WO2014021262A1

WO2014021262A1 - Electronic apparatus

Info

Publication number: WO2014021262A1
Application number: PCT/JP2013/070478
Authority: WO
Inventors: 三浦　忠将; 是如山下; 裕直小倉
Original assignee: 株式会社村田製作所; 国立大学法人千葉大学
Priority date: 2012-08-03
Filing date: 2013-07-29
Publication date: 2014-02-06
Also published as: JP6128659B2; US20150144295A1; JPWO2014021262A1; JP6369997B2; CN104584705A; JP2016171342A

Abstract

Provided is an electronic apparatus provided with a new means capable of suppressing temperature increases in a heat emitting component. The electronic apparatus (20), which is provided with a heat emitting part, has a device (or a chemical heat pump) (10) comprising: a reaction chamber (1) which houses a chemical heat storage material which exhibits an endothermic reaction in response to heat emitted by the heat emitting part (11); a condensation/evaporation chamber (3) for either condensing or evaporating condensable components generated from the endothermic reaction of the chemical heat storage material; and a communication part (5) which communicates between the reaction chamber (1) and the condensation/evaporation chamber (3) such that the condensable components are capable of moving between the reaction chamber (1) and the condensation/evaporation chamber (3).

Description

Electronics

The present invention relates to an electronic device, and more particularly to an electronic device including a heat generating component (or an electronic component that generates heat).

In an electronic component built in an electronic device, for example, a central processing unit (CPU) or other integrated circuit (IC), a part of the input energy is converted into heat and lost due to heat generation. . And if the temperature rise by heat_generation | fever becomes remarkable, an electronic component itself may fail or it may have a bad influence on other surrounding components, and the lifetime and reliability of an electronic device may be impaired. Moreover, the heat generation of the electronic component is not preferable in terms of usability and safety of the user of the electronic device.

In order to suppress the temperature rise of such heat generating components, conventionally, a cooling fan is used to exhaust heat to the outside of the electronic device by forced convection, or both ends of the heat pipe are connected to the heat generating components, heat sink and heat sink, respectively. A method of transporting heat using the latent heat of evaporation and condensation of the working fluid in the heat pipe to dissipate heat from a heat sink or the like is known (see, for example, Patent Document 1). These methods suppress the temperature rise of the heat generating component by directly or indirectly radiating heat from the heat generating component.

JP 2001-68883 A Japanese Patent Laid-Open No. 10-89799 JP 2008-1111592 A

In recent years, with the increase in performance of electronic devices, the number of heat generating components built in one electronic device has increased, and the amount of energy input to each heat generating component has increased. As a result, heat generation in electronic devices has increased. The amount is increasing.

In the conventional heat dissipation method using a cooling fan, additional energy is required to drive the cooling fan, and in order to obtain a higher heat dissipation capacity, the power consumption of the electronic device further increases, which is not preferable. . In the first place, this method is not efficient because heat is dissipated by energy input with respect to heat generation that is energy loss. In addition, a relatively large space is required to install the cooling fan, which is not suitable for small electronic devices. Furthermore, in a smart phone, a tablet-type terminal, etc., the housing of the electronic device is sealed, and an air current cannot be generated by a cooling fan and exhausted to the outside.

In the conventional heat dissipation method using a heat pipe, heat can be transported quickly, but a heat sink or a heat sink is required to dissipate this heat. A relatively large space is required to install a heat sink or the like, which is not suitable for small electronic devices. Although it can be considered that heat is transferred to the housing of the electronic device instead of the heat sink or the like, the surface area of the housing is reduced due to the downsizing and thinning of the electronic device, and high heat dissipation capability cannot be obtained. In addition, if the temperature of the casing rises too much, it is not preferable in terms of user's feeling of use and safety. Furthermore, in high-performance mobile devices such as smartphones, there is a problem in reducing the life of lithium-ion batteries. If heat is released to the housing, the operating environment temperature of the lithium-ion battery will increase, leading to a decrease in battery capacity over time. obtain.

Under such circumstances, the temperature of each heat generating component is measured, and when the measured temperature exceeds a predetermined threshold, the amount of energy input to the heat generating component is limited. This method suppresses the temperature rise of the heat generating component by reducing the heat generation amount itself of the heat generating component. However, in this method, the function of the heat generating component (for example, the performance of the CPU) is hindered each time due to the temperature rise of the heat generating component, and the performance of the electronic device is sacrificed.

An object of the present invention is to provide an electronic device including a novel means capable of suppressing a temperature rise of a heat generating component.

The present inventors paid attention to a technology for storing and transferring heat using a chemical reaction, that is, a chemical heat pump. Chemical heat pumps are currently used for the purpose of exhaust heat utilization in chemical plants and power plants, and are used in large equipment such as domestic hot water supply / heating systems and refrigerator trucks (see, for example, Patent Documents 2 to 3). ) However, what applied the chemical heat pump to the electronic device is not known. As a result of intensive studies based on the original idea of using a chemical heat pump as a novel means that can suppress the temperature rise of the heat-generating component, the present inventors have completed the present invention.

According to the first aspect of the present invention,
Heat-generating parts,
A reaction chamber containing a chemical heat storage material that exhibits an endothermic reaction by heat generated by a heat-generating component, a condensation evaporation chamber for condensing or evaporating a condensable component generated by the endothermic reaction of the chemical heat storage material, and a condensable component condensing with the reaction chamber There is provided an electronic device including a device including a communication unit that communicates between the reaction chamber and the condensation evaporation chamber so as to be movable between the evaporation chamber and the evaporation chamber.

Although not intended to limit the present invention, a device in which the reaction chamber and the condensing evaporation chamber are in communication with each other through a communication unit can be understood as a so-called chemical heat pump. In this specification, such a device is also referred to as a chemical heat pump.

In one aspect related to the first aspect of the present invention, the reaction chamber has a portion made of a thermally conductive material, and the portion made of the thermally conductive material is in direct or indirect contact with the heat generating component. May be arranged.

Instead of or in addition to the above aspect of the present invention, the electronic device further includes a heat conductive member,
The condensation evaporation chamber may have a portion made of a heat conductive material, and the portion made of the heat conductive material may be disposed in direct or indirect contact with the heat conductive member.

The heat conductive member can be selected from the group consisting of a housing of an electronic device, a battery exterior, a substrate, and a display, for example, but is not limited thereto.

The heat generating component can be selected from the group consisting of, for example, an integrated circuit, a light emitting element, a field effect transistor, a motor, a coil, a converter, an inverter, and a capacitor, but is not limited thereto.

According to the second aspect of the present invention,
A first member and a second member;
A reaction chamber containing a chemical heat storage material that exhibits reversible endothermic and exothermic reactions, a condensation evaporation chamber for condensing or evaporating condensable components generated by the endothermic reaction of the chemical heat storage material, and a reaction chamber and a condensation evaporation chamber There is provided an electronic apparatus including a device including a communication unit that communicates, wherein the first member and the reaction chamber are thermally coupled, and the condensation evaporation chamber and the second member are thermally coupled.

In such an electronic device of the present invention, when the temperature of the first member rises and / or when the temperature of the second member falls, heat is transferred from the first member to the reaction chamber, and the chemical heat storage material in the reaction chamber Produces a condensable component due to endothermic reaction, the condensable component moves from the reaction chamber to the condensing evaporation chamber in a gaseous state, and the condensable component condenses in the condensing evaporation chamber to generate heat. Heat can be transferred from the first member to the second member.

In the electronic device according to the present invention, when the temperature of the first member decreases and / or when the temperature of the second member increases, heat is transferred from the reaction chamber to the first member, and heat is generated in the reaction chamber. The reaction occurs and the condensable component is consumed, the condensable component in the gaseous state moves from the condensing evaporation chamber to the reaction chamber through the communication section, and the condensable component condensed in the condensing evaporation chamber gains heat and evaporates. In addition, heat can be transferred from the second member to the condensation evaporation chamber.

Any of the electronic devices related to the first and second aspects of the present invention preferably includes at least one of the following features.
(I) The communication part includes a filter that allows gas to pass but does not allow substantially solid and liquid to pass through. (Ii) The chemical heat storage material is molded or packed in the reaction chamber, and the molded or packed (Iii) the condensation evaporation chamber has a substance capable of trapping liquid therein or at least a part of the inner surface of the condensation evaporation chamber. However, according to this feature, even when the electronic device is rotated up and down and / or left and right, the chemical heat storage material (generally solid or (Solid state) can be effectively prevented from moving from the reaction chamber to the condensing evaporation chamber through the communication section (in the case of the above characteristics (i) and (ii)), and the condensation is condensed in the condensing evaporation chamber. It is possible to effectively prevent the condensable component (liquid) from moving from the condensing evaporation chamber to the reaction chamber through the communication section (in the case of the above characteristics (i) and (iii)), and thereby the performance of the device as a chemical heat pump Can be effectively prevented. The above-described features and the effects obtained thereby are unique in that the mobile electronic device is used by rotating up and down and / or left and right, etc., so that the solid and liquid in the device may move between the two chambers. It addresses the issues of Conventional chemical heat pumps are installed or used while moving in the horizontal direction, and the above-mentioned problems in the use of electronic equipment have been found by the present inventors (the present invention described later). The same applies to the third gist).

According to a third aspect of the present invention, there is provided an electronic device having a function of suppressing a temperature rise of a heat generating component,
Heat-generating parts,
Including at least one reaction chamber containing the chemical heat storage material, and conducting heat generated by the heat generating component from the outer surface of the heat generation component to the chemical heat storage material stored in the at least one reaction chamber. An electronic device that suppresses the temperature rise of the heat generating component by absorbing heat is provided.

In one aspect related to the third aspect of the present invention, the electronic device includes a first reaction chamber containing a first chemical heat storage material and a second reaction chamber containing a second chemical heat storage material,
The first chemical heat storage material and the second chemical heat storage material absorb heat or generate heat due to a reaction involving the same component,
The first reaction chamber and the second reaction chamber are in communication with each other so that the components can move by a communication portion between them.
Heat generated by the heat generating component is conducted to either the first chemical heat storage material in the first reaction chamber or the second chemical heat storage material in the second reaction chamber.

In the above aspect of the present invention, the electronic device further includes a condensation evaporation chamber for condensing or evaporating the component,
The condensing and evaporating chamber may communicate with the communication portion between the first reaction chamber and the second reaction chamber so that the components can move.

Alternatively, in the above aspect of the present invention, the electronic device further includes a condensation evaporation chamber for condensing or evaporating the component,
The condensing and evaporating chamber may be connected to either the first reaction chamber or the second reaction chamber so that the component can be moved by another communication unit.

