TWI690686B - Cooling device - Google Patents

Abstract

A cooling device is configured to apply to cool a heat component. The cooling device includes a tank, a cover and a cooling liquid. The tank has a bottom surface, a cooling liquid input and a cooling liquid output. The cover is connected to the tank. The cover and the tank together form a space which is configured to place the heat component. The cooling liquid is located in the space.

Description

Cooling device

The invention relates to a cooling device, in particular to a cooling device with a cooling fluid inlet and a cooling fluid outlet.

The current common two-phase immersion cooling system provides a tank, which is divided into a liquid section and a vapor section. The liquid section is located on the lower side of the tank body and contains a volatile and low boiling point cooling liquid, and the vapor section is located on the upper side of the tank body and contains a radiator. The user immerses the server in the cooling liquid, and the cooling liquid absorbs the heat of the server to achieve the effect of cooling the server. After the cooling fluid absorbs a certain amount of heat, it will evaporate into gaseous cooling fluid vapor, and the cooling fluid vapor will concentrate upwards on the vapor section of the tank. After the coolant vapor contacts the cooler radiator, the heat of the coolant vapor is transferred to the radiator. Once the heat of the cooling liquid vapor is dissipated, it will condense into liquid cooling liquid, and the cooling liquid will return to the liquid section on the lower side of the tank by gravity. In this way, the heat generated by the server can be brought to the steam section on the upper side of the tank by the cooling liquid, and then the heat is taken away from the tank of the two-phase immersion cooling system through the pipeline connected to the radiator.

However, before the cooling liquid evaporates into the cooling liquid vapor, air already exists inside the vapor section. When the coolant vapor enters the vapor section, the gas inside the vapor section is a mixture of air and coolant vapor. As a result, the gas in contact with the radiator is not pure coolant vapor, making the coolant vapor less efficient at transferring heat to the radiator. Furthermore, when the user opens the tank for equipment maintenance, picks up the server or places the server, the vapor of the tank The cooling liquid vapor of the section is easily dissipated into the atmosphere. If the user repeatedly opens and closes the tank, it may cause insufficient coolant. In addition, the shell of the tank is often provided with an opening for the wire to enter the tank and be electrically connected to the server, so that the server exchanges power and signals through the wire and the outside of the tank. However, the shape of the gap between the opening of the tank shell and the wire is relatively irregular, and it is not easy to completely seal the gap. The coolant vapor may escape from this gap, which will eventually cause insufficient coolant.

The present invention is to provide a cooling device, so as to solve the problems of poor heat dissipation efficiency of the two-phase immersion cooling system and the easy escape of the cooling liquid in the prior art.

The cooling device disclosed in an embodiment of the present invention is suitable for cooling a heating element. The cooling device includes a tank, a cover and a cooling liquid. The tank body has a bottom surface, a coolant inlet and a coolant outlet. The cover body is connected to the groove body. The cover body and the groove body form an accommodating space, and the accommodating space is suitable for accommodating the heating element. Coolant is located in the storage space.

According to the cooling device disclosed in the above embodiment, since the cooling liquid evaporates into the cooling liquid vapor and then leaves the accommodating space from the cooling liquid outlet, the cooling liquid vapor accumulated in the accommodating space can be significantly larger than the conventional technology. cut back. In addition, before the cooling device of the above embodiment is operated, the user can first discharge the air in the accommodating space from the cooling liquid outlet. In this way, when the cooling device of the above embodiment operates, the proportion of air in the gas discharged from the cooling fluid outlet of the tank is small. That is, the discharged gas is closer to the pure coolant vapor, so that the heat conduction effect of the discharged gas is greatly improved than the conventional technology.

The above description of the content of the present invention and the description of the following embodiments are used to exemplify and explain the principles of the present invention, and provide a further scope of the patent application of the present invention explanation of.

