WO2014061420A1 - カチオン重合開始剤、硬化剤組成物およびエポキシ樹脂組成物 - Google Patents
カチオン重合開始剤、硬化剤組成物およびエポキシ樹脂組成物 Download PDFInfo
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- WO2014061420A1 WO2014061420A1 PCT/JP2013/076134 JP2013076134W WO2014061420A1 WO 2014061420 A1 WO2014061420 A1 WO 2014061420A1 JP 2013076134 W JP2013076134 W JP 2013076134W WO 2014061420 A1 WO2014061420 A1 WO 2014061420A1
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- XSQLDMKSWIUQKY-UHFFFAOYSA-N [BH3-]c(c(F)c(c(F)c1F)F)c1F Chemical compound [BH3-]c(c(F)c(c(F)c1F)F)c1F XSQLDMKSWIUQKY-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Definitions
- the present invention relates to a cationic polymerization initiator, a curing agent composition containing this cationic polymerization initiator, and an epoxy resin composition containing this curing agent composition.
- cationic polymerization initiators such as sulfonium salt compounds are known as curing agents for epoxy resins (for example, Patent Document 1).
- the present invention provides a cationic polymerization initiator that, when used as a curing agent component of an epoxy resin composition, improves the storage stability without impairing the curability of the epoxy resin composition. With the goal.
- the present inventors have intensively studied to achieve the above object. As a result, when a cationic polymerization initiator that is a sulfonium salt compound having a specific structure is used as the curing agent component of the epoxy resin composition, the curability of the epoxy resin composition is not impaired and the storage stability is excellent. As a result, the present invention has been completed.
- the present invention provides the following (I) to (V).
- (I) A cationic polymerization initiator which is a sulfonium salt compound represented by the formula (1) described later.
- (II) A curing agent composition comprising the cationic polymerization initiator according to (I) above and a stabilizer that is a compound represented by the formula (6) described later.
- (III) The curing agent composition according to (II), wherein the content of the stabilizer is 0.001 to 20% by mass with respect to the cationic polymerization initiator.
- An epoxy resin and a curing agent component wherein the curing agent component is the cationic polymerization initiator described in (I) above, or the curing agent composition described in (II) or (III) above.
- An epoxy resin composition which is a product.
- (V) The epoxy resin composition according to (IV), wherein the content of the curing agent component is 0.1 to 20 parts by mass with respect to 100 parts by mass of the epoxy resin.
- a cationic polymerization initiator that, when used as a curing agent component of an epoxy resin composition, improves the storage stability without impairing the curability of the epoxy resin composition. Can do.
- the cationic polymerization initiator of the present invention is a cationic polymerization initiator that is a sulfonium salt compound represented by the formula (1) described later.
- the epoxy resin composition in which the cationic polymerization initiator of the present invention is used in combination with an epoxy resin. Excellent storage stability. At this time, curability is not impaired. This is because, in the formula (1) described later, R 2 (an alkyl group having 1 to 6 carbon atoms) or R 3 (a hydrogen atom or an alkyl group having 1 to 6 carbon atoms) becomes a steric hindrance so that the epoxy resin Since it becomes difficult to approach the sulfur cation, the storage stability is considered to be improved.
- R 2 an alkyl group having 1 to 6 carbon atoms
- R 3 a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- the cationic polymerization initiator of the present invention is a cationic polymerization initiator that is a sulfonium salt compound represented by the following formula (1).
- R 1 represents a hydroxy group or a group represented by any of the following formulas (2) to (5)
- R 2 represents an alkyl group having 1 to 6 carbon atoms
- R 3 Represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- R 4 represents an alkyl group having 1 to 6 carbon atoms
- R 5 represents an unsaturated hydrocarbon group which may have a substituent. Show.
- each R 6 independently represents an aromatic or aliphatic hydrocarbon group which may have a substituent which may contain a hetero atom.
- a hetero atom an oxygen atom, a sulfur atom, a nitrogen atom, etc. are illustrated.
