WO2014013978A1 - Dispositif de refroidissement et de chauffage d'air magnétique - Google Patents

Dispositif de refroidissement et de chauffage d'air magnétique Download PDF

Info

Publication number
WO2014013978A1
WO2014013978A1 PCT/JP2013/069280 JP2013069280W WO2014013978A1 WO 2014013978 A1 WO2014013978 A1 WO 2014013978A1 JP 2013069280 W JP2013069280 W JP 2013069280W WO 2014013978 A1 WO2014013978 A1 WO 2014013978A1
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic
heat transfer
liquid metal
gap
electrode
Prior art date
Application number
PCT/JP2013/069280
Other languages
English (en)
Japanese (ja)
Inventor
高橋　秀和
田崎　豊
保田　芳輝
Original Assignee
日産自動車株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日産自動車株式会社 filed Critical 日産自動車株式会社
Priority to JP2014525820A priority Critical patent/JP5796682B2/ja
Publication of WO2014013978A1 publication Critical patent/WO2014013978A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/002—Details of machines, plants or systems, using electric or magnetic effects by using magneto-caloric effects
    • F25B2321/0022—Details of machines, plants or systems, using electric or magnetic effects by using magneto-caloric effects with a rotating or otherwise moving magnet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Definitions

  • the present invention relates to a magnetic air conditioner, and in particular, a magnet that individually applies magnetism to a plurality of magnetic bodies to develop a magnetocaloric effect and transports the heat of the plurality of magnetic bodies using heat transfer of a solid substance.
  • the present invention relates to an air conditioner.
  • the refrigeration technology that has recently attracted attention is the magnetic refrigeration technology.
  • Some magnetic materials exhibit a so-called magnetocaloric effect that changes their temperature according to the change of the magnitude of the magnetic field applied to the magnetic material.
  • a refrigeration technique that transports heat using a magnetic material that exhibits this magnetocaloric effect is a magnetic refrigeration technique.
  • One magnetic body block is formed by a pair of positive and negative magnetic bodies.
  • a plurality of magnetic blocks are arranged in a ring shape to form a magnetic unit.
  • the heat transfer member inserted and removed between the positive and negative magnetic bodies arranged in the magnetic body unit is arranged between the positive and negative magnetic bodies.
  • a permanent magnet is arranged on a hub-like rotator that is concentric with the magnetic unit and has substantially the same inner diameter and outer diameter to form a magnetic circuit.
  • positioned is arrange
  • magnetism is simultaneously applied to and removed from the positive and negative magnetic bodies.
  • the heat transfer member is inserted and removed between the positive and negative magnetic bodies at a fixed timing. The heat generated by the magnetic body due to the magnetocaloric effect is transported in one direction in which the magnetic body is disposed via the heat transfer member.
  • the heat transfer member disposed between the magnetic bodies is inserted and removed at a constant timing. Friction heat is generated when the heat transfer member is inserted and removed. If the generation of this frictional heat is large, the cooled magnetic material will be heated. For this reason, the heat transfer member must be inserted and removed at such a speed (slowness) that it does not affect the temperature of the magnetic material even if frictional heat is generated.
  • the insertion / removal of the heat transfer member is performed in synchronization with the application / removal of magnetism. For this reason, even if it is desired to speed up the change in temperature of the magnetic body by increasing the timing of applying and removing magnetism, the heat transfer member cannot be raised due to the rate of insertion / removal.
  • an object of the present invention is to provide a magnetic air conditioner capable of performing heat transfer and interruption between magnetic bodies and the like at high speed.
  • a magnetic air-conditioning apparatus is arranged in a row at intervals, and a plurality of magnetic bodies that change in temperature by applying and removing magnetism, and each of the plurality of magnetic bodies is magnetic.
  • a magnetic circuit that applies and removes, a low-temperature side heat exchanging portion disposed at one end of the row of the plurality of magnetic bodies and spaced from the magnetic body, and the other end of the row of the plurality of magnetic bodies Between the magnetic bodies, between the magnetic bodies and the low temperature side heat exchange section, and between the magnetic bodies and the high temperature side heat exchange section. And a heat transfer section that is arranged between the two and performs heat transfer and heat insulation therebetween.
  • the heat transfer section includes a dielectric and a first electrode provided in the gap, a liquid metal that moves in the gap, and a second electrode that is electrically connected to the liquid metal,
  • the first electrode is electrically insulated from the liquid metal and the dielectric, and by applying a voltage between the first electrode and the liquid metal, the liquid metal causes the gap to be removed by electrowetting action. It moves to switch the heat transfer and the heat insulation.
  • the magnetic cooling and heating apparatus configured as described above, between a plurality of magnetic bodies arranged in a row, between a magnetic body and a low temperature heat exchange unit, between a magnetic body and a high temperature heat exchange unit. Has a heat transfer section. And this heat transfer part was set as the structure which provided the clearance gap and moved a liquid metal to the clearance gap by electrowetting. In other words, heat transfer is performed in a state where the liquid metal enters the gap, and switching is performed so as to insulate the liquid metal from the gap.
  • FIG. 1 It is a figure which shows the basic composition of the magnetic air conditioning apparatus of embodiment. It is a graph which shows the effect of a magnetic air conditioner. It is a schematic diagram for demonstrating a heat
  • FIG. 1 It is a graph which shows a voltage application characteristic
  • A is a graph which shows the relationship between contact angle (theta) and the frequency f
  • B is a graph which shows the relationship between the applied voltage V and the frequency f.
  • FIG. It is a top view which shows schematic structure of the magnetic air conditioning apparatus of Embodiment 3.
  • FIG. 16 is an exploded sectional view of the magnetic air conditioner shown in FIG. 15. It is a schematic diagram for demonstrating a heat
  • FIG. It is a flowchart for demonstrating the flow which calculates a response characteristic. It is sectional drawing which showed the form which connected the clearance gap between two heat-transfer parts by the communicating path in the magnetic air conditioning apparatus which concerns on Embodiment 4.
  • FIG. It is a figure which shows the air conditioning circulation system using the magnetic air conditioning apparatus which concerns on Embodiment 4. It is a flowchart which shows the procedure which calculates a thermal switching frequency.
  • FIG. 10 is a top view of a magnetic body / heat transfer portion arrangement plate portion according to a fifth embodiment.
  • FIG. 10 is an enlarged schematic diagram of a gap portion in the fifth embodiment. In Embodiment 5, it is explanatory drawing for demonstrating the state which a liquid metal advances.
  • Embodiment 5 it is a graph for demonstrating the positional relationship of a position sensor and a liquid metal.
  • This graph is a three-dimensional graph in which the x-axis direction is time elapsed, the y-axis direction is the position sensor on (ON) and off (OFF) state, and the z-axis direction is the position of the liquid metal.
  • it is a graph for demonstrating the application state of the position of a liquid metal, and the voltage between the 1st electrode-2nd electrodes by an electric circuit.
  • the x-axis direction is time elapsed
  • the y-axis direction is the application state of the voltage between the first electrode and the second electrode (eV is applied and 0V is not applied)
  • the z-axis direction is the position of the liquid metal. It is a three-dimensional graph.
  • Embodiment 5 it is a flowchart which shows the control procedure for synchronizing a liquid metal and the position of the magnet which applies a magnetism to a magnetic body.
  • FIG. 1 is a diagram illustrating a basic configuration of the magnetic air conditioner according to the first embodiment. First, the principle of magnetic refrigeration will be described with reference to this figure.
  • a positive magnetic body is used as a magnetic body made of the same material and having the same type of magnetocaloric effect.
  • the magnetic bodies 100A and 10B form the magnetic body block 100A
  • the magnetic bodies 10C and 10D form the magnetic body block 100B
  • the magnetic bodies 10E and 10F form the magnetic body block 100C.
  • the magnetic body unit 200 is formed by the magnetic body blocks 100A-100C.
  • the magnetic circuits 20A, 20B, magnetic circuits 20C, 20D, and magnetic circuits 20E, 20F reciprocate between the magnetic bodies 10A-10F. That is, from the state of FIG. 1A, the magnetic circuits 20A and 20B move from the magnetic bodies 10A to 10B, the magnetic circuits 20C and 20D move from the magnetic bodies 10C to 10D, and the magnetic circuits 20E and 20F move from the magnetic bodies 10E to 10F all at once. Thus, the state shown in FIG. 1B is obtained. Next, from the state of FIG.
  • the magnetic circuits 20A and 20B are changed from the magnetic bodies 10B to 10A
  • the magnetic circuits 20C and 20D are changed from the magnetic bodies 10D to 10C
  • the magnetic circuits 20E and 20F are changed from the magnetic bodies 10F to 10E all at once.
  • a positive magnetic body that generates heat when applying magnetism in the magnetic circuits 20A, 20B-magnetic circuits 20E, 20F and absorbs heat when removed is used.
  • a positive magnetic body and a negative magnetic body have opposite magneto-caloric effects, and the types of magneto-caloric effects are different.
  • a positive magnetic material that is less expensive than a negative magnetic material is used. This is because a negative magnetic material has to be manufactured from a rare magnetic material, which increases the cost, and the magnitude of the magnetocaloric effect of the negative magnetic material is smaller than that of the positive magnetic material. .
  • the magnetic circuits 20A, 20B-20E, and 20F are provided with permanent magnets (not shown).
  • the magnetic circuits 20A and 20B, the magnetic circuits 20C and 20D, and the magnetic circuits 20E and 20F are integrated to reciprocate in the horizontal direction in the figure, thereby applying magnetism to the magnetic bodies 10A to 10F individually.
  • the heat transfer units 30A-30G transfer heat generated by the magnetic bodies 10A-10F due to the magnetocaloric effect from the low temperature side heat exchange unit 40A to the high temperature side heat exchange unit 40B.
  • the heat transfer unit 30A switches between a heat transfer state that transfers heat between the low temperature side heat exchange unit 40A and the adjacent magnetic body 10A and an adiabatic state that blocks heat.
  • the heat transfer unit 30B switches between a heat transfer state that transfers heat between the magnetic bodies 10A and 10B and an adiabatic state that blocks heat.
  • the heat transfer units 30C, 30D, 30E, and 30F are provided between the magnetic bodies 10B and 10C, between the magnetic bodies 10C and 10D, between the magnetic bodies 10D and 10E, and between the magnetic bodies 10E and 10F. Switch between heat transfer state that transfers heat and heat insulation state that blocks heat.
  • the heat transfer unit 30G switches between a heat transfer state that transfers heat between the magnetic body 10F and the high temperature side heat exchange unit 40B and an adiabatic state that blocks heat
  • the heat transfer units 30B, 30D, and 30F switch the heat transfer state and the heat insulation state between the magnetic bodies 10A and 10B, between the magnetic bodies 10C and 10D, and between the magnetic bodies 10E and 10F at the same timing.
  • the heat transfer units 30A, 30C, 30E, and 30G are also at the same timing, between the low temperature side heat exchange unit 40A and the magnetic body 10A, between the magnetic bodies 10B and 10C, and between the magnetic bodies 10D and 10E.
  • the heat transfer state and the heat insulation state are switched between the magnetic body 10F and the high temperature side heat exchange unit 40B.
  • the heat transfer units 30B, 30D, and 30F and the heat transfer units 30A, 30C, 30E, and 30G are alternately switched between the heat transfer state and the heat insulation state.
  • the detailed configuration of the heat transfer units 30A-30G and the heat transfer / heat insulation switching operation will be described later.
  • the magnetic circuits 20A and 20B are the magnetic body 10A of the magnetic body block 100A
  • the magnetic circuits 20C and 20D are the magnetic body 10C of the magnetic body block 100B
  • the magnetic circuits 20E and 20F are the magnetic body block 100C. It is located on each of the magnetic bodies 10E. At this time, magnetism is applied to the magnetic bodies 10A, 10C, and 10E, and no magnetism is applied to the magnetic bodies 10B, 10D, and 10F, and the magnetism is removed. At this time, the magnetic bodies 10A, 10C, and 10E generate heat.
  • the heat transfer section 30B heats between the magnetic bodies 10A and 10B
  • the heat transfer section 30D heats between the magnetic bodies 10C and 10D
  • the heat transfer section 30F heats between the magnetic bodies 10E and 10F. Set to transmission. For this reason, heat transfer between adjacent magnetic bodies in each magnetic body block is performed. That is, the heat generated by the magnetic bodies 10A, 10C, and 10E due to the magnetocaloric effect is transferred to the magnetic bodies 10B, 10D, and 10F, respectively.
  • the heat transfer units 30A and 30G make heat insulation between the low temperature side heat exchange unit 40A and the magnetic body 10A and between the high temperature side heat exchange unit 40B and the magnetic body 10F. Further, the heat transfer units 30C and 30E are also in a heat insulating state between the magnetic bodies 10B and 10C and between the magnetic bodies 10D and 10E.
  • the magnetic circuits 20A and 20B are the magnetic body 10B of the magnetic block 100A
  • the magnetic circuits 20C and 20D are the magnetic body 10D of the magnetic block 100B
  • the magnetic circuits 20E and 20F are the magnetic bodies. It is located on the magnetic body 10F of the block 100C.
  • magnetism is applied to the magnetic bodies 10B, 10D, and 10F
  • no magnetism is applied to the magnetic bodies 10A, 10C, and 10E, and the magnetism is removed.
  • the magnetic bodies 10B, 10D, and 10F generate heat.
  • the heat transfer unit 30A is between the low temperature side heat exchange unit 40A and the magnetic body 10A
  • the heat transfer unit 30C is between the magnetic bodies 10B and 10C
  • the heat transfer unit 30E is between the magnetic bodies 10D and 10E.
  • the heat transfer part 30G makes a heat transfer state between the magnetic body 10F and the high temperature side heat exchange part 40B.
  • the magnetic bodies 10A, 10C, and 10E absorb heat by the magnetocaloric effect, and the magnetic bodies 10B, 10D, and 10F generate heat by the magnetocaloric effect. For this reason, heat moves from the low temperature side heat exchange section 40A to the magnetic body 10A, from the magnetic body 10B to the magnetic body 10C, from the magnetic body 10D to the magnetic body 10E, and from the magnetic body 10F to the high temperature side heat exchange section 40B.
  • the heat transfer portions 30B, 30D, and 30F are in a heat insulating state between the magnetic bodies 10A and 10B, between the magnetic bodies 10C and 10D, and between the magnetic bodies 10E and 10F.
  • each magnetic body block 100A-100C By reciprocating the magnetic circuit provided corresponding to each magnetic body block 100A-100C in the left-right direction in the figure, the magnetic bodies located at both ends of each magnetic body block 100A-100C are alternately arranged. Repeat the application and removal of magnetism. Further, in conjunction with the movement of the magnetic circuit, the heat transfer units 30A-30G repeat heat transfer and heat insulation among the low temperature side heat exchange unit 40A, the magnetic bodies 10A-10F, and the high temperature side heat exchange unit 40B. Thereby, the heat obtained by the magnetocaloric effect moves from the low temperature side heat exchange unit 40A to the high temperature side heat exchange unit 40B.
  • FIG. 2 is a graph showing the effect of the magnetic refrigeration of the present invention.
