US20200132388A1 - Cooling device - Google Patents
Cooling device Download PDFInfo
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- US20200132388A1 US20200132388A1 US16/198,551 US201816198551A US2020132388A1 US 20200132388 A1 US20200132388 A1 US 20200132388A1 US 201816198551 A US201816198551 A US 201816198551A US 2020132388 A1 US2020132388 A1 US 2020132388A1
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- Prior art keywords
- tank
- cooling device
- liquid
- vapor
- heat source
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
Definitions
- the present disclosure relates to a cooling device, more particularly to a cooling device including a tank inlet and a tank outlet.
- a common immersion cooling device includes a tank, which is divided to a liquid portion and a vapor portion.
- the liquid portion is located below the vapor portion and configured to accommodate a cooling liquid which is volatile and low boiling, and there is a heat dissipation device in the vapor portion.
- a server can be immersed into the cooling liquid for the cooling liquid to absorb heat generated by the server. A portion of the cooling liquid would evaporate into vapor by the heat. When the vapor flows to the vapor portion, the heat in the vapor can be removed by the heat dissipation device, the then the vapor is condensed into the cooling liquid and drops back to the liquid portion of the tank due to gravity.
- a cooling device is configured to cool a heat source.
- the cooling device includes a tank, a cover and a cooling liquid.
- the tank includes a bottom surface, a tank inlet and a tank outlet.
- the cover is disposed on the tank. The cover and the tank form a space therebetween, and the space is configured to accommodate the heat source.
- the cooling liquid is located in the space.
- FIG. 1 is an exploded cross-sectional view of a cooling device and a heat source according to one embodiment of the present disclosure
- FIG. 2 is a cross-sectional view of the cooling device when the heat source is disposed in the cooling device;
- FIG. 3 is a cross-sectional view of the cooling device during the operation of the heat source in FIG. 1 ;
- FIG. 4 is a cross-sectional view of a cooling device according to another embodiment of the present disclosure during the operation of the heat source;
- FIG. 5 is a cross-sectional view of a cooling device according to yet another embodiment of the present disclosure during the operation of the heat source;
- FIG. 6 is a cross-sectional view of a cooling device according to still another embodiment of the present disclosure during the operation of the heat source;
- FIG. 7 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source;
- FIG. 8 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source;
- FIG. 9 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source;
- FIG. 10 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source.
- FIG. 11 is a cross-sectional view of the cooling device and the heat source in FIG. 10 when the operation is completed.
- FIG. 1 is an exploded cross-sectional view of a cooling device and a heat source according to one embodiment of the present disclosure
- FIG. 2 is a cross-sectional view of the cooling device when the heat source is disposed in the cooling device.
- This embodiment provides a cooling device 10 a (e.g., an immersion cooling device) configured to cool a heat source 20 (e.g., a server).
- the cooling device 10 a includes a tank 100 a , a cover 200 a and a cooling liquid 300 a .
- the tank 100 a includes a bottom surface 110 a , a tank inlet 120 a and a tank outlet 130 a .
- the tank 100 a may be placed on a platform P (e.g., a table) in a way that the bottom surface 110 a of the tank 100 a faces the platform P.
- the cover 200 a is disposed on the tank 100 a .
- the cover 200 a and the bottom surface 110 a are respectively located at two opposite sides of the tank 100 a , but the disclosure is not limited thereto. In some other embodiments, the cover and the bottom surface may be located adjacent to each other. In this embodiment, the cover 200 a and the tank 100 a form a space S therebetween. The space S is configured to accommodate the heat source 20 . The cooling liquid 300 a is located in the space S.
- a liquid level 310 a of the cooling liquid 300 a is located farther away from the bottom surface 110 a of the tank 100 a than the heat source 20 , and the heat source 20 is completely immersed in the cooling liquid 300 a , but the disclosure is not limited thereto.
- the heat source may be partially immersed in the cooling liquid.
- the cooling liquid 300 a is volatile, non-conductive and low boiling liquid, such as refrigerant, but the disclosure is not limited thereto.
- the cooling liquid may be pure water or liquid fluoride.
- a permittivity of the cooling liquid 300 a is close to 1. In this embodiment and some embodiments of the present disclosure, the permittivity of the cooling liquid 300 a is approximately 1.8.
- heat generated by the heat source 20 is absorbed by the cooling liquid 300 a so as to cause the cooling liquid 300 a to evaporate into vapor form (e.g., vapor 320 a shown in FIG. 2 ), and the vapor 320 a may be discharged out of the space S via the tank outlet 130 a , thereby dissipating the heat. Therefore, there would not be too much vapor 320 a remaining in the space S, such that less of the vapor 320 a would escape from the opening for receiving the cover 200 a when the cover is removed.
