WO2013182591A3 - Bonding agent comprising ferromagnetic heating particles, method for bonding two bodies using the bonding agent by means of induction heating of the heating particles, and corresponding electronic assembly - Google Patents

Bonding agent comprising ferromagnetic heating particles, method for bonding two bodies using the bonding agent by means of induction heating of the heating particles, and corresponding electronic assembly Download PDF

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Publication number
WO2013182591A3
WO2013182591A3 PCT/EP2013/061572 EP2013061572W WO2013182591A3 WO 2013182591 A3 WO2013182591 A3 WO 2013182591A3 EP 2013061572 W EP2013061572 W EP 2013061572W WO 2013182591 A3 WO2013182591 A3 WO 2013182591A3
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Prior art keywords
bonding
bonding agent
heating
adhesive
ferromagnetic
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PCT/EP2013/061572
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German (de)
French (fr)
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WO2013182591A2 (en
Inventor
Reinhard Streitel
Original Assignee
Osram Opto Semiconductors Gmbh
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Publication of WO2013182591A2 publication Critical patent/WO2013182591A2/en
Publication of WO2013182591A3 publication Critical patent/WO2013182591A3/en

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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
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    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
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    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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    • H10K50/87—Arrangements for heating or cooling

Abstract

A bonding agent (12) for bonding two bodies (14, 16), e.g. an electronic component to another electronic component or to an electronic support is disclosed in various embodiments. The bonding agent (12) has a bonding material (16) and a heating material. The bonding material (16) can have an adhesive, for example a chemically curable adhesive (polyaddition adhesive, for example epoxy resin), or a melting bonding agent, for example solder, a fusion adhesive, (hot-melt adhesive, hot glue). The bonding material can be on the basis of a transparent polymer, such as an epoxy-based, silicone-based or hybrid-based material which allows the bonding agent to be used for optoelectronic components. The heating material has a ferromagnetic material, e.g. ferromagnetic heating particles (30) and is embedded in the bonding material (16) in order to warm the latter (16). During the bonding process, the heating material is inductively warmed or heated with the aid of an alternating magnetic field, whereby the bonding material (16) is also warmed or heated such that it cures or liquefies.
PCT/EP2013/061572 2012-06-06 2013-06-05 Bonding agent, method for bonding two bodies and electronic arrangement WO2013182591A2 (en)

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DE102012209513A DE102012209513A1 (en) 2012-06-06 2012-06-06 Connector, method for connecting two bodies and electronic assembly
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US9508680B1 (en) 2015-06-17 2016-11-29 Globalfoundries Inc. Induction heating for underfill removal and chip rework
US10720371B2 (en) * 2016-04-01 2020-07-21 Intel Corporation Extended temperature operation for electronic systems using induction heating
EP3547352B1 (en) * 2018-03-27 2020-09-30 Infineon Technologies AG Method for joining two joining members
DE102020114485A1 (en) * 2020-05-29 2021-12-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
DE102021118151A1 (en) 2021-07-14 2023-01-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung METHOD OF MANUFACTURING AN OPTOELECTRONIC DEVICE AND OPTOELECTRONIC DEVICE

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