WO2014181780A1 - Verre couvre-objet pour dispositifs d'affichage - Google Patents

Verre couvre-objet pour dispositifs d'affichage Download PDF

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Publication number
WO2014181780A1
WO2014181780A1 PCT/JP2014/062192 JP2014062192W WO2014181780A1 WO 2014181780 A1 WO2014181780 A1 WO 2014181780A1 JP 2014062192 W JP2014062192 W JP 2014062192W WO 2014181780 A1 WO2014181780 A1 WO 2014181780A1
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WO
WIPO (PCT)
Prior art keywords
glass
resin
mold
display device
plate glass
Prior art date
Application number
PCT/JP2014/062192
Other languages
English (en)
Japanese (ja)
Inventor
小金澤 光司
聡 白鳥
良太 中島
孝夫 土居
秀樹 福永
暢彦 竹下
真 府川
淳平 滝川
一博 岡田
拓哉 渡部
孝雄 本島
Original Assignee
旭硝子株式会社
Agcマテックス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013097819A external-priority patent/JP2016136164A/ja
Application filed by 旭硝子株式会社, Agcマテックス株式会社 filed Critical 旭硝子株式会社
Priority to KR1020167014357A priority Critical patent/KR20160102975A/ko
Priority to CN201480070969.4A priority patent/CN105992684B/zh
Priority to PCT/JP2014/079363 priority patent/WO2015098300A1/fr
Priority to EP14874637.3A priority patent/EP3088154A4/fr
Priority to JP2015554647A priority patent/JPWO2015098300A1/ja
Priority to TW103138535A priority patent/TW201532780A/zh
Publication of WO2014181780A1 publication Critical patent/WO2014181780A1/fr
Priority to US15/193,505 priority patent/US20160303783A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336Coating a portion of the article, e.g. the edge of the article
    • B29C45/14434Coating brittle material, e.g. glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles

Definitions

  • the present invention relates to a cover glass for a display device.
  • Patent Document 1 Conventionally, for example, one in which a resin molded body is arranged around a glass plate is known (see, for example, Patent Document 1).
  • FIG. 5 is a perspective view showing a conventional cover glass for a display device.
  • 6 is a cross-sectional view taken along line AA in FIG.
  • a resin molded body 103 is disposed around the plate glass 102.
  • the plate glass 102 has a glass surface 102a facing a user (not shown) who uses the display device, and a glass side surface 102c continuous with the glass surface 102a.
  • a fluorine-containing organosilicon compound is used on the glass surface 102a.
  • a functional film 104 to be configured is disposed.
  • the resin molded body 103 is shaped to sandwich the outer edge of the plate glass 102, and covers the outer edge of the plate glass 102 with an adhesive 105 interposed therebetween.
  • the resin molded body 103 covers the outer edge of the plate glass 102 having the functional film 104 with an adhesive 105.
  • an interface 141 with the adhesive 105 is an interface with the adhesive 105.
  • the fluorine-containing organosilicon compound that generally constitutes the functional film 104 imparts functionality, water repellency, oil repellency, and the like.
  • the adhesive strength of the adhesive 105 at the interface 141 deteriorates over time, and defects occur in the bonding between the plate glass 102 and the resin molded body 103.
  • the cover glass 101 may be damaged. Further, even other functional films may adversely affect the adhesion between the plate glass 102 and the resin molded body 103.
  • the present invention has been made in view of the above points, and an object thereof is to provide a cover glass for a display device that can suppress a bonding defect between a plate glass and a resin molded body.
  • the cover glass for a display device includes a glass member having a glass surface on the user side using the display device, a glass side surface continuous with the glass surface, and a functional film provided on the glass surface.
  • a resin molded body provided around the glass member, the film surface of the functional film and the resin surface of the resin molded body are flush with each other, and between the glass side surface and the resin molded body It is the cover glass for display apparatuses in which the adhesive agent is provided.
  • a glass member is disposed in a mold for molding the resin molded body, the mold is clamped, and the glass member is sandwiched between the molds.
  • the cavity space Filling the cavity space with a resin by injecting a resin into a cavity space formed in at least a part of the periphery of the glass member by clamping the mold; and the cavity space Resin press molding while pressurizing the resin filled in with a predetermined resin compression pressure, and opening the mold clamped and taking out a glass resin integrated molded product, and the resin pressurization
  • a cover glass for a display device that can suppress a bonding defect between a plate glass and a resin molded body.
  • FIG. 2 is a sectional view taken along line AA in FIG. 1. It is sectional drawing which shows the cover glass for display apparatuses of 2nd Embodiment. It is sectional drawing which shows the cover glass for display apparatuses of 3rd Embodiment. It is a perspective view which shows the conventional cover glass for display apparatuses.
  • FIG. 6 is a cross-sectional view taken along line AA in FIG. It is front sectional drawing which shows one Embodiment of the manufacturing apparatus of a glass resin integrated molded product. It is a figure which shows the manufacture procedure of the glass resin integrated molded product using a glass resin integrated molded product manufacturing apparatus.
  • FIG. 1 is a perspective view showing a cover glass for a display device according to the first embodiment.
  • 2 is a cross-sectional view taken along line AA in FIG.
  • the display device cover glass 1 of the first embodiment is a glass resin integrated molded product in which a resin molded body 3 that is a frame is disposed around a plate glass 2 as a glass member.
  • the plate glass 2 has a glass surface 2a which is a user surface on the user (not shown) side who uses the display device, and a glass side surface 2c which is continuous with the glass surface 2a. Details will be described later on the glass surface 2a.
  • a functional film 4 is disposed.
  • a resin film such as polycarbonate may be bonded to the surface of the plate glass 2 opposite to the glass surface 2a to form a laminate of the plate glass 2 and the resin film.
  • the resin molded body 3 shown in FIG. 2 has a unique cross-sectional shape. That is, the resin molded body 3 has a resin surface 3a flush with the film surface 4a of the functional film 4, and a resin inner side surface 3d facing the glass side surface 2c. The resin molded body 3 is joined to the plate glass 2 by the resin inner side surface 3d coming into contact with the glass side surface 2c via the adhesive 5.
  • the plate glass 2 and the resin molded body 3 are integrated.
  • the resin molded body 3 is continuously formed around the plate glass 2 without a seam.
  • the tensile strength (based on ASTM-D638) of the resin molded body 3 is preferably 180 to 240 MPa, and more preferably 190 to 220 MPa.
  • the film surface 4a and the resin surface 3a are “same”. There is no step at the seam between the film surface 4a and the resin surface 3a.
  • the height difference between the film surface 4a and the resin surface 3a is preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, and no difference in level. A complete “evenness" is most preferred.
  • the glass side surface 2c and the resin inner side surface 3d are separated from each other by the adhesive 5 interposed therebetween, but as shown in FIG. 2, a portion forming the resin surface 3a in the resin molded body 3 However, it protrudes on the adhesive 5 and is in contact with the side surface of the functional film 4. For this reason, there is substantially no gap between the film surface 4a and the resin surface 3a.
  • the display device cover glass 1 in which there is no step at the joint between the film surface 4a and the resin surface 3a and no gap exists, allows the boundary between the film surface 4a and the resin surface 3a to be seamless to the user. For example, it can be obtained by the production method of the present invention described later.
  • the resin molded body 103 does not have a shape that covers the outer edge of the plate glass 102 as in the conventional cover glass 101 for a display device (see FIG. 6), the interface between the functional film 4 and the adhesive 5 Does not exist or very little is present. For this reason, it is prevented that the adhesive strength in the interface of the functional film 4 and the adhesive agent 5 falls and the joining defect of the plate glass 2 and the resin molding 3 is produced, and the possibility that the cover glass 1 for display devices may be damaged is reduced. it can.
