CN216291914U

CN216291914U - Electronic device

Info

Publication number: CN216291914U
Application number: CN202121566659.5U
Authority: CN
Inventors: 孟跃龙; 秦西利; 白喜超
Original assignee: Shenzhen Taihengnuo Technology Co ltd
Current assignee: Shenzhen Taihengnuo Technology Co ltd
Priority date: 2021-07-09
Filing date: 2021-07-09
Publication date: 2022-04-12
Anticipated expiration: 2031-07-09

Abstract

The application provides an electronic device, including functional element, installation department, radiator unit, moisture absorption layer and insulating layer, radiator unit passes through the installation department set up in functional element is last, radiator unit includes phase change heat storage layer and fin, moisture absorption layer and insulating layer set up in phase change heat storage layer is kept away from functional element one end is on the surface, be provided with on the insulating layer and link up at least one air vent of insulating layer. The application provides an electron device can utilize heat-retaining material and moisture absorbing material and cooperate the novel structure that has the air vent to absorb certain heat and reach the temperature that reduces the chip, delays chip temperature rise rate to the realization reduces heating element's operating temperature, effectively prolongs the life of product, promotes the effect of user's experience.

Description

Electronic device

Technical Field

The application relates to the technical field of heat dissipation of electronic products, in particular to an electronic device.

Background

Along with the performance of the electronic product is higher and higher, the power consumption is higher and higher, the heat productivity of the chip is also higher and higher, the performance of the chip is improved, and the use experience of a user is improved to become the main trend of chip development. Heat dissipation materials commonly used in the market at present, such as graphite, graphene, liquid cooling heat dissipation-heat pipe, 3D heat dissipation-VC, copper foil and the like, can not meet the increasing heat dissipation requirements by utilizing the rapid heat conductivity of the materials.

The foregoing description is provided for general background information and is not admitted to be prior art.

SUMMERY OF THE UTILITY MODEL

The application provides an electronic device for solve the big difficult radiating problem of electronic product calorific capacity.

In one aspect, the present application provides an electronic device, specifically, the electronic device includes a functional element, an installation portion and a heat dissipation assembly, the heat dissipation assembly passes through the installation portion set up in on the functional element, the heat dissipation assembly includes a phase change heat storage layer.

Optionally, the heat dissipation assembly in the electronic device includes a heat sink disposed between the functional element and the phase change thermal storage layer.

Optionally, in the electronic device, the heat dissipation fin is disposed between the functional element and the mounting portion, or the heat dissipation fin is disposed between the mounting portion and the phase change heat storage layer.

Optionally, the heat sink in the electronic device is selected from at least one of a graphite sheet, a graphene sheet, a heat pipe, a temperature equalization plate, a copper foil, and a heat dissipation VC.

Optionally, the phase change thermal storage layer in the electronic device is selected from crystalline hydrated salts and/or paraffin-based materials.

Optionally, at least one of the crystalline hydrated salts in the electronic device is selected from the group consisting of Na2SO4 · 10H2O, Zn (NO3)2 · 6H2O, NaCH3COO · 3H2O, Na2S2O3 · 5H2O, CaCl2 · 6H2O, and Ca (NO3)2 · 4H 2O; and/or the paraffin material is selected from any paraffin of C18-C30.

Optionally, the mounting portion in the electronic device is selected from at least one of a cured glue, a snap component, a fastening component, a slot component, a pin component, and a screw component.

Optionally, the electronic device further includes a moisture absorption layer disposed on a surface of the phase change heat storage layer away from one end of the functional element.

Optionally, the moisture absorption layer in the electronic device is selected from at least one of an inorganic moisture absorption material and an organic moisture absorption material.

Optionally, the moisture absorption layer is selected from at least one of diatomite, attapulgite, zeolite, molecular sieve, montmorillonite, starch, cellulose, chitin, polypeptide, polyacrylic acid, polyacrylonitrile, polyacrylamide and polyvinyl alcohol.

Optionally, the electronic device further includes a thermal insulation layer disposed on a surface of the phase change thermal storage layer away from one end of the functional element.

