WO2014166215A1 - 一种手持电子设备、支撑组件及支撑组件的制作方法 - Google Patents

一种手持电子设备、支撑组件及支撑组件的制作方法 Download PDF

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Publication number
WO2014166215A1
WO2014166215A1 PCT/CN2013/084529 CN2013084529W WO2014166215A1 WO 2014166215 A1 WO2014166215 A1 WO 2014166215A1 CN 2013084529 W CN2013084529 W CN 2013084529W WO 2014166215 A1 WO2014166215 A1 WO 2014166215A1
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WIPO (PCT)
Prior art keywords
support
amorphous alloy
support assembly
appearance
structural support
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Application number
PCT/CN2013/084529
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English (en)
French (fr)
Inventor
朱爱兰
杨明星
Original Assignee
华为技术有限公司
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP13876083.0A priority Critical patent/EP2814226B1/en
Priority to US14/465,426 priority patent/US9185194B2/en
Publication of WO2014166215A1 publication Critical patent/WO2014166215A1/zh
Priority to US14/878,812 priority patent/US9426263B2/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/007—Semi-solid pressure die casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/14—Machines with evacuated die cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/20—Accessories: Details
    • B22D17/2015—Means for forcing the molten metal into the die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D21/00—Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
    • B22D21/02—Casting exceedingly oxidisable non-ferrous metals, e.g. in inert atmosphere
    • B22D21/022—Casting heavy metals, with exceedingly high melting points, i.e. more than 1600 degrees C, e.g. W 3380 degrees C, Ta 3000 degrees C, Mo 2620 degrees C, Zr 1860 degrees C, Cr 1765 degrees C, V 1715 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D25/00—Special casting characterised by the nature of the product
    • B22D25/06—Special casting characterised by the nature of the product by its physical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
    • B22D27/04—Influencing the temperature of the metal, e.g. by heating or cooling the mould
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/11—Making amorphous alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C45/00—Amorphous alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C45/00—Amorphous alloys
    • C22C45/10—Amorphous alloys with molybdenum, tungsten, niobium, tantalum, titanium, or zirconium or Hf as the major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing

