WO2014079285A1 - Pavé tactile à verre unique et procédé de fabrication - Google Patents

Pavé tactile à verre unique et procédé de fabrication Download PDF

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Publication number
WO2014079285A1
WO2014079285A1 PCT/CN2013/084964 CN2013084964W WO2014079285A1 WO 2014079285 A1 WO2014079285 A1 WO 2014079285A1 CN 2013084964 W CN2013084964 W CN 2013084964W WO 2014079285 A1 WO2014079285 A1 WO 2014079285A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
monolithic glass
carrier layer
touch panel
thickness
Prior art date
Application number
PCT/CN2013/084964
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English (en)
Chinese (zh)
Inventor
林清山
陈猷仁
Original Assignee
宸鸿科技(厦门)有限公司
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Application filed by 宸鸿科技(厦门)有限公司 filed Critical 宸鸿科技(厦门)有限公司
Publication of WO2014079285A1 publication Critical patent/WO2014079285A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Definitions

  • the present invention relates to touch technology, and in particular to a monolithic glass touch panel and a method of fabricating the same.
  • a conventional technique for fabricating a monolithic glass touch panel is described, which first forms a release layer on the carrier substrate 10 (release).
  • the layer 12 has a larger support carrier 14 formed thereon, and after the touch structure 16 is completed on the support carrier, the edge is cut along the edges C and C' of the release layer 12, and the release layer 12 is utilized.
  • the adhesion of the carrier substrate 10 is not good, and the carrier substrate 10 is separated from the release layer 12, the support carrier 14, the touch structure 16 and the like, and a glass cover (not shown) is attached to obtain a single piece. Glass trackpad.
  • the present invention provides a manufacturing method that can effectively solve this problem.
  • the present invention provides a monolithic glass touch panel comprising: a cover plate; a carrier layer having a patterned conductive layer including a sensing electrode; a signal conductor electrically connected to the carrier layer Sensing electrode, wherein the signal wire is concentrated to at least one bonding region, and the bonding region is located on at least one outer side of the sensing electrode, wherein a thickness of the carrier layer of the bonding region is greater than a thickness of the carrier layer of the non-bonding region; A bonding glue is disposed between the cover plate and the carrier layer for engaging the cover plate and the carrier layer.
  • the present invention further provides a method for fabricating a monolithic glass touch panel, comprising: S1: providing a substrate; S2: forming a carrier layer on the substrate, wherein the thickness of the carrier layer preset to the bonding region is greater than the non-bonding region a thickness of the carrier layer; S3: forming a patterned conductive layer on the carrier layer; S4: forming a signal wire electrically connected to the sensing electrode, and the signal wire is concentrated to at least one bonding region, the bonding region is located The sensing electrode has at least one outer side; S5: attaching a cover plate to the patterned conductive layer, and removing the substrate from the carrying layer.
  • the stress applied to the bearing layer of the joint region can be buffered when the substrate is removed, thereby reducing the possibility of the circuit board falling off or being damaged in the joint region.
  • the touch panel is not applied to the touch display device. Affects the light transmittance of the main touch panel.
  • Figure 1 is a cross-sectional view showing a conventional method of fabricating a single-piece glass trackpad.
  • 2A-2D are a series of cross-sectional views illustrating the flow of a method of fabricating a monolithic glass trackpad of the present invention in accordance with an embodiment of the present invention.
  • 3A-3B illustrate a patterned conductive layer in accordance with an embodiment of the present invention.
  • 4A-4B are cross-sectional views showing a single-piece glass track panel of the present invention in accordance with another embodiment of the present invention.
  • 5A-5C are partial schematic views of another embodiment of a sensing electrode of a monolithic glass trackpad in accordance with the present invention.
  • the present invention provides several embodiments for illustrating the technical features of the present invention, and the contents of the embodiments and the drawings are only for illustrative purposes. It is not intended to limit the scope of the invention.
  • Non-essential elements may be omitted from the drawings, and different features may not be drawn to scale and are for illustrative purposes only.
  • the present disclosure may have overlapping element symbols in different embodiments and does not represent an association between different embodiments or drawings.
  • an element formed "above”, “above”, “below” or “below” another element may include an embodiment in which two elements are in direct contact, or may include other additional elements interposed between the two elements.
  • the various components may be displayed at any different scale to make the illustration clear and concise.
  • FIGS. 2A-2D for a series of cross-sectional views according to an embodiment of the present invention for explaining the flow of the method for fabricating the monolithic glass touch panel of the present invention.
  • a substrate 410 is provided, and a plastic layer 422 is formed on the substrate 410.
  • the substrate 410 serves as a mechanical support for the structure formed in the subsequent step, and may be a transparent or opaque substrate such as a glass substrate, but the material thereof is not limited thereto.
  • the plastic layer 422 has a release ability, which may include polyimide (PI), polypropylene (PP), polystyrene (PS), acrylonitrile butadiene styrene resin (ABS), polyparaphenylene Ethylene formate (PET), polyvinyl chloride (PVC), polycarbonate (PC), polyethylene (PE), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE), or a combination thereof .
  • the plastic layer 422 may be a single layer or a multi-layer structure, or may be a stacked structure composed of a material having a release property of the lower layer and a material having no release property of the upper layer.
  • the plastic layer 422 is made to have a first thickness H1 at the land M of the predetermined bonding circuit board, the second thickness H2 is outside the land M (non-joining area), and the first thickness H1 is greater than the second thickness H2.
