WO2014133007A1 - Procédé de fabrication d'un dispositif électronique - Google Patents

Procédé de fabrication d'un dispositif électronique Download PDF

Info

Publication number
WO2014133007A1
WO2014133007A1 PCT/JP2014/054697 JP2014054697W WO2014133007A1 WO 2014133007 A1 WO2014133007 A1 WO 2014133007A1 JP 2014054697 W JP2014054697 W JP 2014054697W WO 2014133007 A1 WO2014133007 A1 WO 2014133007A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass
electronic device
film
glass film
supporting
Prior art date
Application number
PCT/JP2014/054697
Other languages
English (en)
Japanese (ja)
Inventor
保弘 松本
康夫 山崎
睦 深田
Original Assignee
日本電気硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Publication of WO2014133007A1 publication Critical patent/WO2014133007A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a method of manufacturing an electronic device such as a flat panel display such as a liquid crystal display or an organic EL display, organic EL lighting, a solar battery, a lithium ion battery, a digital signage, a touch panel, electronic paper, a mobile phone, or a smartphone.
  • a flat panel display such as a liquid crystal display or an organic EL display, organic EL lighting, a solar battery, a lithium ion battery, a digital signage, a touch panel, electronic paper, a mobile phone, or a smartphone.
  • flat panel displays such as a liquid crystal display, a plasma display, an organic EL display and a field emission display have become popular in recent years.
  • These flat panel displays are required to be thinner.
  • organic EL displays are required to be easily carried by folding or winding, and to be usable not only on flat surfaces but also on curved surfaces.
  • it is not limited to a display that can be used not only on a flat surface but also on a curved surface.
  • it has a curved surface such as the surface of a car body, the roof of a building, or a pillar or an outer wall. If a solar cell or organic EL illumination can be formed on the surface of an object, its application will be expanded. Therefore, the substrate and cover glass used in these devices are required to be further thinned and highly flexible.
  • the light emitter used in the organic EL display is deteriorated by contact with a gas such as oxygen or water vapor. Accordingly, since a high gas barrier property is required for a substrate used in an organic EL display, it is expected to use a glass substrate.
  • glass substrates used in such applications are less flexible because they are less susceptible to tensile stress than resin films, and breakage occurs when the glass substrate surface is subjected to tensile stress by bending the glass substrate. .
  • the glass substrate used for electronic devices such as flat panel displays and solar cells is subjected to various processing related to electronic device manufacturing such as processing and cleaning.
  • processing and cleaning if the glass substrate used in these electronic devices is made thin and made into a film, the glass is a brittle material, which leads to breakage due to a slight change in stress. There is a problem that is very difficult.
  • a glass film having a thickness of 200 ⁇ m or less is rich in flexibility, it is difficult to perform positioning when performing processing, and there is a problem that displacement or the like occurs during patterning.
  • Patent Document 2 proposes a glass film laminate in which a glass film is laminated on a supporting glass. According to this, even if a glass film having low strength and rigidity is used alone, the supporting glass has high rigidity, so that the entire glass film laminate can be easily positioned during processing. Moreover, after completion
  • the various manufacturing-related processes described above include processes involving heating, such as a film forming process or a sealing process of a transparent conductive film.
  • a process involving heating is performed, the support glass and the glass film that are directly laminated in the glass film laminate are bonded to each other, which makes it difficult to peel the glass film from the support glass.
  • Patent Document 3 proposes a glass film laminate in which an inorganic thin film is formed on a supporting glass and then a glass film is laminated. Thereby, even if the electronic device manufacturing related process with heating is performed on the glass film laminate, the supporting glass and the glass film are not bonded, and the glass film is removed from the supporting glass after the electronic device manufacturing related process with heating. It can be peeled off.
  • JP 2010-132531 A WO2011 / 048979 JP 2011-184284 A
  • Patent Document 3 it is necessary to form an inorganic thin film very uniformly on the surface of the supporting glass.
  • the formation of the inorganic thin film on the supporting glass has a problem of requiring a lot of time and cost. Therefore, it is desired that the supporting glass and the glass film are peeled from the glass film laminate by a simple and inexpensive method after the electronic device manufacturing-related process involving heating.
  • the present invention has been made to solve the above-described problems of the prior art, and easily and inexpensively peels a glass film from a supporting glass even after processing related to electronic device manufacturing involving heating.
  • the purpose is to make it possible.
  • the present invention devised to solve the above-mentioned problems is that the surface roughness Ra of the surfaces of the glass film and the supporting glass which are in contact with each other is set to 2.0 nm or less, and both the surfaces are brought into contact with each other.
  • a device is formed on the glass film of the glass film laminate by performing a first process for producing a glass film laminate in which a glass film and a supporting glass are laminated, and an electronic device manufacturing related process involving heating.
  • the second step of producing the electronic device with supporting glass by sealing the element with a cover glass, and applying a liquid containing water to the interface between the glass film and the supporting glass of the electronic device with supporting glass