  • the temperature difference between the low-temperature side heat exchange unit 40A and the high-temperature side heat exchange unit 40B is small at a relatively initial time after the operation of the magnetic cooling / heating apparatus.
  • the temperature difference between the low temperature side heat exchange section 40A and the high temperature side heat exchange section 40B gradually increases, and finally, as shown by the straight line after a long time has passed, The temperature difference between the heat exchange unit 40A and the high temperature side heat exchange unit 40B is maximized.
  • the indoor temperature can be lowered using the heat of the low temperature side heat exchange unit 40A, and the indoor temperature can be increased, for example, using the heat of the high temperature side heat exchange unit 40B.
  • FIG. 1 the schematic diagram of FIGS. 3 and 4 shows how heat moves when a magnetic circuit provided corresponding to each magnetic block is reciprocated in the left-right direction in the figure.
  • all the magnetic bodies forming the magnetic body unit 200 are made of the same material, and all the magnetic bodies have the same type of magnetocaloric effect and have a temperature change of 5 ° C. Assume a case. Specifically, it is assumed that the temperature of 5 ° C. rises when magnetism is applied to all the magnetic materials, and the temperature decreases by 5 ° C. when the magnetism is removed.
  • the magnetic circuit is moved to the right side, the magnetism is removed from the magnetic body located at one end of each magnetic body block 100A-100C, and the magnetic circuit is located at the other end. Magnetism is applied to the magnetic material.
  • the heat transfer unit is set in a heat transfer state so that heat transfer between the magnetic body located at the high temperature side and the high temperature side heat exchange unit 40B is possible.
  • the temperature of the magnetic body located at one end of the magnetic body unit 200 and the low-temperature side heat exchanging section 40A becomes 18 ° C. as shown in FIG.
  • the temperature of the magnetic body located at the end and the high temperature side heat exchange section 40B becomes 22 ° C.
  • the magnetic circuit is moved to the left to remove the magnetism from the magnetic body located at the other end of each magnetic body block 100A-100C, and located at one end. Magnetism is applied to the magnetic material.
  • the heat transfer section is set in a heat transfer state so that heat transfer between adjacent magnetic bodies in each magnetic block 100A-100C is possible.
  • This heat transfer causes the temperature of the low temperature side heat exchanging portion 40A to be 18 ° C. and the temperature of the magnetic material of the magnetic block 100A to be 19 ° C. as shown in FIG. Further, the temperature of the magnetic body of the magnetic block 100B is 20 ° C., and the temperature of the magnetic body of the magnetic block 100C is 21 ° C. And the temperature of the high temperature side heat exchange part 40B will be 22 degreeC.
  • the magnetic circuit is reciprocated to the left and right along the magnetic body, and the heat transfer unit is switched between the heat transfer state and the heat insulation state in synchronization with the movement of the magnetic circuit.
  • Heat moves to the side heat exchange section 40B.
  • the temperature difference between the low temperature side heat exchange section 40A and the high temperature side heat exchange section 40B increases.
  • the state of FIG. 4 (1) and (2) will be repeated, the low temperature side heat exchange part 40A will be about 5 degreeC, and the high temperature side heat exchange part 40B will be 35 degreeC, The temperature difference becomes constant.
  • the indoor temperature can be lowered using the heat of the low temperature side heat exchange unit 40A, and the indoor temperature can be increased, for example, using the heat of the high temperature side heat exchange unit 40B.
  • FIGS. 1 and 3 The description of FIGS. 1 and 3 is applicable when a positive magnetic material is used as a magnetic material of the same material having the same type of magnetocaloric effect.
  • a negative magnetic material When a negative magnetic material is used as a magnetic material of the same material having the same type of magnetocaloric effect, the heat transfer direction is opposite to the direction shown in FIG. Therefore, when a negative magnetic material is used, the positions of the low temperature side heat exchange part 40A and the high temperature side heat exchange part 40B are opposite to those in FIGS.
  • the magnetic air conditioner switches the heat transfer state and the heat insulation state by the heat transfer units 30A to 30G and moves the heat.
  • the heat transfer unit has switched between a heat transfer state and a heat insulation state by inserting and removing a metal plate such as aluminum or copper between magnetic bodies.
  • a metal plate such as aluminum or copper between magnetic bodies.
  • frictional heat is generated when moving between magnetic bodies. Since the insertion / removal of the metal plate is synchronized with the magnetic movement, if the magnetic movement is to be accelerated, the insertion / removal of the metal plate must be accelerated accordingly. If it does so, the frictional heat by a metal plate will become large and the temperature of a magnetic body will not fall. For this reason, the speed of magnetic movement cannot be increased.
  • the heat transfer portion has a structure that does not generate frictional heat.
  • FIG. 5 is a cross-sectional view of the heat transfer portion for explaining the configuration of the heat transfer portion in the first embodiment.
  • FIG. 6 is a plan view of the heat transfer portion for explaining the configuration of the heat transfer portion in the first embodiment (a view of arrow A in FIG. 5).
  • the heat transfer part 30 provided between the magnetic body 10 and the magnetic body 10 'adjacent thereto will be described as an example.
  • the magnetic body 10 and the magnetic body 10 'adjacent thereto described here correspond to the magnetic body 10A in FIG. 1 as 10B, 10C and 10D, 10E and 10F.
  • it corresponds similarly to the low temperature side heat exchange part 40A and the magnetic body 10A, the magnetic body 10F, and the high temperature side heat exchange part 40B.
  • the heat transfer unit 30 corresponds to 30A-30G in FIG.
  • the heat transfer unit 30 includes a first electrode structure 11 in contact with the magnetic body 10, a second electrode structure 21 in contact with the magnetic body 10 ′, and between the first electrode structure 11 and the second electrode body structure 21. And a liquid metal 18 that is taken in and out of the gap 20. In addition, at one end of the gap 20, there is a liquid reservoir 17 that stores liquid metal. In the gap 20, the end opposite to the one end where the liquid reservoir 17 is provided is an open end 24.
  • the first electrode structure 11 and the second electrode structure 21 have the same structure and are symmetrical structures with the gap 20 as the center line.
  • the first electrode structure 11 includes a first electrode 12, a dielectric 13, a second electrode 14, and a liquid repellent coating layer 15 in order from the magnetic body 10 side.
  • the second electrode body structure 21 includes the first electrode 12, the dielectric 13, the second electrode 14, and the liquid repellent coating layer 15 in this order from the magnetic body 10 'side. That is, when the gap 20 is taken as the center, both the first electrode structure 11 and the second electrode body structure 21 are in order from the gap 20 side, the liquid repellent coating layer 15, the second electrode 14, the dielectric 13, and the first electrode 12. It is arranged to become.
  • a lower substrate 16 is provided below the entire magnetic material.
  • the lower substrate 16 has a liquid reservoir 17 communicating with the gap 20.
  • the liquid reservoir 17 is a liquid storage portion that stores liquid metal.
  • the second electrode 14 extends into the liquid reservoir 17 and can be electrically connected to the liquid metal 18.
  • the first electrode 12 is insulated from the liquid reservoir 17. That is, the first electrode 12 is insulated from the liquid metal 18.
  • the first electrode 12 and the second electrode 14 have a capacitor structure with the dielectric 13 between them, and this acts as a capacitor of the liquid metal 18 and the first electrode 12 (details). Later).
  • the upper substrate 100 on which wirings led from the first and second electrodes 12 and 14 are formed is provided above the first electrode structure 11 and the second electrode structure 21.
  • the upper substrate 100 is separated and insulated by the extension of the gap 20 on the first electrode structure 11 side and the second electrode body structure 21 side, and is the same as the first electrode structure 11 and the second electrode structure 21.
  • the same structure is symmetrical with respect to the gap 20.
  • the first wiring 111 from the first electrode 12 and the second wiring 112 from the second electrode 14 are insulated by an insulating layer 113.
  • the wires 111 and 112 are connected to a control device (not shown) of the magnetic air conditioner in order to control the heat transfer unit 30.
  • the control device switches between the heat transfer state and the heat insulation state by the heat transfer unit 30 in synchronization with the magnetic movement.
  • the first electrode 12 and the second electrode 14 are not particularly limited as long as they are conductive, such as copper and aluminum.
  • the shapes of the first electrode 12 and the second electrode 14 are the same, and are electrode plates that match the size of the gap 20 (excluding the gap interval).
  • the dielectric 13 is not particularly limited as long as it is between the first electrode 12 and the second electrode 14 and is a dielectric 13 such as a silicon oxide film or a silicon nitride film.
  • the shape of the dielectric 13 is the same size as the first electrode 12 and the second electrode 14, and the first electrode 12 and the second electrode 14 are not short-circuited.
  • the liquid repellent coating layer 15 has liquid repellency with respect to the liquid metal 18.
  • the liquid repellent coating layer 15 is preferably conductive.
  • Examples of the material used for the liquid repellent coating layer 15 include a conductive oxide film (for example, LaSrTiO 3 system), a conductive glass material (for example, V—Fe—Ba—O system), and a conductive ceramic (for example, SiC system). ) And graphene are preferred.
  • the liquid repellent coating layer 15 is liquid repellent with respect to the liquid metal 18, the liquid metal 18 can be easily stored in the liquid reservoir 17 when no electricity is applied. Further, since the liquid repellent coating layer 15 has conductivity, the electricity that has flowed to the second electrode 14 can be directly flowed to the liquid metal 10, which is efficient. In addition, when the liquid metal 18 is filled in the gap 20 between the first electrode structure 11 and the second electrode structure 21 by supplying electricity to the second electrode 14, the inside of the liquid reservoir 17 can be emptied. The amount of liquid metal 18 used can be reduced.
  • the liquid repellent coating layer 15 only has liquid repellency and is conductive. It may be non-sexual. Further, an insulating liquid repellent member such as an extremely thin silicon oxide film or silicon nitride film may be formed on the surface of the second electrode 14 on the gap 20 side. If an extremely thin silicon oxide film or silicon nitride film is present, electricity can be supplied to the liquid metal 18 by the tunnel effect when electricity is supplied to the second electrode 14 even if they are present.
  • the shape of the liquid repellent coating layer 15 constituted by such a member is large enough to cover the second electrode 14.
  • the second electrode 14 itself is formed of, for example, a conductive oxide film, a conductive glass material, a conductive ceramic material, graphene, or the like. In this case, it is not necessary to provide the liquid repellent coating layer 15 on the gap side surface of the second electrode 14.
  • the lower substrate 16 only needs to be insulated from at least the first and second electrodes 12 and 14.
  • an epoxy substrate, a phenol substrate, an ABS resin substrate, or the like is used as a material having insulation properties as a whole.
  • a liquid reservoir 17 is provided on these substrates.
  • the inner wall surface of the liquid reservoir is made lyophilic so that the liquid metal 18 can be easily stored in the liquid reservoir 17.
  • a metal film 19 for example, a metal film of copper, nickel, aluminum, etc.
  • a silicon substrate can be used as the lower substrate 16, for example.
  • a silicon substrate first, after the liquid reservoir 17 is formed, an insulating layer (not shown) is formed on the entire surface including the wall surface inside the liquid reservoir 17 with a silicon oxide film, a silicon nitride film, or the like. Then, a metal film 19 (for example, a metal film such as copper, nickel, aluminum or the like, or polysilicon provided with conductivity in the case of a silicon substrate) may be formed to make the liquid reservoir 17 lyophilic. It is preferable to do.
  • the metal film 19 formed in the liquid reservoir 17 may be electrically connected to the second electrode 14.
  • the metal film 19 in the liquid reservoir 17 may be omitted.
  • the metal film 19 in the liquid reservoir 17 makes the liquid metal 18 easily stored in the liquid reservoir 17 when the liquid metal 18 is lowered by making the inner wall surface of the liquid reservoir 17 lyophilic. belongs to. For this reason, the metal film 19 may be omitted if the liquid reservoir 17 is sufficiently large and the liquid metal 18 can be smoothly stored even if the inner wall surface of the liquid reservoir 17 is not lyophilic.
  • the liquid reservoir 17 of the lower substrate 16 is provided with a hole 25 that does not leak the liquid metal 18 (the function of the hole 25 will be described later).
  • the upper substrate 100 has the same configuration on the first electrode structure 11 side and the second electrode body structure 21 side, and the first wiring 111 electrically connected to the first electrode 12 and the second electrode 14 are electrically connected. Connected second wiring 112 and an insulating layer 113 for insulating and separating them. Further, as already described, since the first electrode structure 11 side and the second electrode body structure 21 side are insulated and separated by the gap 20, naturally, the upper substrate 100 is also separated from the first electrode structure 11 side.
  • the second electrode body structures 21 are provided so as to be separated and have the same configuration.
  • a liquid repellent coating layer 15 is formed on the portion of each second wiring 112 facing the gap 20.
  • the gap 20 portion is formed so that the liquid repellent coating layer 15 surrounds the gap 20 as shown in FIG. 6, so that the liquid metal does not leak from the side surface portion 15 a of the gap 20. It has become.
  • the side surface portion 15a of the gap 20 has a structure (not shown) that covers the side surface portion of the gap (or the entire side surface including the side surface of the magnetic body) outside the liquid repellent coating layer 15. May be.
  • Such a structure is preferably a non-magnetic, non-conductive member such as resin or ceramic.
  • a portion of the upper substrate 100 facing the wiring (a portion surrounded by a circle in FIG. 5) is an open end 24 so that the pressure in the gap 20 does not increase or decrease due to the movement of the liquid metal 18. ing. For this reason, the liquid metal 18 can move in the gap 20 smoothly.
  • the wirings 111 and 112 used for the upper substrate 100 are made of copper, aluminum or the like, like the first and second electrodes 12 and 14.
  • the insulating layer 113 is preferably an insulator (insulating material) having a dielectric constant lower than that of the dielectric 13 at least.
  • the wirings 111 and 112 are wirings for applying a voltage to the first and second electrodes 12 and 14. For this reason, the same voltage as that of the first and second electrodes 12 and 14 is applied to the portion where the wiring is opposed (the portion in the vicinity of the open end 24 surrounded in FIG. 5). Then, if a material having a high dielectric constant is used as the insulating layer of the upper substrate 100, a capacitor structure is formed between the liquid metal 18 and the wiring even in this portion. Then, when the liquid metal 18 rises, there is a possibility that the liquid metal 18 may come from the enclosed portion to the upper side and be discharged at that momentum.
  • an insulating material having a low dielectric constant is used to prevent the liquid metal 18 from entering the gap 20 between the portions where the wiring layers face each other.
