WO2013186904A1 - Dispositif de détection de condensation de rosée, système de refroidissement, et procédé de régulation du débit d'un fluide de refroidissement - Google Patents

Dispositif de détection de condensation de rosée, système de refroidissement, et procédé de régulation du débit d'un fluide de refroidissement Download PDF

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Publication number
WO2013186904A1
WO2013186904A1 PCT/JP2012/065276 JP2012065276W WO2013186904A1 WO 2013186904 A1 WO2013186904 A1 WO 2013186904A1 JP 2012065276 W JP2012065276 W JP 2012065276W WO 2013186904 A1 WO2013186904 A1 WO 2013186904A1
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WO
WIPO (PCT)
Prior art keywords
cooling medium
dew condensation
flow rate
cooled
electronic device
Prior art date
Application number
PCT/JP2012/065276
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English (en)
Japanese (ja)
Inventor
毅志 宗
紀久 ▲高▼橋
良典 鵜塚
淳一 尾郷
高橋　晋
Original Assignee
富士通株式会社
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Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to PCT/JP2012/065276 priority Critical patent/WO2013186904A1/fr
Priority to JP2014521067A priority patent/JPWO2013186904A1/ja
Publication of WO2013186904A1 publication Critical patent/WO2013186904A1/fr
Priority to US14/546,013 priority patent/US20150068702A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/02—Detecting the presence of frost or condensate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/04—Preventing the formation of frost or condensate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/56—Investigating or analyzing materials by the use of thermal means by investigating moisture content
    • G01N25/66—Investigating or analyzing materials by the use of thermal means by investigating moisture content by investigating dew-point

Definitions

  • the embodiment relates to a dew condensation detection apparatus that detects dew condensation by detecting water droplets generated by dew condensation.
  • the temperature and humidity of the installation environment of the liquid-cooled electronic equipment and the temperature of the coolant are controlled so that no condensation occurs.
  • the air conditioner breaks down or a temperature abnormality of the coolant output device occurs, the temperature of the coolant reaching the electronic device may become lower than the dew point, and the inside of the electronic device may be in a dew condensation state. In such a state, the electronic device may be turned on or the electronic device may continue to operate. In this case, if there is more than a certain amount of water droplets due to condensation inside the electronic device, a short circuit between the electrodes may occur in the electric circuit in the electronic device, which may cause failures such as malfunction of the electric circuit or burning of the electric circuit. is there.
  • a condensation sensor in an electronic device to detect condensation and take measures against condensation. That is, when dew condensation is detected by the dew condensation sensor, the electronic device is prohibited from being turned on or the electronic device is dried.
  • a dew condensation water detection sensor that detects dew condensation by detecting that water droplets generated by condensation flow out and reach a detection unit.
  • Such a dew condensation water detection sensor generally has a device to be measured and a water drop sensor (liquid sensor) formed of metal or the like that easily causes dew condensation.
  • the measured object is provided in a cold water supply passage between the cold water supply device and the electronic device, and is cooled by the cold water from the cold water supply device.
  • the cold water from the cold water supply device first cools the measurement object of the dew condensation detection sensor, and then the cold water is supplied to the electronic device to cool the heat generating components in the electronic device.
  • the temperature of the cold water entering the electronic device after cooling the subject body is the temperature of the cold water supplied to the subject body from the cold water supply device. Almost the same as temperature. Therefore, when dew condensation occurs on the side body, dew condensation may occur in the cold water passage in the electronic device almost simultaneously.
  • a dew condensation sensor is provided at the uppermost stream of a supply side pipe that supplies cold water to the cooling panel to detect dew condensation and control the cold water supply device (see, for example, Patent Document 2).
  • JP 2006-32515 A Japanese Patent No. 3447257
  • the dew condensation sensor detects dew condensation by detecting water droplets due to dew condensation, a certain amount of time is required from the start of dew condensation until it reaches a detectable amount of water droplets due to dew condensation. Therefore, there is a possibility that water droplets may be generated due to condensation in the electronic device between the time when condensation starts in the condensation sensor and the electronic device and until the condensation sensor detects condensation. May cause this. Therefore, there is a demand for the development of a dew condensation detection device that can prevent dew condensation from occurring in an electronic device between the start of dew condensation in the dew condensation sensor and the time when the dew condensation sensor detects dew condensation.
  • a dew condensation detector that is provided in a supply pipeline that supplies a cooling medium from a cooling medium supply device to a cooled device and detects water droplets due to condensation to detect dew condensation; and A heat transfer unit configured to transfer heat from the cooling medium flowing through the reflux pipe returning the cooling medium to the cooling medium supply apparatus to the cooling medium flowing through the supply pipe between the dew condensation detector and the apparatus to be cooled; A condensation detection device is provided.
