Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
  • B29C49/42—Component parts, details or accessories; Auxiliary operations
  • B29C49/4252—Auxiliary operations prior to the blow-moulding operation not otherwise provided for
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
  • B23K1/0016—Soldering of electronic components
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/005—Soldering by means of radiant energy
  • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
  • B23K26/1462—Nozzles; Features related to nozzles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
  • B29C49/08—Biaxial stretching during blow-moulding
  • B29C49/16—Biaxial stretching during blow-moulding using pressure difference for pre-stretching, e.g. pre-blowing
  • B29C49/1602—Biaxial stretching during blow-moulding using pressure difference for pre-stretching, e.g. pre-blowing pre-blowing without using a mould
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
  • B29C49/42—Component parts, details or accessories; Auxiliary operations
  • B29C49/46—Component parts, details or accessories; Auxiliary operations characterised by using particular environment or blow fluids other than air
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
  • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
  • B65B3/02—Machines characterised by the incorporation of means for making the containers or receptacles
  • B65B3/022—Making containers by moulding of a thermoplastic material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
  • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
  • B65B3/04—Methods of, or means for, filling the material into the containers or receptacles
  • B65B3/10—Methods of, or means for, filling the material into the containers or receptacles by application of pressure to material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
  • B65B31/00—Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
  • B65B31/02—Filling, closing, or filling and closing, containers or wrappers in chambers maintained under vacuum or superatmospheric pressure or containing a special atmosphere, e.g. of inert gas
  • B65B31/025—Filling, closing, or filling and closing, containers or wrappers in chambers maintained under vacuum or superatmospheric pressure or containing a special atmosphere, e.g. of inert gas specially adapted for rigid or semi-rigid containers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
  • B65B55/00—Preserving, protecting or purifying packages or package contents in association with packaging
  • B65B55/02—Sterilising, e.g. of complete packages
  • B65B55/04—Sterilising wrappers or receptacles prior to, or during, packaging
  • B65B55/08—Sterilising wrappers or receptacles prior to, or during, packaging by irradiation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
  • B65B55/00—Preserving, protecting or purifying packages or package contents in association with packaging
  • B65B55/02—Sterilising, e.g. of complete packages
  • B65B55/04—Sterilising wrappers or receptacles prior to, or during, packaging
  • B65B55/10—Sterilising wrappers or receptacles prior to, or during, packaging by liquids or gases
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/36—Electric or electronic devices
  • B23K2101/42—Printed circuits
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
  • B29C49/42—Component parts, details or accessories; Auxiliary operations
  • B29C49/46—Component parts, details or accessories; Auxiliary operations characterised by using particular environment or blow fluids other than air
  • B29C2049/4602—Blowing fluids
  • B29C2049/465—Blowing fluids being incompressible
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C2791/00—Shaping characteristics in general
  • B29C2791/004—Shaping under special conditions
  • B29C2791/006—Using vacuum
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C2791/00—Shaping characteristics in general
  • B29C2791/004—Shaping under special conditions
  • B29C2791/007—Using fluid under pressure
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
  • B29C49/08—Biaxial stretching during blow-moulding
  • B29C49/10—Biaxial stretching during blow-moulding using mechanical means for prestretching
  • B29C49/14—Clamps
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
  • B29C49/42—Component parts, details or accessories; Auxiliary operations
  • B29C49/42403—Purging or cleaning the blow-moulding apparatus
  • B29C49/42405—Sterilizing
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
  • B29C49/42—Component parts, details or accessories; Auxiliary operations
  • B29C49/42414—Treatment of preforms, e.g. cleaning or spraying water for improved heat transfer
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
  • B29C49/42—Component parts, details or accessories; Auxiliary operations
  • B29C49/42414—Treatment of preforms, e.g. cleaning or spraying water for improved heat transfer
  • B29C49/42416—Purging or cleaning the preforms
  • B29C49/42418—Purging or cleaning the preforms for sterilizing
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
  • B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
  • B29K2067/003—PET, i.e. poylethylene terephthalate
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
  • B29L2031/00—Other particular articles
  • B29L2031/712—Containers; Packaging elements or accessories, Packages
  • B29L2031/7158—Bottles
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07141—Means for applying energy, e.g. ovens or lasers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07178—Means for aligning
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/072—Connecting or disconnecting of bump connectors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/072—Connecting or disconnecting of bump connectors
  • H10W72/07221—Aligning
  • H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/072—Connecting or disconnecting of bump connectors
  • H10W72/07231—Techniques
  • H10W72/07235—Applying EM radiation, e.g. induction heating or using a laser
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/072—Connecting or disconnecting of bump connectors
  • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
  • H10W72/07253—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in shapes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/072—Connecting or disconnecting of bump connectors
  • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
  • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
  • H10W72/231—Shapes
  • H10W72/234—Cross-sectional shape, i.e. in side view
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
  • H10W72/241—Dispositions, e.g. layouts
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
  • H10W72/241—Dispositions, e.g. layouts
  • H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
  • H10W72/241—Dispositions, e.g. layouts
  • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
  • H10W72/241—Dispositions, e.g. layouts
  • H10W72/247—Dispositions of multiple bumps
  • H10W72/248—Top-view layouts, e.g. mirror arrays
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
  • H10W72/251—Materials
  • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/834—Interconnections on sidewalls of chips
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
  • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

• the present invention relates to a process for the preparation of containers from preforms and a device therefor.