  • the resin molded body 103 largely protrudes from the glass surface 102 a (functional film 104) of the plate glass 102. Therefore, an L-shaped depression (indicated by reference numeral 151 in FIG. 6) is formed at the boundary portion between the protruding portion and the plate glass 102 in the resin molded body 103 or at the boundary portion between the plate glass 102 and the functional film 104. In this recess 151, dust and dust tend to accumulate.
  • the film surface 4a of the functional film 4 and the resin surface 3a of the resin molded body 3 are flush with each other, and is denoted by reference numeral 151 in FIG. Such a problem that the dust is not formed and dust or dust tends to collect can be avoided.
  • the resin molded body 103 covers the plate glass 102 so as to sandwich it.
  • the display area becomes narrower than the size of the plate glass 102, and in order to enlarge the display area, a larger size of the plate glass 102 is necessary, and it is difficult to reduce the size and weight of the display device, and the cost increases.
  • the resin molded body 3 is not in a shape that sandwiches and covers the plate glass 2, so that the size of the plate glass 2 is, for example, that of the conventional display device cover glass 101.
  • the display area can be further enlarged, so that it is easy to reduce the size and weight, and it is possible to avoid an increase in cost due to increasing the size of the plate glass 2.
  • the boundary between the surface of the plate glass 2 and the resin molded body 3 is flush, a design with a sense of unity can be achieved.
  • FIG. 3 is a cross-sectional view illustrating a cover glass for a display device according to the second embodiment.
  • the same part as 1st Embodiment uses the same code
  • the wraparound portion 3e which is a part of the resin molded body 3 wraps around the glass back surface (main surface opposite to the glass surface 2a) 2b of the plate glass 2.
  • the display area is narrower than 1st Embodiment, the adhesion area with respect to the plate glass 2 by the adhesive agent 5 is expanded, and the joint defect of the plate glass 2 and the resin molding 3 is expanded. Occurrence can be further prevented.
  • Such a 2nd embodiment can be suitably adopted also from a viewpoint of securing the adhesion area by adhesive 5, for example, when plate glass 2 is comparatively thin.
  • the cover glass for display apparatuses of the said embodiment has the part (namely, wraparound part 3e which overlaps with the glass plate 2 by planar view) located below the glass back surface 2b of the plate glass 2 of the resin molding 3.
  • it can also be used as a bonding member as a seal part with a display device.
  • a resin composition that serves as an adhesive layer is supplied to a region surrounded by the glass back surface 2b of the plate glass 2 and the resin molded body 3 (a region indicated as 5 in FIG. 3). In this state, the sheet glass 2 and the resin molded body 3 can be easily bonded to the display device by laminating with a display device to be protected, such as a display, and curing the resin composition to be an adhesive layer.
  • the atmosphere for curing the resin composition may be normal pressure or under reduced pressure.
  • the atmosphere is changed to an atmosphere of higher pressure (for example, atmospheric pressure) after that, the pressure is increased in the direction in which the plate glass 2 and the display device are in close contact with each other, and the seal is sealed. Since the volume of the void portion remaining in the sealed space surrounded by the portion is reduced according to the differential pressure of the atmosphere, the decompression space in the sealed space sealed by the plate glass 2, the display device, and the seal portion More preferably, the resin composition flows and the entire sealed space is uniformly filled with the resin composition.
  • the seal portion is a portion that comes into contact with the display device when bonded to the display device, the seal portion may be formed of a softer resin than the resin molded body 3 other than the seal portion.
  • the lower part of the resin molded body 3 is formed of a softer resin than the upper part.
  • FIG. 4 is a cross-sectional view illustrating a cover glass for a display device according to a third embodiment.
  • the same part as 1st Embodiment uses the same code
  • the seal portion 6 is formed with a different resin separately below the resin molded body 3. Also in this case, the seal portion 6 is preferably formed of a softer resin than the resin molded body 3.
  • Glass member sheet glass
  • optical members such as a glass lens other than plate glass
  • the plate glass 2 is demonstrated below, as a glass member, it is not limited to this.
  • the plate glass 2 which is a glass member has the glass surface 2a, the glass side surface 2c, and the glass back surface 2b, the shape will not be limited, but a rectangle is preferable.
  • the rectangle is substantially a rectangle and includes a shape in which the corners of the peripheral portion are cut off (for example, a corner is cut).
  • the example of the rectangular plate glass was shown as one Embodiment, it is not limited to this.
  • a deformed glass whose one side is processed into a corrugated shape may be used.
  • Curved plate glass can also be used.
  • the size of the plate glass 2 is not limited.
  • the size of the main surface (glass surface 2a and glass back surface 2b) is preferably 10 mm ⁇ 30 mm to 1000 mm ⁇ 1600 mm, and 30 mm ⁇ 50 mm to 800 mm ⁇ 1000 mm. Is more preferable.
  • the thickness of the plate glass 2 (the length of the glass side surface 2c) is not particularly limited, but is preferably 0.5 to 10 mm, and more preferably 0.7 to 3 mm.
  • silane coupling agent vinyl group-containing silane coupling agent, styryl group-containing silane coupling agent, amino group-containing silane coupling agent, epoxy group-containing silane coupling agent, methacryloyloxy group-containing silane coupling agent, acryloyloxy A group-containing silane coupling agent or the like is used, and as the primer, a primer obtained by diluting a urethane resin, an acrylic resin, a silicone resin, an epoxy resin, or the like with a solvent can be used.
  • the manufacturing method of the plate glass 2 is not specifically limited, It can manufacture by a conventionally well-known method. For example, it can be manufactured by melting a conventionally known glass raw material to form a molten glass, and then forming it into a plate shape by a float method, a fusion method, a slot down draw method, a redraw method, a pulling method or the like.
  • the glass composition of the plate glass 2 is not specifically limited.
  • the plate glass 2 may be composed of a plurality of plate glasses laminated by heat fusion or the like. In that case, the glass compositions of the respective plate glasses may be the same or different from each other.
  • the plate glass 2 is a tempered glass subjected to a chemical tempering treatment. In that case, it is necessary to select a glass containing an alkali component, and soda lime glass and alkali aluminosilicate glass are preferable.
  • the chemical strengthening treatment is performed on the untreated plate glass.
  • a chemically strengthened layer in which a compressive stress is generated by the chemical strengthening treatment is formed, while the inner portion not subjected to the chemical strengthening treatment is relatively tensile. Stress is generated and a tensile stress layer is formed.
  • the depth of the chemical strengthening layer is, for example, 2 to 50 ⁇ m, and the compressive stress thereof is, for example, 50 to 900 MPa. Further, the tensile stress of the tensile stress layer is, for example, 20 to 100 MPa.
  • the chemical strengthening treatment generally includes an alkali component (for example, an alkali metal ion such as Li ion or Na ion, hereinafter also referred to as “small-diameter alkali component”) present in the plate glass, and an alkali component having a larger ion radius.
  • This is a so-called ion exchange treatment that is substituted with (for example, an alkali metal ion such as K ion, hereinafter also referred to as “large-diameter alkali component”).
  • Specific examples of the chemical strengthening treatment method include a method in which plate glass is immersed in a molten potassium nitrate (KNO3) salt for 15 minutes to 5 hours.
  • KNO3 molten potassium nitrate
  • the chemical strengthening treatment may include a preheat treatment for preheating using a heater or the like as a pretreatment for immersion. Examples of the temperature of the chemical strengthening treatment (including preheat treatment) include 550 ° C. or lower.
  • the tempered glass to which the chemical strengthening process was performed is cut
  • the cutting method is not particularly limited, and a known cutting method is used.
  • a method of cutting after cutting a cutting line with a diamond cutter, a method of cutting with a dicing apparatus, a laser cutting, etc. Can be mentioned.