  • a cooled device that cools internal components with a cooling medium
  • a cooling medium supply device that generates a cooling medium to be supplied to the cooled device, the cooled device and the cooling medium supply device are connected
  • the cooling A circulation line for connecting a cooling medium from the medium supply apparatus to the cooled apparatus, the cooled apparatus and the cooling medium supply apparatus, and returning the cooling medium from the cooled apparatus to the cooling medium supply apparatus
  • a cooling system is provided having a heat transfer section that is moved to a cooling medium.
  • a cooling medium flow rate control method for controlling the flow rate of the cooling medium supplied to the cooled apparatus, wherein the temperature of the cooling medium discharged from the cooled apparatus is detected, and the detected temperature is compared with a temperature threshold value.
  • a cooling medium flow rate control method for controlling the flow rate of the cooling medium supplied to the apparatus to be cooled based on the comparison result.
  • the dew condensation detector can detect the dew condensation before the dew condensation occurs inside the electronic device, and it is possible to prevent problems caused by the dew condensation in the electronic device.
  • FIG. 1 is a schematic diagram showing an overall configuration of an electronic device cooling system to which a dew condensation detection device according to the first embodiment is attached.
  • an electronic device 10 that is an example of a cooled device is a liquid-cooled electronic device such as a computer or a server, for example, and is cooled by low-temperature cooling water (hereinafter referred to as cold water) supplied from a cold water supply device 12.
  • the internal heat generating components (for example, semiconductor devices and power supply circuits) are cooled.
  • the cold water generated by the cold water supply device 12 is supplied to a cooling water passage (not shown) in the electronic device 10 through the cold water supply pipe 14.
  • a heat generating component is arranged in the middle of the cooling water passage, and the cold water absorbs heat from the heat generating component and cools the heat generating component.
  • Cooling water (hereinafter referred to as hot water) that has been heated by cooling the heat generating components is returned from the cooling water passage in the electronic device 10 to the cold water supply device 12 through the hot water recirculation conduit 16.
  • the cold water supply device 12 is a well-known cooling water cooling device having, for example, a refrigerator and a heat exchanger, but any device that can cool the hot water discharged from the electronic device 10 and supply it to the electronic device 10 again as cold water. Any configuration of the cooling water cooling device may be used.
  • the cooling water is used as the cooling medium.
  • the cooling medium is not limited to the cooling water, and may be a cooling medium such as a cooling liquid other than water.
  • the cold water supply device 12 cools the hot water flowing from the hot water reflux line 16 to a predetermined temperature to form cold water, and flows the cold water to the cold water supply line 14 at a constant flow rate. Therefore, the cold water supply device 12 is provided with a water temperature sensor 12a for detecting the temperature of the hot water flowing from the hot water circulation pipe 16 and a water temperature sensor 12b for detecting the temperature of the cold water supplied to the cold water supply pipe 14. Yes. Further, the cold water supply device 12 is provided with a flow rate controller 12 c that adjusts the flow rate of the cold water supplied to the cold water supply line 14. The flow rate controller 12c may be a flow rate adjustment valve provided in the flow path of cold water, or may be a mechanism that adjusts the flow rate by adjusting the number of rotations of a pump for transporting cold water.
  • the cold water supply device 12 is provided with a control unit 12d for controlling the flow rate controller 12c based on the detected temperatures of the water temperature sensors 12a and 12b.
  • the control unit 12d is configured by a microcomputer including a CPU and a memory. In general, a plurality of electronic devices 10 are provided for one cold water supply device 12.
  • a condensation sensor 20 which is an example of a condensation detector, is provided in the middle of a cold water supply pipe 14 provided between the cold water supply device 12 and the electronic device 10.
  • the dew condensation sensor 20 may be provided at any position of the chilled water supply pipeline 14, but when the chilled water supply pipeline 14 is long, the dew condensation sensor 20 is located near the electronic device 10. It is desirable to arrange in (near). If the environment (temperature, humidity) around the condensation sensor 20 and the environment (temperature, humidity) around the electronic device 10 or around the electronic device 10 are equal, the condensation detection by the condensation sensor 20 is detected in the electronic device 10. It is because it can be considered that it is equal to dew condensation detection.
  • the condensation sensor 20 detects water droplets due to condensation on the object to be measured and outputs a condensation detection signal.
  • the dew condensation detection signal output from the dew condensation sensor 20 is supplied to a service processor 10b provided in the control unit 10a of the electronic device 10.
  • the service processor 10b is a CPU that performs control to keep some functions working even when the main power of the electronic device 10 is shut off and the main functions are stopped. For example, when the dew condensation detection signal is supplied, the service processor 10b can shut down the main power supply of the electronic device 10 and stop the operation of the electronic device 10.
  • a heat transfer unit 30 that is an example of a heat transfer unit that transfers heat from hot water to cold water is provided.
