WO2014121592A1 - 电子设备、电子系统及其电路板互联架构 - Google Patents

电子设备、电子系统及其电路板互联架构 Download PDF

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Publication number
WO2014121592A1
WO2014121592A1 PCT/CN2013/080965 CN2013080965W WO2014121592A1 WO 2014121592 A1 WO2014121592 A1 WO 2014121592A1 CN 2013080965 W CN2013080965 W CN 2013080965W WO 2014121592 A1 WO2014121592 A1 WO 2014121592A1
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WO
WIPO (PCT)
Prior art keywords
board
circuit board
signal
circuit
connector
Prior art date
Application number
PCT/CN2013/080965
Other languages
English (en)
French (fr)
Inventor
白磊
刘雄彪
彭乐雄
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP13874793.6A priority Critical patent/EP2945470B1/en
Priority to US14/103,085 priority patent/US8842441B2/en
Publication of WO2014121592A1 publication Critical patent/WO2014121592A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/735—Printed circuits including an angle between each other
    • H01R12/737—Printed circuits being substantially perpendicular to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Definitions

  • the present invention relates to the field of electronic circuits, and more particularly to an electronic device, an electronic system, and a circuit board interconnection structure thereof. Background technique
  • an electronic system of an electronic device such as a server, a router, a switch, and the like generally has a circuit having a specific function composed of a plurality of interconnected and interacting basic circuits, and a functional circuit portion thereof is mostly deployed and integrated on a circuit board.
  • the electrical connection between the functional circuits is realized by a connector.
  • Most of the circuit boards of the existing electronic devices adopt a layout arrangement of orthogonal architectures, that is, direct orthogonal insertion between the front-end circuit board of the electronic system and the connector on the rear-mounted circuit board, thereby realizing the circuit board. Electrical connection of each functional circuit part.
  • the technical problem to be solved by the embodiments of the present invention is to provide a circuit board interconnection architecture with high installation and matching precision and easy plugging.
  • an embodiment of the present invention further provides an electronic system using the circuit board interconnection architecture.
  • an embodiment of the present invention further provides an electronic device to which the electronic system is applied.
  • a circuit board interconnection structure comprising at least one first board and at least two second boards substantially perpendicular to the first board, at least one of the first board and the second board Opening a plurality of slots, the first board and the second board being connected by signals mounted on both sides of the slot
  • the device is mated and electrically connected.
  • An electronic system comprising at least one first board, at least two second boards, a plurality of first signal connectors and a plurality of second signal connectors, the first board being substantially perpendicular to the second board
  • the first signal connector is disposed on the first board
  • the second signal connector is disposed on the second board
  • at least one of the first board and the second board a plurality of slots are provided, the slots being between any two adjacent first signal connectors or between any two adjacent second signal connectors, or the slots are located in any two adjacent A signal connector and the slot are located between any two adjacent second signal connectors, and the first board and the second board are connected by the first signal connector and the second signal Plug-in connection.
  • An electronic device includes a housing and the above electronic system disposed within the housing.
  • the first board and the second board are slotted, the first board is vertically connected to the second board through the connector, the first board and the first board
  • the connector on the two circuit boards can simultaneously perform a misalignment movement in two directions perpendicular to the first circuit board and the second circuit board, thereby solving the orthogonal direction of the first board and the second board.
  • the accuracy of the fit Even if the first board and the second board have assembly tolerances, the connector still meets the assembly accuracy requirement, and after the first board and the second board are orthogonally interconnected, the The first circuit board and the second circuit board are integrally deformed.
  • FIG. 1 is a schematic diagram of assembly of a circuit board interconnection structure of an electronic system according to a preferred embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the circuit board interconnection architecture of the electronic system shown in FIG. 1.
  • FIG. 3 is a schematic view showing the connection of the first board and the first signal connector shown in FIG. 2.
  • an electronic system 1 is provided in an electronic device (not shown) such as a server, a router, a switch, and the like, and is integrally packaged as a circuit having a specific function. Inside the housing of the electronic device.
  • the electronic system 1 includes at least one first board 10, at least two second boards 20, a plurality of first signal connectors 30 mounted on the first board 10, and the second board 20 A number of second signal connectors 40 are provided.
  • the electronic system 1 includes four first boards 10 that are parallel to each other and four second boards 20 that are parallel to each other. The four first boards 10 and The four second boards 20 are vertically connected.