  • a third step of peeling the electronic device from the supporting glass is a third step of peeling the electronic device from the supporting glass.
  • the glass film and the supporting glass can be directly fixed and laminated.
  • the element formed on the glass film can be sealed by sealing the element with the cover glass after the electronic device manufacturing related process. Even if an electronic device manufacturing related process involving heating is performed by applying a liquid containing water to the interface between the supporting glass and the glass film, the supporting glass and the glass film can be favorably peeled off. Even if the liquid is used at the time of peeling, the liquid is not attached to the element in the electronic device because the cover glass is sealed to make the periphery of the element a sealed space. The internal elements are not deteriorated.
  • the third step is preferably performed by immersing the electronic device with a supporting glass in a liquid containing water.
  • the liquid containing water is preferably alkaline.
  • the supporting glass can be peeled from the electronic device with supporting glass more efficiently.
  • an ultrasonic wave may be applied to the electronic device with a supporting glass.
  • the ultrasonic wave is applied to the electronic device with a supporting glass in the third step, the liquid containing water efficiently penetrates into the interface between the supporting glass and the glass film.
  • the support glass and the glass film can be peeled off more favorably.
  • a peeling member may be inserted at the interface between the glass film and the supporting glass.
  • the liquid containing water can penetrate efficiently into the interface of support glass and glass film.
  • the supporting glass and the glass film can be peeled off more favorably.
  • the peeling member can be a hydrophobic resin sheet.
  • the peeling member is a hydrophobic resin sheet, it is excellent in handling the resin sheet in a liquid containing water, and efficiently contains water at the interface between the glass film and the supporting glass. Liquid can enter.
  • an inorganic thin film can be formed on the surface of the supporting glass that is in contact with the glass film.
  • the inorganic thin film is formed on the surface of the supporting glass that comes into contact with the glass film, the supporting glass and the glass film can be more efficiently separated.
  • the cover glass may be laminated on a carrier glass, and the cover glass and the carrier glass may be peeled off in the third step.
  • the cover glass is supported by the carrier glass, it is possible to perform processing related to electronic device manufacturing on the cover glass side as well, even if the cover glass has flexibility.
  • the element can be sealed, and the cover glass and the carrier glass can be peeled off at the same time as the supporting glass and the glass film are peeled off in the third step.
  • the peeling member in the third step, may be inserted into the interface between the cover glass and the carrier glass.
  • the 3rd process inserts a peeling member in the interface of a cover glass and carrier glass, the liquid containing water efficiently penetrates also into the interface of a cover glass and carrier glass.
  • the cover glass and the carrier glass can be peeled off satisfactorily.
  • the present invention it is possible to easily and inexpensively peel the glass film from the supporting glass even after processing related to electronic device manufacturing involving heating, and by sealing with a cover glass,
  • the elements in the electronic device are preferably protected.
  • the method for manufacturing an electronic device sets the surface roughness Ra of the glass film 11 and the supporting glass 12 on the side in contact with each other to 2.0 nm or less, and both surfaces thereof.
  • the glass of the glass film laminated body 1 by performing the electronic device manufacturing related process with a 1st process which laminates
  • a second step of forming the electronic device 3 with supporting glass by forming the element 51 on the film 11 and sealing the element 51 with the cover glass 2, and the glass film 11 and the supporting glass of the electronic device 3 with supporting glass
  • the glass film 11 is made of silicate glass or silica glass, preferably borosilicate glass, most preferably non-alkali glass. If the glass film 11 contains an alkali component, cations are dropped on the surface, so-called soda blowing phenomenon occurs, and the structure becomes rough. In this case, if the glass film 11 is curved and used, there is a possibility that it will be damaged from a portion that has become rough due to deterioration over time.
  • the alkali-free glass is a glass that does not substantially contain an alkali component (alkali metal oxide), and specifically, a glass having an alkali component of 3000 ppm or less.
  • the content of the alkali component in the present invention is preferably 1000 ppm or less, more preferably 500 ppm or less, and most preferably 300 ppm or less.
  • the thickness of the glass film 11 is preferably 300 ⁇ m or less, more preferably 5 ⁇ m to 200 ⁇ m, and most preferably 5 ⁇ m to 100 ⁇ m. Thereby, the thickness of the glass film 11 can be made thinner and appropriate flexibility can be imparted, handling properties are difficult, and problems such as misalignment and bending during patterning are likely to occur. On the other hand, processing related to electronic device manufacturing can be easily performed by using the supporting glass 12 described later. If the thickness of the glass film 11 is less than 5 ⁇ m, the strength of the glass film 11 tends to be insufficient, and the glass film 11 may be difficult to peel from the support glass 12.
  • silicate glass, silica glass, borosilicate glass, non-alkali glass, or the like is used similarly to the glass film 11.
  • the thickness of the support glass 12 is preferably 400 ⁇ m or more. When the thickness of the supporting glass 12 is less than 400 ⁇ m, there is a possibility that a problem may occur in terms of strength when the supporting glass 12 is handled alone.