  • the heat transfer unit 30 is provided to supply heat to the cold water that has passed through the dew condensation sensor 20 to increase the temperature of the cold water that enters the electronic device 10.
  • the heat transfer unit 30 transfers a part of the heat of the hot water flowing out from the electronic device 10 to the hot water circulation pipe 16 to the cold water just before flowing into the electronic device 10 after passing through the dew condensation sensor 20. This is to increase the temperature of the cold water flowing into the electronic device 10 by a predetermined temperature (for example, 2 ° C.).
  • a metal member 40 formed of a metal such as copper, copper alloy, aluminum, aluminum alloy or the like as a heat transfer material is used as the heat transfer unit 30.
  • the metal member 40 has a shape that fits between the cold water supply line 14 and the hot water reflux line 16. The portions where the metal member 40 contacts the cold water supply pipe 14 and the hot water reflux pipe 16 are joined by a thermal bonding material such as welding, brazing material, or solder.
  • the temperature of the hot water flowing through the hot water circulation pipe 16 is higher than the temperature of the cold water flowing through the cold water supply pipe 14, so By being transmitted from the path 16 to the metal member 40 and further transmitted to the cold water supply pipe 14, it is transferred to the cold water flowing through the cold water supply pipe 14. By being heated by this heat, the temperature of the cold water flowing into the electronic device 10 rises.
  • the temperature of the cold water passing through the dew condensation sensor 20 (or the temperature of the cold water coming out of the dew condensation sensor 20) is 21 ° C.
  • heat is supplied to the cold water of 21 ° C. and the temperature is raised to 23 ° C., for example.
  • 23 ° C. cold water enter the electronic device 10.
  • the cold water that has flowed through the electronic device 10 and cooled the electronic components becomes, for example, 33 ° C. warm water, and is discharged from the electronic device 10 to the hot water recirculation conduit 16.
  • the environment in the server room in which the electronic device 10 is installed is maintained at a room temperature of 25 ° C. and a relative humidity of 50% or less, and the temperature of the cold water supplied from the cold water supply device 12 is 21 ° C. .
  • the dew point temperature inside the dew condensation sensor 20 and the electronic device 10 is 13.9 ° C. as determined from the wet air diagram. Therefore, in this environment, also in the dew condensation sensor 20 (21 ° C. same as that of the cold water), the cooling water passage inside the electronic device 10 (23 ° C. same as that of the cold water heated by the heater 30). In this case, the dew point temperature (13.9 ° C.) or lower does not cause condensation.
  • the environment in the server room has changed due to, for example, a failure of the air conditioner in the server room and has risen to a room temperature of 28 ° C. and a relative humidity of 70%.
  • the dew point temperature in the environment in the server room rises to 22 ° C. and becomes higher than the cold water temperature 21 ° C. Therefore, dew condensation occurs in the dew condensation sensor 20 that is 21 ° C., which is the same as cold water.
  • the cooling water passage in the electronic device 10 has a temperature of 23 ° C., which is the same as the temperature of the cold water heated by the heat transfer unit 30, and is higher than the dew point temperature of 22 ° C. Therefore, condensation occurs in the electronic device 10. Absent.
  • the dew point temperature As it is, as the environment in the server room continues to change and the room temperature or relative humidity rises, the dew point temperature further rises from 22 ° C. When the dew point temperature exceeds the cold water temperature of 23 ° C., condensation occurs in the electronic device 10.
  • the dew point temperature reaches the temperature 21 ° C. of the dew condensation sensor 20
  • dew condensation sensor 20 dew condensation proceeds and water droplets grow, and the dew condensation sensor 20 has a water droplet amount that can detect the water droplets. That is, no condensation has started in the electronic device 10 until the condensation sensor 20 outputs a condensation detection signal after the condensation in the server room has changed and the condensation sensor 20 has started to form a condensation. Is not generated.
  • the heat transfer part 30 is formed using a ceramic material, heat conductive plastic, heat conductive rubber, or the like. May be.
  • a heat transfer adhesive can be used as a bonding material.
  • a heat conductive rubber it is preferable to apply a heat conductive grease or liquid to the connecting portion.
  • the size and shape of the metal member 40 are determined by the amount of heat to be transferred.
  • the amount of heat to be transferred is, for example, the amount of heat that can raise 21 ° C. cold water to 23 ° C. and the amount of heat that 33 ° C. hot water drops to 31 ° C. in the above description.
  • the amount of heat that can be transferred by the metal member 40 is determined by the thermal conductivity of the metal member 40 and the heat transfer coefficient between the metal member 40, the cold water supply pipe 14, and the hot water reflux pipe 16.
  • the heat transfer unit 30 illustrated in FIG. 3 includes a connection cover 52 wound around the cold water supply pipe 14 and the hot water reflux pipe 16.