  • the plate glass 2 obtained by being cut after the chemical strengthening treatment has one tensile stress layer between two compressive stress layers by cutting the end portion, and a cut surface (that is, a glass side surface). From 2c), the tensile stress layer is exposed.
  • chemical strengthening treatment may be performed after cutting (including after chamfering).
  • ⁇ Glass decoration> Arbitrary decoration may be given to the glass surface 2a of the plate glass 2 (or the opposite glass back surface 2b).
  • the pattern of decoration can be implemented arbitrarily, the pattern which forms a frame of frame shape with black or white, for example is mentioned.
  • Various methods can be used as the decoration method, and examples thereof include screen printing, pad printing, and gravure offset printing.
  • ⁇ End treatment of glass sheet> When plate glass is used as the glass member, the plate glass may have a chamfered portion at a corner between the glass surface and the glass side surface. In this case, the chamfering may be C chamfering or R chamfering. Moreover, handling of plate glass can be facilitated by using plate glass that has been chamfered in this way.
  • C chamfering is preferable as a form of a chamfering part.
  • C chamfering is preferable.
  • the flatness of the seam part of plate glass and a resin molding can be improved more compared with R chamfering.
  • the plate glass which does not give such an end surface process can also be used for plate glass. That is, after cutting into a predetermined size, it is possible to use a plate glass whose side surface, which is the cut surface, is untreated. Thereby, the burden of the pretreatment of the plate glass to be used can be reduced.
  • the functional film 4 can be composed of a fluorine-containing organosilicon compound. That is, the functional film 4 is formed by forming a film using a fluorine-containing organosilicon compound on the glass surface 2 a of the plate glass 2.
  • An arbitrary functional film layer (not shown) such as an antireflection film may be provided between the functional film 4 and the plate glass 2.
  • Any fluorine-containing organosilicon compound can be used without particular limitation as long as it imparts functionality, water repellency and oil repellency.
  • a fluorine-containing organosilicon compound for example, a fluorine-containing organosilicon compound having one or more groups selected from the group consisting of a perfluoropolyether group, a perfluoroalkylene group and a perfluoroalkyl group can be preferably used.
  • the perfluoropolyether group is a divalent group having a structure in which perfluoroalkylene groups and etheric oxygen atoms are alternately bonded.
  • fluorine-containing organosilicon compound having one or more groups selected from the group consisting of a perfluoropolyether group, a perfluoroalkylene group and a perfluoroalkyl group include the following general formulas (I) to (V): The compound etc. which are represented by these are mentioned.
  • Rf is a linear perfluoroalkyl group having 1 to 16 carbon atoms (alkyl group such as methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, etc.), and X is , A hydrogen atom or a lower alkyl group having 1 to 5 carbon atoms (for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, etc.), R1 is a hydrolyzable group (for example, amino group) An alkoxy group, etc.) or a halogen atom (for example, fluorine, chlorine, bromine, iodine, etc.), m is an integer of 1 to 50, preferably 1 to 30, n is an integer of 0 to 2, preferably 1 to 2, p Is an integer of 1 to 10, preferably 1 to 8.
  • Examples of the compound represented by the general formula (II) include n-trifluoro (1,1,2,2-tetrahydro) propylsilazane (n-CF 3 CH 2 CH 2 Si (NH 2 ) 3 ), n- Examples include heptafluoro (1,1,2,2-tetrahydro) pentylsilazane (nC 3 F 7 CH 2 CH 2 Si (NH 2 ) 3 ).
  • q ′ is an integer of 1 or more, preferably 1-20.
  • Examples of the compound represented by the general formula (III) include 2- (perfluorooctyl) ethyltrimethoxysilane (nC 8 F 17 CH 2 CH 2 Si (OCH 3 ) 3 ) and the like.
  • R f2 is — (OC 3 F 6 ) s — (OC 2 F 4 ) t — (OCF 2 ) u — (s, t and u are each independently an integer of 0 to 200)
  • R 2 and R 3 each independently represents a monovalent hydrocarbon group having 1 to 8 carbon atoms (for example, methyl group, ethyl group, n-propyl group). Group, isopropyl group, n-butyl group and the like.
  • X 2 and X 3 are independently hydrolyzable groups (for example, amino group, alkoxy group, acyloxy group, alkenyloxy group, isocyanate group and the like) or halogen atoms (for example, fluorine atom, chlorine atom, bromine atom, iodine)
  • D and e are independently an integer of 1 to 2
  • c and f are independently an integer of 1 to 5 (preferably 1 to 2)
  • a and b are independently 2 Or 3.
  • s + t + u is preferably 20 to 300, more preferably 25 to 100.
  • R 2 and R 3 are more preferably a methyl group, an ethyl group, or a butyl group.
  • the hydrolyzable group represented by X 2 or X 3 is more preferably an alkoxy group having 1 to 6 carbon atoms, particularly preferably a methoxy group or an ethoxy group. Further, a and b are each preferably 3.
  • v is an integer of 1 to 3
  • w, y and z are each independently an integer of 0 to 200
  • h is 1 or 2
  • i is an integer of 2 to 20.
  • X 4 is a hydrolyzable group
  • R 4 is a linear or branched hydrocarbon group having 1 to 22 carbon atoms
  • k is an integer of 0 to 2.
  • w + y + z is preferably 20 to 300, more preferably 25 to 100.
  • i is more preferably from 2 to 10.
  • X 4 is preferably an alkoxy group having 1 to 6 carbon atoms, more preferably a methoxy group or an ethoxy group.
  • R 4 is more preferably an alkyl group having 1 to 10 carbon atoms.
  • a fluorine-containing organosilicon compound having one or more groups selected from the group consisting of a perfluoropolyether group, a perfluoroalkylene group and a perfluoroalkyl group KP-801 (trade name, Shin-Etsu Chemical Co., Ltd.) KY178 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), KY185 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), OPT Tool (registered trademark) DSX and OPTOOL (trade name) (Registered trademark) AES (both trade names, manufactured by Daikin) and the like can be preferably used.
  • fluorine-containing organosilicon compounds are stored in a mixture with a solvent such as a fluorinated solvent in order to suppress deterioration due to reaction with moisture in the atmosphere. If the film is formed as it is, the durability of the obtained functional film 4 may be adversely affected. For this reason, in this invention, it is preferable to use the fluorine-containing organosilicon compound which performed the solvent removal process previously, or the fluorine-containing organosilicon compound which is not diluted with the solvent (namely, the solvent is not added).
  • the concentration of the solvent contained in the fluorine-containing organosilicon compound solution is preferably 1 mol% or less, more preferably 0.2 mol% or less.
  • a fluorine-containing organosilicon compound that does not contain a solvent.
  • the solvent used for storing the fluorine-containing organosilicon compound include perfluorohexane, metaxylene hexafluoride (C 6 H 4 (CF 3 ) 2 ), hydrofluoropolyether, HFE7200 / 7100 (trade name, manufactured by Sumitomo 3M Limited, HFE7200 is represented by C 4 F 9 C 2 H 5 , and HFE 7100 is represented by C 4 F 9 OCH 3 ).
  • the removal treatment of the solvent (solvent) from the fluorine-containing organosilicon compound solution containing the fluorine-based solvent can be performed, for example, by evacuating a container containing the fluorine-containing organosilicon compound solution.
  • the time for performing vacuum evacuation is not limited because it varies depending on the exhaust capacity of the exhaust line, the vacuum pump, etc., the amount of the solution, and the like.
  • a method for forming the functional film 4 in the present invention on the glass surface 2a of the plate glass 2 is not particularly limited, but it is preferable to form the functional film 4 by vacuum deposition using the above materials.
