CN105073385A - 用于生产和填充容器的方法和设备 - Google Patents

用于生产和填充容器的方法和设备 Download PDF

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Publication number
CN105073385A
CN105073385A CN201480009231.7A CN201480009231A CN105073385A CN 105073385 A CN105073385 A CN 105073385A CN 201480009231 A CN201480009231 A CN 201480009231A CN 105073385 A CN105073385 A CN 105073385A
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China
Prior art keywords
preform
die head
pressure
container
gas
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Granted
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CN201480009231.7A
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CN105073385B (zh
Inventor
L·克吕塞拉特
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KHS GmbH
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KHS GmbH
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42—Component parts, details or accessories; Auxiliary operations
    • B29C49/4252—Auxiliary operations prior to the blow-moulding operation not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42—Component parts, details or accessories; Auxiliary operations
    • B29C49/46—Component parts, details or accessories; Auxiliary operations characterised by using particular environment or blow fluids other than air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B3/02—Machines characterised by the incorporation of means for making the containers or receptacles
    • B65B3/022—Making containers by moulding of a thermoplastic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
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    • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B3/04—Methods of, or means for, filling the material into the containers or receptacles
    • B65B3/10—Methods of, or means for, filling the material into the containers or receptacles by application of pressure to material
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B65B31/02—Filling, closing, or filling and closing, containers or wrappers in chambers maintained under vacuum or superatmospheric pressure or containing a special atmosphere, e.g. of inert gas
    • B65B31/025—Filling, closing, or filling and closing, containers or wrappers in chambers maintained under vacuum or superatmospheric pressure or containing a special atmosphere, e.g. of inert gas specially adapted for rigid or semi-rigid containers
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
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    • B65B55/10—Sterilising wrappers or receptacles prior to, or during, packaging by liquids or gases
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C2049/465—Blowing fluids being incompressible
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract

本发明涉及由预成型坯(5)生产被液体含物填充的容器的方法，尤其生产诸如PE-、PP-、或PET的瓶子、PET小桶或类似物的塑料容器的方法。预成型坯(5)在形成和填充阶段期间通过导入容器的含物(20)的压力在吹模中液压地或水动力地形成。所述预成型坯在形成和填充阶段的开始之前被排空(30)至少一次，并且预成型坯在所述排空之后被平衡压力和/或利用灭菌剂(40)冲洗、尤其利用蒸气和/或气体和蒸气的混合物冲洗。