  • the connection cover 52 is preferably formed of a heat conductive material.
  • the connection cover 52 is formed of a metal plate such as copper or aluminum.
  • connection cover 52 The space between the cold water supply pipe 14 and the hot water reflux pipe 16 covered with the connection cover 52 is filled with a heat conductive filler 54 (heat transfer material).
  • the filler 54 is a material having good thermal conductivity such as a thermal sheet or a thermal compound.
  • the connection cover 54 may not be formed of a heat conductive material, and may be formed of, for example, a plastic sheet or a vinyl sheet.
  • the heat conductivity may be enhanced by attaching the metal member 40 shown in FIG. 2 and attaching the connection cover 52 around the metal member 40.
  • FIG. 4 is a flowchart of the dew condensation detection process.
  • the service processor 10b of the control unit 10a of the electronic device 10 When the dew condensation detection process is started, first, the service processor 10b of the control unit 10a of the electronic device 10 outputs a signal from the dew condensation sensor 20 when the electronic device 10 is activated and the internal heat generating component is cooled. Capture (step S1). Subsequently, the service processor 10b of the electronic device 10 determines whether or not the signal from the dew condensation sensor 20 is a dew condensation detection signal indicating that dew condensation has been detected (step S2). If it is determined in step S2 that the signal from the dew condensation sensor 20 is not a dew condensation detection signal, the process returns to step S1 and takes in the signal from the dew condensation sensor 20 again.
  • step S2 if it is determined in step S2 that the signal from the dew condensation sensor 20 is a dew condensation detection signal, the process proceeds to step S3.
  • step S3 the service processor 10b performs a process of shutting down (turning off) the power of the electronic device 10.
  • the display device may notify the administrator of the dew condensation state, or may issue an alarm to notify the administrator.
  • the inside of the electronic device 10 may be dried so as to eliminate condensation.
  • the cold water that has passed through the dew condensation sensor 20 and before entering the electronic device 10 is heated by the heat from the heat transfer unit 30, and is higher than the temperature in the dew condensation sensor 20. Is set to Therefore, the condensation does not start in the electronic device 10 until the condensation is detected after the condensation sensor 20 starts the condensation.
  • a countermeasure against the condensation can be taken so that the power of the electronic device 10 is turned off, thereby preventing a failure due to the condensation in the electronic device 10. be able to.
  • the dew condensation sensor 20 and the heat transfer unit 30 are arranged near the outside of the electronic device 10. However, if a space can be secured inside the electronic device 10, the dew condensation sensor 20 and the heat transfer unit 30 are connected to the electronic device 10. It may be provided inside the device 10.
  • FIG. 5 is a schematic diagram showing an overall configuration of an electronic device cooling system to which the dew condensation detection device according to the second embodiment is attached. 5, parts that are the same as the parts shown in FIG. 1 are given the same reference numerals, and descriptions thereof will be omitted.
  • a connecting pipe 60 is used as the heat transfer unit 30 for transferring heat to cold water. That is, instead of transferring heat by the metal member 40, a part of the hot water flowing through the hot water circulation pipe 16 is returned to the cold water supply pipe 14 through the connection pipe 60, so that the hot water is mixed with the cold water, and the temperature of the cold water Rises.
  • the connecting pipe 60 transfers the heat of the hot water flowing through the hot water reflux pipe line 16 to the cold water in the cold water supply pipe line 14 and functions as the heat transfer unit 30.
  • FIG. 6 is an enlarged cross-sectional view of part A in FIG.
  • the connecting pipe 60 is inserted between the cold water supply pipe 14 and the hot water reflux pipe 16 with one end 60 a inserted into the hot water reflux pipe 16 and the other end 60 b inserted into the cold water supply pipe 14.
  • One end 60 a of the connection pipe 60 is inserted into the hot water circulation pipe 16 in the vicinity of the electronic device 10, and the other end 60 b is inserted into the cold water supply pipe 14 between the dew condensation sensor 20 and the electronic device 10.
  • An inflow opening 62 is provided on one end 60a side of the connecting pipe 60, and an outflow opening 64 is formed on the other end 60b side.
  • the inflow opening 62 opens toward the upstream side of the warm water flow in the warm water reflux line 16.
  • the outflow opening 64 opens toward the downstream of the flow of cold water in the cold water supply pipe 14. Therefore, when the warm water discharged from the electronic device 10 flows into the warm water circulation pipe 16, a part of the warm water flows into the inflow opening 62 of the connection pipe 60. Then, the hot water flows through the connection pipe 60 and flows out from the outflow opening 64 to the cold water supply pipe 14. That is, a part of the hot water discharged from the electronic device 10 is mixed with the cold water immediately before the electronic device 10 through the connection pipe 60. Thereby, the temperature of the cold water supplied to the electronic device 10 can be raised by the heat of the mixed hot water.