  • the solvent removal treatment is performed by evacuating the heating container at room temperature after introducing the fluorine-containing organosilicon compound solution into the heating container of the film forming apparatus for forming the functional film 4 and before raising the temperature. It can also be done. Further, the solvent can be removed beforehand by an evaporator or the like before being introduced into the heating container.
  • the fluorine-containing organosilicon compound having a small or no solvent content is likely to be deteriorated by contact with the atmosphere as compared with those containing a solvent.
  • storage containers for fluorine-containing organosilicon compounds with low (or no) solvent content should be replaced with an inert gas such as nitrogen and sealed, and exposed to the atmosphere when handled. It is preferable to shorten the contact time. Specifically, it is preferable to introduce the fluorine-containing organosilicon compound into the heating container of the film forming apparatus for forming the functional film 4 immediately after opening the storage container. And after introduction
  • inert gas such as nitrogen and a noble gas.
  • the storage container and the heating container are more preferably connected by a pipe with a valve so that the storage container (storage container) can be introduced into the heating container of the present manufacturing apparatus without coming into contact with the atmosphere. Then, after introducing the fluorine-containing organosilicon compound into the heating container and replacing the inside of the container with a vacuum or an inert gas, it is preferable to immediately start heating for film formation.
  • the functional film 4 may be formed by attaching a film or the like in addition to the film formation on the plate glass 2.
  • the thickness of the functional film 4 thus obtained is preferably 0.5 to 100 ⁇ m, more preferably 1 to 30 ⁇ m.
  • the adhesive 5 used in the present invention exhibits an adhesive force by being applied and cured on the glass side surface 2c of the plate glass 2 (in the case of the second embodiment, the edge of the glass back surface 2b). Although it contributes to joining with the resin molding 3, since the cover glass 1 for a display device is used for a display device such as a notebook PC, a tablet PC, or a smartphone, it does not have conductivity, and as much as possible. It is preferable to use a material having excellent insulating properties. Suitable examples of the material for the adhesive 5 include silicone-based, urethane-based, and epoxy-based adhesives having excellent adhesive strength, double-sided tapes, and the like. In this specification, the adhesive before curing and the adhesive after curing are simply referred to as “adhesive”.
  • the resin molded body 3 is bonded to the plate glass 2 via the adhesive 5, and the resin molded body 3 and the plate glass 2 are integrated to form the display device cover glass 1.
  • the material of the resin used as the resin molded body 3 since the display device cover glass 1 is used for a display device such as a notebook PC, a tablet PC, or a smartphone, it does not have electrical conductivity and is as excellent as possible in insulation.
  • a thermoplastic resin is preferably used.
  • the thermoplastic resin used in the present invention is not particularly limited as long as it can be integrally formed with the glass sheet 2 by melt molding.
  • thermoplastic polyester resins for example, polyethylene terephthalate resin, polybutylene terephthalate resin, etc.
  • liquid crystal polymers and crystalline resins (however, liquid crystal polymers are used from the viewpoint that they have excellent melt fluidity due to low shear stress, can be injected into the mold at low pressure, and are difficult to generate burrs. Is preferred).
  • the liquid crystal polymer (LCP) may be any liquid crystal polymer whose liquid crystal layer has a nematic, smectic or discotic structure, and is derived from an aromatic hydroxycarboxylic acid, an aromatic dicarboxylic acid, or an aromatic diol. It may have mainly repeating units.
  • a thermotropic liquid crystal polymer that can be melt-molded is preferable.
  • Rodrun LC-5000, LC-5000F, LC-5000H (trade names, manufactured by Unitika Ltd.), Zyder SRT-300, SRT -500, FSR-315, RC-210, FC-110, FC-120, FC-130 (trade names, made by Nippon Petrochemical Co., Ltd.), Econol E2000, Econol E6000 (trade names, made by Sumitomo Chemical Co., Ltd.) , EPE-240G30, Novacurate E322G30, E335G30 (trade names, manufactured by Mitsubishi Chemical), Vectra A950, Vectra A130, Vectra C130, Vectra A230, Vectra A410 (trade names, manufactured by Polyplastics), BIAC (Product) Name, Japan Gore-Tex), OCTA (product) , Manufactured by Dainippon Ink and Chemicals, Inc.), Zenite (trade name,
  • Crystalline resins include polyphenylene sulfide resin (PPS), polyethylene terephthalate resin (PET), polybutylene terephthalate resin (PBT), aromatic polyester resin, polyether ether ketone resin (PEEK).
  • PPS polyphenylene sulfide resin
  • PET polyethylene terephthalate resin
  • PBT polybutylene terephthalate resin
  • PEEK polyether ether ketone resin
  • Polyether nitrile resin PEN
  • polyamide resin nylon resin
  • polyamide resin for example, polyamide 6, polyamide 66, polyamide 11, polyamide 12, polyamide 46, polyamide 620, polyamide 612, polyamide MDX6, etc.
  • POM polyoxymethylene resin
  • polyethylene resin eg, low density polyethylene, medium density polyethylene, high density polyethylene, etc.
  • polypropylene resin polystyrene resin (eg, syndiotactic polystyrene) Etc.)
  • polybutene resins polymethyl pentene resins, fluorocarbon resins, and polyimide resins.
  • polyphenylene sulfide resin As the crystalline resin (excluding the liquid crystal polymer), polyphenylene sulfide resin, polyethylene terephthalate resin, polybutylene terephthalate resin, aromatic polyester resin, polyamide resin, polyoxymethylene resin, and polyimide resin are preferable, and polyphenylene sulfide resin is more preferable. preferable.
  • the resin forming the resin molded body 3 is a resin composition in which the thermoplastic resin is used as a base resin and a compound containing a hydroxy group and / or an epoxy group in the molecule is blended. .
  • the adhesiveness between the resin molded body 3 and the plate glass 2 can be greatly improved.
  • the compound containing a hydroxy group and / or an epoxy group is preferably a compound that does not foam or decompose when heated and melted with a thermoplastic resin.
  • a thermoplastic resin As the compound containing a hydroxy group in the molecule, various alcohols, polyvinyl alcohol, modified polyvinyl alcohols and copolymers, polyvinyl butyral, ethylene glycol, glycerin, phenol, phenol resin, and these were modified with epichlorohydrin or the like.
  • Examples thereof include compounds, phenoxy resins, hydroxyethyl (meth) acrylate (HEMA), natural polymers (for example, cellulose, cellulose derivatives, starch, chitin, chitosan, cyclodextrin, trehalose, palatinose, maltose, and the like).
  • HEMA hydroxyethyl acrylate
  • natural polymers for example, cellulose, cellulose derivatives, starch, chitin, chitosan, cyclodextrin, trehalose, palatinose, maltose, and the like.
  • glycidyl alcohol, a glycidyl (meth) acrylate, an epoxy resin etc. are mentioned as a compound containing an epoxy group in a molecule
  • the compound containing a hydroxy group and / or an epoxy group is preferably a polymer compound containing a hydroxy group or an epoxy group, and more preferably a resin containing a
  • the resin containing a hydroxy group is preferably a phenoxy resin, and the resin containing an epoxy group is preferably an epoxy resin.
  • the phenoxy resin include a bisphenol A type phenoxy resin, a bisphenol F type phenoxy resin, and a copolymer type phenoxy resin of bisphenol A and bisphenol F.
  • the mass average molecular weight (polystyrene conversion value by GPC measurement) of the phenoxy resin is preferably 10,000 to 200,000, and more preferably 20,000 to 100,000.
  • As the phenoxy resin a commercially available product can be selected.
