WO2014180061A1 - 一种基板加工装置 - Google Patents

一种基板加工装置 Download PDF

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Publication number
WO2014180061A1
WO2014180061A1 PCT/CN2013/078512 CN2013078512W WO2014180061A1 WO 2014180061 A1 WO2014180061 A1 WO 2014180061A1 CN 2013078512 W CN2013078512 W CN 2013078512W WO 2014180061 A1 WO2014180061 A1 WO 2014180061A1
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Prior art keywords
substrate
processing device
reverse
motor
clamping
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PCT/CN2013/078512
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English (en)
French (fr)
Inventor
贾胡平
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深圳市华星光电技术有限公司
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Priority to US13/983,644 priority Critical patent/US20170186630A1/en
Publication of WO2014180061A1 publication Critical patent/WO2014180061A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the invention belongs to the field of manufacturing technology of liquid crystal flat panel display, and particularly relates to a basic device. Background technique
  • the machining sequence is substantially the first knife alignment (step S1) ⁇ the first knife cutting (step S2) ⁇ the first knife returning knife (step S3) ⁇ the second knife alignment (step S34) ⁇
  • Each knife is aligned once to ensure cutting accuracy.
  • the way in which each knife is cut once is a lot of man-hours.
  • a substrate processing apparatus wherein the substrate processing apparatus is configured to perform a cutting process on a substrate, and the substrate processing apparatus includes a clamping component for clamping a substrate and is mounted thereon
  • the support assembly of the substrate, the clamping assembly and the support assembly each have a drive source.
  • the clamping assembly has a chuck and a first motor that drives the chuck.
  • the first motor is a linear servo motor.
  • the support assembly has a synchronous belt transmission mechanism that carries the substrate and a second motor that drives the timing belt transmission mechanism.
  • the second motor is a stepping motor.
  • the timing belt transmission mechanism includes a transmission wheel and a timing belt mounted on the transmission wheel.
  • the width of the timing belt is equal to the width of the substrate.
  • the substrate processing apparatus further includes a controller, the controller is used for a driving source of the clamping assembly and a driving source of the supporting assembly, such that the clamping assembly and the support The components move synchronously during the machining process.
  • the substrate is a glass substrate.
  • the reverse is a glass reverse for a liquid crystal television.
  • the substrate processing apparatus includes a processing tool for performing a cutting process on the substrate.
  • the processing tool is a machining tool.
  • the processing tool is a laser laser head.
  • the beneficial effects of the present invention are: base according to the present invention.
  • the substrate processing apparatus includes a clamping assembly for clamping a substrate and a support assembly for mounting the substrate, and the clamping assembly and the support assembly each have a driving source, thereby Driving the clamping assembly and the supporting assembly to move synchronously by the driving source of the clamping assembly and the supporting assembly, so that the substrate is stationary relative to the supporting assembly, and only one alignment is needed during the processing, without Each time a knife is aligned, the machining time can be saved.
  • Figure 1 is a schematic view showing the structure of a specific embodiment of a counter-processing apparatus according to the present invention.
  • FIG. 2 is a schematic block diagram showing the electrical structure of the counter-processing apparatus of Figure 1.
  • Figure 3 is a diagram of the use of Figure _3 ⁇ 4 ⁇ .
  • Figure 4 is a flow chart of a portion of a reverse machining process performed using a conventional counter processing apparatus.
  • the basic device of the present invention includes a clamping assembly 300 for holding the substrate 100 and a support assembly 200 for mounting the substrate 100, the clamping assembly 300 and the support assembly 200 each having a driving source .
  • the anti-100 may be, for example, a glass reverse for a liquid crystal television.
  • the clamping assembly 300 has a chuck 302 and a first motor 310 that drives the chuck 302.
  • the support assembly 200 has a timing belt transmission mechanism that carries the substrate 100 and a second motor 210 that drives the timing belt transmission mechanism.
  • a processing tool 102 eg, a machining tool or laser laser head, etc.
  • the timing belt transmission mechanism includes a transmission wheel 202 and a timing belt 204 mounted on the transmission wheel 202.
  • the width of the timing belt 204 can be comparable to the width of 100.
  • the drive wheel 202 is rotatable in the rotational direction R in the illustrated embodiment to cause the _ ⁇ 100 to translate.
  • the first motor 310 is a linear servo motor (Linear Servo Motor)
  • the second motor 210 is a stepping motor (Stepping Motor).
  • the base device may further include a controller 10.
  • the controller 10 is used for a driving source (the first motor 310) of the clamping assembly 300 and a driving source (second motor 210) of the supporting assembly 200 such that the clamping assembly 300 and the supporting assembly The 200 moves synchronously during machining to ensure that the _3 ⁇ 4 ⁇ reverse 100 remains stationary relative to the drive face of the timing belt 204 of the support assembly 200. That is, when the first motor 310 drives the chuck 302 holding the substrate 100 to move in the translational direction X, the transmission wheel 202 rotates synchronously in the rotational direction R, which is maintained relative to the transmission surface of the timing belt 204 of the support assembly 200.
  • the substrate is a glass substrate.
  • the basic device of the present invention adopts a structure in which the clamping assembly 300 and the supporting assembly 200 have a driving source at the same time, and the chuck 302 is clamped to the reverse 100 and then synchronized with the synchronous belt 204, and the reverse 100 is on the synchronous belt 204.
  • the formation is relatively static, and the relative jitter and movement deviation of the substrate 100 are reduced during the movement, and the transmission accuracy is improved.
  • the substrate processing apparatus of the present invention has a transmission accuracy error of about 40 um.
  • the processing sequence may be substantially the first knife alignment (step S1) ⁇ the first knife cutting (step S2) ⁇ the first knife returning knife (step S3) ⁇ The second knife cut (step S4) ⁇ the second knife return knife (step S5), and is repeated accordingly.
  • the processing sequence may be substantially the first knife alignment (step S1) ⁇ the first knife cutting (step S2) ⁇ the first knife returning knife (step S3) ⁇
  • it is not necessary to align once for each cutting and the alignment of the processing tool 102 and the specified position on the substrate 100 after the completion of the first machining can be omitted until the processing ends.
  • the substrate processing apparatus of the present invention adopts a transmission method with high transfer precision, and in the process of cutting the mantle, only one alignment is required, and the cutting operation of one substrate can be completed, thereby saving the time of multiple alignments. , speed up the processing rhythm and indirectly increase production capacity.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

