WO2014019421A1 - 触控面板模组及其制造方法 - Google Patents

触控面板模组及其制造方法 Download PDF

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Publication number
WO2014019421A1
WO2014019421A1 PCT/CN2013/077743 CN2013077743W WO2014019421A1 WO 2014019421 A1 WO2014019421 A1 WO 2014019421A1 CN 2013077743 W CN2013077743 W CN 2013077743W WO 2014019421 A1 WO2014019421 A1 WO 2014019421A1
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WO
WIPO (PCT)
Prior art keywords
layer
touch panel
protective layer
panel module
see
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PCT/CN2013/077743
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English (en)
French (fr)
Inventor
纪贺勋
邱宗科
余晶
张专元
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宸鸿科技(厦门)有限公司
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Publication of WO2014019421A1 publication Critical patent/WO2014019421A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/169—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated pointing device, e.g. trackball in the palm rest area, mini-joystick integrated between keyboard keys, touch pads or touch stripes
    • G06F1/1692—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated pointing device, e.g. trackball in the palm rest area, mini-joystick integrated between keyboard keys, touch pads or touch stripes the I/O peripheral being a secondary touch screen used as control interface, e.g. virtual buttons or sliders
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Definitions

  • the present invention relates to a panel module, and more particularly to a touch panel module and a method of fabricating the same.
  • the thickness of the touch panel is an important factor affecting the thinning of such electronic products.
  • the single-layer touch panel structure has a thin thickness, and thus is a trend of technological development in the industry.
  • the edge region of the panel is less resistant to impact, which causes the edge region to be damaged during processing.
  • the invention provides a touch panel module and a manufacturing method thereof, which can achieve the effect of protecting the edge region of the touch panel.
  • the invention provides a touch panel module, comprising: an integrated panel defining a see-through area and a non-perspective area around the see-through area, the integrated panel comprising: a cover plate having an opposite inner surface And an outer surface; a decorative layer disposed on the inner surface of the cover plate and located in the non-perspective region; a sensing electrode layer disposed on the inner surface of the cover plate and located in the see-through region; a circuit layer, Located on the decorative layer and electrically connected to the sensing electrode layer; and a protective layer covering at least part of the decorative layer and a portion of the circuit layer; and a molded case for in-mold injection molding Located in the non-see-through region and formed on the protective layer and partially covering the edge of the integrated panel.
  • the protective layer is further defined as an optical grade protective layer, and the optical grade protective layer is coated on the sensing electrode layer.
  • the material of the optical grade protective layer is at least one of silicon oxide, silicon nitride and polymethyl methacrylate.
  • the protective layer is further defined as a non-optical grade protective layer.
  • the non-optical grade protective layer is made of ink.
  • the protective layer has a softening temperature higher than 160 ° C and the protective layer has a hardness greater than 2H.
  • the sensing electrode layer extends onto the decorative layer.
  • the molded housing has an outer end surface connected to the outer surface of the substrate, and the outer end surface is substantially in the same plane as the outer surface.
  • the embodiment of the present invention further provides a method for manufacturing a touch panel module as described above, the method comprising: forming an integrated panel, the integrated panel defining a see-through area and a non-perspective area around the see-through area, Wherein the integrated panel includes a cover having an opposite inner surface and an outer surface, wherein the method of forming the integrated panel comprises: providing a decorative layer on the inner surface of the cover and located in the non-perspective within the area; a sensing electrode layer is disposed on the inner surface of the cover plate and located in the see-through region; a circuit layer is disposed on the decorative layer, and the circuit layer is electrically connected to the sensing electrode layer; and a protective layer is disposed.
  • the method for forming the molded casing by in-mold injection molding further comprises: providing a mold set surrounding the cavity; defining the integrated panel into the cavity of the mold set, and the integrated An edge of the panel encloses a housing space with the mold set; injecting a molten plastic into the housing space; and forming the molded housing by pressure-holding cooling to cause the integrated panel and the molded housing
  • the touch panel module is formed in combination.
  • the technical solution of the present invention can avoid the problem that the edge area of the touch panel module is easily damaged.
