WO2014046323A1

WO2014046323A1 - Package module and manufacturing method thereof

Info

Publication number: WO2014046323A1
Application number: PCT/KR2012/007651
Authority: WO
Inventors: 문종태
Original assignee: (주)호전에이블
Priority date: 2012-09-21
Filing date: 2012-09-24
Publication date: 2014-03-27
Also published as: KR20140038735A

Abstract

The present invention relates to a package module, the package module according to one embodiment comprising: a substrate; a package positioned on the substrate; one or more connecting parts positioned in between the substrate and the package, and comprising a conductive substance; and an epoxy part coating one or more connecting parts, excluding the upper surface of the package. Thus, as the connecting parts are coated by the epoxy parts, the connecting parts are prevented from coming off, thereby improving the conductive property, and as the upper part of the package does not have an epoxy part, dissipation of heat generated from the movement of the package is more efficient, thereby preventing noise generation and degradation due to the heat .

Description

Package module and its manufacturing method

The present invention relates to a package module and a manufacturing method thereof.

A package module is a package mounted on a substrate, which is manufactured by mounting a desired package on a printed circuit board using surface mounting technology (SMT).

A general surface mount technique is as follows.

First, a cream paste is printed on a printed circuit board to form an electrode pattern, and then a desired package is placed on a corresponding portion of the printed circuit board on which the electrode pattern is formed.

Then, heat is applied to the printed circuit board on which the desired package is located to melt the electrode pattern formed of solder paste to connect the terminal of the package and the printed electrode pattern on the printed circuit board.

As such, the electrode pattern formed of the solder paste is heat-treated and cured to connect the electrode pattern and the package.

However, after the desired package is mounted on the printed circuit board through the surface mounting process separately from the surface mounting process, the mounted component is protected from foreign matter such as moisture or dust, or the mounted component is prevented from falling off the printed circuit board. To this end, the liquid epoxy is applied to the surface around the mounted component and then cured.

In particular, when the printed circuit board is a flexible printed circuit board, a problem arises in that the mounted component falls because the thickness of the flexible printed circuit board is thinner than a general printed circuit board and bent during use. In particular, a large number of component detachment occurs at the portion where the bending occurs badly.

Therefore, after performing a surface mounting process on a flexible printed circuit board, a liquid epoxy is apply | coated to the surface of the flexible printed circuit board on which the component was mounted, and it hardens.

As such, since the coating process of the epoxy is made through a separate process, a lot of time and costs arise.

In addition, the gap between the printed circuit board and the component including the flexible printed circuit board is narrow, the problem of the epoxy coating operation is not performed smoothly, there is a problem such as damage or disconnection of the component due to foreign matter.

Therefore, the technical problem to be achieved by the present invention is to reduce the time and cost of manufacturing a package module.

Another object of the present invention is to reduce the contact failure rate of the components mounted on the substrate in the package module.

According to one aspect of the present invention, a package module includes a substrate, a package disposed on the substrate, at least one junction portion formed between the substrate and the package and made of a conductive material, and the at least one junction portion other than an upper surface of the package. It is apply | coated and includes an epoxy part.

The epoxy part may apply to the entire outer circumferential surface of the at least one bonding part that is exposed.

The epoxy part may apply a portion of an outer circumferential surface of the at least one junction part that is exposed.

The at least one junction may include two adjacent junctions, and the epoxy portion may be located between the two adjacent junctions.

The substrate may be a flexible printed circuit board.

According to another aspect of the present invention, a method of manufacturing a package module includes printing an electrode composition on a substrate to form an electrode pattern, placing a package having a terminal on the electrode pattern, and heat treating the substrate on which the package is located. By connecting the electrode pattern and the terminal to form a bonding portion, and forming an epoxy portion for applying the bonding portion, the electrode composition preferably comprises a metal powder and epoxy.

The electrode composition may contain 10wt% to 90wt% metal powder and 90wt% to 10wt% epoxy.

The substrate may be a flexible printed circuit board.

According to this feature, since the bonding portion is applied by the epoxy portion, the problem of falling of the bonding portion is prevented, and the electrical characteristics are improved.

In addition, since the epoxy portion is not positioned on the package, heat dissipation operation generated in the package during the package operation is performed more efficiently, thereby preventing noise or degradation due to heat.

Furthermore, since an epoxy portion for applying the bonding portion is formed during the process of bonding the electrode pattern positioned on the substrate and the terminal positioned in the package to form the bonding portion, a separate additional process for forming the epoxy portion is unnecessary. This reduces the time and cost of manufacturing a package module.

