WO2014046323A1 - Module de conditionnement et son procédé de fabrication - Google Patents

Module de conditionnement et son procédé de fabrication Download PDF

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Publication number
WO2014046323A1
WO2014046323A1 PCT/KR2012/007651 KR2012007651W WO2014046323A1 WO 2014046323 A1 WO2014046323 A1 WO 2014046323A1 KR 2012007651 W KR2012007651 W KR 2012007651W WO 2014046323 A1 WO2014046323 A1 WO 2014046323A1
Authority
WO
WIPO (PCT)
Prior art keywords
package
epoxy
substrate
electrode pattern
junction
Prior art date
Application number
PCT/KR2012/007651
Other languages
English (en)
Korean (ko)
Inventor
문종태
Original Assignee
(주)호전에이블
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)호전에이블 filed Critical (주)호전에이블
Publication of WO2014046323A1 publication Critical patent/WO2014046323A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a package module and a manufacturing method thereof.
  • a package module is a package mounted on a substrate, which is manufactured by mounting a desired package on a printed circuit board using surface mounting technology (SMT).
  • SMT surface mounting technology
  • a general surface mount technique is as follows.
  • a cream paste is printed on a printed circuit board to form an electrode pattern, and then a desired package is placed on a corresponding portion of the printed circuit board on which the electrode pattern is formed.
  • the electrode pattern formed of the solder paste is heat-treated and cured to connect the electrode pattern and the package.
  • the mounted component is protected from foreign matter such as moisture or dust, or the mounted component is prevented from falling off the printed circuit board.
  • the liquid epoxy is applied to the surface around the mounted component and then cured.
  • the printed circuit board is a flexible printed circuit board
  • a large number of component detachment occurs at the portion where the bending occurs badly.
  • the gap between the printed circuit board and the component including the flexible printed circuit board is narrow, the problem of the epoxy coating operation is not performed smoothly, there is a problem such as damage or disconnection of the component due to foreign matter.
  • the technical problem to be achieved by the present invention is to reduce the time and cost of manufacturing a package module.
  • Another object of the present invention is to reduce the contact failure rate of the components mounted on the substrate in the package module.
  • a package module includes a substrate, a package disposed on the substrate, at least one junction portion formed between the substrate and the package and made of a conductive material, and the at least one junction portion other than an upper surface of the package. It is apply
  • the epoxy part may apply to the entire outer circumferential surface of the at least one bonding part that is exposed.
  • the epoxy part may apply a portion of an outer circumferential surface of the at least one junction part that is exposed.
  • the at least one junction may include two adjacent junctions, and the epoxy portion may be located between the two adjacent junctions.
  • the substrate may be a flexible printed circuit board.
  • a method of manufacturing a package module includes printing an electrode composition on a substrate to form an electrode pattern, placing a package having a terminal on the electrode pattern, and heat treating the substrate on which the package is located.
  • the electrode composition preferably comprises a metal powder and epoxy.
  • the electrode composition may contain 10wt% to 90wt% metal powder and 90wt% to 10wt% epoxy.
  • the substrate may be a flexible printed circuit board.
  • an epoxy portion for applying the bonding portion is formed during the process of bonding the electrode pattern positioned on the substrate and the terminal positioned in the package to form the bonding portion, a separate additional process for forming the epoxy portion is unnecessary. This reduces the time and cost of manufacturing a package module.
  • the application pattern of the electrode pattern and the terminal by epoxy is more accurate and reliable. It is done.
  • FIG. 1 is a cross-sectional view of a package module according to an embodiment of the present invention.
  • FIGS. 2A and 2B illustrate a method of manufacturing a package module according to an embodiment of the present invention.
  • 3 to 6 are cross-sectional views of various examples of package modules according to an embodiment of the present invention.
  • FIG. 1 a package module according to an embodiment of the present invention will be described.
  • a package module may include a substrate 100, a package 200 positioned on the substrate 100, and a junction 300 located between the substrate 100 and the package 200. And an epoxy portion 310 that applies the surface of the bonding portion 300 positioned between the substrate 100 and the package 200.
  • the substrate 100 is a flexible printed circuit board made of polyimide, polyethylene terephthalate (PET), fiber material, or the like, but is not limited thereto, and may be a rigid printed circuit board (rigid PCB).
  • the package 200 may be a driving chip, a central process unit (CPU) chip, or the like used in a display device.
  • CPU central process unit