The electronic device according to the third aspect of the present invention preferably includes at least one of the following features.
(I ′) A filter through which gas can pass but solids and liquids cannot substantially pass through any of the connecting portions connecting the chambers (the first reaction chamber, the second reaction chamber, and the condensation evaporation chamber). (Ii ′) the first chemical heat storage material is molded or packed in the first reaction chamber, and the minimum cross-sectional dimension of the molded or packed first chemical heat storage material is the communication portion (and preferably exists) And the second chemical heat storage material is formed or packed in the second reaction chamber, and the minimum of the second chemical heat storage material formed or packed The cross-sectional dimension is greater than the minimum cross-sectional dimension of the communication (and preferably, if present, another communication) (iii ') the condensation evaporation chamber has a substance capable of trapping liquid therein or is At least a part of the inner surface of the chamber is made of a substance capable of trapping liquid. According to this feature, even if the electronic device is rotated up and down and / or left and right, the first and / or Alternatively, it is possible to effectively prevent the chemical heat storage material (generally solid or solid) in the second reaction chamber from moving from the first and / or second reaction chamber to the condensing evaporation chamber through the communication portion (the above feature (i In the case of ') and (ii')), it is also effective that the condensable component (liquid) condensed in the condensing evaporation chamber moves from the condensing evaporation chamber to the first and / or second reaction chamber through the communication section. It can prevent (in the case of the said characteristics (i ') and (iii')), and can prevent effectively impairing the performance as a chemical heat pump which these members comprise.

Throughout all the gist of the present invention, “chemical heat storage material” means a substance that can store heat by an endothermic reaction. In the present invention, the condensable component (component that can be condensed or evaporated in the condensation evaporation chamber) generated by the endothermic reaction of the chemical heat storage material can be water, but is not limited thereto. Or regarding the 3rd summary of this invention, a chemical heat storage material may produce the component which can be changed to another phase change (for example, sublimation) instead of a condensable component by endothermic reaction. In this case, the condensation evaporation chamber functions as a phase change chamber (for example, a sublimation chamber) in which the component changes phase.

Such a chemical heat storage material preferably exhibits an endothermic reaction at a temperature of 30 to 200 ° C.

In addition, it is possible to use at least one kind of heat storage material selected from the group consisting of zeolite, silica gel, mesoporous silica, and activated carbon instead of the chemical heat storage material throughout the gist of the present invention. Also in this case, the effect corresponding to each heat storage material can be produced.

According to the first aspect of the present invention, an endothermic reaction is performed by applying a chemical heat pump (a device in which a reaction chamber and a condensation evaporation chamber communicate with each other through a communication unit) in an electronic device including a heat generating component. When the heat generating component generates heat, the chemical heat storage material reacts and takes heat from the heat generating component to store heat, thereby suppressing the temperature rise of the heat generating component. In other words, at least temporal heat transfer or leveling is realized in the electronic device.

According to the second aspect of the present invention, a chemical heat pump is applied between the first member and the second member in the electronic device, and the reaction chamber and the condensation evaporation chamber of the chemical heat pump are respectively used as the first member and the second member. Since they are thermally coupled, heat can be transferred from the first member to the second member or from the second member to the first member while storing or radiating heat with the chemical heat storage material, in other words In the electronic equipment, temporal and spatial heat transfer or leveling is realized.

According to the third aspect of the present invention, in an electronic device including a heat generating component, a reaction chamber containing a chemical heat storage material is provided, and heat generated by the heat generating component is stored in the reaction chamber from the outer surface of the heat generating component. Conduction to the chemical heat storage material is performed, and the chemical heat storage material absorbs heat (stores heat) by a reaction, thereby suppressing an increase in temperature of the heat-generating component.

In any of the gist of the present invention, since a chemical reaction of a chemical heat storage material can be used, a large heat storage capacity can be obtained. Further, when the heat generated by the heat generating component is reduced or decreased, the heat generated by the heat generating component is not directly transferred to the chamber (usually a condensing evaporation chamber. However, in the case of the third aspect of the present invention, the first reaction is performed. Cold heat (or a negative amount of heat) can be obtained on the side of the chamber and the second reaction chamber, including the case where the heat generated by the heat generating component is not directly conducted. Obtaining such a large heat storage capacity and cold is a remarkable feature of the present invention compared to a heat pipe using latent heat and a heat transport device using sensible heat. As other heat pumps excluding the chemical heat pump using a chemical reaction, a mechanical heat pump and a heat pump using an adsorption or absorption reaction are known. According to the present invention, since a chemical reaction of a chemical heat storage material is used, unlike a mechanical heat pump, a mechanical component having a large and complicated configuration such as a compressor is not required, and an adsorption or absorption reaction is not required. Therefore, it is possible to store heat in a wide temperature range.

However, the present invention is not limited to the one using a chemical heat storage material, and widely uses other heat storage materials such as at least one heat storage material selected from the group consisting of zeolite, silica gel, mesoporous silica and activated carbon. Can be included. Also in this case, the effect corresponding to each heat storage material can be produced. Further, such a heat storage material can be easily handled and can be simplified in structure (for example, it is not necessary to consider corrosion prevention) as compared with a chemical heat storage material.

It is a schematic schematic cross section of the electronic device in one embodiment of this invention. It is a schematic schematic cross section of the electronic device in another embodiment of this invention. It is a schematic model top view which shows the various modifications of the electronic device in another embodiment of this invention. It is a schematic model top view which shows one CHP mounting example in the Example of the electronic device of this invention. It is a schematic model top view which shows another CHP mounting example in the Example of the electronic device of this invention. It is a schematic model top view which shows another CHP mounting example in the Example of the electronic device of this invention. It is a schematic model top view which shows another CHP mounting example in the Example of the electronic device of this invention. It is a schematic schematic cross section which shows the model used by the simulation in the comparative example of the electronic device of this invention. It is a schematic schematic cross section which shows the model used by the simulation in one Example of the electronic device of this invention. FIG. 10 is a graph and a table showing changes over time in the temperature of the CPU and reaction chamber in the simulation of FIG. 9. It is a schematic schematic cross section which shows the model used by the simulation in another Example of the electronic device of this invention. It is a schematic model perspective view which shows the manufacture example of CHP used for the electronic device in one embodiment of this invention.

The electronic device according to some embodiments of the present invention will be described in detail below with reference to the drawings, but the present invention is not limited thereto.

First, the configuration of a chemical heat pump (CHP), which is a device in which the reaction chamber and the condensation evaporation chamber are in communication with each other through a communication unit, will be described. In this embodiment, as shown in FIG. 1, the chemical heat pump 10 communicates between a reaction chamber 1 containing a chemical heat storage material, a condensation evaporation chamber 3 for condensing or evaporating a condensable component, and these. And a communication unit 5. The chemical reaction of the chemical heat storage material is a driving source of heat transfer by the chemical heat pump 10, and the condensable component is a working medium of the chemical heat pump 10.

As the chemical heat storage material, any appropriate material can be used as long as heat can be stored by an endothermic reaction. In terms of the principle of the chemical heat pump, the chemical heat storage material is not limited to this as long as it exhibits a reversible endothermic reaction and exothermic reaction, and any of these reactions generates a condensable component. The condensable component should just be a component which can change a phase between a gaseous state (gas phase) and a liquid state (liquid phase) in use environment.

In this embodiment, a chemical heat storage material that generates a condensable component by an endothermic reaction is used. Such a chemical heat storage material may exhibit a dehydration reaction as an endothermic reaction and a hydration reaction as an exothermic reaction, in which case the condensable component is water.

More specifically, inorganic chemical compound hydrates and inorganic hydroxides can be used as the chemical heat storage material. More specifically, alkaline earth metal compound hydrates and alkaline earth metal hydroxides such as calcium sulfate and calcium chloride hydrates, calcium and magnesium hydroxides, and the like can be given.

For example, calcium sulfate hemihydrate exhibits the following endothermic reaction.

In the formula, Q ₁ is known to be about 16.7 kJ / mol.
The endothermic reaction of calcium sulfate hemihydrate can proceed at about 50 to 150 ° C., for example, although it depends on various conditions. This is a reversible reaction, and the reverse reaction is an exothermic reaction. Calcium sulfate hemihydrate is in a solid state (eg, powder), calcium sulfate is in a solid state, and water is in a gaseous state.

For example, calcium chloride hydrate exhibits the following endothermic reaction.

In the formula, n can be the number of molecules to be hydrated, specifically 1, 2, 4, 6 and Q ₂ is known to be about 30 to 50 kJ / mol.
The endothermic reaction of calcium chloride hydrate can proceed at about 30 to 150 ° C., for example, although it depends on various conditions. This is a reversible reaction, and the reverse reaction is an exothermic reaction. Calcium chloride hydrate is in a solid state (eg, powder), calcium chloride is in a solid state, and water is in a gaseous state.

However, the chemical heat storage material is not limited to the above example, and any appropriate chemical heat storage material may be used (for example, it may be capable of generating ammonia). It can be selected appropriately to show the reaction.

In a broader concept, the chemical heat storage material that can be used in the present invention preferably exhibits an endothermic reaction at a temperature of 30 to 200 ° C., for example, 40 ° C. or more, more preferably 50 ° C. or more, and 150 ° C. or less. It is preferable that the endothermic reaction is exhibited at a temperature of 120 ° C. or lower.

Such chemical heat storage material is accommodated in the reaction chamber 1. The chemical heat storage material may form, for example, a solid phase 2a, and a gas phase 2b containing a condensable component may exist in the reaction chamber 1. It is desirable that the pressure in the reaction chamber is substantially equal to the equilibrium pressure of the endothermic reaction and the exothermic reaction under the normal operating temperature environment (when the exothermic component is in a non-exothermic state).

On the other hand, in the condensing evaporation chamber 3, a condensable component may be included in the gas phase 4a and the liquid phase 4b. Although this embodiment is not limited, you may accommodate the component (for example, water of a liquid state) condensed beforehand in the condensation evaporation chamber. The pressure in the condensation evaporation chamber is desirably substantially equal to the saturated vapor pressure of the condensable component (saturated water vapor pressure in the case of water) under the operating temperature environment.

The communication part 5 which connects the reaction chamber 1 and the condensation evaporation chamber 3 should just be able to move a condensable component between these. More specifically, the condensable component can move in a gaseous state, and in this case, the communication part 5 may be anything that allows gas to pass through. Such a communication part may be a tubular member for convenience, but is not limited thereto.

The communication unit 5 may or may not include a valve (not shown). When the communication unit 5 does not include a valve, the device configuration is simplified, and the movement of the condensable component and, consequently, the operation of the chemical heat pump 10 is caused by the progress of the reaction in the reaction chamber 1 and / or the progress of the phase change in the condensation evaporation chamber 3 ( Typically, it depends on the temperature in the reaction chamber 1 and / or the condensation evaporation chamber 3). When the communication part 5 is provided with a valve, the movement of the condensable component and hence the operation of the chemical heat pump 10 can be controlled by opening and closing the valve, and the timing of heat transfer, heat generation and cooling can be managed. Thermal design becomes possible.

Such a chemical heat pump 10 is a closed system in which no substance enters or exits, but heat can enter and exit at least in the reaction chamber 1, preferably in the reaction chamber 1 and the condensation evaporation chamber 3. Specifically, each of the reaction chamber 1 and preferably the condensation evaporation chamber 3 can be at least partially made of a heat conductive material. The heat conductive material is not particularly limited, and may be a good heat conductor such as metal (copper and the like), oxide (alumina and the like), nitride (aluminum nitride and the like), and carbon.

