WO2014038839A1

WO2014038839A1 - Method for manufacturing highly functional thin film material made of two kinds of materials

Info

Publication number: WO2014038839A1
Application number: PCT/KR2013/007960
Authority: WO
Inventors: 주학식
Original assignee: Joo Hak-Sik
Priority date: 2012-09-05
Filing date: 2013-09-04
Publication date: 2014-03-13
Also published as: KR101280681B1

Abstract

The present invention discloses a method for manufacturing a highly functional thin film material made of two kinds of materials. The present invention provides a method for manufacturing a highly functional thin film material made of two kinds of materials which can increase the degree of freedom of application thereof to electronic devices of various forms by adjusting the density and thickness of a sintered body, which is sintered in a certain shape by means of pressurization in a constant temperature environment in order to increase the durability and elasticity of the sintered body, thereby enabling the reduction of breakage and damage of a synthetic resin sintered body.

Description

Manufacturing method of high functional thin film material of different materials

The present invention relates to a high-functional thin film material made of a heterogeneous material and a method for manufacturing the same, and more particularly, by forming a metal into a porous thin film form and then combining a synthetic resin having antimicrobial properties so that it can be applied to various electronic devices. The present invention relates to a method for manufacturing a heterogeneous high-functional thin film material that can enhance the product value of a product due to electromagnetic wave absorption and antibacterial action.

Recently, with the rapid increase of various high-tech electronic devices such as high-performance portable wireless information terminals and home appliances that are operated in conjunction with wired and wireless communication networks, the trend of high integration of electronic devices used in these devices and widening frequency of electromagnetic waves There is an increasing trend of sources of.

On the other hand, Electromagnetic Waves is an abbreviation of Electromagnetic Waves and refers to a phenomenon in which an electromagnetic field whose intensity changes periodically is propagated through space. It is used in various fields and applications such as devices and communication devices. The effects of electromagnetic waves on the human body are symptoms of VDT syndrome, which refers to symptoms such as headaches and visual impairments caused by heat generated by microwaves used in microwave ovens and mobile phones, and harmful electromagnetic waves emitted from computers and monitors. It can be seen through various symptoms identified by electromagnetic waves such as DisplayTerminal Syndrome. In addition, a number of studies have been reported, such as increased cancer incidence of residents near power transmission lines and brain tumors of long-term users of mobile phones.

In particular, due to the development of mobile communication technology and the popularization of personal mobile communication, the user is unprotected and exposed to high frequency electromagnetic waves generated from mobile communication devices such as mobile phones, and the temperature of the skull area increases during the use of such mobile communication devices. Research and questioning about the possibility of harmful effects on the human body continues.

These electromagnetic waves may disturb other electromagnetic waves due to electromagnetic interference (EMI), as well as harmful to the human body, and may cause device failures for the electrical and electronic devices themselves. As is miniaturized and integrated, it can be said that the possibility of failure and malfunction due to self-generated electromagnetic waves as well as external electromagnetic waves exist.

In order to block the influence of the device by electromagnetic waves, a conductive metal plate (also called shield can) is attached to a case or main circuit of an electrical / electronic device to form an electromagnetic shielding means in the form of a metal plate, or EMI (ElectroMagnetic Interference) A method of shielding undesired electromagnetic waves is generally used by applying shielding paint or by vacuum plating or sputtering.

However, in the case of a portable wireless information terminal such as a mobile phone or a smart phone, since the display is disposed, shielding of the remaining parts except for the display panel may be possible, but shielded electromagnetic waves are radiated through the display panel. . That is, in the case of coating a general metal structure or shielding material other than the porous structure, shielding is possible by reflecting electromagnetic waves, but the reflected electromagnetic waves are emitted through the display panel in which the user is in contact with the body.

On the other hand, as a technique for efficiently absorbing and extinguishing electromagnetic waves, a sintered compact molded to have porosity by sintering metal powder is used. That is, as is known, the sintered body absorbs moisture by capillary action and gradually evaporates, but also absorbs and extinguishes electromagnetic waves in addition to absorbing and reducing noise and external shock.