- R 6 in the formulas (2) to (5) can be selected from various substituents from the viewpoint of adjusting the curability of the epoxy resin composition, and is not particularly limited, but includes a hetero atom represented by R 6.
- the aromatic hydrocarbon group which may have a substituent may be carbon such as phenyl group, naphthyl group, biphenylenyl group, fluorenyl group, anthryl group, p-toluenesulfonyl group (tosyl group), etc.
- arylaryl groups such as benzyl group and phenylethyl group; arylalkenyl groups such as styryl group and cinnamyl group; and the like.
- Examples of the aliphatic hydrocarbon group which may have a substituent which may contain a heteroatom represented by R 6 include, for example, saturated groups having 1 to 12 carbon atoms such as an alkyl group, an alkenyl group and an alkynyl group.
- an unsaturated chain hydrocarbon group and specific examples thereof include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, Isopentyl, neopentyl, tert-pentyl, hexyl, isohexyl, 2-ethylhexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, vinyl, allyl, isopropenyl, A —CH ⁇ CH— (CH 2 ) 8 — group, an ethynyl group and the like can be mentioned.
- an aromatic hydrocarbon group which may have a substituent which may contain a hetero atom is preferable because the curability of the epoxy resin composition is excellent.
- An aryl group having 6 to 18 carbon atoms is more preferable, and a p-toluenesulfonyl group is more preferable.
- the group represented by R 1 in the formula (1) is not particularly limited as long as it is a hydroxy group or a group represented by any one of the formulas (2) to (5), but the curability of the epoxy resin composition is excellent. For this reason, a hydroxy group or a group represented by the formula (4) is preferable.
- Examples of the alkyl group having 1 to 6 carbon atoms represented by R 2 in the formula (1) include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, an n-pentyl group, and an n-hexyl group. Among them, a methyl group and an ethyl group are preferable.
- Examples of the alkyl group having 1 to 6 carbon atoms represented by R 3 in the formula (1) include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, an n-pentyl group, and an n-hexyl group. And a methyl group and an ethyl group are preferable.
- the group represented by R 3 in formula (1) is not particularly limited as long as it is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, but from the viewpoint of availability, a hydrogen atom is preferable.
- the group represented by R 1 to R 3 corresponds to the substituent substituted with the hydrogen atom of the benzene ring in the formula (1), and the position thereof is not particularly limited, but R 2 and R 3 represent The group is preferably in the ortho position relative to the sulfur atom bonded to the benzene ring. Thereby, it becomes a steric hindrance with respect to the epoxy resin approaching a sulfur cation, and storage stability is more excellent.
- the position of the group represented by R 1 is not particularly limited, and examples thereof include a para position with respect to a sulfur atom bonded to a benzene ring.
- Examples of the alkyl group having 1 to 6 carbon atoms represented by R 4 in the formula (1) include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, an n-pentyl group, and an n-hexyl group. Among them, a methyl group and an ethyl group are preferable.
- Examples of the unsaturated hydrocarbon group which may have a substituent represented by R 5 in formula (1) include an aromatic hydrocarbon group which may have a substituent, and specific examples thereof.
- an aryl group having 6 to 18 carbon atoms such as a phenyl group, a naphthyl group, a biphenylenyl group, a fluorenyl group, an anthryl group, a p-toluenesulfonyl group (tosyl group); an arylalkyl group such as a benzyl group or a phenylethyl group;
- Arylalkenyl groups such as a styryl group and a cinnamyl group;
- an aryl group or arylalkenyl group having 6 to 18 carbon atoms is preferable, and a naphthyl group or styryl group is more preferable because of the excellent curability of the epoxy resin composition.
- Method for producing cationic polymerization initiator It does not specifically limit as a manufacturing method of the sulfonium salt compound represented by Formula (1) which is a cationic polymerization initiator of this invention.
- a compound represented by the following formula (a1) and a compound represented by the following formula (a2) are mixed at a molar ratio of 1.0: 1.0.
- a chloride intermediate represented by the following formula (a3) is obtained by putting it in methanol as an organic solvent and reacting it by mixing at room temperature for about 24 hours.