  • a so-called Low-k material used in a semiconductor device can be used.
  • any material having a lower dielectric constant than the dielectric 13 used between the first and second electrodes 12 and 14 may be used.
  • These Low-k materials may be used.
  • These Low-k materials are known to have a relative dielectric constant of 3.0 or less with respect to a relative dielectric constant of 4.2 to 4.0 of SiO 2 .
  • the vicinity of the open end 24 where the insulating layer 113 that is an insulator is disposed has a thickness at which the wirings 112 and 113 are insulated.
  • the thickness is about the thickness of the dielectric 13 from the upper end of the gap, the liquid When the metal 18 rises, it is not discharged from the upper end.
  • the liquid metal 18 (sometimes referred to as a conductive fluid) is a liquid metal at least in a temperature range in which the magnetic air conditioner is used.
  • galinstan which is a eutectic alloy of gallium, indium and tin can be used.
  • Galinstan is a metal that is liquid at room temperature and has a different melting point depending on the composition of gallium, indium, and tin.
  • a galinstan of 68.5% gallium, 21.5% indium and 10% tin has a melting point: ⁇ 19 ° C., a boiling point: 1300 ° C.
  • liquid metals 18 may be used, and those having a high heat transfer coefficient are preferable.
  • the function of the heat transfer unit 30 is to transfer and block heat (insulation) between magnetic bodies and the like. Since it has such a function, it may be called a thermal switch.
  • this thermal switch function is performed by the liquid metal 18 that moves back and forth between the gap 20 and the liquid reservoir 17.
  • Electrowetting is used to move the liquid metal 18 back and forth between the gap 20 and the liquid reservoir 17.
  • the movement of the liquid metal 18 by electrowetting is known per se and is disclosed in, for example, Japanese Patent Application Laid-Open No. 2007-103363. Therefore, the principle necessary for understanding the present embodiment will be described here.
  • FIG. 7 is an explanatory diagram for explaining the principle of electrowetting.
  • Electrowetting is performed by placing a liquid metal 18 (shown as a droplet here) on the surface of a dielectric 501 provided on the electrode plate 500 and applying a voltage between the electrode plate 500 and the liquid metal 18. This is a technique for controlling wettability with the liquid metal 18 on the dielectric surface.
  • a capacitor is formed between the electrode plate 500 and the liquid metal 18 via a dielectric 501.
  • the electrostatic energy of the capacitor changes (increases), and the corresponding surface energy of the liquid metal 18 decreases, The surface tension of the liquid metal 18 is reduced.
  • the contact angle ⁇ is an angle between the surface of the dielectric 501 on which the liquid metal 18 is placed and the surface of the liquid metal.
  • the contact angle ⁇ varies in the range of 0 ° to 180 ° depending on the surface tension of the liquid metal 18.
  • the contact angle ⁇ when the contact angle ⁇ is 0 ° to 90 °, the surface has good wettability with respect to the liquid metal 18, that is, a lyophilic state.
  • the contact angle ⁇ exceeds 90 ° and is 180 ° or less, which is a state of poor wettability, that is, a liquid repellent state. Electrowetting can change the contact angle ⁇ of the liquid metal 18 placed on the dielectric surface in this way by applying a voltage.
  • FIG. 8 is an explanatory diagram for explaining the movement of the liquid metal in the gap, and is an enlarged view of the liquid metal portion in the gap.
  • the surface on which the liquid metal 18 moves is the liquid repellent coating layer 15 provided so as to face the gap 20 between the magnetic bodies 10 and 10 '.
  • the liquid repellent coating layer 15 has liquid repellency with respect to the liquid metal 18 as already described. Therefore, if no voltage is applied between the first and second electrodes 12 and 14, the liquid metal 18 has a contact angle of 90 ° or more on the surface of the liquid repellent coating layer 15 as shown in FIG. 8A. It becomes liquid repellency (also called lyophobic).
  • the contact angle with the liquid contact surface (the surface of the liquid repellent coating layer 15) is 90 ° or more, so that the center of the liquid surface of the liquid metal 18 is convex as shown in FIG. 8A.
  • the contact portion of the liquid metal 18 with the surface of the liquid repellent coating layer 15 is lowered.
  • the liquid metal 18 acts on the liquid repellent coating layer 15 surface in a liquid pool direction.
  • the liquid metal 18 returns to the liquid reservoir 17.
  • This state is the state shown in FIG. 5 as a whole of the heat transfer section 30, the liquid metal 18 is in the liquid reservoir 17, and the gap 20 is filled with air (or inert gas (hereinafter the same)). ing. Therefore, the gap 20 filled with air provides a heat insulating state between the magnetic bodies 10 and 10 '.
  • the dielectric 13 between the first electrode 12 and the second electrode 14 is polarized and statically applied. Electric energy changes (increases).
  • the second electrode 14 and the liquid metal 18 are electrically connected, the liquid metal 18 and the first electrode 12 have a capacitor structure with the dielectric 13 interposed therebetween.
  • This structure is the same structure as the capacitor structure formed by the liquid metal 18 via the electrode plate 500 and the dielectric 501 in FIG. 7 explaining the principle of electrowetting.
  • the surface energy of the liquid metal 18 increases, and accordingly, the liquid metal 18 on the surface of the liquid repellent coating layer 15 (dielectric film) is increased. Surface tension is reduced and wettability is improved. Then, as shown in FIG. 8B, the contact angle ⁇ of the surface of the liquid metal 18 in contact with the surface of the liquid repellent coating layer 15 becomes 90 ° or less. For this reason, the liquid metal 18 acts on the surface of the liquid repellent coating layer 15 in the direction toward the open end 24 of the gap 20 (in the direction of the upper substrate 100). Further, although the surface tension of the liquid metal 18 itself is lost, the tension that climbs the gap 20 by a capillary phenomenon also works.
  • the liquid metal 18 moves up the gap 20 and is filled in the gap 20, and enters a heat transfer state (see FIG. 9).
  • h is the amount of increase from the position (FIG. 8A) on the original liquid level.
  • d is the gap 20 interval.
  • FIG. 9 is a cross-sectional view of the same portion as in FIG. 5 and shows a state in which the liquid metal 18 has gone up through the gap 20, that is, a heat transfer state.
  • the liquid metal 18 reaches the position of the upper substrate 100 that is the top of the gap 20. As already described, there is no dielectric between the first wiring 111 and the second wiring 112 of the upper substrate 100 (or the dielectric constant is low) in the gap portion of the upper substrate 100. For this reason, since the electrostatic energy in this portion hardly changes, the wettability of the raised liquid metal 18 does not improve, so the liquid metal 18 does not rise any further.
  • the gap 20 is filled with the liquid metal 18 and enters a heat transfer state in which heat is transferred between the magnetic bodies 10 and 10 '.
  • the heat transfer state in which the liquid metal 18 is filled in the gap 20 provided in the heat transfer unit 30 by electrowetting and the liquid metal 18 is excluded from the gap 20 can be electrically controlled.
  • the hole 25 is provided at the lower end of the liquid reservoir 17.
  • the size of the hole 25 is set such that the liquid metal 18 does not leak and the gas flows in and out.
  • the position of the hole 25 may be other than the lower end of the liquid reservoir 17 and may be arranged so that the liquid metal 18 can easily go out from the liquid reservoir 17 into the gap 20.
  • the first and second electrode structures 11 and 21 that face each other with the gap 20 are parallel to the first electrode 12 and the second electrode 14 through the dielectric 13, respectively.
  • the capacitor that is constituted by the first electrode 12, the liquid metal 18, and the dielectric 13 between them is acting on the electrowetting.
  • the second electrode 14 may be omitted as long as a voltage can be applied to the liquid metal 18.
  • an electrode electrically connected to the liquid metal is provided through the lower substrate. In this case, since the second electrode does not exist in the gap, the opposing surface of the gap becomes a dielectric and has liquid repellency with respect to the liquid metal.
  • the electrode structure is increased or decreased because the liquid metal 18 serving as the counter electrode of the first electrode 12 moves as the capacitor structure. For this reason, the electrostatic energy in the dielectric material that causes the electrowetting action also increases or decreases. Therefore, even if the same voltage is applied, the force for moving the liquid metal is changed by the electrowetting action depending on the rising amount of the liquid metal, and the rising speed of the liquid metal may change (the second electrode is omitted). Even in this case, although the moving speed of the liquid metal may be slightly unstable, it is possible to switch between heat transfer and heat insulation without generating friction as in the case of providing the second electrode).
  • the size of the capacitor by the first electrode 12 and the second electrode 14 is the same as that of the liquid metal 18. Does not change with movement. Therefore, even when the same voltage is applied, the transfer speed of the liquid metal is not changed by the movement of the liquid metal, and the heat transfer and the heat insulation can be switched stably.
  • FIG. 10 is a perspective view showing a heat transfer section shape model when the response characteristics are estimated.
  • the shape of the heat transfer unit 30 is such that the gap 20 is dg, the height is 1 mm, and the width is 1 mm.
  • the height at which the liquid metal 18 rises when the gap wall surface becomes lyophilic with respect to the liquid metal 18 is defined as h.
  • the flow velocity of liquid which is important as a response characteristic, can be obtained by applying the formulas of surface tension T acting on the liquid metal 18, shear stress (wall surface) ⁇ , volume force mg, and laminar flow between parallel walls.
  • the directions of forces such as surface tension T, shear stress (wall surface) ⁇ , and body force mg are as shown in FIG.
  • liquid density ⁇ [kg / m 3 ]
  • gravitational acceleration g [m / s 2 ]
  • gap interval dg [m]
  • surface tension T [N / m]
  • contact angle ⁇ [rad]
  • liquid surface flow velocity V [m / s]
  • viscosity ⁇ [pa ⁇ s]
  • liquid surface height Length h [m]
  • liquid surface acceleration ⁇ [m / s 2 ]
  • flow direction length s [m]
  • gap liquid mass m [kg]
  • time t [ sec]
  • time variation: ⁇ t [sec] 10 ⁇ 6 .
  • FIG. 20 is a flowchart for explaining the flow of calculating the response characteristics.
  • ⁇ (t) (surface tension ⁇ shear stress ⁇ volume force) / m is calculated (S3). Thereafter, if ⁇ (t) is 0 or more (S4: YES), V and h are calculated (S5), and if h is 1 mm or more (S6: YES), the process is terminated. On the other hand, if h is less than 1 mm (S6: NO), the process returns to S2.
  • liquid level height h [m]
  • liquid density ⁇ [kg / m 3 ]
  • gravitational acceleration g [m / s 2 ]
  • FIG. 11 is a graph showing the result of calculating the time taken for the liquid metal to rise by changing the contact angle and the gap 20.
  • the vertical axis represents the time (msec) required for the 1 mm liquid metal to rise
  • the horizontal axis represents the interval dg ( ⁇ m) of the gap 20.
  • the value of mercury (Hg) was used for the viscosity ⁇ and density ⁇ of the liquid. That is, the viscosity is 1.55 ⁇ 10 ⁇ 3 Pa ⁇ s (20 ° C.), and the density is 13.5951 ⁇ 10 3 kg / m 3 .
  • normal temperature (20 ° C.) and normal pressure (1 atm) were set.
  • the time required for the liquid to rise can be adjusted to 1.0 msec or less by appropriately adjusting the gap 20 after that. .
  • This time indicates that the repetition of loading / unloading can be increased from about 50 Hz to about 100 Hz by allowing the liquid metal 18 to enter and leave the gap 20 to act as a thermal switch.
  • the magnetic air conditioner As the magnetic air conditioner, a model in which the heat transfer unit 30 is provided between the 24 magnetic bodies is assumed.
  • the size of the surface where the magnetic bodies face each other was a square of 10 mm in length and width, and the thickness of the magnetic body was 1 mm.
  • the thermal conductivity of the magnetic material is 200 W / (m ⁇ K).
  • the gap 20 where the liquid metal 18 enters and exits was set to 200 ⁇ m.
  • the heat transfer coefficient of the first and second metal plates of the heat transfer unit 30 was assumed to be the same as that of aluminum.
  • the dielectric 13 is assumed to have a thickness of 1 ⁇ m and the liquid repellent coating layer 15 has a thickness of several tens of nanometers.
  • the thermal conductivity of SiO 2 is 1.38 W / (m ⁇ K) at 300 K, and SiN is 20 to 28 W / (m ⁇ K) (however, the crystallinity is improved to contain oxygen
  • graphene has a thermal conductivity of 5 ⁇ 10 3 W / (m ⁇ K), and V—Fe—Ba— as a conductive glass.
  • the thermal conductivity is 1.0 W / (m ⁇ K)
  • the thermal conductivity is 6.0 to 10.0 W / (m ⁇ K).
  • SiC as a conductive ceramic, its thermal conductivity is 200 W / m is a ⁇ K).
  • the heat switch when the heat switch is OFF, that is, when the liquid metal 18 is lowered in the heat transfer section 30 and there is no liquid metal 18 in the gap 20.
  • the heat insulating property it is necessary for the heat insulating property to have a thermal conductivity of 1 W / (m ⁇ K) or less.
  • This corresponds to, for example, when the gap 20 is filled with a heat insulating material having a thermal conductivity of acrylic resin.
  • this corresponds to a distance of about several tens of millimeters when the gap 20 is an air layer (the same applies to an inert gas). For this reason, if the space
  • the thermal conductivity required when the thermal switch is turned on is 200 W / mm at the gap of the gap 20 where the liquid metal 18 enters and exits in the above model.
  • a member having a heat transfer coefficient of about (m ⁇ K) is required. This corresponds to the heat transfer coefficient of a metal such as aluminum.
  • the thermal conductivity is 16.5 W / (m ⁇ K). Therefore, if the gap 20 is not 200 ⁇ m but 20 ⁇ m, the length of heat transfer becomes 1/10. Then, since the necessary heat transfer coefficient is effective by the square of the length to be transmitted, it is only necessary to have 2 W / (m ⁇ K) which is 1/100. Therefore, if the gap 20 is 20 ⁇ m, a temperature difference of 60 ° can be obtained with a sufficiently 50 Hz operation even when Galinstan is used. Therefore, if the gap 20 is about 1/4 of 200 ⁇ m, the required thermal conductivity is 1/16 of 200 W / (m ⁇ K), that is, 12.5 W / (m ⁇ K). Therefore, when using Galinstan, the maximum value of the gap 20 is approximately 1/4 of 200 ⁇ m, that is, a temperature difference of 60 ° can be obtained at 50 Hz operation even at about 50 ⁇ m.
  • each part constituting the heat transfer part 30 is such that when the gallinstan is used as the liquid metal 18, the gap 20 is preferably 10 ⁇ m to 50 ⁇ m.
  • the reason why the lower limit is set to 10 is to provide sufficient heat insulation when the liquid metal 18 is lowered and air enters the gap 20 by opening the gap 20 of this level.
  • the upper limit of 50 ⁇ m is to maintain heat transfer performance when the liquid metal 18 rises and fills the gap 20 as already described.
  • the electrode plate, the dielectric 13, the liquid repellent coating layer 15, etc. it is preferable to make the electrode plate, the dielectric 13, the liquid repellent coating layer 15, etc. as thin as possible.
  • the dielectric 13 is too thick, it becomes a heat insulating material, so it is preferable to make it as thin as possible.
  • the total thickness of the dielectrics 13 of the first electrode structure 11 and the second electrode structure 21 is 10 ⁇ m or less, the influence caused thereby is negligible (as in the above example, Since the heat transfer thickness is the square of 200 W / (m ⁇ K), which is about the same as aluminum, the thermal conductivity is about 1/200 at 10 ⁇ m, so 1 W / (m ⁇ K) If the dielectric 13 is 1 ⁇ m as in the above model, the dielectric 13 is 1/20000, which is 0.01 W / (m ⁇ K), which is almost negligible.
  • each part may be appropriately set according to the liquid metal 18 to be used and the frequency to be taken in and out, and is not limited to such a value.
  • FIG. 12 is a graph showing voltage application characteristics
  • FIG. 12A is a graph showing the relationship between the contact angle ⁇ and the frequency f