  • the junction 300 is a portion in which an electrode pattern positioned on the substrate 100 and a terminal (eg, solder ball) attached to the package 200 are bonded to each other, the junction 300 is a conductive material such as a metal. Consists of
  • the electrode pattern of the substrate 100 and the corresponding terminals of the package 200 are physically and electrically connected to each other.
  • the junction 300 may contain tin (Sn) -bismuth (Bi) -silver (Ag) or may contain silver (Ag) -copper (Cu).
  • the epoxy part 310 is made of an epoxy resin which is an insulating material.
  • the epoxy part 310 may have a portion other than the upper surface of the package 200, that is, the surface opposite to the surface on which the solder ball 110 is located, that is, a junction portion exposed to the outside.
  • the outer circumferential surface of the 300 is wrapped and is positioned on the periphery of the package 300 in contact with the junction 300 and on the periphery of the substrate 100 in contact with the junction 300.
  • the epoxy part 310 is not positioned on the top surface of the package 200 and on the portion where the electrode pattern is not located on the surface of the substrate 100 where the electrode pattern is located.
  • the insulating epoxy part 310 is positioned around the junction part 300 and coats the junction part 300, the junction part, that is, the package 200 and the junction part between the substrate 100 and the junction part 300. Since the bonding state between the 300 and the electrode pattern located on the substrate 100 and the terminal located on the package 200 is protected by the epoxy part 310, the problem of falling of these bonding parts is prevented.
  • the epoxy part 310 is not positioned on the package 200. Therefore, as compared with the case of the comparative example in which the epoxy portion is also located on the package, the heat dissipation effect of the heat emitted from the package 200 is improved by the operation of the package 200, thereby preventing noise or deterioration due to heat.
  • FIGS. 2A and 2B As well as FIG. 1.
  • an electrode composition 110 having a desired shape is formed on the substrate 100 by printing a composition for an electrode directly on the substrate 100.
  • the substrate 100 is a flexible printed circuit board made of polyimide, polyethylene terephthalate (PET) or a fiber material, but is not limited thereto, and may be a rigid printed circuit board.
  • PET polyethylene terephthalate
  • the composition for electrodes contains a metal powder and liquid epoxy containing at least one metal, such as copper, silver, gold, etc., and may further contain iron (Fe).
  • the electrode composition may contain 10 wt% to 90 wt% metal powder and 90 wt% to 10 wt% epoxy.
  • the metal powder may have a melting point of about 90 °C to 350 °C depending on the heat resistance of the printed circuit board.
  • the electrode pattern may use screen printing or direct printing.
  • the electrode pattern 110 may be formed by applying a metal paste containing a metal powder and a liquid epoxy. In this case, a separate heat treatment process for drying the coated electrode pattern 110 is omitted.
  • the package 200 which is a component to be mounted on the electrode pattern 110 of the substrate 100, is mounted on the electrode pattern 110 positioned on the substrate 100 (S20).
  • the package 200 since the package 200 has a ball grid array (BGA) shape, the package 200 has solder balls 210, which are terminals in contact with the electrode pattern 110.
  • BGA ball grid array
  • the plurality of solder balls 210 attached to the bottom of the package 200 are positioned to contact the electrode pattern 110 on the electrode pattern 110 positioned on the corresponding substrate 100.
  • the package 200 may be positioned on the desired electrode pattern 110 using a flip chip process or a pick and place process.
  • the electrode pattern 110 positioned on the substrate 100 and the solder balls 210 of the package 200 are physically and electrically connected to fix the package 200 positioned on the substrate 100 on the substrate 100.
  • the substrate 100 is heat treated using an oven (not shown) or the like.
  • the heat treatment temperature is preferably above the melting point of the metal powder contained in the electrode pattern (110).
  • the heat treatment temperature and the heat treatment time vary depending on the type of the metal powder forming the electrode pattern 110.
  • the heat treatment temperature may be 120 ° C to 180 ° C and the heat treatment time may be 1 minute to 3 minutes.
  • the heat treatment temperature may be 200 ° C. to 270 ° C., and the heat treatment time may be 1 minute to 3 minutes.
  • the metal contained in the electrode pattern 110 is melted, and the electrode pattern 110 and the solder balls 210 of the package 200 disposed thereon are electrically and physically connected to the electrode pattern 110 and the solder.
  • a junction 300 to which the ball 210 is connected is formed between the substrate 100 and the package 200 (see FIG. 1).
  • the package 200 is fixed on the electrode pattern 110 of the substrate 100 by the electrode unit 300.
  • the epoxy having a lower melting point than the metal contained in the electrode pattern 110 is also melted.