- the cooling device 10 a further includes a liquid channel 400 a and a vapor channel 500 a , the liquid channel 400 a is connected to the tank inlet 120 a , and the vapor channel 500 a is connected to the tank outlet 130 a .
- the cooling liquid 300 a may be poured into the liquid channel 400 a to flow into the space S and to replenish the evaporated cooling liquid 300 a .
- the vapor 320 a may flow into the vapor channel 500 a via the tank outlet 130 a .
- the vapor 320 a has a lower density than that of the cooling liquid 300 a , a volume flow rate of the vapor 320 a is higher than that of the cooling liquid 300 a ; therefore, to reach a balance of mass flow rate between the tank inlet 120 a and the tank outlet 130 a , an inner diameter of the vapor channel 500 a may be larger than an inner diameter of the liquid channel 400 a , but the disclosure is not limited thereto. In some other embodiments, the balance may also be reached by increasing the quantity of the vapor channel.
- FIG. 3 is a cross-sectional view of the cooling device during the operation of the heat source in FIG. 1 .
- a part of the cooling liquid 300 a was evaporated into vapor form (i.e., vapor 320 a ), and then the liquid level 310 a of the cooling liquid 300 a is fallen to a liquid level 310 a ′.
- the vapor 320 a leaves the space S from the tank outlet 130 a , and the cooling liquid 300 a flows into the space S via the tank inlet 120 to replenish the evaporated cooling liquid 300 a .
- the tank inlet 120 a of the tank 100 a is located closer to the bottom surface 110 a of the tank 100 a than the tank outlet 130 a , but the disclosure is not limited thereto. In some other embodiments, the tank inlet and the tank outlet may be located at the same level.
- the vapor channel 500 a includes an inlet end 510 a and an outlet end 520 a .
- the inlet end 510 a is connected to the tank outlet 130 a of the tank 100 a , and a distance Dla between the inlet end 510 a and the bottom surface 110 a is substantially equal to a distance D 2 a between the outlet end 520 a and the bottom surface 110 a .
- the inlet end 510 a and the outlet end 520 a are substantially located at the same level, but the disclosure is not limited thereto.
- FIG. 4 is a cross-sectional view of a cooling device according to another embodiment of the present disclosure during the operation of the heat source.
- This embodiment provides a cooling device 10 b , which is similar to the aforementioned cooling device 10 a , thus a detailed description of the similar features between these embodiments may not be repeated.
- a distance Dlb of an inlet end 510 b and a bottom surface 110 b of the cooling device 10 b is smaller than a distance D 2 b of an outlet end 520 b and the bottom surface 110 b of the cooling device 10 b .
- a vapor channel 500 b is disposed to a tank 100 b in an inclined manner.
- a liquid level 310 b of a cooling liquid 300 b is allowed to be closer to a cover 200 b and the cooling liquid 300 b is allowed flows into the inlet end 510 b and occupy a portion of the vapor channel 500 b , ensuring only the vapor form of the cooling liquid 300 b (i.e., vapor 320 b ) to pass through the outlet end 520 b of the vapor channel 500 b.
- FIG. 5 is a cross-sectional view of a cooling device according to yet another embodiment of the present disclosure during the operation of the heat source.
- This embodiment provides a cooling device 10 c , which is similar to the aforementioned cooling device 10 a , thus a detailed description of the similar features between these embodiments may not be repeated.
- a cover 200 c of the cooling device 10 c includes a first side 210 c and a second side 220 c , a distance D 3 between the first side 210 c and a bottom surface 110 c is larger than a distance D 4 between the second side 220 c and the bottom surface 110 c .
- the first side 210 c is located farther away from the bottom surface 110 c of the tank 100 c than the second side 220 c .
- first side 210 c is closer to a tank outlet 130 c of a tank 100 c than the second side 220 c , such that the vapor form of the cooling liquid 300 c (i.e., vapor 320 c ) tends to flow toward the first side 210 c . Consequently, the vapor 320 c would easily leave the space S via the tank outlet 130 c.
- the vapor form of the cooling liquid 300 c i.e., vapor 320 c
- FIG. 6 is a cross-sectional view of a cooling device according to still another embodiment of the present disclosure during the operation of the heat source.
- This embodiment provides a cooling device 10 d , which is similar to the aforementioned cooling device 10 a , thus a detailed description of the similar features between these embodiments may not be repeated.
- the cooling device 10 d further includes a heat exchange portion 600 d .
- the heat exchange portion 600 d is, for example, a tube, but the disclosure is not limited thereto. In some other embodiments, the heat exchange portion may be another tank.
