WO2014071722A1 - 一种连接器及电子设备 - Google Patents

一种连接器及电子设备 Download PDF

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Publication number
WO2014071722A1
WO2014071722A1 PCT/CN2013/074270 CN2013074270W WO2014071722A1 WO 2014071722 A1 WO2014071722 A1 WO 2014071722A1 CN 2013074270 W CN2013074270 W CN 2013074270W WO 2014071722 A1 WO2014071722 A1 WO 2014071722A1
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WO
WIPO (PCT)
Prior art keywords
conductive contact
signal
interface
power
enhancement circuit
Prior art date
Application number
PCT/CN2013/074270
Other languages
English (en)
French (fr)
Inventor
肖聪图
赵志刚
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP13753081.2A priority Critical patent/EP2804270A4/en
Priority to US14/034,142 priority patent/US9160116B2/en
Publication of WO2014071722A1 publication Critical patent/WO2014071722A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Definitions

  • the present invention relates to the field of communications technologies, and in particular, to a connector and an electronic device.
  • FIG. 1 is a schematic structural diagram of a backplane and a circuit board connected by a connector in a prior art electronic device.
  • the components constituting the high speed second circuit board link include a backplane 11, a circuit board 12, a circuit board 15, a connector 10, and a connector 14.
  • the connector 14 is used to connect the back board 11 and the circuit board 15, and the connector 10 is used to connect the back board 11 and the circuit board 12.
  • the circuit board 12 is provided with a chip 16, and the circuit board 13 is provided with a chip 13, and the back board 11, the circuit board 12, the circuit board 15, the connector 14, and the connector 10 are internally provided with internal circuit connecting lines (not shown in FIG. ).
  • the connector 14 is connected to the backplane 11 and the circuit board 15, and the connector 10 is connected to the backplane 11 and the circuit board 12, the chip 16 and the chip 13 are electrically connected.
  • FIG. 2 is a specific circuit diagram of a connector connecting a second circuit board and a circuit board in the prior art.
  • FIG. 2 further illustrates a specific circuit connection relationship between the connector 10 of FIG. 1 and the backboard 11 and the circuit board 12.
  • the connector 10 includes conductive contacts 101, 102, 103, 104 (for clarity of illustration in Figure 2, only the four contacts are used as an illustration, the actual number of contacts is as shown in Figure 2.
  • the conductive contacts 105, 106, 107, 108 ibid.
  • the conductive contacts 101, 102, 103, 104 are selectively insertable into the backplane 11, and the conductive contacts 105, 106, 107, 108 are selectively inserted into the circuit board 12, and the conductive contacts 101 and the conductive contacts 108 are
  • the internal electrical connection is realized in the connector 10, and the conductive contact 102 and the conductive contact 107 realize internal electrical connection in the connector 10.
  • the conductive contact 103 and the conductive contact 106 realize internal electrical connection in the connector 10, and the conductive contact
  • the head 104 and the conductive contacts 105 achieve an internal electrical connection in the connector 10. Therefore, when the circuit board 12 is connected to the back board 11 through the connector 10, a plurality of electrical connections can be formed between the back board 11 and the circuit board 12, and data transmission is performed by using the multi-path electrical connection.
  • the inventor of the present application found that the signal transmission speed requirement of the future high-speed second circuit board link is getting faster and faster, for example, it will gradually increase from the current 10G to 17G, and it is expected to be upgraded from 17G to 25G again.
  • signal attenuation will only get bigger and bigger.
  • Due to the limitation of the traditional circuit board trace loss if you need to achieve a link speed of 25G, you need to use M6 board or use high-speed cable scheme to control the signal attenuation occurring in the internal circuit connection line.
  • the price of M6 sheet and high-speed cable is very expensive, which will increase the cost.
  • a high-speed cable is used instead of the above connection method, tens of thousands of lines on the second circuit board are replaced by cable connections, which makes the design scheme extremely complicated.
  • Another solution employed in the prior art is to add an equalizer to the board 12 connected to the connector 10 to increase the signal amplitude and thereby control signal attenuation.
  • the space on the circuit board 12 has been very tight, and adding an equalizer on the circuit board 12 will increase the product volume.
  • the technical problem to be solved by the present invention is to provide an embodiment of a connector and an electronic device capable of controlling signal attenuation at a high transmission data rate without increasing the volume.
  • a connector including: a first interface, a second interface, and a signal enhancement circuit, wherein at least one of the first interface and the second interface includes a power contact, and the power contact is connected to an external power supply to supply power to the signal enhancement circuit.
  • the casing, the signal enhancement circuit is disposed inside the casing and serially connected between the first interface and the second interface, and the signal enhancement circuit performs signal amplification processing on the differential signal received by the first interface and passes the second
  • the interface output, the first interface and the second interface are disposed on different surfaces outside the casing.
  • the first interface includes a first conductive contact, a second conductive contact, a third conductive contact, and a fourth conductive contact, the first conductive contact a head and a second conductive contact for receiving a differential signal from outside the housing, a third conductive contact for receiving a ground signal from outside the housing, and a fourth conductive contact as a power contact for receiving power from outside the housing;
  • signal enhancement The circuit includes a first input end, a second input end, a first output end, a second output end, a ground end, and a power input end, the first input end is connected to the first conductive contact, and the second input end is connected to the second conductive contact a head connection, the ground end is connected to the third conductive contact, the power input end is connected to the fourth conductive contact, the signal enhancement circuit obtains the differential signal through the first input end and the second input end, and performs signal amplification processing;
  • the second interface includes a fifth conductive contact, a sixth conductive contact,
  • the first interface includes a first conductive contact, a second conductive contact, a third conductive contact, a first conductive contact, and a second conductive contact
  • the head is for receiving a differential signal from the outside of the casing
  • the third conductive contact is for receiving a ground signal from the outside of the casing
  • the signal enhancement circuit includes a first input terminal, a second input terminal, a first output terminal, a second output terminal, a grounding end and a power input end, the first input end is connected to the first conductive contact, the second input end is connected to the second conductive contact, the ground end is connected to the third conductive contact, and the signal enhancement circuit passes through the first input end and
  • the second input terminal acquires a differential signal and performs signal amplification processing
  • the second interface includes a fifth conductive contact, a sixth conductive contact, a seventh conductive contact, and an eighth conductive contact, and the fifth conductive contact and the first output The terminal connection is connected, the sixth
  • the fifth conductive contact and the first output and the sixth conductive contact A coupling capacitor is disposed between the second output terminals to perform a DC blocking process on the differential signal subjected to signal amplification processing.
  • the signal enhancement circuit is an equalizer.
  • the voltage value of the power supply is 1.8V or 3.3V.
  • a second aspect provides an electronic device, including a first circuit board, a second circuit board, and a connector, where the connector includes: a first interface, a second interface, and a signal enhancement circuit, and at least one of the first interface and the second interface
  • the power contact is connected to the external power supply to supply power to the signal enhancement circuit
  • the outer casing, the signal enhancement circuit is disposed inside the outer casing and serially connected between the first interface and the second interface, and the signal enhancement circuit is configured to
  • the differential signal received by the interface is subjected to signal amplification processing and output through the second interface, and the first interface and the second interface are disposed on different surfaces outside the casing; at least one of the first circuit board and the second circuit board A power output is provided, and the power contact is connected to the power output, and the power is taken from the power output to supply power to the signal enhancement circuit.
  • the first interface includes a first conductive contact, a second conductive contact, a third conductive contact, and a fourth conductive contact, the first conductive contact
  • the head and the second conductive contact are for receiving a differential signal from the first circuit board
  • the third conductive contact is for receiving a ground signal from the first circuit board
  • the fourth conductive contact is received as a power contact from the first circuit a power output outputted by the power output of the board
  • the signal enhancement circuit includes a first input end, a second input end, a first output end, a second output end, a ground end, and a power input end, the first input end and the first conductive contact a head connection, a second input end is connected to the second conductive contact, the ground end is connected to the third conductive contact, the power input end is connected to the fourth conductive contact, and the signal enhancement circuit is obtained through the first input end and the second input end Differential signal and performing signal amplification processing
  • the second interface includes a
  • the first interface includes a first conductive contact, a second conductive contact, a third conductive contact, a first conductive contact, and a second conductive contact
  • the header is configured to receive a differential signal from the first circuit board
  • the third conductive contact is configured to receive a ground signal from the first circuit board
  • the signal enhancement circuit includes a first input end, a second input end, a first output end, and a first a second output end, a ground end and a power input end, the first input end is connected to the first conductive contact, the second input end is connected to the second conductive contact, the ground end is connected to the third conductive contact
  • the signal enhancement circuit passes the An input terminal and a second input terminal acquire a differential signal and perform signal amplification processing
  • the second interface includes a fifth conductive contact, a sixth conductive contact, a seventh conductive contact, and an eighth conductive contact, and the fifth conductive contact Connected to the first output end, the sixth conductive contact is
  • the fifth conductive contact and the first output end and the sixth conductive contact A coupling capacitor is disposed between the second output terminals to perform a DC blocking process on the differential signal subjected to signal amplification processing.
  • the signal enhancement circuit is an equalizer.
  • the voltage value of the power supply is 1.8V or 3.3V.
  • a third aspect provides a connector including at least one wire group, a casing, and a signal enhancement circuit.
  • the signal enhancement circuit is disposed inside the casing, and the wire group includes a plurality of wire bodies, wherein at least one wire body of the wire group is connected to a power source external to the casing And power the signal enhancement circuit.
  • the wire body group includes a four-wire body, wherein one wire body supplies power to the signal enhancement circuit, one wire body is grounded, and the two wire body transmits a differential signal and passes the signal The enhancement circuit enhances the differential signal.
  • the connector and the electronic device of the embodiment of the present invention provide a signal enhancement circuit in the outer casing of the connector, thereby enabling signal amplification processing on the differential signal, so that the connector can be effective at a high transmission data rate. Control signal attenuation without increasing the board's size and effectively controlling manufacturing and R&D costs.
  • FIG. 1 is a schematic structural view of a connector connecting a second circuit board and a circuit board in the prior art
  • FIG. 2 is a specific circuit diagram of a connector connecting a second circuit board and a circuit board in the prior art
  • FIG. 3 is a schematic structural diagram of a signal enhancement circuit in a connector according to a first embodiment of the present invention
  • FIG. 4 is a specific circuit diagram of a connector connecting a second circuit board and a circuit board according to the first embodiment of the present invention
  • FIG. 5 is a detailed circuit diagram of a connector connecting a second circuit board and a circuit board according to a second embodiment of the present invention
  • FIG. 6 is a schematic view showing the position of a connector in a high speed link according to a third embodiment of the present invention.
  • Figure 7 is a flow chart showing a method of manufacturing a connector according to a fourth embodiment of the present invention.
