WO2013182591A2

WO2013182591A2 - Bonding agent, method for bonding two bodies and electronic arrangement

Info

Publication number: WO2013182591A2
Application number: PCT/EP2013/061572
Authority: WO
Inventors: Reinhard Streitel
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2012-06-06
Filing date: 2013-06-05
Publication date: 2013-12-12
Also published as: DE102012209513A1; WO2013182591A3

Abstract

A bonding agent (12) for bonding two bodies is disclosed in various embodiments. The bonding agent (12) has a bonding material (16) and a heating material. The heating material has a ferromagnetic material and is embedded in the bonding material (16) in order to heat the latter (16).

Description

Besehreibung

Connector, method for connecting two bodies and

electronic arrangement

The invention relates to a connector for connecting two bodies. The connector has a binding material. Furthermore, the invention relates to a method for connecting two bodies, for example by means of the connector. Furthermore, the invention relates to an electronic device in which an electronic component with another

electronic component and / or is connected to a component carrier by means of the connector.

This patent application claims the priority of German Patent Application DE 10 2012 209 513.6, whose

The disclosure of which is hereby incorporated by reference.

It is known two bodies with the help of cohesive

Firmly connect connections. At a

Cohesive connection can be a first body with a second body by means of atomic and / or molecular forces, such as chemical bonding forces and / or

due to electrostatic interactions, such as

for example, ionic, covalent or van der Waals

Binding forces, etc., are connected. cohesive

Compounds may be, for example, non-releasable compounds, for example not soluble without destruction and / or lasting influence on the body.

For making cohesive connections

For example, adhesives or fusion connectors, such as

For example, hot melt adhesive or solder, known.

Corresponding cohesive connections are also referred to as adhesive connections or solder joints.

For example, adhesives are known which in liquid, for example, viscous, state on the body be applied and then cured. The hardened adhesive is firmly bonded to both bodies and thus connects the two bodies together. For example, adhesives based on silicone, epoxy, acrylate or hybrid as well as in the form of one, two or more component adhesives are known.

In fusion connectors, the corresponding connector is placed between the bodies to be joined and then heated until it melts, or the fusion connector is first heated until it melts and is brought in a molten state between the bodies to be joined. Subsequently, the connector is cooled and solidified, wherein he a cohesive

Enters into connection with both bodies and thereby both

Body connects together.

Hot melt adhesives include, for example, hot melt adhesives, which are often referred to as hot melt adhesives, hot melt adhesives, or hot melt adhesives. For example, by

Temperature increase reaches a melting of the hot melt adhesive, resulting in a reduction in viscosity, and the lower viscosity ensures adequate wetting of the adhesive surface and the adhesion between adhesive and adhesive surface increases. The

Hotmelt adhesives can be applied, for example, in a warm and / or liquid state to adhesive surfaces to be bonded. Upon cooling, the hot melt adhesives then produce the cohesive connection. In addition, arises at

Cooling the melt cohesion between adhesive and adhesive surface. This group of well known as hotmelt

Adhesives can be based on various known chemical

Based on raw materials.

Fusion connectors also include solder. A solder is a metal alloy which, depending on the purpose, has metals in a specific mixing ratio, for example lead, tin, zinc, silver, gold and copper. They serve other metals and alloys, such as copper, bronze, brass, Tombak, nickel silver, silver, gold, hard lead, zinc, aluminum but also iron to solder by superficially connect as a melt with these and / or alloy and solidify after cooling. This alloyability of the solder with the metallic workpieces, materials, electronic

Components, wires, jewelery or other

Components are the prerequisite for a permanent, strong cohesive solder joint. The melting point of the

each solder should generally be lower than that of the components to be connected.

For bonding electronic components, for example to each other or to component carriers, it is known

Use adhesives having particles embedded in the adhesive. The particles serve to increase the electrical and / or thermal conductivity of the adhesive, which can contribute to the electronic or electronic

Contact or cool components electrically. Therefore, particles are used which have materials with a high electrical and / or thermal conductivity, for example silver particles.

