacuum suction plate of the first substrate holding mechanism, and the carrier glass is pulled by the vacuum suction pad of the second substrate holding mechanism, while water is applied to the interface between the cover glass and the carrier glass.
  • Water was sprayed by a jet technique, the carrier glass was peeled off, and an organic EL device was manufactured.
  • the support glass and the carrier glass can be peeled off in a short time without stagnation, and the properties of the organic EL device obtained by the peeling are deteriorated. It never happened. Moreover, when the support glass and carrier glass which peeled were again laminated
  • Example 2 In the case of Example 2, the support glass is first fixed in a flat shape by the vacuum suction plate of the first substrate holding mechanism, and the vacuum suction pad of the second substrate holding mechanism is oriented away from the support glass. While pulling, the water was sprayed on the interface between the glass film and the supporting glass by a water jet technique to peel the supporting glass. That is, Example 2 is different from Example 1 in that the object to be first fixed in a flat shape is a supporting glass and the object to be pulled is a glass film.
  • Example 2 also differs from Example 1 in that the object to be fixed in a planar shape after peeling of the supporting glass is a carrier glass, and the object to be pulled is a glass film.
  • the support glass and the carrier glass can be peeled well in a short time without stagnation, and the characteristics of the organic EL device obtained by peeling are deteriorated.
  • the yield of the organic EL device was slightly reduced as compared with the case of Example 1. Further, when the supporting glass and the carrier glass were laminated again on the glass film and the cover glass, a good glass film laminate was obtained and could be reused.
  • Example 3 In the case of Example 3, first, both the supporting glass and the carrier glass are pulled at the interface between the glass film and the supporting glass while being pulled away from each other by the vacuum suction pads of the first and second substrate holding mechanisms. Water was sprayed by a jet method to peel off the supporting glass. That is, Example 3 is different from Examples 1 and 2 in that peeling is performed without fixing a supporting glass, a glass film, or the like in a flat shape.
  • Example 3 is different from Examples 1 and 2 in that after the support glass is peeled off, the glass film or carrier glass is peeled off without being fixed in a flat shape.
  • Example 4 In the case of Example 4, first, the carrier glass is fixed by the vacuum suction plate of the second substrate holding mechanism to fix the glass film in a flat shape, and the support glass is separated from the glass film in the first direction. While pulling with the vacuum suction pad of the substrate holding mechanism, steam was blown onto the interface between the glass film and the supporting glass using a steam discharge machine to peel the supporting glass.
  • the glass film is fixed in a flat shape by the vacuum suction plate of the first substrate holding mechanism, and the carrier glass is pulled by the vacuum suction pad of the second substrate holding mechanism, and steam is applied to the interface between the cover glass and the carrier glass. Steam was sprayed using a discharger to peel off the carrier glass to produce an organic EL device.
  • the support glass and the carrier glass can be peeled off in a short time without stagnation, and the properties of the organic EL device obtained by the peeling are deteriorated. It never happened. Moreover, when the support glass and carrier glass which peeled were again laminated
  • Example 5 In the case of the fifth embodiment, the support glass is first fixed in a planar shape by the vacuum suction plate of the first substrate holding mechanism, and the vacuum suction pad of the second substrate holding mechanism is oriented away from the support glass. While pulling, steam was sprayed on the interface between the glass film and the supporting glass to peel off the supporting glass. That is, Example 5 is different from Example 4 in that the object to be first fixed in a planar shape is a supporting glass and the object to be pulled is a glass film.
  • Example 5 also differs from Example 4 in that the object to be fixed in a planar shape after peeling of the supporting glass is carrier glass, and the object to be pulled is a glass film.
  • the support glass and the carrier glass can be peeled well in a short time without stagnation, and the characteristics of the organic EL device obtained by peeling are deteriorated.
  • the yield of the organic EL device was slightly reduced as compared with the case of Example 4. Further, when the supporting glass and the carrier glass were laminated again on the glass film and the cover glass, a good glass film laminate was obtained and could be reused.
  • Example 6 In the case of Example 6, first, both the supporting glass and the carrier glass are pulled to the interface between the glass film and the supporting glass while being pulled away from each other by the vacuum suction pads of the first and second substrate holding mechanisms. Was sprayed to peel the supporting glass. That is, Example 6 is different from Examples 5 and 4 in that peeling is performed without fixing the supporting glass, the glass film, or the like in a flat shape.
  • Example 6 is different from Examples 5 and 4 in that after the support glass is peeled off, the glass film or carrier glass is peeled off without being fixed in a flat shape.
  • Example 7 In the case of Example 7, the carrier glass is first fixed with the vacuum suction plate of the second substrate holding mechanism to fix the glass film in a flat shape, and the support glass is separated from the glass film in the first direction. While pulling with the vacuum suction pad of the substrate holding mechanism, compressed air was blown onto the interface between the glass film and the supporting glass using an air knife to peel the supporting glass.