Description

用于生产和填充容器的方法和设备
技术领域
本发明涉及用于由预成型坯生产容器的方法和用于所述方法的设备。
背景技术
根据专利公开文献DE4340291，容器的生产已知为：通过气体的和/或蒸气形式的压力媒介吹塑模制由热塑材料制成的预成型坯，诸如，例如由PET(聚对苯二甲酸乙二醇酯)制成的预成型坯，其中，预成型坯在吹塑机内侧传递到不同加工站。典型地，吹塑机包括用于对预成型坯加热或预加热(热调控)的加热设备以及具有至少一个吹塑站的吹塑设备，在吹塑站的区域中，预先加热的预成型坯在每种情况下双轴向或对轴向地膨胀，以形成容器。膨胀在压缩气体的协助下、例如在压缩空气的协助下实现，所述压缩空气作为压力媒介在腔体压力下被引入待膨胀的预成型坯中。具有这种膨胀的预成型坯的方法的技术顺序在专利公开文献DE4340291中说明。
吹塑站的基本构型在专利公开文献DE4212583中描述。加热预成型坯的可能性在专利公开文献DE2352926中说明。
根据典型的进一步加工方法，由吹塑模制制造的容器被传送到下游填充设备，并且在那里被期望产品或填充物质填充。因此，使用分开的吹塑机和分开的填充机器。同样已知的原理是，在这种情况下将分开的吹塑机和分开的填充机器结合以形成一个机器块体，即，以形成一个块体单元的吹塑和填充设备，其中，吹塑模制和填充在分开的机器构件处进行并且以时间顺序进行。
已经提出的是，尤其瓶子形式的容器由热调控或预先加热的预成型坯制造，并且在这种情况下同时地由液体含物填充，所述液体含物作为液压压力媒介引入，以通过膨胀或通过以腔体压力和填充压力径向和轴向拉伸或拉拔预成型坯来挤出容器，以使得在填充的同时相应的预成型坯被模制成容器。
就之前描述的所有方法而言，在填充期间必须注意到无菌的问题，以确保填充产品的长保存期限。许多液体含物也是对氧敏感的，并且就碳化液体而言，外来气体当在压降的情况下气体释放时具有病菌细胞的影响。
发明内容
本发明的目的是提出一种用于生产被液体含物填充的容器的方法和设备，其将确保填充产品的长保存期限。
为了实现这个目的，提出一种用于由预成型坯生产具有液体含物的容器的方法，通过所述方法，预成型坯在模具中的形成和填充阶段期间通过导入容器的液体含物的压力的作用被液压地或水动力地形成。根据本发明的方法的特征在于，预成型坯在形成和填充阶段的开始之前被排空至少一次。利用根据本发明的方法，尤其地，可以生产塑料容器，诸如PE、PP、PET瓶子、PET小桶等等。
也提出一种用于通过至少一个模制和填充站由预成型坯生产被液体含物填充的容器的设备，所述设备包括形成模具空间的至少一个模具、以及至少一个模具头。为了将相应预成型坯模制成容器，液体压力媒介能够经由模具头引入预成型坯的内部，预成型坯以其开口相对于模具头处于密封位置地定位。根据本发明的设备的特征在于，模具头设有用于对预成型坯的内部排空的装置，或尤其借助于管线功能性地连接到用于对预成型坯的内部排空的装置。
根据本发明的方法，预成型坯在形成和填充阶段的开始之前被排空至少一次。优选地，在至少一次排空之后，包含CO2或N2或由之构成的惰性气体或气体混合物(理想地惰性气体)被导入预成型坯以用于平衡压力的目的。预成型坯也能够替换性或补充地在排空之后由惰性气体冲洗。
优选地，利用根据本发明的真空形成，实现50至200mbar的压力。因此，所有外来气体从预成型坯的内部移除，外来气体可能有害地影响填充媒介、或可能对包含碳酸的液体在压降的情况下释放气体(诸如，氧气)产生病菌细胞的影响。与模制容器相比相对厚壁的预成型坯充分稳定以承受甚至相当的低压。待排空的容量相对小，因此根据本发明的方法是在经济上有利的。
在排空之后，预成型坯也能够被平衡压力和/或利用灭菌剂冲洗，尤其利用蒸气和/或气体和蒸气的混合物冲洗。蒸气在这种情况下能够是水蒸汽或蒸发的化学灭菌剂(尤其H2O2)。也能够使用灭菌气体或气体混合物制作为灭菌剂，尤其臭氧或臭氧和惰性气体的混合物制作为灭菌剂。
优选地，预成型坯的嘴部能够由辐射器灭菌，尤其由UV光或脉冲UV光灭菌。
模制和填充程序能够在排空或平衡压力、冲洗、和灭菌之后即刻开始。排空和冲洗也能够重复数次，以实现最大可能地排除预成型坯中的外来气体，外来气体代表预成型坯中的环境污染。
模制和填充程序然后按已知方式进行，其中，若有必要，预成型坯在开始模制过程之前被热调节。为此目的常用的温度介于70℃和120℃之间。热调节例如也能够通过在将预成型坯带入模具之前穿过加热通道或加热拉伸以通常方式发生。优选地，模具然后由此加热，以在通过抽空、冲洗、和/或灭菌对预成型坯进行预处理期间维持热调节。
已经依据方法准备的预成型坯能够在一个工作循环中在模制和填充阶段的框架内被液体填充媒介模制和填充。重新污染的危险能够通过即刻应用按顺序的方法步骤排除。