Optionally, the heat insulation layer in the electronic device is provided with at least one vent hole penetrating through the heat insulation layer.

Optionally, the electronic device is selected from at least one of a mobile phone, a tablet, a computer, a game machine, a reader, a player, a stereo, a power amplifier, a projector, a television, an electronic toy, a router, and a switch.

Optionally, the functional element in the electronic device is selected from at least one of a battery, a heat-generating chip, an electric device, and a display device.

Optionally, a breathing hole for exchanging air is provided on the housing of the electronic device.

As above, the electronic device provided by the application can delay the temperature rising rate of the heating device through the temperature storage function of the phase-change heat storage layer, thereby reducing the surface temperature of the heating element, effectively prolonging the service life of the product and improving the experience of a user.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application. In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a block diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a block diagram of an electronic device according to another embodiment of the present application.

Fig. 3 is a schematic diagram of a mobile phone housing according to an embodiment of the present application.

The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings. With the above figures, there are shown specific embodiments of the present application, which will be described in more detail below. These drawings and written description are not intended to limit the scope of the inventive concepts in any manner, but rather to illustrate the inventive concepts to those skilled in the art by reference to specific embodiments.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the recitation of an element by the phrase "comprising an … …" does not exclude the presence of additional like elements in the process, method, article, or apparatus that comprises the element, and further, where similarly-named elements, features, or elements in different embodiments of the disclosure may have the same meaning, or may have different meanings, that particular meaning should be determined by their interpretation in the embodiment or further by context with the embodiment.

It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

Optionally, the present application provides an electronic device, and fig. 1 is a structural diagram of the electronic device according to an embodiment of the present application.

Referring to fig. 1, in an embodiment, an electronic device includes a functional element 10, a mounting portion (not shown), and a heat dissipation assembly 20.

The heat dissipation assembly 20 is disposed on the functional element 10 through a mounting portion, and the heat dissipation assembly 20 includes a phase change heat storage layer 21.

Optionally, the phase change thermal storage layer 21 in the heat dissipation assembly 20 is mounted on the functional element 10 through a mounting portion, and the thermal storage material in the phase change thermal storage layer 21 can absorb heat generated by the functional element 10, so as to achieve the effect of reducing the working temperature of the heating element.

Referring to fig. 1, in an embodiment, a heat dissipation assembly 20 of an electronic device includes a heat sink 22. The heat sink 22 is provided between the functional element 10 and the phase change thermal storage layer 21.

Alternatively, the heat sink 22 can conduct and dissipate heat generated by the functional component 10 to the surroundings quickly, thereby providing a quick cooling effect to some extent.

Alternatively, the heat sink 22 in the electronic device is provided between the functional element 10 and the mounting portion.

Alternatively, the heat dissipation fins 22 in the electronic device may be provided between the mounting portion and the phase change thermal storage layer 21.

Alternatively, the heat sink 22 primarily conducts heat from the functional element 100 away quickly.

Optionally, the heat sink 22 in the electronic device is selected from at least one of a graphite sheet, a graphene sheet, a heat pipe, a vapor chamber, a copper foil, and a heat sink VC.

The heat dissipation performance of different heat dissipation materials is different, and the material of the heat dissipation plate 22 optimal to the product can be selected according to the factors including material performance, cost and the like.

Alternatively, the phase change thermal storage layer 21 in the electronic device is selected from at least one of crystalline hydrated salt and paraffin-based material.

Among the phase change materials, inorganic phase change materials are mostly hydrated salts, and the general latent heat is high and the thermal conductivity is good. The organic phase change material contains paraffin alkane and polymer hydrocarbon, and the organic phase change material has good cyclicity and low heat conduction. The inorganic/organic composite material mostly uses a shaped phase change material, uses organic alkane as a core material, and uses an inorganic material as a capsule wall.