10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h: cooling device

20: heating element

22: Wire

100a, 100b, 100c, 100f, 100g, 100h: tank

110a, 110b, 110c: bottom surface

120a: coolant inlet

130a, 130c: coolant outlet

200a, 200b, 200c, 200f, 200g, 200h: cover

210c: first side

220c: Second side

300a, 300b, 300d, 300e, 300g, 300h: coolant

310a, 310a’, 310b: liquid level

320a, 320c, 320d, 320e, 320f, 320h: coolant vapor

400a, 400d, 400g, 400h: liquid flow path

500a, 500b, 500d, 500h: steam flow path

510a, 510b: inflow end

520a, 520b: outflow end

600d, 600e, 600g, 600h: heat exchange section

610d: the first end

620d: the second end

700e: heat sink

800f: electronic connector

900g: pumping device

1000h: Inflatable device

P: Platform

S: accommodating space

D1a, D1b, D2a, D2b, D3, D4: distance

A: Fill with air

FIG. 1 is an exploded schematic side sectional view of a cooling device and a heating element according to an embodiment of the invention.

FIG. 2 is a schematic side sectional view of the cooling device of FIG. 1.

FIG. 3 is a schematic side sectional view of the cooling device of FIG. 1 when it is in operation.

FIG. 4 is a schematic side sectional view of the cooling device according to the next embodiment of the present invention when it is in operation.

5 is a schematic side cross-sectional view of the cooling device according to another embodiment of the present invention when it is in operation.

6 is a schematic side sectional view of the cooling device according to yet another embodiment of the present invention when it is in operation.

7 is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation.

8 is a schematic side cross-sectional view of the cooling device according to another embodiment of the present invention when it is in operation.

9 is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation.

10 is a schematic side cross-sectional view of a cooling device according to another embodiment of the present invention when it is in operation.

FIG. 11 is a schematic side sectional view of the cooling device of FIG. 10 when the operation is completed.

The following will describe one embodiment of the present invention. Please refer to FIG. 1 to FIG. 2 first. FIG. 1 is an exploded schematic side sectional view of a cooling device and a heating element according to an embodiment of the invention. FIG. 2 is a schematic side sectional view of the cooling device of FIG. 1.

The cooling device 10a of this embodiment is suitable for cooling a heating element 20. The cooling device 10a includes a tank 100a, a cover 200a, and a cooling liquid 300a. The tank body 100a has a bottom surface 110a, a coolant inlet 120a, and a coolant outlet 130a. When the tank 100a is placed on a platform P such as a desktop, the side facing the platform P is the bottom surface 110a. The cover 200a is connected to the tank 100a. In this embodiment and some embodiments of the present invention, the cover body 200a and the bottom surface 110a of the groove body 100a are located on opposite sides of the groove body 100a, but not limited thereto. In other embodiments, the cover can be connected to the bottom of the tank. In this embodiment, the cover body 200a and the groove body 100a form an accommodating space S. The accommodating space S is suitable for accommodating the heating element 20, for example, a server. The cooling liquid 300a is located in the accommodating space S. In this embodiment and some embodiments of the present invention, a liquid surface 310a of the cooling liquid 300a is farther from the bottom surface 110a of the tank 100a than the heating element 20, that is, the heating element 20 is completely immersed in the cooling liquid 300a, but not This is limited. In other embodiments, the heating element may only be partially immersed in the cooling liquid, as long as the heat of the heating element can be conducted to the cooling liquid. In this embodiment and some embodiments of the present invention, the cooling liquid 300a may be a volatile, non-conductive and low-boiling liquid, such as a refrigerant, but not limited thereto. In other embodiments, the cooling liquid may also be pure water or fluorinated liquid. In this embodiment, when the line signal of the heating element 20 in contact with the cooling liquid 300a is 1 kHz (kilohertz), the dielectric constant of the cooling liquid 300a is close to 1. In this embodiment and some embodiments of the present invention, the dielectric constant of the cooling liquid 300a is 1.8. In this embodiment, when the accommodating space S accommodates both the heating element 20 and the cooling liquid 300a, the heat generated by the heating element 20 can be conducted to the cooling liquid 300a. Since the cooling liquid 300a evaporates into the cooling liquid vapor 320a, it can leave the accommodating space S through the cooling liquid outlet 130a, so that the accommodating space S will not have too much cooling liquid vapor 320a accumulating. When the user needs to open the cover 200a to perform equipment maintenance on the interior of the tank 100a or take the heating element 20, the situation where the coolant vapor 320a escapes from the accommodating space S is relatively greatly reduced compared to the conventional technology.