  • the first signal connector 30 is electrically connected to the first board 10
  • the second signal connector 40 is electrically connected to the second board
  • the two signal connectors 40 are connectable to each other such that an orthogonal architectural assembly connection is achieved between the first card 10 and the second board 20.
  • four first signal connectors 30 are mounted on each first board 10
  • four second signal connectors 40 are mounted on each second board 20 as an example.
  • the first signal connector 30 and the second signal connector 40 are integrally arranged in a matrix form on the first board 10 and the second board 20, and the first signal connector 30 is mounted. The positions correspond one-to-one with the mounting positions of the corresponding second signal connectors 40 to facilitate the plug-in connection.
  • Each of the first boards 10 includes a first substrate 11 and a first circuit board 13 .
  • the first circuit board 13 is mounted on the first substrate 11
  • the first substrate 11 is the first circuit board 13 .
  • the first substrate 11 may be made of a metal material such as copper or iron.
  • the first circuit board 13 is a support for an electronic component such as an integrated circuit, a connector, an electromechanical component, a sensor, and the like, and provides an electrical connection between the electronic components.
  • the first circuit board 13 may be a rinded circuit board (PCB).
  • a plurality of slots 132 are defined in the edge of the first circuit board 13.
  • the slots 132 are equally spaced at the edge of the first circuit board 13.
  • the slot 132 can be a rectangular slot. It can be 1 mm or 2 mm wide and has a length of 15 mm.
  • the distance between any two adjacent slots 132 may also be a non-equal interval. It is listed at the edge of the first circuit board 13, and is arranged in a decreasing or increasing manner according to the pitch, or the arrangement of the slots 132 is opened according to the installation and design position of the first signal connector 30.
  • the slot 132 is not limited to a rectangular slot, but may also be a triangular slot, a semi-elliptical slot, a semi-circular slot, or other shaped slot.
  • the first signal connector 30 is disposed at an edge of the first circuit board 13 of the first board 10 and electrically connected to the first circuit board 13.
  • the slot 132 is defined between any two adjacent first signal connectors 30. That is, each slot of the first circuit board 13 is provided with a first signal connection on both sides. 30.
  • Each of the second boards 20 includes a second substrate 21 and a second circuit board 23, the second circuit board 23 is mounted on the second substrate 21, and the second substrate 21 is the second circuit board 23.
  • the second substrate 21 may be made of a metal material such as copper or iron.
  • the second circuit board 23 is a support for an electronic component such as an integrated circuit, a connector, an electromechanical component, or a sensor, and provides an electrical connection between the electronic components.
  • the second circuit board 23 can also be a printed circuit board.
  • a plurality of slots 232 are defined in the edge of the second circuit board 23, and the slots 232 are equally spaced at the edge of the second circuit board 23.
  • the slot 232 can be a rectangular slot. It can be 1 mm or 2 mm wide and has a length of 15 mm.
  • the distance between any two adjacent slots 232 may also be non-equally spaced at the edge of the second circuit board 23, such as in a decreasing or increasing manner, or the slotting
  • the arrangement of the 232 is opened according to the installation and design position of the second signal connector 30.
  • the slot 232 is not limited to a rectangular slot, but may also be a triangular slot, a semi-elliptical slot, a semi-circular slot, or other shaped slot. It can be understood that the specific shape and size of the slot can be adjusted accordingly according to actual needs.
  • the slot 132 may also be cut at the edge of the first substrate 11 so as to form a slot of the above shape at the edge of the first board 10. Similarly, the slot 132 may also be cut at the edge of the second substrate 21 so as to form a slot of the above shape at the edge of the second board 20.
  • the second signal connector 40 is disposed at an edge of the second circuit board 23 of the second board 20 and electrically connected to the second circuit board 23.
  • the slot 232 is open at any adjacent Between the two second signal connectors 40, that is, the second signal connector 40 is mounted on both sides of each of the slots 232 of the second circuit board 23.
  • the first signal connector 30 and the corresponding second signal connector 40 are directly connected to each other, thereby realizing the first board 10 and the second board 20 Electrical connection between the two causes a current or signal transmission between the first circuit board 13 and the second circuit board 23.
  • the first board 10 and the second board 20 are vertically connected to form an orthogonal interconnection structure between the first board 10 and the second board 20.