Definitions

  • the present invention relates to the field of electronic technologies, and in particular, to a method for manufacturing a handheld electronic device, a support assembly, and a support assembly.
  • handheld electronic devices such as cell phones may include touch screen components, rear casings, internal structural support components, exterior components, and the like.
  • Conventional exterior parts and internal structural support components are usually made of high-strength, high-hardness materials such as stainless steel or aluminum alloy. Due to the high strength and high hardness of the appearance member, the appearance member and the internal structural support assembly can only be connected by screwing or welding, thereby causing the process of assembling the mobile phone to be relatively cumbersome and costly. high.
  • the technical problem to be solved by the embodiments of the present invention is to provide a method for manufacturing a handheld electronic device, a supporting component and a supporting component, so as to simplify the process of assembling the mobile phone.
  • the present invention provides a support assembly installed between a rear case of a handheld electronic device and a screen to support and fix components of the handheld electronic device, the support assembly including an appearance component and an internal structure.
  • a support member, the appearance member and the inner structural support member are integrally formed from an amorphous alloy, and the inner structural support member is formed by extending inwardly from a top or a middle portion of the appearance member, the inner structural support member
  • the average thickness is less than 2 mm.
  • the invention also provides a method for manufacturing a support assembly, comprising:
  • the amorphous alloy is heated and melted in a vacuum environment, and the temperature of the amorphous alloy is higher than a preset temperature range of the melting point;
  • the support assembly is obtained after the vacuum die-casting mold is kept warm for a preset time, wherein
  • the support assembly includes an exterior member and an internal structural support member that is formed with a net size of the appearance member.
  • the present invention also provides a handheld electronic device including a rear case, a screen, a component, and a support assembly, the support assembly being mounted between the rear case and the screen to support and fix the component, the support
  • the assembly includes an appearance member and an inner structural support member.
  • the appearance member and the inner structural support member are integrally formed from an amorphous alloy, and the inner structural support member is formed to extend inwardly from a top or a middle portion of the appearance member.
  • the inner structural support has an average thickness of less than 2 mm.
  • the appearance member and the internal structural support member are integrally formed from an amorphous alloy.
  • the inner structural support member is formed inwardly from the top or middle portion of the appearance member, and the inner structural support member has an average thickness of less than 2 mm.
  • the appearance member 41 of the present invention and the internal structural support assembly need not be connected by screwing or welding, thereby simplifying the assembly process of the hand-held electronic device 100.
  • FIG. 1 is an exploded perspective view of a mobile phone electronic device according to a preferred embodiment of the present invention
  • FIG. 2 is a schematic view of the support assembly of FIG. 1;
  • FIG. 3 is a flow chart of a support assembly according to a first preferred embodiment of the present invention.
  • FIG. 4 is a flow chart of a support assembly according to a second preferred embodiment of the present invention.
  • FIG. 1 illustrates a handheld electronic device 100 according to a preferred embodiment of the present invention.
  • the handheld electronic device 100 includes a rear case 10, a screen 20, components (not shown), and a support assembly 40.
  • the support assembly 40 is mounted between the rear case 10 and the screen 20 to support and fix the component.
  • the support assembly 40 includes an exterior member 41 and an internal structural support member 42.
  • the appearance member 41 and the inner structural support member 42 are integrally formed of an amorphous alloy.
  • the inner structural support member 42 is formed to extend inwardly from the top or middle portion of the appearance member 41.
  • the inner structural support 42 has an average thickness of less than 2 mm.
  • the height H of the appearance member 41 is in the range of 0.5 mm to 10 mm.
  • the wall thickness W1 of the appearance member 41 is in the range of 0.5 mm to 3 mm.
  • the support region thickness W2 of the inner structural support member 42 is in the range of 0.2 mm to 2 mm.
  • the appearance member 41 and the internal structural support member 42 are once-net-sized by a die-casting amorphous alloy or a semi-solid molding process.
  • the inner structural support member 42 is provided with a through groove 422 for receiving components disposed on the inner structural support member 42.