- the obtained chloride intermediate and the sodium salt of tetrakis (pentafluorophenyl) borate are mixed in an aqueous solvent so that the molar ratio is 1.0: 1.0 to 1.0: 1.1.
- the sulfonium salt compound represented by the above formula (1) can be obtained by mixing at room temperature for 5 to 24 hours. Since R 1 ⁇ R 5 in formula (a1) ⁇ (a3) has the same meaning as R 1 ⁇ R 5 in the above-mentioned formula (1), the description thereof is omitted.
- a sulfonium salt compound represented by the following formula (1A) can be preferably exemplified.
- curing agent composition of this invention is a hardening
- the epoxy resin composition in which the cationic polymerization initiator of the present invention is used in combination with an epoxy resin is excellent in storage stability, but the storage stability is further improved by further including this stabilizer. This is because, for example, in the case where the stabilizer is a compound represented by the formula (6A) described later, a methyl group that is an electron-donating group is introduced at the ortho-position, so that the nucleophilicity of the sulfide. It is considered that the storage stability is improved.
- the stabilizer when the stabilizer is a compound represented by the formula (6B) described later, in addition to the nucleophilicity of the sulfide, it may have a structure in which the carbonyl oxygen of the carboxy group is coordinated to the sulfonium salt. Therefore, it is considered that the storage stability is improved by these effects.
- curing agent composition of this invention is demonstrated first.
- the stabilizer contained in the curing agent composition of the present invention is a compound represented by the following formula (6).
- R 7 represents a hydroxy group, a carboxy group, or a group represented by the following formula (7)
- R 8 represents an alkyl group having 1 to 6 carbon atoms
- R 9 represents A hydrogen atom or an alkyl group having 1 to 6 carbon atoms is shown. However, when R 9 represents a hydrogen atom, R 7 represents a carboxy group.
- R 10 represents an alkyl group having 1 to 6 carbon atoms or an aromatic hydrocarbon group which may have a substituent.
- Examples of the alkyl group having 1 to 6 carbon atoms represented by R 10 in the formula (7) include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, an n-pentyl group, and an n-hexyl group. Among them, a methyl group and an ethyl group are preferable.
- examples of the aromatic hydrocarbon group which may have a substituent represented by R 10 in formula (7) include a phenyl group, a naphthyl group, a biphenylenyl group, a fluorenyl group, an anthryl group, p-toluenesulfonyl, and the like.
- Aryl groups having 6 to 18 carbon atoms such as a group (tosyl group); arylalkyl groups such as benzyl group and phenylethyl group; arylalkenyl groups such as styryl group and cinnamyl group;
- the group represented by R 7 in formula (6) is preferably a hydroxy group or a carboxy group because the storage stability of the epoxy resin composition is further improved.
- Examples of the alkyl group having 1 to 6 carbon atoms represented by R 8 in the formula (6) include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, an n-pentyl group, and an n-hexyl group. Among them, a methyl group and an ethyl group are preferable.
- Examples of the alkyl group having 1 to 6 carbon atoms represented by R 9 in the formula (6) include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, an n-pentyl group, and an n-hexyl group. Among them, a methyl group and an ethyl group are preferable.
- the group represented by R 9 in the formula (6) is not particularly limited as long as it is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, but for the reason that the storage stability of the epoxy resin composition is further excellent, 1-6 alkyl groups are preferred.
- a compound represented by the formula (6) as described above a compound represented by the following formula (6A) or (6B) can be preferably exemplified.
- the content of such a stabilizer is preferably 0.001 to 20% by mass, more preferably 0.01 to 10% by mass, based on the cationic polymerization initiator of the present invention. More preferably, the content is from 05 to 10% by mass. If content of a stabilizer is this range, in the epoxy resin composition using the hardening
- the method for producing the curing agent composition of the present invention is not particularly limited.
- the cationic polymerization initiator and the stabilizer of the present invention are sufficiently kneaded and uniformly dispersed under reduced pressure or in an inert atmosphere.