  • PKHC, PKHH, PKHJ, PKHB, PKFE, PKHP (trade name, manufactured by InChem Corp.), YP-50, YP-50S, YP-55. , YP-70, FX239 (trade name, manufactured by Toto Kasei), Epicoat E1256, Epicoat E4250, Epicoat E4275 (trade name, manufactured by Union Carbide), UCAR, PKHC, PKHH (trade name, manufactured by Toto Kasei) ) Etc.
  • These may be used alone or in combination of two or more.
  • the hydroxy group content in the polymer compound having a hydroxy group is preferably from 0.01 to 23 mol / kg, more preferably from 0.1 to 15 mol / kg, and more preferably from 1 to 10 mol / kg. More preferred are molecules.
  • the particularly preferable range of the hydroxy group content is 3 to 7 mol / kg polymer (resin), and the most preferable range is 3 to 5 mol / kg polymer (resin). .
  • Epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins and other bisphenol type epoxy resins; phenol novolac type epoxy resins, o-cresol novolak type epoxy resins, biphenyl novolak type epoxy resins, etc. Novolac type epoxy resins; biphenyl type epoxy resins, naphthalene type epoxy resins, triphenylmethane type epoxy resins, dicyclopentadiene type epoxy resins, alicyclic epoxy resins and glycidyl ether type epoxy resins, glycidyl ester type epoxy resins, etc. An epoxy resin; etc. are illustrated. These may be used alone or in combination of two or more.
  • the epoxy resin as with the phenoxy resin, those having various physical properties are commercially available, and those suitable for the purpose can be selected and used suitably.
  • the mass average molecular weight (polystyrene conversion value by GPC measurement) of the epoxy resin is preferably 700 to 200,000, and more preferably 900 to 100,000.
  • the content of the epoxy group in the polymer compound having an epoxy group is preferably 0.01 to 10 mol / kg polymer, more preferably 0.1 to 8 mol / kg polymer.
  • the phenoxy resin and the epoxy resin may be used alone or in combination.
  • the compound instead of preparing a resin composition in which a compound containing a hydroxy group and / or an epoxy group is blended with a thermoplastic resin, the compound is previously grafted to the thermoplastic resin or modified with the compound. A hydroxy group and / or an epoxy group may be introduced into the thermoplastic resin.
  • the compounding amount of the compound containing a hydroxy group and / or the compound containing an epoxy group in the molecule is preferably 1 to 90 parts by weight with respect to 100 parts by weight of the thermoplastic resin. Part by mass is more preferable.
  • the compounding amount of the above compound is too small, sufficient adhesion between the resin composition and the plate glass 2 may not be obtained.
  • the compounding amount is too large, the basic resin of the thermoplastic resin as the base resin may not be obtained. The properties are hindered, and it may be difficult to obtain a high-strength resin molded body 3 itself, or the adhesiveness may rather deteriorate. If the blending amount is within this range, the resin composition and the plate glass 2 The resin molded body 3 has excellent strength.
  • a filler can be mix
  • the fibrous filler include inorganic fibers such as glass fibers, carbon fibers, potassium titanate fibers, aluminum borate fibers, and metal fibers; organic fibers such as aramid fibers, vinylon fibers, and hemp fibers.
  • fillers having various shapes such as powder, sphere, break, needle, and plate include silica, alumina, talc, clay, kaolin, aluminum hydroxide, magnesium hydroxide, and calcium carbonate.
  • the plate-like filler include mica and glass break.
  • the hollow filler include shirasu balloons, glass balloons, and various resin balloons. These fillers can be used alone or in combination of two or more.
  • the resin composition of the present invention further includes a colorant, a pigment, a heat stabilizer, an antioxidant, a stabilizer, an ultraviolet absorber, a compatibilizer, a dispersant, and a lubricant without departing from the object of the present invention.
  • a colorant e.g., a colorant, a pigment, a heat stabilizer, an antioxidant, a stabilizer, an ultraviolet absorber, a compatibilizer, a dispersant, and a lubricant without departing from the object of the present invention.
  • Mold release agents, and other additives can be blended.
  • a small amount of other thermoplastic resins can be blended.
  • the resin composition in the present invention can be prepared by various known methods. For example, a predetermined proportion of a thermoplastic resin, a compound containing a hydroxyl group and / or an epoxy group in the molecule, and, if necessary, a component such as a filler are premixed with a V-type blender or a Henschel mixer, and then extruded. The method of melt-kneading with a machine is mentioned. Also, each component can be individually supplied to an extruder and melt kneaded.
  • ⁇ Resin shape> With respect to the molded shape of the resin to be the resin molded body 3, it is possible to perform processing necessary for the applied device by designing the mold shape. For example, holes can be made for speakers, switch buttons, and terminals, a hook structure for assembling the main body side and the cover glass can be provided, or a beam structure for reinforcing the strength as a housing can be incorporated on the back side.
  • the surface of the resin to be the resin molded body 3 may be optionally decorated depending on the application and design. For example, by embossing the mold, the resin surface can be embossed.
  • an in-mold transfer foil may be inserted on the decorative surface side in the mold during resin molding, and decoration may be performed simultaneously with resin molding.
  • it can be painted by various printing methods after molding.
  • a method capable of three-dimensional decoration is preferable.
  • arbitrary decoration can be performed by inkjet printing, pad printing, screen printing, gravure offset printing, or the like.
  • the decorating layer of the resin surface and the glass surface of plate glass can be made into the same surface, it is preferable.
  • a method for producing a glass resin integrated molded product described below can be preferably cited. Therefore, in the following, first, a manufacturing apparatus for a glass resin integrated molded product used in a method for manufacturing a glass resin integrated molded product will be described.
  • FIG. 7 is a front cross-sectional view showing an embodiment of a manufacturing apparatus for a glass resin integrated molded product.
  • a glass resin integrated molded product manufacturing apparatus (glass resin integrated molded product manufacturing apparatus) 10 according to the present embodiment includes a mold 12, a mold clamping device (not shown) of the mold 12, An injection device (not shown) for injecting resin into the cavity space 14 formed by the clamped mold 12 and a control device (not shown) for overall control of the operation of the entire device are configured.
  • the mold 12 includes a movable mold 16 as a first mold disposed on the upper side in the vertical direction, and a fixed mold 18 as a second mold disposed on the lower side in the vertical direction. Configured.
  • the movable-side mold 16 has a nested structure, and a movable-side cavity block 20 that forms a space in which the resin material of the resin molded body 3 is injected, a movable-side mold 22 to which the movable-side cavity block 20 is attached, It is configured with.
  • the movable-side cavity block 20 has a rectangular parallelepiped shape, and includes a movable-side concave portion 20 ⁇ / b> A on a surface facing the fixed-side mold 18 (surface on the lower side in the vertical direction). 20 A of this movable side recessed part has a shape corresponding to the shape of the upper side (glass surface 2a side) when the cover glass 1 for display apparatuses which is a glass resin integrated molded product is divided into 2 parts up and down.
  • the plate glass 2 is mounted on the plate glass mounting surface 28A1 mentioned later.
  • the functional film 4 may or may not be formed in advance on the glass surface 2 a of the plate glass 2, but the shape of the movable side recess 20 ⁇ / b> A differs depending on the presence or absence of the functional film 4. That is, for example, when the plate glass 2 on which the functional film 4 is formed in advance is used, the shape of the movable side recess 20A is such that the surface in contact with the film surface 4a of the functional film 4 and the surface in contact with the resin surface 3a of the resin molded body 3 Is formed by a series of flat surfaces.
  • the shape of the movable recess 20A is such that the surface in contact with the glass surface 2a is thicker than the surface in contact with the resin surface 3a. Make the shape protruding by that much.
  • membrane surface 4a and the resin surface 3a are the same surface is obtained.
  • the movable-side mold 22 includes a movable-side cavity block mounting portion 22A for mounting the movable-side cavity block 20 on a surface facing the fixed-side mold 18 (surface on the lower side in the vertical direction).