  • the thickness of the support glass 12 is preferably 400 ⁇ m to 700 ⁇ m, and most preferably 500 ⁇ m to 700 ⁇ m. As a result, the glass film 11 can be reliably supported, and breakage of the glass film 11 that can occur when the glass film 11 is peeled from the support glass 12 can be effectively suppressed.
  • the thickness of the support glass 12 may be less than 400 ⁇ m (for example, 300 ⁇ m or the like, the same thickness as the glass film 11). .
  • the glass film 11 and the supporting glass 12 used in the present invention are preferably formed by a down draw method, and more preferably formed by an overflow down draw method.
  • the overflow downdraw method shown in FIG. 2 is a molding method in which both surfaces of the glass plate do not come into contact with the molded member at the time of molding, and the both surfaces (translucent surface) of the obtained glass plate are hardly scratched and polished. Even if not, high surface quality can be obtained.
  • the glass film 11 and / or the supporting glass 12 may be formed by a float method, a slot down draw method, a roll out method, an up draw method, a redraw method, or the like.
  • the glass ribbon G immediately after flowing down from the lower end portion 81 of the wedge-shaped molded body 8 is drawn downward while the shrinkage in the width direction is restricted by the cooling roller 82 to be predetermined.
  • the glass ribbon G that has reached the predetermined thickness is gradually cooled in a slow cooling furnace (annealer), the thermal distortion of the glass ribbon (G) is removed, and the glass ribbon (G) is cut into a predetermined size, thereby forming a glass film. 11 and the support glass 12 are respectively formed.
  • the 1st process based on this invention is laminated
  • the surface roughness Ra of the contact surface 11a of the glass film 11 with the support glass 12 and the contact surface 12a of the support glass 12 with the glass film 11 is 2.0 nm or less, respectively.
  • surface roughness Ra exceeds 2.0 nm, adhesiveness will fall and it will become impossible to laminate
  • the surface roughness Ra of each of the contact surfaces 11a and 12a of the glass film 11 and the supporting glass 12 is preferably 1.0 nm or less, more preferably 0.5 nm or less, and 0.2 nm or less. Most preferred.
  • the roughness Ra is preferably 2.0 nm or less, more preferably 1.0 nm or less, further preferably 0.5 nm or less, and most preferably 0.2 nm or less.
  • the surface roughness of the conveyance surface 12b of the support glass 12 is not particularly limited.
  • the glass film 11 having substantially the same area is laminated on the support glass 12, but in order to further facilitate the peeling of the glass film 11 from the support glass 12, the glass film 11 is supported by the support glass 12. It may be laminated so as to protrude from.
  • the protruding amount of the glass film 11 from the supporting glass 12 is preferably 1 to 20 mm, more preferably 1 to 10 mm, and most preferably 1 to 5 mm. Even if the protruding amount of the glass film 11 is about 1 mm, the end portion of the glass film 11 can be used as the starting point of the peeling, while the protruding amount of the glass film 11 exceeds 20 mm. May cause damage or drooping.
  • the portion of the glass film 11 protruding from the support glass 12 may be all four sides of the glass film laminate 1, or may be only two sides or only one side facing each other.
  • the support glass 12 may be laminated so as to protrude from the glass film 11.
  • the amount of protrusion of the support glass 12 from the glass film 11 is preferably 0.5 to 10 mm, and more preferably 0.5 to 1 mm.
  • the area of the effective surface 11b of the glass film 11 can be secured more widely.
  • the support glass 12 protrudes from the glass film 11 in all four sides.
  • the form in which the glass film 11 protrudes from the support glass 12 only on one side, and the support glass 12 protrudes from the glass film 11 in the remaining three sides is more preferable.
  • the step of laminating the glass film 11 on the support glass 12 may be performed under reduced pressure. Thereby, the bubble produced when the glass film 11 and the support glass 12 are laminated
  • the second step according to the present invention is an effective surface 11b of the glass film 11 of the glass film laminate 1 produced in the first step as shown in FIG.
  • the device 51 is formed on the support glass 2 by sealing the device 51 formed on the effective surface 11 b of the glass film 11 with the cover glass 2.
  • Examples of the electronic device manufacturing related process involving heating in the second step include a film forming process by a CVD method, a sputtering method, and the like.
  • a film forming process by a CVD method As elements formed on the effective surface 11b of the glass film 11, liquid crystal elements, organic EL elements, touch panel elements, solar cell elements, piezoelectric elements, light receiving elements, battery elements such as lithium ion secondary batteries, MEMS elements, and semiconductors An element etc. are mentioned.
  • the cover glass 2 is made of silicate glass, silica glass, borosilicate glass, alkali-free glass or the like.
  • the cover glass 2 it is preferable to use a glass having a difference in thermal expansion coefficient at 30 to 380 ° C. with respect to the glass film 11 within 5 ⁇ 10 ⁇ 7 / ° C. Thereby, even if the temperature of the surrounding environment of the produced electronic device 5 changes, it is hard to produce the thermal warp by the difference of an expansion coefficient, the crack of the glass film 11 and the cover glass 2, etc., and it is set as the electronic device 5 which is hard to be damaged. It becomes possible.
  • the cover glass 2 and the glass film 11 are most preferably glass having the same composition.
  • the thickness of the cover glass 2 is preferably 300 ⁇ m or less, more preferably 5 ⁇ m to 200 ⁇ m, and most preferably 5 ⁇ m to 100 ⁇ m. Thereby, thickness of a cover glass can be made thinner and appropriate flexibility can be provided. When the thickness of the cover glass 2 is less than 5 ⁇ m, the strength of the cover glass 2 tends to be insufficient.