- the heat exchange portion 600 d includes a first end 610 d and a second end 620 d .
- the first end 610 d is connected to a vapor channel 500 d and the second end 620 d is connected to a liquid channel 400 d .
- the vapor 320 d flows to the first end 610 d of the heat exchange portion 600 d from the vapor channel 500 d .
- the heat exchange portion 600 d is configured to provide an extra space for the processes of condensation and evaporation of a cooling liquid 300 d to occur (i.e., the transition from the cooling liquid 300 d and vapor 320 d ).
- the vapor 320 d turns into the cooling liquid 300 d in the heat exchange portion 600 d and flows back to the liquid channel 400 d through the second end 620 d due to gravity.
- the cooling liquid 300 d in the space S is able to be evaporated into the gaseous phase and then is condensed to flow back to the space S, forming a circulation without losing any of it.
- FIG. 7 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source.
- This embodiment provides a cooling device 10 e , which is similar to the aforementioned cooling device 10 a , thus a detailed description of the similar features between these embodiments may not be repeated.
- the cooling device 10 e further includes a heat dissipation device 700 e .
- the heat dissipation device 700 e is, for example, a liquid cooling device and is connected to a heat exchange portion 600 e .
- the heat dissipation device 700 e is able to absorb and then dissipate heat in the vapor 320 e in the heat exchange portion 600 e . Therefore, the heat dissipation device 700 e is able to accelerate the phase transition of the cooling liquid 300 e .
- the heat dissipation device may be a fan that is not in contact with the heat exchange portion; in such a case, the airflow generated by the fan also helps to accelerate the phase transition of the cooling liquid.
- FIG. 8 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source.
- This embodiment provides a cooling device 10 f , which is similar to the aforementioned cooling device 10 a , thus a detailed description of the similar features between these embodiments may not be repeated.
- the cooling device 10 f further includes an electrical connector 800 f disposed at a cover 200 f .
- the electrical connector 800 f is located in a hole (not shown in the figures) of the cover 200 f and is electrically connected to the heat source 20 via a wire 22 located in the tank 100 f .
- the electrical connector 800 f is configured to transmit electricity or signal to the heat source 20 or receive electricity or signal from the heat source 20 . This allows the heat source 20 to exchange electrical power or signal to another external device through the wire 22 and the electrical connector 800 f .
- the hole of the cover 200 may be, for example, in a square shape, and the electrical connector 800 f is easier to be sealed to the cover 200 f with respect to the conventional gap between the wire and the tank. As a result, the air-tightness of the tank 100 f is increased with respect to the conventional tank.
- FIG. 9 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source.
- This embodiment provides a cooling device 10 g , which is similar to the aforementioned cooling device 10 a , thus a detailed description of the similar features between these embodiments may not be repeated.
- the cooling device 10 g further includes a liquid pump device 900 g , and a heat exchange portion 600 g is a tank.
- the liquid pump device 900 g is connected to and disposed on a liquid channel 400 g and is connected to a tank 100 g and the heat exchange portion 600 g via the liquid channel 400 g .
- a cooling liquid 300 g in the space S can be completely pumped to the heat exchange portion 600 g by the liquid pump device 900 g .
- the vapor form of the cooling liquid 300 g is prevented from escaping from the opening for receiving a cover 200 g when the cover 200 g is removed.
- a valve (not shown in the figures) disposed in the liquid pump device 900 g for preventing the cooling liquid 300 g from flowing back to the space S.
- the valve is switched on.
- the valve is optional, and the disclosure is not limited thereto.
- FIG. 10 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source
- FIG. 11 is a cross-sectional view of the cooling device and the heat source in FIG. 10 when the operation is completed.
- This embodiment provides a cooling device 10 h , which is similar to the aforementioned cooling device 10 a , thus a detailed description of the similar features between these embodiments may not be repeated.
- the cooling device 10 h further includes an air pump device 1000 h located in a heat exchange portion 600 h which is connected to a tank 100 g via a vapor channel 500 h .
- the space S may be filled with air A with the help of the air pump device 1000 h so as to force a cooling liquid 300 h and a vapor 320 h to move toward the heat exchange portion 600 h .
- the air pump device 1000 h may be disposed in the air pump device 1000 h for preventing the air A from flowing back to the heat exchange portion 600 h .
- the valve is switched on.
- the valve is optional, and the disclosure is not limited thereto.
- the cooling device in the embodiments abovementioned, when the heat source and the cooling liquid are both accommodated in the space, heat generated by the heat source is absorbed by the cooling liquid so as to cause the cooling liquid to evaporate into vapor form, and the vapor may be discharged out of the space via the tank outlet, thereby dissipating the heat. Therefore, there would not be too much vapor remaining in the space, such that less of the vapor would escape from the opening for receiving the cover when the cover is removed.