  • the outer surface of the appearance member 41 exhibits a metallic texture after being polished or sandblasted or brushed.
  • the amorphous alloy is a zirconium-based amorphous alloy.
  • the amorphous alloy may be adjusted according to actual needs, but the adjusted material must also be an amorphous alloy, because only the amorphous alloy can form the support of the inner member less than 2 mm by integral molding. Components to meet the needs of ultra-thin handheld electronic devices and high-strength support components.
  • the appearance member 41 and the internal structural support member 42 are integrally formed of an amorphous alloy.
  • the inner structural support member is formed by extending inwardly from the top or middle portion of the appearance member, and the inner structural support member has an average thickness of less than 2 mm.
  • the appearance member 41 of the present invention and the internal structural support assembly need not be connected by screwing or welding, thereby simplifying the assembly process of the handheld electronic device 100.
  • a flow chart of a method for fabricating a support assembly according to a first preferred embodiment of the present invention may include the following steps:
  • Step 101 Providing a vacuum die casting mold.
  • the vacuum die casting mold is designed according to the specific size of the support assembly. Therefore, the vacuum die casting mold can be designed according to the needs of the user, and through the vacuum die casting The support components formed after die-casting of the mold are completely in line with the user's design dimensions.
  • Step 102 The amorphous alloy is heated and melted in a vacuum environment, and the temperature of the amorphous alloy is higher than a preset temperature range of the melting point.
  • the vacuum of the vacuum environment is higher than 500 Pascal.
  • the preset temperature range is 50-300 degrees Celsius.
  • the amorphous alloy is a 4-base amorphous alloy.
  • the vacuum degree of the vacuum environment and the preset temperature range may be adjusted according to actual needs.
  • the amorphous alloy can be adjusted according to actual needs, but the adjusted material must also be an amorphous alloy, because only the amorphous alloy can form a support component with an inner member of less than 2 mm by integral molding to meet the ultra-thin. The need for handheld electronic devices and high-strength support components.
  • Step 103 Injecting the melted amorphous alloy into the barrel of the compressor, and accelerating the pressurization to cause the melted amorphous alloy to be injected into the vacuum die casting mold.
  • Step 104 The support assembly is obtained by holding the vacuum die-casting mold for a preset time, wherein the support assembly comprises an appearance component and an internal structural support member formed with a net size of the appearance component.
  • the support assembly 100 is obtained by the method of making the support assembly.
  • the appearance member 41 of the support assembly 100 and the inner structural support member 42 are integrally formed of an amorphous alloy.
  • the inner structural support member 42 is formed to extend inwardly from the top or middle portion of the appearance member 41.
  • the inner structural support 42 has an average thickness of less than 2 mm.
  • the exterior member 41 of the present invention and the internal structural support assembly 42 need not be joined by screwing or welding, thereby simplifying the assembly of the handheld electronic device 100.
  • a second preferred embodiment of the present invention provides a method of fabricating a support assembly.
  • the manufacturing method of the support assembly provided by the second preferred embodiment is similar to the manufacturing method of the support assembly provided by the first preferred embodiment, and the difference is that: in the second preferred embodiment, the A method for manufacturing a support assembly further includes:
  • Step 105 Remove the material head and the burr of the support component by using a numerical control machine tool.
  • Step 106 Perform high-brightness polishing or sandblasting and wire drawing on the outer surface of the appearance member, so that the outer surface of the appearance member presents a metallic texture.
  • the support assembly 100 is obtained by the method of fabricating the support assembly. In the preferred embodiment of the support assembly 100, through the fabrication of the support assembly The support assembly 100 obtained by the method.
  • the appearance member 41 of the support assembly 100 and the inner structural support member 42 are integrally formed from an amorphous alloy.
  • the inner structural support 42 is formed inwardly from the top or middle of the appearance member 41.
  • the average thickness of the inner structural support 41 is less than
  • the appearance member 41 of the present invention and the internal structural support assembly 42 need not be connected by screwing or welding, thereby simplifying the assembly process of the handheld electronic device 100.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

