WO2014120525A1 - Luminaire à del - Google Patents

Luminaire à del Download PDF

Info

Publication number
WO2014120525A1
WO2014120525A1 PCT/US2014/012485 US2014012485W WO2014120525A1 WO 2014120525 A1 WO2014120525 A1 WO 2014120525A1 US 2014012485 W US2014012485 W US 2014012485W WO 2014120525 A1 WO2014120525 A1 WO 2014120525A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
thermal interface
luminaire
housing
thermal
Prior art date
Application number
PCT/US2014/012485
Other languages
English (en)
Inventor
Scott T. ELLINGSON
Henry Skoczylas
Original Assignee
Atlas Lighting Products, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atlas Lighting Products, Inc. filed Critical Atlas Lighting Products, Inc.
Publication of WO2014120525A1 publication Critical patent/WO2014120525A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • This application is directed to a solid-state luminaire comprising an LED
  • LEDs light emitting diodes
  • LEDs Due to the increasingly widespread quest for energy savings, light emitting diodes (LEDs) have become more and more popular in the lighting industiy. LEDs are so popular because of their small size, fast on-time and quick on-off cycling, resistance to vibration damage, and high efficiency. LEDs present challenges for luminaire manufacturers, however, with respect to heat and glare.
  • LEDs radiate very little heat in the form of infrared radiation. Waste energy is dispersed as heat through the base of the LED.
  • LED luminaires incorporate a plurality of LEDs and the heat given off can be substantial. Over-driving an LED in high ambient temperatures may result in overheating the LED array, eventually leading to device failure. Adequate heat dissipation is desirable to maintain the long life of which LEDs are capable.
  • LED luminaires deal with the heat dissipation issue in one of two ways. Some luminaires incorporate air vents and complex heat sinks, sometimes involving fins on the exterior of the housing where they are visible to the consumer and aesthetically unappealing, and often requiring complicated internal housing to allow for weatherproofmg, Moreover, in many cases, because the number and size of LEDs affects heat dissipation requirements, the
  • PCT Application US 2012/028527 describes an improved LED luminaire that addresses the heat dissipation issue by incorporating stacked thermal interfaces which allow a dual path for quick heat dissipation. While this device addresses the issues described above, there remains an opportunity for improving the access to internal components.
  • An LED luminaire in accordance with a preferred embodiment of the subject invention comprises a luminaire housing, an LED light module, an LED driver, a diffuser, and reflectors.
  • the LED light module comprises at least one LED array, a first thermal interface structure, and at least two second thermal interface structures,
  • the first thermal interface is of sufficient size so that at least two of its outside edges contact or nearly contact at least two of the interior sides of the housing when the first interface is removably attached to the second thermal interfaces.
  • the first and second thermal interfaces together have sufficient surface area so as to maintain the ambient temperature within the luminaire housing at a level below which LED longevity significantly degrades. This may be accomplished through the incorporation of a plurality of fins on the sides of the thermal interfaces open to the interior of the housing.
  • thermal interfaces particularly when used in conjunction with a heat-conductive housing, allow for optimal thermal management by utilizing a dual path to quickly remove the heat from inside the luminaire into the surrounding air external to the luminaire.
  • This configuration of components further allows for easy access to the internal components of the luminaire for maintenance and replacement of the components.
  • Figure 1 depicts a disassembled, exploded view of one luminaire embodiment.
  • Figure 2 depicts a disassembled, exploded view of a second luminaire
  • Figure 3 depicts a disassembled, exploded view of a third luminaire embodiment.
  • Figures 4A and 4B provide a cutaway and a detail, cutaway view of the
  • Figure 5 depicts an exploded, cutaway view of an embodiment of an LED module and housing.
  • Figure 2-4B depict additional embodiments of the inventive thermal management system.
  • the exploded cutaway view shown in Figure 5 is a schematic representative of an exemplary embodiment of the inventive system
  • the LED hu inaires 10 of the depicted embodiments comprise variations on fraditional units, unmodified on the exterior but internally modified to provide a highly conductive thermal path to minimize LED junction temperatures.
  • the inventive system is not limited to conventional housings, but it was felt that utilizing such illustrations demonstrates the manner in which substantial improvements can be made without affecting the exterior look to which architects and other users have become accustomed.
  • the inventive thermal management design results in minimal temperature rise at the location of the one or more LEDs 70, thereby insuring higher lumen maintenance and more stable correlated color temperature over the life of the product.
  • Using a traditionally shaped and sized housing 24 offers end users the ability to enjoy the energy savings of LED technology without having to modify existing surroundings to accommodate new housing designs.
  • the luminaire housing 24 may be a wet location enclosure for protection of electrical components and connections.
  • the housing 24 is removably attached to a front face frame 22.
  • the housing 24 and front face frame 22 be of die cast aluminum, but the housing 24 and/or the front face frame 22 could be manufactured from other materials or in other ways.
  • Aluminum is the presently preferred material because it works well for the die casting process, and it also is lower in cost than other conventionally available alternatives, which include zinc, magnesium, and copper.
  • Aluminum is further preferred over zinc and magnesium due to its high thermal conductivity, an important aspect to assist in heat dissipation. Copper would be desirable as well, but the cost, and weight may make it less desirable than aluminum.
  • the housing 24 may be used as the primary means for mounting the luminaire
  • the housing may further comprise other components for mounting, such as is shown in the embodiments depicted in Figures 2 and 3.