  • FIG. 4 shows an organic EL panel as an example of the electronic device 3 with a supporting glass manufactured in the second step.
  • the anode layer 52a, the hole transport layer 52b, the light emitting layer 52c, the electron transport layer 52d, and the cathode layer 52e are laminated in this order on the effective surface 11b of the glass film 11 by a known film formation method such as CVD or sputtering.
  • the organic EL element 52 is formed.
  • the organic EL element 52 is sealed by bonding the cover glass 2 and the glass film 11 using a known laser sealing or the like, and the electronic device 3 with supporting glass (this time organic EL with supporting glass). Panel).
  • the cover glass 2 and the glass film 11 are directly bonded, but the cover glass 2 and the glass film 11 may be bonded appropriately using a known glass frit, a spacer, or the like.
  • the third step according to the present invention is to apply the electronic device 5 while applying the liquid 4 containing water to the interface 13 between the glass film 11 and the supporting glass 12 of the electronic device 3 with supporting glass. This is a step of peeling from the support glass 12.
  • the liquid 4 containing water may contain other components as long as it contains at least water, and may be in an aqueous solution or a micelle state in which the solute is dissolved in water as well as pure water. It may be a mixture with water or may contain a component that does not dissolve in water, such as oil.
  • the liquid state may be any shape such as liquid columnar, granular, mist, or steam.
  • the liquid 4 containing water is sprayed on the interface 13 between the glass film 11 and the support glass 12 by spraying the liquid 4 containing water from the nozzle 41 onto the interface 13 between the glass film 11 and the support glass 12.
  • the glass film 11 and the support glass 12 are peeled off. Thereby, even if the electronic device manufacturing related process with heating is performed, the glass film 11 and the support glass 12 can be smoothly peeled off.
  • the glass film 11 and the support glass 12 can be favorably peeled by applying the liquid 4 containing water, it is speculated that the reason is as follows.
  • the smooth contact surfaces 11a and 12a of these two glass substrates are brought into close contact with each other.
  • the glass substrates adhere to each other without an adhesive to form the glass film laminate 1.
  • This phenomenon is presumed to be due to the following mechanism. As shown in FIG. 5, it is considered that they are attracted by hydrogen bonding between hydroxyl groups formed on the contact surface 11 a of the glass film 11 and the contact surface 12 a of the support glass 12.
  • the glass film 11 and the support glass 12 may adhere to each other due to the formation of hydrogen bonds through water molecules present at the interface 13 between the glass film 11 and the support glass 12. It is believed that.
  • the electronic device manufacturing process includes a manufacturing-related process including heating such as a film forming process, it is manufactured with a heating process of at least 100 ° C. or higher. For example, in a TFT manufacturing process of a liquid crystal display or an organic EL display, an amorphous silicon TFT is heated to 300 ° C.
  • a low temperature polysilicon TFT is heated to at least 400 ° C. or higher.
  • a TFT composed of indium, gallium, zinc, and oxygen it is heated to at least 300 ° C. or higher.
  • the manufacturing process of the touch sensor substrate it is heated to at least 150 ° C. or higher.
  • the inventors of the present invention include at least water at the interface 13 between the glass film 11 and the support glass 12 in the glass film laminate 1 that has undergone the electronic device manufacturing-related treatment with heating.
  • peeling was performed in a state where a liquid was applied, it was found that the glass film 11 and the supporting glass 12 could be easily peeled, and the present invention was achieved.
  • the liquid 4 containing water is applied to the interface 13 between the glass film 11 and the support glass 12, Si-O-Si + H 2 O ⁇ Si-OH + HO-Si It is considered that the glass film 11 and the supporting glass 12 can be easily peeled off by promoting the hydrolysis reaction.
  • the dehydration reaction and hydrolysis reaction of the Si—OH group at the interface 13 between the glass film 11 and the support glass 12 described above are not limited to Si but exist in Al, In, Sn, Zn, Ti, Zr, Ga, and the like.
  • the OH group is considered to be generated similarly. Therefore, on the support glass 12, SiO, SiO 2, Al 2 O 3, MgO, Y 2 O 3, La 2 O 3, Pr 6 O 11, Sc 2 O 3, WO 3, HfO 2, In 2 O 3 Even when an inorganic thin film such as ITO, ZrO 2 , Nd 2 O 3 , Ta 2 O 5 , CeO 2 , Nb 2 O 5 , TiO, TiO 2 , Ti 3 O 5 , NiO, or ZnO is formed.
  • a similar effect can be expected.
  • the glass film 11 and the support glass 12 can be easily peeled off.
  • the glass film 11 and the support glass 12 can be more easily peeled off more efficiently.
  • the liquid 4 containing water can be more efficiently provided to the interface 13 between the support glass 12 and the glass film 11 at the time of peeling.
  • the liquid 4 containing water is stored in the water tank 42, and the support glass 12 and the glass film 11 are peeled off by immersing the electronic device 3 with support glass in the water tank 42. I do.
  • the liquid 4 containing water is preferably alkaline.
  • a monovalent base, a divalent base or the like can be used, and both strong alkali and weak alkali can be used.
  • the pH of the liquid 4 containing water may be adjusted by adding KOH, NaOH, or a surfactant to water or the like.
  • the pH of the liquid 4 containing water is preferably more than pH 7, more preferably 10 or more.
  • anionic surfactants cationic surfactants, nonionic surfactants, zwitterionic surfactants and the like can be used. Two or more kinds may be mixed, and a mixture of a pH adjusting agent that maintains alkalinity such as sodium carbonate can be used.