  • Figure 8 is a schematic cross-sectional view of the substrate
  • Figure 9 is a schematic cross-sectional view of the substrate after cutting
  • Figure 10 is a schematic cross-sectional view showing the placement of solder paste on the fracture of the substrate and the signal enhancement circuit
  • Figure 11 is a schematic cross-sectional view of the connector of the present invention.
  • FIG. 12 is a schematic perspective structural view of a connector according to a fifth embodiment of the present invention.
  • Figure 13 is a cross-sectional view showing a connector of a fifth embodiment of the present invention.
  • FIG. 14 is a schematic structural diagram of a system of an electronic device according to a fifth embodiment of the present invention.
  • Figure 15 is a perspective view showing the structure of a connector according to a sixth embodiment of the present invention.
  • Figure 16 is a cross-sectional view showing a connector of a sixth embodiment of the present invention.
  • FIG. 17 is a schematic structural diagram of a system of an electronic device according to a sixth embodiment of the present invention.
  • Figure 18 is a cross-sectional view showing a connector in which a signal enhancement circuit is not provided in a seventh embodiment of the present invention.
  • Figure 19 is a schematic structural view showing the cutting of the connector shown in Figure 18 in the seventh embodiment of the present invention.
  • Figure 20 is a schematic view showing the structure of the connector shown in Figure 18 after cutting in the seventh embodiment of the present invention.
  • Figure 21 is a view showing the implantation position of the signal enhancement circuit after cutting the lead body in the seventh embodiment of the present invention.
  • Figure 22 is a view showing the structure of a connector obtained after the first welding method is made in the seventh embodiment of the present invention.
  • Fig. 23 is a view showing the structure of a connector obtained by making another welding method in the seventh embodiment of the present invention.
  • An embodiment of the present invention provides a connector, including: a first interface, a second interface, and a signal enhancement circuit. At least one of the first interface and the second interface includes a power contact, and the power contact contacts the external power source to generate a signal.
  • the enhancement circuit is powered; the casing, the signal enhancement circuit is disposed inside the casing and serially connected between the first interface and the second interface, and the signal enhancement circuit performs signal amplification processing on the differential signal received by the first interface and passes through the
  • the second interface output is provided, and the first interface and the second interface are disposed on different surfaces outside the outer casing.
  • An embodiment of the present invention further provides an electronic device, including a first circuit board, a second circuit board, and a connector.
  • the connector includes: a first interface, a second interface, and a signal enhancement circuit, where the first interface and the second interface are At least one interface includes a power contact for powering the signal enhancement circuit; a housing, a signal enhancement circuit disposed inside the housing and serially connected between the first interface and the second interface, the signal enhancement circuit
  • the differential signal received by the first interface is subjected to signal amplification processing and output through the second interface, and the first interface and the second interface are disposed on different surfaces outside the housing; at least one of the first circuit board and the second circuit board
  • the board is provided with a power output, the power contact is connected to the power output, and the power is taken from the power output to supply power to the signal enhancement circuit.
  • An embodiment of the present invention further provides a connector including at least one wire group, a casing, and a signal enhancement circuit.
  • the signal enhancement circuit is disposed inside the casing, and the wire group includes a plurality of wire bodies, wherein at least one wire body of the wire group is connected to the casing
  • An external power supply supplies power to the signal boost circuit.
  • the connector and the electronic device of the embodiment of the present invention provide a signal enhancement circuit in the outer casing of the connector and supply power by using a power source external to the outer casing, and the signal enhancement circuit performs signal amplification processing on the differential signal to make the connector
  • Signal attenuation can be effectively controlled at high transmission data rates without increasing the board size, and because the present invention eliminates the need for M6 boards and high-speed cables, it can effectively control manufacturing and development costs.
  • FIG. 3 is a schematic structural diagram of a signal enhancement circuit in a connector according to a first embodiment of the present invention.
  • the signal enhancement circuit 23 is configured to perform voltage amplitude amplification processing on the signal to obtain a signal enhancement effect, including a first input terminal 1, a second input terminal 2, a first output terminal 3, a second output terminal 4, and a ground terminal.
  • the external power source is input to the power input terminal 5 to supply power to the signal enhancement circuit 23, and after the power supply is obtained, the data signal input to the first input terminal 1 (in the present invention, a differential signal)
  • the signal is amplified from the first output terminal 3
  • the data signal input to the second input terminal 2 is amplified by the signal enhancement circuit 23.
  • the output of the second output terminal 4 is notable.
  • the signal enhancement circuit 23 of the present invention increases the voltage amplitudes of the two differential signals by a multiple to ensure that the amplitudes of the two differential signals are equal and remain inverted.
  • the signal enhancement circuit 23 described herein can be implemented by various circuits having a voltage amplitude amplification function or an equalizer widely used in the prior art. Since the equalizer is often packaged as a chip, the connector of the present invention is manufactured. It is only necessary to solder the pins of the equalizer to the line requiring signal relay, which can simplify the process. Therefore, in the present invention, an equalizer is preferably used as the signal enhancement circuit.
  • FIG. 4 is a schematic diagram showing the circuit structure of the first embodiment of the electronic device of the present invention. As shown in FIG. 4, the present embodiment discloses an electronic device including a first circuit board 25, a second circuit board 22, and a connector 20.
  • the connector 30 includes a first interface (not labeled), a second interface (not labeled), a housing (not labeled), and a signal enhancement circuit 23 as described in FIG. 3, the signal enhancement circuit 23 being disposed within the housing, the first interface including The first conductive contact 204, the second conductive contact 205, the third conductive contact 206, and the fourth conductive contact 207, the second interface includes a fifth conductive contact 201, a sixth conductive contact 202, and a seventh conductive contact
  • the head 203, the signal enhancement circuit 23 is disposed inside the casing and serially connected between the first interface and the second interface, and the first interface and the second interface are disposed on different surfaces outside the casing.
  • the first conductive contact 204 and the second conductive contact 205 are for receiving a differential signal from the outside of the housing (in this embodiment, the first circuit board 22), and the third conductive contact 206 is for receiving from the outside of the housing (at In this embodiment, the ground signal of the first circuit board 22), the fourth conductive contact 207 serves as a power contact to receive power from the outside of the casing (the first circuit board 22 in this embodiment).
  • the first input end 1 of the signal enhancement circuit 23 is connected to the first conductive contact 204, the second input end 2 is connected to the second conductive contact 205, the ground end 6 is connected to the third conductive contact 206, and the power input terminal 5 is connected.
  • the fourth conductive contacts 207 are connected.
  • the fifth conductive contact 201 of the second interface is connected to the first output end 3, the sixth conductive contact 202 is connected to the second output end 4, the seventh conductive contact 203 is connected to the ground end 6, and the fifth conductive contact 201 And the sixth conductive contact 202 outputs a differential signal subjected to signal amplification processing by the signal enhancement circuit 23.
  • the power source is provided by the first circuit board 22, and the first circuit board 22 is provided with a power output end (not labeled), and the power output end and the fourth conductive contact 207 as a power contact.
  • the connection is for supplying power to the power input terminal 5 to supply power to the signal enhancement circuit 23.
  • the second circuit board 25 is preferably a back board, which includes a main body 21 and a third interface 24, wherein the third interface 24 is pluggable and connectable to the first interface, and the manner in which the interfaces are connected is available.
  • the various methods of technology are implemented and will not be described here.
  • the connector and the electronic device disclosed in the embodiment can be transmitted at a high speed.
  • the effective control of signal attenuation at the data rate, while not increasing the size of the circuit board 22, can effectively control manufacturing and development costs.
  • the number of signal enhancement circuits 23 may be plural, and the first interface may also include multiple The combination of the first conductive contact 204, the second conductive contact 205, the third conductive contact 206 and the fourth conductive contact 207, the second interface may also include a plurality of fifth conductive contacts 201, The contacts formed by the sixth conductive contact 202 and the seventh conductive contact 203 are combined to realize relay transmission of multiple pairs of differential signals.
  • a coupling capacitor is disposed between the sixth conductive contact 202 and the second output terminal 2 of the signal enhancement circuit 23 to perform a DC blocking process on the signal amplified signal to further filter DC interference in the differential signal.
  • the specific capacitance value of the coupling capacitor can be selected according to actual needs, and the present invention does not specifically limit it.
  • FIG. 5 is a schematic structural diagram of a circuit of a second embodiment of an electronic device according to the present invention. As shown in FIG. 5, the present embodiment discloses an electronic device including a first circuit board 35, a second circuit board 32, and a connector 30.
  • the connector 30 includes a first interface (not labeled), a second interface (not labeled), a housing (not labeled), and a signal enhancement circuit 23 as described in FIG. 3, the signal enhancement circuit 23 being disposed within the housing, the first interface including The first conductive contact 305, the second conductive contact 306 and the third conductive contact 307, the second interface comprises a fifth conductive contact 301, a sixth conductive contact 302, a seventh conductive contact 303 and an eighth conductive contact Head 304.
  • the signal enhancement circuit 23 is disposed inside the casing and serially connected between the first interface and the second interface, and the first interface and the second interface are disposed on different surfaces outside the casing.
  • the first conductive contact 305 and the second conductive contact 306 are for receiving a differential signal from the outside of the housing (in the present embodiment, the first circuit board 32), and the third conductive contact 307 is for receiving from the outside of the housing (at In this embodiment, it is the ground signal of the first circuit board 32).
  • the first input end 1 is connected to the first conductive contact 305
  • the second input end 2 is connected to the second conductive contact 306
  • the ground end 6 is connected to the third conductive contact 307
  • the signal enhancement circuit passes through the first input end 1 and
  • the second input terminal 2 acquires a differential signal and performs signal amplification processing.
  • the fifth conductive contact 301 is connected to the first output end 3, the sixth conductive contact 302 is connected to the second output end 4, the seventh conductive contact 303 is connected to the ground end 6, the fifth conductive contact 301 and the sixth conductive
  • the contact 302 outputs a differential signal subjected to signal amplification processing by the signal enhancement circuit 23, and the eighth conductive contact 304 is connected as a power contact to the power input terminal 5 for receiving from the outside of the casing (in this embodiment, the second circuit) Board 35) power supply.
  • the differential signal is provided by the first circuit board 32
  • the power supply is provided by the second circuit board 35
  • the second circuit board 35 is provided with a power output end (not labeled), and the power output end and the The fourth conductive contact 304 of the power contact is connected for supplying power to the power input terminal 5 to supply power to the signal enhancement circuit 23.
  • the second circuit board 35 is preferably a backboard, and includes a main body 31 and a third interface 34.
  • the third interface 34 is pluggable and connectable to the first interface, and the manner in which the interfaces are connected is available. The various methods of technology are implemented and will not be described here.
  • the connector and the electronic device disclosed in the embodiment can be transmitted at a high speed. Effective control of signal attenuation at data rates, while not increasing the board's size, can effectively control manufacturing and R&D costs.