  • the electrode pattern 110 is coated with a liquid epoxy, the solder ball 210 portion of the package 200 exposed to the outside, the electrode pattern 110 portion exposed to the outside, the contact with the solder ball 210 Epoxy is applied on the periphery of the package 300 and on the periphery of the substrate 100 in contact with the electrode pattern 110 to form an epoxy part 310 (see FIG. 1).
  • the liquid epoxy is not only on the electrode pattern 110 positioned on the substrate 110 and the solder ball 210 positioned on the bottom of the package 200 but also a gap between the solder ball 200 and the electrode pattern 110 which are in contact with each other. Penetrate in and apply.
  • the epoxy is a thermosetting epoxy, it is cured when the heat treatment process is completed to complete the package module (see FIG. 1).
  • the epoxy portion 310 is applied to the outer circumferential surface of the bonding portion 300 exposed to the outside by the epoxy contained in the electrode pattern 110, the upper surface of the package 200 and the electrode pattern 110 is formed
  • the epoxy part 310 is not positioned on the portion where the electrode pattern 110 is not located on the surface of the substrate 100.
  • the junction 300 formed by the electrode pattern 110 and the solder ball 210, which are in contact with each other, is coated on the insulating epoxy portion 310, the junction 300 is protected from foreign substances such as dust or moisture. .
  • the bonding portion that is, the bonding portion of the substrate 110 and the electrode pattern 110, the bonding portion of the package 200 and the solder ball 210, and the bonding portion of the solder ball 210 and the electrode pattern 110 Since the epoxy part 310 is coated, the bonding part is prevented from falling off. Rather, due to curing of the epoxy, the package 200 is firmly fixed on the substrate 100 so that the package 200 falls from the substrate 100. The phenomenon is prevented.
  • a whisker phenomenon may electrically connect the adjacent solder balls 210 of the package 200 to cause a short circuit, noise, and an electrical short circuit.
  • the bonding part 300 is applied to the epoxy part 310 which is an insulating film, the whisker phenomenon is prevented.
  • the electrode composition 110 contains iron (Fe), which is a shielding component of electromagnetic waves (EMI), the iron component is included in the epoxy part 310. Therefore, the effect of preventing the electromagnetic waves generated from the junction 300 occurs.
  • Fe iron
  • EMI electromagnetic waves
  • the coating operation of the epoxy during the heat treatment for connecting the electrode pattern 110 and the package 200, that is, the process of forming the epoxy portion 310 occurs at the same time do.
  • the substrate 100 is a flexible printed circuit board
  • an epoxy coating process is performed on the flexible printed circuit board through a separate additional process, the gap between the flexible printed circuit board and the terminal of the package is narrow so that electrodes are normally applied. The problem does not occur.
  • the epoxy contained in the electrode pattern 110 is moved to the outside of the electrode pattern 110 by heat treatment, as well as the electrode pattern 110 as well as the solder ball 210 located thereon,
  • movement of the electrode pattern and terminal by an epoxy is made more accurate and reliable.
  • FIG. 3 to 5 are other examples when the package 200 is in the form of a BAG as shown in FIG. 1, and FIG. 6 is a lead frame for surface mounting in which the package 200 has a lead wire as a terminal. This is an example of a package for).
  • the epoxy part 310 may have each bonding part exposed to the outside ( It is an example of the case where not only 300 but also two adjacent junctions 300 are filled with the epoxy part 310.
  • Epoxy surrounds each junction 310 only, and each junction 310 is compared to FIG. 1 in which each epoxy section 310 is formed, an application area of the epoxy section 310 is increased, so as to the epoxy section 310. Due to the electrical insulation properties are further improved, the bonding strength of the bonding portion 300 and the bonding force between the substrate 100 and the package 200 are further improved.
  • the epoxy part 310 enclosing each of the junction parts 300 surrounds only a part of all of the junction parts 300 exposed to the outside.
  • the epoxy part 310 surrounding two adjacent bonding parts 300 surrounds only a part of all of the bonding parts 300 exposed to the outside.
  • the epoxy part 310 of FIGS. 4 and 5 surrounds the joint portion where the electrode pattern and the solder ball are in contact with each other.
  • the package module illustrated in FIGS. 3 to 4 is implemented by changing the content of epoxy contained in the electrode pattern, and is manufactured in the same manner as the manufacturing method described with reference to FIGS. 2A and 2B, and thus a detailed description thereof is omitted. do.
  • FIG. 5 is a cross-sectional view of a portion of a package module when a package 200 having lead wires is mounted on a substrate 100 according to an embodiment of the present invention.
  • the epoxy part 310 is not positioned on the upper surface of the package 200 and on the portion where the electrode pattern is not located on the surface of the substrate 100 on which the electrode pattern is located.
  • the amount of epoxy contained in the electrode pattern is adjusted to only the desired portion.
  • the epoxy part 310 may be formed.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