The porous metal sintered body is a preliminary sintered body by pressing a metal powder having an average particle size of 100 ㎛ or more at room temperature under a pressure of 100 to 600 MPa, and at this time, 120 minutes or less at a temperature in the range of 900 to 1400 ° C. to have a porosity of 10 to 20%. By sintering during

However, the conventional porous metal sintered body has a disadvantage in that it is difficult to manufacture a product with a beautiful surface due to the metal powder having a large particle size as the raw material is sintered using a metal powder having an average particle size of 100 μm or more, and is easily broken even in a light impact. In particular, since the thickness cannot be made less than 10mm, it is difficult to apply to small electronic devices such as mobile phones or smart phones, and thus there is a problem of low marketability and marketability.

The present invention was created in order to solve the problems of the prior art as described above, an object of the present invention to increase the versatility of application to a variety of products using a heterogeneous composite material, and to secure the freedom and mass production of molding To provide a heterogeneous high-functional thin film material and a method of manufacturing the same.

In particular, the present invention enables the molding of a mixture of a metal and a synthetic resin into a porous thin film having elasticity and durability, thereby enabling application to various electronic devices, and consequently to increase the product value of the applied product. To provide a heterogeneous high-functional thin film material and a method of manufacturing the same.

In addition, the present invention is to provide a high-functional thin film material of different materials and a method of manufacturing the same by adding an antimicrobial additive having antimicrobial properties to the synthetic resin so that the finished thin film material has antimicrobial properties and can increase the product value of the applied product.

In order to achieve the above object, a heterogeneous high-functional thin film material and a method of manufacturing the same according to an exemplary embodiment of the present invention include a filling step of filling a metal powder in a mold; A primary sintered compact forming step of forming the porous sintered compact by heating the metal powder to 10 to 30% or less of the melting point; Forming a secondary sintered compact to pressurize the primary sintered compact to have a density of 10 to 98% and a thickness of 0.001 mm to 2 mm; It characterized in that it comprises a tertiary sintered body forming step of applying and curing the synthetic resin to the thickness of 0.001mm ~ 1mm on the surface of the secondary sintered body.

As a preferable feature of the present invention, the metal powder is a copper-based, tin-based, zinc-based, aluminum-based, stainless-based metal powder having a melting temperature of 300 ℃ ~ 1800 ℃, the particle size of the metal powder is 20㎛ ~ 200 It has a size of μm, wherein the synthetic resin is a composition comprising any one or more of PVC, PC, urethane, silicone, ABS, UV.

In another preferred embodiment of the present invention, in the tertiary sintered compact forming step, the synthetic resin includes an antimicrobial additive made of a composition comprising one or both of silver nano solution or phytoncide solution.

In another preferred embodiment of the present invention, in the primary sintered compact forming step, the metal powder is molded by sintering from 10 minutes to 300 minutes under conditions of a temperature of 10 to 30% lower than the melting temperature.

In another preferred embodiment of the present invention, in the secondary sintered compact forming step, the first sintered compact is subjected to roller pressurization using a press or roller 1 to 20 times at a pressure of 30 MPa to 300 MPa.

In another preferred embodiment of the present invention, in the tertiary sintered compact forming step, a liquid synthetic resin is sprayed on the surface of the secondary sintered compact, or a film is formed by silk printing, or to the surface of the secondary sintered compact. Plastic injection molding or heating the synthetic resin sheet material at a temperature of 60 ° C to 200 ° C on the outer surface of the secondary sintered body;

In another preferred embodiment of the present invention, in the tertiary sintering molding step, the curing of the synthetic resin is made by any one of natural drying, heat curing and UV curing method, the tertiary sintered body cured synthetic resin is polished surface It further comprises any one of a polishing step or a marking molding step for printing or stamping the surface.

The high functional thin film material of the dissimilar material according to the preferred embodiment of the present invention is the secondary sintered body is 0.01mm ~ 2mm, the layer thickness of the synthetic resin applied to the secondary sintered body is formed in the range of 0.01mm ~ 2mm It features.

The heterogeneous high-functional thin film material according to the present invention and a method for manufacturing the same can increase the durability and elasticity of the sintered body by pressing the sintered body sintered to a predetermined shape and adjusting the desired density and thickness, resulting in breakage of the sintered body. And not only can reduce the damage, but also increase the degree of freedom of application for electronic devices having various forms, it is expected that a useful effect to increase the customer satisfaction and product value for the target electronic device to which it is applied.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings, and the terms or words used in the present specification and claims should not be interpreted in a conventional and dictionary sense, and the inventors themselves In order to explain the invention in the best way, the concept of terms should be interpreted as meanings and concepts corresponding to the technical idea of the present invention on the basis of the principle that can be properly defined.