  • concentration of the surfactant in the liquid 4 containing water used in the present invention is preferably 0.001 to 2.0% by mass.
  • anionic surfactant carboxylate, sulfonate, sulfate ester salt and the like can be used.
  • anionic fatty acid salts alpha sulfo fatty acid ester salts, alkylbenzene sulfonates, alkyl sulfates, alkyl ether sulfate esters, alkyl sulfate triethanolamines and the like can be used.
  • cationic surfactant amine salt type and quaternary ammonium salt type can be used.
  • alkyltrimethylammonium salt, dialkyldimethylammonium chloride, alkylpyridinium chloride and the like can be used.
  • Nonionic surfactants include ester types in which polyhydric alcohols and fatty acids are ester-bonded, ether types such as polyoxyethylene alkyl ether, and ester / ether types that have both ester bonds and ether bonds in the molecule. can do.
  • ether types such as polyoxyethylene alkyl ether
  • ester / ether types that have both ester bonds and ether bonds in the molecule.
  • fatty acid diethanolamide, polyoxyethylene alkyl ether, polyoxyethylene alkylphenyl ether and the like can be used.
  • As the zwitterionic surfactant carboxylate type, amino acid type, betaine type and the like can be used.
  • the liquid 4 containing water can be more efficiently applied to the interface 13 between the glass film 11 and the support glass 12, and the separation between the glass film 11 and the support glass 12 can be further facilitated.
  • the applied wavelength of the ultrasonic wave is preferably 25 kHz to 950 kHz, and more preferably 25 kHz to 170 kHz where the vibration energy is large.
  • the time for applying the ultrasonic wave to the electronic device 3 with supporting glass immersed in the liquid 4 containing water is preferably performed until the electronic device 5 is completely peeled from the supporting glass 12.
  • ultrasonic waves may be used only at the start of peeling of the electronic device 5, and in this case, ultrasonic waves may be applied to the electronic device 3 with supporting glass for 1 to 5 seconds.
  • the ultrasonic wave may be applied by directly contacting the ultrasonic wave transmitter with the electronic device 3 with supporting glass or by applying ultrasonic wave to the electronic device 3 with supporting glass through the liquid 4 containing water. Also good.
  • the peeling member 6 is preferably inserted into the interface 13 between the glass film 11 and the supporting glass 12 when the glass film 11 and the supporting glass 12 are peeled off.
  • the liquid 4 containing water can be made to invade sequentially into the interface 13 between the glass film 11 and the support glass 12, Peeling of the glass film 11 and the support glass 12 can be further facilitated.
  • the shape of the peeling member 6 is preferably a sheet-like, belt-like, plate-like, strip-like, wedge-like or the like that has a small thickness and is wider than the electronic device 3 with supporting glass in the peeling progress direction.
  • the thickness of the peeling member is preferably 0.01 mm to 1 mm, and more preferably 0.1 mm to 0.5 mm.
  • the peeling member 6 can be inserted into a slight gap generated at the interface 13 between the glass film 11 and the support glass 12.
  • the length of the peeling member 6 is dependent also on the area of the electronic device 3 with support glass used as peeling object, it is preferable that it is long in the peeling progress direction at least rather than the electronic device 3 with support glass. In this way, the glass film 11 once peeled off and the supporting glass 12 come into contact again after passing through the peeling member 6 and are prevented as much as possible from partially or entirely becoming the electronic device 3 with supporting glass. be able to.
  • the material of the peeling member 6 can be a rigid metal such as aluminum or stainless steel, but it is preferable to use a flexible resin film such as polyethylene or acrylic, and a hydrophobic film such as a fluorine film.
  • the resin sheet is more preferable.
  • a hydrophobic resin sheet as the peeling member 6, there is little risk of damaging the end surfaces of the glass film 11 and the supporting glass 13, and the liquid 4 containing water even if immersed in water because it is hydrophobic. Inside, handling of the peeling member 6 becomes easy.
  • the hydrophobic resin sheet includes not only that the resin sheet itself is hydrophobic, but also that various sheets (resin sheet, metal sheet, etc.) are coated with a hydrophobic substance.
  • the material of the peeling member 6 is a rigid resin plate. Is preferably used, and the peeling member 6 can be smoothly inserted into the interface 13 between the glass film 11 and the support glass 12, and the glass film 11 and the support glass 12 are less likely to be damaged.
  • the desired electronic device 5 can finally be manufactured by peeling the support glass 12 from the electronic device 3 with a support glass by a 3rd process.
  • FIG. 9 is a diagram showing another embodiment according to the present invention.
  • the embodiment shown in FIG. 9 is different from the above-described embodiment in that the cover glass 2 is laminated on the carrier glass 21.
  • an electronic device manufacture related process can be performed also on the cover glass 2.
  • the liquid crystal element 53 can be sealed with the cover glass 2 formed.
  • the electronic device 3 with supporting glass also includes the carrier glass 21.
  • the carrier glass 21 is preferably made of the same material as the glass film 11, the cover glass 2 and the support glass 12 described above, and a glass having the same thickness as the support glass 12.
  • the carrier glass 21 and the cover glass 2 are preferably made of the same glass material.
  • the cover glass 2 and the carrier glass 21 are also peeled in the same process as the glass film 11 and the support glass 12 are peeled in the water tank 42 in which the liquid 4 containing water is stored. To do. Therefore, it is not necessary to provide a special process for peeling the carrier glass 21. Also when peeling the cover glass 2 and the carrier glass 21, it is preferable to apply an ultrasonic wave as above-mentioned, and it is preferable to use the peeling member 6 mentioned above.
