WO2014102423A1 - Fuente de evaporación para el transporte de precursores químicos, y método de evaporación para el transporte de los mismos que utiliza dicha fuente - Google Patents
Fuente de evaporación para el transporte de precursores químicos, y método de evaporación para el transporte de los mismos que utiliza dicha fuente Download PDFInfo
- Publication number
- WO2014102423A1 WO2014102423A1 PCT/ES2013/070901 ES2013070901W WO2014102423A1 WO 2014102423 A1 WO2014102423 A1 WO 2014102423A1 ES 2013070901 W ES2013070901 W ES 2013070901W WO 2014102423 A1 WO2014102423 A1 WO 2014102423A1
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- WIPO (PCT)
- Prior art keywords
- main tube
- precursors
- tube
- transport
- chemical precursors
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4485—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation without using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
Definitions
- the present invention belongs to the technical field of the deposition of chemical precursors in a substrate, specifically to the deposition techniques by transporting the evaporated precursors by means of carrier gases to the substrate (VTD), "Vapor Transport Deposition "), applied for example for the realization of coatings or the manufacture of photovoltaic cells.
- the invention relates in particular to an evaporation source for transporting chemical precursors to a substrate, and to the evaporation method for transporting these chemical precursors used by the previous source.
- the CSS (acronym of the name of the technique in English "Cióse Space Sublimation") is an evaporation technique that is based on the heating of some precursors until their evaporation, and the condensation of these in a substrate that is placed immediately above the evaporator. Therefore, this technique does not use any carrier or carrier gas, to move precursors from one point to another in a gaseous state.
- VTD vacuum Transport Deposition
- a gas drag or carrier to move evaporated precursors from the evaporation source to the substrate that is at a certain distance and in a fixed position. This technique allows the deposition of precursors on substrates arranged at considerable distances from the evaporation source.
- the usual configuration of the inlet and outlet of the gases in the evaporation source is carried out at the top of it, and perpendicularly to the surface where the precursors are found.
- the precursors are located in the lower part of a main hollow tube, and the inlet and outlet tubes of the carrier gases are placed in the upper part of the tube, oriented towards the precursors, that is, in a direction parallel to the longitudinal direction of the tube.
- This configuration presents the problem that, when the carrier gases have a direct impact on the substrate, they really impact this, creating a turbulent regime, and dragging solid substances not evaporated from the precursor, so the deposition in the substrate will not be the expected in terms of quantity and quality, and also, these solid substances that transport the carrier gases can obstruct the transport tubes of the carrier gas, deteriorating the equipment and affecting its operation.
- the present invention solves the problems existing in the state of the art by means of an evaporation source for the transport of chemical precursors, to a substrate in which the deposition of these precursors is carried out by condensation.
- the source is formed by a main tube, with removable top and bottom lid for easy access to all parts of its interior.
- the main tube can be made of stainless steel, copper, titanium, etc., coated or not with some type of alloy to offer better resistance to temperature and corrosion. This coating can be made of nickel, vanadium, molybdenum, chromium or other mixtures of materials.
- the tube can have dimensions from 10 to 100 millimeters in diameter, or as appropriate even up to 1000 millimeters in diameter, depending on the amount of precursor and the deposition rate that is needed.
- the height of the tube can vary depending on the configuration of the input of the carrier gases and the amount of precursor to be evaporated, which can be from 10 to 100 millimeters, or greater depending on the needs.
- the tube houses inside the precursors that are to be evaporated and transported by means of carrier gases, or drag.
- the precursors that can be used must have chemical characteristics suitable for evaporation with the physical limits that can be achieved with the tools used. Examples of precursors can be halides, such as chlorides or fluorides of copper, gallium, selenium, indium, zinc, cadmium magnesium sulphide, tellurium, etc. It will depend on what material is intended to be formed by condensing the precursors transported in the substrate to choose the materials of the precursors to evaporate.
- these precursors are housed in the lower part of the tube, while in the upper part of the tube there is an inlet, through which an inlet tube of carrier gases is connected to the interior of the main tube, and an outlet, through the which connects an exit tube of carrier gases to the interior of the main tube, circulating through this outlet tube the carrier gases already with the evaporated precursors, for transport to the substrate.
- Both the gas inlet pipe to the main pipe, as well as the outlet pipe can be conventionally made of stainless steel, copper, titanium, etc., coated or not with some type of alloy to offer better temperature resistance. and corrosion.