The material in the phase change thermal storage layer has the ability to change its physical state over a range of temperatures. When the phase change heat storage layer absorbs heat and is heated to the melting temperature, phase change from a solid state to a liquid state is generated, and a large amount of latent heat can be absorbed and stored in the phase change heat storage layer during melting. When the physical state of the phase-change material is changed, the temperature of the material is almost kept unchanged before the phase change is completed, a wide temperature platform is formed, and although the temperature is unchanged, the latent heat absorbed or released is quite large. For general electronic products, the phase transition temperature range can be set between 40-60 degrees centigrade, and accordingly, phase transition materials with phase transition temperatures in this range can be considered. In some phase-change materials such as calcium chloride hexahydrate, the phase-change material has the functions of cooling, absorbing moisture and heating to evaporate moisture, and when the temperature is lowered, the phase-change material absorbs moisture in the air and is stored in a phase-change heat storage layer. When the temperature is raised for heat dissipation, the phase-change material evaporates the water from the phase-change heat storage layer, so that the heat is conducted out to achieve the effect of maintaining the temperature.

Alternatively, the crystalline hydrated salt in the electronic device is at least one selected from the group consisting of Na2SO4 · 10H2O, Zn (NO3)2 · 6H2O, NaCH3COO · 3H2O, Na2S2O3 · 5H2O, CaCl2 · 6H2O, and Ca (NO3)2 · 4H 2O; the paraffin material is selected from any paraffin of C18-C30.

Alternatively, from the viewpoint of availability of raw materials, the crystalline hydrated salt is particularly preferably at least one of Na2SO4 · 10H2O and Zn (NO3)2 · 6H2O, and the sodium sulfate-based heat storage material is not only large in heat storage amount but also low in cost and suitable in temperature. The paraffin-based material is preferably C18-C30 paraffin, more preferably C20-C26 paraffin. The paraffin material has good heat storage performance, a lower melting temperature range, higher latent heat of fusion, quicker phase change, low price of the paraffin, rich resources and durability.

Optionally, the mounting portion in the electronic device is selected from at least one of a cured glue, a snap assembly, a fastening assembly, a slot assembly, a pin assembly, and a screw assembly.

Alternatively, the mounting portion is used to fixedly connect the heat dissipating module 20 and the functional element 10.

Referring to fig. 2, in an embodiment, the electronic device further includes a moisture absorption layer 30, and the moisture absorption layer 30 is disposed on a surface of the phase change heat storage layer 21 away from one end of the functional element 10.

Alternatively, the moisture-absorption layer 30 absorbs moisture in the air and stores the moisture in the moisture-absorption material when the temperature is lowered. When the temperature is raised and the heat is dissipated, the moisture absorption layer 30 evaporates the moisture rapidly, thereby transferring the heat out to achieve the effect of maintaining the temperature.

Alternatively, the moisture absorption layer 30 in the electronic device is selected from at least one of an inorganic moisture absorption material and an organic moisture absorption material.

The moisture absorbent material includes an inorganic moisture absorbent material and an organic moisture absorbent material. The inorganic hygroscopic material comprises diatomite, attapulgite, zeolite, molecular sieve, montmorillonite, etc. The inorganic moisture absorption material has stable structure and low cost. The organic moisture-absorbing material includes natural polymer materials represented by starch, cellulose, chitin, polypeptide, etc., and also includes synthetic polymer materials represented by polyacrylic acid, polyacrylonitrile, polyacrylamide, polyvinyl alcohol. The moisture absorption material mainly takes a water absorption polymer as a base material, and is added with water absorption fillers. The natural polymer material has good water absorption and low cost. The synthesized polymer material has high mechanical strength and good thermal stability, and is beneficial to industrial production.

Optionally, the electronic device further includes a thermal insulation layer 40, and the thermal insulation layer 40 is disposed on a surface of the phase change thermal storage layer 21 at an end far from the functional element 10.

In this embodiment, in order to satisfy the comfort level of the user, a heat insulation layer 40 is added to isolate the influence of the temperature rise of the heating element on the mobile phone shell.

Referring to fig. 2, in an embodiment, the thermal insulation layer 40 of the electronic device is provided with at least one vent hole 41 penetrating through the thermal insulation layer 40.