Fig. 1 shows, for example, an electronic device 10 with an electronic component 18 and a

Component carrier 14. The electronic component 18 is coupled via a connector 12 to the component carrier 14. The connector 12 comprises, for example, an adhesive, a hot melt adhesive or a solder. To the electronic

To firmly connect component 18 to the component carrier 14, the connector 12 is heated. The connector 12 becomes

heated, for example, to cure the binding material 16 or to melt the bonding material 16, wherein the

melted binding material 16 can then be cooled and solidified. Heating the electronic

Arrangement 10 may be made, for example, in a convection oven or a reflow oven, depending on the binder material 16 used. FIG. 2 shows the electronic device 10 according to FIG. 1, wherein, for example, temperature ranges 20, 22, 24, 26 are shown, as in a convection oven

can arise. In the convection oven can

For example, temperatures up to 100 °, for example up to 150 °, for example up to 200 ° are generated. Of the

For example, connector 12 has an adhesive that can be cured in the convection oven. In a first temperature range 20, the average temperature is lower than in a second temperature range 22. In the second

Temperature range 22, the average temperature is smaller than in a third temperature range 24. In the third temperature range 24, the average temperature is smaller than in a fourth temperature range 26. Der erste

Temperature range 20 is within the second

Temperature range 22. The second temperature range 22 is within the third temperature range 24. The third

Temperature range 24 is within the fourth

Temperature range 26. The temperature thus increases from the inside to the outside and from outside to inside. Since the

Connector 12 is located between the electronic component 18 and the component carrier 14, the electronic component 18 and the component carrier 14 must be heated to a temperature which is above the temperature required for curing of the connector 12. On the one hand, this is high

On the other hand, a large part of the heat energy is used to heat the electronic component 18 and the component carrier 14, which would actually not be necessary for curing the adhesive and therefore is not particularly energy-efficient ,

FIG. 3 shows the electronic arrangement 10 according to FIG. 1, wherein, for example, the temperature ranges 20, 22, 24, 26 are shown, as they can arise in a reflow oven. In the reflow oven, for example, temperatures of up to 200 °, for example up to 250 °, for example up to 300 ° can be generated. The connector 12 has, for example a fusion connector, such as solder, which can be melted in the reflow oven and then cooled and thereby solidified. In the first

Temperature range 20, the average temperature is smaller than in the second temperature range 22. In the second

Temperature range 22, the average temperature is smaller than in the third temperature range 24. In the third

Temperature range 24, the average temperature is less than in the fourth temperature range 26. The first

Temperature range 20 is in Figure 2 above the second

Temperature range 22. The second temperature range 22 is in Figure 2 above the third temperature range 24. The third temperature range 24 is located in Figure 2 above the fourth

Temperature range 26. The temperature thus decreases in Figure 2 from top to bottom and from bottom to top. Since the connector 12 is between the electronic component 18 and the component carrier 14, at least the component carrier 14 must be heated to a temperature which is above the melting temperature of the fusion connector.

On the one hand, this places high demands on the component carrier used in terms of its thermal capacity or on the thermal load capacity of other elements which are arranged on the component carrier, on the other hand, a large part of the heat energy is used to

To heat component carrier 14, resulting in melting of the

Fusion connector is actually not necessary and therefore not particularly energy-efficient.

In various embodiments, a connector is provided that allows a simple and effective connection of two bodies. Further, in

various embodiments, a connector

provided, which allows a gentle and / or energy-efficient connection for the body to be connected.

In various embodiments, a method for connecting two bodies is provided, one for the connecting body allows gentle and / or energy-efficient connection.

In various embodiments, a

electronic arrangement provided in which

electronic component is connected to another electronic component and / or a component carrier in a simple, energy-efficient and / or gentle manner.

In various embodiments, a connector for connecting two bodies is provided. The connector has a binding material and a heating material. The heating material comprises a ferromagnetic material and is embedded in the binding material for heating the binding material.

By way of example, the binding material is designed such that it hardens when heated and forms a material connection with a body with which it is in direct physical contact. Alternatively, the bonding material may be configured to transition to a liquid state upon heating and to solid state upon cooling, and to transition to a solid state upon cooling

Cohesive connection with a body with which it is in direct physical contact. The heating material can be inductively heated or heated by means of an alternating magnetic field. The ferromagnetic material contributes to the fact that inductive heating is particularly energy-efficient. The energy efficiency can be further increased if the ferromagnetic material is a relatively poor electrical conductor. The ferromagnetic material of the heating material has, for example, nickel, iron or cobalt. The binding material may be heated or heated with the aid of the heated heating material in such a way that it hardens or becomes liquid. If the binding material is introduced in a liquid state between the two bodies, it can be hardened or cooled down and thus used

bonded solidifying the binding material cohesive Make connections with both bodies to be joined and thus firmly connect the two bodies together. Due to the inductive heating of the heating material of the connector, the heat or heat is generated substantially in the