1 is a block diagram illustrating a method for manufacturing a heterogeneous high-functional thin film material according to the present invention;

2 is a cross-sectional view for explaining the configuration of a highly functional thin film material of different materials according to the present invention;

3 and 4 are photographs taken of the mass production prototype of the high-functional thin film material of different materials according to the present invention,

5 is a view for explaining the porous structure of a heterogeneous high-functional thin film material according to the present invention,

Figure 6 is a photograph showing a magnified 150 times the surface of the high-functional thin film material of different materials according to the present invention,

Figure 7 is a photograph showing a magnified 1000 times the surface of the high-functional thin film material of different materials according to the present invention,

8 and 9 are antimicrobial activity test data by the antimicrobial additives added during the production of high-performance thin film material of different materials according to the present invention.

[Description of Symbols for Major Parts of Drawing]

10: metal plate 20,30: protective layer

Hereinafter, with reference to the accompanying drawings, a highly functional thin film material of different materials and a method of manufacturing the same according to the present invention will be described. First, it should be noted that like elements or parts in the drawings are denoted by the same reference numerals as much as possible. In the following description of the present invention, detailed descriptions of well-known functions or configurations will be omitted in order not to obscure the subject matter of the present invention.

1 is a block diagram illustrating the present invention, FIG. 2 is a cross-sectional view illustrating the structure of the present invention, and FIGS. 3 and 4 are photographs of a mass production prototype according to the present invention. And, Figure 5 is a view for explaining the porous structure of the present invention, Figure 5 is a photograph taken at 150 times the surface of the prototype produced by the present invention, Figure 7 is a photograph taken at 1000 times magnification. .

Referring to the drawings, a method for manufacturing a heterogeneous high-functional thin film material according to the present invention and a thin film material produced by the same will be described below.

The method for producing a heterogeneous high-functional thin film material according to the present invention includes a filling step (s10) of filling a metal powder in a molding space that is an inside of a mold, and heating the metal powder filled in the mold below a melting temperature to increase porosity. Primary sintered compact forming step (s20) for molding the primary sintered body sintered body, and secondary sintered compact molding step (s30) for press molding the primary sintered compact to have a density of 10 ~ 98% and a thickness of 0.001mm ~ 2mm The third sintered compact forming step (s40) of applying a synthetic resin to the surface of the secondary sintered compact, but applying a thickness of 0.001mm ~ 1mm (s40) and, if necessary, the surface for the tertiary sintered compact or printed or stamped on the surface The polishing and marking forming step (s50) is performed.

Metal powder Filling stage ( s10 );

The mold is provided with a molding space for forming a thin film material of a flat plate, and is provided as a thermal mold with little thermal deformation to enable sintering of the metal powder filled in the molding space, and the mold for such sintering molding is a known technique. It may be carried out by, so detailed description thereof will be omitted.

On the other hand, the metal powder used in the present invention, that is, the sintered sample filled in the molding space of the mold is a copper-based, tin-based, zinc-based, aluminum-based, stainless-based metal powder having a melting temperature of 300 ℃ ~ 1800 ℃ It is proposed to be used, and in addition, silver (Ag) or silver alloy may be used.

In addition, the particle size of the metal powder, that is, the particle size of the metal powder is proposed to have a size of 20㎛ ~ 200㎛. This is because when the particle size of the metal powder is less than 20㎛, the pores do not form properly after sintering and the structure becomes dense, and when the particle size is 200㎛ or more, the sintered density is easily broken or deformed after sintering. There was this. The metal powder is filled in a suitable amount so as not to overflow the molding space of the mold, thereby forming a primary sintered body by heating the metal powder to a temperature such that the metal powder does not melt completely.

Primary sintering Molding step ( s20 );

The present invention proposes sintering molding by heating 10 minutes to 300 minutes at a temperature of 10% to 30% lower than the melting point for each melting characteristic of the material of the metal powder as molding conditions for forming the primary sintered body.

In addition, the boundary surfaces of the metal powders should be stably fused to each other enough to form pores during sintering, and the primary sintered body made of the fused metal powders should remain bonded to a single molded body.

For example, when the copper powder is used as the metal powder proposed in the present invention, that is, the sintered sample, the copper is melted at 1084.5 ° C. Therefore, when the sintering temperature is heated at 750 ° C for 18 to 24 hours, the sintering molding density is 53. A sintered body of ˜57% can be obtained. In addition, the sintering atmosphere may be performed at room temperature or under vacuum conditions.