  • the movable cavity block mounting portion 22A is configured as a recess into which the movable cavity block 20 can be fitted.
  • the movable-side cavity block 20 is mounted on the movable-side mold 22 by fitting into the movable-side cavity block mounting portion 22A and fixing the movable-side cavity block 20 to the movable-side mold 22 using fastening means (not shown).
  • the fixed mold 18 has a nested structure, and a fixed cavity block 24 that forms a space in which the resin material of the resin molded body 3 is injected, and the fixed cavity block 24 includes And a fixed mold 26 to be attached.
  • the fixed-side cavity block 24 has a rectangular parallelepiped shape, and includes a fixed-side recess 24 ⁇ / b> A on a surface facing the movable-side mold 16.
  • the fixed-side recess 24A has a shape corresponding to the shape on the lower side (the glass back surface 2b side) when the display device cover glass 1 which is a glass resin integrated molded product is divided into two vertically.
  • the fixed-side cavity block 24 is configured by nesting a plate glass holding block 28 (first movable portion) that holds the plate glass 2 and a cavity space forming block 30 that is a part that forms the cavity space 14. The This point will be described later.
  • the fixed-side mold 26 includes a fixed-side cavity block mounting portion 26A for mounting the fixed-side cavity block 24 on a surface facing the movable mold 16 (surface on the upper side in the vertical direction).
  • the fixed-side cavity block mounting portion 26A is configured as a recess into which the fixed-side cavity block 24 can be fitted.
  • the fixed-side cavity block 24 is mounted on the fixed-side mold 26 by fitting into the fixed-side cavity block mounting portion 26A.
  • the fixed-side cavity block 24 is configured by combining the plate glass holding block 28 and the cavity space forming block 30.
  • the plate glass holding block 28 includes a plate glass holding portion 28A and a base portion 28B.
  • the plate glass holding portion (glass member holding portion) 28A has an outer shape corresponding to the shape of the plate glass 2, and includes a plate glass placement surface 28A1 for placing the plate glass 2 on the upper side in the vertical direction.
  • the plate glass placement surface 28A1 is a flat surface.
  • the plate glass holding portion 28A includes a guide convex portion 28A2 on the lower side in the vertical direction.
  • the base portion 28B functions as a guide portion of the plate glass holding portion 28A, and includes a guide concave portion 28B1 into which the guide convex portion 28A2 of the plate glass holding portion 28A is fitted.
  • the plate glass holding portion 28A is supported so as to be movable in a direction along the mold clamping direction A of the mold 12 indicated by an arrow A in FIG. 7 by fitting the guide convex portion 28A2 to the guide concave portion 28B1.
  • the base portion 28B includes a plurality of glass holding pressure adjusting cylinders (glass holding pressure adjusting cylinders) 32 as glass holding pressure adjusting means. Each glass holding pressure adjusting cylinder 32 operates in synchronization, and moves the plate glass holding portion 28 ⁇ / b> A in a direction along the mold clamping direction of the mold 12.
  • the cavity space forming block 30 is configured by combining a hollow outer block 30A and a hollow inner block (second movable portion) 30B in a nested manner.
  • the outer block 30A has a cylindrical shape with a rectangular cross section, and the inner block 30B is slidably disposed in the hollow portion.
  • the cavity space forming block 30 is placed on the bottom surface of the fixed-side cavity block mounting portion 26A.
  • the outer block 30A is fixed.
  • the base 28B is placed on the bottom surface of the fixed-side cavity block mounting portion 26A. Accordingly, the base portion 28B is fixed, and the glass plate holding portion 28A can be moved using the glass holding pressure adjusting cylinder 32.
  • the stationary mold 26 is provided with a plurality of resin pressurizing cylinders 34 as resin pressurizing means.
  • Each resin pressurizing cylinder 34 operates in synchronization, and moves the inner block 30B of the cavity space forming block 30 in a direction along the mold clamping direction. Thereby, the volume of the cavity space 14 can be varied, and the resin filled in the cavity space 14 can be pressurized.
  • the inner block 30B is positioned at a “resin injection position” set at the time of resin injection, and is driven by the resin pressurizing cylinder 34 after the resin injection to set a “resin pressurization position”. To "".
  • This resin pressurization position is set to a position vertically above the resin injection position, and is set to a position where the volume of the cavity space 14 is reduced by a predetermined amount.
  • the mold 12 is configured as described above.
  • the plate glass 2 is placed on the plate glass placement surface 28 ⁇ / b> A ⁇ b> 1 and the mold 12 is clamped, the plate glass 2 is sandwiched between the fixed side mold 18 and the movable side mold 16.
  • a cavity space 14 is formed around the plate glass 2 in cooperation with the pressurization of the resin.
  • the plate glass holding portion 28 ⁇ / b> A of the plate glass holding block 28 on which the plate glass 2 is placed is provided to be movable independently of the cavity space forming block 30 by the glass holding pressure adjusting cylinder 32. For this reason, the pressure which acts on the plate glass 2 can be adjusted independently by moving the plate glass holding
  • the cavity space forming block 30 that forms the cavity space 14 is provided such that the inner block 30 ⁇ / b> B can be moved by the resin pressurizing cylinder 34. Therefore, the resin filled in the cavity space 14 can be pressurized by moving the cavity space forming block 30 by the resin pressurizing cylinder 34.
  • the resin is injected from the movable mold 16.
  • the movable mold 16 is provided with a sprue 36 and a gate 38 which are resin flow paths.
  • the resin injected into the sprue 36 through the injection device is injected into the cavity space 14 from the sprue 36 through the gate 38.
  • a mold clamping device (not shown) opens and closes the mold 12 by moving the movable mold 16 forward and backward with respect to the fixed mold 18.
  • the mold 12 is clamped by moving the movable mold 16 in a direction approaching the fixed mold 18, and the mold is moved by moving the movable mold 16 in a direction away from the fixed mold 18. 12 is opened.
  • the injection device (not shown) functions as a resin injection means, and injects resin into the cavity space 14 via the sprue 36 of the mold 12.
  • a control device controls the overall operation of the device. That is, the mold clamping device is controlled to control the opening and closing of the mold 12.
  • the injection device is controlled to control the injection of the resin.
  • the control device controls the resin pressurization cylinder 34 to control the pressurization of the resin filled in the cavity space 14 (that is, functions as a resin pressurization cylinder control means).
  • the control device controls the glass holding pressure adjusting cylinder 32 in cooperation with the resin pressurization by the resin pressurizing cylinder 34 to control the glass holding pressure acting on the plate glass 2 (that is, the glass holding pressure control). And function as cylinder control means for adjusting the glass holding pressure).
  • FIGS. 8A to 8F are diagrams showing a procedure for manufacturing the cover glass 1 for a display device, which is a glass resin integrated molded product, using the glass resin integrated molded product manufacturing apparatus 10.
  • the mold 12 in the initial state, the mold 12 is opened, and the movable mold 16 is positioned at a predetermined height from the fixed mold 18. Further, in this state, the inner block 30B provided in the fixed side mold 18 is located at the resin injection position.
  • the plate glass 2 is placed in the mold 12.
  • the plate glass 2 is placed on the plate glass placement surface 28 ⁇ / b> A ⁇ b> 1 of the plate glass holding block 28 provided in the fixed side mold 18 and placed on the mold 12.
  • the adhesive 5 is previously applied to the glass side surface 2c of the plate glass 2 (in the case of the second embodiment, it is also applied to the edge of the glass back surface 2b of the plate glass plate 2). And the plate glass 2 which has apply
  • the plate glass 2 used here even if it is the plate glass 2 in which the functional film 4 was previously formed on the glass surface 2a, the plate glass 2 in which the functional film 4 was not formed may be sufficient.