In addition, since the epoxy contained in the electrode pattern moves out of the electrode pattern by heat treatment to apply not only the electrode pattern but also the terminal portion of the package located thereon, the application pattern of the electrode pattern and the terminal by epoxy is more accurate and reliable. It is done.

1 is a cross-sectional view of a package module according to an embodiment of the present invention.

2A and 2B illustrate a method of manufacturing a package module according to an embodiment of the present invention.

3 to 6 are cross-sectional views of various examples of package modules according to an embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. When a portion of a layer, film, region, plate, etc. is said to be "on top" of another part, this includes not only when the other part is "right over" but also when there is another part in the middle. On the contrary, when a part is "just above" another part, there is no other part in the middle.

Next, a package module and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the accompanying drawings.

First, referring to FIG. 1, a package module according to an embodiment of the present invention will be described.

As shown in FIG. 1, a package module according to an embodiment of the present invention may include a substrate 100, a package 200 positioned on the substrate 100, and a junction 300 located between the substrate 100 and the package 200. And an epoxy portion 310 that applies the surface of the bonding portion 300 positioned between the substrate 100 and the package 200.

In this example, the substrate 100 is a flexible printed circuit board made of polyimide, polyethylene terephthalate (PET), fiber material, or the like, but is not limited thereto, and may be a rigid printed circuit board (rigid PCB).

The package 200 may be a driving chip, a central process unit (CPU) chip, or the like used in a display device.

Since the junction 300 is a portion in which an electrode pattern positioned on the substrate 100 and a terminal (eg, solder ball) attached to the package 200 are bonded to each other, the junction 300 is a conductive material such as a metal. Consists of

Due to the junction 300, the electrode pattern of the substrate 100 and the corresponding terminals of the package 200 are physically and electrically connected to each other.

The junction 300 may contain tin (Sn) -bismuth (Bi) -silver (Ag) or may contain silver (Ag) -copper (Cu).

The epoxy part 310 is made of an epoxy resin which is an insulating material.

As shown in FIG. 1, the epoxy part 310 may have a portion other than the upper surface of the package 200, that is, the surface opposite to the surface on which the solder ball 110 is located, that is, a junction portion exposed to the outside. The outer circumferential surface of the 300 is wrapped and is positioned on the periphery of the package 300 in contact with the junction 300 and on the periphery of the substrate 100 in contact with the junction 300. However, the epoxy part 310 is not positioned on the top surface of the package 200 and on the portion where the electrode pattern is not located on the surface of the substrate 100 where the electrode pattern is located.

As such, since the insulating epoxy part 310 is positioned around the junction part 300 and coats the junction part 300, the junction part, that is, the package 200 and the junction part between the substrate 100 and the junction part 300. Since the bonding state between the 300 and the electrode pattern located on the substrate 100 and the terminal located on the package 200 is protected by the epoxy part 310, the problem of falling of these bonding parts is prevented.

In addition, in the present embodiment, the epoxy part 310 is not positioned on the package 200. Therefore, as compared with the case of the comparative example in which the epoxy portion is also located on the package, the heat dissipation effect of the heat emitted from the package 200 is improved by the operation of the package 200, thereby preventing noise or deterioration due to heat.

Next, a method of manufacturing a package module according to an embodiment of the present invention will be described with reference to FIGS. 2A and 2B as well as FIG. 1.

First, as shown in FIG. 2A, an electrode composition 110 having a desired shape is formed on the substrate 100 by printing a composition for an electrode directly on the substrate 100.

In this example, the substrate 100 is a flexible printed circuit board made of polyimide, polyethylene terephthalate (PET) or a fiber material, but is not limited thereto, and may be a rigid printed circuit board.

The composition for electrodes contains a metal powder and liquid epoxy containing at least one metal, such as copper, silver, gold, etc., and may further contain iron (Fe).

The electrode composition may contain 10 wt% to 90 wt% metal powder and 90 wt% to 10 wt% epoxy.

At this time, the metal powder may have a melting point of about 90 ℃ to 350 ℃ depending on the heat resistance of the printed circuit board.

The electrode pattern may use screen printing or direct printing.

When the electrode pattern is formed by screen printing, the electrode pattern 110 may be formed by applying a metal paste containing a metal powder and a liquid epoxy. In this case, a separate heat treatment process for drying the coated electrode pattern 110 is omitted.

Next, as shown in FIG. 2B, the package 200, which is a component to be mounted on the electrode pattern 110 of the substrate 100, is mounted on the electrode pattern 110 positioned on the substrate 100 (S20). In this case, as shown in FIG. 2B, since the package 200 has a ball grid array (BGA) shape, the package 200 has solder balls 210, which are terminals in contact with the electrode pattern 110.