In this embodiment and some embodiments of the invention, the cooling device 10a further includes a liquid flow channel 400a and a vapor flow channel 500a. The liquid flow channel 400a is connected to the tank 100a through the cooling liquid inlet 120a, and the vapor flow channel 500a is connected to the tank 100a through the cooling liquid outlet 130a. The liquid cooling liquid 300a flows from the liquid flow channel 400a through the cooling liquid inlet 120a and enters the storage space S, and the gaseous cooling liquid vapor 320a enters the vapor flow channel 500a from the storage space S via the cooling liquid output port 130a. As such, when the cooling device 10a is activated, the heat of the heating element 20 is conducted to the cooling liquid 300a and the cooling liquid 300a evaporates into the cooling liquid vapor 320a. The coolant vapor 320a then brings heat from the containing space S to the vapor flow channel 500a. The cooling liquid 300a enters the accommodating space S from the liquid flow channel 400a to supplement the evaporated cooling liquid 300a. In addition, since the density of the cooling liquid vapor 320a is smaller than the density of the cooling liquid 300a, the volume flow rate of the cooling liquid vapor 320a is greater than the volume flow rate of the cooling liquid 300a. In order to make the cooling device 10a in a balanced state, the pipe diameter of the vapor flow channel 500a should be larger than the pipe diameter of the liquid flow channel 400a. In this way, the mass flow rate of the coolant vapor 320a flowing out of the coolant output port 130a will be equal to the mass flow rate of the coolant 300a flowing in from the coolant input port 120a, but not limited to this. In other embodiments, the vapor flow channel can also be added , As long as the mass flow rate of the coolant vapor flowing from the coolant outlet is equal to the mass flow rate of the coolant flowing from the coolant inlet.

In this embodiment, the cooling liquid 300a is used to absorb the heat generated from the heating element 20. When the cooling device 10a is activated, part of the cooling liquid 300a will evaporate into gaseous cooling liquid vapor 320a after absorbing a certain amount of heat. As part of the cooling liquid 300a evaporates, the liquid surface 310a of the cooling liquid 300a is reduced to 310a' (shown in FIG. 3). Please refer to FIG. 3, which is a schematic side cross-sectional view of the cooling device of FIG. 1 when activated. The gaseous coolant vapor 320a leaves the accommodating space S through the coolant output port 130a, and the liquid coolant 300a flows into the accommodating space S through the coolant input port 120a. Because of the characteristics of the liquid flowing down and the gas sloshing up, the cooling liquid inlet 120a of the liquid is preferably lower than the cooling liquid outlet 130a of the gas. In this embodiment and some embodiments of the present invention, the coolant inlet 120a of the tank 100a is closer to the bottom surface 110a of the tank 100a than the coolant outlet 130a, but not limited thereto. In other embodiments, the distance between the coolant inlet of the tank and the bottom surface can be equal to the distance between the coolant outlet and the bottom surface, as long as the liquid coolant can flow into the accommodating space and the gaseous coolant vapor through the coolant inlet It can just leave the accommodating space through the coolant outlet.

In this embodiment and some embodiments of the present invention, the vapor flow channel 500a has an inflow end 510a and a first-run outlet 520a. The inflow end 510a is connected to the coolant outlet 130a of the tank 100a, and the distance D1a from the inflow end 510a to the bottom surface 110a is equal to the distance D2a from the outflow end 520a to the bottom surface 110a. That is, the vapor flow channel 500a is provided on the tank 100a so as to be substantially parallel to the bottom surface 110a, but it is not limited thereto. Please refer to FIG. 4, which is a side cross-sectional view of the cooling device according to the next embodiment of the present invention when it is in operation Schematic. The following only describes the differences between the next embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the present invention, the distance D1b from the inflow end 510b to the bottom surface 110b of the cooling device 10b is smaller than the distance D2b from the outflow end 520b to the bottom surface 110b. That is, the vapor flow channel 500b is provided in the tank 100b in an inclined manner. In this way, the liquid surface 310b of the cooling liquid 300b can be closer to the cover 200b, and it is ensured that only the cooling liquid vapor 320b flows through the outflow end 520b of the vapor flow channel 500b, and the cooling liquid 300b is kept in the accommodating space S.