  • the first thickness H1 can be between about 0.5 microns and 15 microns, and the second thickness H2 can be between about 0.5 microns and about 10 microns.
  • This step can be carried out by printing, lithography, and spraying.
  • a buffer layer 424 is formed on the plastic layer 422, and the buffer layer 424 and the plastic layer 422 together form a carrier layer 420 on the substrate 410.
  • the carrier layer 420 can include only the plastic layer 422, ie, the buffer layer 424 is not formed.
  • the buffer layer 424 can be formed of any transparent material.
  • the buffer layer 424 is made of silicon oxide and can be chemically deposited (Chemical). Vapor Deposition, CVD) or other suitable method.
  • the buffer layer 424 can employ an adhesion promoter (Adhesion) containing functional groups of two different characteristics.
  • the adhesion promoter comprises a functional group of an organophilic material and a functional group of a hydrophilic material, wherein the functional group of the organophilic material may be an amine group, a hydroxyl group, an epoxy group or the like, and the functional group of the parent material may be a hydrogenthio group,
  • An adhesion promoter having an amino group, a hydroxyl group, a phosphate group or the like and a functional group having both of these properties has a good adhesion to an inorganic substance or an organic substance, thereby ensuring that the buffer layer 424 can be adapted to different plastic layer materials.
  • the buffer layer 424 can have a thickness of between about 10 angstroms and about 3,000 angstroms.
  • the buffer layer 424 has a higher hardness relative to the plastic layer 422.
  • the carrier layer 420 composed of the higher hardness buffer layer 424 and the ductile plastic layer 422 can simultaneously have good release ability and superior load carrying capacity. To improve the reliability of other components subsequently formed on the carrier layer 420. Further, by making the plastic layer 422 and the buffer layer 424 a composite film layer, A carrier layer 420 having both good mechanical strength and release ability can be obtained.
  • the touch panel is subsequently applied to the touch display device. It does not affect the light transmission of the main touch panel.
  • a conductive layer 430 is formed on the carrier layer 420, and the conductive layer 430 is patterned to form the sensing electrode 432.
  • the conductive layer 430 is a see-through conductive material, and may include indium tin oxide, aluminum zinc oxide, zinc oxide, tin oxide germanium, tin dioxide, indium oxide, nano silver, carbon nanotubes, or a combination thereof. It is formed using physical or chemical vapor deposition, printing, evaporation, spraying or other suitable methods.
  • the patterning step described above can be carried out by any suitable method, such as a lithography and etching step.
  • the patterned conductive layer 430 can also be directly formed by screen printing, spraying, or the like. Please also refer to FIG. 3A.
  • FIG. 3A illustrates a patterned conductive layer 430 that can be used in FIG. 2B.
  • the sensing electrode 432 can be formed on the carrier layer 420 by this patterning process step.
  • the sensing electrode 432 includes a plurality of strip electrodes, but other touch structures may also be used.
  • the signal wires 440 are electrically connected to the sensing electrodes 432 and are concentrated to at least one of the bonding regions M, and the bonding regions M are located on at least one outer side of the sensing electrodes 432. It should be noted that the position and number of the joint regions M can be adjusted according to the specific electrode structure, and are not limited to the positions and the numbers shown.
  • the signal conductor 440 is used to transmit the signal generated by the sensing electrode 432 to an external circuit.
  • the material of the signal conductor 440 may include copper, aluminum, silver, gold, molybdenum aluminum molybdenum alloy, indium tin oxide (ITO), or a combination thereof.
  • a bonding step is then performed to electrically connect the circuit board 470 to the sensing electrode 432.
  • One end of the circuit board 470 can be connected to the signal wire 440 of the bonding area M by the conductive adhesive 460, and then electrically connected to the sensing electrode 432 by the signal wire 440, and a control chip (not shown) can be connected to the other end. And thereby controlling the wafer to be electrically connected to an external circuit (not shown), such as a printed circuit board.
  • the circuit board 470 can be a flexible printed circuit board (Flexible Printed Circuits, FPC), conductive adhesive 460 can use anisotropic conductive adhesive (Anisotropic Conductive Film, ACF).
  • the signal generated by the sensing electrode 432 can be transmitted to the external circuit through the circuit board 470, and the coordinate of the touch position can be obtained after the IC operation and the system interpretation.
  • the sensing electrode 432, the signal wire 440, and the circuit board 470 formed on the carrier layer 420 constitute a touch structure of the main body.
  • the bonding glue 450 is attached from above the sensing electrode 432. Since the bonding region M is formed with the conductive paste 460 and the circuit board 470, the bonding region M is relatively uneven with respect to other regions, so that the bonding yield is improved and the bubble is generated in the bonding region M when the bonding adhesive 450 is attached.
  • the joint area is opened, that is, the joint area M is not covered by the bonding glue 450.
  • Bonding adhesive 450 can be selected from materials with good light transmittance, such as solid optical adhesive (Solid) Optical Clear Adhesive) or Liquid Optical Clear Adhesive).
  • the bonding paste 450 may include a transparent synthetic resin such as Acrylic.
  • the bonding glue 450 can be attached to the sensing electrode 432 by using a hot pressing process of heating and pressing. After the hot pressing is completed, the bonding glue 450 is fixed on the sensing electrode 432, so that the overall strength of the touch structure can be further improved. .
  • a step of laminating the bonding glue 450 may be performed to separate the plurality of touch structures formed on the same large-sized substrate, and the cutting step may be performed by cutter wheel cutting or laser cutting. the way.
  • the bonding glue 450 may be attached first, and then the circuit board 470 is bonded.