- the cooling device further includes a liquid channel and a vapor channel, the liquid channel is connected to the tank inlet, and the vapor channel is connected to the tank outlet.
- an inner diameter of the vapor channel may be larger than an inner diameter of the liquid channel.
- the tank inlet of the tank is located closer to the bottom surface of the tank than the tank outlet. Generally, liquid tends to flow down and gas tends to go up.
- the vapor channel is disposed to the tank in an inclined manner. Accordingly, the liquid level of the cooling liquid is allowed to be closer to the cover and the cooling liquid is allowed flows into the inlet end and occupy a portion of the vapor channel, ensuring only the vapor form of the cooling liquid to pass through the outlet end of the vapor channel.
- the first side is located farther away from the bottom surface than the second side.
- the first side is closer to the tank outlet than the second side, such that the vapor form of the cooling liquid tends to flow toward the first side. Consequently, the vapor would easily leave the space via the tank outlet.
- the cooling device further includes a heat exchange portion.
- the heat exchange portion is configured to provide an extra space for the processes of condensation and evaporation of the cooling liquid to occur (i.e., the transition from the cooling liquid and vapor).
- the vapor turns into the cooling liquid in the heat exchange portion and flows back to the liquid channel through the second end due to gravity.
- the cooling liquid in the space is able to be evaporated into the gaseous phase and then is condensed to flow back to the space, forming a circulation without losing any of it.
- the cooling device further includes a heat dissipation device.
- the heat dissipation device is able to absorb and then dissipate heat in the vapor in the heat exchange portion. Therefore, the heat dissipation device is able to accelerate the phase transition of the cooling liquid.
- the cooling device further includes an electrical connector disposed at the cover.
- the electrical connector is located in a hole of the cover and is electrically connected to the heat source via a wire located in the tank.
- the electrical connector is configured to transmit electricity or signal to the heat source or receive electricity or signal from the heat source. This allows the heat source to exchange electrical power or signal to another external device through the wire and the electrical connector.
- the hole of the cover may be, for example, in a square shape, and the electrical connector is easier to be sealed to the cover with respect to the conventional gap between the wire and the tank. As a result, the air-tightness of the tank is increased with respect to the conventional tank.
- the cooling device further includes a liquid pump device, and the heat exchange portion is a tank.
- the cooling liquid in the space can be completely pumped to the heat exchange portion by the liquid pump device. By doing so, the vapor form of the cooling liquid is prevented from escaping from the opening for receiving the cover when the cover is removed.
- the cooling device further includes an air pump device.
- the space may be filled with air with the help of the air pump device so as to force the cooling liquid and the vapor to move toward the heat exchange portion. By doing so, most in the space is the air and vapor form of the cooling liquid is prevented from escaping from the opening for receiving the cover when the cover is removed.
Abstract
A cooling device is configured to cool a heat source. The cooling device includes a tank, a cover and a cooling liquid. The tank includes a bottom surface, a tank inlet and a tank outlet. The cover is disposed on the tank. The cover and the tank form a space therebetween, and the space is configured to accommodate the heat source. The cooling liquid is located in the space.
Description
- This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s). 201811263995.5 filed in China, P.R.C. on Oct. 26, 2018, the entire contents of which are hereby incorporated by reference.
- The present disclosure relates to a cooling device, more particularly to a cooling device including a tank inlet and a tank outlet.
- A common immersion cooling device includes a tank, which is divided to a liquid portion and a vapor portion. The liquid portion is located below the vapor portion and configured to accommodate a cooling liquid which is volatile and low boiling, and there is a heat dissipation device in the vapor portion. A server can be immersed into the cooling liquid for the cooling liquid to absorb heat generated by the server. A portion of the cooling liquid would evaporate into vapor by the heat. When the vapor flows to the vapor portion, the heat in the vapor can be removed by the heat dissipation device, the then the vapor is condensed into the cooling liquid and drops back to the liquid portion of the tank due to gravity.
- According to one aspect of the present disclosure, a cooling device is configured to cool a heat source. The cooling device includes a tank, a cover and a cooling liquid. The tank includes a bottom surface, a tank inlet and a tank outlet. The cover is disposed on the tank. The cover and the tank form a space therebetween, and the space is configured to accommodate the heat source. The cooling liquid is located in the space.