根据本发明的设备的模具头设有用于排空预成型坯的内部以生产真空的合适装置、或例如通过管线功能性地连接到所述装置，诸如，例如，连接至真空泵。能够在预成型坯的内部中实现的压力在这种情况下应优选介于50和200mbar之间。
在设备的有利实施方式中，至少一组模具头一起与共用低压或真空腔室连接，所述低压或真空腔室继而与用于排空的装置、诸如例如与真空泵连接。尤其地，所有模具头能够通过管线连接到单一真空腔室。真空腔室能够有利地形成为一个或多个环形煮沸器或环形管道。
设备能够设有用于热调节预成型坯的装置。
根据本发明的设备的模具头能够优选地也设有用于将诸如蒸气、气体和蒸气的混合物、臭氧、和/或H2O2的灭菌剂引入预成型坯的内部的装置。预成型坯由此能够有效地消毒。后续填充的填充媒介由此设有长保存期限。
模具头也能够设有用于将尤其包含CO2或N2或由之构成的惰性气体引入预成型坯的内部的装置。预成型坯因此能够有效地具有惰性，这同样促进填充媒介的长保存期限。
在优选的实施方式中，根据本发明的设备的模具头能够设有用于通过辐射器、尤其通过UV发射器或脉冲UV光的发射器对预成型坯的嘴部灭菌的装置。预成型坯因此能够在形成和填充阶段的开始之前被整体灭菌。完成的填充容器无需经历另一灭菌过程。
附图说明
在后文中基于附图通过示例性实施方式更加详细地描述本发明：
图1示出根据本发明的用于由预成型坯5生产被液体产品填充的容器的系统的示意性代表图。
具体实施方式
在图1中示出的系统设有至少一个模制和填充站1，所述至少一个模制和填充站分别包括形成模具腔室3的至少一个模具2。模具2被模具头4朝上关闭。
在图中由虚线代表的预成型坯5能够被引入模具且以预成型坯的开口6相对于模具头4处于密封位置地接触。
模具头4通过传递线路连接到用于液体产品的第一存储容器20，液体产品在借助于高压泵21的高压下保持在第一存储容器中且能够经由阀10传导到预成型坯5。传递的体积能够在这种情况下借助于磁感应式流量计(MID)22测量。
模具头4也通过传递线路连接到真空泵30，利用所述真空泵，大约100mbar的真空能够经由阀11在预成型坯5中产生。
模具头4也经由传递线路连接到用于产生蒸气的源头和/或H2O2存储容器40，以使得预成型坯5能够经由阀12被赋予蒸气，尤其水蒸汽或蒸发的H2O2。
模具头4也经由传递线路连接到CO2存储容器50，以使得预成型坯5能够经由阀13被赋予CO2。
依据根据本发明的方法生产被液体产品填充的容器以在下文中描述的方式发生：首先预成型坯5被引入打开的模具2且模具头4关闭，以使得预成型坯5的开口6与模具头4取得密封地接触。
在第一步骤中，阀11打开，以使得由真空泵30产生的真空能够在预成型坯5上起作用。预成型坯5被排空。与挤出的容器相反，预成型坯5非常稳定，以使得其能够抵抗强大低压。排空因此无问题。鉴于预成型坯5的小容量，排空能够在非常短的时间内发生，这对于在填充机器内的处理时间而言是重要的。
在下一步骤中，阀11关闭且阀12打开。因此，承受低压的预成型坯5与蒸气发生器和/或H2O2存储容器40连通且经历平衡压力。由于低压，水蒸汽和/或蒸发的H2O2被吸入预成型坯5的内部，并且预成型坯5的与液体产品接触的表面被灭菌。
在这个阶段结束之后，阀12关闭且阀11打开，以使得真空在预成型坯5的内部中再次形成。
在真空阀11关闭之后，阀13能够打开，由此预成型坯5的内部再次经历平衡压力且被CO2冲洗。就大多数饮料而言，CO2是惰性气体且不会引起饮料的变质。
在这个阶段结束之后，阀13再次关闭，并且通过打开阀10，形成和填充过程被设定为运行。在容器20中占据的形成和填充压力下，存在于预成型坯5中的惰性气体被强制排出，并且预成型坯变形成容器。不言自明的是，预成型坯在形成和填充阶段之前以通常和已知的方式被热调节。
概括而言，预成型坯5的拉伸由图中未示出的装置支持和控制。例如可以在模具中利用拉伸条，在预成型坯的基部上从下方接合的引导元件、或低压。这些手段的结合同样是可行的。对于所述方法尤其有利的是无传统拉伸条在预成型坯的内部或容器中使用，而是预成型坯在转变期间由外侧、优选由接合在基部的装置引导。
在容器挤出和填充之后，头部空间以合适的方式形成，容器经历平衡压力且被封闭。
明显的是，在此以示意形式示出的系统能够设有多个形成和填充站1，在所述形成和填充站处，多个容器能够同时或时间上偏离地形成。同样明显的是，示出的方法能够在排空和消毒的各种情况下、或相应在通过惰性气体排空和冲洗的各种情况下包括多于一个循环。
附图标记列表
1形成和填充站
2模具
3模制腔室
4模具头
5预成型坯
6预成型坯的开口
10用于液体含物传递的阀
11用于真空泵的阀
12用于蒸气发生器/H2O2存储容器的阀
13用于惰性气体存储容器的阀
20用于液体含物的存储容器
21高压泵
22磁感应式流量计(MID)
30真空泵
40H2O2存储容器，蒸气发生器
50CO2存储容器