  • the direction parallel to the plane of the first interposer 10 can be set to the X-axis direction and the axial direction.
  • the direction parallel to the plane of the first interposer 10 can be set to the Y-axis direction.
  • the first board 10 and the second board 20 are assembled, the first board 10 is located in the X-axis direction, and the second board 20 is located.
  • the Y-axis direction orthogonal to the X-axis direction will be described as an example.
  • the first signal connector 30 is mounted on the first circuit board 13, and the slot 132 is opened between any two adjacent first signal connectors.
  • the second signal connector 30 is provided.
  • the slot 232 is defined in the second circuit board 23 and between any two adjacent second signal connectors 40.
  • the first connector 30 is aligned with the corresponding second connector 40 and can be mated with the corresponding second connector 40, that is, arranged on the first circuit board 13 along the X-axis direction.
  • the first signal connector 30 is connected to the second signal connector 40 arranged on the second circuit board 23 in the Y-axis direction.
  • any two adjacent first signal connectors 30 of each first board 10 are provided with slots 132
  • any two adjacent second signal connectors 40 of each second board 20 are The opening is provided with a slot 232.
  • the first circuit board 13 region located between the adjacent ones of the slots 132 is positive or negative along the Y-axis.
  • the direction i.e., the direction perpendicular to the surface of the first circuit board 13
  • is offset that is, the first connector 30 located between the adjacent two slots 132 also occurs in the positive or negative direction of the Y-axis. mobile.
  • the area of the second circuit board 13 located between the adjacent ones of the slots 232 is in the positive or negative direction along the X axis (ie, vertical) Offset in a direction straight to the surface of the second circuit board 23, that is, the second connector 40 located between the adjacent two slots 232 is also along the X-axis in the positive or negative direction along the X-axis.
  • a movement has occurred. Therefore, by forming a groove between the first interposer 10 and the connector on the second interposer 20 which are orthogonal to each other, the orthogonal direction of the first interposer 10 and the second interposer 20 is solved.
  • the connector still meets the assembly accuracy requirement, and the first board 10 and the second board 20 can be avoided.
  • the first circuit board 13 and the second circuit board 23 are integrally deformed.
  • two or more slots may be formed between any two adjacent connectors on the first circuit board 13 and the second circuit board 23. Therefore, after the first board 10 and the second board 20 are orthogonally interconnected, the connectors on the first circuit board 13 and the second circuit board 23 can be perpendicular to the first circuit board 13 at the same time. And the direction of movement of the second circuit board 23, thereby solving the problem of the matching accuracy in the orthogonal direction of the first board 10 and the second board 20, even if the first board 10 and the second board 20 are assembled. Tolerance, the connector still meets the requirements of assembly accuracy, and after the first board 10 and the second board 20 are orthogonally interconnected, the first circuit board 13 and the second circuit board 23 are integrated. Deformation occurred.
  • only a plurality of slots may be formed in the first board 10 or the second board 20, that is, at least one of the first board 10 and the second board 20.
  • the slot is located between any two adjacent first signal connectors 30 or between any two adjacent second signal connectors 40, or the slot is located at any two adjacent first signal connections.
  • the first board 10 and the second board 20 are connected by the first signal connector 30 and the second signal.
  • the first signal connector 30 is offset in a direction perpendicular to the first circuit board 13 or the second signal connector is perpendicular to the second circuit board 23, or
  • the first signal connector 30 and the second signal connector 40 are offset in a direction perpendicular to the first circuit board 13 and the second circuit board 23, respectively.
  • a non-orthogonal interconnecting architecture may be used between the first interposer 10 and the second interposer 20, that is, the first interposer 10 and the second interposer
  • the board 20 is inserted and connected by a signal connector installed on both sides of the slot, and the plane where the first board 10 is located intersects with the plane where the second board 20 is located, and the angle between the two boards Not equal to 90 degrees.
  • a backplane structure (not shown) may be added between the first board 10 and the second board 20, and the first board 10 and the second board 20 pass through the back.
  • the board forms an interconnected architecture.