- The present disclosure will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only and thus are not intending to limit the present disclosure and wherein:
-
FIG. 1 is an exploded cross-sectional view of a cooling device and a heat source according to one embodiment of the present disclosure; -
FIG. 2 is a cross-sectional view of the cooling device when the heat source is disposed in the cooling device; -
FIG. 3 is a cross-sectional view of the cooling device during the operation of the heat source inFIG. 1 ; -
FIG. 4 is a cross-sectional view of a cooling device according to another embodiment of the present disclosure during the operation of the heat source; -
FIG. 5 is a cross-sectional view of a cooling device according to yet another embodiment of the present disclosure during the operation of the heat source; -
FIG. 6 is a cross-sectional view of a cooling device according to still another embodiment of the present disclosure during the operation of the heat source; -
FIG. 7 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source; -
FIG. 8 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source; -
FIG. 9 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source; -
FIG. 10 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source; and -
FIG. 11 is a cross-sectional view of the cooling device and the heat source inFIG. 10 when the operation is completed. - In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
- Please refer to
FIG. 1 toFIG. 2 ,FIG. 1 is an exploded cross-sectional view of a cooling device and a heat source according to one embodiment of the present disclosure, andFIG. 2 is a cross-sectional view of the cooling device when the heat source is disposed in the cooling device. - This embodiment provides a
cooling device 10 a (e.g., an immersion cooling device) configured to cool a heat source 20 (e.g., a server). Thecooling device 10 a includes atank 100 a, acover 200 a and acooling liquid 300 a. Thetank 100 a includes abottom surface 110 a, atank inlet 120 a and atank outlet 130 a. As shown in the figure, thetank 100 a may be placed on a platform P (e.g., a table) in a way that thebottom surface 110 a of thetank 100 a faces the platform P. Thecover 200 a is disposed on thetank 100 a. In this embodiment and some embodiments of the present disclosure, thecover 200 a and thebottom surface 110 a are respectively located at two opposite sides of thetank 100 a, but the disclosure is not limited thereto. In some other embodiments, the cover and the bottom surface may be located adjacent to each other. In this embodiment, thecover 200 a and thetank 100 a form a space S therebetween. The space S is configured to accommodate theheat source 20. Thecooling liquid 300 a is located in the space S. In this embodiment and some embodiments of the present disclosure, aliquid level 310 a of thecooling liquid 300 a is located farther away from thebottom surface 110 a of thetank 100 a than theheat source 20, and theheat source 20 is completely immersed in thecooling liquid 300 a, but the disclosure is not limited thereto. In some other embodiments, as long as heat generated by the heat source is able to be transferred to the cooling liquid, the heat source may be partially immersed in the cooling liquid. In this embodiment and some embodiments of the present disclosure, thecooling liquid 300 a is volatile, non-conductive and low boiling liquid, such as refrigerant, but the disclosure is not limited thereto. In some other embodiments, the cooling liquid may be pure water or liquid fluoride. In this embodiment, when a signal of a wire of theheat source 20 contacting thecooling liquid 300 a is 1 kHz, a permittivity of thecooling liquid 300 a is close to 1. In this embodiment and some embodiments of the present disclosure, the permittivity of thecooling liquid 300 a is approximately 1.8. In this embodiment, when theheat source 20 and thecooling liquid 300 a are both accommodated in the space S, heat generated by theheat source 20 is absorbed by thecooling liquid 300 a so as to cause thecooling liquid 300 a to evaporate into vapor form (e.g.,vapor 320 a shown inFIG. 2 ), and thevapor 320 a may be discharged out of the space S via thetank outlet 130 a, thereby dissipating the heat. Therefore, there would not be toomuch vapor 320 a remaining in the space S, such that less of thevapor 320 a would escape from the opening for receiving thecover 200 a when the cover is removed. - In this embodiment and some embodiments of the present disclosure, the
cooling device 10 a further includes aliquid channel 400 a and avapor channel 500 a, theliquid channel 400 a is connected to thetank inlet 120 a, and thevapor channel 500 a is connected to thetank outlet 130 a. Thecooling liquid 300 a may be poured into theliquid channel 400 a to flow into the space S and to replenish the evaporatedcooling liquid 300 a. Thevapor 320 a may flow into thevapor channel 500 a via thetank outlet 130 a. Thevapor 320 a has a lower density than that of thecooling liquid 300 a, a volume flow rate of thevapor 320 a is higher than that of thecooling liquid 300 a; therefore, to reach a balance of mass flow rate between thetank inlet 120 a and thetank outlet 130 a, an inner diameter of thevapor channel 500 a may be larger than an inner diameter of theliquid channel 400 a, but the disclosure is not limited thereto. In some other embodiments, the balance may also be reached by increasing the quantity of the vapor channel. - Please refer to