一种基板加工装置。其中，所述基板加工装置包括用于夹持基板（100）的夹持组件（300）及用于载置所述基板（100）的支承组件（200），所述夹持组件（300）与所述支承组件（200）均具有驱动源。根据所述基板加工装置，所述夹持组件（300）与所述支承组件（200）均具有驱动源，由此，可以通过所述夹持组件（300）与所述支承组件（200）各自的驱动源，驱动所述夹持组件（300）与所述支承组件（200）同步运动，使得基板（100）相对于支承组件（200）静止，在加工过程中无需每切割一刀对位一次，能够节省加工时间。

Description

一种 加工装置 技术领域
本发明属于液晶平板显示的制造技术的领域， 尤其涉及一种基^ ^工装置。 背景技术
目前， 液晶电视、 液晶电脑等平板显示器越来越受到大众的欢迎。 在平板显 示器的制造产业的薄膜晶体管的制程（TFT process ) 中， 需要对玻璃 反进行镭 射切割等加工。 传统的切割方式中， 通过卡盘（Chuck )将基板 ( Substrate )或条 带（Strip ) 夹持， 并放置在无动力驱动的辊子（Roller )上。 在该切割方式中， 如 图 4所示， 加工顺序大致为第一刀对齐（步骤 S1 ) →第一刀切割 （步骤 S2 ) →第 一刀回刀 （步骤 S3 ) →第二刀对齐（步骤 S34 ) →第二刀切割 （步骤 S4 ) →第二 刀回刀 （步骤 S5 ), 依此重复。 每切割一刀对位一次， 以保证切割精度。 然而， 每 切割一刀对位一次的方式， 会耗费大量工时。 发明内容
本发明的目的在于， 提供一种基 ^^工装置， 其无需每切割一刀对位一次， 能够节省加工时间。
本发明通过如下技术方案实现： 一种基板加工装置， 其中， 所述基板加工装 置用于对基板进行切割加工， 对所述基板加工装置包括用于夹持基板的夹持组件 及用于载置所述基板的支承组件， 所述夹持组件与所述支承组件均具有驱动源。
作为上述技术方案的进一步改进， 所述夹持组件具有卡盘及驱动卡盘的第一 电机。
作为上述技术方案的进一步改进， 所述第一电机为线性伺服电机。
作为上述技术方案的进一步改进， 所述支承组件具有承载所述基板的同步皮 带传动机构及驱动所述同步皮带传动机构的第二电机。
作为上述技术方案的进一步改进， 所述第二电机为步进电机。
作为上述技术方案的进一步改进， 所述同步皮带传动机构包括传动轮及架设 在所述传动轮上的同步皮带。
作为上述技术方案的进一步改进， 所述同步皮带的宽度与基板的宽度相等。 作为上述技术方案的进一步改进， 所述基板加工装置还包括控制器， 所述控 制器用于所述夹持组件的驱动源和所述支承组件的驱动源， 使得所述夹持组件与 所述支承组件在加工过程中同步运动。
作为上述技术方案的进一步改进， 所述基板为玻璃基板。
作为上述技术方案的进一步改进， 所述 反为用于液晶电视的玻璃 反。 作为上述技术方案的进一步改进， 所述基板加工装置包括加工工具， 所述加 工工具用于对基板进行切割加工。
作为上述技术方案的进一步改进， 所述加工工具为加工刀具。
作为上述技术方案的进一步改进， 所述加工工具为激光镭射头。
本发明的有益效果是： 根据本发明的基^ ^。工装置， 所述基板加工装置包括 用于夹持基板的夹持组件及用于载置所述基板的支承组件， 且所述夹持组件与所 述支承组件均具有驱动源， 由此， 可以通过所述夹持组件与所述支承组件各自的 驱动源， 驱动所述夹持组件与所述支承组件同步运动， 使得基板相对于支承组件 静止， 在加工过程中仅需进行一次对位， 无需每切割一刀对位一次， 能够节省加 工时间。