  • FIG. 1 is a perspective view of the present invention, showing an appearance of an electronic product having a touch panel module
  • FIG. 2 is a cross-sectional view of a preferred embodiment of the touch panel module disclosed along the line A-A of FIG. 1;
  • FIG. 3 is a top view of the integrated panel included in the touch panel module of FIG. 1;
  • FIG. 4 is a cross-sectional view of another preferred embodiment of the touch panel module disclosed along the line A-A of FIG. 1;
  • FIG. 5 is a schematic flow chart of a method for manufacturing a touch panel module according to the present invention.
  • 6 to 9 are schematic views showing the flow of the molded case formed by in-mold injection molding according to FIG.
  • the touch panel module 100 includes an integrated panel 1 and a molded case 2 .
  • the integrated panel 1 is a single-layer touch panel referred to in the industry, and the molded case 2 is coated on the edge of the integrated panel 1 by in-mold injection molding.
  • the in-mold injection molding method has the advantages of simple steps because of the step of saving the combination.
  • FIG. 2 is a cross-sectional view of a preferred embodiment of the touch panel module disclosed along the line AA of FIG. 1
  • FIG. 3 is a touch panel module according to FIG. 1 .
  • the integrated panel 1 defines a see-through area 1111 and a non-perspective area 1112 located around the see-through area 1111.
  • the integrated panel 1 includes a cover 11 , a decorative layer 12 , a sensing electrode layer 13 , a circuit layer 14 , and a protective layer 15 .
  • the molded casing 2 is partially formed in the non-see-through region 1112 by in-mold injection molding and formed on the protective layer 15 and partially covering the edge of the integrated panel 1. As shown in FIG.
  • the see-through area 1111 can be rectangular, and the non-perspective area 1112 can be square and surround the see-through area 1111.
  • the components shown in FIG. 3 are only shown in FIG. One implementation of the integrated panel structure is not intended to limit the scope of the invention.
  • the cover plate 11 has an opposite inner surface 111 and an outer surface 112.
  • the cover plate is used to protect and carry the components formed on the inner surface 111 thereof.
  • the outer surface 112 of the cover 11 serves as an interface for a finger or a stylus to contact.
  • a special functional coating such as an anti-reflective layer or an anti-staining layer may be formed on the outer surface of the cover plate 11.
  • the cover 11 is a light transmissive substrate made of glass that is resistant to at least 1000 ° C.
  • the decorative layer 12 is disposed on the inner surface 111 of the cover 11 and located in the non-perspective area 1112. In other words, the decorative layer 12 is also substantially in a square ring shape. In one embodiment, the decorative layer 12 is formed with a patterned area (not shown), such as a functional key pattern or a logo pattern on a typical mobile phone product.
  • the material of the decorative layer 12 can be colored photoresist or ink, so that when the touch panel module 100 is viewed from the outer surface 112 of the cover 11 , the color or pattern design of the decorative layer 12 can be seen, thereby shielding the decorative layer.
  • Related design on 12 eg, circuit layer 14).
  • the sensing electrode layer 13 is disposed on the inner surface 111 of the cover 11 and is located in the see-through region 1111. Further, the sensing electrode layer extends onto the decorative layer 12, that is, the extended portion 131 shown in FIGS. 2 and 3. The sensing electrode layer 131 extends onto the decorative layer 12 to meet the design requirements of the patterned layer of the decorative layer 12 having a touch function.
  • the sensing electrode layer 13 may be a single-layer biaxial electrode structure as shown in FIG. 3, but may be other electrode structures.
  • the circuit layer 14 is located on the decorative layer 12 and is electrically connected to the sensing electrode layer 13 .
  • the wiring layer 14 has a plurality of wires 141, and the wires 141 are spaced apart from each other on the decorative layer 12.
  • the wires 141 are concentrated by a wiring design to a bonding region 16 (Bonding And is electrically connected to a controller (not shown) by an external flexible circuit board or a lead pin, thereby outputting a sensing signal of the sensing electrode layer 13 to the controller.