FIG. 3 , which is a cross-sectional view of the cooling device during the operation of the heat source inFIG. 1 . During the operation of theheat source 20, a part of thecooling liquid 300 a was evaporated into vapor form (i.e.,vapor 320 a), and then theliquid level 310 a of thecooling liquid 300 a is fallen to aliquid level 310 a′. Thevapor 320 a leaves the space S from thetank outlet 130 a, and thecooling liquid 300 a flows into the space S via the tank inlet 120 to replenish the evaporatedcooling liquid 300 a. Generally, liquid tends to flow down and gas tends to go up, thus, in this embodiment and some embodiments of the present disclosure, thetank inlet 120 a of thetank 100 a is located closer to thebottom surface 110 a of thetank 100 a than thetank outlet 130 a, but the disclosure is not limited thereto. In some other embodiments, the tank inlet and the tank outlet may be located at the same level. - In this embodiment and some embodiments of the present disclosure, the
vapor channel 500 a includes aninlet end 510 a and anoutlet end 520 a. Theinlet end 510 a is connected to thetank outlet 130 a of thetank 100 a, and a distance Dla between the inlet end 510 a and thebottom surface 110 a is substantially equal to a distance D2 a between the outlet end 520 a and thebottom surface 110 a. In other words, the inlet end 510 a and the outlet end 520 a are substantially located at the same level, but the disclosure is not limited thereto. Please refer toFIG. 4 , which is a cross-sectional view of a cooling device according to another embodiment of the present disclosure during the operation of the heat source. This embodiment provides acooling device 10 b, which is similar to theaforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, a distance Dlb of aninlet end 510 b and abottom surface 110 b of thecooling device 10 b is smaller than a distance D2 b of anoutlet end 520 b and thebottom surface 110 b of thecooling device 10 b. In other words, avapor channel 500 b is disposed to atank 100 b in an inclined manner. Accordingly, aliquid level 310 b of a cooling liquid 300 b is allowed to be closer to acover 200 b and the cooling liquid 300 b is allowed flows into theinlet end 510 b and occupy a portion of thevapor channel 500 b, ensuring only the vapor form of the cooling liquid 300 b (i.e.,vapor 320 b) to pass through theoutlet end 520 b of thevapor channel 500 b. - In the previous embodiment, the
cover 200 a is placed horizontally, but the disclosure is not limited thereto. Please refer toFIG. 5 , which is a cross-sectional view of a cooling device according to yet another embodiment of the present disclosure during the operation of the heat source. This embodiment provides acooling device 10 c, which is similar to theaforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, acover 200 c of thecooling device 10 c includes afirst side 210 c and asecond side 220 c, a distance D3 between thefirst side 210 c and abottom surface 110 c is larger than a distance D4 between thesecond side 220 c and thebottom surface 110 c. In other words, thefirst side 210 c is located farther away from thebottom surface 110 c of thetank 100 c than thesecond side 220 c. In addition, thefirst side 210 c is closer to atank outlet 130 c of atank 100 c than thesecond side 220 c, such that the vapor form of the cooling liquid 300 c (i.e.,vapor 320 c) tends to flow toward thefirst side 210 c. Consequently, thevapor 320 c would easily leave the space S via thetank outlet 130 c. - Please refer to
FIG. 6 , which is a cross-sectional view of a cooling device according to still another embodiment of the present disclosure during the operation of the heat source. This embodiment provides acooling device 10 d, which is similar to theaforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, thecooling device 10 d further includes aheat exchange portion 600 d. Theheat exchange portion 600 d is, for example, a tube, but the disclosure is not limited thereto. In some other embodiments, the heat exchange portion may be another tank. In this embodiment and some embodiments of the present disclosure, theheat exchange portion 600 d includes afirst end 610 d and asecond end 620 d. Thefirst end 610 d is connected to avapor channel 500 d and thesecond end 620 d is connected to aliquid channel 400 d. Thevapor 320 d flows to thefirst end 610 d of theheat exchange portion 600 d from thevapor channel 500 d. Theheat exchange portion 600 d is configured to provide an extra space for the processes of condensation and evaporation of a cooling liquid 300 d to occur (i.e., the transition from the cooling liquid 300 d andvapor 320 d). Thevapor 320 d turns into the cooling liquid 300 d in theheat exchange portion 600 d and flows back to theliquid channel 400 d through thesecond end 620 d due to gravity. In short, the cooling liquid 300 d in the space S is able to be evaporated into the gaseous phase and then is condensed to flow back to the space S, forming a circulation without losing any of it. - Please refer to
FIG. 7 , which is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source. This embodiment provides acooling device 10 e, which is similar to theaforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, thecooling device 10 e further includes aheat dissipation device 700 e. Theheat dissipation device 700 e is, for example, a liquid cooling device and is connected to aheat exchange portion 600 e. Theheat dissipation device 700 e is able to absorb and then dissipate heat in thevapor 320 e in theheat exchange portion 600 e. Therefore, theheat dissipation device 700 e is able to accelerate the phase transition of the cooling liquid 300 e. In some other embodiments, the heat dissipation device may be a fan that is not in contact with the heat exchange portion; in such a case, the airflow generated by the fan also helps to accelerate the phase transition of the cooling liquid. - Please refer to