The chemical heat pump 10 used in the electronic apparatus of the present embodiment preferably includes any one of the following features alone or in combination of two or more.
(I) The communication unit 5 includes a filter that allows gas to pass but does not substantially allow solids and liquids to pass. (Ii) In the reaction chamber 1, a chemical heat storage material is molded or packed, and the molding is performed. Or the minimum cross-sectional dimension of the packed chemical heat storage material is larger than the minimum cross-sectional dimension of the communication part 5 (iii) The condensing and evaporating chamber 3 has a substance capable of trapping liquid inside, or the condensing evaporating chamber 3 At least a part of the surface is made of a substance that can trap liquid

With regard to (i) above, the communication unit 5 includes a filter through which gas can pass but solids and liquids cannot substantially pass, so that the electronic device 20 rotates up and down and / or left and right. Even if it exists, it can prevent effectively that the chemical heat storage material (generally solid or solid form) in the reaction chamber 1 moves from the reaction chamber 1 to the condensation evaporation chamber 3 through the communication part 5, and the condensation evaporation chamber It is possible to effectively prevent the condensable component (liquid) condensed in 3 from moving from the condensation evaporation chamber 3 to the reaction chamber 1 through the connecting portion 5.

Such a filter may be any filter that allows gas to pass but does not substantially allow solids and liquids to pass. The phrase “solid and liquid are substantially impermeable” means that a small amount of solid and liquid may be passed without impairing the performance of the chemical heat pump. The filter preferably allows a small amount of liquid to pass through but does not allow solids to pass through, and more preferably prevents both solids and liquids from passing through.

More specifically, filter, moisture permeability (JIS L1099 (B method, generally depends on the B-1 method)) is 1000g ^/ m 2 ^/ 24h or more, preferably particularly 10000g ^/ m 2 ^/ 24h or more Thus, the pressure loss due to the filter can be sufficiently reduced. The solid non-passability is not limited as long as the chemical heat storage material does not pass through, and can be appropriately selected according to the dimensions of the chemical heat storage material to be used. As for the non-passability of the liquid, the waterproof property (according to JIS L1092 (Method A)) is preferably 1000 mm or more, particularly preferably 10,000 mm or more.

Specifically, for example, a film (micropore filter) obtained by stretching polytetrafluoroethylene can be used, and this may be combined with a polyurethane polymer as necessary. Such a film is commercially available, for example, under the trade name “Gore-Tex” (registered trademark). Moreover, what gave the polyurethane coating to the fiber fabric which carried out the water repellent process can also be used. Such a polyurethane coating fabric is commercially available, for example, from Toray Industries, Inc. under the trade name “ENTANT GII” (registered trademark) XT.

However, the present invention is not limited to these examples, and any suitable structure having pores with dimensions smaller than water molecules and larger than water vapor molecules can be applied to the filter.

The filter can be provided in the communication section 5 in any manner as long as gas can pass through but solid and liquid can pass through substantially. The filter may be arranged, for example, so as to fill at least a part of the internal space of the communication part 5 (preferably in the vicinity of the reaction chamber 1), and the opening of the communication part 5 (preferably on the reaction chamber 1 side). May be arranged so as to cover the opening).

Regarding the above (ii), the chemical heat storage material is molded or packed in the reaction chamber 1, and the minimum cross-sectional dimension of the molded or packed chemical heat storage material is larger than the minimum cross-sectional dimension of the connecting portion 5, so that the electronic device Even when 20 is rotated up and down and / or left and right, the chemical heat storage material (generally solid or solid) in the reaction chamber 1 moves from the reaction chamber 1 to the condensation and evaporation chamber 3 through the communication portion 5. Can be effectively prevented.

In the reaction chamber 1, the chemical heat storage material may be molded or packed by any appropriate method. If the chemical heat storage material is a hydrate of an inorganic compound (such as a hydrate of calcium sulfate or calcium chloride), it will solidify by hydration of the inorganic compound. Is possible. In addition, it is possible to mix the chemical heat storage material with a resin material and a solvent, if necessary, and mold the obtained composition with a mold press or the like (note that the resin material and the solvent if present are Part, preferably most, can be removed during molding). Alternatively, when the chemical heat storage material is a granular material, a mesh, net, fabric (for example, woven or non-woven fabric), film, etc. having an opening size smaller than the particle size (for example, average particle size) of the chemical chamber heat material It is possible to pack the chemical heat storage material by using the packing material. The packaging material may be made of, for example, metal, natural or synthetic fiber, polymer material or the like.

The chemical heat storage material molded or packed in this way has a minimum cross-sectional dimension that is larger than the minimum cross-sectional dimension of the connecting portion 5. The minimum cross-sectional dimension of the chemical heat storage material molded or packaged refers to the minimum cross-sectional dimension among arbitrary cross-sectional dimensions of the chemical heat storage material molded or packaged. Further, the minimum cross-sectional dimension of the connecting part 5 refers to the smallest cross-sectional dimension among arbitrary cross-sectional dimensions of the internal space of the connecting part 5, and normally refers to the dimension of the narrowest part of the connecting part 5. In another expression, among the arbitrary projected areas of the molded or packaged chemical heat storage material, the maximum dimension when the projected area is the smallest is the cross-sectional dimension perpendicular to the center line of the internal space of the connecting portion 5. It can also be said that it is larger than the minimum cross-sectional dimension. In short, it is only necessary that the molded or packed chemical heat storage material has a size that does not pass through the connecting portion 5. For example, if the opening dimension of the reaction chamber 1 side opening of the communication part 5 (and possibly the condensation evaporation chamber 3 side opening) is smaller than the minimum cross-sectional dimension of the molded or packaged chemical heat storage material, The part between both opening parts of the connection part 5 may be enlarged.

The chemical heat storage material formed or packed may be present in the reaction chamber 1, but for quick and efficient movement of heat, the chemical heat storage material is disposed so as to contact a position where heat from the heat generating component 11 is well transmitted. It is preferred that

Regarding (iii) above, the condensation evaporation chamber 3 has a substance capable of trapping liquid inside, or at least a part of the inner surface of the condensation evaporation chamber 3 is made of a substance capable of trapping liquid. Even when the electronic device 20 is rotated up and down and / or left and right, the condensable component (liquid) condensed in the condensation evaporation chamber 3 moves from the condensation evaporation chamber 3 to the reaction chamber 1 through the communication unit 5. Can be effectively prevented.

Such a substance may be any substance that can reversibly trap a liquid. More specifically, a porous material such as a porous material made of ceramics, zeolite, metal or the like can be used, but is not limited thereto.

The substance capable of trapping the liquid may be accommodated in the condensation evaporation chamber 3 or may constitute at least a part of the inner surface of the condensation evaporation chamber 3. In the former case, a substance capable of trapping a liquid prepared in advance may be arranged in the condensation evaporation chamber 3. In the latter case, for example, ceramics or zeolite may be synthesized on the inner surface of the wall material of the condensation evaporation chamber 3 by, for example, hydrothermal synthesis to cover the surface. In any case, the substance capable of trapping the liquid may be present in the condensation evaporation chamber 3 or on the inner surface thereof. However, for quick and efficient movement of the heat, the substance to the heat conductive member 13 may be used. It is preferable that it exists in the position where heat is transmitted well.

The chemical heat pump 10 having such a configuration is not limited to this embodiment, but can be manufactured as follows as an example.

First, referring to FIG. 12A, two

metal plates

41a and 41b are prepared. These

metal plates

41a and 41b may preferably be made of a corrosion-resistant metal, for example, stainless steel such as SUS, but are not limited thereto. The thickness of the

metal plates

41a and 41b can be, for example, 0.01 mm or more, particularly 0.05 to 0.5 mm. The material and thickness of the

metal plates

41a and 41b may be the same or different.

Next, as shown in FIG. 12B, two convex portions 43a corresponding to the reaction chamber 1 and the condensation evaporation chamber 3 are formed on one metal plate 41a. The dimensions of the protrusions 43a can be appropriately determined according to the dimensions desired for the reaction chamber 1 and the condensation evaporation chamber 3, and the height of the protrusions 43a is, for example, 0.1 to 100 mm, particularly 0.3 to It can be 10 mm and can be the same or different. On the other hand, a recess 43b corresponding to the connecting portion 3 is formed in the other metal plate 42b. The size of the concave portion 43b may be any size as long as it forms the connecting portion 5 that communicates between the reaction chamber 1 and the condensing evaporation chamber 3, and the condensable component can move inside the concave portion 43b. For example, it may be 0.1 to 100 mm, particularly 0.3 to 10 mm. Arbitrary appropriate methods may be applied to the formation of the concavo-

convex shapes

43a and 43b on the

metal plates

41a and 41b. For example, methods such as drawing and press forming can be used.

And the chemical heat storage material 45 is arrange | positioned in the direction corresponding to the reaction chamber 1 among the two convex parts 43a of the metal plate 41a. The chemical heat storage material 45 is generally solid or solid, and may be, for example, granular or sheet-like. The chemical heat storage material 45 is preferably molded or packed in advance as described above, but this is not essential.

Further, if necessary, a substance (for example, a porous material, not shown) capable of trapping the liquid is disposed on the side corresponding to the condensation evaporation chamber 3 of the two convex portions 43a of the metal plate 41a. Alternatively, the inner surface of the two convex portions 43a corresponding to the condensation evaporation chamber 3 may be covered with a substance capable of trapping liquid as described above.

On the other hand, it is preferable to dispose a filter 47 that allows the gas to pass through the recess 43 of the metal plate 41b but does not allow the solid and liquid to pass through substantially. However, this is not essential.

Thereafter, as shown in FIG. 12C, these

metal plates

41a and 41b are overlapped so that the convex portion 43a and the concave portion 43b together form an internal space. Thereby, the outer peripheral flat surfaces of the

metal plates

41a and 41b are in close contact with each other.

And as shown in FIG.12 (d), the outer peripheral part 49 of the

metal plates

41a and 41b which overlap | superposed is airtightly sealed. Hermetic sealing is performed at a desired pressure inside the chemical heat pump, generally under reduced pressure (depending on the chemical heat storage material used), for example, 0.1 to 100,000 Pa, particularly 1.0 to 10000 Pa (absolute pressure). It is preferable to carry out. Any appropriate method may be applied to the hermetic sealing, and for example, laser welding, arc welding, resistance welding, gas welding, brazing, and the like can be used. After the hermetic sealing, unnecessary edge portions of the outer peripheral portion 49 may be appropriately removed by punching or the like.

The chemical heat pump 10 can be manufactured as described above. However, the manufacturing method described above is merely an example, and the chemical heat pump applied to the present invention can be manufactured according to any appropriate method.

Next, the chemical heat pump 10 having the above-described configuration is incorporated into the electronic device 20 including the heat generating component 11. The electronic device 20 only needs to include at least one electronic component as the heat generating component 11. In general, the electronic device 20 is configured such that an electronic circuit board on which at least one electronic component is mounted on a board is accommodated in a housing (or an exterior). The chemical heat pump 10 is provided in the electronic device 20 (more specifically, in the housing). In the present embodiment, the chemical heat pump 10 can be understood as a means for suppressing a temperature rise of the heat generating component 11 (or cooling the heat generating component).