  • a coupling capacitor is disposed between the sixth conductive contact 302 and the second output terminal 2 of the signal enhancement circuit 23 to perform a DC blocking process on the signal amplified signal to further filter DC interference in the differential signal.
  • the specific capacitance value of the coupling capacitor can be selected according to actual needs, and the present invention does not specifically limit it.
  • the number of the signal enhancement circuits 23 may be plural, and the first interface may also be used.
  • a combination of contacts formed by a plurality of sets of first conductive contacts 305, second conductive contacts 306, and third conductive contacts 307 is included.
  • the second interface may also include a combination of contacts formed by the plurality of fifth conductive contacts 301, the sixth conductive contacts 302, the seventh conductive contacts 303, and the eighth conductive contacts 304, thereby implementing a multi-channel differential signal. Following the transmission.
  • the voltage value of the above power source is preferably 1.8 V or 3.3 V, and the selection of the voltage value depends on the type or model of the signal enhancement circuit used.
  • FIG. 6 is a schematic diagram showing the position of the connector in the high speed link according to the third embodiment of the present invention.
  • the device constituting the high speed second circuit board link includes a second circuit board 51, a circuit board 42, a circuit board 42, a connector 50, and a connector 40.
  • a signal enhancement circuit 43 and a coupling capacitor 44 are disposed in the connector 40.
  • the signal enhancement circuit 53 and the coupling capacitor 54 are disposed in the connector 50.
  • the first interface 501 of the connector 50 is inserted into the circuit board 52, and the second interface 502 is inserted into the circuit board 51 to connect the second circuit board 51 and the circuit board 52.
  • the first interface 401 of the connector 40 is inserted.
  • the second interface 402 is inserted in the circuit board 42 to connect the second circuit board 51 and the circuit board 42.
  • the circuit board 52 is provided with a chip 55.
  • the circuit board 42 is provided with a chip 435.
  • the back board 11, the circuit board 12, and the circuit board 15 are internally provided with internal circuit connecting lines (not shown), and the second circuit is connected to the connector 50. After the board 51 and the circuit board 52 are connected to the second circuit board 51 and the circuit board 42, the chip 55 and the chip 435 are electrically connected.
  • the connector used in the above embodiment is the connector described in the foregoing embodiment.
  • the first interface 401, the second interface 402, the first interface 501, and the like are not specifically illustrated.
  • the specific conductive contact included in the first interface 502, wherein the conductive contact of the interface is consistent with the above embodiment, and details are not described herein.
  • the signal enhancement circuit 53 is provided in the connector 50, the signal enhancement circuit 43 is disposed in the connector 40, and the differential signal transmitted between the chip 55 and the chip 435 can be obtained by the signal enhancement circuit 53 and the signal enhancement circuit 43. Processing, thereby achieving relay amplification, can effectively control the loss of differential signals transmitted at high speed.
  • FIG. 7 is a flowchart of a method of manufacturing a connector according to a fourth embodiment of the present invention. As shown in FIG. 7, the method of manufacturing the connector of the present invention includes the following steps:
  • Step 701 Fix the first interface, the second interface, and the signal enhancement circuit to the base respectively, wherein at least one of the first interface and the second interface includes a power contact.
  • Step 702 The signal enhancement circuit is electrically connected to the first interface and the second interface, respectively, so that the signal enhancement circuit is serially connected between the first interface and the second interface, and the power contact is electrically connected to the signal enhancement circuit to supply power thereto.
  • the step of electrically connecting the signal enhancement circuit to the first interface and the second interface is specifically: the first input end and the second input end of the packaged signal enhancement circuit are The grounding end and the power input end are respectively reflowed with the first conductive contact, the second conductive contact, the third conductive contact and the fourth conductive contact of the first interface to be electrically connected one by one, and the packaged signal is to be encapsulated The first output end, the second output end, and the ground end of the enhancement circuit are respectively reflowed with the fifth conductive contact, the sixth conductive contact, and the seventh conductive contact of the second interface to be electrically connected one by one, thereby forming A connector according to a first embodiment of the present invention.
  • the step of electrically connecting the signal enhancement circuit to the first interface and the second interface respectively is specifically: the first input end and the second input end of the packaged signal enhancement circuit and The grounding end is respectively reflowed with the first conductive contact, the second conductive contact and the third conductive contact of the first interface to be electrically connected one by one, and the first output end and the second of the packaged signal enhancement circuit are The output end, the ground end and the power input end are respectively reflowed with the fifth conductive contact, the sixth conductive contact, the seventh conductive contact and the eighth conductive contact of the second interface, and are electrically connected one by one, thereby forming A connector according to a second embodiment of the present invention.
  • FIG. 8-10 are schematic diagrams showing the actual application process of the manufacturing method of the connector of the present invention.
  • FIG. 8 is a cross-sectional view of the above-described substrate (ie, the existing connector described in FIG. 2).
  • the base body includes a plastic portion 82 and a wire portion 81.
  • the line to be relayed is selected at the line portion 81, and the line is cut to form a break 83, and a packaged signal enhancement circuit 84 is prepared, which includes a pin 85.
  • solder paste 86 is placed at the break 83 of the line and the pins 85 of the packaged signal enhancement circuit 84 are placed over the solder paste 86.
  • the solder paste 86 is used for reflow soldering, so that the signal enhancement circuit 84 is fixed on the substrate to form the connector of the present invention.
  • the selection of the specific circuit can be seen in the corresponding embodiment of FIG. The description of the corresponding embodiments is omitted here.
  • FIG. 12 is a schematic perspective structural view of a connector according to a fifth embodiment of the present invention.
  • the connector 608 includes a housing 607 and a plurality of contacts 611, 612, 613, 614, 644, 645, 646 disposed outside the housing 607, wherein the contacts 611, 612 613, 614 are disposed on one surface of the outer casing 607, and the contacts 644, 645, 646 are disposed on the other surface of the outer casing 607.
  • FIG. 13 is a cross-sectional view showing a connector according to a fifth embodiment of the present invention. As shown in Figure 13, The inside of the connector is further provided with a signal enhancement circuit 10 and a wire set.
  • the wire set includes a first wire body 601, a second wire body 602, a third wire body 603, a fourth wire body 604, a fifth wire body 605, and a sixth wire body 606.
  • the first lead body 601 is connected to a power source external to the housing 607 and supplies power to the signal enhancement circuit 10.
  • the signal enhancement circuit 10 is provided with a power input terminal 1, a first signal input terminal 2, a second signal input terminal 3, a ground terminal 4, a first signal output terminal 5, and a second signal output terminal 6.
  • One end of the first wire body 601 is connected to the power input terminal 1, and a power source from the outside of the casing 607 is input to the signal enhancement circuit 10 to supply power to the signal enhancement circuit 10.
  • One end of the second wire body 602 is connected to the first signal input terminal 2
  • One end of the third wire body 603 is connected to the second signal input terminal 3
  • the second wire body 602 and the third wire body 603 input a differential signal from the outside of the casing 607 to the signal enhancement circuit 10; the signal enhancement circuit 10 performs the differential signal
  • the signals are amplified and output to one end of the fifth lead body 605 and one end of the sixth lead body 606, and the ground end 4 is connected between one end and the other end of the fourth lead body 604.
  • the other end of the first lead body 601, the other end of the second lead body 602, the other end of the third lead body 603, and the other end of the fourth lead body 604 are respectively disposed with a plurality of conductive contacts provided on one surface of the outer casing 607
  • the heads 611, 612, 613, 614 are connected, the other end of the fifth lead body 605, the other end of the sixth lead body 606, and the other end of the fourth lead body 604 are respectively electrically connected to the other surface provided on the other surface of the outer casing.
  • the contacts 645, 646, 644 are connected.
  • the first lead body 601, the second lead body 602, the third lead body 603, and the fourth lead body 604 are curved conductors, and the fifth lead body 605 and the sixth lead body 606 are straight conductors. It should be noted that in the present embodiment, in order to satisfy the vertical angle requirement between the external circuit board (described in detail below) to which the connector 608 is connected, the above setting is made in this embodiment, but in this embodiment In an alternative embodiment of the invention, the shape of the wire body may be set according to actual needs, which is not specifically limited in the present invention.
  • the first lead body 601, the second lead body 602, the third lead body 603, the fourth lead body 604, the fifth lead body 605 and the sixth lead body 606 are connected to the power input terminal 1 and the first signal input end. 2.
  • the second signal input terminal 3, the ground terminal 4, the first signal output terminal 5, and the second signal output terminal 6 are connected by soldering (shown in the black portion) to achieve a fixed and maintained electrical connection.
  • a coupling capacitor may be respectively disposed on the fifth wire body 605 and the sixth wire body 606 to perform a DC blocking process on the signal amplified signal.
  • FIG. 14 is a schematic structural diagram of a system of an electronic device according to a fifth embodiment of the present invention. As shown in FIG. 14, the embodiment further discloses an electronic device including a first circuit board 620, a second circuit board 630, and the connector 608 described in FIG.
  • the first circuit board 620 includes a main body 626 and a device 625.
  • the device 625 is provided with a power output 621, differential signal output ends 622, 623, and a ground end 624.
  • the second circuit board 630 includes a main body 638 and a device 639.
  • the device 639 is provided with differential signal inputs 635, 636 and a ground 634.
  • the first circuit board 620 is provided with an interface (not shown) for insertion of the contacts 611, 612, 613, 614, and the second circuit board 630 is provided with an interface (not labeled) for insertion of the contacts 645, 646, 644.
  • the contacts 611, 612, 613, 614 When the contacts 611, 612, 613, 614 are inserted into the interface on the first circuit board 620, the contacts 611, 612, 613, 614 are inserted into the interface of the second circuit board 630, the power output terminal 621, the differential signal output terminal 622, The 623 and the grounding end 624 respectively pass through the wires (not labeled) in the main body 626 and the first wire body 601, the second wire body 602, the third wire body 603, the fourth wire body 604, and the power input terminal 1, the first signal.
  • the input terminal 2, the second signal input terminal 3, and the ground terminal 4 are connected; the first signal output terminal 5 and the second signal output terminal 6 and the ground terminal 4 respectively pass through the fifth wire body 605, the sixth wire body 606, and the fourth wire Body 604 and wires (not labeled) within body 638 are coupled to differential signal inputs 635, 636 and ground 634.
  • the power output terminal 621 outputs power to the signal enhancement circuit 10 to keep it active, the differential signal output terminals 622, 623 output differential signals to the signal enhancement circuit 10 for relay amplification, and the signal enhancement circuit 10 outputs the relay-amplified differential signal.
  • the signal enhancement circuit 10 outputs the relay-amplified differential signal.
  • differential signal inputs 635, 636 To differential signal inputs 635, 636. Also, since the ground terminal 624 of the device 625, the ground terminal 4 of the signal enhancement circuit 10, and the ground terminal 634 of the device 639 remain connected, it is ensured that the three are collectively set.