- the manufacturing method of the epoxy resin composition of this invention mentioned later may serve as the manufacturing method of the hardening
- the epoxy resin composition of the present invention is an epoxy resin composition containing an epoxy resin and a curing agent component, and the curing agent component is the cationic polymerization initiator of the present invention described above or the curing agent composition of the present invention. is there. Since the epoxy resin composition of the present invention contains the cationic polymerization initiator of the present invention or the curing agent composition of the present invention as a curing agent component of the epoxy resin, the curability is not impaired and the storage stability is excellent.
- the content of the curing agent component is preferably 0.1 to 20 parts by mass, and more preferably 0.5 to 10 parts by mass with respect to 100 parts by mass of the epoxy resin. If content of the said hardening
- Epoxy resin The epoxy resin contained in the epoxy resin composition of the present invention is not particularly limited as long as it has two or more epoxy groups, and conventionally known ones can be used, for example, bisphenol A type epoxy resin, Bisphenol F type epoxy resin, dicyclopentadiene type epoxy resin, diaminodiphenylmethane type epoxy resin, aminophenol type epoxy resin, naphthalene type epoxy resin, phenol novolac type epoxy resin, biphenyl type epoxy resin, hydrogenated bisphenol A type epoxy resin, water Bisphenol F type epoxy resin, hydrogenated biphenol type epoxy resin, polyalkylene glycol type epoxy resin, alicyclic epoxy resin, and the like may be used, and these may be used alone or in combination of two or more. Good.
- a commercial item can be used as such an epoxy resin.
- examples of the bisphenol A type epoxy resin include Epicoat 828 (manufactured by JER) and EP4100E (manufactured by ADEKA).
- examples of the polyalkylene glycol type epoxy resin include EP4000S and EP4010S (both are ADEKA).
- examples of the alicyclic epoxy resin include Celoxide 2021P (manufactured by Daicel Chemical Industries, Ltd.).
- the epoxy resin composition of the present invention is, as necessary, for example, a filler, a reaction retarding agent, an antioxidant, an antioxidant, a pigment (dye), a plasticizer, as long as the object of the present invention is not impaired. It can contain various additives such as thixotropic agents, UV absorbers, flame retardants, solvents, surfactants (including leveling agents), dispersants, dehydrating agents, adhesion promoters, antistatic agents, etc. The content is not particularly limited.
- the method for producing the epoxy resin composition of the present invention is not particularly limited.
- an epoxy resin, the above-described curing agent component, and an additive that can be used as necessary are ball milled under reduced pressure or in an inert atmosphere.
- the manufacturing method of the epoxy resin composition of this invention may serve as the manufacturing method of the hardening
- the epoxy resin composition of the present invention is excellent in storage stability, it can be a one-component type.
- the epoxy resin composition of the present invention is a one-pack type, the epoxy resin composition of the present invention can be placed in a container, hermetically sealed and stored at room temperature or lower (for example, ⁇ 20 to 25 ° C.).
- the epoxy resin composition of the present invention is excellent in storage stability, it can suppress thickening even under relatively high temperature conditions. Specifically, for example, it can be stored at about 30 to 75 ° C. It becomes.
- the epoxy resin composition of the present invention can be cured by heating for a short time under heating conditions.
- the heating temperature is preferably 80 to 250 ° C., and more preferably 80 to 200 ° C. from the viewpoint of shortening the curing time in production.
- adherends to which the epoxy resin composition of the present invention can be used include glass materials, plastic materials, metals, and organic-inorganic composite materials. Although it does not specifically limit as a use of the epoxy resin composition of this invention, For example, a sealing material, a laminated board, an adhesive agent, a sealing material, a coating material etc. are mentioned.
- the epoxy resin composition of the present invention can be cured at a low temperature in a short time, thereby reducing the internal stress that occurs during curing. For example, it can be used in the field of electronic materials such as anisotropic conductive films. Can be suitably used.