  • the protective layer 15 is coated on at least part of the decorative layer 12 and part of the wiring layer 14. Specifically, the partial decorative layer 12 and the partial wiring layer 14 located in the non-see-through region need to pass through the coating of the protective layer 15 to avoid the color change and the circuit layer of the decorative layer 12 which may be generated during the process of forming the molded case 2. 14 The problem of compression fracture, thereby avoiding the problem that the edge area of the integrated panel 1 is easily damaged. It should be noted that the circuit layer 14 located in the bonding region 16 is not covered by the protective layer 15 to ensure that the circuit layer 14 located in the bonding region 16 can be electrically connected to a controller by an external flexible circuit board or a guiding pin ( The figure is not shown).
  • the protective layer 15 is further defined as an optical grade protective layer 151 in this embodiment.
  • the optical grade protective layer 151 is preferably provided with light transmissive properties and does not reduce the light transmittance of the components covered by the optical grade protective layer 151.
  • the optical grade protective layer 151 may be made of silicon oxide (SiOx) or nitrided. At least one of silicon (SiNx) and polymethyl methacrylate (PMMA).
  • optical protection layer 151 is also coated on the sensing electrode layer 13 to protect the sensing electrode layer 13.
  • the optical grade protective layer 151 when the optical grade protective layer 151 reaches a certain condition, for example, the softening temperature of the optical grade protective layer 151 is higher than 160 ° C, and the hardness of the optical grade protective layer 151 is greater than 2H, the optical grade protective layer 151 can be made. It has a better protective effect, but is not limited thereto.
  • FIG. 4 is a cross-sectional view of another preferred embodiment of the touch panel module disclosed along the line AA of FIG. 1 , which is similar to the components disclosed in the embodiment of FIG. 2 .
  • the protective layer 15 of FIG. 4 is a non-optical grade protective layer 152.
  • the non-optical-grade protective layer 152 shown in FIG. 4 refers to reducing the light transmittance of the component covered thereby.
  • the material of the non-optical-grade protective layer 152 may be ink. .
  • the non-optical grade protective layer 152 is different from the optical grade protective layer 151 in that the non-optical grade protective layer 152 is only coated on the partial decorative layer 12 and the partial wiring layer 14.
  • the non-optical grade protective layer 152 reaches a certain condition, such as a softening temperature higher than 160 ° C, and the hardness of the non-optical grade protective layer 152 is greater than 2H, the non-optical grade can be made.
  • the protective layer 152 has a preferable protective effect, but is not limited thereto.
  • FIG. 5 is a schematic flowchart of a method for manufacturing a touch panel module according to the present invention.
  • the steps include: forming an integrated panel (step S50 ) And forming a molded case by in-mold injection molding (step S52), wherein the integrated panel defines a see-through area and a non-perspective area around the see-through area, the cover plate has an opposite inner surface and an outer surface surface.
  • FIG. 9 is a schematic flow chart of the molded case in which the step S52 is formed by the in-mold injection molding method of the present invention.
  • a mold set 200 for an injection molding machine which comprises a fixed mold 201 and a moving mold 202, and the fixed mold 201 and the inner edge of the movable mold 202 surround a cavity 203.
  • the cavity 203 has a shape of the pre-made touch panel module 100, that is, the cavity 203 includes a volume sufficient to provide the integrated panel 1 and the molded case 2 .
  • the integrated panel 1 is placed into the cavity 203 of the mold set 200 as an insert in the cavity 203, and the edge of the integrated panel 1 is surrounded by the die set 200 to define A housing space 204.
  • the outer surface 112 of the cover 11 of the integrated panel 1 abuts against the inner edge of the fixed mold 201, and the inner edge of the movable mold 202 abuts against the protective layer 15 of the integrated panel 1.
  • the protective layer 15 can be as shown in FIG.
  • the optical protective layer 151 is also the non-optical grade protective layer 152 shown in FIG. 4, wherein the protective layer 15 has a softening temperature higher than 160 ° C and a hardness greater than 2H.
  • a molten plastic 2' is injected from the moving mold 202.
  • the molded case 2 is formed in the housing space 204 and then cooled by pressure-holding, so that the integrated panel 1 and the molded case 2 are combined to form the touch panel module 100, wherein the partial mold
  • the casing 2 is located in the non-perspective area and is formed on the protective layer 15 and the partially molded casing 2 covers the edge of the integrated panel 1.
  • the molded casing 2 has an outer end surface connected to the outer surface of the cover plate, and the outer end surface is located on the same horizontal surface as the outer surface.