- This coating can be made of nickel, vanadium, molybdenum, chromium or other mixtures of materials.
- These inlet and outlet tubes can have dimensions from 1 to 10 millimeters in diameter, or even up to 100 millimeters in diameter depending on the case and needs, depending on the amount of precursors and the deposition rate that you want to obtain. The length of this tube will depend on the distance to which the evaporated precursors must be transported.
- the gas inlet and outlet tubes can be connected to the main tube directly in holes made therein, or joined to the main tube by different means, such as by screwing, welding, or using intermediate connectors previously attached to holes made in the main tube.
- the drive system may have a vacuum system that will make the gases flow better through the tubes. That is to say, a trailing system formed by gases can only be used, in which the gases are injected by one end of the gas inlet tube, and by the end of the gas outlet tube its extraction is not favored, or either a dual system can be used in which, at the same time that gases are injected, the extraction of these by the outlet pipe is helped. Depending on the system chosen, it is possible to have one or another pressure of process, which will favor or hinder the purpose to be achieved.
- carrier, or entrainment gases these can conventionally be argon, nitrogen, oxygen, any noble gas, hydrogen, fluorine, chlorine or some mixture of the above.
- the gas flows that will be used can be encompassed from 1 to 200 sccm (standard cubic centimeters per minute), or even up to 1000 sccm according to needs.
- the evaporation source object of the present invention has heating means connected to the side surface of the main tube, which may consist of a resistance wound around the main tube, or embedded in it, or one or more heating lamps arranged outside the tube.
- These heating means can preferably be covered by a thermally insulating and non-conductive material, such as a ceramic material, to avoid fluctuations in the selected temperature.
- thermocouples To control the temperature inside and outside the main tube, temperature meters (thermocouples, PT1000, etc.) are arranged inside and / or outside it. These meters will preferably be resistant to corrosion.
- the inlet and outlet are disposed on the side surface of the main tube, opposite each other, and aligned along a common line that transversely crosses the side surface of the main tube.
- the inlet and the outlet are aligned along a common line perpendicular to the lateral surface of the main tube. Since the inlet and outlet tube are preferably arranged at a right angle to the main tube, the circulation of the carrier gases will be essentially parallel to the surface on which the precursors are arranged, and at a considerable distance from them.
- the inlet and the outlet are arranged aligned along a common line perpendicular to the lateral surface of the main tube, and diametrically opposed with respect to the axis of the main tube, although these may also show a slight angle deviation.
- the carrier gases enter the main tube without impacting the precursors, and separated at a certain distance from them.
- the gases enter in a direction parallel to the surface of evaporating precursors.
- the source object of the invention has the advantage that, thanks to its configuration, the carrier gas does not move or drag solid substances not evaporated from the precursor. Therefore, it prevents solid particles from being carried by the carrier gas to the substrate, altering the deposition of the precursor in it. In addition, it also prevents part of the solid particles entrained from clogging the pipes, eventually clogging and damaging them, as was the case with devices existing in the state of the art.
- the inlet pipe of the gases is connected to the inlet, and the outlet tube of the gases to the outlet of the main tube, and inside said main tube there is no physical communication between the inlet and the outlet , passing the gases from the inlet to the outlet through the inside of the tube directly.
- the gas inlet and outlet tubes will be fixed to the outer face of the main tube, the interior of said main tube being hollow.
- the inlet and outlet of the main tube can be connected through the interior thereof by means of a straight through connection tube, which has at least one opening, or several notches in the area shared with the main tube. In this way the flow will remain as laminar as possible and try to drag as much evaporated precursor.
- the source has one or more separation elements inside the main tube, as a plate or plate, which separates the lower part from the upper part of the tube.
- This separation element has notches or holes. This will be an isolated area in the upper part of the main tube where the gas inlet and outlet pipes are fixed to the outer face of this main tube. The evaporated precursors will pass through the notches or holes in the separation element and will reach the drag flow.
- the present invention relates to an evaporation method for the transport of chemical precursors, which uses the source described above.
- the precursors are arranged in the lower part of the main tube, and they are heated by means of the main tube heating means, until evaporation.
- carrier gases are introduced by means of an inlet tube connected to the main tube inlet, and the carrier gases are removed along with the evaporated precursors by means of an outlet tube connected to the main tube outlet. This introduction and extraction of the gases carrying the main tube are carried out aligned and in a transverse direction to the lateral surface of the main tube, preferably in a direction perpendicular to the lateral surface of the main tube.