- Preparation of cationic polymerization initiator 1 First, 176.64 g of 1- (chloromethyl) naphthalene and 154.23 g of 4- (methylthio) -m-cresol were reacted in methanol at room temperature for 24 hours to obtain a chloride intermediate. Next, 100 g of the obtained chloride intermediate and 2121 g of an aqueous sodium salt solution of tetrakis (pentafluorophenyl) borate (solid content 10%) were mixed at room temperature for 24 hours to obtain a compound.
- the obtained compound was confirmed to be a sulfonium salt compound represented by the above formula (1A).
- the sulfonium salt compound represented by the formula (1A) thus obtained was used as a cationic polymerization initiator 1.
- the Yasuda-type gel time tester is a device that rotates the rotor in a test tube containing a sample in an oil bath, and when the gelation proceeds and a certain torque is applied, the rotor is dropped by the magnetic coupling mechanism and the timer is stopped. .
- Epoxy resin 1 bisphenol A type epoxy resin (EP4100E, manufactured by ADEKA)
- Cationic polymerization initiator 1 sulfonium salt compound represented by the above formula (1A)
- Cationic polymerization initiator 2 sulfonium salt compound represented by the above formula (X1)
- Cationic polymerization initiator 3 the above formula Sulphonium salt compound represented by (X2)
- Cationic polymerization initiator 4 Sulphonium salt compound represented by formula (X3) described above
- Stabilizer 1 Compound represented by formula (6A) (manufactured by Tokyo Chemical Industry Co., Ltd.)
- Stabilizer 2 Compound represented by formula (6B) (manufactured by Tokyo Chemical Industry Co., Ltd.)
- Examples 1 to 5 using the cationic polymerization initiator 1 have a lower rate of increase in viscosity than those of Comparative Examples 2 and 4 in which these are not used, and the storage stability is improved. I found it excellent.
- Comparative Example 3 using the stabilizer 1 although the viscosity increase rate at 40 ° C. was relatively low, the viscosity increase rate at 60 ° C. was high.