The heat generating component 11 may be an electronic component that is lost when heat is partially converted into heat. Examples of the heat generating component 11 include an integrated circuit (IC) such as a central processing unit (CPU), a power management IC (PMIC), a power amplifier (PA), a transceiver IC, and a voltage regulator (VR); a light emitting diode (LED), Examples include, but are not limited to, light emitting elements such as incandescent bulbs and semiconductor lasers; field effect transistors (FETs) and the like. There may be at least one, generally a plurality of heat generating components in the electronic device 20.

The reaction chamber 1 of the chemical heat pump 10 is disposed so as to be thermally coupled to the heat generating component 11. For example, you may arrange | position the part which consists of a heat conductive material of the reaction chamber 1 with respect to the heat-emitting component 11 directly or indirectly. Thereby, heat can be transferred between the heat generating component 11 and the reaction chamber 1. When the electronic device 20 includes a plurality of heat generating components, the heat generating component 11 that is thermally coupled to the reaction chamber 1 may be one or more.

On the other hand, the condensation evaporation chamber 3 of the chemical heat pump 10 is not essential to the present embodiment, but may be disposed so as to be thermally coupled to any appropriate heat conductive member 13 present in the electronic device 20. . The heat conductive member 13 only needs to have a temperature lower than the temperature of the heat generating component 11 when the heat generating component 11 generates heat. Examples of the heat conductive member 13 include, but are not limited to, a casing of an electronic device, a battery (eg, a lithium ion battery, an alkaline battery, a nickel metal hydride battery), a substrate, and a display. For example, you may arrange | position the part which consists of a heat conductive material of the condensation evaporation chamber 3 with respect to the heat conductive member 13 directly or indirectly. Thereby, heat can be transferred between the condensing evaporation chamber 3 and the heat conductive member 13. There may be one or more thermally conductive members 13 that are thermally coupled to the condensation evaporation chamber 3.

In the present invention, the two members being “thermally coupled” means that they are combined so that heat can move between these members. The thermal coupling may be heat conduction by direct or indirect contact, non-contact heat radiation, or a heat medium or a heat conductive member. When contacting two members indirectly to thermally bond them, a thermally conductive adhesive layer (for example, a layer obtained by using an adhesive whose thermal conductivity is increased by a metal filler, etc.) The contact is preferably made via a member made of a heat conductive material (for example, a heat transfer plate made of metal or a thermal sheet).

The electronic device 20 of the present embodiment configured as described above can be used in the following two modes.

・ First mode (heat storage process)
First, energy is input to the heat generating component 11 to generate heat, and when the temperature of the heat generating component 11 rises, heat is transmitted to the reaction chamber 1 that is thermally coupled thereto. Specifically, the heat generated by the heat generating component 11 is conducted from the outer surface of the heat generating component 11 to a chemical heat storage material accommodated in the reaction chamber 1 through, for example, a portion made of a heat conductive material in the reaction chamber 1. When heat is supplied to the reaction chamber in this way, the endothermic reaction (heat storage) of the chemical heat storage material proceeds in the reaction chamber to generate a condensable component (that is, the partial pressure of the condensable component in the reaction chamber increases). ). As a result, heat is deprived from the heat generating component, and an increase in the temperature of the heat generating component (typically, the temperature of the outer surface of the heat generating component, and so on) is suppressed.

Thus, the condensable component generated in the reaction chamber 1 moves from the reaction chamber 1 to the condensing evaporation chamber 3 through the communication portion 5 in a gaseous state (vapor). Such movement can occur naturally due to the diffusion phenomenon, but is not limited thereto. When the communication unit 5 includes a valve, the movement of the condensable component can be controlled by opening and closing the valve.

In the condensing evaporation chamber 3, the condensable components condense and generate heat (latent heat). For example, when the condensable component is water, the gas state water changes to liquid state water by the following reaction.

In the formula, Q ₃ is known to be 20.9 kJ / mol.

¡The temperature in the condensation evaporation chamber can be increased by the generated heat. At this time, the pressure in the condensation evaporation chamber is set in advance (in a non-heat generation state, for example, when the heat conductive member 13 is thermally coupled to the condensation evaporation chamber 3, It is preferable to set the saturated vapor pressure of the condensable component (at a temperature that can be set as appropriate) and keep the condensable component in a gas-liquid equilibrium state because condensation can proceed rapidly.

Although not essential to the present embodiment, when the condensation evaporation chamber 3 is thermally coupled to the heat conductive member 13, the heat generated in the condensation evaporation chamber 3 is, for example, the heat of the condensation evaporation chamber 3. It is transmitted to the heat conductive member 13 through a portion made of a conductive material.

As described above, according to the first mode, the temperature increase of the heat generating component 11 can be suppressed (or the heat generating component is cooled) using the endothermic reaction (heat storage) of the chemical heat storage material. Further, when the condensing and evaporating chamber 3 is thermally coupled to the housing of the electronic device 20 as the heat conductive member 13, the heat is stored in the chemical heat storage material, and the heat generating component 11 starts the reaction chamber. Since the heat emitted from the condensing and evaporating chamber 3 to the heat conductive member 13 can be made smaller (the temperature level can be changed) than the heat entering the inside 1, the temperature of the housing can be maintained at a relatively low temperature. Thereby, the temperature control of the heat generating component 11 and the electronic device 20 as a whole becomes possible.

In addition, when the condensation evaporation chamber 3 is thermally coupled to the heat conductive member 13, the same action (mechanism) as described above can be obtained by lowering the temperature of the heat conductive member 13. Heat can be removed from the heat generating component 11, and the temperature rise of the heat generating component 11 can be suppressed and further reduced. In the present embodiment, the heat generating component 11 and the heat conductive member 13 can be grasped as a first member thermally coupled to the reaction chamber 1 and a second member thermally coupled to the condensation evaporation chamber 3, respectively. The first member and the second member are not limited to these, and can be thermally designed by applying an arbitrary member.

・ Second mode (heat dissipation process)
Next, when the temperature of the heat generating component 11 decreases, for example, by reducing or stopping energy input to the heat generating component 11, heat is transferred from the reaction chamber 1 thermally coupled to the heat generating component 11 to the heat generating component 11. Is done. Specifically, the heat is transmitted from the system in the reaction chamber 1 to the heat generating component 11 through, for example, a portion made of a heat conductive material in the reaction chamber 1. When heat is taken away from the system in the reaction chamber 1 in this way, an exothermic reaction (radiation) opposite to the endothermic reaction of the chemical heat storage material proceeds in the reaction chamber 1 to consume the condensable component (that is, , The partial pressure of the condensable component in the reaction chamber decreases). As a result, the temperature of the heat generating component 11 starts to rise.

When the condensable component is consumed in the reaction chamber 1 in this manner, the condensable component in the gaseous state (vapor) moves from the condensing evaporation chamber 3 to the reaction chamber 1 through the communication portion 5. Such movement may occur naturally due to a diffusion phenomenon, but is not limited thereto. When the communication unit 5 includes a valve, the movement of the condensable component can be controlled by opening and closing the valve.

In the condensation evaporation chamber 3, the condensable component of the liquid phase gains heat (latent heat) and evaporates. The temperature in the condensing and evaporating chamber 3 can be lowered by taking heat away.

Although not essential to the present embodiment, when the condensation evaporation chamber 3 is thermally coupled to the heat conductive member 13, the heat conductive material of the condensation evaporation chamber 3, for example, is extracted from the heat conductive member 13. It is transmitted to the condensing evaporation chamber 3 through the part consisting of In other words, cold heat can be obtained from the condensation evaporation chamber 3 to the heat conductive member 13.

As described above, according to the second mode, it is possible to suppress the temperature drop of the heat generating component 11 by using the exothermic reaction (heat radiation) of the chemical heat storage material. In addition, when the condensation evaporation chamber 3 is thermally coupled as a heat conductive member 13 to a housing of an electronic device, a battery exterior, or the like, the temperature of the housing or the battery is decreased (or the housing or The battery can also be cooled). Thereby, the temperature control of the heat generating component 11 and the electronic device 20 as a whole becomes possible.

In addition, when the condensation evaporation chamber 3 is thermally coupled to the heat conductive member 13, the same action (mechanism) as described above can be obtained by increasing the temperature of the heat conductive member 13. The temperature of the heat generating component 11 can be raised. In the present embodiment, the heat generating component 11 and the heat conductive member 13 can be grasped as a first member that is thermally coupled to the reaction chamber and a second member that is thermally coupled to the condensation evaporation chamber, respectively. The member and the second member are not limited to these, and can be thermally designed by applying any member. For example, in the second mode, it is possible to suppress the temperature rise of the second member (or cool the second member).

As understood from the above, the electronic device of the present invention does not require extra energy input for the purpose of suppressing the temperature rise of the heat-generating component, unlike the conventional heat dissipation method using a cooling fan, and is energy efficient. Excellent electronic equipment is realized.

Further, the electronic device of the present invention does not dissipate heat by convection (generates an air flow and exhausts to the outside) unlike the conventional heat dissipation method using a cooling fan, and the casing of the electronic device is sealed (closed). System).

Moreover, since the electronic device of the present invention stores heat in the chemical heat storage material compared to the conventional heat dissipation method using a heat pipe, it can obtain a large heat storage capacity and can obtain a high heat dissipation capability. Further, when the condensing evaporation chamber is thermally coupled to the heat conductive member, in the first mode (heat storage process), the heat conductive member from the condensing evaporation chamber rather than the heat entering the reaction chamber from the heat generating component. In addition, it is possible to reduce the heat that flows out (the temperature level can be changed), and in the second mode (heat radiation process), cold heat can be obtained for the heat conductive member. Therefore, if the housing of the electronic device is used as a thermally conductive member that is thermally coupled to the condensing evaporation chamber, the temperature of the housing can be maintained at a relatively low temperature (for example, a surface temperature of 55 ° C. or lower), and the housing can be maintained. The adverse effects due to temperature on other parts in the body (for example, a lithium ion battery) can be reduced. In addition, if the exterior of the battery is used as a thermally conductive member that is thermally coupled to the condensing evaporation chamber, the life of the battery (for example, a lithium ion battery in which a decrease in battery capacity due to a high use environment temperature is a problem) Can be extended. In addition, if a substrate is used as a heat conductive member that is thermally coupled to the condensation evaporation chamber, it is possible to prevent the reliability of other electronic components mounted on the substrate from being impaired.

In addition, according to the electronic apparatus of the present invention, the first member thermally coupled to the reaction chamber and the second member thermally coupled to the condensation evaporation chamber are thermally designed by applying an arbitrary member. In accordance with the specific specifications of the electronic device, a thermally optimal electronic component layout becomes possible.

As mentioned above, although the electronic device in one embodiment of this invention was explained in full detail, the electronic device of this invention is not limited to this embodiment, Various modifications are possible based on the basic concept of this invention.

