WO2014073297A1 - 光インターコネクション装置 - Google Patents
光インターコネクション装置 Download PDFInfo
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- WO2014073297A1 WO2014073297A1 PCT/JP2013/076923 JP2013076923W WO2014073297A1 WO 2014073297 A1 WO2014073297 A1 WO 2014073297A1 JP 2013076923 W JP2013076923 W JP 2013076923W WO 2014073297 A1 WO2014073297 A1 WO 2014073297A1
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- Prior art keywords
- light
- light receiving
- light emitting
- semiconductor
- semiconductor substrate
- Prior art date
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- 230000003287 optical effect Effects 0.000 title claims abstract description 56
- 239000004065 semiconductor Substances 0.000 claims abstract description 101
- 239000000758 substrate Substances 0.000 claims abstract description 90
- 239000012535 impurity Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000000137 annealing Methods 0.000 claims description 6
- 229910052795 boron group element Inorganic materials 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910052696 pnictogen Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 230000010365 information processing Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
- H04B10/803—Free space interconnects, e.g. between circuit boards or chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by at least one potential or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (6)
- 積層配置された複数の半導体基板間で光信号の送受信を行う光インターコネクション装置であって、
一つの前記半導体基板に配置された複数の発光素子又は受光素子は、前記半導体基板を共通の半導体層とするpn接合部を備え、
異なる前記半導体基板間で光信号の送受信を行う一対の前記発光素子と前記受光素子は、共通波長での発光と受光をそれぞれ行うことを特徴とする光インターコネクション装置。 - 一つの前記半導体基板に配置される複数の発光素子のうち互いに隣接配置された発光素子は、異なる波長での発光を行うことを特徴とする請求項1記載の光インターコネクション装置。
- 一つの前記半導体基板に配置される複数の受光素子のうち互いに隣接配置された受光素子は、異なる波長での受光を行うことを特徴とする請求項1又は2記載の光インターコネクション装置。
- 前記共通の半導体層はn型Si層であり、当該n型Si層に不純物をドープすることで当該n型Si層との境界付近に前記pn接合部を形成するp型半導体層が形成され、
前記発光素子又は前記受光素子のそれぞれは、アニール処理で前記不純物を拡散させる過程で照射される光の波長によって、前記共通波長が特定されることを特徴とする請求項1~3のいずれかに記載された光インターコネクション装置。 - 前記不純物は13族元素から選択される材料であることを特徴とする請求項4に記載された光インターコネクション装置。
- 異なる前記半導体基板間で光信号の送受信を行う一対の前記発光素子と前記受光素子の間に配置される前記半導体基板には、前記光信号を透過させる光透過部が設けられることを特徴とする請求項5に記載された光インターコネクション装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020157011465A KR20150082266A (ko) | 2012-11-08 | 2013-10-03 | 광 인터커넥션 장치 |
US14/441,498 US20150280835A1 (en) | 2012-11-08 | 2013-10-03 | Optical interconnection device |
CN201380058348.XA CN104813598A (zh) | 2012-11-08 | 2013-10-03 | 光互连装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012246685A JP2014096684A (ja) | 2012-11-08 | 2012-11-08 | 光インターコネクション装置 |
JP2012-246685 | 2012-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014073297A1 true WO2014073297A1 (ja) | 2014-05-15 |
Family
ID=50684414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/076923 WO2014073297A1 (ja) | 2012-11-08 | 2013-10-03 | 光インターコネクション装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150280835A1 (ja) |
JP (1) | JP2014096684A (ja) |
KR (1) | KR20150082266A (ja) |
CN (1) | CN104813598A (ja) |
TW (1) | TW201421720A (ja) |
WO (1) | WO2014073297A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014150520A (ja) * | 2013-01-11 | 2014-08-21 | V Technology Co Ltd | 光インターコネクション装置 |
