WO2013182591A3 - Matériau de liaison, procédé de liaison de deux corps et dispositif électronique - Google Patents

Matériau de liaison, procédé de liaison de deux corps et dispositif électronique Download PDF

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Publication number
WO2013182591A3
WO2013182591A3 PCT/EP2013/061572 EP2013061572W WO2013182591A3 WO 2013182591 A3 WO2013182591 A3 WO 2013182591A3 EP 2013061572 W EP2013061572 W EP 2013061572W WO 2013182591 A3 WO2013182591 A3 WO 2013182591A3
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Prior art keywords
bonding
bonding agent
heating
adhesive
ferromagnetic
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PCT/EP2013/061572
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German (de)
English (en)
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WO2013182591A2 (fr
Inventor
Reinhard Streitel
Original Assignee
Osram Opto Semiconductors Gmbh
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Publication of WO2013182591A2 publication Critical patent/WO2013182591A2/fr
Publication of WO2013182591A3 publication Critical patent/WO2013182591A3/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L2924/11—Device type
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    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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    • H10K50/87—Arrangements for heating or cooling

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Selon différents exemples de réalisation, l'invention porte sur un matériau de liaison (12) destiné à relier deux corps. Le matériau de liaison (12) comprend une matière liante (16) et une matière chauffante. La matière chauffante comprend un matériau ferromagnétique incorporé dans la matière liante (16) pour la chauffer.
PCT/EP2013/061572 2012-06-06 2013-06-05 Matériau de liaison, procédé de liaison de deux corps et dispositif électronique WO2013182591A2 (fr)

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DE102012209513.6 2012-06-06
DE102012209513A DE102012209513A1 (de) 2012-06-06 2012-06-06 Verbinder, Verfahren zum Verbinden zweier Körper und elektronische Anordnung

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WO2013182591A3 true WO2013182591A3 (fr) 2014-03-27

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DE102015004003B3 (de) * 2014-04-01 2015-09-03 Volkmar Stark Verfahren zur Erhaltung der magnetischen Feldstärke von permanentmagnetischen Dipolen und Vorrichtung zur Erhaltung der magnetischen Feldstärke von permanentmagnetischen Dipolen sowie Antrieb und Getriebe
US9508680B1 (en) 2015-06-17 2016-11-29 Globalfoundries Inc. Induction heating for underfill removal and chip rework
US10720371B2 (en) * 2016-04-01 2020-07-21 Intel Corporation Extended temperature operation for electronic systems using induction heating
EP3547352B1 (fr) * 2018-03-27 2020-09-30 Infineon Technologies AG Procédé permettant d'assembler deux éléments de liaison
DE102020114485A1 (de) * 2020-05-29 2021-12-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement
DE102021118151A1 (de) 2021-07-14 2023-01-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung eines optoelektronischen bauelements und optoelektronisches bauelement

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US20040016505A1 (en) * 2002-07-25 2004-01-29 Shiva Consulting, Inc. Method of curing an anisotropic conductive compound
JP2004288946A (ja) * 2003-03-24 2004-10-14 Casio Comput Co Ltd 電子部品の実装方法
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