Optionally, a plurality of vent holes 41 are evenly distributed on the insulation layer 40. When the functional element 10 is in a low-temperature standby state, the air holes 41 absorb moisture from the air and store the moisture in the moisture absorption layer 30, and the entire material in the heat dissipation assembly 20 is in a solid state. When the functional device 10 starts to operate and the moisture absorption layer 30 starts to be heated, the air holes 41 evaporate moisture (accelerate) to take away heat, and the phase change material in the heat dissipation assembly 20 changes phase to delay the rising speed of the surface temperature of the functional device.

Optionally, the electronic device is selected from at least one of a mobile phone, a tablet, a computer, a game machine, a reader, a player, a stereo, a power amplifier, a projector, a television, an electronic toy, a router and a switch.

These conventional electronic devices often generate a large amount of heat during operation, and need to be properly dissipated or stored. Through these electron devices who set up phase transition heat-retaining material, can effectively reduce operating temperature, increase of service life.

Alternatively, the functional element 10 in the electronic device is selected from at least one of a battery, a heat-generating chip, an electric device, and a display device.

The functional elements of the battery, the heating chip, the electric device and the display device are all common heating elements, and a large amount of heat is generated in the operation.

In this embodiment, the electronic device utilizes the heat storage material, the moisture absorption material, and the vent hole to reduce the temperature of the functional element 10, thereby delaying the rising rate of the temperature of the functional element 10.

In one embodiment of the phone case 50, as shown in fig. 3, an opening including a speaker sound outlet, a SIM card fitting gap, a receiver small hole, a phone camera decoration, etc. may be used as the first breathing hole 51. Or a second breathing hole 52 specially arranged on the mobile phone shell 50. The breathing hole has communicated the inside and outside air of electron device shell, not only can make the heat that heating element produced in the work go to with the vapor that gives off can give off the outside air smoothly, when heating element temperature reduces, can also get into the shell with the air exchange that the shell outside contains steam inside, make heat-retaining phase change material or hygroscopic layer can inhale moisture to do benefit to the heat dissipation that volatilizees next time.

As above, the electronic device that this application provided can utilize heat-retaining material and moisture-absorbing material and cooperate the novel structure that has the air vent to absorb certain heat and reach the temperature that reduces the chip, delays chip temperature rise rate to realize reducing heating element's operating temperature, extension product life promotes the effect of user's experience.

The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application, or which are directly or indirectly applied to other related technical fields, are included in the scope of the present application.

Claims

1. The utility model provides an electronic device, its characterized in that, includes functional element, installation department and radiator unit, radiator unit passes through the installation department set up in on the functional element, radiator unit includes phase change heat storage layer, radiator unit includes the fin, the fin set up in between functional element and the phase change heat storage layer.

2. The electronic device according to claim 1, wherein the heat sink is provided between the mounting portion and the phase change thermal storage layer.

3. The electronic device of claim 1, wherein the heat sink is at least one of a graphite sheet, a graphene sheet, a heat pipe, a vapor chamber, a copper foil, and a heat sink VC.

4. An electronic device according to any one of claims 1-3, wherein the phase-change thermal storage layer is a crystalline hydrated salt or a paraffin-based material.

5. The electronic device of any of claims 1-3, wherein the mounting portion is at least one of a cured glue, a snap assembly, a fastening assembly, a slot assembly, a pin assembly, and a screw assembly.

6. The electronic device according to any one of claims 1 to 3, further comprising a moisture absorption layer disposed on a surface of the phase change thermal storage layer away from the functional element.

7. The electronic device according to claim 6, wherein the moisture absorption layer is at least one of an inorganic moisture absorption material and an organic moisture absorption material.

8. The electronic device according to any one of claims 1 to 3, wherein the electronic device further comprises a thermal insulation layer disposed on a surface of the phase change thermal storage layer away from the functional element.

9. The electronic device of claim 8, wherein the thermal insulation layer is provided with at least one vent hole therethrough, and a housing of the electronic device is provided with a breathing hole for exchanging air.