附图说明
图 1是根据本发明的 反加工装置的一个具体实施例的结构示意图。
图 2是图 1的 反加工装置的电气结构示意框图。
图 3是利用图 1的_¾^。工装置进行的 反加工工艺的一部分的流程图。 图 4是利用传统 反加工装置进行的 反加工工艺的一部分的流程图。
具体实施方式
以下结合附图对本发明的具体实施方式进行进一步的说明。
本发明的基^ ^工装置包括用于夹持基板 100的夹持组件 300及用于载置所 述基板 100的支承组件 200,所述夹持组件 300与所述支承组件 200均具有驱动源。 在本实施例中， 其中， 所述 反 100例如可以为用于液晶电视的玻璃 反。
如图 1和图 2所示， 所述夹持组件 300具有卡盘 302及驱动卡盘 302的第一 电机 310。所述支承组件 200具有承载所述基板 100的同步皮带传动机构及驱动所 述同步皮带传动机构的第二电机 210。在进行切割等加工的初始， 安装在机台上的 加工工具 102 (例如加工刀具或激光镭射头等）与基板 100上的加工位置对齐。 同步皮带传动机构包括传动轮 202及架设在所述传动轮 202上的同步皮带 204。 同步皮带 204的宽度可以与 100的宽度相当。 传动轮 202在图示实施例 中可沿转动方向 R旋转， 带动 _Ϊ 100平移。 且本实施例中， 所述第一电机 310 为线性伺服电机（Linear Servo Motor ), 所述第二电机 210为步进电机（Stepping Motor )。
此外， 如图 2所示， 本实施例中， 所述基^ ^工装置还可以包括控制器 10。 所述控制器 10用于所述夹持组件 300的驱动源 （第一电机 310 )和所述支承组件 200的驱动源 （第二电机 210 ), 使得所述夹持组件 300与所述支承组件 200在加 工过程中同步运动， 从而保证_¾ ^反 100相对于支承组件 200的同步皮带 204的传 动面保持静止。即，在第一电机 310驱动夹持有基板 100的卡盘 302沿平移方向 X 运动时， 传动轮 202沿转动方向 R同步旋转， ^反 100相对于支承组件 200的同 步皮带 204的传动面保持静止。 所述基板为玻璃基板。
本发明的基^ ^工装置采用夹持组件 300与支承组件 200同时具有驱动源的 结构， 卡盘 302夹取 ^反 100后随同步皮带 204—起同步运行， ^反 100在同步 皮带 204上形成了相对静止， 并且移动过程中降低了基板 100的相对抖动以及移 动偏差， 提高了传送精度。 例如， 在本发明的一个具体实施例中， 本发明的基板 加工装置的传送精度误差达到士 40um左右。
在利用本发明的基板加工装置进行切割等加工时， 如图 3 所示， 加工顺序可 以大致为第一刀对齐（步骤 S1 )→第一刀切割（步骤 S2 )→第一刀回刀（步骤 S3 ) →第二刀切割 （步骤 S4 ) →第二刀回刀 （步骤 S5 ), 依此重复。 与传统加工方式 相比， 无需每切割一刀对位一次， 可省去第一刀加工完成之后的加工工具 102与 基板 100上规定位置的对齐， 直至加工结束。
如上所述， 本发明的基板加工装置采用传送精度高的传送方式， 在切割地鞛 加工过程中， 只需要进行一次对位， 即可完成一块基板的切割动作， 从而节省多 次对位的时间， 加快加工节奏， 间接增加产能。
以上具体实施方式对本发明进行了详细的说明， 但这些并非构成对本发明的 限制。 本发明的保护范围并不以上述实施方式为限， 但凡本领域普通技术人员根 据本发明所揭示内容所作的等效修饰或变化， 皆应纳入权利要求书中记载的保护 范围内。