FIG. 8 , which is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source. This embodiment provides acooling device 10 f, which is similar to theaforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, thecooling device 10 f further includes anelectrical connector 800 f disposed at acover 200 f. In addition, theelectrical connector 800 f is located in a hole (not shown in the figures) of thecover 200 f and is electrically connected to theheat source 20 via awire 22 located in thetank 100 f. Theelectrical connector 800 f is configured to transmit electricity or signal to theheat source 20 or receive electricity or signal from theheat source 20. This allows theheat source 20 to exchange electrical power or signal to another external device through thewire 22 and theelectrical connector 800 f. In addition, the hole of the cover 200 may be, for example, in a square shape, and theelectrical connector 800 f is easier to be sealed to thecover 200 f with respect to the conventional gap between the wire and the tank. As a result, the air-tightness of thetank 100 f is increased with respect to the conventional tank. - Please refer to
FIG. 9 , which is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source. This embodiment provides acooling device 10 g, which is similar to theaforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, thecooling device 10 g further includes aliquid pump device 900 g, and aheat exchange portion 600 g is a tank. Theliquid pump device 900 g is connected to and disposed on aliquid channel 400 g and is connected to atank 100 g and theheat exchange portion 600 g via theliquid channel 400 g. In this embodiment and some embodiments of the present disclosure, a cooling liquid 300 g in the space S can be completely pumped to theheat exchange portion 600 g by theliquid pump device 900 g. By doing so, the vapor form of the cooling liquid 300 g is prevented from escaping from the opening for receiving acover 200 g when thecover 200 g is removed. Further, there may be a valve (not shown in the figures) disposed in theliquid pump device 900 g for preventing the cooling liquid 300 g from flowing back to the space S. During the operating of theheat source 20, the valve is switched on. However, the valve is optional, and the disclosure is not limited thereto. - Please refer to
FIG. 10 andFIG. 11 ,FIG. 10 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source, andFIG. 11 is a cross-sectional view of the cooling device and the heat source inFIG. 10 when the operation is completed. This embodiment provides acooling device 10 h, which is similar to theaforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, thecooling device 10 h further includes anair pump device 1000 h located in aheat exchange portion 600 h which is connected to atank 100 g via avapor channel 500 h. In this embodiment and some embodiments of the present disclosure, the space S may be filled with air A with the help of theair pump device 1000 h so as to force a cooling liquid 300 h and avapor 320 h to move toward theheat exchange portion 600 h. By doing so, most in the space S is the air A and vapor form of the cooling liquid 300 h is prevented from escaping from the opening for receiving acover 200 h when thecover 200 h is removed. Further, there may be a valve (not shown in the figures) disposed in theair pump device 1000 h for preventing the air A from flowing back to theheat exchange portion 600 h. During the operating of theheat source 20, the valve is switched on. However, the valve is optional, and the disclosure is not limited thereto. - According to the cooling device in the embodiments abovementioned, when the heat source and the cooling liquid are both accommodated in the space, heat generated by the heat source is absorbed by the cooling liquid so as to cause the cooling liquid to evaporate into vapor form, and the vapor may be discharged out of the space via the tank outlet, thereby dissipating the heat. Therefore, there would not be too much vapor remaining in the space, such that less of the vapor would escape from the opening for receiving the cover when the cover is removed.
- In some embodiments, the cooling device further includes a liquid channel and a vapor channel, the liquid channel is connected to the tank inlet, and the vapor channel is connected to the tank outlet. To reach a balance of mass flow rate between the tank inlet and the tank outlet, an inner diameter of the vapor channel may be larger than an inner diameter of the liquid channel.
- In some embodiments, the tank inlet of the tank is located closer to the bottom surface of the tank than the tank outlet. Generally, liquid tends to flow down and gas tends to go up.
- In some embodiments, the vapor channel is disposed to the tank in an inclined manner. Accordingly, the liquid level of the cooling liquid is allowed to be closer to the cover and the cooling liquid is allowed flows into the inlet end and occupy a portion of the vapor channel, ensuring only the vapor form of the cooling liquid to pass through the outlet end of the vapor channel.