  • FIG. 12B is a graph showing the relationship between the applied voltage V and the frequency f. From these graphs, it can be seen that in order to increase the frequency, it is necessary to reduce the contact angle, and in order to increase the frequency, it is necessary to increase the voltage. That is, by raising the voltage applied to the first electrode 12 and the second electrode 14 and lowering the contact angle, the frequency of taking in and out the liquid metal 18 can be raised.
  • FIG. 13 is a diagram showing an example of switching characteristics in one cycle of liquid metal loading and unloading. As shown in the figure, when viewed as one cycle and 360 °, the rise at the time of voltage application (ON) is maintained for 18 ° of one cycle, and then the ON voltage is maintained for 162 °. When the voltage is turned off (OFF), the falling off voltage is obtained over a period of 18 ° of one cycle.
  • the switching characteristic is not limited to this special characteristic, and it is preferable to obtain an on / off characteristic close to a rectangular wave.
  • FIG. 14 is a plan view for explaining the structure of the heat transfer unit of the second embodiment, as viewed from the direction corresponding to the arrow A in FIG.
  • blades 31 are arranged on the wall surfaces of the first electrode structure 11 side and the second electrode body structure 21 side in the gap 20 of the heat transfer section 30, that is, on the surface of the liquid repellent coating layer 15. It is.
  • the blade 31 extends vertically from the liquid reservoir 17 of the lower substrate 16 in the direction of the upper substrate 100, and the blade 31 on the first electrode structure 11 side and the blade 31 on the second electrode body structure 21 side do not contact each other. It is wide.
  • the blade 31 itself may be formed, for example, so that the material of the liquid repellent coating layer 15 has the structure of the blade 31 as it is.
  • the contact surface area of the liquid metal 18, the wall surface of the 1st electrode body structure 11, and the wall surface of the 2nd electrode body structure 21 becomes large, and heat transfer efficiency improves.
  • the gap d B is formed between the blade 31 of the first electrode structure 11 side and the second electrode structure body 21 side of the blade 31, the liquid to the blade wall even gap d B between the blade 31 The surface tension of the metal 18 works and the liquid metal 18 is more likely to rise (when voltage is applied).
  • the gap d B also previously described between the blade 31, it is preferably about 10 [mu] m ⁇ 50 [mu] m.
  • FIG. 15 is a top view showing a schematic configuration of the magnetic cooling / heating device of Embodiment 3, and shows a state seen through from above so that the positional relationship among the magnetic body, the permanent magnet forming the magnetic circuit, and the heat transfer unit can be understood.
  • FIG. 16A to 16B are top views of the magnetic body / heat transfer portion arrangement plate and the magnet arrangement plate constituting the magnetic air conditioner shown in FIG. 17 is an exploded cross-sectional view of the magnetic air conditioner shown in FIG. 15 (A is a cross-sectional view of the magnet arrangement plate 800 portion, and B is a cross-sectional view of the magnetic body / heat transfer portion arrangement plate 700 portion).
  • FIG. 15 is a cross-sectional view of the magnet arrangement plate 800 portion, and B is a cross-sectional view of the magnetic body / heat transfer portion arrangement plate 700 portion.
  • FIG. 18 is a schematic diagram for explaining a state in which heat moves when the magnet arrangement plate of this magnetic air conditioner is rotated
  • FIG. 18A is a cross section taken along the line AA in FIG. 15, 15 corresponds to a cross section taken along line AA in FIG. 15, and
  • FIG. 18B corresponds to a cross section taken along line BB in FIG.
  • FIG. 19 is an explanatory diagram for explaining the operation of the magnetic air conditioner according to the third embodiment.
  • the description of the drive section shown in FIG. 17 is omitted for easy understanding of the invention.
  • This magnetic air conditioner uses the same principle as the magnetic refrigeration shown in FIG. In order to perform magnetic refrigeration using this principle, it is configured as follows.
  • the magnetic air conditioner 500 includes a hollow disk-shaped magnetic body / heat transfer unit arrangement plate 700 (in particular, see FIG. 16A) having an open center part, and a center part.
  • a hollow disk-shaped magnet arrangement plate 800 (see FIG. 16B in particular).
  • the magnetic body / heat transfer section arrangement plate 700 has a low temperature side heat exchange section 40A disposed at the center thereof and a high temperature side heat exchange section 40B disposed at the outer periphery thereof.
  • the magnet arrangement plate 800 has two discs, an upper disc 800A and a lower disc 800B, which are arranged with a gap (see particularly FIG. 17).
  • the magnetic body / heat transfer portion arrangement plate 700 and the magnet arrangement plate 800 are arranged concentrically (refer to FIGS. 15, 17, and 18 in particular).
  • the magnetic body / heat transfer portion arrangement plate 700 is inserted between the upper disc 800A and the lower disc 800B of the magnet arrangement plate 800 (see particularly FIGS. 17 and 18).
  • the low temperature side heat exchanging unit 40A is arranged at the center of the magnetic body / heat transfer unit arrangement plate 700 and the magnet arrangement plate 800.
  • the high temperature side heat exchanging part 40B is arranged on the outer periphery of the magnetic body / heat transfer part arrangement plate 700 and the magnet arrangement plate 800 (see particularly FIGS. 15, 17, and 18).
  • the low temperature side heat exchange section 40A is disposed at the center thereof, and the outer peripheral section thereof.
  • the high temperature side heat exchange part 40B is arrange
  • the high temperature side heat exchange unit 40B is arranged at the center, and the low temperature side heat exchange unit 40A is arranged at the outer periphery thereof.
  • the arrangement of the low temperature side heat exchanging part 40A and the high temperature side heat exchanging part 40B differs depending on which of the positive and negative magnetic substances is used for the magnetic substance / heat transfer part arrangement plate 700.
  • the magnetic body / heat transfer part arrangement plate 700 is a hollow disk whose center part is open, and the opening diameter of the center part is larger than the diameter of the cylindrical low temperature side heat exchange part 40A. Slightly larger.
  • the diameter of the magnetic body / heat transfer part arrangement plate 700 is the same as the inner circumference of the cylindrical high temperature side heat exchange part 40B.
  • the magnetic body / heat transfer portion arrangement plate 700 is fixed to the high temperature side heat exchange portion 40B. Not shown between the magnetic body / heat transfer section arrangement plate 700 and the high temperature side heat exchange section 40B so that heat does not move between the magnetic body / heat transfer section arrangement plate 700 and the high temperature side heat exchange section 40B. It is preferable to interpose a heat insulating material.
  • a plurality of magnetic bodies are formed annularly and radially on one side of the magnetic body / heat transfer portion arrangement plate 700 (opposing surface of the disc 800A).
  • twelve magnetic body units 200A, 200B, 200C,..., 200G, adjacent to the region on the magnetic body / heat transfer portion arrangement plate 700 divided at a central angle of 30 ° in the circumferential direction. ..., 200L is formed.
  • the heat transfer part is arrange
  • Each magnetic body unit 200A, 200B, 200C,..., 200G,..., 200L has six magnetic bodies arranged from the center of the magnetic body / heat transfer section arrangement plate 700 toward the outer periphery.
  • the magnetic body unit 200A arranges magnetic bodies 10Aa, 10Ab, 10Ac, 10Ad, 10Ae, and 10Af
  • the magnetic body unit 200B arranges magnetic bodies 10Ba, 10Bb, 10Bc, 10Bd, 10Be, and 10Bf, respectively.
  • the six magnetic bodies constituting each magnetic unit are all positive magnetic bodies whose temperature rises when magnetism is applied. It is made of magnetic material suitable for each operating temperature range.
  • each magnetic body unit two magnetic bodies form a set to form a magnetic body block.
  • the magnetic bodies 10Aa and 10Ab form the magnetic body block 100Aa
  • the magnetic bodies 10Ac and 10Ad form the magnetic body block 100Ab
  • the magnetic bodies 10Ae and 10Af form the magnetic body block 100Ac.
  • the magnetic bodies 10Ba and 10Bb form the magnetic body block 100Ba
  • the magnetic bodies 10Bc and 10Bd form the magnetic body block 100Bb
  • the magnetic bodies 10Be and 10Bf form the magnetic body block 100Bc.
  • each of the magnetic body units 200A, 200B, 200C,..., 200G, ..., 200L has three magnetic body blocks 100Aa-100Ab-100Ac, 100Ba- 100Bb-100Bc,...
  • Each of the magnetic blocks 100Aa, 100Ab, 100Ac, 100Ba, 100Bb, 100Bc,... Has two magnetic bodies, 10Aa-10Ab, 10Ac-10Ad, 10Ae-10Af, 10Ba-10Bb, 10Bc-10Bd, 10Be-10Bf ... is formed.
  • the magnetic body unit 200A is formed of six magnetic bodies 10Aa, 10Ab, 10Ac, 10Ad, 10Ae, and 10Af. . These magnetic bodies have three magnetic body blocks 100Aa, 100Ab, and 100Ac. These magnetic blocks are formed of a set of two magnetic bodies 10Aa-10Ab, 10Ac-10Ad, and 10Ae-10Af.
  • the magnetic body units 200B to 200L are formed in the same manner as the magnetic body unit 200A. For this reason, the magnetic body / heat transfer portion arrangement plate 700 of Embodiment 3 has a configuration equivalent to that obtained by arranging the magnetic body units 200 shown in FIG. 1A in 12 rows in parallel.
  • the magnetic body 10Aa used in the third embodiment may be directly formed on the magnetic body / heat transfer portion arrangement plate 700.
  • the heat transfer portion arrangement plate 700 is preferably made of a material having a large thermal resistance. This is because if the thermal resistance is small, the heat generated by the magnetic bodies 10Aa,... Will be dissipated through the magnetic body / heat transfer portion arrangement plate 700. Further, in order to increase the thermal resistance, the magnetic bodies 10Aa,... Are not directly formed on the magnetic body / heat transfer portion arrangement plate 700, but the magnetic bodies 10Aa,. A heat insulating film or a heat insulating layer may be provided between the two.
  • the magnetic bodies 10Aa,... May be integrally formed on the magnetic body / heat transfer portion arrangement plate 700 as a magnetic unit 200A,... Via a heat insulating film or a heat insulating layer.
  • the magnetic material blocks 100Aa,... May be divided and formed via a heat insulating film or a heat insulating layer, and arranged on the magnetic material / heat transfer portion arrangement plate 700.
  • the magnetic bodies 10Aa,... are the same as those in the first embodiment as already described in the third embodiment.
  • La x Ca 1-x MnO 3 , La (Fe 1-x Si x ) 13 H y and the like can be used for the material composition.
  • the shape of the magnetic bodies 10Aa,... Is as shown in FIG. 15, FIG. 16A, FIG.
  • a shape such as a spherical shape, an ellipsoidal shape, a cubic shape, a cylindrical shape, or an elliptical columnar shape may be employed.
  • the magnetic body / heat transfer portion arrangement plate 700 includes the magnetic body unit 200A in which the magnetic bodies 10Aa... Of the same material are arranged in a plurality of rows in the radial direction.
  • a plurality of the magnetic body units 200A are arranged in an annular shape adjacent to each other at intervals in the circumferential direction intersecting with the arrangement direction of the magnetic bodies 10Aa,.
  • the magnetic unit 200A includes magnetic body blocks 100Aa,... In which magnetic bodies 10Aa,... Of the same material are arranged in a radial direction at intervals in a plurality of rows, and the magnetic body blocks 100Aa are arranged as magnetic bodies 10Aa,. They are formed in a plurality of rows with intervals in the direction.
  • the magnetic body unit 200A of the magnetic body / heat transfer section arrangement plate 700 between all the magnetic bodies 10Aa, between the magnetic bodies 10Aa and the low temperature side heat exchange section 40A, between the magnetic body 10Af and the high temperature side heat exchange.
  • a heat transfer portion is disposed between the portions 40B.
  • This heat exchange unit has the same configuration as that described in the first or second embodiment. That is, the heat transfer units 30Ba, 30Ab, 30Bc, 30Ad, 30Be, 30Af, and 30Bg are arranged in the direction from the low temperature side heat exchange unit 40A to the high temperature side heat exchange unit 40B. The same applies to the magnetic body unit 200B.
  • Heat transfer is performed between all the magnetic bodies 10Aa, between the magnetic bodies 10Aa and the low-temperature side heat exchange unit 40A, and between the magnetic body 10Af and the high-temperature side heat exchange unit 40B.
  • the parts 30Aa, 30Bb, 30Ac, 30Bd, 30Ae, 30Bf, and 30Ag are arranged (see FIG. 16A).
  • the heat transfer units 30Ab, 30Ad, and 30Af are simultaneously in a heat transfer state (ON), and at that time, the heat transfer units 30Ba, 30Bc, 30Be, and 30Bg are in a heat insulation state (OFF). Conversely, the heat transfer units 30Ab, 30Ad, and 30Af are simultaneously insulative (off), and at that time, the heat transfer units 30Ba, 30Bc, 30Be, and 30Bg are in the heat transfer state (on).
  • the heat transfer units 30Bb, 30Bd, and 30Bf are simultaneously in a heat transfer state (ON), and at that time, the heat transfer units 30Aa, 30Ac, 30Ae, and 30Ag are in a heat insulation state (OFF).
  • the heat transfer units 30Bb, 30Bd, and 30Bf are simultaneously insulative (off), and at that time, the heat transfer units 30Aa, 30Bc, 30Ae, and 30Ag are in the heat transfer state (on). That is, in the figure, when the heat transfer part of the subscript A of 30 is simultaneously turned on, the heat transfer part of the subscript B is simultaneously turned off or vice versa.
  • the heat transfer unit that is in the heat transfer state (ON) in the illustrated operation state is indicated by a symbol.
  • the heat transfer units are all the same.
  • the structure is between all the magnetic bodies, between the heat exchange part and the magnetic body.
  • the low temperature side heat exchanging portion 40A has the magnetic body units 200A, 200B, 200C formed on the magnetic body / heat transfer portion arrangement plate 700. ,..., 200G,..., 200L are adjacent to the magnetic bodies 10Aa, 10Bb,. Further, the high temperature side heat exchanging portion 40B is formed of the magnetic body 10Af located at the other end of the magnetic body units 200A, 200B, 200C,..., 200L formed on the magnetic body / heat transfer portion arrangement plate 700, 10Bf,... Also in all the magnetic units, heat transfer portions 30Ba, 30Ab... Or 30Aa, 30Bb,.
  • the magnet arrangement plate 800 is a hollow disc having an opening at the center thereof, and the opening diameter at the center is slightly larger than the diameter of the columnar low temperature side heat exchange portion 40A. is there. Moreover, the diameter of the magnet arrangement
  • the upper and lower two disks 800A and 800B can be separately rotated around the low-temperature side heat exchange unit 40A, and the bearings provided in the low-temperature side heat exchange unit 40A and the upper and lower two discs It is supported by bearings provided at the outer peripheral ends of the disks 800A and 800B.
  • the upper disk 800A is rotatably supported by bearings 520Aa and 520Ab
  • the lower disk 800B is rotatably supported by bearings 520Ba and 520Bb. Therefore, the upper disk 800A can rotate separately from the lower disk 800B.
  • the support board 530 is arrange
  • the support board 530 fixes servo motors 540A and 540B for separately rotating the upper and lower disks 800A and 800B.
  • the servo motor 540A is fixed to a portion facing the upper disc 800A of the support plate 530, and the servo motor 540B is fixed to a portion facing the lower disc 800B of the support plate 530.
  • Gears 550A and 550B are attached to the respective rotation shafts of the servo motors 540A and 540B.
  • a ring gear 560A that meshes with the gear 550A is attached to the outer periphery of the upper disk 800A.
  • a ring gear 560B that meshes with the gear 550B is attached to the outer periphery of the lower disc 800B.
  • the servo motors 540A and 540B, the gears 550A and 550B, and the ring gears 560A and 560B constitute a drive unit.