For example, the number of chemical heat pumps that can be incorporated into an electronic device, the number of chemical heat pumps used for one heat-generating component, the number and arrangement of reaction chambers, condensation evaporation chambers, and communication parts existing in one chemical heat pump, etc. Can be appropriately selected.

Also, for example, the condensation evaporation chamber may be surrounded by the ambient atmosphere in the casing (so-called air insulation, etc.). Alternatively, the condensing and evaporating chamber may be substantially composed of a material having low heat conductivity or heat insulation without having a portion made of a heat conductive material. Furthermore, the condensation evaporation chamber itself may be eliminated, and in this case as well, it is possible to some extent to suppress the temperature rise of the heat generating component by the endothermic reaction of the chemical heat storage material.

That is, as shown in FIG. 2, an electronic device 21 according to another embodiment of the present invention includes a heat generating component 11 and at least one reaction chamber 1 containing a chemical heat storage material (for example, which can form the solid phase 2a). What is necessary is just to have at least. In this case, the heat generated by the heat generating component 11 is conducted from the outer surface of the heat generating component 11 to the chemical heat storage material accommodated in at least one reaction chamber 1, and the chemical heat storage material absorbs heat by the reaction, thereby Temperature rise can be suppressed. The exothermic component 11 can be arranged in any manner as long as it is thermally coupled to the reaction chamber 1.

In such an electronic device of another embodiment, there may be two reaction chambers. More specifically, as shown in FIG. 3A, in the electronic device 22, a first reaction chamber 1a containing a first chemical heat storage material and a second reaction chamber 1b containing a second chemical heat storage material are provided. May exist. The first chemical heat storage material and the second chemical heat storage material are related to the same component (a component that serves as a working medium, for example, a condensable component, but is not limited to this and may be in a gaseous state). Any material that absorbs heat or generates heat by any reaction may be used. The first chemical heat storage material and the second chemical heat storage material only need to have different reaction equilibrium states. The first chemical heat storage material and the second chemical heat storage material may be appropriately selected from the chemical heat storage materials as exemplified above. For example, one of the first chemical heat storage material and the second chemical heat storage material is a half water of calcium sulfate. A hydrate of calcium chloride may be used as the hydrate, and water may be involved in the reversible reaction of these endotherms and exotherms as the same component, but is not limited thereto. The first reaction chamber 1a and the second reaction chamber 1b are in communication with each other so that the component (working medium) can be moved by the connecting portion 5a therebetween, and the heat generated by the heat generating component (not shown) is the first. It may be conducted to either the first chemical heat storage material in the reaction chamber 1a or the second chemical heat storage material in the second reaction chamber 1b. As long as heat generated by a heat generating component (not shown) can be selectively or switchably conducted to one of the first reaction chamber 1a and the second reaction chamber 1b, the heat generating component, the first reaction chamber 1a, and the second reaction chamber 1b The arrangement of the reaction chamber 1b is not particularly limited.

Moreover, like the electronic device 23 shown in FIG.3 (b), the condensation evaporation chamber 3a for condensing or evaporating said mobile component may be further included, and the condensation evaporation chamber 3a is the 1st reaction chamber 1a. The communication unit 5b communicates with the communication unit 5a between the first reaction chamber 1b and the second reaction chamber 1b. The condensing and evaporating chamber 3a is arranged in parallel with the two

reaction chambers

1a and 1b.

Alternatively, as in the electronic device 24 shown in FIG. 3 (c), it may further include a condensation evaporation chamber 3b for condensing or evaporating the mobile component, and the condensation evaporation chamber 3b is the first reaction chamber 1a. Further, either one of the second reaction chambers 1b (second reaction chamber 1b in FIG. 3C) communicates with another communication unit 5c. The condensing and evaporating chamber 3b is arranged in series with the two

reaction chambers

1a and 1b.

In the example of FIGS. 3B and 3C, the mobile component is a condensable component (that is, a component capable of phase change between a gas state (gas phase) and a liquid state (liquid phase)). It is not limited to this. For example, the mobile component may be a component capable of phase change between a gas state (gas phase) and a solid state (solid phase), in which case the

condensation evaporation chambers

3a and 3b are understood as sublimation chambers. Can be done.

FIG. 3 illustrates another embodiment of the present invention by way of example, and the number of reaction chambers, the number of condensing evaporation chambers or sublimation chambers present in some cases, and the arrangement thereof can be selected as appropriate. It is.

For the electronic device in another embodiment of the present invention, the same description as in the above embodiment can be applied unless otherwise specified.

For example, the electronic device of another embodiment illustrated in FIG. 3 preferably includes any one of the following features alone or in combination of two or more.
(I ′) In the first reaction chamber 1a and the second reaction chamber 1b, and any one of the connecting

portions

5a, 5b, and 5c that connect the condensing

evaporation chamber

3a or 3b, preferably in the connecting

portions

5b and 5c on the condensing evaporation chamber side. (Ii) a first chemical heat storage material is molded or packaged in the first reaction chamber 1a, and the molded or packaged gas is allowed to pass through, but the solid and liquid are not substantially allowed to pass through. The minimum cross-sectional dimension of the first chemical heat storage material formed is larger than the minimum cross-sectional dimension of the communication portion 5a, and / or the second chemical heat storage material is molded or packed in the second reaction chamber 1b. The minimum cross-sectional dimension of the second chemical heat storage material formed is greater than the minimum cross-sectional dimension of the communication part 5a (and preferably another communication part 5c, if present) (iii ') the condensation evaporation chamber 3a 3b is that the liquid has therein a trappable material, or condensation evaporation chamber 3a, at least a portion of the inner surface of the 3b, are composed of liquid from the trap substance

For these features, the same description as that of the embodiment described above with reference to FIGS. 1 and 12 is applied, and the same effect as this is achieved.

As mentioned above, although the electronic device in some embodiment of this invention was demonstrated, all these can change further.

In other words, all the electronic devices in the above-described embodiments use chemical heat storage materials, but instead use other heat storage materials that generate a phase changeable component with an endothermic phenomenon. Also good. In this case, the phase changeable component becomes the working medium of the device, and the component can move in a gaseous state from the reaction chamber, and the condensation evaporation chamber or the sublimation chamber described above is a chamber in which the phase changes (that is, the phase change chamber). ) And may function as a condensing evaporation chamber or a sublimation chamber.

Such other heat storage material can be appropriately selected according to the use of the electronic device of the present invention (for example, so as to exhibit an endothermic phenomenon by the heat generated by the heat-generating component). Other heat storage materials, like chemical heat storage materials, preferably exhibit an endothermic phenomenon at a temperature of, for example, 30 to 200 ° C., particularly 40 ° C. or more, further 50 ° C. or more, 150 ° C. or less, and further 120 ° C. It is preferable to exhibit an endothermic phenomenon at the following temperatures.

Examples of other heat storage materials that can be used in the present invention include at least one heat storage material selected from the group consisting of zeolite, silica gel, mesoporous silica, and activated carbon (hereinafter, also simply referred to as “zeolite etc.”). Any of these can, for example, reversibly adsorb and desorb water (or hydration reaction and dehydration reaction, and so on), and exhibit an endothermic phenomenon upon desorption of water.

In the formula, Z represents the composition of zeolite or the like as a representative, and x can take various values depending on the composition. Q ₄ can be, for example, about 30-80 kJ / mol for zeolite, depending on the specific composition. Such desorption of water proceeds depending on various conditions, for example, about 50 to 150 ° C. for zeolite, about 5 to 150 ° C. for silica gel, about 5 to 150 ° C. for mesoporous silica, and about 5 to 150 ° C. for activated carbon. Can do.

The zeolite is a so-called zeolite structure, that is, a crystalline hydrous aluminosilicate having a network structure in which SiO ₄ tetrahedron and AlO ₄ tetrahedron share apex oxygen and are connected in three dimensions as a basic skeleton. Zeolites can usually be represented by the general formula:
^{^{_{_{(M 1, M 2 1/2)}}}} m (Al m Si n O 2 (m + n)) · xH 2 O (n ≧ m)
M ¹ is a monovalent cation such as Li ⁺ , Na ⁺ , or K ⁺ , and M ² is a divalent cation such as Ca ²⁺ , Mg ²⁺ , or Ba ²⁺ .

Among these, zeolites that can be suitably used in the present invention include A-type zeolite (LTA), X-type zeolite (FAU), Y-type zeolite (FAU), beta-type zeolite (BEA), AlPO-5 (AFI), and the like. It is.

Silica gel is a three-dimensional structure of colloidal silica, and has a pore diameter of several nm to several tens of nm, a specific surface area of 5 to 1000 m / g, and can control the properties of the porous material over a wide range. Moreover, the primary particle surface of silica gel is covered with silanol, and polar molecules (such as water) are selectively adsorbed under the influence of silanol.

Mesoporous silica is a substance having uniform and regular pores made of silicon dioxide and having a pore diameter of about 2 to 10 nm.

Activated carbon is a “porous carbonaceous substance having pores”, which has a large specific surface area and adsorption capacity. The basic skeleton is a two-dimensional lattice planar structure in which carbon atoms are connected at an angle of 120 °. The two-dimensional lattice is irregularly stacked to form a crystal lattice, and this crystal lattice is randomly connected to be activated carbon. The voids between the crystal lattices are activated carbon pores, and water is adsorbed into the pores. .

These zeolites and the like are preferably preliminarily adsorbed with water when producing the electronic device of the present invention.

When zeolite or the like is used as the other heat storage material in the electronic apparatus of the present invention, water that is a condensable component serves as a working medium, and therefore, the embodiment using the above-described chemical heat storage material (produces water as a condensable component, The same function and effect can be obtained by the same mechanism as that of the working medium.

The electronic device of the present invention can be suitably used as a mobile electronic device such as a smart phone, a mobile phone, a tablet terminal, a laptop computer, a portable game machine, a portable music player, or a digital camera.

-CHP mounting example In the electronic device of the present invention, a chemical heat pump (CHP) mounting example in which various parts / members are applied as the first member / heating member 11 and the second member / thermal conductive member 13 will be described below. Although it demonstrates more concretely with reference, it is not limited to these.

(Mounting example 1)
Referring to FIG. 4, in this mounting example, the electronic device is a laptop PC (personal computer) 20a, and the heat generating component is CPU 11a. The chemical heat pump 10 includes a reaction chamber 1, a condensation evaporation chamber 3, and a communication unit 5 that communicates between them. The reaction chamber 1 is thermally coupled to the CPU 11a. For example, the reaction chamber 1 may be bonded to the CPU 11a using an adhesive whose thermal conductivity is increased with a metal filler or the like, but is not limited thereto. The condensation evaporation chamber 3 is not thermally coupled to either the lithium ion battery 13a or the housing 13b, and is thermally insulated. The condensation evaporation chamber 3 is preferably insulated from the CPU 11a (heat generating component).