  • the hot water is mixed with the cold water of 21 ° C. and the temperature is raised to 23 ° C., for example.
  • 23 ° C. cold water enter the electronic device 10. It is assumed that the cold water that has flowed through the electronic device 10 and cooled the electronic components becomes, for example, 33 ° C. warm water and is discharged from the electronic device 10 to the hot water circulation conduit 16.
  • the environment in the server room in which the electronic device 10 is installed is maintained at a room temperature of 25 ° C. and a relative humidity of 50% or less, and the temperature of the cold water supplied from the cold water supply device 12 is 21 ° C. .
  • the flow rate of cold water supplied from the cold water supply device 12 is assumed to be 450 ml / min. Hot water is supplied to the cold water after passing through the dew condensation sensor 20 via the connecting pipe 60.
  • the cold water having a temperature of 23 ° C. and a flow rate of 600 ml / min absorbs this heat generation amount to become hot water having a temperature of 33 ° C. It is discharged to the path 16.
  • a portion of the 33 ° C. hot water (150 ml / min as described above) flows into the connecting pipe 60 as soon as it is discharged from the electronic device 10, and the remaining 450 ml / min hot water (33 ° C.) is supplied to the cold water supply device 12.
  • the cold water supply device 12 cools 450 ml / min of hot water (33 ° C.) to generate 450 ml / min of cold water (21 ° C.), and supplies the cold water to the cold water supply line 14.
  • the dew point temperature inside the dew condensation sensor 20 and the electronic device 10 is 13.9 ° C. when determined from the wet air diagram. Therefore, in this environment, also in the dew condensation sensor 20 (21 ° C. same as that of the cold water), the cooling water passage inside the electronic device 10 (23 ° C. same as that of the cold water heated by the heater 30). In this case, the dew point temperature (13.9 ° C.) or lower does not cause condensation.
  • the environment in the server room has changed due to, for example, a failure of the air conditioner in the server room and has risen to a room temperature of 28 ° C. and a relative humidity of 70%.
  • the dew point temperature in the environment in the server room rises to 22 ° C. and becomes higher than the cold water temperature 21 ° C. Therefore, dew condensation occurs in the dew condensation sensor 20 that is 21 ° C., which is the same as cold water.
  • the cooling water passage in the electronic device 10 has a temperature of 23 ° C., which is the same as the temperature of the cold water heated by the heat transfer unit 30, and is higher than the dew point temperature of 22 ° C. Therefore, condensation occurs in the electronic device 10. Absent.
  • the dew point temperature As it is, as the environment in the server room continues to change and the room temperature or relative humidity rises, the dew point temperature further rises from 22 ° C. When the dew point temperature exceeds the cold water temperature of 23 ° C., condensation occurs in the electronic device 10.
  • the dew point temperature reaches the temperature 21 ° C. of the dew condensation sensor 20
  • dew condensation sensor 20 dew condensation proceeds and water droplets grow, and the dew condensation sensor 20 has a water droplet amount that can detect the water droplets. That is, no condensation has started in the electronic device 10 until the condensation sensor 20 outputs a condensation detection signal after the condensation in the server room has changed and the condensation sensor 20 has started to form a condensation. Is not generated.
  • the temperature of the cold water after passing through the dew condensation sensor 20 can be increased similarly to the first embodiment described above, and the same effect as in the first embodiment can be obtained. . Therefore, by receiving a dew condensation detection signal from the dew condensation sensor 20 and taking a measure such as shutting off the power supply of the electronic device 10, the failure of the electronic device 10 due to dew condensation can be prevented in advance.
  • connection piping 60 of the shape shown in FIG. 7 is used as the heat transfer part 30, the shape of the connection piping is not limited to this shape.
  • the shape / configuration capable of taking in a part (predetermined flow rate) of the hot water flowing through the hot water circulation pipe 16 and supplying it to the cold water supply pipe 14 is various shapes / configurations in addition to the shape / configuration shown in FIG. Can think.
  • inclined plates 72 and 74 can be provided at both ends 70 a and 70 b of a cylindrical pipe 70 having both ends opened to control the flow of hot water.
  • both ends of the cylindrical pipe are cut obliquely, and the obliquely cut surface faces the upstream direction of the hot water flow on the hot water reflux pipe line 16 side, and conversely, on the cold water supply pipe side.
  • the pipe may be attached so that the surface cut in the direction of the cold water faces the downstream direction of the flow of cold water.
  • the temperature of the dew condensation sensor 20 and the temperature of the electronic component in the electronic device 10 are the same.
  • the difference (temperature difference) is constant. Therefore, the time from when the dew condensation is detected by the dew condensation sensor 20 until the dew condensation occurs inside the electronic device 10 is also constant.