  • the servo motors 540A and 540B are rotated synchronously. Therefore, the magnet arrangement plate 800 is arranged such that the magnetic body / heat transfer unit arrangement plate 700 is sandwiched between the upper and lower disks 800A and 800B with the low temperature side heat exchange unit 40A as the center, and the low temperature side heat exchange unit 40A. It rotates with the high temperature side heat exchange part 40B.
  • a plurality of permanent magnets are arranged annularly and radially on one side of the upper disk 800A forming the magnet arrangement plate 800 (the lower side of the disk 800A shown in FIGS. 17 and 18). It is.
  • the permanent magnets are magnetic body blocks 100Aa, 100Ab, 100Ac, 100Ba, 100Bb of the magnetic body units 200A, 200B, 200C, ..., 200G, ..., 200L of the magnetic body / heat transfer portion arrangement plate 700 shown in Fig. 16A. , 100Bc,... Are arranged so that one permanent magnet faces each other.
  • the permanent magnet Each time the magnet arrangement plate 800 rotates 30 ° and moves to the adjacent magnetic body unit, the permanent magnet is moved to the adjacent magnetic body unit 200A, 200B, 200C,..., 200G,. 100Ab, 100Ac, 100Ba, 100Bb, 100Bc,... Reciprocate in the radial direction. Therefore, the permanent magnet individually applies magnetism to the magnetic bodies 200A, 200B, 200C,..., 200G,.
  • permanent magnets 20Aa, 20Ac, and 20Ae at the corresponding positions of the magnetic body unit 200A in the upper disk 800A of the magnet arrangement plate 800 in the drawing are
  • the magnetic body / heat transfer portion arrangement plate 700 is in a position facing the magnetic bodies 10Aa, 10Ac, and 10Ae of the magnetic body unit 200A.
  • the permanent magnets 20Ba, 20Bc, and 20Be at the corresponding positions of the magnetic body unit 200B are respectively at positions facing the magnetic bodies 10Bb, 10Bd, and 10Bf of the magnetic body unit 200B.
  • the permanent magnets 20Aa, 20Ac, 20Ae at the corresponding positions of the magnetic body unit 200A are opposed to the magnetic bodies 10Ba, 10Bc, 10Be of the magnetic body unit 200B, respectively. It becomes the position to do.
  • the permanent magnets at the corresponding positions of the magnetic body unit 200L are positions facing the magnetic bodies 10Ab, 10Ad, and 10Af of the magnetic body unit 200A. That is, each time the magnet arrangement plate 800 rotates 30 ° clockwise, the permanent magnets reciprocate for each magnetic body block in each of the magnetic body units 200A, 200B, 200C, ..., 200G, ..., 200L.
  • the positional relationship between the permanent magnet and the magnetic body is the same positional relationship as the positional relationship in FIG. 1A and the positional relationship in FIG. 1B are repeated each time the magnet arrangement plate 800 rotates 30 °.
  • the permanent magnets 20Aa, 20Ac, and 20Ae are formed of magnetic bodies 10Aa, 10Ac, Magnetism is simultaneously applied to 10Ae.
  • the heat transfer portions 30Ab, 30Ad, and 30Af of the magnetic body unit 200A are in a heat transfer state
  • the heat transfer portions 30Ba, 30Bc, 30Be, and 30Bg are in a heat insulating state.
  • the permanent magnets 20Ba, 20Bc, and 20Be are magnetic bodies 10Bb and 10Bd that are positioned at the other ends of the respective magnetic body blocks 100Ba, 100Bb, and 100Bc of the other adjacent magnetic body unit 200B. 10Bf is simultaneously magnetized. At this time, the heat transfer portions 30Ba, 30Bc, 30Be, and 30Bg of the magnetic body unit 200B are in a heat transfer state, and the heat transfer portions 30Ab, 30Ad, and 30Af are in a heat insulation state.
  • the positional relationship between the permanent magnet and the magnetic body between two adjacent magnetic body units is the same as in the case of the magnetic body units 200A and 200B.
  • the positional relationship between the permanent magnet and the magnetic body as described above between two adjacent magnetic body units is referred to as state 1.
  • the permanent magnets 20Aa, 20Ac, 20Ae are magnetized at one end of each of the magnetic body blocks 100Ba, 100Bb, 100Bc of the other adjacent magnetic body unit 200B. Magnetism is simultaneously applied to the bodies 10Ba, 10Bc, and 10Be. This state is equivalent to the movement of the permanent magnets 20Ba, 20Bc, 20Be shown in FIG. 18B to the left magnetic bodies 10Ba, 10Bc, 10Be.
  • the permanent magnet present at the corresponding position of the magnetic body unit 200L is simultaneously magnetized to the magnetic bodies 10Ab, 10Ad, 10Af located at the other ends of the respective magnetic body blocks 100Aa, 100Ab, 100Ac of one adjacent magnetic body unit 200A. Apply. This state is equivalent to the movement of the permanent magnets 20Aa, 20Ac, 20Ae shown in FIG. 18A to the right magnetic bodies 10Ab, 10Ad, 10Af. Also in the other magnetic body units 200C-200L, the positional relationship between the permanent magnet and the magnetic body between two adjacent magnetic body units changes in the same manner as in the case of the magnetic body units 200A and 200B. The positional relationship between the permanent magnet and the magnetic body as described above between two adjacent magnetic body units is referred to as state 2.
  • Magnetic protrusions are formed on one side of the lower disk 800B that forms the magnet arrangement plate 800 (the upper side of the disk 800B shown in FIGS. 17 and 18).
  • the magnetic protrusions are arranged in correspondence with the arrangement of the permanent magnets arranged on one side of the upper disk 800A.
  • a magnetic projection 20Ab is arranged corresponding to the permanent magnet 20Aa
  • a magnetic projection 20Ad is arranged corresponding to the permanent magnet 20Ac
  • a magnetic projection 20Af is arranged corresponding to the permanent magnet 20Ae. ing.
  • a magnetic protrusion 20Bb is disposed corresponding to the permanent magnet 20Ba
  • a magnetic protrusion 20Bd is disposed corresponding to the permanent magnet 20Bc
  • a magnetic protrusion 20Bf is disposed corresponding to the permanent magnet 20Be.
  • the magnet arrangement plate 800 is composed of two magnetically connected flat plates that sandwich the magnetic material / heat transfer portion arrangement plate 700 with a gap.
  • the permanent magnets disposed on the upper disk 800A and the magnetic protrusions disposed on the lower disk 800B form a magnetic circuit between the upper disk 800A and the lower disk 800B. This magnetic circuit constitutes a magnetic application unit.
  • a permanent magnet is used as means for generating magnetism in the magnetic application unit.
  • a superconducting magnet or an electromagnet can be used.
  • the magnetic circuit is composed of an electromagnet, the magnitude of the magnetism applied to the magnetic body can be changed within a certain range, so that the magnetism applying unit can have versatility.
  • a permanent magnet is disposed on the upper disk 800A and a magnetic protrusion is disposed on the lower disk 800B.
  • a magnetic protrusion is disposed on the upper disk 800A.
  • a permanent magnet is disposed on the lower disk 800B.
  • both disks are rotated as a unit. However, both disks may be provided separately as long as they are magnetically connected. Since the upper disc 800A and the lower disc 800B are magnetically connected and the permanent magnet and the magnetic projection are provided opposite to each other, the magnetic flux from the permanent magnet can be effectively utilized, and the permanent magnet can be downsized. Weight reduction is possible.
  • the magnet arrangement plate 800 is preferably made of a low heat transfer material having a large thermal resistance so as not to let the heat generated by the magnetic bodies 10Aa,... And the heat transferred by the heat transfer units 30Aa,.
  • the permanent magnet 20Aa is located on the magnetic body 10Aa
  • the permanent magnet 20Ac is located on the magnetic body 10Ac
  • the permanent magnet 20Ae is located on the magnetic body 10Ae (FIG. 18A, (See FIG. 19A).
  • magnetism is applied to the magnetic bodies 10Aa, 10Ac, and 10Ae
  • no magnetism is applied to the magnetic bodies 10Ab, 10Ad, and 10Af
  • the magnetism is removed.
  • the magnetic bodies 10Aa, 10Ac, and 10Ae generate heat.
  • the heat transfer section 30Ab is in a heat transfer state between the magnetic bodies 10Aa and 10Ab
  • the heat transfer section 30Ad is in the magnetic bodies 10Ac and 10Ad
  • the heat transfer section 30Af is in the heat transfer state between the magnetic bodies 10Ae and 10Af.
  • heat transfer between adjacent magnetic bodies in each magnetic body block is performed. That is, the heat generated by the magnetic bodies 10Aa, 10Ac, and 10Ae due to the magnetocaloric effect is transferred to the magnetic bodies 10Ab, 10Ad, and 10Af, respectively.
  • heat is not transferred between the low temperature side heat exchange unit 40A and the magnetic body 10Aa and between the high temperature side heat exchange unit 40B and the magnetic body 10Af. Also, heat transfer between the magnetic blocks is not performed.
  • the corresponding position of the magnetic body unit 200B is such that the permanent magnet 20Ba is positioned on the magnetic body 10Bb, the permanent magnet 20Bc is positioned on the magnetic body 10Bd, and the permanent magnet 20Be is positioned on the magnetic body 10Af (see FIGS. 18B and 19A).
  • magnetism is applied to the magnetic bodies 10Bb, 10Bd, and 10Bf, and no magnetism is applied to the magnetic bodies 10Ba, 10Bc, and 10Be, and the magnetism is removed.
  • the magnetic bodies 10Bb, 10Bd, and 10Bf generate heat.
  • the heat transfer section 30Ba is between the low temperature side heat exchange section 40A and the magnetic body 10Ba
  • the heat transfer section 30Bc is between the magnetic bodies 10Bb and 10Bc
  • the heat transfer section 30Be is between the magnetic bodies 10Bd and 10Be.
  • the heat transfer unit 30Bg is in a heat transfer state between the magnetic body 10Bf and the high temperature side heat exchange unit 40B. Therefore, heat transfer is performed between the adjacent magnetic bodies 10Bb-10Bc, 10Bd-10Be in the adjacent magnetic body blocks 100Ba, 100Bb, 100Bc.
  • heat is generated between the magnetic body 10Ba located at one end of the magnetic body unit 200B and the low temperature side heat exchange unit 40A and between the magnetic body 10Bf located at the other end of the magnetic body unit 200B and the high temperature side heat exchange unit 40B.
  • the plurality of magnetism applying units arranged on the magnet arrangement plate 800 are moved relative to the magnet arrangement plate 800 and the magnetic body / heat transfer unit arrangement plate 700 by the relative movement between the magnet arrangement plate 800 and the magnetic body / heat transfer unit arrangement plate 700.
  • the magnetocaloric effect is developed by moving close to and away from the plurality of magnetic bodies arranged in the plate.
  • the plurality of heat transfer units arranged on the magnetic body / heat transfer unit arrangement plate 700 “switch the heat transfer state and the heat insulation state in accordance with the movement of the magnet arrangement plate 800.
  • the above state 1 is as shown in FIG. 19A.
  • heat is transferred between adjacent magnetic bodies in each magnetic block, and between the adjacent magnetic bodies of the adjacent magnetic blocks at the corresponding position of the magnetic unit 200B.
  • heat is transferred between the magnetic body positioned at one end of the magnetic unit 200B and the low-temperature side heat exchange unit 40A and between the magnetic body positioned at the other end of the magnetic unit 200B and the high-temperature side heat exchange unit 40B.
  • the heat transfer section 30 is at the corresponding position of the magnetic body unit 200A.
  • the positional relationship between the magnetic body and the magnetic body is equivalent to that shown in FIG. 18B.
  • the positional relationship between the heat transfer section 30 and the magnetic body is equivalent to that shown in FIG. 18A.
  • the positional relationship between the permanent magnet and the magnetic body in the state 2 is obtained by reversing the positional relationship between the permanent magnet and the magnetic body in the state 1 between adjacent magnetic units.
  • the heat transfer portion of the magnet arrangement plate 800 transfers heat between adjacent magnetic bodies in each magnetic block of one adjacent magnetic body unit and the other magnetic body. Between adjacent magnetic bodies of adjacent magnetic body blocks of the body unit, between the magnetic body located at one end of the other magnetic body unit and the low temperature side heat exchange section, and at the other end of the other magnetic body unit Heat is transferred between the magnetic body located at the high temperature side and the high temperature side heat exchange part.
  • state 2 heat is transferred between adjacent magnetic bodies in each magnetic block of the other adjacent magnetic body unit, and adjacent magnetic bodies of adjacent magnetic body blocks of one magnetic body unit are transferred. And between the magnetic body located at one end of the one magnetic body unit and the low-temperature side heat exchange section and between the magnetic body located at the other end of the one magnetic body unit and the high-temperature side heat exchange section. Heat to and from.
  • 17 and 18 has a magnetic body / heat transfer portion arrangement plate 700 for relatively moving the magnetic body / heat transfer portion arrangement plate 700 and the magnet arrangement plate 800 in the arrangement direction of the magnetic unit.
  • either one of the magnet arrangement plates 800 is rotated.
  • Any type of electric motor can be used as the drive unit as long as it can rotate the magnetic body / heat transfer unit arrangement plate 700 and the magnet arrangement plate 800.
  • the magnet arrangement plate 800 is rotated with its central portion as the rotation axis.
  • the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B are provided with a mechanism capable of exchanging heat with an external environment such as indoor air.
  • a mechanism may be adopted in which a refrigerant is supplied from the outside and heat exchange with the external environment can be performed via the refrigerant.
  • the magnetic air conditioner 500 according to the present embodiment configured as described above performs magnetic refrigeration as follows.
  • the steady state is reached quickly from the starting time. Can do. That is, the steady state is reached while the number of rotations of the magnet arrangement plate 800 is small compared to a magnetic air conditioner having the same configuration using a conventional magnetic body.
  • the temperature of the low temperature side heat exchange unit 40A can be lowered and the temperature of the high temperature side heat exchange unit 40B can be increased, and the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B can be increased. A temperature difference can be produced between them.
  • the number of magnetic blocks arranged in series is increased and connected to the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B.
  • the temperature difference between the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B can be increased.
  • a magnetic material whose starting temperature is in the operating temperature range is mixed with at least the lowest temperature side and the higher temperature side magnetic body.
  • the magnetic air conditioner of Embodiment 3 is applied to an air conditioner that performs indoor air conditioning, a refrigerator, an air conditioner that performs air conditioning of a vehicle interior, in addition to a vehicle refrigeration apparatus (particularly a cooling device for a fuel cell or a secondary battery). be able to.
  • the magnet arrangement plate 800 In the third embodiment, an example in which permanent magnets and magnetic protrusions are arranged on the magnet arrangement plate 800 is illustrated.
  • positioning board 800 can be reduced in size and weight.
  • the magnetic body / heat transfer portion arrangement plate 700 and the magnet arrangement plate 800 are illustrated in a disk shape, and both plates are relatively rotated.
  • positioning board 800 may be made into flat form, and both plates may be reciprocated relatively linearly.
  • magnetic refrigeration can be performed only by relatively moving the magnetic body / heat transfer portion arrangement plate 700 and the magnet arrangement plate 800 in the arrangement direction of the magnetic body unit.
  • the configuration of the magnetic air conditioner can be simplified, and downsizing, weight reduction, and cost reduction can be realized.
  • Embodiment 4 is a form in which the gaps in the two heat transfer units are connected by a communication path.
  • FIG. 21 is a cross-sectional view showing a configuration in which the gaps in the two heat transfer units are connected by a communication path in the magnetic air conditioning apparatus according to the fourth embodiment. This cross-sectional view shows the same cross-sectional position as in FIGS.
  • the gaps 20 in the two heat transfer portions 30a and 30b are connected by the communication path 50.