  • the decorative layer 12 and the circuit layer 14 are protected by the protective layer 15 (buffering and heat insulation), so that the direct contact with the molten plastic 2' is reduced.
  • the possibility of avoiding variations in the color or pattern of the decorative layer 12 and avoiding the circuit layer 14 due to injection of molten plastic 2 ' The generated pressure causes the wire 141 to break.
  • the protective layer 15 helps to prevent the decorative layer 12 and the circuit layer 14 from being scratched or the like in the above process, thereby avoiding the problem that the edge region of the touch panel module 100 is easily damaged.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Position Input By Displaying (AREA)

Abstract

本发明提供一种触控面板模组，包括一整合式面板，界定有一透视区域及位于该透视区域周围的一非透视区域，该整合式面板包含：一盖板，具有相对的一内表面及一外表面；一装饰层，设置于该盖板的内表面且位于该非透视区域内；一感测电极层，设置于该盖板的内表面且位于该透视区域内；一线路层，位于该装饰层上且电性连接于该感测电极层；及一保护层，至少披覆于部分该装饰层与部分该线路层上；以及一模制壳体，以模内射出成型方式部分位于该非透视区域内且形成在该保护层上以及部分包覆该整合式面板的边缘。此外，本发明另提供一种触控面板模组的制造方法。采用本发明的技术方案，可避免触控面板模组边缘区域易损坏的问题。

Description

触控面板模组及其制造方法 技术领域
本发明是有关一种面板模组，且特别是有关于一种触控面板模组及其制造方法。
背景技术
近年来，许多电子产品都将触控面板与显示面板整合，让触控面板作为使用者的输入界面，藉此省略键盘或是实体按键所占用的空间，进而让电子产品更轻薄短小。
触控面板的厚度是影响该类电子产品薄型化的重要因素，单层触控面板结构具有较薄的厚度，因而是业界技术发展的趋势。但是对于单层触控面板结构而言，由于厚度较薄，面板边缘区域耐冲撞的能力较差，导致面板在加工过程中，容易出现边缘区域损坏的问题。
缘是，本发明人有感上述缺失之可改善，乃特潜心研究并配合学理的运用，终于提出一种设计合理且有效改善上述缺失之本发明。
发明内容
本发明提供了一种触控面板模组及其制造方法，其可达到保护触控面板边缘区域的效果。
本发明提供一种触控面板模组，包括：一整合式面板，界定有一透视区域及位于该透视区域周围的一非透视区域，该整合式面板包含：一盖板，具有相对的一内表面及一外表面；一装饰层，设置于该盖板的内表面且位于该非透视区域内；一感测电极层，设置于该盖板的内表面且位于该透视区域内；一线路层，位于该装饰层上且电性连接于该感测电极层；及一保护层，至少披覆于部分该装饰层与部分该线路层上；以及一模制壳体，以模内射出成型方式部分位于该非透视区域内且形成在该保护层上以及部分包覆该整合式面板的边缘。
优选地，该保护层进一步限定为一光学级保护层，且该光学级保护层披覆于该感测电极层上。
优选地，该光学级保护层的材质为氧化硅、氮化硅及聚甲基丙烯酸甲酯的至少其中之一。
优选地，该保护层进一步限定为一非光学级保护层。
优选地，该非光学级保护层的材质为油墨。