  • the first signal connector 30 of the first board 10 can correspond to the second signal connector 40 on the second board 20, the first board 10 and the second board
  • the at least one of the plurality of slots 20 is provided with a plurality of slots, and the first signal connector 30 is directly connected to the second signal connector 40; the first signal connector 30 of the first board 10 may not be
  • the second signal connector 40 on the second board 20 - correspondingly, at least one of the first board 10 and the second board 20 is provided with a plurality of slots, and the first signal connector 30
  • the second signal connector 40 is mounted on the backplane structure, and the current or signal between the first signal connector 30 and the second signal connector 40 is realized by internal routing of the backplane structure. transmission.
  • the first board 10 and the second board 20 are slotted, the first board 10 is vertically connected to the second board 20 through a connector, and the first The connector on the circuit board 13 and the second circuit board 23 can simultaneously perform a misalignment movement in two directions perpendicular to the first circuit board 13 and the second circuit board 23, thereby solving the first board 10 The problem of the matching accuracy in the direction orthogonal to the second interposer 20. Even if the first board 10 and the second board 20 have assembly tolerances, the connector still meets the assembly accuracy requirement, and the first board 10 and the second board 20 can be prevented from being orthogonally interconnected. Thereafter, the first circuit board 13 and the second circuit board 23 are integrally deformed.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

本发明公开了一种线路板互联架构，其包括至少一个第一插板及与该第一插板大致垂直的至少两个第二插板，所述第一插板与所述第二插板中的至少一个开设有若干开槽，该第一插板与所述第二插板通过装设于所述开槽两侧的信号连接器对插配合，并电性连接，该线路板互联结构解决了在该第一插板与第二插板正交方向上的配合精度问题，即使该第一插板与第二插板存在装配公差，则所述连接器仍然满足装配精度的要求，而且可以避免在所述第一插板与第二插板正交互联对接之后，所述第一线路板和第二线路板整体发生变形。本发明还提供一种电子系统及应用该电子系统的电子设备。

Description