Connector itself and the two bodies are only slightly heated. As a result, the curing or melting of the

Binding material is very energy-efficient and the body is spared. For example, the connector may be used to attach a temperature-sensitive body to another body. For example, the connector may be used to provide temperature-sensitive electronic

Components on other components and / or

Set component carriers. Alternatively or additionally, the connector may be used to provide electronic

To attach components to temperature-sensitive component carriers and / or to component carriers with temperature-sensitive components.

In various embodiments, the heating material has heating particles embedded in the binding material. For example, the heating particles on the ferromagnetic material. The formation of the heating material as

Heating particles can contribute to a particularly energy-efficient heating of the binding material. For example, the heating particles may be evenly distributed in the binding material. Furthermore, the heating particles as a whole can have a large surface area, which can contribute to good heat transfer from the heating particles to the binding material.

Furthermore, the heat energy radiated by the heating particles in all spatial directions can be used to heat the binding material 16.

In various embodiments, the heating particles are coated. The coating can help to prevent unwanted, for example chemical, interaction between the heating particles and the binding material.

For example, the coating can help one Reduce and / or prevent corrosion of the heating particles due to the interaction with the binding material.

In various embodiments, the binding material comprises an adhesive, for example a chemically curing adhesive, for example a polyaddition adhesive, for example epoxy resin.

In various embodiments, the binding material comprises a fusion connector. For example, this indicates

Binding material solder, a hot melt adhesive, hot glue,

Hot glue or hot glue on.

In various embodiments, the binding material is non-magnetic.

In various embodiments, the binding material is transparent. For this purpose, the binding material may be formed, for example, based on a transparent polymer, for example on an epoxy, silicone or hybrid basis. this makes possible

For example, the connector for optoelectronic

To be able to use components. For example, the connector may be subject to electromagnetic radiation

emitting or absorbing device used to form a solid connection, for example with a

Encapsulation, a substrate or a cover, in the region of an emitting or absorbing surface of the

manufacture corresponding component. It may be sufficient if the connector in a fixed

Wavelength range is optically transparent, in particular in the range of the wavelength of an absorbed or emitted by the device electromagnetic radiation.

In various embodiments, a method of connecting two bodies is provided, wherein a first body is coupled to a second body via a connector, such as the connector discussed above. An alternating magnetic field is in the range of Connector produced. The heating material of the connector is heated by means of the alternating magnetic field. The

Tying material is solidified, with the two bodies joined together via the solidified bonding material of the connector.

In various embodiments, as a body, a first electronic component and a second

electronic component and / or a component carrier connected to each other. The electronic component is, for example, a semiconductor component and / or a

optoelectronic component.

In various embodiments, an electronic device having a first electronic component and a second electronic component is provided. The two electronic components are connected to a connector, material fit and are over the connector

connected to each other. The connector has a

Binding material, the cohesive with the two

connected electronic components, and a

Heating material, which has a ferromagnetic material and which is embedded in the binding material.

In various embodiments, an electronic device having a first electronic component and a component carrier is provided. The two

Electronic components come with a connector

cohesively connected and are over the connector

connected with each other. The connector includes a bonding material integrally bonded to the electronic component and the component carrier, and a heating material comprising a ferromagnetic material and disposed therein

Binding material is embedded.

Embodiments of the invention are illustrated in the figures and are explained in more detail below. Show it:

Figure 1 shows an electronic device according to the prior

Technology;

Figure 2 shows the electronic arrangement according to Figure 1 with

exemplary temperature ranges;

FIG. 3 shows the electronic arrangement according to FIG

exemplary temperature ranges;

Figure 4 shows an embodiment of an electronic

Arrangement; FIG. 5 shows a detailed view of an exemplary embodiment of an electronic arrangement according to FIG. 4;

FIG. 6 shows a detailed view of an exemplary embodiment of an electronic arrangement according to FIG. 4;

FIG. 7 shows the electronic arrangement according to FIG. 4 and an alternating magnetic field;