• a blow molding machine has a heating device for tempering or preheating (thermal conditioning) of the preform rings, and a blowing device with at least one blowing station, in the region of which the preform which has previously been tempered is expanded biaxially or multiaxially to form a container. Expansion takes place with the aid of a compressed gas, e.g.
• the containers produced by blow molding are fed to a subsequent filling device and filled here with the intended product or filling material.
• a separate blowing machine and a separate filling machine are used.
• the separate blowing machine and the separate filling machine to form a block of machines, ie to summarize a blocked blowing-filling device together, wherein continue the blow molding and filling done on separate machine components and time sequentially.
• the object of the invention is to propose a method and an apparatus for producing filled with a liquid filling containers, which ensure a long shelf life of the medium.
• a method for the preparation of filled with a liquid product containers of preforms is proposed in which the preform during a forming and filling phase in a form hydraulically or hydro-dynamically deformed by pressure of the supplied contents into the container becomes.
• the inventive method is characterized in that the preform is evacuated at least once before the beginning of the molding and filling phase.
• plastic containers such as PE, PP, PET bottles, PET-KEG and the like can be produced.
• an apparatus for producing filled with a liquid product containers of preforms with at least one forming and filling station which has at least one forming a mold cavity shape and at least one forming head.
• a liquid Pressure medium are introduced.
• the device according to the invention is characterized in that the forming head has means for evacuating the interior of the preform or is functionally connected to such, in particular via lines.
• the preform is evacuated at least once before the beginning of the molding and filling phase.
• an inert gas or gas mixture is passed into the preform after the at least one evacuation to relieve, ideally an inert gas containing or consisting of C0 2 or N 2 .
• the preform may also be alternatively or cumulatively rinsed after evacuation with an inert gas.
• a pressure of 50 to 200 mbar is achieved in the vacuuming according to the invention.
• all foreign gases are removed from the interior of the preform, which could have a detrimental effect on the filling medium or act as a germ cell for the outgassing of a carbonated liquid at pressure drop, such as. Oxygen.
• the compared to the molded container relatively thick-walled preform is sufficiently stable to withstand even greater negative pressure.
• the volume to be evacuated is comparatively low, which is why the method according to the invention is economically advantageous.
• the preform can be relieved after an evacuation with a sterilizing agent and / or rinsed, in particular with steam and / or a gas-vapor mixture.
• the steam in this case may be a water vapor or a vaporized chemical sterilant, especially H2O2.
• the sterilizing agent may also be a sterilizing gas or gas mixture, in particular ozone or a mixture of ozone and an inert gas.
• the mouth of the preform can be sterilized by a radiation emitter, in particular UV light or pulsed UV light.
• a radiation emitter in particular UV light or pulsed UV light.
• the molding and filling process can begin immediately after evacuation or after discharge, flushing and sterilization.
• the evacuation and flushing can also be repeated several times to maximize the freedom of foreign gases in the preform that are contaminants of the atmosphere in the preform.
• the molding and filling process is then done in a known manner, wherein the preform is thermally conditioned if necessary, before the beginning of the molding process.
• temperatures are between 70 ° C and 120 ° C.
• the thermal conditioning can, for. B. also be carried out in the usual way by passing through a heating section before introducing the preform into the mold.
• the mold is then heated appropriately to maintain thermal conditioning during preforming of the preform by vacuuming, rinsing and / or sterilizing.
• a prepared according to the process preform can be formed and filled in the context of the Formund filling phase in one operation with a liquid filling medium. Re-contamination can be ruled out by the immediate succession of process steps.
• the forming head of the apparatus according to the invention has suitable means for evacuating the interior of the preform to produce a vacuum, or is provided with such means as e.g. with a vacuum pump, functionally connected, e.g. via lines.
• the achievable in the interior of the preform pressure should preferably be between 50 and 200 mbar.
• the device are at least one group of mold heads together with a common vacuum chamber in combination, which in turn is associated with means for evacuation, such as a vacuum pump.
• all mold heads can be connected in line with a single vacuum space.
• the Vacuum space can be advantageously designed as one or more ring tank or ring tubes.
• the apparatus may include means for thermally conditioning the preform.
• the forming head of the device according to the invention may preferably further have means for introducing a sterilizing agent, such as steam, a gas-vapor mixture, ozone and / or H 2 O 2 in the interior of the preform.
• a sterilizing agent such as steam, a gas-vapor mixture, ozone and / or H 2 O 2 in the interior of the preform.
• the forming head can also have means for introducing an inert gas, in particular containing or consisting of CO 2 or N 2 , in the interior of the preform.
