WO2014007240A1 - Appareil électroluminescent et procédé de fabrication d'un appareil électroluminescent - Google Patents

Appareil électroluminescent et procédé de fabrication d'un appareil électroluminescent Download PDF

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Publication number
WO2014007240A1
WO2014007240A1 PCT/JP2013/068118 JP2013068118W WO2014007240A1 WO 2014007240 A1 WO2014007240 A1 WO 2014007240A1 JP 2013068118 W JP2013068118 W JP 2013068118W WO 2014007240 A1 WO2014007240 A1 WO 2014007240A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
dam
emitting device
sealing resin
light
Prior art date
Application number
PCT/JP2013/068118
Other languages
English (en)
Japanese (ja)
Inventor
宏彰 大沼
真也 石崎
幡　俊雄
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2014007240A1 publication Critical patent/WO2014007240A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Abstract

La présente invention concerne un appareil électroluminescent (1) comprenant des puces DEL (13) montées sur un substrat (11), une bague de retenue (12) disposée sur le substrat, les puces DEL étant rendues étanches avec une résine d'étanchéité (14). En outre, une lentille (15) est montée sur la résine d'étanchéité (14). Une partie de la bague de retenue (12) forme une partie en saillie plus haute que la surface supérieure de la résine d'étanchéité (14), et la lentille (15) est alignée en amenant son extrémité circonférentielle extérieure en contact avec la surface de paroi intérieure de la bague de retenue (12).
PCT/JP2013/068118 2012-07-06 2013-07-02 Appareil électroluminescent et procédé de fabrication d'un appareil électroluminescent WO2014007240A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-152759 2012-07-06
JP2012152759 2012-07-06

Publications (1)

Publication Number Publication Date
WO2014007240A1 true WO2014007240A1 (fr) 2014-01-09

Family

ID=49881995

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/068118 WO2014007240A1 (fr) 2012-07-06 2013-07-02 Appareil électroluminescent et procédé de fabrication d'un appareil électroluminescent

Country Status (1)

Country Link
WO (1) WO2014007240A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016115897A (ja) * 2014-12-18 2016-06-23 シチズン電子株式会社 発光装置及びその製造方法
JP6118437B1 (ja) * 2015-12-21 2017-04-19 ルーメンス カンパニー リミテッド Ｌｅｄモジュール
US10193032B2 (en) 2016-09-30 2019-01-29 Nichia Corporation Method for manufacturing light emitting device
JP2022104258A (ja) * 2020-12-28 2022-07-08 三菱電機株式会社 表示ユニット、表示装置、及び表示ユニットの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0983018A (ja) * 1995-09-11 1997-03-28 Nippon Denyo Kk 発光ダイオードユニット
JP2002543594A (ja) * 1999-04-22 2002-12-17 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング レンズ付ｌｅｄ光源
JP2008512867A (ja) * 2004-09-10 2008-04-24 ソウル セミコンダクター カンパニー リミテッド 多重モールド樹脂を有する発光ダイオードパッケージ
JP2012094611A (ja) * 2010-10-26 2012-05-17 Panasonic Corp 照明装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0983018A (ja) * 1995-09-11 1997-03-28 Nippon Denyo Kk 発光ダイオードユニット
JP2002543594A (ja) * 1999-04-22 2002-12-17 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング レンズ付ｌｅｄ光源
JP2008512867A (ja) * 2004-09-10 2008-04-24 ソウル セミコンダクター カンパニー リミテッド 多重モールド樹脂を有する発光ダイオードパッケージ
JP2012094611A (ja) * 2010-10-26 2012-05-17 Panasonic Corp 照明装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016115897A (ja) * 2014-12-18 2016-06-23 シチズン電子株式会社 発光装置及びその製造方法
JP6118437B1 (ja) * 2015-12-21 2017-04-19 ルーメンス カンパニー リミテッド Ｌｅｄモジュール
JP2017118088A (ja) * 2015-12-21 2017-06-29 ルーメンス カンパニー リミテッド Ｌｅｄモジュール
US10193032B2 (en) 2016-09-30 2019-01-29 Nichia Corporation Method for manufacturing light emitting device
JP2022104258A (ja) * 2020-12-28 2022-07-08 三菱電機株式会社 表示ユニット、表示装置、及び表示ユニットの製造方法

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