The plurality of solder balls 210 attached to the bottom of the package 200 are positioned to contact the electrode pattern 110 on the electrode pattern 110 positioned on the corresponding substrate 100.

In this case, the package 200 may be positioned on the desired electrode pattern 110 using a flip chip process or a pick and place process.

Next, the electrode pattern 110 positioned on the substrate 100 and the solder balls 210 of the package 200 are physically and electrically connected to fix the package 200 positioned on the substrate 100 on the substrate 100. In order to do this, the substrate 100 is heat treated using an oven (not shown) or the like.

At this time, the heat treatment temperature is preferably above the melting point of the metal powder contained in the electrode pattern (110).

Therefore, the heat treatment temperature and the heat treatment time vary depending on the type of the metal powder forming the electrode pattern 110.

For example, when the metal powder contained in the electrode pattern 110 is made of tin (Sn) -bismuth (Bi) -silver (Ag), the heat treatment temperature may be 120 ° C to 180 ° C and the heat treatment time may be 1 minute to 3 minutes. In addition, when the metal powder contained in the electrode pattern 110 is made of silver (Ag) -copper (Cu), the heat treatment temperature may be 200 ° C. to 270 ° C., and the heat treatment time may be 1 minute to 3 minutes.

By the heat treatment process, the metal contained in the electrode pattern 110 is melted, and the electrode pattern 110 and the solder balls 210 of the package 200 disposed thereon are electrically and physically connected to the electrode pattern 110 and the solder. A junction 300 to which the ball 210 is connected is formed between the substrate 100 and the package 200 (see FIG. 1).

The package 200 is fixed on the electrode pattern 110 of the substrate 100 by the electrode unit 300.

During the heat treatment process, the epoxy having a lower melting point than the metal contained in the electrode pattern 110 is also melted.

Therefore, the electrode pattern 110 is coated with a liquid epoxy, the solder ball 210 portion of the package 200 exposed to the outside, the electrode pattern 110 portion exposed to the outside, the contact with the solder ball 210 Epoxy is applied on the periphery of the package 300 and on the periphery of the substrate 100 in contact with the electrode pattern 110 to form an epoxy part 310 (see FIG. 1).

At this time, the liquid epoxy is not only on the electrode pattern 110 positioned on the substrate 110 and the solder ball 210 positioned on the bottom of the package 200 but also a gap between the solder ball 200 and the electrode pattern 110 which are in contact with each other. Penetrate in and apply.

In this embodiment, since the epoxy is a thermosetting epoxy, it is cured when the heat treatment process is completed to complete the package module (see FIG. 1).

At this time, since the epoxy portion 310 is applied to the outer circumferential surface of the bonding portion 300 exposed to the outside by the epoxy contained in the electrode pattern 110, the upper surface of the package 200 and the electrode pattern 110 is formed The epoxy part 310 is not positioned on the portion where the electrode pattern 110 is not located on the surface of the substrate 100.

As such, since the junction 300 formed by the electrode pattern 110 and the solder ball 210, which are in contact with each other, is coated on the insulating epoxy portion 310, the junction 300 is protected from foreign substances such as dust or moisture. .

In addition, the bonding portion, that is, the bonding portion of the substrate 110 and the electrode pattern 110, the bonding portion of the package 200 and the solder ball 210, and the bonding portion of the solder ball 210 and the electrode pattern 110 Since the epoxy part 310 is coated, the bonding part is prevented from falling off. Rather, due to curing of the epoxy, the package 200 is firmly fixed on the substrate 100 so that the package 200 falls from the substrate 100. The phenomenon is prevented.

In addition, when tin (Sn) is contained in the metal powder, a whisker phenomenon may electrically connect the adjacent solder balls 210 of the package 200 to cause a short circuit, noise, and an electrical short circuit. . However, in the present example, since the bonding part 300 is applied to the epoxy part 310 which is an insulating film, the whisker phenomenon is prevented.

In particular, when the electrode composition 110 contains iron (Fe), which is a shielding component of electromagnetic waves (EMI), the iron component is included in the epoxy part 310. Therefore, the effect of preventing the electromagnetic waves generated from the junction 300 occurs.

In addition, since the epoxy is contained in the composition for the electrode forming the electrode pattern, the coating operation of the epoxy during the heat treatment for connecting the electrode pattern 110 and the package 200, that is, the process of forming the epoxy portion 310 occurs at the same time do.