- Examples 1 to 5 had a low viscosity increase rate at 60 ° C. and were excellent in storage stability.
- the gel times of Examples 1 to 5 were the same as those of Comparative Examples 2 to 4, and the curability was not impaired and was good.
- Comparative Example 1 using the cationic polymerization initiator 2 had good storage stability, it was found that the gel time was longer and the curability was inferior to Examples 1-5.
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Abstract
Description
そこで、本発明は、エポキシ樹脂組成物の硬化剤成分として使用された場合に、該エポキシ樹脂組成物の硬化性を損なうことなく、その貯蔵安定性を良好にするカチオン重合開始剤を提供することを目的とする。
(I)後述する式(1)で表されるスルホニウム塩化合物であるカチオン重合開始剤。
(II)上記(I)に記載のカチオン重合開始剤と、後述する式(6)で表される化合物である安定剤と、を含有する硬化剤組成物。
(III)上記安定剤の含有量が、上記カチオン重合開始剤に対して、0.001~20質量%である、上記(II)に記載の硬化剤組成物。
(IV)エポキシ樹脂と、硬化剤成分と、を含有し、上記硬化剤成分が、上記(I)に記載のカチオン重合開始剤、または、上記(II)もしくは(III)に記載の硬化剤組成物である、エポキシ樹脂組成物。
(V)上記硬化剤成分の含有量が、上記エポキシ樹脂100質量部に対して、0.1~20質量部である、上記(IV)に記載のエポキシ樹脂組成物。
本発明のカチオン重合開始剤は、後述する式(1)で表されるスルホニウム塩化合物であるカチオン重合開始剤であり、本発明のカチオン重合開始剤をエポキシ樹脂と併用したエポキシ樹脂組成物においては、貯蔵安定性が優れる。このとき、硬化性が損なわれることもない。
これは、後述する式(1)において、R2(炭素数1~6のアルキル基)またはR3(水素原子または炭素数1~6のアルキル基)が立体障害となることで、エポキシ樹脂が硫黄カチオンに近づきにくくなるため、貯蔵安定性が向上するものと考えられる。
以下、本発明のカチオン重合開始剤について、詳細に説明する。
また、R6が示すヘテロ原子を含んでいてもよい置換基を有していてもよい脂肪族炭化水素基としては、例えば、アルキル基、アルケニル基、アルキニル基などの炭素数1~12の飽和または不飽和の鎖式炭化水素基が挙げられ、その具体例としては、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、sec-ブチル基、tert-ブチル基、ペンチル基、イソペンチル基、ネオペンチル基、tert-ペンチル基、ヘキシル基、イソヘキシル基、2-エチルヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基、ビニル基、アリル基、イソプロペニル基、-CH=CH-(CH2)8-基、エチニル基などが挙げられる。
式(1)中のR3が示す基としては、水素原子または炭素数1~6のアルキル基であれば特に限定されないが、入手しやすさの観点からは、水素原子であるのが好ましい。
なお、R1が示す基の位置としては、特に限定されず、例えば、ベンゼン環に結合した硫黄原子に対するパラ位が挙げられる。
これらのうち、R5が示す基としては、エポキシ樹脂組成物の硬化性が優れるという理由から、炭素数6~18のアリール基、アリールアルケニル基が好ましく、ナフチル基、スチリル基がより好ましい。
本発明のカチオン重合開始剤である式(1)で表されるスルホニウム塩化合物の製造方法としては、特に限定されない。
この製造方法としては、例えば、まず、下記式(a1)で表される化合物と、下記式(a2)で表される化合物とを、1.0:1.0のモル比となるように、有機溶媒であるメタノール中に投入し、室温で24時間程度混合することにより反応させて、下記式(a3)で表されるクロライド中間体を得る。
次に、得られたクロライド中間体と、テトラキス(ペンタフルオロフェニル)ボレートのナトリウム塩とを、1.0:1.0~1.0:1.1のモル比となるように、水溶媒下で、室温で5~24時間混合することにより、上述した式(1)で表されるスルホニウム塩化合物が得られる。
なお、下記式(a1)~(a3)中のR1~R5は、上述した式(1)中のR1~R5と同義であるため、説明を省略する。