  • the electronic device 10 such as a server may have a different heat generation amount depending on the electronic device 10, and even in the same electronic device 10, the heat generation amount varies due to a load variation on the electronic component.
  • an optimum temperature difference can be set by adjusting the amount of heat transferred by the heat transfer unit 30, and the system power supply is turned on before the condensation sensor 20 detects the condensation and before the condensation occurs in the electronic device 10. Shut off and stop safely.
  • the system power supply is turned on before the condensation sensor 20 detects the condensation and before the condensation occurs in the electronic device 10. Shut off and stop safely.
  • an electronic device with a small load fluctuation if an optimum design is performed in advance, it is possible to take measures against condensation only by providing the heat transfer unit 30 as in the first and second embodiments.
  • an electronic device having a high load fluctuation such as a server
  • the amount of heat transferred by the heat transfer unit 30 is set in accordance with the state where the load on the electronic component is the lowest (the state where the heat generation amount is small)
  • the load is high. If this happens, the cooling of the electronic components will be insufficient. For this reason, the operating temperature of the electronic component becomes high, which causes a reduction in the life of the electronic component and an increase in the failure rate.
  • the amount of heat transferred by the heat transfer unit 30 is set in accordance with the highest load state, when the load is low, the temperature of the dew condensation sensor 20 and the internal temperature of the electronic device 10 (the temperature of the electronic component) The temperature difference becomes smaller. In such a situation, the time from when the dew condensation sensor 20 detects dew condensation to when dew condensation occurs in the electronic device 10 is short, and there is a possibility that the system power supply cannot be shut off reliably and stopped safely. .
  • the flow rate of the cold water supplied from the cold water supply device 12 is controlled / adjusted based on the temperature of the hot water flowing back through the hot water circulation pipe 16. That is, the temperature of the hot water returned to the cold water supply device 12 is measured, and the flow rate of the cold water generated by the cold water supply device 12 is controlled based on the measured temperature.
  • the supply amount of the cold water is set to a flow rate that matches the lowest load state in the initial setting. If the temperature of the hot water exceeds a certain threshold, the cooling capacity of the electronic component by the cold water can be increased by increasing the flow rate of the supplied cold water, and the operating temperature of the electronic component can be kept low. Thereby, the temperature difference between the temperature of the dew condensation sensor 20 and the temperature of the electronic component can also be maintained within a certain range.
  • FIG. 9 is a flowchart of a cold water flow rate control process for adjusting the amount of cold water supplied.
  • the cold water flow rate control process is repeated at regular intervals.
  • the control unit 12d of the cold water supply device 12 acquires the temperature Tw of the hot water that has flowed back through the hot water circulation pipe 16 (S11).
  • the temperature Tw of the hot water can be detected by the water temperature sensor 12a.
  • the control unit 12d of the cold water supply device 12 compares the temperature Tw of the hot water that has been earned with the temperature threshold (step S12).
  • the temperature threshold includes an upper limit threshold UTH and a lower limit threshold LTH.
  • UTH upper limit threshold
  • LTH lower limit threshold
  • step S13 the flow rate of the cold water (21 ° C.) supplied from the cold water supply device 12 to the cold water supply pipe 14 (that is, the electronic device 10) is increased by a predetermined amount, and then the process ends.
  • the chilled water flow rate control process is repeatedly performed at regular time intervals, the process may return to step S11 after step S13 so that the next process is started immediately after the process is completed.
  • step S14 the flow rate of the cold water (21 ° C.) supplied from the cold water supply device 12 to the cold water supply pipe 14 (that is, the electronic device 10) is decreased by a predetermined amount, and then the process ends.
  • the chilled water flow rate control process is repeatedly performed at regular time intervals, the process may return to step S11 after step S14 so that the next process is started immediately after the process is completed.
  • FIG. 10 is a schematic diagram showing an overall configuration of an electronic device cooling system to which the dew condensation detection device according to the third embodiment is attached. 10, parts that are the same as the parts shown in FIG. 5 are given the same reference numerals, and descriptions thereof will be omitted.
  • the connecting pipe 60 is used as the heat transfer unit 30 for transferring heat to cold water, as in the second embodiment.
  • a metal member 40 may be used as in the first embodiment.
  • a heater 80 which is an example of a heating unit, is provided between the dew condensation sensor 20 and the electronic device 10.
  • the heater 80 is provided to heat the cold water that has passed through the dew condensation sensor 20 and raise the temperature of the cold water that enters the electronic device 10.
  • the chilled water that has passed through the dew condensation sensor 20 is heated by the heat transferred by the heat transfer unit 30 and becomes chilled water that is higher by a predetermined temperature in the electronic device 10. Supplied.
  • the temperature of the hot water discharged from the electronic device 10 may be extremely low.