In this mounting example, when the CPU 11a operates to generate heat and reaches a certain high temperature (depending on the chemical heat storage material to be used), heat is taken from the CPU 11a and the endothermic reaction of the chemical heat storage material in the reaction chamber 1 proceeds (at this time). The generated condensable component can be condensed in the condensing evaporation chamber 3), thereby reducing the temperature rise of the CPU 11 a, preferably stabilizing the temperature of the CPU 11 a, and maintaining the CPU 11 a below the heat resistant temperature. After that, when the operation of the CPU 11a is changed or stopped to a lower level and the temperature of the CPU 11a is lowered to a certain low temperature, the exothermic reaction of the chemical heat storage material proceeds in the reaction chamber 1 to give heat to the CPU 11a (condensation at this time). In the evaporation chamber 3, the condensable component can evaporate), whereby the temperature of the CPU 11 a can slightly increase. That is, the chemical heat pump 10 takes heat from the CPU 11a when the CPU 11a operates at a high temperature, and applies heat to the CPU 11a when the CPU 11a operates at a low temperature.

(Installation example 2)
Referring to FIG. 5, in this mounting example, the electronic device is a laptop PC 20a, and the heat generating component is a CPU 11a. The chemical heat pump 10 includes a reaction chamber 1, a condensation evaporation chamber 3, and a communication unit 5 that communicates between them. The reaction chamber 1 is thermally coupled to the CPU 11a. The condensation evaporation chamber 3 is thermally coupled to the housing 13b. For example, the reaction chamber 1 and the condensation / evaporation chamber 3 may be bonded to the CPU 11a and the housing 13b using an adhesive whose thermal conductivity is increased with a metal filler or the like, but is not limited thereto.

In this mounting example, when the CPU 11a operates to generate heat and reaches a certain high temperature (depending on the chemical heat storage material to be used), heat is taken from the CPU 11a and the endothermic reaction of the chemical heat storage material in the reaction chamber 1 proceeds. The condensable component generated by the reaction is condensed in the condensing evaporation chamber 3 to give heat to the housing 13b, thereby reducing the temperature rise of the CPU 11a, preferably stabilizing the temperature of the CPU 11a, and keeping the CPU 11a at the heat resistant temperature. It can maintain below (for example, 120 degrees C or less). After that, when the operation of the CPU 11a is changed or stopped to a lower level and the temperature of the CPU 11a is lowered to a certain low temperature, the exothermic reaction of the chemical heat storage material proceeds in the reaction chamber 1 and the condensation evaporation chamber 3 starts from the housing 13b. By depriving the heat, the condensable component evaporates, and as a result, the temperature of the CPU 11a slightly increases, the temperature of the housing 13b decreases, and can be maintained at a relatively low temperature (for example, 55 ° C. or lower). That is, the chemical heat pump 10 draws heat from the CPU 11a and releases the heat to the housing 13b when the CPU 11a operates at a high temperature, and gives heat to the CPU 11a and removes (cools) the heat from the housing 13b when operating at a low temperature.

(Mounting example 3)
Referring to FIG. 6, in this mounting example, the electronic device is a smartphone 20b, and the heat generating component is a power management IC 11b. The chemical heat pump 10 includes a reaction chamber 1, a condensation evaporation chamber 3, and a communication unit 5 that communicates between them. The reaction chamber 1 is thermally coupled to the power management IC 11b. The condensation evaporation chamber 3 is thermally coupled to the lithium ion battery 13a. For example, the reaction chamber 1 and the condensation evaporation chamber 3 may be bonded to the power management IC 11b and the lithium ion battery 13a, respectively, using an adhesive whose thermal conductivity is increased with a metal filler or the like, but is not limited thereto.

In this mounting example, when the power management IC 11b operates to generate heat and reaches a certain high temperature (depending on the chemical heat storage material used), the heat management IC 11b takes heat away and the endothermic reaction of the chemical heat storage material in the reaction chamber 1 proceeds. Then, the condensable component generated by this endothermic reaction is condensed in the condensing evaporation chamber 3 to give heat to the lithium ion battery 13a, thereby reducing the temperature rise of the power management IC 11b, and preferably the temperature of the power management IC 11b is increased. By stabilizing, the power management IC 11b can be maintained at a heat resistant temperature or lower (for example, 85 ° C. or lower). Thereafter, when the operation of the power management IC 11b is changed or stopped to a lower level and the temperature of the power management IC 11b is lowered to a certain low temperature, the exothermic reaction of the chemical heat storage material proceeds in the reaction chamber 1 and in the condensation evaporation chamber 3 The heat is removed from the lithium ion battery 13a and the condensable component evaporates. As a result, the temperature of the power management IC 11b slightly increases, the temperature of the lithium ion battery 13a decreases, and the life of the lithium ion battery 13a does not decrease. The temperature can be maintained below the temperature (for example, 40 ° C. or below). That is, the chemical heat pump 10 takes heat from the power management IC 11b when the power management IC 11b operates at a high temperature and releases heat to the lithium ion battery 13a, and applies heat to the power management IC 11b and removes heat from the lithium ion battery 13a when operated at a low temperature. (Cooling).

(Mounting example 4)
Referring to FIG. 7, in this mounting example, the electronic device is a smartphone 20b, and the heat generating components are two

power amplifiers

11c and 11c ′. The first chemical heat pump 10 includes a reaction chamber 1, a condensation evaporation chamber 3, and a communication unit 5 that communicates between them. The second chemical heat pump 10 ′ includes a reaction chamber 1 ′, a condensation evaporation chamber 3 ′, and a communication portion 5 ′ communicating between them. Reaction chamber 1 is thermally coupled to power amplifier 11c. The reaction chamber 1 ′ is thermally coupled to the power amplifier 11c ′.

Condensation evaporation chambers

3 and 3 ′ are thermally coupled to housing 13b. For example, the reaction chamber 1 and the condensation evaporation chamber 3 are bonded to the power amplifier 11c and the housing 13b, respectively, using an adhesive whose thermal conductivity is increased with a metal filler or the like, and the reaction chamber 1 ′ and the condensation evaporation chamber 3 ′ are bonded to each other. The power amplifier 11c ′ and the housing 13b may be bonded to each other, but are not limited thereto.

In this mounting example, when the band 1 is used, the power amplifier 11c operates to generate heat, and when the temperature reaches a certain level (depending on the chemical heat storage material used), the power amplifier 11c takes heat away from the chemical heat storage material in the reaction chamber 1. An endothermic reaction proceeds, and the condensable component generated by the endothermic reaction condenses in the condensing evaporation chamber 3 to give heat to the housing 13b, thereby reducing the temperature rise of the power amplifier 11c, and preferably the power amplifier 11c. Thus, the power amplifier 11c can be maintained at a heat resistant temperature or lower (for example, 85 ° C. or lower). Thereafter, the band 1 is switched to the band 2 to stop the operation of the power amplifier 11c and operate the power amplifier 11c '. Then, when the power amplifier 11c ′ operates to generate heat and reaches a certain high temperature (depending on the chemical heat storage material to be used), heat is taken from the power amplifier 11c ′ and the endothermic reaction of the chemical heat storage material in the reaction chamber 1 ′ proceeds. Then, the condensable component generated by the endothermic reaction is condensed in the condensing evaporation chamber 3 ′ to give heat to the housing 13b, thereby reducing the temperature rise of the power amplifier 11c ′, and preferably the power amplifier 11c ′. The temperature can be stabilized and the power amplifier 11c ′ can be maintained at a heat resistant temperature or lower (for example, 85 ° C. or lower). On the other hand, the temperature of the power amplifier 11c is lowered to a certain low temperature, the exothermic reaction of the chemical heat storage material proceeds in the reaction chamber 1, and the condensable component evaporates by removing heat from the housing 13b in the condensation evaporation chamber 3. As a result, the temperature of the power amplifier 11c slightly increases, and the temperature of the housing 13b decreases. Thereby, the housing | casing 13b can be maintained at comparatively low temperature (for example, 55 degrees C or less). That is, the

chemical heat pumps

10 and 10 ′ take heat from the

power amplifier

11c or 11c ′ during high-temperature operation by switching between the band 1 and the band 2, and give heat to the stopped

power amplifier

11c or 11c ′. Thus, it is possible to control the heat entering and leaving the housing 13b.

・ Simulation Next, the heat balance was simulated based on several models.

(Simulation model 1)
Based on the model simulating the configuration of an existing smartphone, first, the suitability of the analysis method (including various conditions) used in the simulation is verified in the case of a CPU heating value of 1.8 W (equal to the measured heating value). In addition, according to this analysis method, a simulation was performed in the case of a CPU heat generation amount of 7 W as a comparative example.

As shown in FIG. 8, an electronic device model 30 assumed in this simulation model includes an electronic circuit board 22 having a CPU 21a and a power management IC (PMIC) 21b mounted on the upper surface and the lower surface, a battery 24, and a camera unit 25, respectively. Are accommodated in an internal space between the chassis (upper thermal conductive member) 23a and the battery cover (lower thermal conductive member) 23b, and a display 26 is provided on the upper surface of the chassis 23a. The camera unit 25 contacts the electronic circuit board 22, the chassis 23a, and the battery cover 23b. The battery 24 is in contact with the chassis 23a and the battery cover 23b. The electronic circuit board 22 does not contact the battery 24 but contacts the battery cover 23b (the contact portion is not shown). The chassis 23 a comes into contact with the display 26, and the display 26 is exposed to the ambient atmosphere (air) 29. A part of the battery cover 23 b comes into contact with the human body 28, and the remaining part is exposed to the ambient atmosphere (air) 29. In this electronic device model 30, an assumed route through which heat can enter and exit is as indicated by double arrows in FIG.

The dimensions and heat generation amount of each member described above for the electronic device model 30 were set as shown in Table 1 below (in Table 1, the symbol “-” means zero heat generation). Among these members, the CPU 21a and the PMIC 21b are heat generating components, and the camera unit 25 and the battery 24 are also heat generating components, but the heat generation amount is very small compared to the CPU 21a and the PMIC 21b.

For each of these members, set physical properties such as density, specific heat, and thermal conductivity as appropriate to correspond to each member used in existing smartphones, and calculate the mc value (product of mass and specific heat) used. The density and specific heat were assumed to be constant regardless of the temperature.

The initial conditions and boundary conditions in this simulation were as follows.
Initial conditions:
The ambient atmosphere (air) 29 is a constant temperature of 25 ° C.
All members shall be at a temperature of 25 ° C.
boundary condition:
The CPU 21a, the PMIC 21b, the camera unit 25, and the battery 24 start to generate heat at t = 0 (the heat generation start time is set to t = 0).
The human body 28 has a constant temperature of 36 ° C., and at t = 0, 1/3 of the exposed surface of the battery cover 23b comes into contact with the human body 28 (heat transfer), and the remaining 2/3 is the ambient atmosphere (atmosphere). 29 to be exposed.
Heat transfer between the display 26 and the battery cover 23b and the ambient atmosphere (atmosphere) 29 is assumed to be convective heat transfer and radiant heat transfer.
In addition, unless otherwise specified, heat transfer is assumed to be conduction heat transfer.