优选地，该保护层的软化温度高于160℃，且该保护层的硬度大于2H。
优选地，该感测电极层延伸至该装饰层上。
优选地，该模制壳体具有一外端面，该外端面相连于该基板外表面，且该外端面与该外表面大致坐落于同一平面上。
本发明实施例另提供一种如上所述的触控面板模组的制造方法，其步骤包括：形成一整合式面板，该整合式面板界定有一透视区域及位于透视区域周围的一非透视区域，其中该整合式面板包括一盖板，该盖板具有相对的一内表面及一外表面，其中形成该整合式面板的方法包括：设置一装饰层于该盖板的内表面且位于该非透视区域内； 设置一感测电极层于该盖板的内表面且位于该透视区域内；设置一线路层于该装饰层上，且该线路层与该感测电极层电性连接；以及设置一保护层，该保护层至少披覆于部分该装饰层与部分该线路层；以及以模内射出成型方式形成一模制壳体，其中部分模制壳体位于该非透视区域内且形成在该保护层上以及部分模制壳体包覆该整合式面板的边缘。
进一步地，以模内射出成型方式形成该模制壳体的方法更包括：提供一模具组，其包围界定有一模穴；将该整合式面板置入该模具组的模穴内，且该整合式面板的边缘与该模具组包围界定出一壳体空间；注射一熔融塑料至该壳体空间中；以及经保压冷却形成该模制壳体，以使该整合式面板与该模制壳体结合形成该触控面板模组。
综上所述，采用本发明的技术方案，可避免触控面板模组边缘区域易损坏的问题。
为使能更进一步了解本发明的特征及技术内容，请参阅以下有关本发明的详细说明与附图，但是此等说明与所附图示仅系用来说明本发明，而非对本发明的权利范围作任何的限制。
附图说明
图1是本发明的立体示意图，揭示具有触控面板模组的电子产品外观；
图2是沿图1的A-A剖面线所揭示的触控面板模组的一较佳实施例的剖面图；
图3是依据图1的触控面板模组内含的整合式面板的上视图；
图4是沿图1的A-A剖面线所揭示的触控面板模组的另一较佳实施例的剖面图；
图5是本发明所揭示的触控面板模组的制造方法的流程示意图；以及
图6-图9是依据图5以模内射出成型形成模制壳体的流程示意图。
具体实施方式
请参阅图1所示，其为本发明的一实施例，本实施例为一种触控面板模组100，包括一整合式面板1及一模制壳体2。
其中，上述整合式面板1为业内所指称的单层触控面板，而模制壳体2是以模内射出成型的方式包覆于所述整合式面板1的边缘。相较于采用粘性物质(如水胶)结合模制殻体2与该整合式面板1的方式，采用模内射出成型的方式由于节省了结合的步骤，具有步骤较为简洁的优势。
请合并参阅图2与图3，其中图2为沿图1的A-A剖面线所揭示的触控面板模组的一较佳实施例的剖面图，图3为依据图1的触控面板模组内含的整合式面板的上视图。所述整合式面板1界定有一透视区域1111及位于该透视区域1111周围的一非透视区域1112。所述整合式面板1包含有一盖板11、一装饰层12、一感测电极层13、一线路层14及一保护层15。所述模制壳体2以模内射出成型方式部分位于该非透视区域1112内且形成在该保护层15上以及部分包覆该整合式面板1的边缘。其中，如图3所示，透视区域1111可呈矩形状，而非透视区域1112可呈方环状且围绕于透视区域1111外，图3所绘示的各元件，仅为图1所示的整合式面板结构的一种可实施方式，但并不用以限制本发明的解释范围。
所述盖板11具有相对的一内表面111及一外表面112。所述盖板用以保护和承载形成在其内表面111的各元件。所述盖板11的外表面112作为手指或者触控笔接触的界面。在一实施例中，所述盖板11的外表面上，可形成有特殊的功能涂层，如抗反射层或抗污层。在一实施例中，盖板11为能耐热至少1000℃的玻璃所制成的一透光基板。
所述装饰层12设置于盖板11内表面111且位于非透视区域1112内，换言之，装饰层12亦大致呈方环状。在一实施例中，装饰层12形成有图案化的区域（图未示），如通常手机产品上功能键图案或Logo图案。所述装饰层12的材质可为有色光阻或油墨，藉以令触控面板模组100自盖板11外表面112观看时，可看到装饰层12的颜色或图案设计，进而遮蔽位于装饰层12上的相关设计(如：线路层14)。