  • the connector 608 can relay the differential signal transmitted from the first circuit board 620 to the second circuit board 630 by the power supply provided by the first circuit board 620, thereby effectively suppressing signal attenuation.
  • the first lead body 601 is connected to the fifth lead body 605 through the signal enhancement circuit 10
  • the first lead body 601 and the fifth lead body 605 may be collectively referred to as the same lead body.
  • the second wire body 602 is connected to the sixth wire body 606 through the signal enhancement circuit 10
  • the second wire body 602 and the sixth wire body 606 may also be collectively referred to as the same wire body.
  • the wire group includes four wire bodies, wherein the first wire body supplies power to the signal enhancement circuit, the fourth wire body 604 is grounded, and the wire body composed of the first wire body 601 and the fifth wire body 605 And a wire body composed of the second wire body 602 and the sixth wire body 606 is for transmitting a differential signal and enhancing the differential signal by the signal enhancement circuit 10.
  • the wire sets may be arranged in a plurality of groups, and a signal enhancement circuit is provided in each of the groups of wire groups in the manner described above, thereby enabling simultaneous amplification of the plurality of differential signals.
  • FIG. 15 is a schematic perspective structural view of a connector according to a sixth embodiment of the present invention.
  • the connector 708 includes a housing 707 and a plurality of contacts 712, 713, 714, 741, 744, 745, 746 disposed outside the housing 707, wherein the contacts 712, 713 714, 715 are disposed on one surface of the outer casing 707, and the contacts 741, 744, 745, 746 are disposed on the other surface of the outer casing 707.
  • FIG. 16 is a cross-sectional view showing a connector according to a sixth embodiment of the present invention.
  • the inside of the connector 708 is further provided with a signal enhancement circuit 10 and a wire group.
  • the wire set includes a first wire body 701, a second wire body 702, a third wire body 703, a fourth wire body 704, a fifth wire body 705, and a sixth wire body 706.
  • the first lead body 701 is connected to a power source external to the housing 707 and supplies power to the signal enhancement circuit 10.
  • the signal enhancement circuit 10 is provided with a power input terminal 1, a first signal input terminal 2, a second signal input terminal 3, a ground terminal 4, a first signal output terminal 5, and a second signal output terminal 6.
  • One end of the first wire body 701 is connected to the power input terminal 1, and a power source from the outside of the casing 707 is input to the signal enhancement circuit 10 to supply power to the signal enhancement circuit 10.
  • One end of the second wire body 702 is connected to the first signal input terminal 2
  • One end of the third wire body 703 is connected to the second signal input terminal 3
  • the second wire body 702 and the third wire body 703 input a differential signal from the outside of the casing 707 to the signal enhancement circuit 10; the signal enhancement circuit 10 performs the differential signal
  • the signals are amplified and output to one end of the fifth lead body 705 and one end of the sixth lead body 706, and the ground end 4 is connected between one end and the other end of the fourth lead body 704.
  • the other end of the second lead body 702, the other end of the third lead body 703, and the other end of the fourth lead body 704 are respectively connected to a plurality of conductive contacts 712, 713, 714 disposed on one surface of the outer casing 707,
  • the other end of one wire body 701, the other end of the fifth wire body 705, the other end of the sixth wire body 706, and the other end of the fourth wire body 704, respectively, and a plurality of conductive contacts disposed on the other surface of the outer casing 741, 745, 747, 744 are connected.
  • the second lead body 702, the third lead body 703 and the fourth lead body 704 are curved conductors, and the first conductor body 701, the fifth conductor body 705 and the sixth conductor body 706 are straight conductor bodies. It should be noted that in the present embodiment, in order to satisfy the vertical angle requirement between the external circuit board (described in detail below) to which the connector 708 is connected, the above setting is made in the present embodiment, but In an alternative embodiment of the present invention, the shape of the wire body may be set according to actual needs, which is not specifically limited in the present invention.
  • the second signal input terminal 3, the ground terminal 4, the first signal output terminal 5, and the second signal output terminal 7 are connected by soldering (shown in the black portion) to achieve a fixed and maintained electrical connection.
  • a coupling capacitor may be respectively disposed on the fifth wire body 705 and the sixth wire body 706 to perform a DC blocking process on the signal amplified signal.
  • the first lead body 701 is connected to the fifth lead body 705 through the signal enhancement circuit 10
  • the first lead body 701 and the fifth lead body 705 may be collectively referred to as the same lead body.
  • the second wire body 702 is connected to the sixth wire body 706 through the signal enhancement circuit 10
  • the second wire body 702 and the sixth wire body 706 may also be collectively referred to as the same wire body.
  • the wire group includes four wire bodies, wherein the first wire body supplies power to the signal enhancement circuit, the fourth wire body 704 is grounded, and the wire body composed of the first wire body 701 and the fifth wire body 705 And a wire body composed of the second wire body 702 and the sixth wire body 706 is for transmitting a differential signal and enhancing the differential signal by the signal enhancement circuit 10.
  • the wire sets may be arranged in a plurality of groups, and a signal enhancement circuit is provided in each of the groups of wire groups in the manner described above, thereby enabling simultaneous amplification of the plurality of differential signals.
  • FIG. 17 is a schematic structural diagram of a system of an electronic device according to a sixth embodiment of the present invention. As shown in FIG. 17, this embodiment further discloses an electronic device including a first circuit board 720, a second circuit board 730, and the connector 708 illustrated in FIG.
  • the first circuit board 720 includes a main body 726 and a device 725.
  • the device 725 is provided with differential signal output ends 722, 723 and a ground end 724.
  • the second circuit board 730 includes a main body 738 and a device 739.
  • the device 739 is provided with a power output 731, differential signal input terminals 735 and 736, and a ground terminal 734.
  • An interface (not labeled) is provided on the first circuit board 720 for insertion of the contacts 712, 713, 714, and an interface (not labeled) is provided for the second circuit board 730 to be inserted for the contacts 741, 745, 746, 744.
  • the contacts 712, 713, 714 are inserted into the interface on the first circuit board 720, the contacts 741, 745, 746, 744 are inserted into the interface of the second circuit board 730, the differential signal output terminals 722, 723 and the ground terminal 724 pass respectively.
  • the wires (not labeled) in the main body 726 and the second wire body 702, the third wire body 703, and the fourth wire body 704 are connected to the first signal input terminal 2, the second signal input terminal 3, and the ground terminal 4;
  • the terminal 1, the first signal output terminal 5, the second signal output terminal 6 and the ground terminal 4 pass through the first wire body 701, the fifth wire body 705, the sixth wire body 706, the fourth wire body 704, and the main body 738, respectively.
  • Inner conductors are coupled to power supply output 739, differential signal inputs 735, 736, and ground 734.
  • the power output terminal 731 outputs power to the signal enhancement circuit 10 to keep it active, the differential signal output terminals 722, 723 output differential signals to the signal enhancement circuit 10 for relay amplification, and the signal enhancement circuit 10 outputs the relay-amplified differential signal.
  • differential signal inputs 735, 736 To differential signal inputs 735, 736.
  • the ground terminal 724 of the device 725, the ground terminal 4 of the signal enhancement circuit 10, and the ground terminal 734 of the device 739 remain connected, it is ensured that the three are collectively set.
  • the connector 708 can relay-amplify the differential signal transmitted from the first circuit board 720 to the second circuit board 730 by the power supply provided by the second circuit board 730, thereby effectively suppressing signal attenuation.
  • FIG. 18 is a connector of a seventh embodiment of the present invention in which a signal enhancement circuit is not provided. Cutaway view.
  • the connector 809 includes a housing 807 and lead bodies 801, 802, 803, 804.
  • FIG. 19 is a schematic structural view showing the cutting of the connector shown in FIG. 18 in the seventh embodiment of the present invention.
  • the outer casing 807 can be detached (when the outer casing 807 does not completely surround the lead body, the outer casing 807 may not be detached, and the portion of the lead body exposed to the outer casing 807 may be selected for cutting) along the cutting lines S1 and S2.
  • the wire bodies 801, 802, 803, 804 are cut.
  • FIG. 20 is a schematic structural view of the connector shown in FIG. 18 after cutting in the seventh embodiment of the present invention. As shown in FIG. 20, after the cutting is performed, the broken wire bodies 811, 812, 821, 822, 831, 832, 841, and 842 are produced.
  • FIG. 21 shows an implantation position of the signal enhancement circuit after cutting the lead body in the seventh embodiment of the present invention.
  • the signal enhancement circuit 10 is implanted between the cutting breaks.
  • the signal enhancement circuit 10 is provided with a power input terminal 1, a first signal input terminal 2, a second signal input terminal 3, a ground terminal 4, and a first signal.
  • FIG. 22 is a view showing the structure of the connector obtained after the first welding method is made in the seventh embodiment of the present invention.
  • the power input terminal 1 is welded to the wire body 812
  • the first signal input terminal 2 is welded to the wire body 821
  • the second signal input terminal 3 is welded to the wire body 831
  • the ground terminal 4 is respectively connected to the wire.
  • the body 841 and the wire body 842 are welded
  • the first signal output end 5 is welded to the wire body 822
  • the second signal output end 6 is welded to the wire body 832
  • the wire body 811 is removed to obtain the connection described in the sixth embodiment.
  • the conductor body 811 can also be left in contact with another signal enhancement circuit.
  • FIG. 23 there is shown a schematic structural view of a connector obtained by making another welding method in the seventh embodiment of the present invention.
  • the power input terminal 1 is welded to the wire body 811
  • the first signal input terminal 2 is welded to the wire body 821
  • the second signal input terminal 3 is welded to the wire body 831
  • the ground terminal 4 is respectively connected to the wire.
  • the body 841 and the wire body 842 are welded
  • the first signal output end 5 is welded to the wire body 822
  • the second signal output end 6 is welded to the wire body 832
  • the wire body 812 is removed to obtain the connection described in the sixth embodiment.
  • the wire body 812 can also be left in contact with another signal enhancing circuit).
  • the present invention discloses a connector, a method of manufacturing the same, and an electronic device capable of performing signal amplification processing on a differential signal, so that the connector can effectively control signal attenuation at a high transmission data rate without thereby increasing the circuit board. Volume and effective control of manufacturing and R&D costs.