La présente invention concerne un module de conditionnement, le module de conditionnement selon un mode de réalisation comprenant : un substrat ; un conditionnement positionné sur le substrat ; une ou plusieurs partie(s) connectrice(s) positionnée(s) entre le substrat et le conditionnement et comprenant une substance conductrice ; et une partie en époxy recouvrant une ou plusieurs partie(s) connectrice(s), à l'exception de la surface supérieure du conditionnement. Ainsi, puisque les parties connectrices sont recouvertes des parties en époxy, cela empêche les parties connectrices de se détacher, améliorant ainsi la propriété conductrice, et puisque la partie supérieure du conditionnement n'a pas de partie en époxy, la dissipation de chaleur générée par le mouvement du conditionnement est plus efficace, évitant ainsi la génération de bruit et la dégradation due à la chaleur.
PCT/KR2012/007651 2012-09-21 2012-09-24 Module de conditionnement et son procédé de fabrication WO2014046323A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0105223 2012-09-21
KR20120105223A KR20140038735A (ko) 2012-09-21 2012-09-21 패키지 모듈 및 그 제조 방법

Publications (1)

Publication Number Publication Date
WO2014046323A1 true WO2014046323A1 (fr) 2014-03-27

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PCT/KR2012/007651 WO2014046323A1 (fr) 2012-09-21 2012-09-24 Module de conditionnement et son procédé de fabrication

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KR (1) KR20140038735A (fr)
WO (1) WO2014046323A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102101346B1 (ko) * 2018-11-19 2020-05-27 (주)호전에이블 Led 플립칩 어레이 및 그 결합방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002373967A (ja) * 2001-06-14 2002-12-26 Sharp Corp 半導体装置およびその製造方法
JP2003211289A (ja) * 2002-01-21 2003-07-29 Fujitsu Ltd 導電性接合材料、それを用いた接合方法及び電子機器
JP2004047775A (ja) * 2002-07-12 2004-02-12 Matsushita Electric Ind Co Ltd 光部品の実装方法および実装構造
KR20070049168A (ko) * 2004-08-25 2007-05-10 마츠시타 덴끼 산교 가부시키가이샤 땜납 조성물, 납땜 접합 방법, 및 납땜 접합 구조
US7776735B2 (en) * 2004-08-30 2010-08-17 Renesas Technology Corp. Semiconductor device and process for manufacturing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002373967A (ja) * 2001-06-14 2002-12-26 Sharp Corp 半導体装置およびその製造方法
JP2003211289A (ja) * 2002-01-21 2003-07-29 Fujitsu Ltd 導電性接合材料、それを用いた接合方法及び電子機器
JP2004047775A (ja) * 2002-07-12 2004-02-12 Matsushita Electric Ind Co Ltd 光部品の実装方法および実装構造
KR20070049168A (ko) * 2004-08-25 2007-05-10 마츠시타 덴끼 산교 가부시키가이샤 땜납 조성물, 납땜 접합 방법, 및 납땜 접합 구조
US7776735B2 (en) * 2004-08-30 2010-08-17 Renesas Technology Corp. Semiconductor device and process for manufacturing the same

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Publication number Publication date
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