- solid particles of the precursor are prevented from being carried by the carrier gas to the substrate, altering the deposition of the precursor therein, and also prevents solid particles carried by the carrier gas from obstructing the conductions deteriorating these and affecting the deposition, as it happens in the existing methods in the state of the art.
- evaporation of the precursors is favored due to the difference in pressure produced by the Venturi effect.
- Figure 1 a is a perspective view of an evaporation source for the transport of chemical precursors existing in the state of the art.
- Figure 1 b is a plan view of the source of Figure 1 a.
- Figure 1 c is an elevation view of the source of Figures 1 a and 1 b.
- Figure 2a is a perspective view of an embodiment of an evaporation source for the transport of chemical precursors object of the present invention.
- Figure 2b is a plan view of the source of Figure 2a.
- Figure 2c is an elevation view of the source of Figures 2a and 2b.
- Figure 3a is a perspective view of an alternative embodiment of an evaporation source for the transport of chemical precursors object of the present invention.
- Figure 3b is a section in plan.
- Figure 3c is a sectional elevation of the source of Figures 3a and 3b.
- Figure 4a is a perspective view of another different embodiment of an evaporation source for the transport of chemical precursors object of the present invention.
- Figure 4b is a section in plan.
- Figure 4c is a sectional view of the source of Figures 4a and 4b.
- An object of the present invention is a source of evaporation for the transport of chemical precursors, to a substrate in which the deposition of the precursors is carried out by condensation.
- the source object of the present invention is formed by a hollow main tube 1, with removable lower and upper covers 2, to provide access to its interior, which houses the precursors.
- the main tube 1 is made of a metallic material, which can be stainless steel, copper, titanium, or a combination of several of them.
- a coating made of an alloy of elements such as nickel, vanadium, molybdenum, chromium, and combination thereof.
- the main tube is divided into a lower part 3 in which the precursors are housed, and an upper part 4.
- an inlet 5 is arranged, through which a tube of inlet 9 of carrier gases into the main tube 1, and an outlet 6, through which an outlet tube 10 of carrier gases is connected to the interior of the main tube 1.
- the gas inlet and outlet tubes 10 can be connected to the main tube 1 directly, to the inlet 5 and outlet 6 respectively, or joined to the main tube 1 by different means, such as by screwing, welding, or using intermediate connectors previously connected to the inlet 5 and the outlet 6 of the main tube 1.
- the heating means 8 are connected to the side surface 7 of the main tube 1, and cause evaporation of the precursors.
- the heating means 8 may be formed a resistance arranged around the main tube 1, either rolled or embedded in it.
- the heating means 8 may consist of at least one heating lamp arranged externally to the main tube 1.
- meters can be used both inside and outside of it.
- the inlet 5 and the outlet 6 of the main tube 1 are arranged on the lateral surface of the latter, opposite each other, and aligned along a common line that transversely crosses the lateral surface 7 of the main tube 1.
- the inlet 5 and the outlet 6 are arranged aligned along a common line arranged perpendicularly to the side surface 7 of the main tube 1.
- inlet 5 and outlet 6 for carrier gases there are different alternatives for the connection between inlet 5 and outlet 6 for carrier gases.
- the inlet pipe 9 of the gases is connected to the inlet 5, and the outlet tube 10 of the gases to the outlet 6 of the main tube 1, and inside said main tube 1 there is no physical communication between the inlet 5 and the outlet 6, the gases from the inlet 5 passing to the outlet 6 through the inside of the main tube 1 directly.
- the gas inlet and outlet tubes 10 will be fixed to the outer face of the main tube 1, the interior of said main tube 1 being hollow. This embodiment is shown in Figures 2a, 2b and 2c.
- the inlet 5 and the outlet 6 of the main tube 1 can be connected through the interior thereof by means of a straight through connection tube 1 1, which has at least one opening 12, or several notches in the shared area with the main tube 1. In this way the flow will remain as laminar as possible and will carry as much evaporated precursor as possible.
- a straight through connection tube 1 1 which has at least one opening 12, or several notches in the shared area with the main tube 1.
- the source has a separation element 13 inside the main tube 1, as a plate or plate, which separates the lower part 3 from the upper part 4 thereof.
- This separation element 13 has notches or holes 14. This will be an isolated area in the upper part 4 of the main tube 1 where the gas inlet and outlet tubes 10 are fixed to the outer face of this main tube 1. The evaporated precursors will pass through the notches or holes 14 of the separation element 13 and will reach the carrier, or drag flow.