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Abstract

一种连接器以及包括连接器的电子设备。连接器（30）包括：第一接口、第二接口以及信号增强电路（23），第一接口、第二接口中至少一个接口包括电源触头（207），电源触头用于为信号增强电路供电；外壳，信号增强电路设置于外壳内部并串接于第一接口和第二接口之间，信号增强电路对第一接口接收到的差分信号进行信号放大处理并通过第二接口输出，第一接口、第二接口设置于外壳外部的不同表面上。连接器及其电子设备可在高传输数据速率下控制信号衰减，同时又不增加电路板的体积。

Description

一种连接器及电子设备
【技术领域】
本发明涉及通信技术领域，特别是涉及一种连接器及电子设备。
【背景技术】
请参见图1，图1是现有技术的电子设备中利用连接器连接背板和电路板的结构示意图。如图1所示，在现有技术中，组成高速第二电路板链路的器件包括背板11、电路板12、电路板15、连接器10以及连接器14。连接器14用于连接背板11和电路板15，连接器10用于连接背板11和电路板12。电路板12上设置有芯片16，电路板13上设置有芯片13，背板11、电路板12、电路板15、连接器14以及连接器10内部均设置有内部电路连接线（图1未标示）。在连接器14连接背板11和电路板15、连接器10连接背板11和电路板12后，芯片16与芯片13之间实现电连接。
请参见图2，图2是现有技术中连接器连接第二电路板和电路板的具体电路图。其中，图2进一步绘示出图1中连接器10与背板11以及电路板12的具体电路连接关系。如图2所示，连接器10包括导电触头101、102、103、104（为了在图2中可清楚标示，仅以该4个触头作为说明，实际触头数目如图2中所示）以及导电触头105、106、107、108（同上）。其中，导电触头101、102、103、104可选择性插入至背板11中，导电触头105、106、107、108可选择性插入电路板12中，导电触头101与导电触头108在连接器10中实现内部电连接，导电触头102与导电触头107在连接器10中实现内部电连接，导电触头103与导电触头106在连接器10中实现内部电连接，导电触头104与导电触头105在连接器10中实现内部电连接。因此，在电路板12通过连接器10与背板11连接时，背板11与电路板12之间可形成多路电连接，利用该多路电连接进行数据信号的传输。
本申请发明人在长期研发中发现，未来的高速第二电路板链路的信号传输速度要求越来越快，比如会从现在的10G逐步提升到17G，并预计再会从17G再提升到25G，在高速数据传输速率下，信号衰减只会越来越大。由于传统电路板走线损耗的限制，若需要实现速度为25G的链路，须要用到M6板材或者采用高速电缆方案来控制内部电路连接线中发生的信号衰减。而M6板材和高速电缆的价格非常昂贵，会造成成本增加。另外，若采用高速电缆代替上述的连接方式，则会将第二电路板上的成千上万条线路换成线缆连接，使得设计方案变得异常复杂。
现有技术中所采用的另一种方案是在与连接器10连接的电路板12上增加均衡器来提升信号幅度，进而控制信号衰减。但由于产品集成度越来越高，电路板12上的空间使用已经很紧张，再在电路板12上增加均衡器会增加产品体积。
【发明内容】
本发明主要解决的技术问题是提供一种连接器及电子设备实施例，既能在高传输数据速率下控制信号衰减，又能不因此而增加体积。
一方面提供一种连接器，包括：第一接口、第二接口以及信号增强电路，第一接口、第二接口中至少一个接口包括电源触头，电源触头与外部电源连接以为信号增强电路供电；外壳，信号增强电路设置于外壳内部并串接于第一接口和第二接口之间，所述信号增强电路对所述第一接口接收到的差分信号进行信号放大处理并通过所述第二接口输出，第一接口、第二接口设置于外壳外部的不同表面上。
结合第一方面的实现方式，在第一种可能的实现方式中：第一接口包括第一导电触头、第二导电触头、第三导电触头以及第四导电触头，第一导电触头和第二导电触头用于接收来自外壳外部的差分信号，第三导电触头用于接收来自外壳外部的地信号，第四导电触头作为电源触头接收来自外壳外部的电源；信号增强电路包括第一输入端、第二输入端、第一输出端、第二输出端、接地端以及电源输入端，第一输入端与第一导电触头连接，第二输入端与第二导电触头连接，接地端与第三导电触头连接，电源输入端与第四导电触头连接，信号增强电路通过第一输入端以及第二输入端获取差分信号并进行信号放大处理；第二接口包括第五导电触头、第六导电触头以及第七导电触头，第五导电触头与第一输出端连接，第六导电触头与第二输出端连接，第七导电触头与接地端连接，第五导电触头和第六导电触头输出经信号增强电路进行信号放大处理的差分信号。
结合第一方面的实现方式，在第二种可能的实现方式中，第一接口包括第一导电触头、第二导电触头、第三导电触头，第一导电触头和第二导电触头用于接收来自外壳外部的差分信号，第三导电触头用于接收来自外壳外部的地信号；信号增强电路包括第一输入端、第二输入端、第一输出端、第二输出端、接地端以及电源输入端，第一输入端与第一导电触头连接，第二输入端与第二导电触头连接，接地端与第三导电触头连接，信号增强电路通过第一输入端以及第二输入端获取差分信号并进行信号放大处理；第二接口包括第五导电触头、第六导电触头、第七导电触头以及第八导电触头，第五导电触头与第一输出端连接，第六导电触头与第二输出端连接，第七导电触头与接地端连接，第五导电触头和第六导电触头输出经信号增强电路进行信号放大处理的差分信号，第八导电触头作为电源触头与电源输入端连接，用于接收来自外壳外部的电源。
结合第一方面的第一、第二种可能的实现方式中的任一者，在第三种可能的实现方式中，第五导电触头与第一输出端之间以及第六导电触头与第二输出端之间分别设置有耦合电容，以对经信号放大处理的差分信号进行隔直处理。
结合第一方面的第一、第二种可能的实现方式中的任一者，在第四种可能的实现方式中，信号增强电路为均衡器。
结合第一方面的第一、第二种可能的实现方式中的任一者，在第五种可能的实现方式中，电源的电压值为1.8V或3.3V。
第二方面提供一种电子设备，包括第一电路板、第二电路板以及连接器，连接器包括：第一接口、第二接口以及信号增强电路，第一接口、第二接口中至少一个接口包括电源触头，电源触头与外部电源接触以为信号增强电路供电；外壳，信号增强电路设置于外壳内部并串接于第一接口和第二接口之间，所述信号增强电路对所述第一接口接收到的差分信号进行信号放大处理并通过所述第二接口输出，第一接口、第二接口设置于外壳外部的不同表面上；第一电路板、第二电路板中至少一个电路板设置有电源输出端，电源触头与电源输出端连接，从电源输出端获取电源以为信号增强电路供电。
结合第二方面的实现方式，在第一种可能的实现方式中，第一接口包括第一导电触头、第二导电触头、第三导电触头以及第四导电触头，第一导电触头和第二导电触头用于接收来自第一电路板的差分信号，第三导电触头用于接收来自第一电路板的地信号，第四导电触头作为电源触头接收来自第一电路板的电源输出端所输出的电源；信号增强电路包括第一输入端、第二输入端、第一输出端、第二输出端、接地端以及电源输入端，第一输入端与第一导电触头连接，第二输入端与第二导电触头连接，接地端与第三导电触头连接，电源输入端与第四导电触头连接，信号增强电路通过第一输入端以及第二输入端获取差分信号并进行信号放大处理；第二接口包括第五导电触头、第六导电触头以及第七导电触头，第五导电触头与第一输出端连接，第六导电触头与第二输出端连接，第七导电触头与接地端连接并接收来自第二电路板的地信号，第五导电触头和第六导电触头输出经信号增强电路进行信号放大处理的差分信号至第二电路板。
结合第二方面的实现方式，在第二种可能的实现方式中，第一接口包括第一导电触头、第二导电触头、第三导电触头，第一导电触头和第二导电触头用于接收来自第一电路板的差分信号，第三导电触头用于接收来自第一电路板的地信号；信号增强电路包括第一输入端、第二输入端、第一输出端、第二输出端、接地端以及电源输入端，第一输入端与第一导电触头连接，第二输入端与第二导电触头连接，接地端与第三导电触头连接，信号增强电路通过第一输入端以及第二输入端获取差分信号并进行信号放大处理；第二接口包括第五导电触头、第六导电触头、第七导电触头以及第八导电触头，第五导电触头与第一输出端连接，第六导电触头与第二输出端连接，第七导电触头与接地端连接并接收来自第二电路板的地信号，第五导电触头和第六导电触头输出经信号增强电路进行信号放大处理的差分信号至第二电路板，第八导电触头作为电源触头接收来自第二电路板的电源输出端所输出的电源。
结合第二方面的第一、第二种可能的实现方式中的任一者，在第三种可能的实现方式中，第五导电触头与第一输出端之间以及第六导电触头与第二输出端之间分别设置有耦合电容，以对经信号放大处理的差分信号进行隔直处理。
结合第二方面的第一、第二种可能的实现方式中的任一者，在第四种可能的实现方式中，信号增强电路为均衡器。
结合第二方面的第一、第二种可能的实现方式中的任一者，在第五种可能的实现方式中，电源的电压值为1.8V或3.3V。
第三方面提供一种连接器，包括至少一导线组、外壳以及信号增强电路，信号增强电路设置于外壳内部，导线组包括若干导线体，其中导线组中的至少一导线体连接外壳外部的电源并为信号增强电路供电。
结合第三方面的实现方式，在第一种可能的实现方式中，导线体组包括四导线体，其中一导线体为信号增强电路供电，一导线体接地，二导线体传输差分信号并经过信号增强电路增强差分信号。
区别于现有技术的情况，本发明实施例的连接器及电子设备在连接器的外壳内设置信号增强电路，进而能够对差分信号进行信号放大处理，使得连接器在高传输数据速率下可有效控制信号衰减，同时不因此而增加电路板的体积且能有效控制制造和研发成本。
【附图说明】
图1是现有技术中连接器连接第二电路板和电路板的结构示意图;
图2是现有技术中连接器连接第二电路板和电路板的具体电路图;
图3是根据本发明第一实施例的连接器中的信号增强电路的结构示意图;
图4是根据本发明第一实施例的连接器连接第二电路板和电路板的具体电路图;
图5是根据本发明第二实施例的连接器连接第二电路板和电路板的具体电路图;
图6是本发明第三实施例的连接器在高速链路中的位置示意图;
图7是本发明第四实施例的连接器的制造方法的流程图;
图8是基体的横截面示意图；
图9是基体在进行裁断后的横截面示意图；
图10是基体的断口放置锡膏以及信号增强电路的横截面示意图；
图11是本发明的连接器的横截面示意图；
图12为本发明第五实施例的连接器的立体结构示意图；
图13为本发明第五实施例的连接器的剖面图；
图14为本发明第五实施例的电子设备的系统结构示意图；
图15为本发明第六实施例的连接器的立体结构示意图；
图16为本发明第六实施例的连接器的剖面图；
图17为本发明第六实施例的电子设备的系统结构示意图
图18是本发明第七实施例中未设置有信号增强电路的连接器的剖视图；
图19是本发明第七实施例中对图18所示连接器进行切割的结构示意图；
图20是本发明第七实施例中对图18所示连接器进行切割后的结构示意图；