For this reason, since a separate epoxy coating process is not necessary after the package module process of mounting the package 200 on the substrate 100 is completed, the time for manufacturing the package module is reduced.

When the substrate 100 is a flexible printed circuit board, when an epoxy coating process is performed on the flexible printed circuit board through a separate additional process, the gap between the flexible printed circuit board and the terminal of the package is narrow so that electrodes are normally applied. The problem does not occur.

However, in the present embodiment, since the epoxy contained in the electrode pattern 110 is moved to the outside of the electrode pattern 110 by heat treatment, as well as the electrode pattern 110 as well as the solder ball 210 located thereon, The application | coating operation | movement of the electrode pattern and terminal by an epoxy is made more accurate and reliable.

Next, various examples of a package module according to an embodiment of the present invention will be described with reference to FIGS. 3 to 6.

3 to 5 are other examples when the package 200 is in the form of a BAG as shown in FIG. 1, and FIG. 6 is a lead frame for surface mounting in which the package 200 has a lead wire as a terminal. This is an example of a package for).

In the case of FIG. 3, when each solder ball of the package 200 is bonded to each other on each electrode pattern to form a respective bonding part 300, unlike FIG. 1, the epoxy part 310 may have each bonding part exposed to the outside ( It is an example of the case where not only 300 but also two adjacent junctions 300 are filled with the epoxy part 310.

Epoxy surrounds each junction 310 only, and each junction 310 is compared to FIG. 1 in which each epoxy section 310 is formed, an application area of the epoxy section 310 is increased, so as to the epoxy section 310. Due to the electrical insulation properties are further improved, the bonding strength of the bonding portion 300 and the bonding force between the substrate 100 and the package 200 are further improved.

In the case of FIG. 4, when compared with FIG. 1, the epoxy part 310 enclosing each of the junction parts 300 surrounds only a part of all of the junction parts 300 exposed to the outside. In addition, in the case of FIG. 5, In comparison with FIG. 3, the epoxy part 310 surrounding two adjacent bonding parts 300 surrounds only a part of all of the bonding parts 300 exposed to the outside.

In this case, the epoxy part 310 of FIGS. 4 and 5 surrounds the joint portion where the electrode pattern and the solder ball are in contact with each other.

In this case, since the content of the epoxy contained in the electrode pattern is reduced, the manufacturing cost of the package module is reduced.

The package module illustrated in FIGS. 3 to 4 is implemented by changing the content of epoxy contained in the electrode pattern, and is manufactured in the same manner as the manufacturing method described with reference to FIGS. 2A and 2B, and thus a detailed description thereof is omitted. do.

FIG. 5 is a cross-sectional view of a portion of a package module when a package 200 having lead wires is mounted on a substrate 100 according to an embodiment of the present invention.

As shown in FIG. 5, the peripheral portion of the package 100 that surrounds the junction 300 exposed to the outside and is in contact with the junction 300 and the contact portion 300 is in contact with the junction 300. Although located above, the epoxy part 310 is not positioned on the upper surface of the package 200 and on the portion where the electrode pattern is not located on the surface of the substrate 100 on which the electrode pattern is located.

In addition to the case shown in FIG. 5, when the package 200 having the lead wire is mounted on the substrate 100, as in the case of FIGS. 3 to 5, the amount of epoxy contained in the electrode pattern is adjusted to only the desired portion. The epoxy part 310 may be formed.

Since the method of mounting the package 200 having the lead wires on the substrate 100 is also the same as described with reference to FIGS. 2A and 2B, description thereof will be omitted.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

Claims

Board,

A package located on the substrate,

At least one junction between the substrate and the package and made of a conductive material, and

The epoxy portion is coated with the at least one junction other than the top surface of the package.

Package module comprising a.
In claim 1,

And said epoxy portion covers the entirety of said at least one bonding portion exposed.
In claim 1,

And the epoxy portion is applied to a portion of the at least one bonding portion that is exposed.
In claim 1,

The at least one junction comprises two adjacent junctions,

And the epoxy portion is located between the two adjacent junctions.
In claim 1,

And the substrate is a flexible printed circuit board.
Printing an electrode composition on a substrate to form an electrode pattern,

Positioning a package having a terminal on the electrode pattern;

Heat treating the substrate on which the package is located, connecting the electrode pattern and the terminal to form a junction part, and forming an epoxy part to apply the junction part, and

The electrode composition contains a metal powder and an epoxy

Package module manufacturing method.
In claim 6,

The electrode composition is a package module manufacturing method containing 10wt% to 90wt% metal powder and 90wt% to 10wt% epoxy.
In claim 6,

And the substrate is a flexible printed circuit board.