CN216491676U - Heat dissipation plate and electronic device - Google Patents
Heat dissipation plate and electronic device Download PDFInfo
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- CN216491676U CN216491676U CN202122410340.XU CN202122410340U CN216491676U CN 216491676 U CN216491676 U CN 216491676U CN 202122410340 U CN202122410340 U CN 202122410340U CN 216491676 U CN216491676 U CN 216491676U
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- heat
- layer
- phase change
- heat dissipation
- change material
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Abstract
The utility model provides a heat dissipation plate which comprises a heat conduction interface layer, a temperature equalization plate, a heat storage layer and a heat conduction layer, wherein the heat conduction interface layer, the temperature equalization plate, the heat storage layer and the heat conduction layer are sequentially attached to each other; the phase change temperature range of the phase change material layer is 28-45 ℃. Compared with the prior art, the heat dissipation plate provided by the utility model can provide better, more stable and more balanced heat dissipation effects.
Description
[ technical field ] A
The present invention relates to the field of heat transfer, and in particular, to a heat sink and an electronic device.
[ background ] A method for producing a semiconductor device
When the electronic device works, active heating components such as a chip, a battery, a screen and a camera module exist in the electronic device, and if the heat generated by the components is not timely conducted and dissipated, the electronic device is halted, restarted or even damaged due to overhigh temperature.
Electronic devices in the prior art generally employ some heat dissipation components (e.g., a temperature equalization plate) to quickly dissipate heat to an outer casing of the electronic device, so as to maintain the temperature of the internal environment of the electronic device. However, in the heat dissipation scheme of the prior art, since the heat is quickly conducted to the outer casing of the electronic device, the electronic device may have a bad usage experience of scalding hands when being used.
Therefore, it is necessary to provide a new heat sink and an electronic device to solve the above-mentioned problems.
[ Utility model ] content
The utility model aims to provide a radiating sheet and electronic equipment which have good radiating effect and can increase the operation experience hand feeling.
In order to achieve the purpose, the utility model provides a heat dissipation plate which comprises a heat conduction interface layer, a temperature equalizing plate, a heat storage layer and a heat conduction layer which are sequentially attached, wherein the heat storage layer comprises a phase change material layer, the phase change material layer is made of microcapsule particles, and the microcapsule particles are microcapsule shells and n-alkane wrapped by the microcapsule shells; the phase change temperature range of the phase change material layer is 28-45 ℃.
Preferably, the microcapsule shell is made of any one of polyurethane, polyurea resin and polyester resin; or any one of calcium carbonate and silicon dioxide; the enthalpy value range of the microcapsule particles is 170J/g-220J/g.
Preferably, the heat conducting layer is one or more of a graphite sheet, a graphene sheet, a copper foil and an aluminum foil.
Preferably, the heat-conducting interface layer is one or more of a heat-conducting paste and a heat-conducting pad.
Preferably, a heat transfer layer is further clamped between the heat storage layer and the temperature equalizing plate, and the heat transfer layer is one or more of a copper foil, an aluminum foil and a graphite sheet.
Preferably, the heat storage layer further comprises a protective film attached to one side of the phase change material layer, and the phase change material layer is directly coated on one side, away from the temperature equalization plate, of the heat transfer layer.
Preferably, the protective film is made of copper foil or aluminum foil.
The utility model also provides electronic equipment which comprises a shell with an accommodating space, wherein a chip, a battery, a camera module and a screen which actively generate heat are accommodated in the shell, the electronic equipment also comprises the heat dissipation plate which is attached to the shell, the heat conduction layer of the heat dissipation plate is attached to the shell, and the heat conduction interface layer is attached to at least one of the chip, the battery, the camera module and the screen.