图21示出在本发明第七实施例中信号增强电路在切割导线体后的植入位置；
图22示出在本发明第七实施例中作出第一种焊接方式后获得的连接器的结构示意图；
图23示出在本发明第七实施例中作出另一种焊接方式后获得的连接器的结构示意图。
【具体实施方式】
本发明实施例提供了一种连接器，包括：第一接口、第二接口以及信号增强电路，第一接口、第二接口中至少一个接口包括电源触头，电源触头与外部电源接触以为信号增强电路供电；外壳，信号增强电路设置于外壳内部并串接于第一接口和第二接口之间，所述信号增强电路对所述第一接口接收到的差分信号进行信号放大处理并通过所述第二接口输出，第一接口、第二接口设置于外壳外部的不同表面上。
本发明实施例进一步提供了一种电子设备，包括第一电路板、第二电路板以及连接器，连接器包括：第一接口、第二接口以及信号增强电路，第一接口、第二接口中至少一个接口包括电源触头，电源触头用于为信号增强电路供电；外壳，信号增强电路设置于外壳内部并串接于第一接口和第二接口之间，所述信号增强电路对所述第一接口接收到的差分信号进行信号放大处理并通过所述第二接口输出，第一接口、第二接口设置于外壳外部的不同表面上；第一电路板、第二电路板中至少一个电路板设置有电源输出端，电源触头与电源输出端连接，从电源输出端获取电源以为信号增强电路供电。
本发明实施例进一步提供了一种连接器，包括至少一导线组、外壳以及信号增强电路，信号增强电路设置于外壳内部，导线组包括若干导线体，其中导线组中的至少一导线体连接外壳外部的电源并为信号增强电路供电。
通过上述方式，本发明实施例的连接器以及电子设备通过在连接器的外壳内设置信号增强电路并利用外壳外部的电源对其进行供电，信号增强电路对差分信号进行信号放大处理，使得连接器在高传输数据速率下可有效控制信号衰减，并且不会增加电路板的体积，另外由于本发明无需采用M6板材和高速电缆，因此能有效控制制造和研发成本。
下面将结合具体实施例对本发明实施例的连接器以及电子设备进行描述。
请参见图3，图3是根据本发明第一实施例的连接器中的信号增强电路的结构示意图。信号增强电路23用于对信号进行电压幅值放大处理，从而获得信号增强的效果，其包括第一输入端1、第二输入端2、第一输出端3、第二输出端4、接地端6以及电源输入端5，外部的电源输入至电源输入端5从而为信号增强电路23进行供电，在获得供电后，输入至第一输入端1的数据信号（在本发明中为一路差分信号）经由信号增强电路23的信号放大处理后从第一输出端3输出，输入至第二输入端2的数据信号（在本发明中为另一路差分信号）经由信号增强电路23的信号放大处理后从第二输出端4输出，值得注意的是，本发明的信号增强电路23对两路差分信号的电压幅值增大倍数相等，以确保两路差分信号幅值相等且保持反相。
其中，于此所述的信号增强电路23可由各种具有电压幅值放大功能的电路或现有技术中广泛应用的均衡器实现，由于均衡器往往已经封装为芯片，在制造本发明的连接器时只需将均衡器的引脚对应焊接至需要进行信号中继的线路即可，其可以简化制程，因此在本发明优选采用均衡器作为信号增强电路。
并请参见图4，图4是本发明的电子设备第一实施例的电路结构示意图。如图4所示，本实施例公开了一种电子设备，其包括第一电路板25、第二电路板22以及连接器20。
连接器30包括第一接口（未标示）、第二接口（未标示）、外壳（未标示）以及图3中所述的信号增强电路23，信号增强电路23设置于外壳内，第一接口包括第一导电触头204、第二导电触头205、第三导电触头206以及第四导电触头207，第二接口包括第五导电触头201、第六导电触头202以及第七导电触头203，信号增强电路23设置于外壳内部并串接于第一接口和第二接口之间，第一接口、第二接口设置于外壳外部的不同表面上。
第一导电触头204和第二导电触头205用于接收来自外壳外部（在本实施例中为第一电路板22）的差分信号，第三导电触头206用于接收来自外壳外部（在本实施例中为第一电路板22）的地信号，第四导电触头207作为电源触头接收来自外壳外部（在本实施例中为第一电路板22）的电源。信号增强电路23的第一输入端1与第一导电触头204连接，第二输入端2与第二导电触头205连接，接地端6与第三导电触头206连接，电源输入端5与第四导电触头207连接。
第二接口的第五导电触头201与第一输出端3连接，第六导电触头202与第二输出端4连接，第七导电触头203与接地端6连接，第五导电触头201和第六导电触头202输出经信号增强电路23进行信号放大处理的差分信号。
具体地，在本实施例中，电源由第一电路板22提供，第一电路板22上设置有电源输出端（未标示），该电源输出端与作为电源触头的第四导电触头207连接，用于供电至电源输入端5从而为信号增强电路23进行供电。
在本实施例中，第二电路板25优选为背板，其包括主体21以及第三接口24，其中，第三接口24与第一接口可插拔连接，由于其接口相连的方式可用现有技术的各种方法实现，于此不作赘述。
由于信号增强电路23设置在连接器20内，且信号增强电路23所需的电源由第一电路板22的电源输出端提供，因此，本实施例所揭示的连接器及电子设备可在高传输数据速率下有效控制信号衰减，同时不因此而增加电路板22的体积，能有效控制制造和研发成本。
在上述的第一实施例中，为了方便说明，仅以一个信号增强电路23作为说明，但如图4所示，信号增强电路23的数量也可为多个，而第一接口也可以包括多组第一导电触头204、第二导电触头205、第三导电触头206以及第四导电触头207所形成的触头组合，第二接口也可以包括多组第五导电触头201、第六导电触头202以及第七导电触头203所形成的触头组合，从而实现多对差分信号的中继传输。
值得注意的是，在本发明的备选实施例中，更可在上述的第一实施例所述的连接器20的第五导电触头201与信号增强电路23的第一输出端1之间、第六导电触头202与信号增强电路23的第二输出端2之间设置耦合电容，以对经信号放大处理的差分信号进行隔直处理，以进一步滤去差分信号中的直流干扰。其中，耦合电容的具体电容值可根据实际需要选取，本发明对其不作具体限定。
以下请参见图5，图5是根据本发明的电子设备第二实施例的电路结构示意图。如图5所示，本实施例公开了一种电子设备，其包括第一电路板35、第二电路板32以及连接器30。
连接器30包括第一接口（未标示）、第二接口（未标示）、外壳（未标示）以及图3中所述的信号增强电路23，信号增强电路23设置于外壳内，第一接口包括第一导电触头305、第二导电触头306以及第三导电触头307，第二接口包括第五导电触头301、第六导电触头302、第七导电触头303以及第八导电触头304。信号增强电路23设置于外壳内部并串接于第一接口和第二接口之间，第一接口、第二接口设置于外壳外部的不同表面上。
第一导电触头305和第二导电触头306用于接收来自外壳外部（在本实施例中为第一电路板32）的差分信号，第三导电触头307用于接收来自外壳外部（在本实施例中为第一电路板32）的地信号。第一输入端1与第一导电触头305连接，第二输入端2与第二导电触头306连接，接地端6与第三导电触头307连接，信号增强电路通过第一输入端1以及第二输入端2获取差分信号并进行信号放大处理。第五导电触头301与第一输出端3连接，第六导电触头302与第二输出端4连接，第七导电触头303与接地端6连接，第五导电触头301和第六导电触头302输出经信号增强电路23进行信号放大处理的差分信号，第八导电触头304作为电源触头与电源输入端5连接，用于接收来自外壳外部（在本实施例中为第二电路板35）的电源。
具体地，在本实施例中，差分信号由第一电路板32提供，电源由第二电路板35提供，第二电路板35上设置有电源输出端（未标示），该电源输出端与作为电源触头的第四导电触头304连接，用于供电至电源输入端5从而为信号增强电路23进行供电。
在本实施例中，第二电路板35优选为背板，其包括主体31以及第三接口34，其中，第三接口34与第一接口可插拔连接，由于其接口相连的方式可用现有技术的各种方法实现，于此不作赘述。
由于信号增强电路23设置在连接器30内，且信号增强电路23所需的电源由第二电路板35的电源输出端提供，因此，本实施例所揭示的连接器及电子设备可在高传输数据速率下有效控制信号衰减，同时不因此而增加电路板的体积，能有效控制制造和研发成本。
值得注意的是，在本发明的备选实施例中，更可在上述的第二实施例所述的连接器30的第五导电触头301与信号增强电路23的第一输出端1之间、第六导电触头302与信号增强电路23的第二输出端2之间设置耦合电容，以对经信号放大处理的差分信号进行隔直处理，以进一步滤去差分信号中的直流干扰。其中，耦合电容的具体电容值可根据实际需要选取，本发明对其不作具体限定。
并且，在上述的第二实施例中，为了方便说明，仅以一个信号增强电路23作为说明，但如图5所示，信号增强电路23的数量也可为多个，而第一接口也可以包括多组第一导电触头305、第二导电触头306以及第三导电触头307所形成的触头组合。第二接口也可以包括多组第五导电触头301、第六导电触头302、第七导电触头303以及第八导电触头304所形成的触头组合，从而实现多路差分信号的中继传输。
另外，在本发明所有实施例中，上述电源的电压值优选为1.8V或3.3V，其电压值的选取取决于所使用的信号增强电路的种类或型号。
请参见图6，图6是本发明第三实施例的连接器在高速链路中的位置示意图。如图6所示，组成高速第二电路板链路的器件包括第二电路板51、电路板42、电路板42、连接器50以及连接器40。连接器40内设置有信号增强电路43以及耦合电容44，连接器50内设置有信号增强电路53和耦合电容54。
连接器50的第一接口501插置于电路板52中，第二接口502插置于电路板51中，以连接第二电路板51和电路板52，连接器40的第一接口401插置于第二电路板51中，第二接口402插置于电路板42中，以连接第二电路板51和电路板42。电路板52上设置有芯片55，电路板42上设置有芯片435，背板11、电路板12、电路板15内部均设置有内部电路连接线（未标示），在连接器50连接第二电路板51和电路板52，连接器40连接第二电路板51和电路板42后，芯片55与芯片435之间实现电连接。
值得注意的是，这里所采用的连接器为上述实施例中所述的连接器，为了便于描述以及清楚绘示，没有具体绘示出第一接口401、第二接口402、第一接口501以及第一接口502所包括的具体导电触头，其中，上述接口的导电触头与上述实施例一致，于此不作赘述。
由于在连接器50中设置有信号增强电路53，在连接器40中设置有信号增强电路43，芯片55与芯片435之间传输的差分信号可得到信号增强电路53以及信号增强电路43的信号放大处理，从而实现中继放大，可有效控制高速传输的差分信号的损耗。
请参见图7，图7是本发明第四实施例的连接器的制造方法的流程图。如图7所述，本发明的连接器的制造方法包括以下步骤：
步骤701：将第一接口、第二接口以及信号增强电路分别固定于基体上，其中第一接口、第二接口中至少一个接口包括电源触头。