  • the desired electronic device 5 can be finally manufactured by peeling the supporting glass 12 and the carrier glass 21 from the supporting glass-equipped electronic device 3 in the third step.
  • the method for manufacturing an electronic device can perform the first step, the second step, and the third step in succession, as schematically shown in FIG. Moreover, it is not limited to the structure performed continuously from a 1st process to a 3rd process, For example, the glass film laminated body 1 manufactured after the 1st process is packed and shipped, and an electronic device manufacturing related process is separately carried out.
  • the facility may be configured to perform the second step and the third step.
  • the support glass 12 and the carrier glass 21 are peeled off by packing and shipping the electronic device 3 with the support glass manufactured after the second step, and performing the third step in a separate facility. 5 may be manufactured.
  • the surface roughness Ra was measured under the conditions of a scan size of 10 ⁇ m, a scan rate of 1 Hz, and a sample line 512 using AFM (NanoScope) manufactured by Veeco.
  • the surface roughness Ra was 0.25 nm as calculated from the measured values in a 10 ⁇ m square measurement range.
  • This glass film and supporting glass were laminated at a temperature of 25 ° C. to produce a glass film laminate.
  • the obtained glass film laminate was placed in an electric furnace heated to 100 ° C., 150 ° C., 200 ° C., 300 ° C., 350 ° C., 400 ° C., and 450 ° C., heated for 30 minutes, and then unheated taken out of the electric furnace.
  • peeling surface energy (gamma) (J / m ⁇ 2 >) by a glass opening method with a glass film laminated body and the glass film laminated body heated at the above-mentioned temperature. ,evaluated.
  • the crack opening method inserts a peeling member 6 having a known thickness at the interface of the glass film laminate 1, and peels the surface from the separation distance c generated between the glass film 11 and the support glass 12.
  • the peeling surface energy ⁇ is calculated by the following equation.
  • h is the thickness (m) of the peeling member 6
  • Ta is the thickness (m) of the glass film 11
  • Ea is the Young's modulus (Pa) of the glass film 11
  • Tb is the thickness (m) of the support glass 12
  • Eb is the support.
  • c is the distance (m) peeled by inserting the peeling member 6.
  • Example 2 the peel surface energy ⁇ was measured in a state where the glass film laminate was immersed in an alkaline aqueous solution having a KOH concentration of 0.01 mol / kg (pH 10). As Example 3, the peeling surface energy ⁇ was measured while applying a 40 kHz ultrasonic wave in a state where the glass film laminate was immersed in water. As Comparative Example 1, peeling surface energy ⁇ was measured in the atmosphere. As a peeling member used for the measurement, a stainless steel cutter blade having a thickness of 40 ⁇ m was used. The results are shown in Table 1.
  • Example 1 As shown in Table 1, in Example 1, the surface energy of peeling was lowered by adding water, and it is clear that peeling can be performed more easily.
  • Example 2 shows that it becomes easier to peel by making water alkaline. Moreover, the surface energy at the time of peeling can also be lowered
  • a rectangular transparent glass plate having a length of 370 mm, a width of 470 mm, and a thickness of 500 ⁇ m was used as the supporting glass.
  • a glass film laminated on the supporting glass a glass film having a length of 370 mm, a width of 470 mm, and a thickness of 100 ⁇ m was used.
  • non-alkali glass product name: OA-10G, thermal expansion coefficient at 30 to 380 ° C .: 38 ⁇ 10 ⁇ 7 / ° C., Young's modulus 73 GPa
  • the surface roughness Ra was measured under the conditions of a scan size of 10 ⁇ m, a scan rate of 1 Hz, and a sample line 512 using AFM (NanoScope) manufactured by Veeco.
  • the surface roughness Ra was 0.25 nm as calculated from the measured values in a 10 ⁇ m square measurement range.
  • This glass film and supporting glass were laminated at a temperature of 20 ° C. to produce a glass film laminate.
  • the obtained glass film laminate was placed in an electric furnace heated to 100 ° C., 150 ° C., 200 ° C., 300 ° C., 350 ° C., 400 ° C., and 450 ° C., heated for 2 hours, and then taken out from the electric furnace.
  • Example 4 By making 100 glass film laminates under each heating condition and inserting a 100 ⁇ m thick fluororesin sheet (product name Yodoflon, manufactured by Yodogawa Hutec) at the interface between the glass film and the supporting glass, A peel test with the supporting glass was performed.
  • Example 4 a peel test was performed in a state where the glass film laminate was immersed in water.
  • Example 5 a peel test was performed in a state where the glass film laminate was immersed in an alkaline aqueous solution having a KOH concentration of 0.01 mol / kg (pH 10).
  • Example 6 a peel test was performed while applying a 40 kHz ultrasonic wave in a state where the glass film laminate was immersed in water.
  • Comparative Example 2 a peel test was performed in the air.
  • the probability of peeling success is 95% to 100%, 80 is 80% to 95%, ⁇ is 60% to 80%, and x is 60% or less.
  • Table 2 The results are shown in Table 2.
  • peeling was possible under any conditions with heating at 100 ° C. or lower, but in Examples 4 to 6, peeling was easy even when the heat treatment temperature became high due to the application of water. I understand that It has been clarified that the separation becomes even easier by using an alkaline aqueous solution or applying ultrasonic waves even if the heat treatment temperature is high.
  • the present invention is suitable for manufacturing electronic devices such as flat panel displays such as liquid crystal displays and organic EL displays, organic EL lighting, solar cells, lithium ion batteries, digital signage, touch panels, electronic paper, mobile phones and smartphones. Can be used for