In this embodiment and some embodiments of the present invention, the cover 200a is a flat plate substantially parallel to the bottom surface 110a, but it is not limited thereto. Please refer to FIG. 5, which is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the invention, the cover 200c of the cooling device 10c has a first side 210c and a second side 220c. The distance D3 from the first side 210c to the bottom surface 110c is greater than the distance D4 from the second side 220c to the bottom surface 110c. That is, the first side 210c is closer to the coolant outlet 130c of the tank 100c than the second side 220c, and the first side 210c is farther away from the bottom surface 110c of the tank 100c than the second side 220c. Due to the characteristic that the gas will scatter upward, setting the first side 210c of the cover 200c higher than the second side 220c can concentrate the coolant vapor 320c on the first side 210c. And the first side 210c is close to the coolant outlet 130c of the tank 100c so that the coolant vapor 320c concentrated on the first side 210c can more easily leave the accommodating space S through the coolant outlet 130c.

Next, please refer to FIG. 6, which is a schematic side sectional view of the cooling device according to yet another embodiment of the present invention when it is in operation. The following is only for yet another embodiment of the present invention The differences from some of the foregoing embodiments will be described, and the remaining similarities will be omitted. In this embodiment and some embodiments of the present invention, the cooling device 10d further includes a heat exchange section 600d. The heat exchange section 600d is, for example, a pipe material, but not limited thereto. In other embodiments, the heat exchange section may also be a receiving slot. In this embodiment and some embodiments of the present invention, the heat exchange section 600d has a first end 610d and a second end 620d. The heat exchange section 600d is connected to the vapor flow channel 500d through the first end 610d, and the heat exchange section 600d is connected to the liquid flow channel 400d through the second end 620d. The heat exchange section 600d is a space for supplying gaseous cooling liquid vapor 320d to condensing into liquid cooling liquid 300d. The cooling liquid vapor 320d enters the first end 610d of the heat exchange section 600d from the vapor flow channel 500d. The cooling liquid vapor 320d condenses into the cooling liquid 300d after radiating heat at the first end 610d, and flows into the liquid flow channel 400d through the second end 620d with the action of gravity. In this way, the cooling liquid vapor 320d leaving the accommodating space S can return to the accommodating space S in the state of the cooling liquid 300d through the vapor flow path 500d, the heat exchange section 600d, and the liquid flow path 400d, forming a cooling liquid 300d Closed circulation system and maintain the volume of cooling fluid 300d.

Next, please refer to FIG. 7, which is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the invention, the cooling device 10e further includes a heat dissipation device 700e. The heat dissipation device 700e is, for example, a water cooling box and is connected to the heat exchange section 600e. Through the contact between the heat dissipation device 700e and the heat exchange section 600e, the heat of the cooling liquid vapor 320e in the heat exchange section 600e is conducted to the heat dissipation device 700e. In this way, the speed at which the cooling liquid vapor 320e condenses into the cooling liquid 300e in the heat exchange section 600e can be accelerated. In this embodiment and In some embodiments of the present invention, the heat dissipation device 700e is, for example, a water cooling box, but it is not limited thereto. In other embodiments, the heat dissipation device may also be a fan and the fan is not connected to the heat exchange section. The air outlet of the fan faces the heat exchange section, which can accelerate the air flow around the heat exchange section. The air flow around the heat exchange section helps the heat dissipation of the cooling liquid vapor in the heat exchange section and accelerates the speed at which the cooling liquid vapor condenses into the cooling liquid in the heat exchange section.

Next, please refer to FIG. 8, which is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the invention, the cooling device 10f further includes an electronic connector 800f. The electronic connector 800f penetrates through an opening (not shown) of the cover 200f and is connected to the cover 200f. The electronic connector 800f is used to electrically connect the heating element 20 through the wire 22, and the electronic connector 800f can exchange power and signals with the outside of the tank 100f. That is, the heating element 20 in the accommodating space S can exchange power and signals through the wire 22, the electronic connector 800f, and the outside of the tank 100f. The shape of the opening of the cover 200f is, for example, square, which can improve the adhesion effect between the electronic connector 800f and the opening of the cover 200f compared to the conventional technology. In this way, the grooves 100f or the lid 200f can be prevented from passing through the irregular and difficult-to-close openings for the wire 22 to leave the accommodating space S, and the coolant vapor 320f can be prevented from escaping from the irregular openings.