步骤702：将信号增强电路分别与第一接口、第二接口电连接，使信号增强电路串接于第一接口和第二接口之间，并且电源触头电连接信号增强电路，为其供电。
其中，在本发明的备选实施例中，将信号增强电路分别与第一接口、第二接口电连接的步骤具体为：将封装好的信号增强电路的第一输入端、第二输入端、接地端以及电源输入端分别与第一接口的第一导电触头、第二导电触头、第三导电触头以及第四导电触头进行回流焊而一一对应电连接，将封装好的信号增强电路的第一输出端、第二输出端以及接地端分别与第二接口的第五导电触头、第六导电触头以及第七导电触头进行回流焊而一一对应电连接，从而形成本发明第一实施例所述的连接器。
在本发明的另一备选实施例中，将信号增强电路分别与第一接口、第二接口电连接的步骤具体为：将封装好的信号增强电路的第一输入端、第二输入端以及接地端分别与第一接口的第一导电触头、第二导电触头以及第三导电触头进行回流焊而一一对应电连接，将封装好的信号增强电路的第一输出端、第二输出端、接地端以及电源输入端分别与第二接口的第五导电触头、第六导电触头、第七导电触头以及第八导电触头进行回流焊而一一对应电连接，从而形成本发明第二实施例所述的连接器。
具体地，请参见图8-10，其绘示出本发明的连接器的制造方法的实际应用过程示意图。
请参见图8，其为上述的基体（即图2所述的现有的连接器）的横截面视图。该基体包括塑胶部82和走线部81。
请参见图9，在走线部81选取需要进行中继的线路，并裁断该线路以形成断口83，另外准备好封装好的信号增强电路84，其包括引脚85。
请参见图10，在线路的断口83处放入锡膏86，并将封装好的信号增强电路84的引脚85放置与锡膏86上。
请参见图11，利用锡膏86进行回流焊，从而将信号增强电路84固定在基体上，以形成本发明的连接器，其中，具体线路的选取可参见图7所对应的实施例及其备选实施例所对应的描述，于此不作赘述。
请参见图12，图12为本发明第五实施例的连接器的立体结构示意图。如图12所示，在本实施例中，连接器608包括外壳607以及设置在外壳607外的多个触头611、612、613、614、644、645、646，其中，触头611、612、613、614设置在外壳607的一个表面上，触头644、645、646设置在外壳607的另外一个表面上。
请参见图13，图13为本发明第五实施例的连接器的剖面图。如图13所示， 连接器的内部进一步设置有信号增强电路10以及一导线组。
导线组包括第一导线体601、第二导线体602、第三导线体603、第四导线体604、第五导线体605以及第六导线体606。第一导线体601连接外壳607外部的电源并为信号增强电路10供电。
信号增强电路10设置有电源输入端1、第一信号输入端2、第二信号输入端3、接地端4、第一信号输出端5以及第二信号输出端6。
第一导线体601的一端与电源输入端1连接，将来自外壳607外部的电源输入至信号增强电路10以为信号增强电路10供电，第二导线体602的一端与第一信号输入端2连接、第三导线体603的一端与第二信号输入端3连接，第二导线体602与第三导线体603将来自外壳607外部的差分信号输入至信号增强电路10；信号增强电路10对差分信号进行信号放大处理并分别输出至第五导线体605的一端以及第六导线体606的一端，接地端4连接于第四导线体604的一端与另一端之间。
第一导线体601的另一端、第二导线体602的另一端、第三导线体603的另一端以及第四导线体604的另一端分别与设置在外壳607的一个表面上的多个导电触头611、612、613、614连接，第五导线体605的另一端、第六导线体606的另一端以及第四导线体604的另一端分别与设置在外壳的另一个表面上的多个导电触头645、646、644连接。
其中，上述第一导线体601、第二导线体602、第三导线体603以及第四导线体604为曲导线体，第五导线体605以及第六导线体606为直导线体。值得注意的是，在本实施例中，为满足连接器608所连接的外接电路板（于下文将会详细介绍）之间的垂直角度需求，在本实施例中作出上述设置，但，在本发明的备选实施例中，上述导线体的形状可根据实际需要设置，本发明对其不作具体限定。
并且，上述的第一导线体601、第二导线体602、第三导线体603、第四导线体604、第五导线体605以及第六导线体606与电源输入端1、第一信号输入端2、第二信号输入端3、接地端4、第一信号输出端5以及第二信号输出端6通过焊锡（如图黑色部分所示）连接，以实现固定及保持电连接。
值得注意的是，在本发明的备选实施例中，第五导线体605以及第六导线体606上可分别设置有耦合电容，以对经信号放大处理的差分信号进行隔直处理。
请参见图14，图14为本发明第五实施例的电子设备的系统结构示意图。如图14所示，本实施例更揭示一种电子设备，其包括第一电路板620、第二电路板630以及图13所述的连接器608。
第一电路板620包括主板体626以及器件625，器件625上设置有电源输出端621、差分信号输出端622、623以及接地端624。
第二电路板630包括主板体638以及器件639，器件639上设置有差分信号输入端635、636以及接地端634。
第一电路板620上设置有接口（未标示）以供触头611、612、613、614插入，第二电路板630设置有接口（未标示）以供触头645、646、644插入。
在触头611、612、613、614插入第一电路板620上的接口、触头611、612、613、614插入第二电路板630的接口时，电源输出端621、差分信号输出端622、623以及接地端624分别通过主板体626内的导线（未标示）以及第一导线体601、第二导线体602、第三导线体603、第四导线体604与电源输入端1、第一信号输入端2、第二信号输入端3、接地端4连接；第一信号输出端5以及第二信号输出端6以及接地端4分别通过第五导线体605、第六导线体606、第四导线体604以及主板体638内的导线（未标示）与差分信号输入端635、636以及接地端634连接。
电源输出端621输出电源至信号增强电路10使其保持工作，差分信号输出端622、623输出差分信号至信号增强电路10以进行中继放大，信号增强电路10输出经中继放大后的差分信号至差分信号输入端635、636。并且，由于器件625的接地端624、信号增强电路10的接地端4以及器件639的接地端634保持连接，可以保证三者共地设置。
因此，通过第一电路板620所提供的电源，连接器608可以对从第一电路板620传输至第二电路板630的差分信号进行中继放大，从而有效抑制了信号衰减。
另外，由于上述的第一导线体601通过信号增强电路10与第五导线体605连接，因此第一导线体601与第五导线体605可合称为同一导线体。
同理，由于上述的第二导线体602通过信号增强电路10与第六导线体606连接，因此第二导线体602与第六导线体606亦可合称为同一导线体。
因此，本实施例中，导线组包括四个导线体，其中第一导线体为信号增强电路供电，第四导线体604接地，由第一导线体601与第五导线体605所组成的导线体以及由第二导线体602与第六导线体606所组成的导线体用于传输差分信号并经过信号增强电路10增强差分信号。
并且，在本发明的扩展实施例中，导线组可设置为多组，并且对应于每一组导线组均以上述所介绍的方式设置一信号增强电路，从而可实现多路差分信号同时放大。
请参见图15，图15为本发明第六实施例的连接器的立体结构示意图。如图15所示，在本实施例中，连接器708包括外壳707以及设置在外壳707外的多个触头712、713、714、741、744、745、746，其中，触头712、713、714、715设置在外壳707的一个表面上，触头741、744、745、746设置在外壳707的另外一个表面上。
请参见图16，图16为本发明第六实施例的连接器的剖面图。如图13所示，连接器708的内部进一步设置有信号增强电路10以及一导线组。导线组包括第一导线体701、第二导线体702、第三导线体703、第四导线体704、第五导线体705以及第六导线体706。第一导线体701连接外壳707外部的电源并为信号增强电路10供电。
信号增强电路10设置有电源输入端1、第一信号输入端2、第二信号输入端3、接地端4、第一信号输出端5以及第二信号输出端6。
第一导线体701的一端与电源输入端1连接，将来自外壳707外部的电源输入至信号增强电路10以为信号增强电路10供电，第二导线体702的一端与第一信号输入端2连接、第三导线体703的一端与第二信号输入端3连接，第二导线体702与第三导线体703将来自外壳707外部的差分信号输入至信号增强电路10；信号增强电路10对差分信号进行信号放大处理并分别输出至第五导线体705的一端以及第六导线体706的一端，接地端4连接于第四导线体704的一端与另一端之间。
第二导线体702的另一端、第三导线体703的另一端以及第四导线体704的另一端分别与设置在外壳707的一个表面上的多个导电触头712、713、714连接，第一导线体701的另一端、第五导线体705的另一端、第六导线体706的另一端以及第四导线体704的另一端分别与设置在外壳的另一个表面上的多个导电触头741、745、747、744连接。
其中，上述第二导线体702、第三导线体703以及第四导线体704为曲导线体，第一导线体701、第五导线体705以及第六导线体706为直导线体。值得注意的是，在本实施例中，为满足连接器708所连接的外接电路板（于下文将会详细介绍）之间的垂直角度需求，而在本实施例中作出上述设置，但，在本发明的备选实施例中，上述导线体的形状可根据实际需要设置，本发明对其不作具体限定。
并且，上述的第一导线体701、第二导线体702、第三导线体703、第四导线体704、第五导线体705以及第六导线体706与电源输入端1、第一信号输入端2、第二信号输入端3、接地端4、第一信号输出端5以及第二信号输出端7通过焊锡（如图黑色部分所示）连接，以实现固定及保持电连接。
值得注意的是，在本发明的备选实施例中，第五导线体705以及第六导线体706上可分别设置有耦合电容，以对经信号放大处理的差分信号进行隔直处理。
另外，由于上述的第一导线体701通过信号增强电路10与第五导线体705连接，因此第一导线体701与第五导线体705可合称为同一导线体。
同理，由于上述的第二导线体702通过信号增强电路10与第六导线体706连接，因此第二导线体702与第六导线体706亦可合称为同一导线体。
因此，本实施例中，导线组包括四个导线体，其中第一导线体为信号增强电路供电，第四导线体704接地，由第一导线体701与第五导线体705所组成的导线体以及由第二导线体702与第六导线体706所组成的导线体用于传输差分信号并经过信号增强电路10增强差分信号。
并且，在本发明的扩展实施例中，导线组可设置为多组，并且对应于每一组导线组均以上述所介绍的方式设置一信号增强电路，从而可实现多路差分信号同时放大。
请参见图17，图17为本发明第六实施例的电子设备的系统结构示意图。如图17所示，本实施例更揭示一种电子设备，其包括第一电路板720、第二电路板730以及图16所述的连接器708。