FIG. 8 shows the electronic arrangement according to FIG. 4

exemplary temperature ranges;

FIG. 9 is a flow chart of an embodiment of a

Method for connecting two bodies. In the following detailed description, reference is made to the accompanying drawings, which form a part of this specification, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top", "bottom", "front", "back", "front", "rear", etc. is used with reference to the orientation of the described figure (s). Since components of embodiments in a number different orientations can be positioned, the directional terminology is illustrative and is in no way limiting. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various embodiments described herein may be combined with each other unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims. In the context of this description, the terms

"connected", "connected" and "coupled" used to describe both a direct and indirect connection, a direct or indirect connection and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate.

In the context of this description, an electronic component can be understood as a component which

Electromagnetic radiation emitted or absorbed and / or which relates to the control, regulation or amplification of an electric current, for example by using semiconductor devices. An electronic component may comprise a component from the group of components: for example, a diode, a transistor, a

Thermogenerator, an integrated circuit, a thyristor.

In the context of this description can under a

Optoelectronic component an embodiment of a

electronic component can be understood, wherein the optoelectronic component has an optically active region. The optically active region can absorb electromagnetic radiation and form a photocurrent therefrom or emit electromagnetic radiation by means of an applied voltage to the optically active region.

An electromagnetic radiation emitting device may in various embodiments

be electromagnetic radiation emitting semiconductor device and / or as an electromagnetic

Radiation emitting diode, as an organic

electromagnetic radiation emitting diode, as an electromagnetic radiation emitting transistor or as an organic electromagnetic radiation

be formed emitting transistor. The radiation may, for example, be light in the visible range, UV light and / or infrared light. In this context, the

electromagnetic radiation emitting device

For example, as a light emitting diode (light emitting diode, LED) as an organic light emitting diode (organic light emitting diode, OLED), as light emitting

Transistor or emitting as organic light

Transistor be formed. The light-emitting

Component may be part of an integrated circuit in various embodiments. Furthermore, a

Be provided plurality of light emitting devices, for example housed in a common

Casing.

Fig. 1 shows, as explained in more detail above, for example, a known electronic device 10 with a

electronic component 18 and a component carrier 14. The electronic component 18 is coupled via a connector 12 to the component carrier 14. The connector 12 comprises, for example, an adhesive, a hot melt adhesive or a solder. Fig. 2 shows, as explained in more detail above, the electronic device 10 according to Figure 1, wherein, for example

Temperature ranges 20, 22, 24, 26 are shown as they can arise in a convection oven. The connector 12 For example, has an adhesive in the

Convection oven can be cured. The temperature increases from the inside to the outside and from outside to inside. Fig. 3 shows, as explained in more detail below, the electronic device 10 according to Figure 1, wherein, for example, the

Temperature ranges 20, 22, 24, 26 are shown as they can arise in a reflow oven. The connector 12 comprises, for example, a fusion connector, for example solder, which can be melted in the reflow oven and then cooled and thereby solidified. The temperature thus decreases in Figure 2 from top to bottom and from bottom to top. Fig. 4 shows an embodiment of an electronic

Arrangement 10 with an electronic component 18 and a component carrier 14. The electronic component 18 is coupled via a connector 12 to the component carrier 14. The connector 12 comprises a binding material 16, for example an adhesive or a fusion connector, for example a hot-melt adhesive or a solder, and a heating material. The heating material has, for example, heating particles 30.

For example, the bonding material 16 comprises an epoxy, silicone, acrylate or hybrid based adhesive and / or a one, two or more component adhesive. The

Heating particles 30 comprise or are formed from ferromagnetic material. The heating particles 30 point

For example, iron, cobalt or nickel or are formed from it. A weight proportion of the heating particles 30 based on the total weight of the connector 12 may be for example between 1% and 80%, for example between 2% and 40%, for example between 3% and 20%.