- this separation element 13 ensures that the flow of carrier gas is in a laminar, and not turbulent, regime, so that less thermal and transport losses will occur. This makes the heating and drag process more efficient.
- Figures 4a, 4b and 4c show a particular embodiment of the evaporation source of the present invention, which presents both the straight through connection tube 1 1 with at least one opening 12, and the separation element 13 inside the tube principal.
- main tube 1 a 100 mm high stainless steel hollow tube and DN25 diameter 2 caps are used at the ends.
- a coil resistance is provided to provide heat.
- a resistance of 1.5kW / m is used which allows a maximum temperature of 700 e C. to be reached.
- the main tube 1 is isolated by means of an insulating material to avoid temperature fluctuations, although it could also be carried out without insulation.
- the insulating material could be composed of a ceramic fiber-based material surrounded by an aluminum jacket, or a low emissive material for the main tube 1 and surrounded by a jacket to which it is made empty, avoiding losses by conduction, or by a refractory ceramic material.
- the inlet 5 and the outlet 6 are arranged, both in line, said transverse line to the main tube 1, forming a certain angle with it, which will preferably be straight.
- inlet 5 the inlet tube 9 of carrier gases is connected, and in outlet 6 the outlet tube 10 of carrier gases is connected.
- Both tubes, 9 and 10 are made of polished stainless steel, and have a diameter of 3/8 inch, although other diameters or configurations could be used. Conventionally, around these tubes 9 and 10 a resistance is arranged wound to provide heat. A resistance of 1.5kW / m is used which allows a maximum temperature of 700 e C. to be reached.
- This insulator is made of ceramic fiber surrounded by an aluminum jacket.
- meters are placed inside and outside the vertical tube, as well as inside and outside of tubes 9 and 10 to control the temperature at all times.
- Another object of the present invention is an evaporation method for the transport of chemical precursors, which uses the source described above.
- the precursors to be evaporated are located in the lower part 3 of the main tube 1 of the source, and they are heated by means of the heating means 8 of the main tube 1, until their evaporation.
- the carrier gases are introduced into the main tube 1 by means of an inlet tube 9 that is connected to the inlet 5 of the tube 1, and is removed together with the evaporated precursors from the inside of the main tube 1 by means of a tube output 10 connected to output 6.
- the introduction and extraction of the gases from the main tube 1 are carried out aligned in a transverse direction to the lateral surface 7 of the main tube 1, preferably in a direction perpendicular to the lateral surface of this main tube 1.
- the carrier gases enter the main tube 1 without impacting the precursors, and separated at a certain distance from them.
- the gases enter in a direction parallel to the surface of evaporating precursors.
- the evaporated material ascends through the main tube 1 and meets the flow of carrier gases, which collect only the precursors evaporated, maintaining a laminar regime, or as close as possible to it, and leaving through the outlet 6 of the main tube, being led to the substrate, in which the deposition is carried out by condensation.
- the coil resistance 8 is connected to the main tube 1 of 1.5 kW / m, providing a temperature of 450 e C.
- a flow control system is placed in the inlet tube 9 of the entrained gases, together with a valve and the source of said entrained gases.
- the process chamber in which the sample holder is placed where the evaporated precursor will be deposited is placed in series with this element.
- a 1000 l / s turbomolecular pump is provided with a valve to cancel or activate it, as well as a guillotine valve as required.
- a rotary of 100 m 3 / h is arranged. With this configuration, a base vacuum pressure of less than 1 x10 "5 Pa can be reached.
- the entrainment gas, or carrier will be an inert gas, in this case argon.
- the gas flow will be the one necessary to work at a pressure of 1 x10 "1 Pa.