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Laminated Bodies (AREA)
  • Photovoltaic Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

L'invention concerne un dispositif électronique (5) qui est fabriqué en réalisant : une première étape d'ajustement de la rugosité de surface (Ra) de côtés (11a, 12a) d'un film en verre (11) et d'un verre support (12) en contact l'un avec l'autre à 2,0 nm ou moins et la mise en contact des deux côtés (11a, 12a) pour produire un stratifié de film en verre (1) dans lequel le film en verre (11) et le verre support (12) sont stratifiés ; une deuxième étape de formation d'un élément (51) sur le film en verre (11) du stratifié de film en verre (1) par réalisation d'un procédé lié à la fabrication d'un dispositif électronique qui comprend un chauffage, et le scellement de l'élément (51) avec un verre de revêtement (2) afin de produire un dispositif électronique (3) comprenant le verre support ; et une étape d'application d'un liquide (4) qui comprend de l'eau sur une interface entre le film en verre (11) et le verre support (12) du dispositif électronique (3) comprenant le verre support et de séparation du dispositif électronique (5) du verre support (12).
PCT/JP2014/054697 2013-02-26 2014-02-26 Procédé de fabrication d'un dispositif électronique WO2014133007A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-035466 2013-02-26
JP2013035466 2013-02-26

Publications (1)

Publication Number Publication Date
WO2014133007A1 true WO2014133007A1 (fr) 2014-09-04

Family

ID=51428269

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/054697 WO2014133007A1 (fr) 2013-02-26 2014-02-26 Procédé de fabrication d'un dispositif électronique

Country Status (3)

Country Link
JP (1) JP2014194541A (fr)
TW (1) TW201446497A (fr)
WO (1) WO2014133007A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11289519B2 (en) 2017-01-30 2022-03-29 Sony Semiconductor Solutions Corporation Semiconductor device and electronic apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3247557A1 (fr) * 2015-01-22 2017-11-29 Corning Incorporated Procédés pour liaison de substrat hautement flexible à un support et produit formé par ceux-ci