  • the front face frame 22 and housing 24 enclose an LED driver 54 as well as the LED module 100 (see Figure 5) as shown, for example, in Figures 4A and 4B, which illustrate how these elements may be located for each of the described embodiments, although other suitable positioning could be selected by those skilled in the art,
  • the frame 22 may further act as a heat transfer mechanism to the exterior environment and provides a suitable mounting angle for the LED module 100.
  • the LED module 100 is mounted to the housing 24, The
  • LED module 100 in the depicted embodiment comprises of three main parts (schematically shown in Figure 5) - one or more LED arrays 50, one or more first thermal interface structures 61, and at least two second thermal interface structures 63, 63', 63".
  • the LED arrays 50 are printed circuit boards 52 containing one or more LEDs 70. Any shape or number of LEDs 70 may be used on the LED arrays 50, subject to size and number constraints imposed by fixture and circuit board dimensions and power limitations imposed by the selected LED driver 54. Further, the circuit board 52 could use multi-chip LEDs 70, use single or multi-array configurations, or contain secondary optics placed in conjunction with the LEDs 70 to modify the resulting light distribution.
  • the inventive thermal management system allows for optimum heat dissipation through a multi-layer heat sink.
  • An LED array 50 is comprised of an LED 70 and printed circuit board 52. When activated, the LED 70 generates heat at its base. The heat of the LED 70 first passes through the board 52. To allow for the most efficient heat dissipation, the board 52 may have a metal core, such as aluminum or copper.
  • the heat from the LED array 50 continues to dissipate, passing through a first thermal interface 61 attached to the underside of the circuit board 52.
  • This first interface 61 is at least as large as the LED array 50 and preferably is of sufficient size so that at least two of its outside edges contact or nearly contact at least two of the interior sides of the housing 24 when the first interface 61 is attached to the housing 24.
  • the first interface 61 in the embodiments depicted in Figures 1-4B is of a size such that each of its outside edges contact or nearly contact each of the interior sides of the housing 24.
  • a thermally conductive gap filler may be interposed between the first thermal interface 61 and the housing 24 at the overlapping area between the two.
  • points of contact between the LED array 50 and the first interface 61 may be attached through the use of a thermally conductive gap filler between the two.
  • a thermally conductive gap filler between the two.
  • Appropriate materials for the gap filler include ultra-soft acrylic elastomer, thermal grease, thermal tape, thermal adhesive, or some other material suitable to create a thermal path for heat dissipation. The main requirement is to use materials that are more heat-conductive than air.
  • the first thermal interface 61 is attached along at least two edges to at least two second thermal interfaces 63, 63', 63" as shown in the embodiments depicted in Figures 1-4B.
  • a thermally conductive gap filler may be interposed between the first thermal interface 61 and the second thermal interfaces 63, 63', 63" at the overlapping area 26 between the two as shown in Figure 4B.
  • the second thermal interfaces 63, 63', 63" provide two paths for heat dissipation.
  • the second thermal interface 63 is attached to the interior sides of the housing 24.
  • This second interface 63 provides a direct path for heat dissipation from the first thermal interface 61 to the housing 24, which then dissipates the heat to the ambient air.
  • a second path is provided from the first thermal interface 61 to the second interface 63 that provides a broad surface to dissipate heat to the air enclosed by the housing 24. This air, in ton, conducts the heat to the housing 24 via natural convection from whence it is conducted to the air external to the housing 24. Due to the effectiveness of this dual path for heat dissipation, there is no need for vents, exterior fins, or complex weatherproofing.
  • LED array 50 provides an easily modified mounting solution that is an improvement over attaching the LED array 50 directly to the housing 24. If the LED array 50 were mounted directly to the housing 24, any change in the size or type of arrays 50 would potentially mean modifying the housing 24 and, thus, the die cast molding. Changing hole sizes or positions in the first and second thermal interfaces 61 , 63, 63', 63" is much easier and can be accomplished in less time and at lower cost.
  • the second interfaces 63, 63', 63" comprise plates that are flat on at least the side pressed to the housing 24. These second interfaces 63, 63', 63" may be attached to the sides of the housing 24 such as with attachment material such as ultra-soft acrylic elastomer, thermal grease, thermal tape, thermal adhesive, or some other material suitable to create a thermal path for heat dissipation.
  • the first interface 61 is removably attached to the second interfaces 63, 63', 63" using fasteners such as screws. This configuration provides for much easier
  • this configuration of the luminaire 10 allows a repair person access to the driver 54 for replacement without the difficulty of prying a heat sink from a housing and then, after repair, having to use a hydraulic press to push the heat sink back into the housing.
  • a second advantage of this improved configuration is the ability of the customer to repair the fixture in the field. Should a driver 54 fail in the field, with the inventive luminaire 10 design, the customer need not return the luminaire 10 to the manufacturer for repair but instead may simply unscrew the first thermal interface 61 , repair or replace the driver 54, and then reattach the first thermal interface 61. This requires no special tools or machines and can even be done while leaving the luminaire 10 attached, for example, to a building or pole.
  • the first and second thermal interfaces 61 , 63, 63', 63" may be made of
  • first and/or second thermal interfaces 61, 63, 63', 63 " may comprise fms extending into the open space within the housing 24.
  • the incorporation of fms provides additional surface area to increase the effectiveness of heat dissipation.
  • a certain amount of surface area on a heat sink is required in order to dissipate a certain amount of heat. It is well known to persons skilled in the art that the efficacy of heat sinks can be improved by increasing their surface area.