第一电路板720包括主板体726以及器件725，器件725上设置有差分信号输出端722、723以及接地端724。
第二电路板730包括主板体738以及器件739，器件739上设置有电源输出端731、差分信号输入端735、736以及接地端734。
第一电路板720上设置有接口（未标示）以供触头712、713、714插入，第二电路板730设置有接口（未标示）以供触头741、745、746、744插入。
在触头712、713、714插入第一电路板720上的接口、触头741、745、746、744插入第二电路板730的接口时，差分信号输出端722、723以及接地端724分别通过主板体726内的导线（未标示）以及第二导线体702、第三导线体703、第四导线体704与第一信号输入端2、第二信号输入端3、接地端4连接；电源输入端1、第一信号输出端5以及第二信号输出端6以及接地端4分别通过通过第一导线体701、第五导线体705、第六导线体706、第四导线体704以及主板体738内的导线（未标示）与电源输出端739、差分信号输入端735、736以及接地端734连接。
电源输出端731输出电源至信号增强电路10使其保持工作，差分信号输出端722、723输出差分信号至信号增强电路10以进行中继放大，信号增强电路10输出经中继放大后的差分信号至差分信号输入端735、736。并且，由于器件725的接地端724、信号增强电路10的接地端4以及器件739的接地端734保持连接，可以保证三者共地设置。
因此，通过第二电路板730所提供的电源，连接器708可以对从第一电路板720传输至第二电路板730的差分信号进行中继放大，从而有效抑制了信号衰减。
以下将结合图18至24对本发明第七实施例的一种连接器制造方法作出具体介绍，首先请参见图18，图18是本发明第七实施例中未设置有信号增强电路的连接器的剖视图。如图18所示，该连接器809包括外壳807以及导线体801、802、803、804。
请参见图19，图19是本发明第七实施例中对图18所示连接器进行切割的结构示意图。如图19所示，可拆开外壳807（在外壳807不完全包围导线体时，也可不拆开外壳807，而选择导线体裸露出外壳807的部分进行切割），沿着切割线S1以及S2对导线体801、802、803、804进行切割。
请参见图20，图20是本发明第七实施例中对图18所示连接器进行切割后的结构示意图。如图20所示，进行切割后，产生断开的导线体811、812、821、822、831、832、841、842。
请参见图21，图21示出在本发明第七实施例中信号增强电路在切割导线体后的植入位置。如图21所示，信号增强电路10植入于切割断口之间，信号增强电路10设置有电源输入端1、第一信号输入端2、第二信号输入端3、接地端4、第一信号输出端5以及第二信号输出端6。
请参见图22，图22示出在本发明第七实施例中作出第一种焊接方式后获得的连接器的结构示意图。如图22所示，将电源输入端1与导线体812焊接、将第一信号输入端2与导线体821焊接、将第二信号输入端3与导线体831焊接、将接地端4分别与导线体841以及导线体842焊接、将第一信号输出端5与导线体822焊接、将第二信号输出端6与导线体832焊接，将导线体811删除，获得第六实施例中所述的连接器（也可保留导线体811使其与另一个信号增强电路连接）。
请参见图23，图23示出在本发明第七实施例中作出另一种焊接方式后获得的连接器的结构示意图。如图23所示，将电源输入端1与导线体811焊接、将第一信号输入端2与导线体821焊接、将第二信号输入端3与导线体831焊接、将接地端4分别与导线体841以及导线体842焊接、将第一信号输出端5与导线体822焊接、将第二信号输出端6与导线体832焊接，将导线体812删除，获得第六实施例中所述的连接器（也可保留导线体812使其与另一个信号增强电路连接）。
因此，本发明公开了一种连接器及其制造方法以及电子设备，能够对差分信号进行信号放大处理，使得连接器在高传输数据速率下可有效控制信号衰减，同时不因此而增加电路板的体积且能有效控制制造和研发成本。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (12)

  1. 一种连接器，其特征在于，包括：
    第一接口、第二接口以及信号增强电路，所述第一接口、第二接口中至少一个接口包括电源触头，所述电源触头与所述连接器外部的电源连接以为所述信号增强电路供电；
    外壳，所述信号增强电路设置于所述外壳内部并串接于第一接口和第二接口之间，所述信号增强电路对所述第一接口接收到的差分信号进行信号放大处理并通过所述第二接口输出，所述第一接口、第二接口设置于所述外壳外部的不同表面上。
  2. 根据权利要求1所述的连接器，其特征在于：
    所述第一接口包括第一导电触头、第二导电触头、第三导电触头以及第四导电触头，所述第一导电触头和第二导电触头用于接收来自所述外壳外部的差分信号，所述第三导电触头用于接收来自所述外壳外部的地信号，所述第四导电触头作为所述电源触头接收来自所述外壳外部的电源；
    所述信号增强电路包括第一输入端、第二输入端、第一输出端、第二输出端、接地端以及电源输入端，所述第一输入端与所述第一导电触头连接，所述第二输入端与所述第二导电触头连接，所述接地端与所述第三导电触头连接，所述电源输入端与所述第四导电触头连接，所述信号增强电路通过所述第一输入端以及第二输入端获取所述差分信号并进行信号放大处理；
    所述第二接口包括第五导电触头、第六导电触头以及第七导电触头，所述第五导电触头与所述第一输出端连接，所述第六导电触头与所述第二输出端连接，所述第七导电触头与所述接地端连接，所述第五导电触头和第六导电触头输出经所述信号增强电路进行信号放大处理的差分信号。
  3. 根据权利要求1所述的连接器，其特征在于：
    所述第一接口包括第一导电触头、第二导电触头、第三导电触头，所述第一导电触头和第二导电触头用于接收来自所述外壳外部的差分信号，所述第三导电触头用于接收来自所述外壳外部的地信号；
    所述信号增强电路包括第一输入端、第二输入端、第一输出端、第二输出端、接地端以及电源输入端，所述第一输入端与所述第一导电触头连接，所述第二输入端与所述第二导电触头连接，所述接地端与所述第三导电触头连接，所述信号增强电路通过所述第一输入端以及第二输入端获取所述差分信号并进行信号放大处理；
    所述第二接口包括第五导电触头、第六导电触头、第七导电触头以及第八导电触头，所述第五导电触头与所述第一输出端连接，所述第六导电触头与所述第二输出端连接，所述第七导电触头与所述接地端连接，所述第五导电触头和第六导电触头输出经所述信号增强电路进行信号放大处理的差分信号，所述第八导电触头作为所述电源触头与所述电源输入端连接，用于接收来自所述外壳外部的电源。
  4. 根据权利要求2至3任一项所述的连接器，其特征在于，所述第五导电触头与所述第一输出端之间以及所述第六导电触头与所述第二输出端之间分别设置有耦合电容，以对所述经信号放大处理的差分信号进行隔直处理。
  5. 根据权利要求2至3任一项所述的连接器，其特征在于，所述电源的电压值为1.8V或3.3V。
  6. 一种电子设备，其特征在于，包括第一电路板、第二电路板以及连接器，所述连接器包括：
    第一接口、第二接口以及信号增强电路，所述第一接口、第二接口中至少一个接口包括电源触头，所述电源触头与所述连接器外部的电源连接以为所述信号增强电路供电；
    外壳，所述信号增强电路设置于所述外壳内部并串接于第一接口和第二接口之间，所述信号增强电路对所述第一接口接收到的差分信号进行信号放大处理并通过所述第二接口输出，所述第一接口、第二接口设置于所述外壳外部的不同表面上；
    所述第一电路板、第二电路板中至少一个电路板设置有电源输出端，所述电源触头与所述电源输出端连接，从所述电源输出端获取电源以为所述信号增强电路供电。
  7. 根据权利要求6所述的电子设备，其特征在于：
    所述第一接口包括第一导电触头、第二导电触头、第三导电触头以及第四导电触头，所述第一导电触头和第二导电触头用于接收来自所述第一电路板的差分信号，所述第三导电触头用于接收来自所述第一电路板的地信号，所述第四导电触头作为所述电源触头接收来自所述第一电路板的电源输出端所输出的电源；
    所述信号增强电路包括第一输入端、第二输入端、第一输出端、第二输出端、接地端以及电源输入端，所述第一输入端与所述第一导电触头连接，所述第二输入端与所述第二导电触头连接，所述接地端与所述第三导电触头连接，所述电源输入端与所述第四导电触头连接，所述信号增强电路通过所述第一输入端以及第二输入端获取所述差分信号并进行信号放大处理；
    所述第二接口包括第五导电触头、第六导电触头以及第七导电触头，所述第五导电触头与所述第一输出端连接，所述第六导电触头与所述第二输出端连接，所述第七导电触头与所述接地端连接并接收来自所述第二电路板的地信号，所述第五导电触头和第六导电触头输出经所述信号增强电路进行信号放大处理的差分信号至所述第二电路板。
  8. 根据权利要求6所述的电子设备，其特征在于：
    所述第一接口包括第一导电触头、第二导电触头、第三导电触头，所述第一导电触头和第二导电触头用于接收来自所述第一电路板的差分信号，所述第三导电触头用于接收来自所述第一电路板的地信号；
    所述信号增强电路包括第一输入端、第二输入端、第一输出端、第二输出端、接地端以及电源输入端，所述第一输入端与所述第一导电触头连接，所述第二输入端与所述第二导电触头连接，所述接地端与所述第三导电触头连接，所述信号增强电路通过所述第一输入端以及第二输入端获取所述差分信号并进行信号放大处理；
    所述第二接口包括第五导电触头、第六导电触头、第七导电触头以及第八导电触头，所述第五导电触头与所述第一输出端连接，所述第六导电触头与所述第二输出端连接，所述第七导电触头与所述接地端连接并接收来自所述第二电路板的地信号，所述第五导电触头和第六导电触头输出经所述信号增强电路进行信号放大处理的差分信号至所述第二电路板，所述第八导电触头作为所述电源触头接收来自所述第二电路板的电源输出端所输出的电源。
  9. 根据权利要求7或8任一项所述的电子设备，其特征在于，所述第五导电触头与所述第一输出端之间以及所述第六导电触头与所述第二输出端之间分别设置有耦合电容，以对所述经信号放大处理的差分信号进行隔直处理。
  10. 根据权利要求7至8所述的电子设备，其特征在于，所述电源的电压值为1.8V或3.3V。
  11. 一种连接器，其特征在于，所述连接器包括至少一导线组、外壳以及信号增强电路，所述信号增强电路设置于所述外壳内部，所述导线组包括若干导线体，其中所述导线组中的至少一导线体连接所述外壳外部的电源并为所述信号增强电路供电。
  12. 根据权利要求11所述的连接器，其特征在于，所述导线体组包括四导线体，其中一导线体为所述信号增强电路供电，一导线体接地，二导线体传输差分信号并经过所述信号增强电路增强差分信号。
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