Claims

权 利 要 求 书
1、 一种基板加工装置， 其中， 所述基 ^l口工装置用于对基板进行切割加工， 对所述基板加工装置包括用于夹持基板的夹持组件及用于载置所述基板的支承组 件， 所述夹持组件与所述支承组件均具有驱动源。
2、 根据权利要求 1所述的 反加工装置， 其中， 所述夹持组件具有卡盘及驱 动卡盘的第一电机。
3、 根据权利要求 2所述的基板加工装置， 其中， 所述第一电机为线性伺服电 机。
4、 根据权利要求 1所述的基板加工装置
Figure imgf000007_0001
所述支承组件具有承载所述 勾的第二电机。
5、 根据权利要求 4所述的 口工装置， 其中 所述第二电机为步进电机。
6、 根据权利要求 4所述的 反加工装置， 其中： 所述同步皮带传动机构包括 传动轮及架设在所述传动轮上的同步皮带。
7、 根据权利要求 6所述的 反加工装置， 其中， 所述同步皮带的宽度与 反 的宽度相等。
8、 根据权利要求 1所述的 反加工装置， 其中， 所述 口工装置还包括控 制器， 所述控制器用于所述夹持组件的驱动源和所述支承组件的驱动源， 使得所 述夹持组件与所述支承组件在加工过程中同步运动。
9、 根据权利要求 1所述的 反加工装置， 其中， 所述 ^反为玻璃 ^反。
10、 根据权利要求 1 所述的 加工装置， 其中， 所述 反为用于液晶电视 的玻璃 1 。
11、 根据权利要求 1 所述的 反加工装置， 其中， 所述 ^反加工装置包括加 工工具， 所述加工工具用于对基板进行切割加工。
12、根据权利要求 11所述的基板加工装置， 其中， 所述加工工具为加工刀具。
13、 根据权利要求 11所述的 反加工装置， 其中， 所 工工具为激光镭射 头。
PCT/CN2013/078512 2013-05-10 2013-06-29 一种基板加工装置 WO2014180061A1 (zh)

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