Claims (12)

1.一种用于由预成型坯(5)生产被液体含物(20)填充的容器的方法，所述容器尤其诸如PE、PP、PET的瓶子、PET小桶等等，其中，预成型坯(5)在模具(2)中的形成和填充阶段期间通过导入容器的液体含物的压力的作用液压地或水动力地变形，其中所述预成型坯(5)在所述形成和填充阶段的开始之前被排空至少一次，其特征在于，所述预成型坯(5)在排空之后被平衡压力和/或被灭菌剂(40)冲洗、尤其被蒸气和/或气体和蒸气的混合物冲洗。
2.根据权利要求1所述的方法，其特征在于，所述蒸气是水蒸汽或蒸发的化学灭菌剂，尤其是H2O2。
3.根据权利要求1所述的方法，其特征在于，所述灭菌剂是灭菌气体或气体混合物，尤其是臭氧或具有惰性气体的臭氧。
4.根据权利要求1至3所述的方法，其特征在于，在预成型坯为了平衡压力的至少一次排空之后，惰性气体或气体混合物被导入预成型坯，理想地是包含CO2或N2或由之构成的惰性气体(50)被导入预成型坯。
5.根据权利要求1至4中任一所述的方法，其特征在于，在排空之后，所述预成型坯被惰性气体(50)冲洗。
6.根据权利要求1至3中任一所述的方法，其特征在于，预成型坯(5)被排空到50至200mbar的压力。
7.根据权利要求1至6中任一所述的方法，其特征在于，所述预成型坯(5)的嘴部被辐射器灭菌、尤其被UV光或脉冲UV光灭菌。
8.一种用于通过至少一个形成和填充站(1)由预成型坯(5)生产被液体含物填充的容器的设备，所述设备包括形成模具腔室(3)的至少一个模具(2)和至少一个模具头(4)，为了将相应预成型坯(5)转变成容器，液体压力媒介(20)能够借助于所述模具头引入预成型坯的内部(5)，所述预成型坯以其开口(6)相对于模具头(4)处于密封位置地定位，其中所述模具头(4)设有用于对预成型坯(5)的内部排空的装置(11，30)或尤其通过管线功能性地连接到用于对预成型坯的内部排空的装置，其特征在于，所述模具头(4)设有用于将灭菌剂引入预成型坯(5)的内部的装置(12，40)，所述灭菌剂尤其是蒸气、气体和蒸气的混合物、臭氧、和/或H2O2，并且其中，至少一组模具头(4)一起连接到共用低压或真空腔室，所述低压或真空腔室继而与用于排空的装置(11，30)连接，尤其地，所有模具头(4)通过管线连接到单一低压腔室。
9.根据权利要求8所述的设备，其特征在于，所述低压或真空腔室形成为一个或多个环形煮沸器或环形管道。
10.根据权利要求8或9所述的设备，其特征在于，所述设备设有用于对预成型坯(5)热调节的装置。
11.根据权利要求8至10中任一所述的设备，其特征在于，所述模具头(4)设有用于将惰性气体引入预成型坯(5)的内部的装置(13，50)，所述惰性气体尤其包含CO2或N2或由之构成。
12.根据权利要求8至11中任一所述的设备，其特征在于，所述模具头(4)设有用于通过辐射器、尤其通过UV发射器或脉冲UV光的发射器对预成型坯(5)的嘴部灭菌的装置。
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