  • the cover 480 is attached over the touch structure, and the substrate 410 in FIG. 2C is removed from the carrier layer 420 (release).
  • the cover 480 is used to protect the touch structure, and may include a transparent material such as glass.
  • the light shielding layer 490 may be formed on the edge of the cover 480. More specifically, the light shielding layer 490 is located on the side of the cover 480 that is engaged with the touch structure. In another embodiment, the light shielding layer 490 can be located on the other side opposite the joint surface. The light shielding layer 490 is used to shield the signal wires 440 to ensure that the single-chip glass touch panel is not seen by the user during use, which affects the visual appearance.
  • the material of the light shielding layer 490 may be a colored ink or a colored photoresist.
  • the method of releasing the substrate 410 from the carrier layer 420 may be solution immersion, heat treatment, cold treatment, external force detachment or a combination thereof. More specifically, when the solution is immersed in the solution, the solution may be water, alcohol, propylene glycol methyl ether acetate (PGMEA) solution, polyvinylidene fluoride (NMP) solution, etc.; heat treatment and cold treatment are used to heat the substrate 410 or Cooling, using the different thermal expansion rates of the carrier layer 420 and the substrate 410, generates stress and facilitates release. Moreover, the order in which the cover plate is attached and the substrate is removed is adjustable, and is not limited to the above sequence.
  • the monolithic glass touch panel 400 formed through the above process includes: a cover 480; a carrying layer 420,
  • the carrier layer 420 is formed with a patterned conductive layer, including a sensing electrode 432, a signal wire 440 electrically connected to the sensing electrode, and the signal wire 440 is concentrated to at least one bonding region M, and the bonding region M At least one outer side of the sensing electrode 432, wherein the thickness of the bearing layer of the bonding area M is greater than the thickness of the bearing layer of the non-bonding area; the circuit board 470, the signal wire 440 electrically connected to the bonding area M; and the bonding glue 450
  • the cover 480 and the carrier layer 420 are disposed to engage the cover 480 and the carrier layer 420.
  • the carrier layer 420 includes a plastic layer 422 and a buffer layer 424.
  • the plastic layer 422 has a first thickness H1 at the land M, and a second thickness H2 outside the land M, the first thickness H1 is between 0.5 microns and 15 microns, and the second thickness H2 can be between about 0.5 microns. Between about 10 microns.
  • the edge of the cover 480 is formed with a light shielding layer 490 for shielding the signal wires 440, ensuring that the single-chip glass touch panel 400 is not seen by the user during use, affecting the visual appearance.
  • Other characteristics of the components of the monolithic glass trackpad 400 have been described in detail in the process, and are not described herein.
  • the purpose of thickening the thickness of the carrier layer 420 of the bonding region M is achieved by making the plastic layer 422 of the bonding region M have a thick thickness H1, so that the stress of the bonding region M of the carrier layer 420 is affected when the substrate 410 is removed. Buffering can be obtained, thereby reducing the likelihood of the board 470 of the landing zone M falling off or being damaged.
  • the non-joining area of the carrier layer 420 does not need to be correspondingly thickened, it does not affect the light transmittance of the overall single-chip glass touch panel.
  • the signal line 440 of the splicing area M is subsequently shielded by the light shielding layer 490, that is, the splicing area M is not the touch area of the main body. Therefore, when the touch panel is applied to the touch display device, the main body touch panel is not affected. Translucency.
  • the main components and manufacturing methods of the single-chip glass touch panel 500 are substantially similar to those of the single-chip glass touch panel 400 .
  • the difference is that the strengthening step of the embodiment further includes the circuit in the bonding area M.
  • the gap between the plate 570 and the carrier layer 520 fills the adhesive 551.
  • the additional adhesive 551 may be a solid optical adhesive, a liquid optical adhesive or the like.
  • the sensing electrodes may be other aspects in addition to the strip structure shown in FIG. 3A.
  • the sensing electrode 432 shown in the first embodiment is taken as an example to illustrate another aspect of the sensing electrode.
  • the sensing electrode 432 includes a plurality of first electrode blocks arranged along the first direction. 432a, a plurality of first wires 432c connecting adjacent first electrode blocks 432a, and a plurality of second electrode blocks 432b arranged in a second direction, and each of the second electrode blocks 432b is distributed on both sides of the first wires 432c.
  • the first direction and the second direction are perpendicular to each other.
  • an insulating block P is further formed on each of the first wires 432c.
  • the insulating block P may be made of an insulating material such as an epoxy resin.
  • a second wire 433 connecting the adjacent second electrode block 432b, and a signal wire 440 are further formed on each of the insulating blocks P.
  • the second wire 433 and the signal wire 440 may be formed at the same time or may be formed one after another.
  • the second wire 433 may be of the same material as the signal wire 440, such as copper, aluminum, silver, gold, molybdenum aluminum molybdenum alloy, indium tin oxide (ITO), or a combination thereof.
  • the second wire 433 can also be made of a material different from the signal wire 440.
  • Other characteristics of the sensing electrode 432 and the signal conductor 440 are the same as those of the previous embodiment, and are not described herein again.
  • the stress applied to the bearing layer of the joint region can be buffered, thereby reducing the edge region of the bearing layer of the joint region.
  • the component is prone to detachment or damage.
  • the non-joining zone bearing layer is not thickened, and the joint zone is subsequently shielded by the light shielding layer, that is, the joint zone is not the touch of the main body. Control area, so when the touch panel is applied to the touch display device It does not affect the light transmission of the main touch panel.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