  • the open end 24 of the gap 20 is covered with a lid portion 55 that covers these open ends 24 to form a sealed space 56.
  • the inside of the sealed space 56 formed by the lid portion 55 is filled with an inert gas.
  • an inert gas For example, helium can be used as the inert gas.
  • the fourth embodiment is the same as any one of the first to third embodiments except that the communication path 50 and the lid 55 are provided in the heat transfer parts 30a and 30b. Omitted.
  • the communication path 50 connects the gaps 20 between the heat transfer section 30a and the heat transfer section 30b so that the liquid metal 18 can move.
  • the communication passage 50 is connected without providing a liquid reservoir.
  • the liquid transfer reservoirs 50a and 30b are provided with respective liquid reservoirs. May be connected by the communication path 50.
  • the wirings 111a and 112a of the heat transfer unit 30a and the wirings 111b and 112b of the heat transfer unit 30b constitute the upper substrate 100 independently of each other.
  • the insulating material 52 is provided between the wiring 111a and 112a located between the heat transfer parts 30a and 30b and the wiring 111b and 112b.
  • the insulating material 52 may be the same member as the insulating layer 113, or may be provided separately to insulate the wiring.
  • both the heat transfer units 30a and 30b can be operated independently.
  • the other is on. That is, when the heat transfer unit 30a side is off, no voltage is applied to the first and second electrodes 12 and 14 on the heat transfer unit 30a side, and the first and second electrodes on the heat transfer unit 30b side are not applied. A voltage is applied to 12 and 14 and they are on.
  • the gap 20 on the heat transfer part 30a side disappears, while the gap 20 on the heat transfer part 30b side disappears.
  • the heat transfer part 30a side is a heat insulation state
  • the heat transfer part 30b side is a heat state.
  • Electrowetting is as described in the first embodiment.
  • the gap 20 on the heat transfer section side that is turned on functions as a liquid storage section for the gap 20 on the heat transfer section side that is turned off. become.
  • the internal wall surface of the communication path 50 has liquid repellency with respect to the liquid metal 18 so that the liquid metal 18 can easily move.
  • a liquid repellent coating layer (not shown) may be provided in the same manner as the gap 20, or the inner wall surface itself may be liquid repellent processed.
  • the lid portion 55 forms one sealed space 56 that covers at least the open end 24 of each gap 20 between the heat transfer portions 30a and 30b connected by the communication path 50.
  • the liquid metal 18 is prevented from being oxidized by filling the sealed space 56 formed by the lid portion 55 with an inert gas.
  • the liquid metal 18 is still a metal. For this reason, it is oxidized when exposed to air for a long time. Although the degree of oxidation varies depending on the composition of the liquid metal, it is possible to prevent the oxidation of the liquid metal 18 by providing the sealed space 56 and filling the inside with an inert gas, thereby extending the life of the apparatus. it can. In particular, when galinstan mentioned as an example of the liquid metal is used, oxidation of galinstan can be prevented.
  • the open ends 24 of the gaps 20 of the heat transfer portions 30a and 30b connected by the communication passage 50 are covered with the lid portion 55, but instead, the entire magnetic air conditioner (at least) A plurality of heat transfer units) may be placed in a sealed casing, and the entire interior of the casing may be used as a sealed space, and an inert gas may be placed therein.
  • the first embodiment by providing the sealed space 56 with such a casing covering the entire apparatus and filling the inside with an inert gas to prevent the liquid metal 18 from being oxidized.
  • an inert gas to prevent the liquid metal 18 from being oxidized.
  • the sealed space 56 not only the open end 24 where each heat transfer unit 30 is independent, but also a hole 25 is provided on the liquid reservoir 17 side so that gas can enter and exit. For this reason, it is possible to prevent oxidation not only from the open end 24 of the gap 20 but also from the hole 25 by putting the entire apparatus in a casing and filling the inside with an inert gas.
  • the inside of the sealed space 56 may be evacuated (depressurized state) so that air (mainly oxygen and moisture) does not enter. In that case, it is preferable that the inside of the sealed space 56 is purged with an inert gas and then sealed under reduced pressure. By reducing the pressure after purging, the inside of the sealed space is filled with a slight amount of inert gas, so that oxidation of the liquid metal can be prevented.
  • the heat transfer units 30a and 30b connected by the communication path 52 may be connected in any way as long as the heat transfer units that are turned on when one is turned on are connected to each other.
  • the cross sections of the heat transfer portions 30a and 30b adjacent to each other in the direction in which heat is transferred are not limited to this.
  • circumferential heat transfer units may be connected to each other.
  • heat transfer units 30Aa and 30Ba are connected, 30Bb and 30Ab are connected, 30Ac and 30Bc are connected, 30Bd and 30Ad are connected, 30Ae and 30Be are connected, 30Bf and 30Af are connected, and 30Ag and 30Bg are connected.
  • the capacities of the gaps 20 can be made the same by connecting in the circumferential direction.
  • a part may be a circumferential direction and another part may be a heat transfer direction.
  • the heat transfer units 30Aa and 30Ba are connected.
  • 30Bb and 30Ac are connected
  • 30Bd and 30Ae are connected
  • 30Bf and 30Ag are connected.
  • 30Ab and 30Bc are connected
  • 30Ad and 30Be are connected
  • 30Af and 30Bg are connected.
  • the capacities of the gaps 20 are different between the heat transfer portions connected in the heat transfer direction. Therefore, when the gaps have different capacities, the capacities of both may be made uniform by changing the interval of one of the gaps.
  • three or more heat transfer units may be connected by a communication path.
  • at least one of the three or more connected heat transfer units is turned on, at least one of the other heat transfer units is always turned off.
  • capacitance which a liquid metal can mutually accommodate is set as the relationship of ON and OFF. If only one heat transfer section turned on is turned off and the liquid metal from the heat transfer section cannot be accommodated, a liquid reservoir is provided in the middle of the communication path and adjusted accordingly. Also good.
  • a form in which all the heat transfer units are connected by a communication path may be used.
  • FIG. 22 is a diagram showing an air conditioning circulation system using the magnetic air conditioning apparatus according to the fourth embodiment.
  • the overall configuration of the magnetic cooling and heating apparatus 500 is the same as that of the third embodiment, but only the configuration of the heat transfer unit is modeled so as to be the fourth embodiment. That is, two heat transfer parts in the circumferential direction are connected to each other.
  • heat transfer units 30Aa and 30Ba are connected, 30Bb and 30Ab are connected, 30Ac and 30Bc are connected, 30Bd and 30Ad are connected, and 30Ae and 30Be are connected.
  • 30Bf and 30Af are connected, and 30Ag and 30Bg are connected.
  • a low temperature side heat exchanger 630 is connected to the low temperature side heat exchange section 40A (see Embodiment 3) of the magnetic cooling and heating apparatus 500, and the high temperature side heat exchange section 40B (implemented).
  • a high-temperature side radiator 730 is connected to the third embodiment).
  • the low temperature side radiator 630 is connected to the air inlet and outlet of the inner refrigerant passage 600 via the inner refrigerant passage pump 780.
  • the high temperature side radiator 730 is connected to the air inlet and outlet of the outer refrigerant passage 720 via the outer refrigerant passage pump 790.
  • the inner peripheral refrigerant passage pump 780 controls the flow rate of the refrigerant flowing through the inner peripheral refrigerant passages 600A-600F.
  • the peripheral refrigerant passage pump 790 controls the flow rate of the refrigerant flowing through the outer peripheral refrigerant passage 720.
  • the cold air generated in the inner peripheral refrigerant passage 600 is supplied to the low-temperature side radiator 630 and is heat-exchanged with the external air forcedly blown by the low-temperature side radiator fan 630F.
  • the air after the heat exchange is returned to the inner peripheral refrigerant passage 600 and cooled.
  • the hot air generated in the outer peripheral refrigerant passage 720 is supplied to the high-temperature side radiator 730, and heat exchange is performed with the external air forcedly blown by the high-temperature side radiator fan 730F.
  • the air after heat exchange returns to the outer refrigerant passage 720 and is heated again.
  • the low temperature side radiator 630 cools outside air, and the high temperature side radiator 730 heats outside air. In such a heat exchanger model, calculate the heat switching frequency of the heat transfer section that is closely related to the heat transfer rate.
  • FIG. 23 is a flowchart showing a procedure for calculating the thermal switching frequency.
  • a desired temperature is set as a set temperature as a temperature of a predetermined space (for example, assuming a vehicle interior), and a required heat amount and a required temperature difference corresponding to this temperature are input. (S10).
  • the required amount of heat required for setting the predetermined space in the predetermined space is obtained. Further, the difference between the temperature of the air flowing out from the outer peripheral refrigerant passage and the temperature of the air flowing out from the inner peripheral refrigerant passage is obtained. The obtained values are input as the required heat amount and the required temperature difference.
  • the switching operation frequency f of the heat transfer unit in which the input required heat amount and the required temperature difference are set in advance is input.
  • the switching operation frequency f is one cycle from on to off until it is turned on again.
  • the air temperature that serves as a reference for the temperature of the air flowing into the outer refrigerant passage from the magnetic calorific material ambient temperature, the temperature of the air that flows out of the outer refrigerant passage from the temperature that is half the required temperature difference from the magnetic calorific material ambient temperature, and the magnetic calorific value The air temperature serving as a reference for the temperature of the air flowing into the inner peripheral refrigerant passage from the material ambient temperature, and the temperature of the air flowing out from the inner peripheral refrigerant passage from a temperature half the required temperature difference from the ambient temperature of the magnetic calorific value material are input.
  • the air flow rate of the outer periphery refrigerant passage pump 780 that supplies the refrigerant to the outer periphery refrigerant passage and the air flow rate of the inner periphery refrigerant passage pump 790 that supplies the refrigerant to the inner periphery refrigerant passage are also input. Further, the air volume of the low-temperature side radiator fan 630F and the air volume of the high-temperature side radiator fan 730F are also input (S20).
  • the magnetic air conditioner 500 is operated. Specifically, in order to realize the input operating frequency f, the heat transfer unit is switched as described in the third embodiment.
  • the amount of heat generated by the magnetic air conditioner 500 estimated based on the ambient temperature of the magnetocaloric material, the temperatures of the low temperature side heat exchange unit 450A and the high temperature side heat exchange unit 450B, and the operating frequency f is an error from the required heat amount. It is determined whether it is within the range (S30). The error range is set in advance. If the generated heat amount is not within the error range (S30: NO), the operating frequency f is changed so as to be within the error range (S40). Specifically, if the amount of heat generated by the magnetic cooling / heating device 500 is considerably smaller than the required amount of heat, the switching frequency of the heat transfer unit is increased in order to increase the amount of heat generated. Conversely, if the amount of heat generated by the magnetic cooling / heating device 500 is too large than the required amount of heat, the switching frequency of the heat transfer unit is decreased in order to decrease the amount of heat generated.
  • the temperature of the air at the inlet of the outer refrigerant passage and the temperature of the air at the inlet of the inner refrigerant passage are respectively the outer refrigerant passage and the inner refrigerant.
  • the temperature of the air flowing into the passage serves as a standard for the temperature of the air, and the temperature of the air at the outlet of the outer refrigerant passage and the temperature of the air at the outlet of the inner refrigerant passage are respectively set to the outer peripheral refrigerant. It is determined whether the temperature of the air flowing out of the passage and the inner refrigerant passage is within an error (S50).
  • the error range is set in advance.
  • the outer refrigerant passage for flowing air to the outer refrigerant passage so as to be within the error range
  • the air flow rates of the low temperature side radiator fan 630F and the high temperature side radiator fan 730F are changed (S60).
  • FIG. 24 is a perspective view showing a heat transfer portion shape model (communication model) when trial calculation of response characteristics when two heat transfer portions communicate with each other.
  • the communication model has a higher operating frequency by about 30% than the independent model. . This indicates that the two heat transfer portions can be operated faster by communicating with each other through the communication path.
  • FIG. 26 is a top view of the magnetic material / heat transfer portion arrangement plate portion of the fifth embodiment.
  • the basic form of the fifth embodiment is the same as that of the third embodiment. That is, it has each magnetic body unit 200A, 200B, 200C, ..., 200G, ..., 200L.
  • the magnetic body units 200A, 200B, 200C,..., 200G,..., 200L six magnetic bodies are arranged from the center portion of the magnetic body / heat transfer portion arrangement plate 700 toward the outer peripheral portion.
  • the magnetic body unit 200A arranges magnetic bodies 10Aa, 10Ab, 10Ac, 10Ad, 10Ae, and 10Af
  • the magnetic body unit 200B arranges magnetic bodies 10Ba, 10Bb, 10Bc, 10Bd, 10Be, and 10Bf, respectively.
  • Each magnetic body is a positive magnetic body whose temperature rises when magnetism is applied. It is made of magnetic material suitable for each operating temperature range.
  • the application of magnetism to each magnetic body is performed by a magnet arrangement plate (see FIG. 16B). Accordingly, when viewed as a single magnetic body unit, the direction in which the magnet rotates intersects the direction in which the magnetic bodies are arranged with a gap therebetween.
  • the magnet is a permanent magnet that rotates in the circumferential direction.
  • the magnetic body unit 200A focusing on the magnetic body unit 200A, between each of the magnetic bodies 10Aa to Af, between the low temperature side heat exchange unit 40A and the magnetic body 10Aa, and between the magnetic body 10Af and the high temperature side heat exchange unit 40B.
  • the liquid metal 18 moves in the gap 300.
  • the gap 300 is independent between each of the magnetic bodies 10Aa to Af, between the low temperature side heat exchange section 40A and the magnetic body 10Aa, and between the magnetic body 10Af and high temperature side heat exchange section 40B.
  • 200G,..., 200L are formed in a circular shape so as to penetrate the units 200A, 200B, 200C,.
  • the liquid metal 18 is arranged so that one magnetic body is separated and always moves in synchronism in both the circumferential direction and the row direction of the magnetic bodies. That is, in the illustrated state, when the heat transfer units 30Ba, 30Bc, 30Be, and 30Bg are located at the positions of the magnetic bodies in the magnetic unit 200A, the heat transfer units 30Bb, 30Bd, It is moved so that it is at the position of 30Bf.
  • the liquid metal 10 conducts heat transfer at these positions.
  • FIG. 27 is an enlarged schematic diagram of the gap portion. In this figure, a gap portion extending over two magnetic body units is shown.