本发明提供了一种支撑组件，安装于手持电子设备的后壳与屏幕之间，以支撑固定所述手持电子设备的元器件，所述支撑组件包括外观件及内部结构支撑件，所述外观件与所述内部结构支撑件由非晶合金一体成型制成，所述内部结构支撑件由所述外观件的顶部或中部向内延伸出形成，所述内部结构支撑件的平均厚度小于2mm。本发明本简化了所述手持电子设备的组装的工序。本发明还提供一种支撑组件的制作方法及手持电子设备。

Description

一种手持电子设备、 支撑组件及支撑组件的制作方法 技术领域
本发明涉及电子技术领域， 尤其涉及一种手持电子设备、 支撑组件及支 撑组件的制作方法。
背景技术 通常手持电子设备如手机会包括触摸屏组件、 后壳、 内部结构支撑组件、 外观件等。 传统的外观件及内部结构支撑组件通常采用不锈钢或铝合金等高 强度、 高硬度的材质。 由于所述外观件的高强度及高硬度的材质的原因， 所 述外观件与所述内部结构支撑组件只能通过螺钉锁合或焊接方式进行连接， 从而导致手机组装的工序相对繁瑣， 成本太高。
发明内容
本发明实施例所要解决的技术问题在于， 提供一种手持电子设备、 支撑 组件及支撑组件的制作方法， 以简化手机组装的工序。
为了解决上述技术问题， 本发明提供了一种支撑组件， 安装于手持电子 设备的后壳与屏幕之间， 以支撑固定所述手持电子设备的元器件， 所述支撑 组件包括外观件及内部结构支撑件， 所述外观件与所述内部结构支撑件由非 晶合金一体成型制成， 所述内部结构支撑件由所述外观件的顶部或中部向内 延伸出形成， 所述内部结构支撑件的平均厚度小于 2mm。
本发明还提供一种支撑组件的制作方法， 包括：
提供一真空压铸模具；
将非晶合金在真空环境下加热融化， 且使所述非晶合金的料温高于其熔 点预设温度范围；
将融化的非晶合金注入到压缩机的料筒， 并加速加压使融化的非晶合金 射入所述真空压铸模具；
对所述真空压铸模具保温预设时间后即可得到所述支撑组件， 其中， 所 述支撑组件包括外观件及与所述外观件一次净尺寸成型的内部结构支撑件。 本发明还提供一种手持电子设备， 包括后壳、 屏幕、 元器件及支撑组件， 所述支撑组件安装于所述后壳与所述屏幕之间， 以支撑固定所述元器件， 所 述支撑组件包括外观件及内部结构支撑件， 所述外观件与所述内部结构支撑 件由非晶合金一体成型制成， 所述内部结构支撑件由所述外观件的顶部或中 部向内延伸出形成， 所述内部结构支撑件的平均厚度小于 2mm。
实施本发明实施例， 具有如下有益效果：
实施本发明的实施例， 所述外观件与所述内部结构支撑件由非晶合金一体 成型制成。 所述内部结构支撑件由所述外观件的顶部或中部向内延伸出形成， 所述内部结构支撑件的平均厚度小于 2mm。本发明的外观件 41与内部结构支 撑组件无需通过螺钉锁合或焊接方式进行连接， 从而简化了所述手持电子设 备 100的组装的工序。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案， 下面将对实 施例或现有技术描述中所需要使用的附图作简单地介绍， 显而易见地， 下面 描述中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还可以根据这些附图获得其他的附图。
图 1是本发明较佳实施方式提供的一种手机电子设备的分解示意图； 图 2是图 1的支撑组件的示意图；
图 3是本发明第一较佳实施方式提供的一种支撑组件的流程图； 图 4是本发明第二较佳实施方式提供的一种支撑组件的流程图。 具体实施方式
下面将结合本发明实施例中的附图， 对本发明实施例中的技术方案进行 清楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而 不是全部的实施例。 基于本发明中的实施例， 本领域普通技术人员在没有作 出创造性劳动前提下所获得的所有其他实施例， 都属于本发明保护的范围。 请参考图 1 , 为本发明较佳实施例提供的一种手持电子设备 100。 所述手 持电子设备 100包括后壳 10、 屏幕 20、 元器件（未示出）及支撑组件 40。
请继续参考图 2, 所述支撑组件 40安装于所述后壳 10与所述屏幕 20之 间， 以支撑固定所述元器件。 所述支撑组件 40包括外观件 41及内部结构支 撑件 42。所述外观件 41与所述内部结构支撑件 42由非晶合金一体成型制成。 所述内部结构支撑件 42由所述外观件 41 的顶部或中部向内延伸出形成。 所 述内部结构支撑件 42的平均厚度小于 2mm。