L'invention concerne un pavé tactile à verre unique comprenant: un cache; une couche de support, une couche conductrice avec motifs étant formée sur la couche de support et comprenant une électrode de détection; un conducteur de signaux connecté électriquement à l'électrode de détection, lequel conducteur de signaux converge dans au moins une zone de jonction, la zone de jonction se situant sur au moins un côté externe de l'électrode de détection, et l'épaisseur de la couche de support dans la zone de jonction étant supérieure à l'épaisseur de la couche de support hors de la zone de jonction; et une colle de fixation disposée entre le cache et la couche de support, et servant à joindre le cache et la couche de support. La présente invention concerne également un procédé de formation d'un pavé tactile à verre unique. L'utilisation de ce pavé tactile à verre unique permet de régler le problème lors du processus de fabrication lié au fait que la structure tactile dans la zone marginale de la couche de support risque de tomber ou d'être endommagée, augmentant ainsi le rendement du pavé tactile à verre unique.
PCT/CN2013/084964 2012-11-22 2013-10-10 Pavé tactile à verre unique et procédé de fabrication WO2014079285A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210479192.XA CN103838407B (zh) 2012-11-22 2012-11-22 单片玻璃触控板及其制作方法
CN201210479192.X 2012-11-22

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WO2014079285A1 true WO2014079285A1 (fr) 2014-05-30