  • a gap 300 is formed between the magnetic bodies 10 and 10 ′ arranged in the row direction.
  • the dielectric 13 and the first electrode 12 are formed in this order from the gap side on one wall surface of the gap.
  • the second electrode 14 is formed side by side on the same wall surface in a state of being electrically insulated separately from the first electrode 12 (here, physically separated).
  • the dielectric 13 and the second electrode are exposed on one wall surface of the gap 300.
  • the liquid metal 18 is arrange
  • the first electrode 12 and the second electrode 14 are connected to the electric circuit 301.
  • one first electrode 12 and one second electrode 14 are connected in a pair.
  • the first electrode 12 and the second electrode 14 are provided in two pairs in the length of one magnetic body in the circumferential direction, and can be switched independently by the electric circuit 301.
  • first electrode 12 and the second electrode 14 are connected to one electric circuit 301 one by one. However, in the actual circuit configuration, each first electrode 12 is shown. As long as the second electrode 14 can be individually switched, any circuit configuration may be used.
  • a position sensor (position detector) 302 for detecting the position of the liquid metal 18 is provided on the wall surface in the gap 300.
  • the position sensor 302 for example, a resistance sensor whose resistance value changes depending on the liquid metal 18 can be used. More specifically, for example, two electrodes that are exposed on the wall surface and insulated from each other are provided, and the resistance value between the two electrodes changes by simultaneously touching the liquid metal between the two electrodes. Such a simple sensor may be used. Of course, any other material can be used as long as the position of the liquid metal 18 can be detected.
  • the position sensor 302 is disposed on the wall surface facing the wall surface where the second electrode 14 is exposed. Thereby, it can be detected that the liquid metal 18 has passed between the first electrodes 12 arranged in the circumferential direction.
  • the gap 300 is a sealed space, and the inside thereof is filled with vacuum (depressurized state) or inert gas. This prevents the liquid metal from being oxidized. If the liquid metal 18 is resistant to oxidation, it is not necessary to fill with a vacuum or an inert gas. However, it is preferable to seal so that the liquid metal 18 does not leak.
  • the length of the liquid metal 18 in the circumferential direction is one lump of liquid metal 18, and it is necessary to perform heat transfer and heat insulation. Is necessary.
  • the first electrode 12 and the second electrode 14 immediately after the position sensor 302 are energized, and the liquid metal 18 and the first electrode 12 are energized.
  • Capacitors are formed. On the end side (in the direction of the arrow in the figure) where such a capacitor is formed, the contact angle ⁇ with the wall surface of the liquid metal 18 becomes 90 ° or less. Thereby, the liquid metal 18 proceeds in the direction of the arrow shown in the figure.
  • a liquid repellent coating layer may be provided on the wall surface (including the exposed surface of the dielectric 13) other than the surface of the second electrode 14 as in the other embodiments. Further, a liquid repellent coating layer may be provided on the surface of the second electrode 14 so as not to interfere with the conductivity with the liquid metal 18 (or to be in a conductive state).
  • the liquid pool in the first embodiment (see FIG. 9) or the passage in the fourth embodiment (see FIG. 21) is unnecessary.
  • the liquid metal 18 is moved in the circumferential direction to function as a thermal switch, a liquid reservoir and a passage for storing the liquid metal 18 are not necessary. Because.
  • FIG. 28 is an explanatory diagram for explaining a state in which the liquid metal advances.
  • the electric circuits are denoted by 301a, 301b, 301c, and 301d from the left in the figure for explanation.
  • the position sensors are denoted by 302a, 302b, 302c, and 302d from the left in the drawing.
  • step 1 the liquid metal 18 passes through the position sensor 302b, and the electric circuits 301a and 301b are on. , And others indicate the off state.
  • the liquid metal 18 moves from the state of step 1 to the state of step 2, it is detected by the position sensor 302c before the electric circuit 301c that the liquid metal 18 has come. This turns on the electric circuit 301c.
  • the contact angle ⁇ between the tip of the liquid metal and the wall surface is 90 ° or less. For this reason, the liquid metal 18 travels with a driving force generated in the direction of the arrow shown in the drawing.
  • the position sensor 302a since the position sensor 302a does not detect the liquid metal 18, the electric circuit 301a is turned off accordingly.
  • the contact angle ⁇ with the wall surface becomes 90 ° or more.
  • the liquid metal 18 does not generate a driving force in the backward direction (opposite to the arrow). In this way, the driving force in the direction of the arrow further acts on the liquid metal 18.
  • the liquid metal 18 is moved in one direction. Can be moved.
  • FIG. 29 is a graph for explaining the positional relationship between the position sensor and the liquid metal.
  • This graph is a three-dimensional graph in which the x-axis direction is time elapsed, the y-axis direction is the position sensor on (ON) and off (OFF) state, and the z-axis direction is the position of the liquid metal.
  • the position sensor 302b is turned on when the liquid metal 18 moves and reaches the position sensor 302b (the state of step 1 in FIG. 28). Thereafter, while the position sensor 302b detects the liquid metal 18, the ON state continues. When the liquid metal 18 is no longer detected, it is turned off.
  • the position sensor 302c When the liquid metal 18 further moves and reaches the position sensor 302c, the position sensor 302c is turned on (state of step 2 in FIG. 28). Thereafter, while the position sensor 302c detects the liquid metal 18, the on state continues. When the liquid metal 18 is no longer detected, it is turned off.
  • the position sensor 302d When the liquid metal 18 further moves and reaches the position sensor 302d, the position sensor 302d is turned on (state of step 3 in FIG. 28). Thereafter, while the position sensor 302d detects the liquid metal 18, the ON state continues. When the liquid metal 18 is no longer detected, it is turned off.
  • FIG. 30 is a graph for explaining the position of the liquid metal and the application state of the voltage between the first electrode and the second electrode by the electric circuit.
  • the x-axis direction is time elapsed
  • the y-axis direction is the application state of the voltage between the first electrode and the second electrode (eV is applied and 0V is not applied)
  • the z-axis direction is the position of the liquid metal. It is a three-dimensional graph.
  • FIG. 31 is a flowchart showing a control procedure for synchronizing the liquid metal and the position of the magnet that applies magnetism to the magnetic material.
  • the angular velocity vm and phase of the magnet arrangement plate are input (S1).
  • the angular velocity vm of the magnet arrangement plate is a value obtained by dividing the angle (M ⁇ in FIG. 26) when the magnet arrangement plate 800 is moved by the length of the magnetic body in the circumferential direction by time t.
  • the value is obtained by dividing 30 degrees by the time to move, which is determined in advance by the cooling / heating capacity.
  • the phase is where in the magnet block 200A to 200L the position where the innermost magnet exists in the magnet arrangement plate 800.
  • the moving angular velocity vL and phase of the liquid metal are calculated.
  • the movement angular velocity vL of the liquid metal is an angular velocity when the liquid metal moves by one circumferential length of the magnetic body.
  • 12 magnetic body blocks 200A to 200L are arranged in the circumferential direction. Therefore, the angle is 30 degrees, and this is a value divided by the time from when the position sensor (for example, 302b) is turned on until the next position sensor (for example, 302c) is turned on.
  • the phase is a position corresponding to the magnetic material in which the liquid metal currently exists.
  • the predetermined value is an allowable range for the position of the magnet and the position of the liquid metal to move together.
  • the circumferential interval between the magnetic blocks 200A to 200L (the magnetic bodies arranged in the circumferential direction) Since a difference of about a gap) is acceptable, a speed difference that falls within the difference is set as a predetermined value.
  • both the voltage between the first and second electrodes and the application time are increased (S5). Thereby, the moving speed of the liquid metal is accelerated. Thereafter, the process returns to S2.
  • the magnet position on the magnet arrangement plate and the on / off of the heat transfer unit (thermal switch) by the liquid metal 18 are synchronized.
  • two pairs of the first electrode 12 and the second electrode 14 are arranged in the length of one magnetic body in the circumferential direction, but the present invention is not limited to this. For example, as many as 3 pairs, 4 pairs, etc. may be arranged in the length of one magnetic body in the circumferential direction, or vice versa.
  • the position sensor position detector
  • the moving speed (angular speed) of the liquid metal is adjusted in advance so as to match the rotational speed (angular speed) of the magnetic material arranging plate, and thereafter, the current is sequentially applied between the first and second electrodes so as to maintain the speed. Even if it does, it can synchronize to some extent.
  • the rotation speed of the magnetic material arranging plate is slow, such control is possible.
  • the rotating speed of the magnetic material arranging plate is high, the configuration and control described in the fifth embodiment are used. Is preferred.
  • first electrode 12 and the dielectric 13 and the second electrode 14 are arranged on one wall surface in the gap 300, but the present invention is not limited to this, and may be arranged on opposing wall surfaces in the gap 300.
  • a heat transfer section is provided between a plurality of magnetic bodies arranged in a row, between the magnetic body and the low temperature heat exchange section, and between the magnetic body and the high temperature heat exchange section. .
  • a gap is provided, and liquid metal is taken in and out (moved) by electrowetting in the gap.
  • heat transfer is performed in a state where the liquid metal enters the gap, and switching is performed so as to insulate the liquid metal from the gap. Therefore, when the heat transfer and the heat insulation are switched, the liquid metal only moves in the gap and therefore no frictional heat is generated, so that the heat transfer and the heat insulation can be switched at a high speed. For this reason, the application and removal of magnetism by the magnetic circuit to be synchronized can be accelerated.
  • the movement of the liquid metal by electrowetting is such that when the voltage is applied, the contact angle between the liquid metal and the surface of the gap becomes 90 ° or less, so that the liquid metal has improved wettability with the surface of the gap and the surface. It moves in the gap by the action of tension. On the other hand, when the voltage is turned off, the contact angle exceeds 90 ° and the wettability on the surface is lost, and the liquid metal loses the moving force.
  • gaps are provided in a circumferential shape between the magnetic bodies that perform heat transfer and between the heat exchanger and the magnetic body.
  • the first electrodes and the second metal are alternately arranged in the circumferential direction.
  • the first electrode is insulated by a dielectric, and the second electrode and the dielectric are exposed on the wall surface forming the gap.
  • the liquid metal is moved in one direction by sequentially energizing the first electrode and the second electrode in one direction of the gap. For this reason, compared with the case where a liquid metal is reciprocated, the movement of the liquid smoother is attained. Further, since the movement is only in one direction, once the liquid metal starts to move, it can be moved at a high speed with a smaller driving force (that is, a low applied voltage).
  • the position detector for detecting the position of the liquid metal since the position detector for detecting the position of the liquid metal is provided, the position between the first and second electrodes is adjusted according to the position of the liquid metal detected by the position detector. What is necessary is just to apply a voltage and to energize.
  • synchronization can be obtained from the moving speed (angular speed) of the magnet and the moving speed (angular speed) of the liquid metal obtained from the position of the liquid metal detected by the position detector.
  • the gap is a sealed space, and the inside is filled with a vacuum (depressurized state) or an inert gas. This prevents the liquid metal from being oxidized.
  • the first electrode structure and the second electrode structure having the same structure are provided via a gap.
  • the first electrode structure and the second electrode structure are a liquid repellent coating layer, a second electrode, a dielectric, and a first electrode, respectively, in order from the gap side.
  • the first electrode is insulated from the liquid metal, and the second electrode is electrically connected to the liquid metal.
  • the liquid metal moves smoothly by providing the liquid repellent coating layer on the surface of the gap where the liquid metal contacts.
  • a liquid repellent coating layer may be provided, and similarly the liquid metal can be moved smoothly.
  • At least two heat transfer portions are connected by a communication path so that the liquid metal can move between these at least two heat transfer portions.
  • a force in the direction in which the liquid metal enters the gap works in the one heat transfer section, and the liquid metal in the direction in which the liquid metal leaves the gap in the other. Power will work. For this reason, a force twice as large as that of the isolated liquid reservoir (Embodiment 1) is applied to the liquid metal that moves back and forth through the communication path. Operation as a thermal switch becomes possible at higher speed.
  • the inner wall surface of the liquid pool is made lyophilic with respect to the liquid metal. Thereby, it becomes easy to store the liquid metal in the liquid reservoir.
  • the liquid metal can smoothly move between the gap and the liquid reservoir by having the open end in the gap.
  • an insulator having a dielectric constant lower than that of the dielectric is disposed near the open end. This eliminates (or reduces) the action of electrowetting at this portion and prevents the liquid metal from being discharged from the open end.
  • Embodiments 1 to 3 the open end provided in the gap is opened in a sealed space filled with an inert gas. As a result, the liquid metal can be prevented from coming into contact with the air to prevent the liquid metal from being oxidized, and the life of the magnetic air conditioner can be extended.
  • the gap has a width that is perpendicular to the surface of the opposing liquid repellent coating layer and does not reach the surfaces facing each other, and the liquid reservoir communicates from the liquid reservoir.
  • a plurality of blades extending to the end opposite to one end of the gap is provided.
  • the first electrode and the second electrode may be short-circuited.
  • the electrostatic energy stored in the dielectric between the first electrode and the second electrode is released at once, and the liquid metal that has gone up the gap more quickly is stored in the liquid. It can be lowered and housed inside.
  • the open end of the gap and the hole of the liquid reservoir may be connected via a gas communication path different from the gap. That is, this gas communication path forms a sealed space structure between the gap and the liquid reservoir.
  • the gas communication path is preferably filled with an inert gas.
  • the gas communication path is preferably filled with an inert gas.
  • the normal temperature (20 ° C.) is assumed as the temperature at the start, but the present invention is applicable when the start temperature is not necessarily the normal temperature.
  • First electrode structure 12 first electrode, 13 dielectric, 14 second electrode, 15 liquid repellent coating layer, 16 Lower substrate, 17 Liquid pool, 18 Liquid metal, 18 Upper substrate, 20 gap, 20A-20F magnetic circuit, 21 2nd electrode structure, 25 holes, 30 heat transfer section, 31 blades, 50 passages, 55 lid, 56 sealed space, 300 gap, 301 electrical circuit, 302 Position sensor (position detector).