Second sintering Molding step ( s30 );

According to the present invention, the sintered primary sintered compact is subjected to press or roller pressurization 1 to 20 times at a pressure of 30 MPa to 300 MPa, but is pressurized to have a density of 10 to 98% and a thickness of 0.001 mm to 2 mm. The thin plate 20 is formed.

Here, as a pressurization method for the primary sintered body, various pressurization apparatuses may be used, and in the present invention, it is proposed that a rolling or rolling mill, which is a press machine or a roller pressurization method, is used, depending on the requirements of the resultant and the performance of the presser. It may be repeated 1 to 20 times.

In particular, the pressing force for the primary sintered body must be made within the range of low pressure 30MPa ~ 300MPa, which is applied to the inside and outside of the primary sintered body when the pressure is applied to the primary sintered body at a high pressure of 300MPAa or more This is because cracking occurs.

On the other hand, the secondary sintered body which is press-formed by the pressing machine or the roller press-type rolling / rolling machine is preferably pressed so that the upper and lower surfaces are flattened. As the sintered density increases during the pressing process, the bonding force between the metal powders increases. This results in increased durability and elasticity.

In addition, the secondary sintered compact forming step may be carried out at room temperature, but is preferably carried out at a temperature lower than 40% to the sintering temperature of the metal powder.

In addition, it is also possible to selectively perform sintering at a temperature lower by 10 to 30% based on the melting temperature of the primary sintered compact to increase the sintering stability.

Tertiary sintering Molding step ( s40 );

The present invention is to form a protective layer (20,30) by applying or injecting a synthetic resin on the surface of the pressure-molded secondary sintered body, the protective layer (20,30) made of such a synthetic resin is a metal foil By reinforcing the weak physical properties of the secondary sintered body provided in (10), it prevents oxidation, discoloration and corrosion, and at the same time, compensates for the permanent deformation and damage easily by external force, and increases the ease of processing and handling. . In particular, since the electromagnetic wave passes through the synthetic resin material, the synthetic resin in the present invention is preferably applied to the extent that pores exposed to the surface of the secondary sintered body can be shielded.

On the other hand, the synthetic resin in the present invention PP (Polypropylene) PVC (Poly Vinyl Chloride), PC (Polycarbonate), PE (Polyethylene), PET (Polyethylene terephthalate), urethane, silicone, epoxy, ABS (Acrylonitrile Butadiene Styrene), UV A composition in which any one or more than one resin (Ultraviolet-Resin) is formed may be used, and the thickness of the synthetic resin may be 0.001 mm to 1 mm.

On the other hand, the method for molding the tertiary sintered body in the present invention is as follows.

First, a method of forming a liquid synthetic resin by spray injection,

Secondly, a method of forming a film by silk printing;

Thirdly, insert injection molding the secondary sintered compact and injection molding onto the surface thereof;

Fourth, a method of forming a synthetic resin sheet material by heating at a temperature of 60 ℃ to 200 ℃ to the outer surface of the secondary sintered body.

After the outer surface of the secondary sintered body is wrapped with the synthetic resin by this method, curing is performed by any one of natural drying, thermal curing, and UV curing according to the type of the synthetic resin. That is, to wrap the outer surface of the secondary sintered body as a synthetic resin by the various methods described above, as a result, the secondary sintered body is prevented from being exposed to the outside, thereby the natural oxidation of the metal that is the secondary sintered body when used for a long time It is possible to prevent problems such as discoloration, discoloration, and corrosion, and to prevent the secondary sintered body from being easily damaged or damaged by external force due to the physical properties of the synthetic resin, thereby facilitating processing and handling, thereby improving workability. Can be.

On the other hand, the part to be considered first in the tertiary sintered body molding step is to maintain the antibacterial stability when the elastic and antimicrobial additives of the synthetic resin is mixed, for this purpose, the thickness of the synthetic resin in the present invention is 0.001mm ~ 1mm It is proposed to be formed within the range of. If the thickness of the synthetic resin is less than 0.001mm, the elasticity and bonding properties of the synthetic resin cannot be expected. If the thickness of the synthetic resin is 1 mm or more, the molding process is restricted and excessively thick. This is because there is a disadvantage that is limited by the application.