• an inert gas in particular containing or consisting of CO 2 or N 2 , in the interior of the preform.
• the preform can be effectively rendered inert, which also contributes to the long shelf life of the filled medium.
• the forming head of the device according to the invention can have means for sterilizing the mouth of the preform by a radiation emitter, in particular a UV emitter or emitter for pulsed UV light.
• a radiation emitter in particular a UV emitter or emitter for pulsed UV light.
• the preform can thus be completely sterilized before the beginning of the molding and filling phase.
• the finished, filled container does not have to be subjected to a sterilization process again.
• Fig. 1 shows a schematic representation of a plant according to the invention for the production of filled with a liquid product containers from preforms. 5
• the plant shown in Fig. 1 has at least one forming and filling station 1, each having at least one mold cavity 3 forming a mold 2.
• the mold 2 is closed by a forming head 4 upwards.
• a dashed line in the figure preform 5 can be introduced into the mold and lies with its opening 6 in sealing position against the forming head 4 at.
• the forming head 4 is connected via a supply line to a first storage 20 for a liquid product, in which the product is under high pressure by a high-pressure pump 21 and the preform 5 can be supplied via a valve 10.
• the volume supplied can be measured via a magnetic inductive flowmeter (MID) 22.
• MID magnetic inductive flowmeter
• the forming head 4 is connected via a feed line to a vacuum pump 30, with which in the preform 5 via a valve 11, a vacuum of about 100 mbar can be generated.
• the forming head 4 is also connected via a supply line to a source for generating steam and / or a H 2 O 2 memory 40, so that the preform 5 via a valve 12 with steam, in particular with steam, and / or vaporized H 2 O 2 can be applied.
• the forming head 4 is also connected via a supply line with a CO 2 storage 50, so that the preform 5 can be acted upon via a valve 13 with CO 2 .
• the preparation of a container filled with a liquid product container according to the method of the invention is carried out in the manner described below: First, the preform 5 is introduced into the open mold 2 and the mold head 4 is closed, so that the opening 6 of the preform 5 sealingly the forming head 4 in plant.
• valve 11 is opened, so that the vacuum generated by the vacuum pump 30 can act on the preform 5.
• the preform 5 is evacuated.
• the preform 5 is very unlike the molded container stable, so that it can withstand significant negative pressure. The evacuation is therefore not a problem. Given the small volume of the preform 5, the evacuation can be done within a very small time interval, which is important for the process times within a filling machine.
• valve 11 is closed and valve 12 is opened.
• the under-pressure preform 5 communicates with the steam generator and / or H 2 O 2 reservoir 40 and is relieved. Due to the negative pressure, steam and / or vaporized H 2 O 2 are sucked into the interior of the preform 5 and the surfaces of the preform 5 coming into contact with the contents are sterilized.
• valve 12 is closed and again valve 11 is opened, so that again a vacuum in the interior of the preform 5 is generated.
• valve 13 After closing the vacuum valve 11, valve 13 can be opened, whereby the interior of the preform 5 is relieved again and flushed with CO 2 .
• CO 2 is an inert gas and does not cause deterioration of the beverage.
• valve 13 is closed again and by opening the valve 10 of the molding and filling process is set in motion. Under the pressure prevailing in the container 20 forming and filling pressure, the inert gas contained in the preform 5 is displaced and deformed the preform into the container. It goes without saying that the preform is thermally conditioned in the usual and known manner prior to the molding and filling phase.
• the stretching of the preform 5 can be assisted and controlled by suitable means, which are not shown in the figure.
• suitable means for example, a stretching rod, a guide element acting on the bottom of the preform from below, or negative pressure in the mold can be used.
• a combination of these funds is also possible.
• Particularly advantageous Process in which no conventional stretch rod in the interior of the preforms or the container is used, but the preform during the deformation from the outside, preferably on the ground attacking, is performed. After shaping and filling of the container, a head space is formed in a suitable manner, the container relieved and closed.
• system shown here may have several form and filling stations 1, where simultaneously or temporally slightly offset several containers can be formed simultaneously.
• the illustrated method can comprise more than one cycle each of evacuation and disinfection or evacuation and purging with inert gas.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Optics & Photonics (AREA)
• Physics & Mathematics (AREA)
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• Dispersion Chemistry (AREA)
• Chemical & Material Sciences (AREA)
• Toxicology (AREA)
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• Plasma & Fusion (AREA)
• Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
• Filling Of Jars Or Cans And Processes For Cleaning And Sealing Jars (AREA)
• Basic Packing Technique (AREA)

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• 2013
  • 2013-02-19 DE DE201310101642 patent/DE102013101642A1/de not_active Ceased
• 2014
  • 2014-02-17 CN CN201480009231.7A patent/CN105073385B/zh active Active
  • 2014-02-17 JP JP2015557353A patent/JP2016514071A/ja active Pending
  • 2014-02-17 WO PCT/EP2014/000428 patent/WO2014127903A1/de not_active Ceased
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  • 2014-02-17 US US14/768,607 patent/US11345073B2/en active Active

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