Compared with the prior art, the heat dissipation plate provided by the utility model contains the phase-change material layer, the phase-change material plays a role in heat buffering in the whole heat dissipation system, and the phenomenon that the power is suddenly increased in a short time, and the temperature of heat source devices (such as a chip, a battery, a camera module, a screen and the like) is sharply increased to influence the operation experience of a mobile phone is prevented. And secondly, the continuously generated heat is partially absorbed by the phase change material layer, so that the temperature rise of the whole body is restrained, the whole use temperature is in a body-sensing comfortable area, and the absorbed heat is slowly released when the device is operated at low power.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic structural view of a heat dissipation plate according to a first embodiment of the present invention;
fig. 2 is a schematic structural view of a second heat dissipation plate according to an embodiment of the present invention;
fig. 3 is a schematic structural view of a heat storage layer in a second embodiment of the heat dissipation plate of the present invention;
fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of an embodiment of an electronic device using a heat dissipation plate.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of a heat dissipation plate according to a first embodiment of the present invention. The utility model provides a heat dissipation plate 100, wherein the heat dissipation plate 100 comprises a heat conduction interface layer 101, a temperature equalizing plate 102, a heat storage layer 103 and a heat conduction layer 104 which are sequentially attached, the heat conduction layer 104 is one or more of a graphite sheet, a graphene sheet, a copper foil and an aluminum foil, and the heat conduction layer can rapidly guide heat stored in the heat storage layer out of the heat dissipation plate; the heat conducting interface layer 101 is one or more of heat conducting paste and a heat conducting pad, and the heat conducting interface layer 101 is in contact with a heat source component in the electronic equipment in application, so that the heat dissipation plate 101 can absorb heat generated by the heat source quickly; the heat storage layer 103 comprises a phase change material layer 1031, the phase change material layer 1031 is made of microcapsule particles, and the microcapsule particles are microcapsule shells and n-alkane (C18-C22) wrapped by the microcapsule shells; the phase change material layer 1031 has a phase change temperature range of 28-45 ℃.
A Phase Change Material (PCM-Phase Change Material) refers to a substance that changes the state of a substance at a constant temperature and can provide latent heat. The process of changing physical properties is called a phase change process, and in this case, the phase change material absorbs or releases a large amount of latent heat.
Specifically, in the present embodiment, the microcapsule shell is made of a polymer material, for example, any one of polyurethane, polyurea resin, and polyester resin; or inorganic materials such as calcium carbonate and silicon dioxide. More preferably, the enthalpy value range of the microcapsule particles is 170J/g-220J/g.
The heat dissipation plate 100 provided by the embodiment is provided with the heat storage layer comprising the phase change material layer 1031, and is matched with the temperature equalizing plate 102, so that heat is quickly led out from a heat source component, a heat buffering effect is achieved, sudden increase of power in a short time is prevented, and the use experience of a mobile phone is influenced due to rapid temperature rise.
Fig. 2 is a schematic structural diagram of a second heat dissipation plate according to an embodiment of the present invention. The structure of this embodiment is substantially the same as that of the first embodiment, wherein a heat transfer layer 105 is further interposed between the heat storage layer 103 and the temperature equalization plate 102, and the heat transfer layer 105 is one or more of a copper foil, an aluminum foil, and a graphite sheet. The phase change material layer 1031 of the thermal storage layer 103 is directly coated on the side of the heat transfer layer 105 far away from the temperature equalization plate 102.
Because the heat storage layer 103 and the temperature equalizing plate 102 are used together, the temperature equalizing plate 102 conducting heat quickly and the heat storage layer 103 storing heat have strong competition, but because the heat conductivity of the heat storage layer is 0.1w/(k.m), the response time to heat is slow, in order to enable the heat dissipation plate 100 to respond quickly and dissipate heat, the second embodiment adopts copper foil, one or more of aluminum foil or graphite flake is used as the heat transfer layer 105, which is attached to the temperature equalizing plate 102, and because the phase change material layer 1031 is directly coated on the surface layer of the temperature equalizing plate 102, the use of glue is reduced, the thermal resistance is reduced, the phase change material layer 1031 is heated quickly, and the temperature is reduced.
Referring to fig. 2 to 3, in the heat dissipating plate 100 according to the second embodiment, the heat storage layer 103 further includes a protective film 1032 attached to one side of the phase change material layer 1031, the protective film 1032 is made of copper foil or aluminum foil, and the protective film 1032 facilitates a mass production process of the heat storage layer and can protect the phase change material layer 1031.