In addition, the synthetic resin for molding the tertiary sintered body is proposed to include an antimicrobial additive made of a composition of any one or both of the nano-nano solution or phytoncide solution, the function and composition ratio of these antimicrobial additives are as follows.

First, since silver nanoparticles have a smaller particle size, the distribution, that is, the surface area of the silver nanoparticles becomes larger when mixed with the synthetic resin, and thus, the antibacterial / bacterial activity is high. When the silver nano liquid is mixed with the synthetic resin, economical efficiency and antimicrobial properties should be considered. In the present invention, the composition ratio of the synthetic resin and the silver nano liquid is proposed to be mixed at a weight ratio of 90 to 96:10 to 4 through repeated experiments. . In this case, when the silver nano liquid is added to 3% or less with respect to the synthetic resin, the antimicrobial activity is sharply lowered, and thus the antimicrobial property is poor. When the silver nano liquid is more than 10%, the economic efficiency is inferior.

Second, phytoncide is a substance containing a phenol compound, an alkaloid component, and glycoside mainly composed of terpene, and is mainly extracted from pine (cypress) or cypress. Such phytoncide may have a lower price than the silver nano-solution described above, and thus may increase the mixing ratio. In the present invention, it is proposed that the synthetic resin and the phytoncide liquid are mixed in a weight ratio of 3 to 9: 7 to 1.

Meanwhile, as shown in FIGS. 8 and 9, the synthetic resin mixed with the antimicrobial additives has an antimicrobial function in the resin itself, and the synthetic resin having such antimicrobial properties penetrates and hardens into a myriad of pores formed on the surface of the secondary sintered body. By being easily peeled off or damaged, the antibacterial function is maintained permanently.

Polishing and Marking Formation Step ( s50 );

The tertiary sintered body produced by the tertiary sintering molding step is a process of polishing the surface or marking, that is, printing or stamping the surface.

In the case of the polishing process, a grinding tool such as a grinder may be used to smoothly process the surface of the tertiary sintered body or to roughen the surface of the tertiary sintered body so that the synthetic resin covering the surface of the secondary sintered body does not block pores. have.

In the marking process, the product information is displayed by printing or stamping on the surface of the tertiary sintered body, and may be formed of letters, patterns, and images including the product information so that the pores of the tertiary sintered body are not exposed.

On the other hand, it is also possible to reduce the thickness of the third sintered body by additional pressurization, in which the pressurization process, like the process of the secondary sintered body, suggests that a rolling or rolling press of a press or roller press type is used. Depending on the requirements of the press and the performance of the pressurizer may be repeated about 1 to 20 times.

The thin film material manufactured by the method of manufacturing a heterogeneous high functional thin film material according to the present invention configured as described above forms fine pores as shown in FIGS. 6 and 7, and absorption and disappearance of electromagnetic waves is possible. In addition, as it is possible to provide a thin film thickness, it is possible to apply to a portable wireless information terminal such as a mobile phone or a smartphone. In particular, the heterogeneous high-functional thin film material of the present invention is manufactured by the above-described process, the secondary sintered body is molded into a thickness of 0.01mm ~ 1.99mm, the protective layer of the synthetic resin applied to the secondary sintered body The thickness may be formed of 0.01mm ~ 1.99mm, the total thickness of the tertiary sintered body is proposed as a preferred embodiment to be molded to have a 0.02mm ~ 2mm. At this time, the protective layer made of synthetic resin is applied to one surface or the entire surface of the secondary sintered body, and after the coating should be formed so that the surface pores of the secondary sintered body are not exposed.

The preferred embodiment of the present invention is summarized as follows.

Metal powder is put into a mold (such as a mold or a tray) and compressed to form a primary shape. At this time, the sintering temperature is different depending on the material of the metal powder used, and in order to control the porosity of the metal, low melting point material (EX: synthetic resin-wax powder, plastic powder, metal powder-tin) It is possible to have more porosity in the case of compression sintering by mixing.

In addition, in the case of the above metal powder, it is preferable to use a metal material having a melting point temperature of the metal within the range of 300 to 1,800 degrees, and mainly compresses the metal powder of copper series metal, aluminum series, stainless alloy, etc. After sintering, the primary sintered body is molded and sintered at a temperature lower than the melting point of the metal material. In the case of the sintered primary sintered body, pores may be formed by the space occupied by the low melting point material.