所述感测电极层13设置于盖板11的内表面111上且位于透视区域1111内。进一步地，感测电极层延伸至装饰层12上，即图2和图3中所示的延伸部分131。感测电极层131延伸至装饰层12上，可满足装饰层12图案化区域具有触控功能的设计需要。所述感测电极层13可为如图3所示的单层双轴的电极结构，但亦可为其它电极结构。
所述线路层14位于装饰层12上且电性连接于感测电极层13。更详细地说，线路层14具有数条导线141，且所述导线141间隔地排列于装饰层12上。所述导线141通过布线设计会聚至一接合区域16（Bonding Area）,并藉由外接软性电路板或导针电性连接于一控制器(图未示)上，藉以输出感测电极层13的感测信号至上述控制器。
所述保护层15至少披覆于部分装饰层12与部分线路层14上。具体而言，位于非透视区域的部分装饰层12和部分线路层14，需通过保护层15的披覆，藉以避免形成模制壳体2的过程中可能产生的装饰层12颜色变化和线路层14受压断裂的问题，进而避免整合式面板1边缘区域易损坏的问题。另需说明的是，位于接合区域16的线路层14未被保护层15覆盖，以保证位于接合区域16的线路层14可藉由外接软性电路板或导针电性连接于一控制器(图未示)上。
所述保护层15于本实施例中进一步限定为一光学级保护层151。其中，上述光学级保护层151具备有较佳透光性且不会降低其所覆盖的元件的透光性，举例来说，光学级保护层151的材质可为氧化硅(SiOx)、氮化硅(SiNx)及聚甲基丙烯酸甲酯(PMMA)的至少其中之一。
进一步地，上述光学级保护层151亦会披覆于感测电极层13上，起到保护感测电极层13的作用。
须说明的是，在光学级保护层151达到一定条件时，如：光学级保护层151的软化温度高于160℃，且光学级保护层151的硬度大于2H，将可使光学级保护层151具有较佳的保护效果，但不受限于此。
请合并参阅图3与图4，其中图4为沿图1的A-A剖面线所揭示的触控面板模组的另一较佳实施例的剖面图，其与图2实施例所揭露的元件类似，但图4的保护层15为一非光学级保护层152。
具体而言，于光学特性上，图4所示的非光学级保护层152指的是会降低其所覆盖的元件的透光性，举例来说，非光学级保护层152的材质可为油墨。
再者，于构造设计上，非光学级保护层152不同于光学级保护层151之处在于，所述非光学级保护层152仅披覆于部分装饰层12以及部分线路层14上。
与光学级保护层151材料特性相似，当该非光学级保护层152达到一定条件时，如软化温度高于160℃，且该非光学级保护层152的硬度大于2H，将可使非光学级保护层152具有较佳的保护效果，但不受限于此。
所述模制壳体2具有一外端面21，上述外端面21相连于盖板11外表面112，且模制壳体2的外端面21与盖板11的外表面112坐落于同一水平面上。
请参考图5，是绘示本发明另提供一种触控面板模组的制造方法的流程示意图，其步骤包括：形成一整合式面板(步骤S50) 以及以模内射出成型方式形成一模制壳体(步骤S52)，其中该整合式面板界定有一透视区域及位于透视区域周围的一非透视区域，该盖板具有相对的一内表面及一外表面。
其中，形成步骤S50的整合式面板的方法包括：设置一装饰层于该盖板的内表面且位于该非透视区域内(步骤S510)；设置一感测电极层于该盖板的内表面且位于该透视区域内(步骤S520)，其中感测电极层可进一步延伸至装饰层上；设置一线路层于该装饰层上(步骤S530)，且该线路层与该感测电极层电性连接； 设置一保护层(步骤S540)，该保护层至少披覆于部分装饰层与部分线路层上。
其中，请参考图6至图9，是本发明以模内射出成型方式形成步骤S52的模制壳体的流程示意图。
首先，请参阅图6所示，提供一用于射出成型机的模具组200，其包含一固定模具201与一移动模具202，且固定模具201与移动模具202内缘包围界定出一模穴203，其中，所述模穴203具有预制触控面板模组100的型体，亦即模穴203包含足以设置整合式面板1与成形模制壳体2的容积。
请再参阅图7所示，将整合式面板1置入上述模具组200的模穴203内以作为模穴203内的置入件，所述整合式面板1的边缘与模具组200包围界定出一壳体空间204。其中，整合式面板1的盖板11外表面112抵接于固定模具201内缘，而移动模具202内缘抵接于整合式面板1的保护层15上，保护层15可为图2所示的光学保护层151或是图4所示的非光学级保护层152，其中保护层15的软化温度高于160℃且硬度大于2H。