具体地， 所述外观件 41的高度 H在 0.5mm-10mm范围内。 所述外观件 41的壁厚 W1在 0.5mm-3mm范围内。 所述内部结构支撑件 42的支撑区域厚 度 W2在 0.2mm-2mm范围内。 其中， 所述外观件 41与所述内部结构支撑件 42通过 4告基非晶合金压铸或半固态成型工艺一次净尺寸成型。
所述内部结构支撑件 42设有通槽 422, 用于收容设置于所述内部结构支 撑件 42上的元器件。
所述外观件 41的外表面经高亮抛光或喷砂、 拉丝处理后呈现金属质感。 在本实施方式中， 所述非晶合金为锆基非晶合金。 在其他实施方式中， 所述非晶合金可以根据实际需要进行调整， 但调整后的材料也必须为非晶合 金， 因为只有非晶合金才可能通过一体成型的方式成型出内构件小于 2mm的 支撑组件， 以满足超薄手持电子设备以及高强度支撑组件的需求。
在本较佳实施方式中， 所述外观件 41与所述内部结构支撑件 42由非晶 合金一体成型制成。 所述内部结构支撑件由所述外观件的顶部或中部向内延 伸出形成， 所述内部结构支撑件的平均厚度小于 2mm。 本发明的外观件 41 与内部结构支撑组件无需通过螺钉锁合或焊接方式进行连接， 从而简化了所 述手持电子设备 100的组装的工序。
请继续参考图 2,本发明第一较佳实施方式提供的一种支撑组件的制作方 法的流程图； 该方法可以包括以下步骤：
步骤 101、 提供一真空压铸模具。
其中， 所述真空压铸模具是根据所述支撑组件的具体尺寸进行设计的。 故， 所述真空压铸模具可以根据用户的需要进行设计， 且通过所述真空压铸 模具压铸后成型的支撑组件完全符合用户的设计尺寸。
步骤 102、将非晶合金在真空环境下加热融化， 且使所述非晶合金的料温 高于其熔点预设温度范围。
其中， 在本实施方式中， 所诉真空环境的真空度高于 500 帕斯卡。 所述 预设温度范围为 50-300摄氏度。 所述非晶合金为 4告基非晶合金。 在其他实施 方式中， 所述真空环境的真空度、 所述预设温度范围可以根据实际需要进行 调整。 所述非晶合金可以根据实际需要进行调整， 但调整后的材料也必须为 非晶合金， 因为只有非晶合金才可能通过一体成型的方式成型出内构件小于 2mm的支撑组件， 以满足超薄手持电子设备以及高强度支撑组件的需求。
步骤 103、将融化的非晶合金注入到压缩机的料筒， 并加速加压使融化的 非晶合金射入所述真空压铸模具。
步骤 104、 对所述真空压铸模具保温预设时间后即可得到所述支撑组件， 其中， 所述支撑组件包括外观件及与所述外观件一次净尺寸成型的内部结构 支撑件。
在本较佳实施方式中， 通过所述支撑组件的制作方法得到的所述支撑组 件 100。所述支撑组件 100的所述外观件 41与所述内部结构支撑件 42由非晶 合金一体成型制成。 所述内部结构支撑件 42由所述外观件 41 的顶部或中部 向内延伸出形成。 所述内部结构支撑件 42的平均厚度小于 2mm。本发明的外 观件 41与内部结构支撑组件 42无需通过螺钉锁合或焊接方式进行连接， 从 而简化了所述手持电子设备 100的组装的工序。
请参考图 3 , 本发明第二较佳实施方式提供一种支撑组件的制作方法。 所 述第二较佳实施方式提供的一种支撑组件的制作方法与第一较佳实施方式提 供的一种支撑组件的制作方法相似， 其区别在于： 在第二较佳实施方式中， 所述一种支撑组件的制作方法还包括：
步骤 105、 利用数控机床去掉所述支撑组件的料头及毛边。
步骤 106、 对所述外观件的外表面进行高亮抛光或喷砂、 拉丝处理， 从而 使得所述外观件的外表面呈现金属质感。
在本较佳实施方式中， 通过所述支撑组件的制作方法得到的所述支撑组 件 100。 所述支撑组件 100的在本较佳实施方式中， 通过所述支撑组件的制作 方法得到的所述支撑组件 100。 所述支撑组件 100的外观件 41与内部结构支 撑件 42由非晶合金一体成型制成。 所述内部结构支撑件 42由所述外观件 41 的顶部或中部向内延伸出形成。 所述内部结构支撑件 41 的平均厚度小于
2mm。 本发明的外观件 41与内部结构支撑组件 42无需通过螺钉锁合或焊接 方式进行连接， 从而简化了所述手持电子设备 100的组装的工序。
以上所揭露的仅为本发明一种较佳实施例而已， 当然不能以此来限定本发 明之权利范围， 本领域普通技术人员可以理解实现上述实施例的全部或部分 流程， 并依本发明权利要求所作的等同变化， 仍属于发明所涵盖的范围。