Abstract

L'invention concerne un luminaire à DEL qui a un logement de luminaire, un module de lampes à DEL, et un pilote de DEL. Le module de lampes à DEL comprend au moins une matrice de DEL, une première interface thermique, et au moins deux secondes interfaces thermiques. La première interface thermique est fixée de manière amovible aux secondes interfaces thermiques. Les première et seconde interfaces thermiques ont une aire de surface suffisante pour maintenir la température ambiante dans le logement de luminaire à un niveau inférieure à celui où la longévité des DEL se dégrade significativement.
PCT/US2014/012485 2013-01-30 2014-01-22 Luminaire à del WO2014120525A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361758569P 2013-01-30 2013-01-30
US61/758,569 2013-01-30
US201361790024P 2013-03-15 2013-03-15
US61/790,024 2013-03-15

Publications (1)

Publication Number Publication Date
WO2014120525A1 true WO2014120525A1 (fr) 2014-08-07

Family

ID=51262846

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2014/012485 WO2014120525A1 (fr) 2013-01-30 2014-01-22 Luminaire à del

Country Status (1)

Country Link
WO (1) WO2014120525A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100124058A1 (en) * 2008-11-18 2010-05-20 Miller Michael R Thermal Management of LED Lighting Systems
US20100149809A1 (en) * 2006-09-30 2010-06-17 Ruud Lighting, Inc. Led lighting fixture
US20100314985A1 (en) * 2008-01-15 2010-12-16 Philip Premysler Omnidirectional LED Light Bulb
US20110286219A1 (en) * 2010-05-23 2011-11-24 Rab Lighting, Inc. LED Housing with Heat Transfer Sink
US20120236602A1 (en) * 2011-02-09 2012-09-20 Leader International Corporation Flat led lamp assembly
US20120262917A1 (en) * 2011-04-15 2012-10-18 Guy Courcelle Energy efficient street lighting led luminaire

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100149809A1 (en) * 2006-09-30 2010-06-17 Ruud Lighting, Inc. Led lighting fixture
US20100314985A1 (en) * 2008-01-15 2010-12-16 Philip Premysler Omnidirectional LED Light Bulb
US20100124058A1 (en) * 2008-11-18 2010-05-20 Miller Michael R Thermal Management of LED Lighting Systems
US20110286219A1 (en) * 2010-05-23 2011-11-24 Rab Lighting, Inc. LED Housing with Heat Transfer Sink
US20120236602A1 (en) * 2011-02-09 2012-09-20 Leader International Corporation Flat led lamp assembly
US20120262917A1 (en) * 2011-04-15 2012-10-18 Guy Courcelle Energy efficient street lighting led luminaire

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