请再参阅图8所示，自移动模具202注射一熔融塑料2 ' 至壳体空间204中，再经保压冷却后即形成所述模制壳体2，以使整合式面板1与模制壳体2结合形成所述触控面板模组100，其中，部分模制壳体2位于非透视区域内且形成在保护层15上以及部分模制壳体2包覆整合式面板1的边缘。该模制壳体2具有一外端面，该外端面相连于该盖板外表面，且该外端面与该外表面坐落于同一水平面上。
其中，于注射熔融塑料2 ' 时，装饰层12与线路层14透过保护层15的保护(缓冲与隔热)，使其降低直接接触熔融塑料2 ' 的可能，进而避免装饰层12的颜色或图案产生变化以及避免线路层14因注射熔融塑料2 ' 所产生的压力而产生导线141断裂。再者，保护层15更是有助于避免装饰层12与线路层14于上述过程中产生刮伤等损坏，藉此可避免触控面板模组100边缘区域易损坏的问题。
请再参阅图9所示，最后开模取出触控面板模组100即完成制造流程。
在此制造方法实施例中所使用的元件，皆与前述实施例相同，在此即不再赘述。
以上所述仅为本发明的实施例，其并非用以局限本发明的专利范围。

Claims (10)

  1. 一种触控面板模组，其特征在于，包括：
    一整合式面板，界定有一透视区域及位于该透视区域周围的一非透视区域，该整合式面板包含：
    一盖板，具有相对的一内表面及一外表面；
    一装饰层，设置于该盖板的内表面且位于该非透视区域内；
    一感测电极层，设置于该盖板的内表面且位于该透视区域内；
    一线路层，位于该装饰层上且电性连接于该感测电极层；及
    一保护层，至少披覆于部分该装饰层与部分该线路层上；以及
    一模制壳体，以模内射出成型方式部分位于该非透视区域内且形成在该保护层上以及部分包覆该整合式面板的边缘。
  2. 如权利要求1所述的触控面板模组，其特征在于，该保护层为一光学级保护层，该光学级保护层披覆于该感测电极层上。
  3. 如权利要求2所述的触控面板模组，其特征在于，该光学级保护层的材质为氧化硅、氮化硅及聚甲基丙烯酸甲酯的至少其中之一。
  4. 如权利要求1所述的触控面板模组，其特征在于，该保护层为一非光学级保护层。
  5. 如权利要求4所述的触控面板模组，其特征在于，该非光学级保护层的材质为油墨。
  6. 如权利要求1至5中任一项所述的触控面板模组，其特征在于，该保护层的软化温度高于160℃，且该保护层的硬度大于2H。
  7. 如权利要求1至5中任一项所述的触控面板模组，其特征在于，该感测电极层延伸至该装饰层上。
  8. 如权利要求1至5中任一项所述的触控面板模组，其特征在于，该模制壳体具有一外端面，该外端面相连于该盖板外表面，且该外端面与该外表面坐落于同一水平面上。
  9. 一种触控面板模组的制造方法，其特征在于，步骤包括：
    形成一整合式面板，该整合式面板界定有一透视区域及位于透视区域周围的一非透视区域，其中该整合式面板包括一盖板，该盖板具有相对的一内表面及一外表面，其中形成该整合式面板的方法包括：
    设置一装饰层于该盖板的内表面且位于该非透视区域内；
    　　设置一感测电极层于该盖板的内表面且位于该透视区域内；
    　　设置一线路层于该装饰层上，且该线路层与该感测电极层电性连接；以及
    　　设置一保护层，该保护层至少披覆于部分该装饰层与部分该线路层；以及
    以模内射出成型方式形成一模制壳体，其中部分模制壳体位于该非透视区域内且形成在该保护层上以及部分模制壳体包覆该整合式面板的边缘。
  10. 如权利要求9中所述的触控面板模组的制造方法，其特征在于，以模内射出成型方式形成该模制壳体的方法更包括：
    　　 提供一模具组，其包围界定有一模穴；
    将该整合式面板置入该模具组的模穴内，且该整合式面板的边缘与该模具组包围界定出一壳体空间；
    注射一熔融塑料至该壳体空间中；以及
    经保压冷却形成该模制壳体，以使该整合式面板与该模制壳体结合形成该触控面板模组。
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