电子设备、 电子系统及其电路板互联架构
技术领域
本发明涉及电子电路领域， 尤其涉及一种电子设备、 电子系统及其电路 板互联架构。 背景技术
目前， 服务器、 路由器、 交换机等电子设备的电子系统通常由若干相互 连接、 相互作用的基本电路组成的具有特定功能的电路整体， 其中的功能电 路部分大多部署、 集成于线路板上， 该线路板之间通过连接器来实现各功能 电路之间的电性连接。 现有的电子设备的线路板大多釆用正交架构的布局排 列方式， 即， 电子系统的前插线路板与后插线路板上的连接器之间直接正交 垂直对插， 从而实现线路板上的各功能电路部分的电性连接。
随着上述电子设备向着高密化发展， 其线路板的集成度越来越高， 且该 前插线路板与后插线路板上各连接器之间的距离越来越近， 排列密度越来越 大。 因此， 当前插线路板与后插线路板直接对插连接时， 二者之间会存在较 大的装配公差， 而且累积的公差链可能超过所述连接器配合精度的要求， 导 致装配有连接器的线路板在对插装配连接后发生变形。 此外， 由于各连接器 之间距离较近， 安装时， 需要对其施加较大的外力才可装配置线路板上。 发明内容
本发明实施例所要解决的技术问题在于， 提供一种安装配合精度高、 且 便于插接的电路板互联架构。
另外， 本发明实施例还提供一种应用该电路板互联架构的电子系统。 另外， 本发明实施例还提供一种应用该电子系统的电子设备。
一种线路板互联架构， 其包括至少一个第一插板及与该第一插板大致垂 直的至少两个第二插板， 所述第一插板与所述第二插板中的至少一个开设有 若干开槽， 该第一插板与所述第二插板通过装设于所述开槽两侧的信号连接 器对插配合， 并电性连接。
一种电子系统， 其包括至少一个第一插板、 至少两个第二插板、 若干第 一信号连接器及若干第二信号连接器， 该第一插板与所述第二插板大致垂直， 该第一信号连接器设置于所述第一插板上， 该第二信号连接器设置于所述第 二插板上， 所述第一插板与所述第二插板中的至少一个开设有若干开槽， 该 开槽位于任意相邻的两个第一信号连接器之间或任意相邻的两个第二信号连 接器之间， 或所述开槽位于任意相邻的两个第一信号连接器之间和所述开槽 位于任意相邻的两个第二信号连接器之间， 该第一插板及该第二插板通过所 述第一信号连接器及第二信号连接器对插连接。
一种电子设备， 包括外壳及设置于所述外壳内的上述电子系统。
综上所述， 通过在所述第一插板和第二插板开设开槽， 该第一插板通过 连接器与所述第二插板垂直对插连接时， 该第一线路板和第二线路板上的连 接器可同时在垂直于所述第一线路板和第二线路板的两个方向上发生错位移 动， 进而解决了在该第一插板与第二插板正交方向上的配合精度问题。 即使 该第一插板与第二插板存在装配公差， 则所述连接器仍然满足装配精度的要 求， 而且可以避免在所述第一插板与第二插板正交互联对接之后， 所述第一 线路板和第二线路板整体发生变形。 附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案， 下面将对实 施例或现有技术描述中所需要使用的附图作简单地介绍， 显而易见地， 下面 描述中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还可以根据这些附图获得其他的附图。
图 1 是本发明较佳实施例提供的一种电子系统的线路板互联架构组装示 意图。
图 2是图 1所示的电子系统的线路板互联架构的分解示意图。
图 3是图 2所示的第一插板与第一信号连接器的连接示意图。 具体实施方式
下面将结合本发明实施例中的附图， 对本发明实施例中的技术方案进行 清楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而 不是全部的实施例。 基于本发明中的实施例， 本领域普通技术人员在没有做 出创造性劳动前提下所获得的所有其他实施例 , 都属于本发明保护的范围。
请参阅图 1及图 2 , 本发明较佳实施例提供的一种电子系统 1 , 其可应用 于服务器、 路由器、 交换机等电子设备（图未示）， 并作为具有特定功能的电 路整体封装于该电子设备的壳体内。该电子系统 1包括至少一个第一插板 10、 至少两个第二插板 20、 装设于该第一插板 10上的若干第一信号连接器 30及 装设于该第二插板 20上的若干第二信号连接器 40。 在本发明实施例中， 以所 述电子系统 1包括四个相互平行的第一插板 10及四个相互平行的第二插板 20 为例加以说明， 所述四个第一插板 10与该四个第二插板 20垂直连接。