As shown in fig. 4-5, the present invention further provides an electronic apparatus 200, which includes a housing 201 having a receiving space, the housing includes a bottom plate 2011 and a middle frame 2012 covering the bottom plate 2011, and the housing 201 receives therein a chip 202, a battery 203, a camera module 204 and a screen 205 that actively generate heat.
As shown in fig. 5, the heat dissipation plate 100 is applied to the electronic device 200, wherein the heat conduction interface layer 101 of the heat dissipation plate 100 is attached to the chip 202, and the heat conduction layer is attached to the housing 201, so that the heat can be quickly and uniformly conducted from the chip 202 to the housing.
Compared with the prior art, the heat dissipation plate provided by the utility model contains the phase-change material layer, the phase-change material plays a role in heat buffering in the whole heat dissipation system, and the phenomenon that the power is suddenly increased in a short time, and the temperature of heat source devices (such as a chip, a battery, a camera module, a screen and the like) is sharply increased to influence the operation experience of a mobile phone is prevented. And secondly, the continuously generated heat is partially absorbed by the phase change material layer, so that the temperature rise of the whole body is restrained, the whole use temperature is in a body-sensing comfortable area, and the absorbed heat is slowly released when the device is operated at low power.
While the foregoing is directed to embodiments of the present invention, it will be understood by those skilled in the art that various changes may be made without departing from the spirit and scope of the utility model.
Claims (8)
1. The heat dissipation plate is characterized by comprising a heat conduction interface layer, a temperature equalizing plate, a heat storage layer and a heat conduction layer which are sequentially attached, wherein the heat storage layer comprises a phase change material layer, the phase change material layer is made of microcapsule particles, and the microcapsule particles are microcapsule shells and n-alkane wrapped by the microcapsule shells; the phase change temperature range of the phase change material layer is 28-45 ℃.
2. The heat dissipating plate of claim 1, wherein the microcapsule shell is made of any one of polyurethane, polyurea resin and polyester resin; or any one of calcium carbonate and silicon dioxide; the enthalpy value range of the microcapsule particles is 170J/g-220J/g.
3. Heat distribution plate according to claim 1, wherein the heat conductive layer is one or more of a graphite sheet, a graphene sheet, a copper foil and an aluminum foil.
4. The heat spreader as claimed in claim 1, wherein the thermal interface layer is one or more of a thermal paste and a thermal pad.
5. The heat dissipation plate as claimed in claim 1, wherein a heat transfer layer is further sandwiched between the heat storage layer and the temperature equalization plate, and the heat transfer layer is one or more of a copper foil, an aluminum foil, and a graphite sheet.
6. The heat dissipating plate of claim 5, wherein the thermal storage layer further comprises a protective film attached to one side of the phase change material layer, and the phase change material layer is directly coated on the side of the heat transfer layer away from the temperature equalizing plate.
7. Heat dissipation plate according to claim 6, wherein the protective film is made of copper foil or aluminum foil.
8. An electronic device, comprising a housing having a receiving space, wherein the housing contains a chip, a battery, a camera module and a screen, which actively generate heat, the electronic device further comprises a heat dissipation plate according to any one of claims 1 to 7 attached to the housing, the heat conduction layer of the heat dissipation plate is attached to the housing, and the heat conduction interface layer is attached to at least one of the chip, the battery, the camera module and the screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122410340.XU CN216491676U (en) | 2021-09-30 | 2021-09-30 | Heat dissipation plate and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122410340.XU CN216491676U (en) | 2021-09-30 | 2021-09-30 | Heat dissipation plate and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216491676U true CN216491676U (en) | 2022-05-10 |
Family
ID=81437923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122410340.XU Expired - Fee Related CN216491676U (en) | 2021-09-30 | 2021-09-30 | Heat dissipation plate and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216491676U (en) |
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2021
- 2021-09-30 CN CN202122410340.XU patent/CN216491676U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220510 |