Next, please refer to FIG. 9, which is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the invention, the cooling device 10g further includes a pumping device 900g. The heat exchange section 600g is, for example, a receiving slot. The pump device 900g is located in the liquid flow channel 400g and is connected to the tank body 100g and the heat exchange section 600g through the liquid flow channel 400g, but it is not limited thereto. In other embodiments, the pumping device may be located in a place other than the liquid flow path and connected to the tank through an opening other than the coolant inlet, as long as the pumping device is below the liquid level of the coolant. In this embodiment and some embodiments of the present invention, before the user needs to open the lid 200g, the cooling liquid 300g can be drawn out of the accommodating space S through the pump device 900g, and the cooling liquid 300g is stored in the heat exchange Segment 600g. As a result, there is no coolant 300g in the storage space S. Then, when the user opens the lid 200g, the cooling fluid 300g can be prevented from evaporating into the atmosphere and escaping. When the pumping device 900g functions, the pumping device 900g may be provided with, for example, a check valve (not shown) to prevent the cooling liquid 300g from flowing back to the accommodating space S. When the user replaces the lid 200g and returns to the working stage of the cooling device 10g, the check valve is removed. But not limited to this. In other embodiments, no check valve may be provided.

Then please refer to FIG. 10 and FIG. 11. 10 is a schematic side sectional view of the cooling device according to another embodiment of the present invention when it is in operation. 11 is a schematic side cross-sectional view of the cooling device of FIG. 10 when the operation is completed. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the invention, the cooling device 10h further includes an inflation device 1000h. The heat exchange section 600h is, for example, a receiving slot. The inflation device 1000h is located in the heat exchange section 600h and is connected to the tank body 100h through the vapor flow channel 500h, but not limited to this. In other embodiments, the inflation device may be located in a place other than the heat exchange section and connected to the tank through an opening other than the coolant outlet, as long as the inflation device is above the level of the coolant. In this embodiment and some embodiments of the invention, the user needs to hit the cover 200h Before opening, a filling air A can be filled into the accommodating space S through the inflation device 1000h, and the cooling liquid 300h and the cooling liquid vapor 320h are pushed through the liquid flow channel 400h to the heat exchange section 600h. In this way, as shown in FIG. 11, the accommodating space S is filled with air A only. Then, when the user opens the cover 200h, the accommodating space S only has the filling air A to escape and can prevent the cooling liquid 300h or the cooling liquid vapor 320h from evaporating into the atmosphere and escaping. When the inflation device 1000h functions, the inflation device 1000h may be provided with, for example, a check valve (not shown) to prevent the filling air A from flowing back to the heat exchange section 600h. When the user replaces the cover body 200h and returns to the working stage of the cooling device 10h, the check valve is removed. But not limited to this. In other embodiments, no check valve may be provided.

According to the cooling device of the above embodiment, when the accommodating space accommodates both the heating element and the cooling liquid, the heat generated by the heating element can be conducted to the cooling liquid. And since the cooling liquid evaporates into the cooling liquid vapor, it can leave the accommodating space through the cooling liquid output port, so that the accommodating space will not have too much coolant vapor accumulating. When the user needs to open the cover to repair the equipment inside the tank or take the heating element, the escape of the coolant vapor from the accommodating space will be relatively greatly reduced compared to the conventional technology.

In addition, when the cooling device is activated, part of the cooling liquid will evaporate into gaseous cooling liquid vapor after absorbing a certain amount of heat. Because of the characteristics of the liquid flowing low and the gas sloshing high, the cooling fluid inlet through which the liquid flows should be set lower than the cooling fluid outlet through which the gas flows. Liquid coolant can easily flow into the storage space through the coolant inlet and gaseous coolant vapor can easily leave the storage space through the coolant outlet.

Furthermore, the cooling device is also provided with a liquid flow path and a vapor flow path. When the cooling device is activated, the heat of the heating element is transferred to the cooling liquid and evaporates into the cooling liquid vapor. Coolant The steam then brings heat from the containing space to the steam flow path. In addition, the cooling liquid enters the accommodating space from the liquid flow channel to supplement the evaporated cooling liquid.

The steam flow channel can also be provided in the tank in an inclined manner. In this way, the liquid level of the cooling liquid can be closer to the cover. And ensure that only the cooling liquid vapor flows through the outflow end, keeping the cooling liquid in the accommodating space.