所述第一信号连接器 30与所述第一插板 10电性连接， 该第二信号连接 器 40与所述第二插板电性连接， 且该第一信号连接器 30与相应的第二信号 连接器 40可对插连接， 从而使得所述第一插板 10与所述第二插板 20之间实 现正交架构装配连接。 在本发明实施例中， 以每一第一插板 10上安装有 4个 第一信号连接器 30、 及每一第二插板 20上安装有 4个第二信号连接器 40为 例加以说明， 该第一信号连接器 30及第二信号连接器 40整体大致呈矩阵状 分配装设于所述第一插板 10及第二插板 20上， 且所述第一信号连接器 30的 安装位置与相应的第二信号连接器 40的安装位置一一对应， 以便于二者对插 连接。
每一所述第一插板 10包括第一基板 11及第一线路板 13 , 该第一线路板 13装设于该第一基板 11上，该第一基板 11为所述第一线路板 13提供支撑作 用。 在本发明实施例中， 该第一基板 11可由铜、 铁等金属材料制成。
请一并参阅图 3 , 该第一线路板 13为集成电路、 连接器、 机电元件、 传 感器等电子元器件的支撑体， 并为该电子元器件之间提供电气连接。 在本发 明实施例中， 该第一线路板 13可为印刷电路板 ( rinted circuit board, PCB )。 所述第一线路板 13的边缘处开设若干开槽 132, 该开槽 132等间隔排列于所 述第一线路板 13边缘处， 在本发明实施例中， 该开槽 132可为一矩形槽， 其 宽度可为 1毫米或 2毫米， 其长度为 15毫米。
在其他实施例中， 任意相邻两个开槽 132之间的距离也可为非等间隔排 列于所述第一线路板 13边缘处， 如按照间距递减或递增的方式排列， 或者该 开槽 132的排列方式根据所述第一信号连接器 30的安装、设计位置进行开设。
在其他实施例中， 该开槽 132 并不局限于矩形槽， 还可为三角形槽、 半 椭圓形槽、 半圓形槽或其他形状的开槽。
具体为， 所述第一信号连接器 30装设于该第一插板 10的第一线路板 13 的边缘处， 并与该第一线路板 13电性连接。 所述开槽 132开设于任意相邻的 两个第一信号连接器 30之间， 也即是说， 该第一线路板 13 的每个开槽 132 的两侧均装设有第一信号连接器 30。
每一所述第二插板 20包括第二基板 21及第二线路板 23 , 该第二线路板 23装设于该第二基板 21上，该第二基板 21为所述第二线路板 23提供支撑作 用。 在本发明实施例中， 该第二基板 21可由铜、 铁等金属材料制成。
该第二线路板 23为集成电路、 连接器、 机电元件、 传感器等电子元器件 的支撑体， 并为该电子元器件之间提供电气连接。 在本发明实施例中， 该第 二线路板 23也可为印刷电路板。 所述第二线路板 23的边缘处开设若干开槽 232, 该开槽 232等间隔排列于所述第二线路板 23边缘处， 在本发明实施例 中， 该开槽 232可为一矩形槽， 其宽度可为 1毫米或 2毫米， 其长度为 15毫 米。
在其他实施例中， 任意相邻两个开槽 232之间的距离也可为非等间隔排 列于所述第二线路板 23边缘处， 如按照间距递减或递增的方式排列， 或者该 开槽 232的排列方式根据所述第二信号连接器 30的安装、设计位置进行开设。
在其他实施例中， 该开槽 232 并不局限于矩形槽， 还可为三角形槽、 半 椭圓形槽、 半圓形槽或其他形状的开槽。 可以理解的是， 所述开槽的具体形 状和尺寸还可根据实际需要进行相应的调整。
在本发明实施例中， 所述开槽 132也可以在所述第一基板 11边缘处切割 形成， 从而在所述第一插板 10边缘处贯通形成上述形状的开槽。 同理， 所述 开槽 132也可以在所述第二基板 21边缘处切割形成，从而在所述第二插板 20 边缘处贯通形成上述形状的开槽。
具体为， 所述第二信号连接器 40装设于该第二插板 20的第二线路板 23 的边缘处， 并与该第二线路板 23电性连接。 所述开槽 232开设于任意相邻的 两个第二信号连接器 40之间， 也即是说， 该第二线路板 23 的每个开槽 232 的两侧均装设有第二信号连接器 40。
在本发明实施例中，所述第一信号连接器 30与对应的第二信号连接器 40 之间可直接对插连接， 从而实现了所述第一插板 10与所述第二插板 20之间 的电性连接， 进而实现所述第一线路板 13与所述第二线路板 23之间的电流 或信号传输。 此时， 所述第一插板 10与所述第二插板 20之间垂直连接， 从 而形成了该第一插板 10与第二插板 20之间的正交互联架构。 在本发明实施 例中， 具体为， 可设定平行于所述第一插板 10所在平面的方向为 X轴方向， 轴方向。
当然， 可以理解， 平行于所述第一插板 10所在平面的方向可设定为 Y轴 向。