  • the glass film is fixed in a flat shape by the vacuum suction plate of the first substrate holding mechanism, and the carrier glass is pulled by the vacuum suction pad of the second substrate holding mechanism, and air is applied to the interface between the cover glass and the carrier glass. Compressed air was sprayed using a knife to peel off the carrier glass to produce an organic EL device.
  • the support glass and the carrier glass can be peeled off in a short time without stagnation, and the properties of the organic EL device obtained by the peeling are deteriorated. It never happened. Moreover, when the support glass and carrier glass which peeled were again laminated
  • Example 8 In the case of Example 8, the support glass is first fixed in a flat shape by the vacuum suction plate of the first substrate holding mechanism, and the vacuum suction pad of the second substrate holding mechanism is oriented away from the support glass. While pulling, the support glass was peeled off by blowing compressed air to the interface between the glass film and the support glass using an air knife. That is, Example 8 is different from Example 7 in that the object to be first fixed in a planar shape is a supporting glass and the object to be pulled is a glass film.
  • Example 8 is also different from Example 7 in that the object to be fixed in a planar shape after peeling of the supporting glass is carrier glass, and the object to be pulled is a glass film.
  • the support glass and the carrier glass can be peeled well in a short time without stagnation, and the characteristics of the organic EL device obtained by peeling are deteriorated.
  • the yield of the organic EL device was slightly reduced as compared with the case of Example 7. Further, when the supporting glass and the carrier glass were laminated again on the glass film and the cover glass, a good glass film laminate was obtained and could be reused.
  • Example 9 In the case of Example 9, first, air is applied to the interface between the glass film and the supporting glass while pulling both the supporting glass and the carrier glass in the direction separating from each other by the vacuum suction pads of the first and second substrate holding mechanisms. Air was blown by a knife technique to peel off the supporting glass. That is, Example 9 is different from Examples 7 and 8 in that peeling is performed without fixing a supporting glass, a glass film, or the like in a flat shape.
  • Example 9 is different from Examples 7 and 8 in that after the support glass is peeled off, the glass film, the carrier glass and the like are peeled off without being fixed in a flat shape.
  • Comparative Example 1 a stainless steel wedge having a thickness of 0.5 mm was inserted into the interface between the supporting glass and the glass film in the organic EL device having the above specifications and peeled off. At this time, the support glass is fixed in a flat shape by the vacuum holding plate of the substrate holding mechanism, and the stainless steel wedge is inserted while pulling the carrier glass with the vacuum suction pad of the substrate holding mechanism in the direction away from the supporting glass. It peeled.
  • the glass film is fixed to a flat surface by the vacuum holding plate of the substrate holding mechanism, and the carrier glass is pulled in the direction away from the glass film by the vacuum holding pad of the substrate holding mechanism, while the stainless steel is attached to the interface between the cover glass and the carrier glass.
  • the wedge glass made was inserted and the carrier glass was peeled off to produce an organic EL device.
  • Example 1 when peeling support glass from the electronic device with support glass from the said experimental result, as shown in Example 1, while spraying the fluid containing water on the interface of support glass and a glass film by the method of a water jet. It was confirmed that it is most preferable to peel the supporting glass by fixing the glass film side to a flat shape and pulling the supporting glass side.
  • Example 1 when peeling the carrier glass from the electronic device with supporting glass, as shown in Example 1, while spraying a fluid containing water on the interface between the cover glass and the carrier glass by a water jet technique, it was confirmed that it was most preferable that the carrier glass was peeled off by pulling the carrier glass side while fixing it in a flat shape.
  • the glass film 11 and the supporting glass are used in the third step. While holding any one of 12 in a plane, the other is applied with a tension in a direction away from the other, and the other is peeled off from the other.
  • the manufacturing method of the electronic device which concerns on one Embodiment of this invention, and the manufacturing method of a glass film maintain the interface of the glass film 11 and the support glass 12 by keeping either the glass film 11 and the support glass 12 planar. 13 can be reliably sprayed with the liquid 4 as a fluid, whereby the glass film 11 and the supporting glass 12 that have been subjected to the treatment with heating can be more reliably peeled without being damaged. I have to.
  • the glass film 11 is held in a flat shape in the third step.
  • the support glass 12 is provided with a tension in a direction away from the glass film 11.
  • the present invention can be applied not only in the production of glass films and electronic devices, but also in the production of various devices produced using a film-like substrate made of a material other than glass (for example, a synthetic resin). It is also possible to apply by applying this.