  • a sufficient temperature difference between the temperature of the dew condensation sensor 20 and the internal temperature of the electronic device 10 cannot be obtained, and dew condensation occurs inside the electronic device 10 after dew condensation is detected by the dew condensation sensor 20. It will not be possible to take enough time.
  • the heater 80 when the temperature of the hot water becomes extremely low, the heater 80 is driven and the temperature of the cold water supplied to the electronic device 10 is increased by heating with the heat of the heater 80, thereby increasing the temperature of the electronic device. 10 Condensation inside is suppressed.
  • the dew condensation sensor 20, the heat transfer unit 30 (connection pipe 60), and the heater 80 are arranged in the vicinity outside the electronic device 10. However, if a space can be secured inside the electronic device 10, dew condensation is achieved.
  • the sensor 20, the heat transfer unit 30 (connection pipe 60), and the heater 80 may be provided inside the electronic device 10.
  • the heater 80 is provided between the connection pipe 60 and the electronic device 10.
  • the heater 80 may be attached between the condensation sensor 20 and the connection pipe 60, or the heater 80 may be attached to the condensation sensor 20. It is good also as attaching to.
  • the heater 80 may be disposed at any position as long as it can raise the temperature of the cold water after leaving the dew condensation sensor 20 and before entering the electronic device 10.
  • the dew condensation sensor 20, the heat transfer unit 30 (connection pipe 60), and the heater 80 constitute a dew condensation detection device.
  • the heater 80 a heater that performs heating with electric energy such as an electric heater (resistance heater) or an induction heater can be used.
  • heating may be performed using heat from a heating element of a peripheral device of the electronic device 10.
  • FIG. 11 is a flowchart of a cold water flow rate control process performed in the electronic device cooling system shown in FIG. The cold water flow rate control process is repeated at regular intervals.
  • steps that are the same as the steps shown in FIG. 9 are given the same step numbers, and descriptions thereof are omitted.
  • step S12 determines whether the temperature Tw of the hot water is lower than the lower limit threshold LTH, it is determined that the electronic components in the electronic device 10 are sufficiently cooled, and the process proceeds to step S21. move on.
  • step S21 the control unit 12d of the chilled water supply device 12 determines whether the flow rate of chilled water (21 ° C.) supplied from the chilled water supply device 12 to the chilled water supply pipeline 14 (that is, the electronic device 10) is equal to or higher than the flow rate lower limit value. Determine.
  • step S21 When the flow rate of the cold water to be supplied is equal to or higher than the lower limit of the flow rate (YES in step S21), the process proceeds to step S22.
  • step S22 the flow rate of the cold water (21 ° C.) supplied from the cold water supply device 12 to the cold water supply pipe 14 (that is, the electronic device 10) is decreased by a predetermined amount, and then the process ends.
  • the chilled water flow rate control process is repeatedly performed at regular time intervals, the process may return to step S11 after step S22 so that the next process is started immediately after the process is completed.
  • step S23 the flow rate of the cold water (21 ° C.) supplied from the cold water supply device 12 to the cold water supply pipe 14 (that is, the electronic device 10) is maintained as it is, and the heater 80 is driven. Thereby, the temperature of the cold water supplied to the electronic device 10 rises due to the heating of the heater 80, and a sufficient difference between the temperature of the dew condensation sensor 20 and the internal temperature of the electronic device 10 can be taken.
  • the process ends.
  • the chilled water flow rate control process is repeatedly performed at regular time intervals, the process may return to step S11 after step S23 so that the next process is started immediately after the process of step 23 is completed.
  • FIG. 12 is a time chart showing the operation and temperature change of each part when the cold water flow rate control process shown in FIG. 11 is performed.
  • the temperature of the hot water discharged from the electronic device 10 decreases with a slight time difference.
  • the control unit 12d of the chilled water supply device 12 detects the temperature drop of the hot water from the detection value of the water temperature sensor 12a, the chilled water supply amount (the flow rate of chilled water) is reduced by a predetermined flow rate as shown in FIG. .
  • the temperature of the warm water slightly decreases and then increases, and returns to the original constant temperature.
  • the above state change is a state change by the processing of steps S11, S12, S21, and S22 in the flowchart shown in FIG.
  • the controller 12d of the chilled water supply device 12 detects an increase in the temperature of the hot water from the detection value of the water temperature sensor 12a, the chilled water supply amount (the flow rate of chilled water) is increased by a predetermined flow rate as shown in FIG. .
  • the temperature of the hot water increases slightly, then decreases, and returns to the original constant temperature.
  • the above state change is a state change by the processing of steps S11, S12, and S13 in the flowchart shown in FIG.