The component carrier 14 has, for example, a

Circuit board, such as a flexible circuit board or a FR4 circuit board, a leadframe or a portion of a leadframe, a ceramic substrate or a

Semiconductor substrate, for example, a silicon chip on. Furthermore, the component carrier 14 in a

Form material embedded leadframe have. In

various embodiments may be under a

Leadframe be understood, for example, a metal structure having one or more metal sections, for example, holds the metal pieces together by means of a metal frame. In various embodiments, a leadframe may for example be formed from a flat metal plate, for example by means of a chemical method such as etching, or by a mechanical method such as punching. In various embodiments, a leadframe

For example, have a metal frame, the one

Variety of later electrode-forming metal sections, which may be connected to each other by means of metal webs and with the metal frame. In different

Embodiments, however, can also be understood as a metal segment formed from a metal frame described above, which form electrodes, wherein the metal sections are no longer covered by the metal

are physically connected to each other, i. For example, after the metal bars have already been removed. Thus, in various embodiments, the metal sections illustratively form the leadframe itself or provide

isolated sections of the lead frame.

Alternatively or additionally, the component carrier 14, for example, have or consist of a Kapton film (PI), a metal foil or a PET film. For example, the component carrier 14 may be a steel foil, a

Plastic film or a laminate with one or more Kunststofffolien have or be formed from it. The plastic may be one or more polyolefins (eg, high or low density polyethylene (PE) or

Polypropylene (PP)) or be formed therefrom.

Furthermore, the plastic may be polyvinyl chloride (PVC), polystyrene (PS), polyester and / or polycarbonate (PC),

Polyethylene terephthalate (PET), polyethersulfone (PES), PEEK, PTFE or / and polyethylene naphthalate (PEN) or be formed therefrom. The component carrier 14 may comprise one or more of the above-mentioned materials. The connector 12 and / or the binding material 16 may

be designed, for example, transparent or translucent. The term "translucent" or "translucent layer" can be understood in various embodiments that a layer is permeable to light,

For example, if the electronic component 18 is a light emitting device, for the light generated by the light emitting device, for example, one or more wavelength ranges, for example, for light in a wavelength range of visible light

(For example, at least in a portion of the

Wavelength range from 380 nm to 780 nm). By way of example, the term "translucent layer" in various exemplary embodiments is to be understood to mean that substantially the entire amount of light coupled into a structure (for example a layer) also originates from the structure

(For example, layer) is coupled, whereby a part of the light can be scattered in this case. The term "transparent" or "transparent layer" can be used in

According to various embodiments, it can be understood that a layer is permeable to light (for example at least in a partial region of the wavelength range from 380 nm to 780 nm), wherein light coupled into a structure (for example a layer) is substantially without

Scattering or light conversion also from the structure

(For example, layer) is decoupled. Thus is

"Transparent" in various embodiments as a special case of "translucent" to look at.

The wavelength range in which the connector 12 and / or the binding material 16 are transparent or translucent may, in particular, comprise a wavelength of an electromagnetic radiation emitted or absorbed by the electronic component 18. For example, the connector 12 and / or the

Binding material 16 may be formed transparent or translucent, if the electronic component 18 is formed as a bottom emitter or as a top and bottom emitter. By way of example, a bottom emitter can be understood as meaning a light emitting component that carries light in the direction of the component emitting the light

Component carrier 18 emitted. By way of example, top and bottom emitters can be understood as meaning a light-emitting component which emits light in the direction of the component carrier 18 carrying the light-emitting component and in the direction away from the component carrier 18. If the connector 12 is to be transparent or translucent, then, if the heating material is not transparent or translucent, for example, the weight fraction of

Heating material to be kept low. For example, then the weight content of the heating material based on the total weight of the connector 12 may be for example between 1% and 20%, for example between 2% and 10%, for example between 3% and 5%.

In order to form the binding material 16 in a transparent or translucent manner, the binding material 16 may be formed, for example, on the basis of a transparent polymer, for example on an epoxy, silicone or hybrid basis.

FIG. 5 shows a detailed view of an exemplary embodiment of the electronic arrangement 10 according to FIG. 4

Heating particles 30 are each formed in one piece and / or each have only one material or only one combination of materials and / or are not coated.

FIG. 6 shows a detailed view of an exemplary embodiment of the electronic arrangement 10 according to FIG. 4

For example, iron, cobalt or nickel or are from it educated. The heating particles 30 are coated, which in FIG. 6 with the aid of the fat border of the heating particles 30

is indicated. The coating comprises a material having an interaction, for example a chemical

Interaction, between the binding material 16 and the

Heating particles 30 reduced or prevented. For example, the coating protects the heating particles 30 from corrosion. The coating may comprise a material that

ferromagnetic or non-ferromagnetic.