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  • General Physics & Mathematics (AREA)
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Abstract

L'invention concerne un procédé de fabrication d'un film de verre qui permet le retrait aisé et peu coûteux d'un film de verre à partir d'un verre support, même lors du post-traitement associé à la fabrication impliquant l'application de chaleur ; et un procédé de fabrication d'un dispositif électronique. Selon l'invention, ce procédé de fabrication d'un film de verre comprend : une première étape dans laquelle un stratifié de films de verre (1) est produit par stratification d'un film de verre (11) et d'un verre support (12) qui ont subi un prétraitement associé à la fabrication ; une deuxième étape dans laquelle un procédé associé à la fabrication impliquant l'application de chaleur au film de verre (11) dans le stratifié de films de verre (1) est réalisé ; et une troisième étape dans laquelle le stratifié de films de verre post-traité (1) est scindé en film de verre (11) et en verre support (12) obtenus par la mise en œuvre du procédé associé à la fabrication. Dans la troisième étape, soit le film de verre (11), soit le verre support (12) est retiré de l'autre pendant qu'un liquide sous pression (4) est appliqué sur une interface (13) entre le film de verre (11) et le verre support (12) dans le stratifié de films de verre (1).
PCT/JP2014/062435 2013-05-10 2014-05-09 Procédé de fabrication d'un film de verre et procédé de fabrication d'un dispositif électronique WO2014181855A1 (fr)

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WO2015190418A1 (fr) * 2014-06-13 2015-12-17 日本電気硝子株式会社 Procédé pour la fabrication de film de verre et procédé pour la fabrication de dispositif électronique comprenant un film de verre
EP3118893A1 (fr) * 2015-07-13 2017-01-18 Nokia Technologies Oy Appareil et procédé destinés à permettre le transfert de matériaux en deux dimensions
WO2021102106A1 (fr) * 2019-11-21 2021-05-27 Corning Incorporated Substrats de support en vitrocéramique et verre recyclés

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WO2010079688A1 (fr) * 2009-01-09 2010-07-15 旭硝子株式会社 Stratifié de verre et procédé de fabrication pour celui-ci
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WO2015190418A1 (fr) * 2014-06-13 2015-12-17 日本電気硝子株式会社 Procédé pour la fabrication de film de verre et procédé pour la fabrication de dispositif électronique comprenant un film de verre
JP2016003147A (ja) * 2014-06-13 2016-01-12 日本電気硝子株式会社 ガラスフィルムの製造方法、及びこのガラスフィルムを含む電子デバイスの製造方法
EP3118893A1 (fr) * 2015-07-13 2017-01-18 Nokia Technologies Oy Appareil et procédé destinés à permettre le transfert de matériaux en deux dimensions
WO2017009526A1 (fr) * 2015-07-13 2017-01-19 Nokia Technologies Oy Appareil et procédé permettant le transfert de matériaux bidimensionnels
WO2021102106A1 (fr) * 2019-11-21 2021-05-27 Corning Incorporated Substrats de support en vitrocéramique et verre recyclés
US11823967B2 (en) 2019-11-21 2023-11-21 Corning Incorporated Recycled glass and glass-ceramic carrier sustrates

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