WO2014023648A1 - Optoelektronisches halbleiterbauelement und verfahren zum herstellen eines spiegelbereichs auf einem halbleiterkörper - Google Patents
Optoelektronisches halbleiterbauelement und verfahren zum herstellen eines spiegelbereichs auf einem halbleiterkörper Download PDFInfo
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- WO2014023648A1 WO2014023648A1 PCT/EP2013/066230 EP2013066230W WO2014023648A1 WO 2014023648 A1 WO2014023648 A1 WO 2014023648A1 EP 2013066230 W EP2013066230 W EP 2013066230W WO 2014023648 A1 WO2014023648 A1 WO 2014023648A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 110
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 72
- 239000000203 mixture Substances 0.000 claims abstract description 33
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 31
- 229910052697 platinum Inorganic materials 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 229910052703 rhodium Inorganic materials 0.000 claims description 9
- 239000010948 rhodium Substances 0.000 claims description 9
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims description 8
- 229910052741 iridium Inorganic materials 0.000 claims description 8
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 8
- -1 platinum metals Chemical class 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 238000000137 annealing Methods 0.000 claims description 6
- 229910052762 osmium Inorganic materials 0.000 claims description 5
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 5
- 230000001427 coherent effect Effects 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 238000002310 reflectometry Methods 0.000 description 23
- 230000005855 radiation Effects 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 5
- 230000003595 spectral effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L31/03044—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds comprising a nitride compounds, e.g. GaN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Led Devices (AREA)
- Optical Elements Other Than Lenses (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015525834A JP6226985B2 (ja) | 2012-08-10 | 2013-08-01 | オプトエレクトロニクス半導体部品、および半導体ボディ上へのミラー領域の作製方法 |
CN201380042500.5A CN104521013B (zh) | 2012-08-10 | 2013-08-01 | 光电子半导体器件和用于在半导体本体上制造镜区域的方法 |
US14/420,883 US9397268B2 (en) | 2012-08-10 | 2013-08-01 | Optoelectronic semiconductor component and method for producing a mirror region on a semiconductor body |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012107384.8 | 2012-08-10 | ||
DE102012107384.8A DE102012107384A1 (de) | 2012-08-10 | 2012-08-10 | Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines Spiegelbereichs auf einem Halbleiterkörper |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014023648A1 true WO2014023648A1 (de) | 2014-02-13 |
Family
ID=48906276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2013/066230 WO2014023648A1 (de) | 2012-08-10 | 2013-08-01 | Optoelektronisches halbleiterbauelement und verfahren zum herstellen eines spiegelbereichs auf einem halbleiterkörper |
Country Status (5)
Country | Link |
---|---|
US (1) | US9397268B2 (de) |
JP (1) | JP6226985B2 (de) |
CN (1) | CN104521013B (de) |
DE (1) | DE102012107384A1 (de) |
WO (1) | WO2014023648A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6747308B2 (ja) * | 2017-01-20 | 2020-08-26 | 豊田合成株式会社 | 発光素子 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007029370A1 (de) * | 2007-05-04 | 2008-11-06 | Osram Opto Semiconductors Gmbh | Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips |
US20100012962A1 (en) * | 2008-07-17 | 2010-01-21 | Advanced Optoelectronic Technology Inc. | Light emitting diode and fabrication thereof |
WO2010111986A1 (de) * | 2009-04-03 | 2010-10-07 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung eines optoelektronischen bauelements, optoelektronisches bauelement und bauelementanordnung mit mehreren optoelektronischen bauelementen |
DE102010009717A1 (de) * | 2010-03-01 | 2011-09-01 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip |
DE102010020211A1 (de) * | 2010-05-10 | 2011-11-10 | Osram Opto Semiconductors Gmbh | Träger für ein optoelektronisches Bauelement, optoelektronische Vorrichtung mit einem Träger und Verfahren zur Herstellung eines Trägers für ein optoelektronisches Bauelement |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4239508B2 (ja) * | 2002-08-01 | 2009-03-18 | 日亜化学工業株式会社 | 発光素子 |
JP4507532B2 (ja) | 2002-08-27 | 2010-07-21 | 日亜化学工業株式会社 | 窒化物半導体素子 |
KR100634503B1 (ko) * | 2004-03-12 | 2006-10-16 | 삼성전자주식회사 | 질화물계 발광소자 및 그 제조방법 |
JP2008041866A (ja) | 2006-08-04 | 2008-02-21 | Nichia Chem Ind Ltd | 窒化物半導体素子 |
TWI331816B (en) * | 2007-04-03 | 2010-10-11 | Advanced Optoelectronic Tech | Semiconductor light-emitting device |
JP5502360B2 (ja) * | 2009-04-10 | 2014-05-28 | スタンレー電気株式会社 | 酸化亜鉛系半導体素子及びその製造方法 |
WO2012067075A1 (ja) | 2010-11-15 | 2012-05-24 | 日本電気株式会社 | 光素子 |
-
2012
- 2012-08-10 DE DE102012107384.8A patent/DE102012107384A1/de not_active Withdrawn
-
2013
- 2013-08-01 US US14/420,883 patent/US9397268B2/en active Active
- 2013-08-01 CN CN201380042500.5A patent/CN104521013B/zh active Active
- 2013-08-01 WO PCT/EP2013/066230 patent/WO2014023648A1/de active Application Filing
- 2013-08-01 JP JP2015525834A patent/JP6226985B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007029370A1 (de) * | 2007-05-04 | 2008-11-06 | Osram Opto Semiconductors Gmbh | Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips |
US20100012962A1 (en) * | 2008-07-17 | 2010-01-21 | Advanced Optoelectronic Technology Inc. | Light emitting diode and fabrication thereof |
WO2010111986A1 (de) * | 2009-04-03 | 2010-10-07 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung eines optoelektronischen bauelements, optoelektronisches bauelement und bauelementanordnung mit mehreren optoelektronischen bauelementen |
DE102010009717A1 (de) * | 2010-03-01 | 2011-09-01 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip |
DE102010020211A1 (de) * | 2010-05-10 | 2011-11-10 | Osram Opto Semiconductors Gmbh | Träger für ein optoelektronisches Bauelement, optoelektronische Vorrichtung mit einem Träger und Verfahren zur Herstellung eines Trägers für ein optoelektronisches Bauelement |
Also Published As
Publication number | Publication date |
---|---|
CN104521013B (zh) | 2018-11-23 |
JP6226985B2 (ja) | 2017-11-08 |
JP2015528641A (ja) | 2015-09-28 |
CN104521013A (zh) | 2015-04-15 |
DE102012107384A1 (de) | 2014-02-13 |
US20150243850A1 (en) | 2015-08-27 |
US9397268B2 (en) | 2016-07-19 |
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