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Hard Magnetic Materials (AREA)
  • General Induction Heating (AREA)

Abstract

L'invention porte sur un dispositif de refroidissement et de chauffage d'air magnétique, apte à exécuter un transfert de chaleur à haute vitesse et une isolation entre des corps magnétiques ou analogues. Pour atteindre ce résultat, une unité de transfert de chaleur est disposée entre une pluralité de corps magnétiques, et l'unité de transfert de chaleur comporte une première électrode (12) et un corps diélectrique (13) qui y sont adjacents et une seconde électrode (14) disposée en ligne avec la première électrode (12) et isolée de celle-ci, la première électrode (12) et la seconde électrode (14) étant disposées sur une surface de paroi à l'intérieur d'un espace libre (20). L'excitation séquentielle de la première électrode (12) et de la seconde électrode (14) en ligne a pour effet qu'un métal liquide (18) se déplace dans l'espace libre (20) par un effet d'électromouillage, en commutant ainsi entre le transfert de chaleur et l'isolation entre les corps magnétiques (10, 10').
PCT/JP2013/069280 2012-07-17 2013-07-16 Dispositif de refroidissement et de chauffage d'air magnétique WO2014013978A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014525820A JP5796682B2 (ja) 2012-07-17 2013-07-16 磁気冷暖房装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012158830 2012-07-17
JP2012-158830 2012-07-17
JP2013-006532 2013-01-17
JP2013006532 2013-01-17

Publications (1)

Publication Number Publication Date
WO2014013978A1 true WO2014013978A1 (fr) 2014-01-23

Family

ID=49948804

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/069280 WO2014013978A1 (fr) 2012-07-17 2013-07-16 Dispositif de refroidissement et de chauffage d'air magnétique

Country Status (2)

Country Link
JP (1) JP5796682B2 (fr)
WO (1) WO2014013978A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112789455A (zh) * 2018-09-27 2021-05-11 大金工业株式会社 磁冷冻系统
US20220268494A1 (en) * 2019-07-25 2022-08-25 National Institute For Materials Science Magnetic refrigeration module, magnetic refrigeration system, and cooling method
JP7362010B1 (ja) 2023-03-20 2023-10-16 三菱電機株式会社 磁気冷凍装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007147209A (ja) * 2005-11-30 2007-06-14 Toshiba Corp 磁気冷凍機
JP2007147136A (ja) * 2005-11-25 2007-06-14 Toshiba Corp 磁気冷凍機
US20110154833A1 (en) * 2009-12-29 2011-06-30 Foxconn Technology Co., Ltd. Miniaturized liquid cooling device
JP2013057409A (ja) * 2011-09-06 2013-03-28 Nissan Motor Co Ltd 磁気冷暖房装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007147136A (ja) * 2005-11-25 2007-06-14 Toshiba Corp 磁気冷凍機
JP2007147209A (ja) * 2005-11-30 2007-06-14 Toshiba Corp 磁気冷凍機
US20110154833A1 (en) * 2009-12-29 2011-06-30 Foxconn Technology Co., Ltd. Miniaturized liquid cooling device
JP2013057409A (ja) * 2011-09-06 2013-03-28 Nissan Motor Co Ltd 磁気冷暖房装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112789455A (zh) * 2018-09-27 2021-05-11 大金工业株式会社 磁冷冻系统
US20220268494A1 (en) * 2019-07-25 2022-08-25 National Institute For Materials Science Magnetic refrigeration module, magnetic refrigeration system, and cooling method
JP7362010B1 (ja) 2023-03-20 2023-10-16 三菱電機株式会社 磁気冷凍装置

Also Published As

Publication number Publication date
JPWO2014013978A1 (ja) 2016-06-30
JP5796682B2 (ja) 2015-10-21

Similar Documents

Publication Publication Date Title
JP6212955B2 (ja) 磁気冷暖房装置
JP6079498B2 (ja) 磁気冷暖房装置
JP5760976B2 (ja) 磁気冷暖房装置
JP4557874B2 (ja) 磁気冷凍機
JP5807723B2 (ja) 磁気冷暖房装置
US9784482B2 (en) Magnetic cooling apparatus and method of controlling the same
US9273886B2 (en) Magnetic refrigerator utilizing a permanent magnet to create movement between plates comprising high and low temperature side heat exchangers
US20150033762A1 (en) Regenerative electrocaloric cooling device
JP2007147136A (ja) 磁気冷凍機
JP6603701B2 (ja) 少なくとも一本のヒートパイプ、特に熱サイホンを有する空調装置
US20140130515A1 (en) Magnetic refrigeration device and magnetic refrigeration system
JP2008082662A (ja) 磁気冷凍デバイスおよび磁気冷凍方法
CN103206804A (zh) 磁冷却设备及其控制方法
JP5796682B2 (ja) 磁気冷暖房装置
JP2008544200A (ja) 連続回転磁気冷凍機またはヒートポンプ
JP2014095535A (ja) 磁気冷暖房装置
KR101204325B1 (ko) 콤팩트한 능동형 자기 재생식 냉동기
JP5884431B2 (ja) 磁気冷暖房装置
WO2021214836A1 (fr) Dispositif de réfrigération magnétique et dispositif à cycle de réfrigération
JP6136529B2 (ja) 磁気冷暖房装置および冷暖房システム
JP2013057408A (ja) 磁気冷暖房装置
JP5817353B2 (ja) 磁気冷暖房装置
JP2012167881A (ja) 磁気式温度調整装置の熱交換器
JP5857554B2 (ja) 磁気冷暖房装置
JP2013108664A (ja) 熱輸送器およびそれを用いた磁気冷暖房装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13819947

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2014525820

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13819947

Country of ref document: EP

Kind code of ref document: A1