  • the shape of the movable side recess 20 ⁇ / b> A is varied.
  • the functional film 4 is formed in advance on the glass surface 2a of the plate glass 2, the functional film 4 is formed by, for example, forming a film on the glass surface 2a or pasting a film by the method described above. Keep it.
  • the movable side mold 16 is moved toward the fixed side mold 18 by a mold clamping device (not shown), and the mold 12 is clamped. Accordingly, the plate glass 2 is sandwiched between the fixed mold 18 and the movable mold 16, and a cavity space 14 is formed around the plate glass 2.
  • the glass holding pressure adjusting cylinder 32 is controlled so that the pressure acting on the plate glass 2 becomes a predetermined pressure, and the position of the plate glass holding portion 28A is controlled.
  • a resin is injected into the cavity space 14 by an injection device (not shown), and the cavity space 14 is filled with the resin.
  • the inner block 30B is moved to the resin pressurization position by the resin pressurizing cylinder 34, and the resin filled in the cavity space 14 is pressurized with a predetermined resin compression pressure. Press molding. Thereby, it is possible to prevent sink marks from occurring in the resin molded body 3.
  • the film surface 4a and the resin surface 3a are not produced at the joint between the film surface 4a and the resin surface 3a without causing a step or a gap.
  • the resin molded body 3 can be integrally formed around the plate glass 2 with an adhesive 5 interposed therebetween. Further, when the plate glass 2 on which the functional film 4 is not formed is used, the glass surface 2a is recessed from the resin main surface 3a by the thickness of the functional film 4 to be formed later, around the plate glass 2.
  • the resin molded body 3 can be integrally molded.
  • the position of the plate glass holding portion 28A is controlled by the glass holding pressure adjusting cylinder 32 in conjunction with the pressurization of the resin, and the pressure acting on the plate glass 2 is controlled to be within the specified range.
  • the upper limit within the specified range is set to a pressure lower than the pressure at which the glass plate 2 sandwiched between the fixed mold 18 and the movable mold 16 is cracked, and the lower limit of the specified range is the fixed side.
  • the pressure is set to be higher than the pressure at which positional deviation occurs in the glass sheet 2 sandwiched between the mold 18 and the movable mold 16.
  • the glass resin integrated molded product taken out becomes the display device cover glass 1 as it is.
  • the functional film 4 is formed on the glass surface 2a that is recessed from the resin main surface 3a to form the cover glass 1 for a display device.
  • a film may be formed or a film may be attached by the method described above.
  • the alignment can be used as a reference.
  • the fluorine-containing organosilicon compound solution described above may be poured onto the glass surface 2a that is a recess with respect to the surrounding resin main surface 3a.
  • the resin molded body 3 can be made to function as a mold for pouring, compared with the case where the plate glass 2 on which the functional film 4 is formed is used.
  • the workability when forming the functional film 4 is improved.
  • FIG. 9 is a conceptual diagram illustrating an example of pressure control of a sheet glass during resin pressurization.
  • a broken line L1 indicated by a solid line indicates a transition of pressure acting on the resin injected into the cavity space 14.
  • the broken line L2 shown as a continuous line has shown the transition of the pressure which acts on the plate glass 2 when pressure control is carried out.
  • T1 is a time when the injection of the resin into the cavity space 14 is started
  • T2 is a time when the injection of the resin into the cavity space 14 is completed
  • T3 starts the pressurization of the resin.
  • the time, T4, indicates the time when the pressurization is completed
  • T5 indicates the time when the mold is opened.
  • a region PB indicated by oblique lines with a narrow interval indicates a pressure region where cracks occur in the plate glass 2
  • a region PS indicated by oblique lines with a wide interval indicates a pressure region where positional deviation occurs in the plate glass 2.
  • the displacement occurs when the pressure becomes lower than the pressure acting on the resin at the completion of injection (that is, the pressure acting on the resin at time T2).
  • the pressure acting on the plate glass 2 is controlled so as not to fall within the range of the region PB and the region PS, including when the resin is pressurized. In the example shown in FIG. 9, it controls so that the plate glass 2 is also pressurized at the time of resin pressurization.
  • the range is a pressure range in which the plate glass 2 is not cracked (that is, a range that does not enter the region PB).
  • the broken line L3 shown with a broken line has shown the transition of the pressure which acts on the plate glass 2 when pressure control is not carried out. If the pressure acting on the plate glass 2 is not controlled when the resin is pressurized, the pressure acting on the plate glass 2 increases as the resin is pressurized, and the plate glass 2 is cracked.
  • FIG. 10 is a conceptual diagram showing another example of pressure control of the plate glass during resin pressurization.
  • a broken line L4 indicated by a solid line indicates a transition of pressure acting on the resin injected into the cavity space.
  • the broken line L5 shown with a continuous line has shown the transition of the pressure which acts on the plate glass 2 when pressure control is carried out.
  • control is performed so that the pressure acting on the plate glass 2 during resin pressurization is reduced.
  • the range to be reduced is a pressure range in which positional deviation does not occur (that is, a range that does not enter the region PS).
  • the broken line L6 shown with a broken line has shown the transition of the pressure which acts on the plate glass 2 when pressure control is not carried out. If the pressure acting on the plate glass 2 is not controlled when the resin is pressurized, the pressure acting on the plate glass 2 increases as the resin is pressurized, and the plate glass 2 is cracked.
  • a mode in which the pressure is increased and a mode in which the pressure is lowered there are two modes of controlling the pressure acting on the plate glass 2 when the resin is pressurized, that is, a mode in which the pressure is increased and a mode in which the pressure is lowered.
  • Which mode is selected is determined in consideration of the viscosity of the resin to be used. That is, if the viscosity of the resin used is high, a high pressure is already applied to the plate glass 2 before the resin pressurization. In such a case, the pressure applied to the plate glass 2 during the resin pressurization is controlled to decrease. To do. Thereby, it can prevent effectively that the plate glass 2 is broken.
  • FIG. 11 is a front cross-sectional view showing a modification of the glass resin integrated molded product manufacturing apparatus.
  • the glass resin integrated molded product manufacturing apparatus 10 has different glass holding pressure adjusting means and resin pressing means. Therefore, only the configuration of the glass holding pressure adjusting means and the resin pressurizing means will be described here.
  • the base portion 28 ⁇ / b> B of the plate glass holding block 28 is provided with a plurality of glass holding pressure adjusting springs 62 as glass holding pressure adjusting means.
  • the glass holding pressure adjusting spring 62 biases the plate glass holding portion 28A toward the movable mold 16 (that is, biases vertically upward).
  • the stationary mold 26 is provided with a plurality of resin pressing springs 64 as resin pressing means.
  • Each resin pressurizing spring 64 urges the outer block 30A of the cavity space forming block 30 toward the movable mold 16 (that is, urges vertically upward).
  • the outer block 30 ⁇ / b> A is biased by the resin pressurizing spring 64, the outer block 30 ⁇ / b> A contacts the movable cavity block 20 of the movable mold 16. Thereby, the cavity space 14 is formed around the plate glass 2.
  • resin is injected into the cavity space 14 by an injection device (not shown), and the cavity space 14 is filled with resin.
  • the movable mold 16 is moved toward the fixed mold 18. That is, the mold 12 is further clamped. Thereby, the clearance gap formed between the movable side mold 22 and the stationary side mold 26 at the time of previous mold clamping is closed.
  • the outer block 30A When the mold 12 is further clamped, the outer block 30A is pushed by the movable mold 16 against the urging force of the resin pressurizing spring 64 and moves downward in the vertical direction. As a result, the inner block 30B is relatively extended to the cavity space 14, and the volume of the cavity space 14 decreases. Thereby, the resin filled in the cavity space 14 is pressurized.