本発明の硬化剤組成物は、上述した本発明のカチオン重合開始剤と、後述する式(6)で表される化合物である安定剤と、を含有する硬化剤組成物である。
上述したように、本発明のカチオン重合開始剤をエポキシ樹脂と併用したエポキシ樹脂組成物は貯蔵安定性が優れるが、さらにこの安定剤を含むことで、より貯蔵安定性が優れる。
これは、例えば、安定剤が後述する式(6A)で表される化合物である場合においては、オルト位に電子共与性基であるメチル基が導入されていることにより、スルフィドの求核性が高まり、貯蔵安定性が向上するものと考えられる。
また、例えば、安定剤が後述する式(6B)で表される化合物である場合においては、スルフィドの求核性の他に、カルボキシ基のカルボニル酸素がスルホニウム塩に配位する構造をとることができるため、これらの効果により貯蔵安定性が向上するものと考えられる。
以下では、まず、本発明の硬化剤組成物に含有される安定剤について説明する。
本発明の硬化剤組成物に含有される安定剤は、下記式(6)で表される化合物である。
また、式(7)中のR10が示す置換基を有していてもよい芳香族炭化水素基としては、例えば、フェニル基、ナフチル基、ビフェニレニル基、フルオレニル基、アンスリル基、p-トルエンスルホニル基(トシル基)などの炭素数6~18のアリール基;ベンジル基、フェニルエチル基などのアリールアルキル基;スチリル基、シンナミル基などのアリールアルケニル基;等が挙げられる。
式(6)中のR9が示す炭素数1~6のアルキル基としては、例えば、メチル基、エチル基、n-プロピル基、n-ブチル基、n-ペンチル基、n-ヘキシル基などが挙げられ、なかでも、メチル基、エチル基であるのが好ましい。
安定剤の含有量がこの範囲であれば、本発明の硬化剤組成物を用いたエポキシ樹脂組成物において、貯蔵安定性がさらに優れる。
なお、後述する本発明のエポキシ樹脂組成物の製造方法が、本発明の硬化剤組成物の製造方法を兼ねていてもよい。
次に、本発明のエポキシ樹脂組成物について説明する。本発明のエポキシ樹脂組成物は、エポキシ樹脂と硬化剤成分とを含有するエポキシ樹脂組成物であり、上記硬化剤成分は、上述した本発明のカチオン重合開始剤または本発明の硬化剤組成物である。
本発明のエポキシ樹脂組成物は、エポキシ樹脂の硬化剤成分として本発明のカチオン重合開始剤または本発明の硬化剤組成物を含有するため、硬化性が損なわれることなく、貯蔵安定性に優れる。
本発明のエポキシ樹脂組成物に含有されるエポキシ樹脂としては、エポキシ基を2個以上有するものであれば特に限定されず、従来公知のものを用いることができ、例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ジアミノジフェニルメタン型エポキシ樹脂、アミノフェノール型エポキシ樹脂、ナフタレン型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、水添ビスフェノールA型エポキシ樹脂、水添ビスフェノールF型エポキシ樹脂、水添ビフェノール型エポキシ樹脂、ポリアルキレングリコール型エポキシ樹脂、脂環式エポキシ樹脂などが挙げられ、これらを1種単独で用いてもよく、2種以上を併用してもよい。
このようなエポキシ樹脂としては、市販品を用いることができる。例えば、ビスフェノールA型エポキシ樹脂としては、例えば、エピコート828(JER社製)、EP4100E(ADEKA社製)等が挙げられ、ポリアルキレングリコール型エポキシ樹脂としては、例えば、EP4000S、EP4010S(いずれもADEKA社製)等が挙げられ、脂環式エポキシ樹脂としては、例えば、セロキサイド2021P(ダイセル化学社製)が挙げられる。
本発明のエポキシ樹脂組成物は、本発明の目的を損わない範囲で、必要に応じて、例えば、充填剤、反応遅延剤、老化防止剤、酸化防止剤、顔料(染料)、可塑剤、揺変性付与剤、紫外線吸収剤、難燃剤、溶剤、界面活性剤(レベリング剤を含む)、分散剤、脱水剤、接着付与剤、帯電防止剤などの各種添加剤を含有することができ、その含有量も特に限定されない。
なお、本発明のエポキシ樹脂組成物の製造方法が、上述した本発明の硬化剤組成物の製造方法を兼ねていてもよい。
本発明のエポキシ樹脂組成物の用途としては、特に限定されないが、例えば、封止材、積層板、接着剤、シーリング材、塗料などが挙げられる。また、本発明のエポキシ樹脂組成物は、低温で短時間に硬化することができ、これにより、硬化時に生じる内部応力を低減できるため、例えば、異方性導電フィルムなどの電子材料分野での用途に好適に用いることができる。
(カチオン重合開始剤1の調製)