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TW (2) TWI591520B (fr)
WO (1) WO2014079285A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106569625A (zh) * 2015-10-11 2017-04-19 宝宸（厦门）光学科技有限公司 触控感测装置及其制作方法
TWI588703B (zh) * 2015-08-31 2017-06-21 宸鴻科技（廈門）有限公司 觸控面板及其製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103425338A (zh) * 2013-07-25 2013-12-04 柳杰 触摸屏中间体及触摸屏加工方法
CN105404407B (zh) * 2014-08-16 2019-01-22 宸鸿科技(厦门)有限公司 具有柔性触控感测器的触控面板及其制作方法
CN105856707B (zh) * 2015-01-18 2019-04-16 昇印光电（昆山）股份有限公司 一种可离型印刷薄膜、复合型印刷结构及制作方法
CN107526203A (zh) * 2017-03-14 2017-12-29 惠科股份有限公司 一种显示装置及其制程

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102200866A (zh) * 2010-03-24 2011-09-28 上海天马微电子有限公司 互电容触摸感应装置及其检测方法、触摸显示装置
CN202217249U (zh) * 2011-09-01 2012-05-09 宸鸿科技(厦门)有限公司 镜片触控装置
CN203178950U (zh) * 2012-11-22 2013-09-04 宸鸿科技(厦门)有限公司 单片玻璃触控板
CN203232387U (zh) * 2012-11-22 2013-10-09 宸鸿科技(厦门)有限公司 单片玻璃触控板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1376212A1 (fr) * 2002-06-21 2004-01-02 Asulab S.A. Cellule d'affichage, notamment à cristal liquide, ou cellule photovoltaique comprenant des moyens pour sa connexion à électronique de commande
GB0327093D0 (en) * 2003-11-21 2003-12-24 Koninkl Philips Electronics Nv Active matrix displays and other electronic devices having plastic substrates
EP2641883A4 (fr) * 2011-02-01 2014-10-01 Micro Technology Co Ltd Corps lié de substrat de verre en plaque mince et son procédé de fabrication
CN202472601U (zh) * 2011-04-22 2012-10-03 扬升照明股份有限公司 触控装置
TWM425339U (en) * 2011-05-20 2012-03-21 Henghao Technology Co Ltd Direct-patterned window type capacitive touch panel and touch-display panel using the same
CN102495702A (zh) * 2011-11-29 2012-06-13 黄山市中显微电子有限公司 一种抗干扰的单玻璃电容式触控面板及其制作方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102200866A (zh) * 2010-03-24 2011-09-28 上海天马微电子有限公司 互电容触摸感应装置及其检测方法、触摸显示装置
CN202217249U (zh) * 2011-09-01 2012-05-09 宸鸿科技(厦门)有限公司 镜片触控装置
CN203178950U (zh) * 2012-11-22 2013-09-04 宸鸿科技(厦门)有限公司 单片玻璃触控板
CN203232387U (zh) * 2012-11-22 2013-10-09 宸鸿科技(厦门)有限公司 单片玻璃触控板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI588703B (zh) * 2015-08-31 2017-06-21 宸鴻科技（廈門）有限公司 觸控面板及其製造方法
CN106569625A (zh) * 2015-10-11 2017-04-19 宝宸（厦门）光学科技有限公司 触控感测装置及其制作方法

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TWM455213U (zh) 2013-06-11
TW201421320A (zh) 2014-06-01
CN103838407B (zh) 2018-01-16
CN103838407A (zh) 2014-06-04

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