WO2013182077A1 - 一种led模组的密封工艺 - Google Patents

一种led模组的密封工艺 Download PDF

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Publication number
WO2013182077A1
WO2013182077A1 PCT/CN2013/076937 CN2013076937W WO2013182077A1 WO 2013182077 A1 WO2013182077 A1 WO 2013182077A1 CN 2013076937 W CN2013076937 W CN 2013076937W WO 2013182077 A1 WO2013182077 A1 WO 2013182077A1
Authority
WO
WIPO (PCT)
Prior art keywords
sealing ring
wire
hole
waterproof
shaped sealing
Prior art date
Application number
PCT/CN2013/076937
Other languages
English (en)
French (fr)
Inventor
陈凯
黄建明
吕华丽
Original Assignee
杭州华普永明光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201210188159.1A external-priority patent/CN103471066B/zh
Priority claimed from CN201310189101.3A external-priority patent/CN104180079B/zh
Priority claimed from CN 201320278363 external-priority patent/CN203273043U/zh
Priority to PL13800354T priority Critical patent/PL2863119T3/pl
Priority to US14/403,108 priority patent/US9788444B2/en
Priority to EP13800354.6A priority patent/EP2863119B1/en
Application filed by 杭州华普永明光电股份有限公司 filed Critical 杭州华普永明光电股份有限公司
Priority to BR112014028070-3A priority patent/BR112014028070B1/pt
Priority to ES13800354.6T priority patent/ES2663994T3/es
Priority to KR1020147026960A priority patent/KR101820391B1/ko
Priority to JP2015513012A priority patent/JP5953428B2/ja
Priority to AU2013271129A priority patent/AU2013271129B2/en
Publication of WO2013182077A1 publication Critical patent/WO2013182077A1/zh
Priority to ZA2014/07956A priority patent/ZA201407956B/en
Priority to US15/695,709 priority patent/US10243341B2/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B37/00—Nuts or like thread-engaging members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L5/00—Devices for use where pipes, cables or protective tubing pass through walls or partitions
    • F16L5/02—Sealing
    • F16L5/10—Sealing by using sealing rings or sleeves only
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V27/00—Cable-stowing arrangements structurally associated with lighting devices, e.g. reels 
    • F21V27/02—Cable inlets
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/013—Sealing means for cable inlets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Definitions

  • the present invention relates to an LED lighting device, and more particularly to a sealing process for the LED module. Background technique
  • LED Under the current trend of promoting energy conservation and environmental protection, LED has been widely used for its energy saving, long service life, short startup time, safety and stability. At present, other lighting devices are gradually being LEDs. Lighting device instead.
  • the waterproof structure of the traditional LED product is fastened by screws in a box package, and the product is heavy and has a large influence on heat dissipation.
  • a waterproof sealing structure of an LED module and a preparation process thereof are disclosed.
  • the waterproof sealing structure of the LED module comprises an LED component, a substrate, an electrode, a circuit board, and the entire surface of the LED module is covered.
  • the PARYLENE film is one of PARYLENE N, PARYLENE C, PARYLENE D, PARYLENE VT4.
  • the above patent uses a layer of parylene film on the entire surface of the LED module to achieve sealing and waterproofing.
  • the disadvantages are: the film is easy to be scratched, damaged, and has a short service life; the film is completely covered on the surface of the whole lamp, and the process is difficult and the cost is high.
  • the object of the present invention is to provide a sealing process for an LED module to solve the technical problem of high sealing cost and poor effect.
  • a sealing process for an LED module comprising:
  • the waterproof wire is connected to the positive and negative solder joints on the PCB through the heat sink through-hole, the positive and negative solder joints and the waterproof wire pass through the position for sealing treatment, and between the waterproof wire and the wire hole Sealed waterproof operation; (2) Fix the PCB board on the heat sink;
  • the sealing and waterproofing operation between the waterproof line and the wire hole further comprises:
  • the externally threaded nut is a hollow structure
  • the waterproof wire and the sealing ring can pass through the center
  • the inner wall of the through hole has a threaded structure, and cooperates with the externally threaded nut
  • one side of the two-way wedge seal ring is installed in the through hole.
  • the other side of the ⁇ -shaped portion is squeezed and installed when the externally threaded nut is tightened, so that the through hole, the sealing ring and the outer thread nut of the waterproof wire are squeezed by the sealing ring in the above process.
  • the resulting deformation fits snugly to achieve a waterproof effect.
  • the two-component insulating sealant or other sealant is used to seal the positive and negative solder joints of the PCB and the waterproof cable of the heat sink, and is cured at room temperature after sealing.
  • Other sealants refer to all types of glue that are suitable for sealing in addition to the two-component seal.
  • fixing the heat sink as a whole and the lens group further comprises:
  • the heat sink is integrally pressed into the inverted structure of the lens group, and the solid silicone ring and the liquid silicone gel are deformed, and the inverted structure of the lens group is passed through to make the heat sink and the lens group tightly and firmly connected, and the solid silica gel is passed through The deformation of the ring and liquid silicone is protected.