For example, the coating comprises or is formed from silver or gold.

FIG. 7 shows the electronic arrangement 10 according to FIG. 4 and an embodiment of an alternating magnetic field B. The alternating magnetic field B is, for example, high-frequency and / or serves to inductively heat the heating material, for example the heating particles 30. For example, the alternating magnetic field B has a frequency between 10 kHz and 10 MHz, for example between 20 and 100 kHz, for example between 30 kHz and 50 kHz.

Ferromagnetic materials can be heated particularly effectively inductively. If a ferromagnetic material, for example the heating particles 30 embedded in the binding material 16, is introduced into the alternating magnetic field B, then a current is induced in the ferromagnetic material according to the transformer principle. This eddy current, which flows predominantly in the surface, is short-circuited and is converted directly into heat due to the ohmic resistance of the ferromagnetic material. That means that at

Using a relatively poor electrical conductor with a relatively high ohmic resistance at a given energy input by means of the alternating magnetic field relatively much heat is generated. Thus, the use of a relatively poorly electrically conductive heating material is particularly energy-efficient in the inductive heating of the

Heating material. As a relatively poorly electrically conductive, for example, a material may be referred to, the one Conductivity is less than 20 x 10 ⁶ A / (Vm), such as cobalt or nickel. The use of the ferromagnetic material further increases the efficiency of the inductive

Heating, since with the application of the alternating magnetic field with each field change Ummagnetisierungsverluste occur, leading to an additional heating of the ferromagnetic material. The re-magnetization losses occur due to known physical phenomena, such as

for example, a folding down of the electron spin, the

Change in the Weiss districts and / or a shift in the Bloch walls. Further, a bonding material 16 having, for example, low thermal conductivity for

Warming the connector 12 contribute, as the of the

Heating particles 30 generated heat from the bad

Binding material 16 can be derived and remains largely in the binding material and this heated.

The high-frequency alternating magnetic field B is generated by an inductor, not shown, which is adjusted depending on the zone to be heated, for example, the position, thickness and / or shape of the connector 12, whereby the electronic assembly 10 can be partially heated, for example, in Essentially, the connector 12 are heated. The inductor consists for example of a

water-cooled copper pipe and is connected to a resonant circuit of an induction generator. In this way, a high current density can be generated in the region of the connector 12 which causes a voltage at the ohmic resistance of the heating material. Current and voltage are converted to heat at this resistor. The depth of the heated

Layer is determined by the generator frequency, where high frequencies can contribute to near-surface heating and low frequencies to homogeneous heating. By the right choice of frequency and power, the heating particles 30 can be heated substantially. Furthermore, the frequency can be adjusted to the size and conductivity of the used

Heating particles are adjusted to the heating process

optimize. For induction heating, for example

Frequency ranges are used, which is determined by the procedural application and the used

Distinguish device technology. For example, you can

High frequency systems and / or induction furnaces with frequencies of for example 10 kHz to 10 MHz, for example 20 to 100 kHz, for example between 30 kHz and 50 kHz are used. The inductive heating of the heating material offers compared to other methods, for example, the explained with reference to Figure 2 heating in one

Convection or the explained with reference to Figure 3 heating in a reflow oven, a very high

Efficiency, since the heat can be generated very quickly and substantially in the connector 12 to be heated.

By way of example, FIG. 8 shows the temperature ranges 20, 22, 24, 26, as may occur, for example, in the case of the electronic arrangement 10 when the heating material of the connector 12 is inductive heating. The fourth temperature range 26, which has the highest average temperature, lies inside and essentially in the connector 12. The temperature decreases toward the outside, ie, in FIG. 8, upwards and downwards, so that the first temperature range 20, which is the lowest

Average temperature, is formed on the upper side of the electronic component 18 and on the underside of the component carrier 14.

The heating of the electronic component 18 and / or the component carrier 14 may, for example, a consequence of

Be warming of the connector 12 and / or arise due to the thermal coupling of the electronic component 18 and / or the component carrier 14 with the connector 12. Alternatively or additionally, the heating of the electronic component 18 and / or the component carrier 14, for example, due to induction currents in the electronic component 18 and the component carrier 14 arise, however, by suitable choice of the magnetic Alternating field B can be kept low. Furthermore, the heating of the electronic component 18 and / or the component carrier 14, for example, due to

Ummagnetisierungsverlusten be kept low in the electronic component 18 and the component carrier 14 by using non-ferromagnetic materials for the electronic component 18 and the component carrier 14. The temperature ranges 20, 22, 24, 26 can be adjusted by means of the alternating magnetic field that the occurring temperature gradients are relatively low compared to the other mentioned methods.