CPU heat generation 1.8W (analysis of analysis method)
It was about 1.8W when the calorific value of CPU used for the existing smart phone was measured.
Therefore, first, a heat balance was simulated by applying the analysis method including the above-described various conditions / assumings with the heat generation amount of the CPU 21a in the electronic device model 30 set to 1.8 W. As a result of this simulation, the temperature of the CPU 21a rises to about 50 ° C. at t = about 100 seconds, rises to about 60 ° C. at t = about 1000 seconds, and becomes a quasi-steady state, and the temperature of the battery cover 23b Was shown to rise to about 40 ° C. at t = about 1000 seconds and become a quasi-steady state.
On the other hand, using an existing smartphone under the same conditions (an ambient atmosphere of 25 ° C. and 1/3 of the exposed surface of the battery cover 23b is brought into contact with a human body having a body temperature of about 36 ° C.) When the temperature was measured, the temperatures of the CPU and the battery cover in the pseudo steady state were 62 ° C. and 39 ° C., respectively, which were almost the same as the above simulation values.
Therefore, it was confirmed that the analysis method applied in this simulation is appropriate.

In case of CPU heat generation 7W (comparative example)
The amount of heat generated by the CPU 21a in the electronic device model 30 is an unknown, and the amount of heat generated by the CPU 21a at which the temperature of the CPU 21a is 130 ° C. in a quasi-steady state is obtained by simulation by applying the analysis method including the various conditions and assumptions described above. It became 7W. Setting the heat generation amount of the CPU to 7 W is a severe condition that cannot be assumed under normal use conditions of the CPU.
Then, assuming that the heat generation amount of the CPU 21a in the electronic device model 30 is 7 W, the heat balance was simulated by applying the analysis method including the various conditions / assums described above. As a result of this simulation, the temperature of the CPU 21a rises to 100 ° C. at t = about 100 seconds, rises to about 120 ° C. at t = about 400 seconds, and reaches a pseudo steady state of about 130 ° C. at t = about 1000 seconds. It was shown that the temperature of the battery cover 23b rose to about 53 ° C. in t = about 1000 seconds.

(Simulation model 2)
A simulation was performed on one model of the embodiment of the electronic apparatus of the present invention. This model is similar to the simulation model 1 described above, but is greatly different in that one chemical heat pump is installed. This simulation was performed in the case of a CPU heat generation amount of 7 W according to the same analysis method as in the simulation model 1.

As shown in FIG. 9, in the electronic device model 31 assumed in this simulation model, one chemical heat pump 10 is added, the reaction chamber 1 is the CPU 21a, and the condensation evaporation chamber 3 is the chassis (upper thermal conductive member) 23a. 8 and the electronic device model 30 of FIG. 8 except that the chassis 23a is separated from the battery 24 and the camera unit 25. In this electronic device model 31, an assumed route through which heat can enter and exit is as indicated by double arrows in FIG. However, in this electronic device model 31, the reaction chamber 1 can be switched between a state where it is insulated from other members and a state where it is thermally coupled to the CPU 21a.

Of this electronic device model 31, the dimensions and heat generation amount of each member excluding the chemical heat pump 10 (however, the CPU heat generation amount is only 7 W), physical properties such as density, specific heat, thermal conductivity, mc value, initial conditions and The boundary conditions are the same as those described above for the simulation model 1.

The chemical heat pump 10 is set and assumed as follows.
The reaction chamber 1 is a container made of SUS304 (outer dimensions 40 mm × 40 mm × 2.5 mm, wall thickness 0.25 mm) filled with 5.235 g of calcium sulfate. The condensing evaporation chamber 3 is a container made of SUS316 (outside dimensions 15 mm × 15 mm × 1.5 mm, wall thickness 0.25 mm) filled with 0.346 g of distilled water. About the reaction chamber 1 and the condensation evaporation chamber 3, physical property values, such as a density, specific heat, and heat conductivity, were set suitably according to each material, and mc value (product of mass and specific heat) was calculated and used.
The contact thermal resistance between the reaction chamber 1 and the CPU 21a and between the condensation evaporation chamber 3 and the chassis 23a is ignored.
About the communication part 5 which connects between the reaction chamber 1 and the condensation evaporation chamber 3, the heat transfer between these members is disregarded.
For the endothermic reaction of calcium sulfate hemihydrate and the exothermic reaction of calcium sulfate, a known chemical reaction rate equation (Chemical Engineering, Vol. 35, No. 4, pp. 390-395, 2009) is used.
Calcium sulfate hemihydrate / calcium sulfate has the form of spherical particles having an average particle size of 0.85 mm, and the expansion and contraction of the particles are ignored.
For water vapor, the diffusion resistance and the like are ignored, the temperature in the reaction chamber and the temperature in the condensation evaporation chamber are the same as the temperature of each container, the pressure in the condensation evaporation chamber is the pressure of saturated water vapor at that temperature, and the pressure in the reaction chamber is It shall be equal to the pressure in the condensing evaporation chamber in communication therewith.

In case of CPU heat generation amount 7W (Example 1)
Assuming that the heat generation amount of the CPU 21a in the electronic device model 31 is 7 W, the heat balance was simulated by applying the analysis method including various conditions / assums described above. In this simulation, the chemical heat pump 10 is operated in the heat release process and then in the heat storage process. The changes over time in the temperature of the CPU and reaction chamber in this simulation are shown in the graph and table of FIG. Specifically, it is as follows.

First, from the initial condition (t = 0), the heat generation amount of the CPU 21a is set to 7 W, and the reaction chamber 1 of the chemical heat pump 10 is adiabatic (thermally separated from the CPU 21a) until the temperature of the CPU 21a reaches 120 ° C. The reaction is allowed to proceed (indicated by symbol (1) in FIG. 10), and then the reaction chamber 1 and the CPU 21a are thermally coupled to start heat exchange (heat transfer), and the temperature of the CPU 21a is again 120 ° C. It was simulated until it reached. As a result of this simulation, the following was shown. At t = about 230 seconds, the temperature of the CPU 21a reaches 120 ° C. During this time, calcium sulfate reacts with water vapor in the reaction chamber 1 to generate heat at an average of about 1.7 W, and in the condensation evaporation chamber 3, latent heat 2 is generated due to water evaporation. The heat is absorbed at about 1 W, and the temperature of the reaction chamber 1 rises to 70 ° C. at t = about 230 seconds (indicated by symbol (2) in FIG. 10). Then, by thermally coupling the CPU 21a (120 ° C.) and the reaction chamber 1 (70 ° C.) at t = about 230 seconds, the temperature of the CPU 21a decreases to 85 ° C. at t = about 245 seconds ( (Indicated by symbol (3) in FIG. 10). Thereafter, calcium sulfate reacts with water vapor in the reaction chamber 1 and generates heat at an average of about 1.7 W, and the condensation evaporation chamber 3 continues to absorb heat with a latent heat of about 2.1 W due to evaporation of water, and the reaction chamber reaches t = about 360 seconds. 1 is 101 ° C. (indicated by symbol (4) in FIG. 10), and the reaction equilibrium pressure reaches the saturated water vapor pressure at the condensation evaporation chamber temperature of 16 ° C., so that the endothermic reaction in the reaction chamber 1 is completed. (Reaction rate about 97%). Thereafter, at t = 590 seconds, the temperatures of the CPU 21a and the reaction chamber 1 (container and inside) reach about 120 ° C. (indicated by symbol (5) in FIG. 10). During this time, the condensation evaporation chamber 3 continues to absorb heat with a latent heat of about 2.1 W due to water evaporation, and at t = 590 seconds, the temperature of the condensation evaporation chamber 3 (container and inside), the chassis 23a, and the display 26 reach about 17 ° C. descend. From the above, during t = 0 to 360 seconds, the chemical heat pump 10 operates in the heat release process (reaction rate is about 97%), and during t = 0 to 590 seconds, the temperature of the CPU 21a can be kept at 120 ° C. or lower. .

Subsequently (continuous from t = 590 seconds), the calorific value of the CPU 21a is set to 7 W, and the calcium sulfate semi-hydrated in the reaction chamber 1 at 120 ° C. while the reaction chamber 1 and the CPU 21a are thermally coupled. The simulation was performed until the product generated water vapor by endotherm and the reaction rate reached 90%. As a result of this simulation, the following was shown. In reaction chamber 1, calcium sulfate hemihydrate absorbs heat at an average of about 1.3 W and continues to release water vapor (heat storage), and during t = 590 to 1040 seconds (from the end of heat absorption to 450 seconds later) (FIG. 10). The temperature of the CPU 21a and the reaction chamber 1 (vessel and inside) is maintained at about 120 ° C. The water vapor generated during this period moves to the condensing and evaporating chamber 3 and dissipates heat with a latent heat of about 1.6 W when it becomes water, and at t = 1040 seconds, the condensing evaporating chamber 3 (container and inside), chassis 23a, display 26 Increases to about 28 ° C. In addition, the temperature of the battery cover 23b rises to about 55 ° C. at t = 1040 seconds. From the above, during t = 590 to 1040 seconds, the chemical heat pump 10 operates in the heat storage process (reaction rate 90%), and the temperature of the CPU 21a can be maintained at 120 ° C.

Therefore, according to this simulation, by installing the chemical heat pump 10, the CPU can be kept at 120 ° C. or lower for about 1040 seconds from the start of the CPU heat generation even in an extreme case where the heat generation amount of the CPU is as large as 7 W. found.

(Simulation model 3)
A simulation was performed on another model of the embodiment of the present invention. This model is similar to the model used in the simulation model 1, but is greatly different in that two chemical heat pumps are mounted. This simulation was performed in the case of a CPU heat generation amount of 7 W according to the same analysis method as in the simulation model 1.

As shown in FIG. 11, the electronic device model 32 assumed in this simulation model includes two

chemical heat pumps

10 and 10 ′, the reaction chamber 1 as a CPU 21 a, and the reaction chamber 1 ′ as a battery cover (lower heat 8 is the same as the electronic device model 30 of FIG. 8 except that it is attached to the conductive member 23b and the

condensation evaporation chambers

3 and 3 ′ are attached to each other. In this electronic device model 32, an assumed route through which heat can enter and exit is as shown by double arrows in FIG.

Of the electronic device model 32, the dimensions and heat generation amount of each member excluding the

chemical heat pumps

10 and 10 ′ (however, the CPU heat generation amount is only 7 W), physical properties such as density, specific heat, thermal conductivity, mc value, The initial conditions and boundary conditions are the same as those described above for the simulation model 1.

The

chemical heat pumps

10 and 10 ′ are set and assumed as follows, and the same settings and assumptions as those described above for the chemical heat pump 10 in the simulation model 2 apply unless otherwise specified. (However, the chemical substance charged into the reaction chamber 1 is calcium sulfate hemihydrate (5.235 g in terms of calcium sulfate), and the chemical substance charged into the reaction chamber 1 ′ is calcium sulfate (5.235 g).)
The contact thermal resistance between the reaction chamber 1 and the CPU 21a, between the reaction chamber 1 ′ and the battery cover 23b, and between the condensation evaporation chamber 3 and the condensation evaporation chamber 3 ′ is ignored.
About the communication part 5 which communicates between the reaction chamber 1 and the condensation evaporation chamber 3, and the communication part 5 'which communicates between the reaction chamber 1' and the condensation evaporation chamber 3 ', the heat transfer between these members is ignored. To do.
The condensation evaporation chamber 3 and the condensation evaporation chamber 3 ′ are assumed to be insulated from other members.