Subsequently, the sintered primary sintered body is pressed until the desired thickness is adjusted to adjust the thickness to form the secondary sintered body. In the method of pressurizing, there are a variety of methods such as known press pressurization, roller pressurization, etc. The thinner the target material to be implemented may not be a single pressurization and may be pressurized several times. Such secondary sintered body is preferably pressed to a thickness within 0.001 ~ 1mm.

Subsequently, a synthetic resin layer is formed on the surface of the finished secondary sintered body. At this time, the synthetic resin completes the tertiary sintered body by completely wrapping the metal derived from the outside using various heterogeneous materials such as pvc, pc (polycarbonate), urethane, silicone, abs, and uv liquid. At this time, the thickness of the synthetic resin applied to surround the outside is preferably not more than 2mm in total thickness based on the finished product, the thickness of the secondary sintered body and the thickness of the synthetic resin is basically appropriate according to the purpose of the product to be applied It can be adjusted.

On the other hand, the method of forming the synthetic resin layer for forming the tertiary sintered body can be largely carried out by spray injection method, silk printing method, plastic injection method, synthetic resin sheet attachment method. Here, in the case of the synthetic resin sheet attachment method can be carried out by a method of attaching using a size adhesive and a method of attaching by heat fusion by heating to a temperature of 60 ~ 200 ℃, this attachment method can be easily carried out by known techniques. The detailed description is omitted since it can be.

On the other hand, the present invention is not limited to the described embodiments, it is possible to use and change the application site, it is common in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. It is self-evident to those who have knowledge. Therefore, such modifications or variations will have to belong to the claims of the present invention.

Claims

Filling step of filling a metal powder having a particle size of 20 μm to 200 μm as a metal powder of copper series, tin series, zinc series, aluminum series, and stainless series having a melting temperature of 300 ° C. to 1800 ° C. ;

A primary sintered compact forming step of forming the porous sintered compact by heating the metal powder in a temperature atmosphere of 10-30% lower than a melting temperature for 10 minutes to 300 minutes;

Forming a secondary sintered compact to pressurize the primary sintered compact to have a density of 10 to 98% and a thickness of 0.001 mm to 2 mm;

Apply a synthetic resin having a thickness of 0.001mm ~ 1mm made of a composition comprising any one or more of PVC, PC, PE, PET, urethane, silicone, epoxy, ABS, UV resin on one side or the entire surface of the secondary sintered body Tertiary sintered body molding step of curing; Method for producing a high functional thin film material of different materials, characterized in that configured to include.
The method of claim 1, wherein in the tertiary sintered compact forming step, the synthetic resin of the high functional thin film material of the heterogeneous material, characterized in that it comprises an antimicrobial additive made of a composition comprising one or both of the silver nano solution or phytoncide solution Manufacturing method.
Filling step of filling a metal powder having a particle size of 20 μm to 200 μm as a metal powder of copper series, tin series, zinc series, aluminum series, and stainless series having a melting temperature of 300 ° C. to 1800 ° C. ; A primary sintered compact forming step of forming the porous sintered compact by heating the metal powder to 10 to 30% or less of the melting point; Pressurizing the primary sintered compact so as to have a density of 10 to 98% and a thickness of 0.001 mm to 2 mm, the secondary sintered compact forming step of performing press or roller pressurization 1 to 20 times at a pressure of 30 to 300 MPa with respect to the primary sintered compact; Applying a synthetic resin made of a composition of any one or at least one of PVC, PC, PE, PET, urethane, silicone, epoxy, ABS, UV resin on one side or the entire surface of the secondary sintered body with a thickness of 0.001mm ~ 1mm Tertiary sintered body molding step of curing; Method for producing a high functional thin film material of different materials, characterized in that configured to include.
The method of claim 1 or 3, wherein in the tertiary sintered compact forming step, a liquid synthetic resin is sprayed on the surface of the secondary sintered compact, or a film is formed by silk printing, or the surface of the secondary sintered compact High-performance thin film material of any of the above-mentioned materials, characterized in that it comprises any one of a method of plastic injection molding or by heating the synthetic resin sheet material to a temperature of 60 ℃ ~ 200 ℃ to the outer surface of the secondary sintered body Manufacturing method.
According to claim 1 or 3, wherein in the tertiary sintering molding step, the curing of the synthetic resin is made by any one of natural drying, heat curing, UV curing method, the tertiary sintered body is polishing to polish the surface Method for producing a high-performance thin film material of a heterogeneous material, characterized in that it further comprises any one of the step or the marking molding step of printing or stamping the surface.