The heat necessary for the curing or liquefaction of the binding material 16 is thus essentially generated in the connector 12 itself, ie exactly where it is needed. The

Therefore, heat need not be conducted via heat conduction and / or convection to the connector 12, for example via the component carrier 14, the electronic component 18 and / or a housing, not shown. In addition, starting from the heating particles 30, the heat radiated in all spatial directions can be used effectively to heat the binding material.

9 shows a flow diagram of an embodiment of a method for connecting two bodies. By way of example, the method serves to connect the electronic component 18 to the component carrier 14 with the aid of the connector 12. Alternatively, the method may be used to drive the electronic device 18 using the

Connector 12 with another not shown

electronic component to connect. The method can, for example, for stack bonding of different chips

be used on each other, for example, to attach an LED to a silicon chip. Furthermore, electronic components 18 and / or component carriers 14 can be connected, which have temperature-sensitive elements. For example, the electronic component 18 can be connected to a ceramic submount, which is a temperature-sensitive Has casting material and / or temperature-sensitive lenses.

In a step S2, the two bodies, for example the electronic component 18 and the component carrier 14, are connected to one another indirectly via the connector 12.

For example, the connector 12 may be mounted on the component carrier 14, and the electronic component 18 may be disposed on the connector 12.

In a step S4, the alternating magnetic field B is applied to the two bodies and the connector 12, for example to the electronic device 10. For example, the alternating magnetic field B is generated and applied so that a magnetic flux density in the region of the connector 12 is maximum.

In a step S6, the heating material of the connector 12 is heated by means of the alternating magnetic field B.

If, as binding material 16, a fusion connector,

For example, solder is used, the heating material is heated so that it heats the binding material 16 such that it melts in a step S8 and

liquefied, so goes into a liquid state. In a step S10, the liquefied binding material 16 can then be solidified, for example by cooling the two bodies and / or the connector 12. The solidified connector 12, in particular the consolidated binding material 16 is then materially connected to both bodies, which are then indirectly connected to each other via the connector 12. Further, when using the fusion connector, the fusion connector in a solid state on one side of a

Split between the two bodies are brought and then heated and liquefied. The liquid fusion connector then enters between the two bodies due to gravitational force and / or due to creep effects and / or wetting effects and can then be cooled and solidified. If an adhesive is used as the binding material 16, which is to be cured to enter into a cohesive connection, the heating material is heated in such a way that it heats the binding material 16 in such a way that the binding material 16 hardens in a step S10. The step S8 can then be dispensed with.

The solidification of the binding material 16, for example, provides a transition of the binding material 16 from the moldable

dimensionally stable. This transition may change the

Have viscosity, for example, increasing the

Viscosity from a first viscosity value to a second viscosity value. The second viscosity value may be around

Many times greater than the first viscosity value, for example in a range of about 10 Pas to about 10 ⁶ Pas. The binding material 16 may be liquid and / or formable at the first viscosity and dimensionally stable at the second viscosity. The solidification of the

Tying material may include a process in which

low molecular weight constituents are removed from the binding material 16, for example solvent molecules or low molecular weight, uncrosslinked constituents of the binding material 16, for example drying, curing or chemical

Crosslinking of the Tying Material 16. The tying material 16 may have a higher concentration of low molecular weight substances in the moldable state on the entire substance or substance mixture than in the dimensionally stable state. The invention is not limited to those specified

Embodiments limited. For example, for the bonding material 16, alternative or additional materials may be used as those mentioned above. For example, alternative or additional ferromagnetic materials than those mentioned above may be used for the heating material. For example, alternative or additional materials than those mentioned above may be used for the coating. For example, that can electronic component 18 are connected by means of the connector 12 with another electronic component, not shown. For example, the component carrier 14 by means of the connector 12 with another not

be connected component carrier.