In addition, the first side of the cover of the cooling device can be set higher than the second side. Taking advantage of the characteristic that the gas will scatter upward, the coolant vapor is concentrated on the first side. And the first side is close to the cooling liquid outlet of the tank, so that the cooling liquid vapor concentrated on the first side can more easily leave the accommodating space through the cooling liquid outlet.

The cooling device is also provided with a heat exchange section. The heat exchange section is a space for supplying gaseous cooling liquid vapor to condensing into liquid cooling liquid. The cooling liquid vapor leaves the accommodating space, returns to the accommodating space through the steam flow path, the heat exchange section, and the liquid flow path, forming a closed circulation system of the cooling liquid and maintaining the liquid volume of the cooling liquid.

The cooling device is also provided with a heat dissipation device. The heat of the cooling liquid vapor in the heat exchange section is transmitted to the heat dissipation device through the contact of the heat dissipation device and the heat exchange section. In this way, the speed at which the coolant vapor condenses into the coolant in the heat exchange section can be accelerated.

The cooling device is also provided with an electronic connector. The heating element in the accommodating space can exchange power and signal through the wire, the electronic connector and the outside of the tank. The arrangement of the electronic connector can make the shape of the opening in the groove or cover more regular, such as square. The conventional technique is that the wire directly penetrates the opening, and the shape of the opening is relatively irregular. In contrast, the sealing effect of the electronic connector is improved compared to the conventional technology, which can further prevent the escape of the coolant vapor from the opening.

The cooling device is also provided with a pump device. The pumping device can draw the cooling liquid out of the accommodating space and store the cooling liquid in the heat exchange section. As a result, the storage space is free of coolant. When the user opens the cover, the coolant can be prevented from evaporating into the atmosphere and escaping.

The cooling device is also provided with an inflation device. The inflatable device can fill a filled air into the accommodating space, and push the cooling liquid and the cooling liquid vapor through the liquid flow path to the heat exchange section. In this way, the accommodating space is filled with air only. When the user opens the lid, the accommodating space is filled with air only and can prevent the coolant or coolant vapor from evaporating into the atmosphere and escaping.

Although the present invention is disclosed as above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar arts can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be subject to the scope defined in the patent application scope attached to this specification.

10d: cooling device

300d: coolant

320d: Coolant vapor

400d: liquid flow path

500d: steam channel

600d: heat exchange section

610d: the first end

620d: the second end

S: accommodating space

Claims (9)

A cooling device is suitable for cooling a heating element. The cooling device includes: a tank body having a bottom surface, a coolant inlet and a coolant outlet; a cover body connected to the tank body, the cover body and The tank body forms an accommodating space, the accommodating space is suitable for accommodating the heating element; an inflation device, the inflation device is connected to the trough body; and a cooling liquid, located in the accommodating space. The cooling device as described in item 1 of the patent application range, wherein the coolant inlet of the tank is closer to the bottom surface of the tank than the coolant outlet. The cooling device as described in item 2 of the patent application scope further includes a liquid flow path and a vapor flow path, the liquid flow path is connected to the tank through the cooling liquid inlet, and the vapor flow path is output through the cooling liquid The port is connected to the tank. The cooling device as described in item 3 of the patent application scope, wherein the steam flow prop has an inflow end and a first-rate outflow end, the inflow end is connected to the cooling liquid outlet of the tank, the inflow end is closer to the outflow end than the outflow end The bottom surface of the tank body. The cooling device according to item 4 of the patent application scope, wherein the cover has a first side and a second side, the first side is closer to the coolant outlet of the tank than the second side, and the The first side is farther from the bottom surface of the tank than the second side. The cooling device as described in item 3 of the patent application scope further includes a heat exchange section having a first end and a second end, the heat exchange section is connected to the vapor flow channel through the first end The heat exchange section is connected to the liquid flow channel through the second end. The cooling device as described in item 6 of the patent application scope further includes a heat sink The heat sink is connected to the heat exchange section. The cooling device as described in item 1 of the patent application further includes an electronic connector connected to the cover, and the electronic connector is used to electrically connect the heating element. The cooling device as described in item 1 of the scope of the patent application further includes a pumping device connected to the tank.

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