  • the method further includes: the heat sink functioning as a dual function of the lamp holder and the heat sink may be cut by a profile, and the heat sink may select profiles of different shapes.
  • a sealing process for an LED module comprising:
  • the waterproof wire is connected to the positive and negative solder joints on the PCB through the heat sink through-hole, the positive and negative solder joints and the waterproof wire pass through the position for sealing treatment, and between the waterproof wire and the wire hole Sealed waterproof operation;
  • the outer circumference of the lens group is not provided with a groove; in the step (3) and the step (4), the sealing ring and the liquid silicone are arranged side by side on the outer circumference.
  • Only one groove is provided in the outer circumference of the lens group, and one of the sealing ring and the liquid silicone in the step (3) and the step (4) is disposed in the groove, and the other is disposed on the inner circumference or the outer circumference of the groove.
  • the sealing and waterproofing operation between the waterproof line and the wire hole further comprises:
  • the externally threaded nut has a hollow structure
  • the waterproof wire and the sealing ring can pass through the center
  • the inner wall of the through hole has a threaded structure, and cooperates with the externally threaded nut
  • one side of the double-sided wedge-shaped sealing ring is mounted on the side In the gap between the hole and the waterproof line, the other side of the ⁇ -shaped portion is squeezed and installed when the externally threaded nut is tightened, so that the through hole, the sealing ring and the outer thread nut of the waterproof wire are squeezed by the sealing ring in the above process.
  • the resulting deformation fits snugly to achieve a waterproof effect.
  • a sealing process for an LED lighting device comprising a heat sink comprising different numbers of lamp holder units, each lamp holder unit corresponding to one PCB board and one lens group forming an LED module, Each LED module is subjected to a sealing operation using the sealing process described in claim 1.
  • a sealing process for an LED module comprising:
  • the waterproof wire is connected to the positive and negative solder joints on the PCB through the heat sink through-hole, the positive and negative solder joints and the waterproof wire pass through the position for sealing treatment, and between the waterproof wire and the wire hole Sealed waterproof operation;
  • the present invention has the following advantages:
  • the invention can also be sealed by the "T"-shaped sealing ring, the externally threaded nut, the sealing glue, the thread in the wire hole, and the sealing effect is good; at the same time, the sealing ring and the sealing glue are combined to form a sealing method, if One of the methods fails, and the other can also be independently sealed to further ensure the sealing effect.
  • the inverted structure of the lens group is designed to double protect the solid silicone ring and the liquid silicone, and the lens group and the heat sink achieve a good sealing effect. Due to the inverted structure on the lens group, the solid silicone ring and the liquid silicone can produce the same shape variable in the whole circle position, and the parts are pressed uniformly, so that the module can be unified in the sealing property without appearing. Defects in individual parts.
  • heat sinks may include different numbers of lamp rack units to meet different power requirements, and each lamp rack unit has a corresponding PCB board, A lens group and a sealing silicone.
  • the heat sink comprises a plurality of lamp holder units
  • the large-area sealing of the whole lamp is decomposed into a plurality of lamp holder units, and by improving the sealing performance of the lamp holder unit, the whole lamp can be improved. Sealing.
  • the circumference of the lamp holder unit seal is smaller than the whole lamp, the sealing performance is more easily improved.
  • the sealing process can achieve a good sealing effect, low cost, long service life, no damage to the product itself, high production efficiency: the entire product sealing process can reduce the cost, and at the same time achieve a good sealing effect and achieve waterproof It is moisture-proof, anti-corrosive and anti-oxidation, which is beneficial to the extension of the service life of LED lighting products and the improvement of safety.
  • FIG. 1A is an exploded view of an embodiment of an LED module
  • FIG. 1B is an exploded view of another embodiment of the LED module
  • FIG. 2 is a schematic cross-sectional view showing the structure of the outlet hole
  • Figure 3 is a schematic view of the dispensing
  • Figure 4 is an exploded view of an embodiment of an LED lighting device
  • FIG. 5 is a schematic structural view of an embodiment of an LED heat sink
  • FIG. 6 is a schematic structural view of a sealing process of an LED lighting device
  • FIG. 7 is a schematic cross-sectional view showing a second embodiment of the waterproof line through-hole sealing of the present invention as a through hole;
  • Figure 8 is a schematic structural view of an externally threaded nut in a waterproof wire through hole seal
  • Figure 9 is a schematic view showing the structure of a "T"-shaped sealing ring in a waterproof wire through-hole seal
  • FIG. 10 is a schematic structural view of an externally threaded nut and a "T"-shaped sealing ring in a waterproof wire through-hole seal sleeved on an electric wire;
  • Figure 11 is a cross-sectional view of a specific embodiment of a waterproof wire through hole seal;
  • FIG. 12 is a schematic structural view of another application LED lighting device applicable to the LED sealing process of the present invention.