请一并参阅图 1至图 3 , 组装所述第一插板 10与所述第二插板 20时， 在 此以所述第一插板 10位于 X轴方向， 所述第二插板 20位于与所述 X轴方向 正交的 Y轴方向为例加以说明。所述第一信号连接器 30装设于所述第一线路 板 13上，任意相邻的两个第一信号连接器之间 30开设有所述开槽 132, 所述 第二信号连接器 30装设于所述第二线路板 23上， 且任意相邻的两个第二信 号连接器之间 40开设有所述开槽 232。所述第一连接器 30与相应的第二连接 器 40——对准， 并可与对应的第二连接器 40——连接配合， 即， 在该第一 线路板 13上沿 X轴方向排列的第一信号连接器 30与所述第二线路板 23上沿 Y轴方向排列的第二信号连接器 40—一对插连接。
由于每个第一插板 10的任意相邻的两个第一信号连接器 30之间开设有 开槽 132,每个第二插板 20的任意相邻的两个第二信号连接器 40之间开设有 开槽 232, 此时， 为了满足所述连接器配合精度的要求， 位于所述相邻连个开 槽 132之间的第一线路板 13区域在沿着 Y轴的正方向或负方向（即垂直于该 第一线路板 13表面的方向）发生偏移， 即， 位于该相邻两个开槽 132之间的 第一连接器 30也沿着 Y轴的正方向或负方向发生移动。 同时， 位于所述相邻 连个开槽 232之间的第二线路板 13区域在沿着 X轴的正方向或负方向 (即垂 直于该第二线路板 23表面的方向）发生偏移， 即， 位于该相邻两个开槽 232 之间的第二连接器 40也沿着 X轴沿着 X轴的正方向或负方向发生移动。 因 此， 通过在相互正交的第一插板 10与第二插板 20上的连接器之间开设开槽， 同时解决了在该第一插板 10与第二插板 20正交方向上的配合精度问题， 即 使该第一插板 10与第二插板 20存在装配公差， 则所述连接器仍然满足装配 精度的要求， 而且可以避免所述第一插板 10与第二插板 20正交互联对接之 后， 所述第一线路板 13和第二线路板 23整体发生变形。
可以理解， 在其他实施例中， 所述第一线路板 13和第二线路板 23上任 意相邻的两个连接器之间可开设两个或两个以上的开槽。 因此， 当所述第一 插板 10与第二插板 20正交互联对接之后，该第一线路板 13和第二线路板 23 上的连接器可同时在垂直于所述第一线路板 13和第二线路板 23的方向移动， 进而解决了在该第一插板 10与第二插板 20正交方向上的配合精度问题， 即 使该第一插板 10与第二插板 20存在装配公差， 则所述连接器仍然满足装配 精度的要求， 而且可以避免所述第一插板 10与第二插板 20正交互联对接之 后， 所述第一线路板 13和第二线路板 23整体发生变形。
在其他实施例中， 可仅在所述第一插板 10或第二插板 20上开设若干开 槽， 即， 所述第一插板 10与所述第二插板 20中的至少一个上开设有若干开 槽。 如此， 该开槽位于任意相邻的两个第一信号连接器 30之间或任意相邻的 两个第二信号连接器 40之间， 或该开槽位于任意相邻的两个第一信号连接器 30之间， 并同时位于任意相邻的两个第二信号连接器 40之间， 该第一插板 10及该第二插板 20通过所述第一信号连接器 30及第二信号连接 40对插连接， 则该第一信号连接器 30在垂直于所述第一线路板 13的方向或所述第二信号 连接器在垂直于所述第二线路板 23的方向发生偏移， 或所述第一信号连接器 30和所述第二信号连接器 40分别在垂直于所述第一线路板 13和所述第二线 路板 23的方向发生偏移。
可以理解， 在其他实施例中， 所述第一插板 10与第二插板 20之间还可 釆用非正交的互联架构， 即， 所述第一插板 10与所述第二插板 20通过装设 于所述开槽两侧的信号连接器对插连接， 且该第一插板 10所在的平面与第二 插板 20所在的平面之间相交， 且二者之间的角度不等于 90度。 在其他实施例中， 所述第一插板 10与所述第二插板 20之间可增设一背 板结构 (图未示 ), 该第一插板 10与第二插板 20通过该背板形成互联架构。 具体为， 所述第一插板 10的第一信号连接器 30可以与第二插板 20上的第二 信号连接器 40——对应， 所述第一插板 10与所述第二插板 20中的至少一个 开设有若干开槽， 则该第一信号连接器 30与所述第二信号连接器 40直接对 插连接； 所述第一插板 10的第一信号连接器 30还可不与第二插板 20上的第 二信号连接器 40——对应， 所述第一插板 10与所述第二插板 20中的至少一 个开设有若干开槽， 则该第一信号连接器 30与所述第二信号连接器 40装设 于该背板结构上， 并通过该背板结构的内部走线实现所述第一信号连接器 30 与第二信号连接器 40之间的电流或信号传输。