  • the amount of heat generated by the electronic components is greatly reduced, the temperature of the hot water continues to rise even if the amount of cold water supplied is reduced, and accordingly the amount of cold water supplied is further reduced. Then, the supply amount of cold water (flow rate of cold water) is greatly reduced, and becomes smaller than the lower limit of flow rate as shown in FIG. 12- (b). Then, in order to increase the temperature of the cold water in order to maintain the temperature difference, the power supply of the heater 80 is turned on and a voltage is applied to the heater 80 as shown in FIG. Thereby, the heater 80 generates heat and the cold water supplied to the electronic device 10 is heated.
  • the state change after time C is a state change due to the processing of steps S11, S12, S21, S22, S112, S12, S21, and S23 in the flowchart shown in FIG.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Other Air-Conditioning Systems (AREA)
  • Air Conditioning Control Device (AREA)

Abstract

L'invention concerne un détecteur de condensation de rosée (20) permettant de détecter la condensation de rosée en détectant les gouttes d'eau produites par la condensation de rosée dans une conduite d'alimentation (14) alimentant un dispositif (10) à refroidir en un fluide de refroidissement provenant d'un dispositif d'alimentation (12) en fluide de refroidissement. Une section transfert de chaleur (30) transfert la chaleur d'un fluide de refroidissement traversant une conduite de circulation (16) vers un fluide de refroidissement traversant la conduite d'alimentation (14) placée entre le détecteur de condensation de rosée (20) et le dispositif (10) à refroidir, la conduite de circulation (16) retournant le fluide de refroidissement du dispositif (10) à refroidir vers le dispositif d'alimentation (12) en fluide de refroidissement.
PCT/JP2012/065276 2012-06-14 2012-06-14 Dispositif de détection de condensation de rosée, système de refroidissement, et procédé de régulation du débit d'un fluide de refroidissement WO2013186904A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2012/065276 WO2013186904A1 (fr) 2012-06-14 2012-06-14 Dispositif de détection de condensation de rosée, système de refroidissement, et procédé de régulation du débit d'un fluide de refroidissement
JP2014521067A JPWO2013186904A1 (ja) 2012-06-14 2012-06-14 結露検知装置、冷却システム、及び冷却媒体流量制御方法
US14/546,013 US20150068702A1 (en) 2012-06-14 2014-11-18 Dew condensation detecting device, cooling system and cooling medium flow rate controlling method

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PCT/JP2012/065276 WO2013186904A1 (fr) 2012-06-14 2012-06-14 Dispositif de détection de condensation de rosée, système de refroidissement, et procédé de régulation du débit d'un fluide de refroidissement

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016142501A (ja) * 2015-02-04 2016-08-08 東京瓦斯株式会社 室内用輻射式冷暖房システム
WO2017138189A1 (fr) * 2016-02-09 2017-08-17 株式会社島津製作所 Dispositif d'analyse d'icp

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10823439B2 (en) * 2016-12-14 2020-11-03 Dell Products L.P. Systems and methods for reliability control of information handling system
FR3061366B1 (fr) * 2016-12-22 2019-04-05 Thales Chaine amplificatrice a derive de frequence et a plusieurs sorties

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6262489U (fr) * 1985-10-09 1987-04-17
JPH04320399A (ja) * 1991-04-19 1992-11-11 Fujitsu Ltd 電子機器の冷却装置
JPH06164178A (ja) * 1992-11-27 1994-06-10 Mitsubishi Electric Corp 冷却装置
JP2006032515A (ja) * 2004-07-14 2006-02-02 Toshiba Mitsubishi-Electric Industrial System Corp 電力変換装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06119083A (ja) * 1992-10-07 1994-04-28 Toshiba Corp 電子機器の冷却装置
JPH07218075A (ja) * 1994-02-02 1995-08-18 Hitachi Ltd コンピュータ冷却装置
JP4816974B2 (ja) * 2008-03-24 2011-11-16 株式会社日立プラントテクノロジー 電子機器の冷却システム
JP2011237887A (ja) * 2010-05-06 2011-11-24 Hitachi Plant Technologies Ltd 電子機器の冷却方法及び冷却システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6262489U (fr) * 1985-10-09 1987-04-17
JPH04320399A (ja) * 1991-04-19 1992-11-11 Fujitsu Ltd 電子機器の冷却装置
JPH06164178A (ja) * 1992-11-27 1994-06-10 Mitsubishi Electric Corp 冷却装置
JP2006032515A (ja) * 2004-07-14 2006-02-02 Toshiba Mitsubishi-Electric Industrial System Corp 電力変換装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016142501A (ja) * 2015-02-04 2016-08-08 東京瓦斯株式会社 室内用輻射式冷暖房システム
WO2017138189A1 (fr) * 2016-02-09 2017-08-17 株式会社島津製作所 Dispositif d'analyse d'icp
JPWO2017138189A1 (ja) * 2016-02-09 2018-10-25 株式会社島津製作所 Ｉｃｐ分析装置

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