Further, the method of connecting two bodies may also be used to make electrical contact

manufacture. For example, the connector 12 may be used to electrically connect an unillustrated electrical contact of the electronic component 18 to a contact of the component carrier 14, not shown. In this context, the electrical contact of the electronic component 18 includes, for example, a bonding wire contacted with the electronic component 18, which has contact of the component carrier 14

For example, a copper pad and / or the binding material 16 has the solder. In other words, the connector 12 may be used for electrically contacting the electronic component 18. Further, in the method, an external pressure may optionally be exerted during curing of the binding material 16, for example, a mechanical pressure may be exerted on the bodies to be joined and / or the bodies may be pressurized under an atmosphere having an elevated pressure relative to normal pressure, for example

Pressure chamber to be interconnected.

Further, the heating material may be selected to have a high thermal coefficient of thermal conductivity. Of the

Connector 12 may then be used in addition to dissipating heat from electronic device 18. Alternatively or additionally, another material may be added to the connector 12, which is intended to substantially improve the thermal conductivity of the connector 12. The further material can then be non-ferromagnetic, for example.

For example, in addition to the heating particles 30, silver particles, for example silver flakes, may be provided to the connector 12 added, for example, in the binding material 16

be embedded.

Alternatively or additionally, the heating material can be chosen so that it has a good electrical conductivity. The connector 12 may then be in addition to the electrical

Contact the electronic component 18 are used. Alternatively or additionally, another material may be added to the connector 12, which is intended to substantially improve the electrical conductivity of the connector 12. The other material can not then, for example

be ferromagnetic. For example, in addition to the heating particles 30, silver particles, copper particles and / or aluminum particles may be added to the connector 12,

For example, embedded in the binding material 16 are.

Thus, the thermal and / or electrical

Properties of the connector 12 can be adjusted by adding suitable fillers.

Claims

claims

1. connector (12) for connecting two bodies,

comprising a bonding material (16) and a heating material comprising a ferromagnetic material and embedded in the bonding material (16) for heating the bonding material (16).

2. Connector (12) according to claim 1, wherein the

Heating material heating particles (30), which in the

Binding material (16) are embedded.

3. Connector (12) according to claim 2, wherein the

Heating particles (30) are coated.

4. connector (12) according to one of the above

Claims in which the binding material (16) comprises a chemically curing adhesive.

5. Connector (12) according to one of the preceding

Claims in which the binding material (16) has a

Comprises fusion connector.

6. Connector (12) according to claim 5, wherein the

Binding material (16) has a solder.

7. Connector (12) according to one of the above

Claims, wherein the binding material (16) no

ferromagnetic material.

8. Connector (12) according to one of the above

Claims in which the binding material (16) is transparent.

9. A method for connecting two bodies, wherein

a first body is coupled to a second body via a connector (12) according to any one of the preceding claims, an alternating magnetic field (B) in the region of

Connector (12) is generated

the heating material of the connector (16) is heated by means of the alternating magnetic field (B) in such a way that the bonding material (16) of the connector (16) is heated,

- The bonding material (16) is solidified, wherein the two bodies are connected to each other via the solidified bonding material (16) of the connector (16).

10. The method of claim 9, wherein the binding material

(16) comprises a chemically curing adhesive and in which the heating material of the connector (16) by means of

alternating magnetic field (B) is heated so that the binding material (16) hardens and is solidified.

11. The method of claim 9, wherein the binding material (16) comprises a solder and wherein the heating material of

Connector (16) by means of the alternating magnetic field (B) is heated so that the binding material (16) is liquefied, and in which the liquefied binding material (16)

cooled and solidified.

12. The method according to any one of claims 9 to 11, wherein as the body, a first electronic component (18) and a second electronic component and / or a

Component carrier (14) are interconnected.

13. Electronic arrangement (10) with a first electronic component (18) and with a second

electronic component, both of which are materially connected to a connector (12) and which are interconnected via the connector (12), wherein the connector (12) a binding material (16), the material fit with the two

electronic components (18) is connected, and a

Has heating material, which has a ferromagnetic material and which is embedded in the binding material (16).

14. Electronic arrangement (10) with a first

electronic component (18) and with a component carrier (14), both of which are materially connected to a connector (12) and which are connected to each other via the connector (12), wherein the connector (12) a bonding material (16), the material fit is connected to the electronic component (18) and the component carrier (14), and has a heating material which has a ferromagnetic material and which is embedded in the binding material (16).