JP2015012047A (ja) * | 2013-06-26 | 2015-01-19 | 株式会社ブイ・テクノロジー | 受光素子及びその製造方法 |
US9806067B2 (en) * | 2015-07-20 | 2017-10-31 | Globalfoundries Inc. | Die-die stacking |
CN107785379B (zh) * | 2016-08-31 | 2020-11-06 | 京东方科技集团股份有限公司 | 显示面板及其制造方法和显示装置 |
JP6661594B2 (ja) * | 2017-12-12 | 2020-03-11 | ファナック株式会社 | モジュール及び電子機器 |
JP2020109799A (ja) * | 2019-01-07 | 2020-07-16 | 富士通株式会社 | 電子装置、電子装置の製造方法及び電子機器 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5717189A (en) * | 1980-07-07 | 1982-01-28 | Fujitsu Ltd | Semiconductor light-emitting element |
JPS60136556U (ja) * | 1984-02-22 | 1985-09-10 | オムロン株式会社 | 光波長多重伝送装置 |
JPH0256973A (ja) * | 1988-08-22 | 1990-02-26 | Nippon Telegr & Teleph Corp <Ntt> | 多層光配線板 |
JPH0777632A (ja) * | 1993-07-12 | 1995-03-20 | Ricoh Co Ltd | 受光モジュール |
US20040234232A1 (en) * | 2001-03-29 | 2004-11-25 | Levy Paul S. | Open air optical channel |
JP2009188579A (ja) * | 2008-02-05 | 2009-08-20 | Yokogawa Electric Corp | 電子機器 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2576692B2 (ja) * | 1993-07-14 | 1997-01-29 | 日本電気株式会社 | 波長多重用光デバイスの製造方法 |
JP4239439B2 (ja) * | 2000-07-06 | 2009-03-18 | セイコーエプソン株式会社 | 光学装置およびその製造方法ならびに光伝送装置 |
JP2004022901A (ja) * | 2002-06-18 | 2004-01-22 | Seiko Epson Corp | 光インターコネクション集積回路、光インターコネクション集積回路の製造方法、電気光学装置および電子機器 |
US8687664B2 (en) * | 2006-03-08 | 2014-04-01 | Agere Systems Llc | Laser assembly with integrated photodiode |
KR101240558B1 (ko) * | 2007-11-05 | 2013-03-06 | 삼성전자주식회사 | 광 연결 수단을 구비한 멀티칩 |
JP5717189B2 (ja) * | 2011-02-25 | 2015-05-13 | 国立大学法人 名古屋工業大学 | 進相コンデンサ用制御装置 |
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2012
- 2012-11-08 JP JP2012246685A patent/JP2014096684A/ja active Pending
-
2013
- 2013-10-03 US US14/441,498 patent/US20150280835A1/en not_active Abandoned
- 2013-10-03 KR KR1020157011465A patent/KR20150082266A/ko not_active Application Discontinuation
- 2013-10-03 CN CN201380058348.XA patent/CN104813598A/zh active Pending
- 2013-10-03 WO PCT/JP2013/076923 patent/WO2014073297A1/ja active Application Filing
- 2013-11-07 TW TW102140563A patent/TW201421720A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5717189A (en) * | 1980-07-07 | 1982-01-28 | Fujitsu Ltd | Semiconductor light-emitting element |
JPS60136556U (ja) * | 1984-02-22 | 1985-09-10 | オムロン株式会社 | 光波長多重伝送装置 |
JPH0256973A (ja) * | 1988-08-22 | 1990-02-26 | Nippon Telegr & Teleph Corp <Ntt> | 多層光配線板 |
JPH0777632A (ja) * | 1993-07-12 | 1995-03-20 | Ricoh Co Ltd | 受光モジュール |
US20040234232A1 (en) * | 2001-03-29 | 2004-11-25 | Levy Paul S. | Open air optical channel |
JP2009188579A (ja) * | 2008-02-05 | 2009-08-20 | Yokogawa Electric Corp | 電子機器 |
Non-Patent Citations (1)
Title |
---|
T. KAWAZOE ET AL.: "Highly efficient and broadband Si homojunction structured near-infrared light emitting diodes based on the phonon-assisted optical near-field process", APPLIED PHYSICS B, vol. 104, 16 June 2011 (2011-06-16), pages 747 - 754 * |
Also Published As
Publication number | Publication date |
---|---|
TW201421720A (zh) | 2014-06-01 |
CN104813598A (zh) | 2015-07-29 |
JP2014096684A (ja) | 2014-05-22 |
US20150280835A1 (en) | 2015-10-01 |
KR20150082266A (ko) | 2015-07-15 |
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