  • the resin when the resin is pressurized in this way, a high pressure acts on the plate glass 2, but the plate glass holding portion 28 ⁇ / b> A that holds the plate glass 2 is supported movably while being urged by the glass holding pressure adjusting spring 62. Therefore, the pressure which acts at the time of pressurization can be released. Thereby, it can prevent that a crack arises in the plate glass 2.
  • the glass holding pressure adjusting spring 62 serves to release the pressure acting on the plate glass 2 when the resin is pressed, and therefore the spring force is larger than the spring force of the resin pressing spring 64.
  • the spring force is set weakly. Further, if the spring force is too weak, a positional deviation occurs in the plate glass 2, so that it is set to a spring force capable of applying a pressure that does not cause a positional deviation in the plate glass 2.
  • the pressurization is continuously performed for a predetermined time, and then the mold 12 is opened, and the glass resin integrated molded product to be the display device cover glass 1 is taken out. The manufacturing of the glass resin integrated molded product is completed through the series of steps described above.
  • the resin pressurizing means for pressurizing the resin and the glass holding pressure adjusting means for adjusting the pressure acting on the plate glass 2 can be constituted by the spring, and the same operational effects can be achieved.
  • both the resin pressurizing means and the glass holding pressure adjusting means are constituted by springs, but either one may be constituted by a cylinder.
  • the resin pressurizing means and the glass holding pressure adjusting means can also be constituted by, for example, a motor and a moving mechanism using a feed screw.
  • the type of the spring is not particularly limited.
  • a coil spring or a disc spring can be used. When a disc spring is used, the spring force can be adjusted by adjusting the number of disc springs.
  • the cover glass 1 for a display device is suppressed from causing a bonding defect between the plate glass 2 and the resin molded body 3 and can reduce the risk of breakage. It can also be suitably used as a cover glass for devices, specifically notebook PCs, tablet PCs, smartphones, and other various display devices.
  • the cover glass for display apparatuses which can suppress the joint defect of plate glass and a resin molding can be provided.
  • This cover glass is a cover glass of display apparatuses, such as a notebook PC, a tablet PC, a smart phone, and other mobile devices.
  • a cover glass of display apparatuses such as a notebook PC, a tablet PC, a smart phone, and other mobile devices.
  • SYMBOLS 1 Cover glass for display apparatuses 2 ... Plate glass (glass member) 2a ... glass surface 2b ... glass back surface 2c ... glass side surface 3 ... resin molded body 3a ... resin surface 3d ... resin inner side surface 3e ... wraparound part 4 ... functional film 4a ... film surface 5 ... adhesive 6 ... seal part 10 ... glass resin Integral molded product manufacturing apparatus 12 ... Mold 14 ... Cavity space 16 ... Movable side mold 18 ... Fixed side mold 20 ... Movable side cavity block 20A ... Movable side recess 22 ... Movable side mold 22A ... Movable side cavity block mounting part 24 ... Fixed side cavity block 24A ... Fixed side recess 26 ...
  • Fixed side mold 26A Fixed side cavity block mounting part 28A ... Plate glass holding block (first movable part) 28A1 ... Plate glass mounting surface 28A2 ... Guide convex part 28B ... Base part 28B1 ... Guide concave part 30 ... Cavity space forming block 30A ... Outer block 30B ... Inner block (second movable part) 32 ... Glass holding pressure adjusting cylinder 34 ... Resin pressurizing cylinder 36 ... Sprue 38 ... Gate 62 ... Glass holding pressure adjusting spring 64 ... Resin pressurizing spring 101 ... Conventional display cover glass 102 ... Plate glass 102a ... Glass surface 102c ... Glass side surface 103 ... Resin molded body 104 ... Functional film 105 ... Adhesive 141 ... Interface 151 ... Indentation

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Abstract

L'invention concerne un verre couvre-objet pour dispositifs d'affichage, dont les défauts de collage sont supprimés entre une plaque de verre et un corps en résine moulée. Ce verre couvre-objet pour dispositifs d'affichage comprend : un élément en verre (2) ayant une surface de verre (2a) sur le côté utilisateur d'un dispositif d'affichage et une surface de verre latérale (2c) qui se prolonge vers la surface de verre ; un film fonctionnel (4) placé sur la surface de verre ; et un corps en résine moulée (3) placé autour de l'élément en verre. La surface de film (4a) du film fonctionnel (4) et une surface en résine (3a) du corps en résine moulée (3) sont sur le même plan, et un adhésif (5) est placé entre la surface de verre latérale et le corps en résine moulée.
PCT/JP2014/062192 2013-05-07 2014-05-02 Verre couvre-objet pour dispositifs d'affichage WO2014181780A1 (fr)

Priority Applications (7)

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KR1020167014357A KR20160102975A (ko) 2013-12-27 2014-11-05 유리 수지 일체 성형품의 제조 방법 및 장치
CN201480070969.4A CN105992684B (zh) 2013-12-27 2014-11-05 玻璃树脂一体成形品的制造方法及装置
PCT/JP2014/079363 WO2015098300A1 (fr) 2013-12-27 2014-11-05 Procédé et dispositif permettant la production d'article en verre-résine moulé d'une seule pièce
EP14874637.3A EP3088154A4 (fr) 2013-12-27 2014-11-05 Procédé et dispositif permettant la production d'article en verre-résine moulé d'une seule pièce
JP2015554647A JPWO2015098300A1 (ja) 2013-12-27 2014-11-05 ガラス樹脂一体成形品の製造方法及び装置
TW103138535A TW201532780A (zh) 2013-12-27 2014-11-06 玻璃樹脂一體成形品之製造方法及裝置
US15/193,505 US20160303783A1 (en) 2013-12-27 2016-06-27 Method and device for producing integrally molded glass-resin article

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JP2013097819A JP2016136164A (ja) 2013-05-07 2013-05-07 表示装置用カバーガラス
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WO2016194323A1 (fr) * 2015-05-29 2016-12-08 シャープ株式会社 Appareil électronique et son procédé de fabrication
JP2017181610A (ja) * 2016-03-29 2017-10-05 日本精機株式会社 表示装置
WO2018194103A1 (fr) * 2017-04-19 2018-10-25 Agc株式会社 Élément de protection et dispositif d'affichage
CN110335539A (zh) * 2019-06-10 2019-10-15 无锡小天鹅电器有限公司 显示屏以及电器

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JP2011017736A (ja) * 2009-07-07 2011-01-27 Casio Computer Co Ltd 表示装置
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JP2009086073A (ja) * 2007-09-28 2009-04-23 Hitachi Displays Ltd 液晶表示装置
JP2011017736A (ja) * 2009-07-07 2011-01-27 Casio Computer Co Ltd 表示装置
WO2012029347A1 (fr) * 2010-09-03 2012-03-08 アルプス電気株式会社 Composite en verre, appareil électronique mettant en œuvre celui-ci, et dispositif d'entrée
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WO2016194323A1 (fr) * 2015-05-29 2016-12-08 シャープ株式会社 Appareil électronique et son procédé de fabrication
JPWO2016194323A1 (ja) * 2015-05-29 2017-10-26 シャープ株式会社 電子機器及びその製造方法
JP2017181610A (ja) * 2016-03-29 2017-10-05 日本精機株式会社 表示装置
WO2018194103A1 (fr) * 2017-04-19 2018-10-25 Agc株式会社 Élément de protection et dispositif d'affichage
JPWO2018194103A1 (ja) * 2017-04-19 2020-02-27 Agc株式会社 カバー部材および表示装置
CN110335539A (zh) * 2019-06-10 2019-10-15 无锡小天鹅电器有限公司 显示屏以及电器

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