- In some embodiments, the first side is located farther away from the bottom surface than the second side. In addition, the first side is closer to the tank outlet than the second side, such that the vapor form of the cooling liquid tends to flow toward the first side. Consequently, the vapor would easily leave the space via the tank outlet.
- In some embodiments, the cooling device further includes a heat exchange portion. The heat exchange portion is configured to provide an extra space for the processes of condensation and evaporation of the cooling liquid to occur (i.e., the transition from the cooling liquid and vapor). The vapor turns into the cooling liquid in the heat exchange portion and flows back to the liquid channel through the second end due to gravity. In short, the cooling liquid in the space is able to be evaporated into the gaseous phase and then is condensed to flow back to the space, forming a circulation without losing any of it.
- In some embodiments, the cooling device further includes a heat dissipation device. The heat dissipation device is able to absorb and then dissipate heat in the vapor in the heat exchange portion. Therefore, the heat dissipation device is able to accelerate the phase transition of the cooling liquid.
- In some embodiments, the cooling device further includes an electrical connector disposed at the cover. In addition, the electrical connector is located in a hole of the cover and is electrically connected to the heat source via a wire located in the tank. The electrical connector is configured to transmit electricity or signal to the heat source or receive electricity or signal from the heat source. This allows the heat source to exchange electrical power or signal to another external device through the wire and the electrical connector. In addition, the hole of the cover may be, for example, in a square shape, and the electrical connector is easier to be sealed to the cover with respect to the conventional gap between the wire and the tank. As a result, the air-tightness of the tank is increased with respect to the conventional tank.
- In some embodiments, the cooling device further includes a liquid pump device, and the heat exchange portion is a tank. The cooling liquid in the space can be completely pumped to the heat exchange portion by the liquid pump device. By doing so, the vapor form of the cooling liquid is prevented from escaping from the opening for receiving the cover when the cover is removed.
- In some embodiments, the cooling device further includes an air pump device. The space may be filled with air with the help of the air pump device so as to force the cooling liquid and the vapor to move toward the heat exchange portion. By doing so, most in the space is the air and vapor form of the cooling liquid is prevented from escaping from the opening for receiving the cover when the cover is removed.
- The embodiments are chosen and described in order to best explain the principles of the present disclosure and its practical applications, to thereby enable others skilled in the art best utilize the present disclosure and various embodiments with various modifications as are suited to the particular use being contemplated. It is intended that the scope of the present disclosure is defined by the following claims and their equivalents.
Claims (10)
1. A cooling device, configured to cool a heat source, comprising:
a tank, including a bottom surface, a tank inlet and a tank outlet;
a cover, disposed on the tank, the cover and the tank forming a space therebetween, and the space configured to accommodate the heat source; and
a cooling liquid, located in the space.
2. The cooling device according to claim 1 , wherein the tank inlet of the tank is closer to the bottom surface of the tank than the tank outlet.
3. The cooling device according to claim 2 , further comprising a liquid channel and a vapor channel, the liquid channel connected to the tank via the tank inlet, and the vapor channel connected to the tank via the tank outlet.
4. The cooling device according to claim 3 , wherein the vapor channel includes an inlet end and an outlet end, the inlet end is connected to the tank outlet of the tank, and the inlet end is closer to the bottom surface of the tank than the outlet end.
5. The cooling device according to claim 4 , wherein the cover includes a first side and a second side, the first side is closer to the tank outlet of the tank than the second side, and the first side is farther away from the bottom surface of the tank than the second side.
6. The cooling device according to claim 3 , further comprising a heat exchange portion, wherein the vapor channel is connected to the liquid channel via the heat exchange portion.
7. The cooling device according to claim 6 , further comprising a heat dissipation device connected to the heat exchange portion.
8. The cooling device according to claim 1 , further comprising an electrical connector connected to the cover, wherein the electrical connector is configured to be electrically connected to the heat source.
9. The cooling device according to claim 1 , further comprising a liquid pump device connected to the tank.
10. The cooling device according to claim 1 , further comprising an air pump device connected to the tank.
Applications Claiming Priority (2)
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CN201811263995.5 | 2018-10-26 | ||
CN201811263995.5A CN109168306A (en) | 2018-10-26 | 2018-10-26 | cooling device |
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US20200132388A1 true US20200132388A1 (en) | 2020-04-30 |
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US16/198,551 Abandoned US20200132388A1 (en) | 2018-10-26 | 2018-11-21 | Cooling device |
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CN (1) | CN109168306A (en) |
Families Citing this family (2)
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CN111163610B (en) * | 2018-11-07 | 2021-08-10 | 英业达科技有限公司 | Cooling device |
TWI703690B (en) * | 2019-06-13 | 2020-09-01 | 英業達股份有限公司 | Cooling device and operation method thereof |
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