Claims

权 利 要 求 书
1、 一种支撑组件， 安装于手持电子设备的后壳与屏幕之间， 以支撑固定所 述手持电子设备的元器件， 所述支撑组件包括外观件及内部结构支撑件， 其特 征在于： 所述外观件与所述内部结构支撑件由非晶合金一体成型制成， 所述内 部结构支撑件由所述外观件的顶部或中部向内延伸出形成， 所述内部结构支撑 件的平均厚度小于 2mm。
2、 如权利要求 1所述的支撑组件， 其特征在于， 所述外观件的高度范围为 0.5mm- 10mm, 所述外观件的壁厚范围为 0.5mm-3mm, 所述内部结构支撑件的 厚度范围为 0.2mm-2mm。
3、 如权利要求 1所述的支撑组件， 其特征在于， 所述外观件与所述内部结 构支撑件通过 4告基非晶合金压铸或半固态成型工艺一次净尺寸成型。
4、 如权利要求 1所述的支撑组件， 其特征在于， 所述内部结构支撑件设有 通槽， 以收容设置于所述内部结构支撑件上的元器件。
5、 如权利要求 1所述的支撑组件， 其特征在于， 所述外观件的外表面经高 亮抛光或喷砂、 拉丝处理后呈现金属质感。
6、 如权利要求 1所述的支撑组件， 其特征在于， 所述非晶合金为 4告基非晶 合金。
7、 一种支撑组件的制作方法， 包括：
提供一真空压铸模具；
将非晶合金在真空环境下加热融化， 且使所述非晶合金的料温高于其熔点 预设温度范围；
将融化的非晶合金注入到压缩机的料筒， 并加速加压使融化的非晶合金射 入所述真空压铸模具； 对所述真空压铸模具保温预设时间后即可得到所述支撑组件， 其中， 所述 支撑组件包括外观件及与所述外观件一次净尺寸成型的内部结构支撑件。
8、如权利要求 7所述的方法，其特征在于，所述真空环境的真空度高于 500 帕斯， 所述预设温度范围为 50-300摄氏度。
9、 如权利要求 6所述的方法， 其特征在于， 还包括：
利用数控机床对所述支撑组件进行去掉料头及毛边； 及
对所述外观件的外表面进行高亮抛光或喷砂、 拉丝处理， 从而使得所述外 观件的外表面程序金属质感。
10、 一种手持电子设备， 包括后壳、 屏幕、 元器件及支撑组件， 所述支撑组 件安装于所述后壳与所述屏幕之间， 以支撑固定所述元器件， 所述支撑组件包 括外观件及内部结构支撑件， 其特征在于： 所述外观件与所述内部结构支撑件 由非晶合金一体成型制成， 所述内部结构支撑件由所述外观件的顶部或中部向 内延伸出形成， 所述内部结构支撑件的平均厚度小于 2mm。
PCT/CN2013/084529 2013-04-09 2013-09-27 一种手持电子设备、支撑组件及支撑组件的制作方法 WO2014166215A1 (zh)

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CN105328160A (zh) * 2015-09-28 2016-02-17 维沃移动通信有限公司 电子设备的框架制备方法及电子设备
CN106953163B (zh) * 2017-01-19 2019-11-19 瑞声科技(新加坡)有限公司 天线以及移动终端
CN106936962A (zh) * 2017-01-20 2017-07-07 瑞声科技(新加坡)有限公司 移动终端的外壳及其制造方法
CN106898858B (zh) * 2017-04-18 2019-05-31 北京小米移动软件有限公司 外壳结构的成型方法、外壳结构及电子设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101577741A (zh) * 2008-05-09 2009-11-11 鸿富锦精密工业（深圳）有限公司 手机外壳
CN102021503A (zh) * 2010-12-15 2011-04-20 江苏大学 一种连续纤维增强金属基复合材料的制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5244282B2 (ja) * 2001-06-07 2013-07-24 リキッドメタル テクノロジーズ，インコーポレイティド 電子機器用およびフラットパネルディスプレー用の改良金属フレーム
CN201585218U (zh) * 2009-10-20 2010-09-15 国基电子（上海）有限公司 滑盖式电子装置
CN102811264B (zh) * 2011-05-30 2015-06-24 李树忠 一种手机壳及其加工方法
KR20160084507A (ko) * 2011-09-30 2016-07-13 크루서블 인텔렉츄얼 프라퍼티 엘엘씨. 사출 성형 시스템을 사용한 비정질 합금의 사출 성형
CN202856806U (zh) * 2012-09-10 2013-04-03 惠州Tcl移动通信有限公司 一种手机壳体及手机

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101577741A (zh) * 2008-05-09 2009-11-11 鸿富锦精密工业（深圳）有限公司 手机外壳
CN102021503A (zh) * 2010-12-15 2011-04-20 江苏大学 一种连续纤维增强金属基复合材料的制备方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2814226A4 *

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