In the case of CPU heat generation amount 7 W (Example 2)
Assuming that the heat generation amount of the CPU 21a in the electronic device model 32 is 7 W, the heat balance was simulated by applying the analysis method including various conditions / assums described above. In this simulation, first, the

chemical heat pumps

10 and 10 ′ are not operated, and then the chemical heat pump 10 is operated in the heat release process, and at the same time, the chemical heat pump 10 ′ is operated in the heat release process. Specifically, it is as follows.

First, from the initial condition (t = 0), the heat generation amount of the CPU 21a was set to 7 W, and the temperature until the temperature of the CPU 21a reached 120 ° C. without operating the

chemical heat pumps

10 and 10 ′ was simulated. As a result, at t = 800 seconds, the temperature of the CPU 21a and the reaction chamber 1 (container and inside) rose to 120 ° C.

Thereafter (continuous from t = 800 seconds), the heating value of the CPU 21a is set to 7 W, and in the reaction chamber 1 at 120 ° C., the calcium sulfate hemihydrate generates water vapor due to endotherm, and the reaction rate reaches 100%. Was simulated. As a result of this simulation, the following was shown. In the reaction chamber 1, the calcium sulfate hemihydrate absorbs heat at an average of about 1.3 W and continues to release water vapor (heat storage). During t = 800 to 1300 seconds (from the end of the endotherm to 500 seconds), the CPU 21a and The temperature of the reaction chamber 1 (vessel and inside) is maintained at about 120 ° C. The water vapor generated during this period moves to the condensation evaporation chamber 3 and dissipates heat with a latent heat of about 1.6 W when it becomes water, but the condensation evaporation chamber 3 is heated by the condensation evaporator 3 ′ that is thermally coupled thereto. Cool and maintain at about 25 ° C. From the above, during t = 800 to 1300 seconds, the chemical heat pump 10 operates in the heat storage process (reaction rate 100%), and the temperature of the CPU 21a can be maintained at 120 ° C.

At the same time (continuous from t = 800 seconds), simulation was performed until the water evaporated in the condenser evaporator 3 'and reached t = 1300 seconds. As a result of this simulation, the following was shown. When the water becomes steam in the condenser evaporator 3 ′, it absorbs heat with a latent heat of about 2.1 W, and the generated steam moves to the reaction chamber 1 ′ and reacts with calcium sulfate to generate heat with about 1.7 W. (Heat radiation). At t = 1190 seconds (390 seconds from the start of heat generation), the reaction rate reaches 100%, and the heat release in the reaction chamber 1 'is completed. During t = 800-1190 seconds, the temperature of the condensation evaporation chamber 3 '(vessel and interior) is maintained at about 25 ° C. The temperature of the battery cover 23b also has a sensible heat effect of calcium sulfate / calcium sulfate hemihydrate, and only rises to about 52 ° C. at t = 1300 seconds. This is 1 ° C. lower than the temperature of the battery cover 23b in the comparative example of the simulation model 1 described above. From the above, during t = 800 to 1190 seconds, the chemical heat pump 10 'operates in the heat dissipation process (reaction rate 100%).

Therefore, according to this simulation, by installing the

chemical heat pumps

10 and 10 ′, the CPU is kept at 120 ° C. or lower for about 1300 seconds from the start of the CPU heat generation even in an extreme case where the heat generation amount of the CPU is as large as 7 W. It turns out that it can keep.

The present invention can be suitably used in, for example, mobile electronic devices such as smartphones, mobile phones, tablet terminals, laptop computers, portable game machines, portable music players, and digital cameras, but is not limited thereto. It is not a thing.

This application claims priority based on Japanese Patent Application No. 2012-173042, filed on August 3, 2012, the entire contents of which are incorporated herein by reference.

1, 1a, 1b, 1 'reaction chamber 2a solid phase (including chemical heat storage material)
2b Gas phase (condensable components included)
3, 3a, 3b, 3 'condensing evaporation chamber 4a gas phase (condensable component included)
4b Liquid phase (condensable components included)
5, 5a, 5b, 5c, 5 'connecting part 10, 10' chemical heat pump (device)
DESCRIPTION OF SYMBOLS 11 Heat-emitting component 13 Thermal

conductive member

20, 21, 22, 23, 24 Electronic device 21a CPU
21b Power management IC
22 Electronic circuit board 23a Chassis 23b Battery cover 24 Battery 25 Camera unit 26 Display 28 Human body 29 Ambient atmosphere (atmosphere)
30, 31, 32 Electronic equipment model

Claims

Heat-generating parts,
A reaction chamber containing a chemical heat storage material that exhibits an endothermic reaction by heat generated by a heat-generating component, a condensation evaporation chamber for condensing or evaporating a condensable component generated by the endothermic reaction of the chemical heat storage material, and a condensable component condensing with the reaction chamber An electronic apparatus comprising: a device having a communication unit that communicates between a reaction chamber and a condensation evaporation chamber so as to be movable between the evaporation chambers.
The electronic device according to claim 1, wherein the communication unit includes a filter that allows gas to pass through but does not allow substantially solid and liquid to pass through.
3. The electronic device according to claim 1, wherein the chemical heat storage material is molded or packed in the reaction chamber, and the minimum cross-sectional dimension of the molded or packed chemical heat storage material is larger than the minimum cross-sectional dimension of the connecting portion.
The condensation evaporation chamber has a substance capable of trapping liquid therein, or at least a part of the inner surface of the condensation evaporation chamber is made of a substance capable of trapping liquid. The electronic device described.
The reaction chamber has a portion made of a heat conductive material, and the portion made of the heat conductive material is disposed in direct or indirect contact with the heat-generating component. Electronic equipment.
The electronic device further includes a heat conductive member,
The condensation evaporation chamber has a portion made of a heat conductive material, and the portion made of the heat conductive material is disposed in direct or indirect contact with the heat conductive member. The electronic device in any one.
The electronic device according to claim 6, wherein the heat conductive member is selected from the group consisting of a housing of the electronic device, a battery exterior, a substrate, and a display.
The electronic device according to any one of claims 1 to 7, wherein the heat generating component is selected from the group consisting of an integrated circuit, a light emitting element, a field effect transistor, a motor, a coil, a converter, an inverter, and a capacitor.
A first member and a second member;
A reaction chamber containing a chemical heat storage material that exhibits reversible endothermic and exothermic reactions, a condensation evaporation chamber for condensing or evaporating condensable components generated by the endothermic reaction of the chemical heat storage material, and a reaction chamber and a condensation evaporation chamber An electronic device including a device including a communication unit that communicates, wherein the first member and the reaction chamber are thermally coupled, and the condensation evaporation chamber and the second member are thermally coupled.
10. The electronic device according to claim 9, wherein the communication unit includes a filter that allows gas to pass through but does not allow substantially solid and liquid to pass through.
The electronic device according to claim 9 or 10, wherein the chemical heat storage material is molded or packed in the reaction chamber, and the minimum cross-sectional dimension of the molded or packed chemical heat storage material is larger than the minimum cross-sectional dimension of the connecting portion.
The condensation evaporation chamber has a substance capable of trapping liquid therein, or at least a part of the inner surface of the condensation evaporation chamber is made of a substance capable of trapping liquid. The electronic device described.
When the temperature of the first member rises and / or when the temperature of the second member falls, heat is transferred from the first member to the reaction chamber, and the chemical heat storage material generates a condensable component by an endothermic reaction in the reaction chamber. In the gaseous state, the condensable component moves from the reaction chamber to the condensing and evaporating chamber through the communication section, the condensable component condenses in the condensing and evaporating chamber to generate heat, and heat is transferred from the condensing and evaporating chamber to the second member The electronic device according to any one of claims 9 to 12.
When the temperature of the first member decreases and / or when the temperature of the second member increases, heat is transferred from the reaction chamber to the first member, an exothermic reaction occurs in the reaction chamber, and the condensable component is consumed, The condensable component in the gaseous state moves from the condensing evaporation chamber to the reaction chamber through the connecting portion, and the condensable component condensed in the condensing evaporation chamber gains heat and evaporates, and heat is transferred from the second member to the condensing evaporation chamber. The electronic device according to any one of claims 9 to 13, wherein:
The electronic device according to any one of claims 1 to 14, wherein the condensable component is water.
An electronic device having a function of suppressing the temperature rise of the heat generating component,
Heat-generating parts,
Including at least one reaction chamber containing the chemical heat storage material, and conducting heat generated by the heat generating component from the outer surface of the heat generation component to the chemical heat storage material stored in the at least one reaction chamber. Electronic equipment that suppresses temperature rise of heat-generating components by absorbing heat.
The electronic device includes a first reaction chamber containing a first chemical heat storage material and a second reaction chamber containing a second chemical heat storage material,
The first chemical heat storage material and the second chemical heat storage material absorb heat or generate heat due to a reaction involving the same component,
The first reaction chamber and the second reaction chamber are in communication with each other so that the components can move by a communication portion between them.
The electronic device according to claim 16, wherein heat generated by the heat generating component is conducted to either the first chemical heat storage material of the first reaction chamber or the second chemical heat storage material of the second reaction chamber.
The first chemical heat storage material is molded or packed in the first reaction chamber, and the minimum cross-sectional dimension of the molded or packed first chemical heat storage material is larger than the minimum cross-sectional dimension of the connecting portion. Electronics.
The second chemical heat storage material is molded or packed in the second reaction chamber, and the minimum cross-sectional dimension of the molded or packed second chemical heat storage material is larger than the minimum cross-sectional dimension of the connecting portion. The electronic device described.
The electronic device further comprises a condensation evaporation chamber for condensing or evaporating the components;
The electronic device according to any one of claims 17 to 19, wherein the condensing and evaporating chamber is in communication with the communication portion between the first reaction chamber and the second reaction chamber so that the component can move.
In any of the communication part between the first reaction chamber and the second reaction chamber and the communication part that leads from the communication part to the condensation evaporation chamber, gas can pass but solids and liquids cannot pass substantially. The electronic device according to claim 20, further comprising a filter.
The electronic device further comprises a condensation evaporation chamber for condensing or evaporating the components;
The electronic device according to any one of claims 17 to 19, wherein the condensing and evaporating chamber is in communication with either the first reaction chamber or the second reaction chamber so that the component can be moved by another communication unit. .
23. The electronic device according to claim 22, wherein the another communication unit includes a filter that allows gas to pass but does not allow substantially solid and liquid to pass through.
The condensation evaporation chamber has a substance capable of trapping liquid therein, or at least a part of the inner surface of the condensation evaporation chamber is made of a substance capable of trapping liquid. The electronic device as described in.
The electronic device according to any one of claims 20 to 24, wherein the component is water.
The electronic device according to any one of claims 1 to 25, wherein the chemical heat storage material exhibits an endothermic reaction at a temperature of 30 to 200 ° C.
27. The electronic device according to claim 1, wherein at least one heat storage material selected from the group consisting of zeolite, silica gel, mesoporous silica, and activated carbon is used instead of the chemical heat storage material.