- a flow of 200 sccm (standard cubic centimeters per minute) is estimated and the turbomolecular pump will be throttled so that the system is at this pressure.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020157017341A KR20150118089A (ko) | 2012-12-28 | 2013-12-19 | 화학 전구체를 운반하기 위한 증발원 및 이 증발원을 사용한 화학 전구체의 운반을 위한 증발 방법 |
CN201380068205.7A CN104919079A (zh) | 2012-12-28 | 2013-12-19 | 用于运送化学前体的蒸发源以及使用所述蒸发源的用于运送所述化学前体的蒸发方法 |
JP2015550121A JP2016505719A (ja) | 2012-12-28 | 2013-12-19 | 化学的な前駆体を搬送するための蒸発源、および上記蒸発源を用いて化学的な前駆体を搬送するための蒸発方法 |
EP13868160.6A EP2940179A4 (en) | 2012-12-28 | 2013-12-19 | EVAPORATING SOURCE FOR THE TRANSPORT OF CHEMICAL PRECURSORS AND EVAPORATING PROCESS FOR THE TRANSPORT OF CHEMICAL PRECURSORS USING THIS SOURCE |
US14/652,388 US20150329962A1 (en) | 2012-12-28 | 2013-12-19 | Evaporation source for transporting chemical precursors and method of evaporation for transporting the same which uses said source |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES201232063A ES2480865B1 (es) | 2012-12-28 | 2012-12-28 | Fuente de evaporación para el transporte de precursores químicos, y método de evaporación para el transporte de los mismos que utiliza dicha fuente. |
ESP201232063 | 2012-12-28 |
Publications (1)
Publication Number | Publication Date |
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WO2014102423A1 true WO2014102423A1 (es) | 2014-07-03 |
Family
ID=51019928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/ES2013/070901 WO2014102423A1 (es) | 2012-12-28 | 2013-12-19 | Fuente de evaporación para el transporte de precursores químicos, y método de evaporación para el transporte de los mismos que utiliza dicha fuente |
Country Status (7)
Country | Link |
---|---|
US (1) | US20150329962A1 (es) |
EP (1) | EP2940179A4 (es) |
JP (1) | JP2016505719A (es) |
KR (1) | KR20150118089A (es) |
CN (1) | CN104919079A (es) |
ES (1) | ES2480865B1 (es) |
WO (1) | WO2014102423A1 (es) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US11393703B2 (en) * | 2018-06-18 | 2022-07-19 | Applied Materials, Inc. | Apparatus and method for controlling a flow process material to a deposition chamber |
Citations (3)
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US20090304906A1 (en) * | 2006-09-29 | 2009-12-10 | Tokyo Electron Limited | Evaporating apparatus, apparatus for controlling evaporating apparatus, method for controlling evaporating apparatus, method for using evaporating apparatus and method for manufacturing blowing port |
US20100285218A1 (en) * | 2008-12-18 | 2010-11-11 | Veeco Instruments Inc. | Linear Deposition Source |
US20120017983A1 (en) * | 2010-07-23 | 2012-01-26 | Beck Markus E | Buffer layer formation |
Family Cites Families (5)
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JPS61213371A (ja) * | 1985-03-19 | 1986-09-22 | Sumitomo Electric Ind Ltd | 蒸着用ルツボ |
US5327998A (en) * | 1992-09-18 | 1994-07-12 | The United States Of America As Represented By The Secretary Of The Air Force | Lubrication by sublimation |
DE102006023046B4 (de) * | 2006-05-17 | 2009-02-05 | Qimonda Ag | Verfahren und Ausgangsmaterial zum Bereitstellen eines gasförmigen Precursors |
JP5527933B2 (ja) * | 2007-11-30 | 2014-06-25 | 東京エレクトロン株式会社 | 成膜装置の制御方法、成膜方法、成膜装置、有機el電子デバイスおよびその制御プログラムを格納した記憶媒体 |
KR101015277B1 (ko) * | 2008-12-10 | 2011-02-15 | 삼성모바일디스플레이주식회사 | 증발원 |
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2012
- 2012-12-28 ES ES201232063A patent/ES2480865B1/es not_active Expired - Fee Related
-
2013
- 2013-12-19 JP JP2015550121A patent/JP2016505719A/ja active Pending
- 2013-12-19 EP EP13868160.6A patent/EP2940179A4/en not_active Withdrawn
- 2013-12-19 US US14/652,388 patent/US20150329962A1/en not_active Abandoned
- 2013-12-19 CN CN201380068205.7A patent/CN104919079A/zh active Pending
- 2013-12-19 KR KR1020157017341A patent/KR20150118089A/ko not_active Application Discontinuation
- 2013-12-19 WO PCT/ES2013/070901 patent/WO2014102423A1/es active Application Filing
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Also Published As
Publication number | Publication date |
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KR20150118089A (ko) | 2015-10-21 |
EP2940179A4 (en) | 2016-02-10 |
JP2016505719A (ja) | 2016-02-25 |
ES2480865B1 (es) | 2015-05-20 |
ES2480865A1 (es) | 2014-07-28 |
CN104919079A (zh) | 2015-09-16 |
EP2940179A1 (en) | 2015-11-04 |
US20150329962A1 (en) | 2015-11-19 |
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