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010129459A2 (fr) * 2009-05-06 2010-11-11 Corning Incorporated Support pour substrats en verre
WO2011001946A1 (fr) * 2009-07-03 2011-01-06 日本電気硝子株式会社 Stratifié verre-film
JP2011029169A (ja) * 2009-07-03 2011-02-10 Nippon Electric Glass Co Ltd 素子封止体及びその製造方法
WO2011034034A1 (fr) * 2009-09-18 2011-03-24 日本電気硝子株式会社 Procédé de fabrication d'un film de verre, procédé de traitement du film de verre et laminé de film de verre
WO2011048979A1 (fr) * 2009-10-20 2011-04-28 旭硝子株式会社 Stratifié de verre, procédé de fabrication d'un stratifié de verre, procédé de fabrication d'un panneau d'affichage et panneau d'affichage obtenu au moyen d'un procédé de fabrication de panneau d'affichage
WO2012014959A1 (fr) * 2010-07-28 2012-02-02 日本電気硝子株式会社 Stratifié de film de verre
WO2013005589A1 (fr) * 2011-07-04 2013-01-10 旭硝子株式会社 Procédé et dispositif de décollement de substrat de verre

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4402144B2 (ja) * 2006-09-29 2010-01-20 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2010090147A1 (fr) * 2009-02-06 2010-08-12 旭硝子株式会社 Procédé de fabrication de dispositif électronique et appareil de séparation utilisé pour celui-ci
JP2010215436A (ja) * 2009-03-13 2010-09-30 Nippon Electric Glass Co Ltd ガラスフィルム積層体
JP5562597B2 (ja) * 2009-08-28 2014-07-30 荒川化学工業株式会社 支持体、ガラス基板積層体、支持体付き表示装置用パネル、および表示装置用パネルの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010129459A2 (fr) * 2009-05-06 2010-11-11 Corning Incorporated Support pour substrats en verre
WO2011001946A1 (fr) * 2009-07-03 2011-01-06 日本電気硝子株式会社 Stratifié verre-film
JP2011029169A (ja) * 2009-07-03 2011-02-10 Nippon Electric Glass Co Ltd 素子封止体及びその製造方法
WO2011034034A1 (fr) * 2009-09-18 2011-03-24 日本電気硝子株式会社 Procédé de fabrication d'un film de verre, procédé de traitement du film de verre et laminé de film de verre
WO2011048979A1 (fr) * 2009-10-20 2011-04-28 旭硝子株式会社 Stratifié de verre, procédé de fabrication d'un stratifié de verre, procédé de fabrication d'un panneau d'affichage et panneau d'affichage obtenu au moyen d'un procédé de fabrication de panneau d'affichage
WO2012014959A1 (fr) * 2010-07-28 2012-02-02 日本電気硝子株式会社 Stratifié de film de verre
WO2013005589A1 (fr) * 2011-07-04 2013-01-10 旭硝子株式会社 Procédé et dispositif de décollement de substrat de verre

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11289519B2 (en) 2017-01-30 2022-03-29 Sony Semiconductor Solutions Corporation Semiconductor device and electronic apparatus

Also Published As

Publication number Publication date
TW201446497A (zh) 2014-12-16
JP2014194541A (ja) 2014-10-09

Similar Documents

Publication Publication Date Title
US9156230B2 (en) Glass film laminate without adhesive
JP5794325B2 (ja) 電子デバイス用ガラス基板の製造方法、及び、電子デバイス用カバーガラスの製造方法
JP5874159B2 (ja) ガラス−樹脂積層体、およびそれを巻き取ったガラスロール、並びにガラスロールの製造方法
WO2012144499A1 (fr) Stratifié, procédé permettant de produire celui-ci, et utilisation de celui-ci
WO2015163134A1 (fr) Corps stratifié en verre, et procédé pour la fabrication d'un dispositif électronique
JP2014019597A (ja) ガラスフィルムの製造方法及びガラスフィルム積層体
JP6287070B2 (ja) ガラスフィルム積層体を製造する方法及び電子・電気デバイスの製造方法
WO2015046490A1 (fr) Procédé de fabrication d'un corps de verre de type feuille, procédé de fabrication d'un dispositif électronique et procédé de fabrication d'une feuille de verre stratifiée
JP2010228166A (ja) ガラスフィルム積層体、該積層体のガラスロール、ガラスフィルムの端面保護方法、及びガラスロールの製造方法
JP2011121320A (ja) ガラスフィルム積層体、該積層体のガラスロール、及びガラスロールの製造方法
WO2015012261A1 (fr) Procédé de fabrication d'un film en verre et procédé de décollement d'un film en verre
WO2015012268A1 (fr) Procédé de production de film de verre et son procédé de décollement
WO2014133007A1 (fr) Procédé de fabrication d'un dispositif électronique
JP6350277B2 (ja) ガラスフィルムの製造方法及び電子デバイスの製造方法
JP2012030404A (ja) ガラスフィルム積層体
JP2010215436A (ja) ガラスフィルム積層体
JP6327580B2 (ja) ガラスフィルム積層体および電子デバイスの製造方法
JP6327437B2 (ja) 電子デバイスの製造方法
WO2014178405A1 (fr) Stratifié de film de verre, et procédé de production de dispositif électronique

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14757770

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14757770

Country of ref document: EP

Kind code of ref document: A1