综上所述， 通过在所述第一插板 10和第二插板 20开设开槽， 该第一插 板 10通过连接器与所述第二插板 20垂直对插连接时， 该第一线路板 13和第 二线路板 23上的连接器可同时在垂直于所述第一线路板 13和第二线路板 23 的两个方向上发生错位移动， 进而解决了在该第一插板 10与第二插板 20正 交方向上的配合精度问题。 即使该第一插板 10与第二插板 20存在装配公差， 则所述连接器仍然满足装配精度的要求， 而且可以避免在所述第一插板 10与 第二插板 20正交互联对接之后， 所述第一线路板 13和第二线路板 23整体发 生变形。
以上所揭露的仅为本发明一种较佳实施例而已，当然不能以此来限定本 发明之权利范围， 因此依本发明权利要求所作的等同变化， 仍属本发明所涵 盖的范围。

Claims

权 利 要 求 书
1. 一种线路板互联架构， 其包括至少一个第一插板及与该第一插板大致垂 直的至少两个第二插板， 其特征在于， 所述第一插板与所述第二插板中的至少 一个开设有若干开槽， 该第一插板与所述第二插板通过装设于所述开槽两侧的 信号连接器对插配合， 并电性连接。
2. 如权利要求 1所述的线路板互联架构， 其特征在于， 所述第一插板包括 第一基板及第一线路板， 该第一线路板装设于该第一基板上， 该第一线路板为 电子元器件的支撑体， 并为该电子元器件之间提供电气连接， 所述第一基板为 所述第一线路板提供支撑作用。
3. 如权利要求 2所述的线路板互联架构， 其特征在于， 所述第二插板包括 第二基板及第二线路板， 该第二线路板装设于该第二基板上， 该第二线路板为 电子元器件的支撑体， 并为该电子元器件之间提供电气连接， 所述第二基板为 所述第二线路板提供支撑作用。
4. 如权利要求 3所述的线路板互联架构， 其特征在于， 所述开槽开设于所 述第一线路板及第二线路板中的至少一个的边缘处， 并位于任意相邻的两个信 号连接器之间， 所述第一线路板与所述第二线路板之间通过对插连接的信号连 接器进行电流或信号传输。
5. 如权利要求 1所述的线路板互联架构， 其特征在于， 所述线路板互联架 构还包括背板结构， 该背板结构设置于所述第一插板与所述第二插板之间， 所 述第一插板和第二插板上的信号连接器通过该背板结构对插连接， 或者该第一 插板和第二插板上的信号连接器装设于该背板结构上， 并通过该背板结构电性 连接。
6. 如权利要求 1所述的线路板互联架构， 其特征在于， 所述开槽的截面形 状为矩形、 三角形、 半椭圓形和半圓形中的任意一种。
7. 一种电子系统， 其包括至少一个第一插板、 至少两个第二插板、 若干第 一信号连接器及若干第二信号连接器， 其特征在于， 该第一插板与所述第二插 板大致垂直， 该第一信号连接器设置于所述第一插板上， 该第二信号连接器设 置于所述第二插板上， 所述第一插板与所述第二插板中的至少一个开设有若干 开槽， 该开槽位于任意相邻的两个第一信号连接器之间或任意相邻的两个第二 信号连接器之间之间， 或所述开槽位于任意相邻的两个第一信号连接器之间， 并同时位于任意相邻的两个第二信号连接之间， 该第一插板及该第二插板通过 所述第一信号连接器及第二信号连接器对插连接。
8. 如权利要求 7所述的电子系统， 其特征在于， 所述第一插板包括第一基 板及第一线路板， 该第一线路板装设于该第一基板上， 所述第一信号连接器装 设于该第一插板的第一线路板的边缘处， 并与该第一线路板电性连接， 所述第 一基板为所述第一线路板提供支撑作用。
9. 如权利要求 8所述的电子系统， 其特征在于， 所述第二插板包括第二基 板及第二线路板， 该第二线路板装设于该第二基板上， 所述第二信号连接器装 设于该第二插板的第二线路板的边缘处， 并与该第二线路板电性连接， 所述第 二基板为所述第二线路板提供支撑作用。
10. 如权利要求 9所述的电子系统， 其特征在于， 所述开槽开设于所述第一 线路板和所述第二线路板中至少一个的边缘处， 所述第一线路板与所述第二线 路板之间通过对插连接的第一信号连接器及第二信号连接器进行电流或信号传 输， 该第一插板与第二插板之间形成互联架构， 该第一信号连接器在垂直于所 述第一线路板的方向或所述第二信号连接器在垂直于所述第二线路板的方向发 生偏移， 或所述第一信号连接器和所述第二信号连接器分别在垂直于所述第一 线路板和所述第二线路板的方向发生偏移。
11. 如权利要求 7所述的电子系统， 其特征在于， 所述开槽为矩形槽、 三角 形槽、 半圓形槽和半椭圓形槽中的任意一种。
12. 一种电子设备， 包括壳体及设置于该壳体内的如权利要求 6-10所述的 电子系统。
PCT/CN2013/080965 2013-02-05 2013-08-07 电子设备、电子系统及其电路板互联架构 WO2014121592A1 (zh)

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