まず、1-(クロロメチル)ナフタレン176.64gと、4-(メチルチオ)-m-クレゾール154.23gとを、メタノール中で室温24時間反応させ、クロライド中間体を得た。次に、得られたクロライド中間体100gと、テトラキス(ペンタフルオロフェニル)ボレートのナトリウム塩水溶液(固形分10%)2121gとを、室温で24時間混合することで化合物を得た。得られた化合物は、分析(1H-NMRおよびHPLCによる分析。以下同様。)の結果、上述した式(1A)で表されるスルホニウム塩化合物であることが確認された。このようにして得られた式(1A)で表されるスルホニウム塩化合物をカチオン重合開始剤1とした。
テトラキス(ペンタフルオロフェニル)ボレートのナトリウム塩水溶液(固形分10%)に代えて、ヘキサフルオロアンチモン酸ナトリウム(Na[SbF6])を78.2g、水を700g混合した以外は、カチオン重合開始剤1の調製と同様にして、化合物を得た。得られた化合物は、分析の結果、下記式(X1)で表されるスルホニウム塩化合物であることが確認された。このようにして得られた式(X1)で表されるスルホニウム塩化合物をカチオン重合開始剤2とした。
まず、1-(クロロメチル)ナフタレン176.64gと、4-(メチルチオ)フェノール140.2gとを、メタノール中で室温24時間反応させ、クロライド中間体を得た。次に、得られたクロライド中間体100gと、テトラキス(ペンタフルオロフェニル)ボレートのナトリウム塩水溶液(固形分10%)2258gとを、室温で24時間混合することで化合物を得た。得られた化合物は、分析の結果、下記式(X2)で表されるスルホニウム塩化合物であることが確認された。このようにして得られた式(X2)で表されるスルホニウム塩化合物をカチオン重合開始剤3とした。
国際公開第2010/064648号に記載された方法に従い、下記式(X3)で表されるスルホニウム塩化合物を得た。得られた式(X3)で表されるスルホニウム塩化合物をカチオン重合開始剤4とした。
下記第1表に示す組成(単位は質量部)になるように、各成分を配合して攪拌機(コンディショニングミキサー MX-20、シンキー社製)を用いて均一に混合し、一部の例では硬化剤組成物の調製も兼ねて、エポキシ樹脂組成物を調製した。
調製した各エポキシ樹脂組成物について、それぞれ、下記の方法でゲルタイムおよび粘度上昇率を測定することで、硬化性および貯蔵安定性を評価した。結果を下記第1表に示す。
調製した各エポキシ樹脂組成物について、安田式ゲルタイムテスター(安田精機製作所社製、No.153ゲルタイムテスター)を用いて150℃でのゲルタイム(単位:秒)を測定した。
なお、安田式ゲルタイムテスターは、オイルバス中、試料を入れた試験管の中でローターを回転させ、ゲル化が進み一定のトルクが掛かると磁気カップリング機構によりローターが落ちタイマーが止まる装置である。
調製した各エポキシ樹脂組成物を40℃または60℃のオーブンに入れて、初期および2時間経過後の粘度をそれぞれ測定し、その増加率を粘度上昇率とした。E型粘度計 VISCONIC EHD型(東機産業社製)を用いて初期粘度を測定した。次いで、得られた初期粘度および2時間後の粘度の値を下記式に当てはめて、粘度上昇率を算出した。
(粘度上昇率)=(2時間後の粘度)/(初期粘度)
・エポキシ樹脂1:ビスフェノールA型エポキシ樹脂(EP4100E、ADEKA社製)
・カチオン重合開始剤1:上述した式(1A)で表されるスルホニウム塩化合物
・カチオン重合開始剤2:上述した式(X1)で表されるスルホニウム塩化合物
・カチオン重合開始剤3:上述した式(X2)で表されるスルホニウム塩化合物
・カチオン重合開始剤4:上述した式(X3)で表されるスルホニウム塩化合物
・安定剤1:式(6A)で表される化合物(東京化成工業社製)
・安定剤2:式(6B)で表される化合物(東京化成工業社製)
また、安定剤1を使用した比較例3は、40℃での粘度上昇率は比較的低いものの、60℃での粘度上昇率は高い結果であった。これに対し、実施例1~5は、60℃での粘度上昇率も低く、貯蔵安定性に優れていた。
しかも、実施例1~5は、比較例2~4に対してゲルタイムが同等であり、硬化性は損なわれず良好であった。
一方、カチオン重合開始剤2を使用した比較例1は、貯蔵安定性は良好であるものの、実施例1~5と比べてゲルタイムが長く、硬化性に劣ることが分かった。
Claims (5)
- 前記安定剤の含有量が、前記カチオン重合開始剤に対して、0.001~20質量%である、請求項2に記載の硬化剤組成物。
- エポキシ樹脂と、硬化剤成分と、を含有し、
前記硬化剤成分が、請求項1に記載のカチオン重合開始剤、または、請求項2もしくは3に記載の硬化剤組成物である、エポキシ樹脂組成物。 - 前記硬化剤成分の含有量が、前記エポキシ樹脂100質量部に対して、0.1~20質量部である、請求項4に記載のエポキシ樹脂組成物。
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