  • FIG. 13 is a view showing an example of the structure of an LEDS lighting module to which the present invention is applied;
  • Figure 14 is an exploded view of an LEDS lighting module to which the present invention is applied.
  • an LED lighting device including a heat sink (the heat sink and the heat sink in the present invention are the same thing, considering the name uniform, now All heat sinks are unified into a heat sink for the name to be mixed.
  • PCB board 12 LED chip, sealed silicone and lens group 13
  • LED chip is soldered on PCB board 12
  • PCB board 12 is attached to heat sink 11
  • lens Group 13 is mounted above the LED chip.
  • the heat sink may comprise a light stand unit or a plurality of light stand units, each light stand unit individually corresponding to a PCB board 12, a lens group 13 and a sealing silicone.
  • the radiator 11 can be cut by a profile to serve as a lamp holder, and is also a radiator, and the processing process is simple, and the cost is low. Depending on the needs, the radiator can be selected from different shapes.
  • the heat sink 11 is provided with a through hole 21 having a stepped cross section, and the waterproof wire 22 of the PCB board 12 is passed through the through hole 21, and a seal ring 31 is attached to the gap between the through hole 21 and the waterproof line 22.
  • the sealing ring 31 is a two-way beak-shaped sealing ring. One side of the beak-shaped portion is installed in the gap between the through hole 21 and the waterproof wire 22, and the other side of the beak-shaped portion and the through-hole wall are fixedly fixed by the nut 32.
  • the through hole 21 and the waterproof wire 22 are bonded together by a seal ring 31.
  • the heat sink 11 is provided with a PCB board 12, and the PCB board 12 and the heat sink 11 are connected in surface contact, and are fixed by screws, and the heat generated on the PCB board 12 can be quickly dissipated through the heat sink 11.
  • the LED board 12 is provided with an LED light source, and the LED light source may be an LED light source with a bracket or an LED light source without a bracket, and directly covers the PCB board 12.
  • the sealed silicone gel comprises a solid silicone ring 14 mounted on the lens group 13 and coated on a solid A gel silicone ring 15 formed by liquid silicone on the side of the silicone ring 14.
  • the solid silicone ring 14 has a groove on the side of the corresponding lens plane for coating liquid silicone.
  • the lens group 13 has a plurality of lenses on its plane, and each lens corresponds to one LED light source.
  • the lens group 13-circle has an undercut structure 18, and the heat sink 11 on which the PCB board 12 is mounted is inverted on the lens group 13 provided with the silicone ring 14 and the liquid silicone 15 by the undercut structure 18 to form a tightly fixed.
  • the principle process can be:
  • the waterproof wire is connected to the positive and negative solder joints on the PCB through the heat sink through-hole, the positive and negative solder joints and the waterproof wire pass through the position for sealing treatment, and between the waterproof wire and the wire hole Sealed waterproof operation;
  • the heat sink with the PCB board and the waterproof wire treated by the step (2) is buckled on the lens set with the solid silicone ring and the liquid silicone treated by the step (5), and the heat sink and the lens are integrally attached.
  • the group is fixed.
  • Use at least two layers of silicone rubber ring to completely isolate the LED chip from the outside world, to prevent all water vapor or other harmful gases from eroding the chip and PCB board, and to be stronger than the film seal, and have a longer life, which can reduce the glue usage compared to the glue sealing. Quantity and product weight. It should be noted that the wire hole seal can also be realized by other devices.
  • the present invention provides a wire hole sealing device for sealing a wire hole 110 through which a wire 140 (or a waterproof wire) passes, the wire hole sealing device comprising a sleeve A "T"-shaped seal ring 130 on the seal line, and an externally threaded nut 120 sleeved on the lower end of the "T"-shaped seal ring 130.
  • the wire hole sealing device comprising a sleeve A "T"-shaped seal ring 130 on the seal line, and an externally threaded nut 120 sleeved on the lower end of the "T"-shaped seal ring 130.
  • the through hole 110 has a cylindrical structure, and the through hole 110 is configured to be a narrow upper and a lower width, that is, the upper portion of the through hole 110 is a narrow diameter portion 111, and the lower portion thereof a first transitional surface 114 is provided at a boundary of the wide-diameter portion 112, the narrow-diameter portion 111 and the wide-diameter portion 112, and a first thread 113 is disposed inside the wide-bore portion 112 of the lower end of the through-hole 110; wherein, the first transition The mesa 114 has a certain inclination; the narrow aperture portion 111 is adjacent to the circuit board at the target where the line hole is disposed, and the wide aperture portion 112 is away from the circuit board at the target.
  • the male nut 120 is hollow, and the outer surface thereof is provided with a second thread 122 matching the first thread 113.
  • the male nut 120 is divided into three sections, and the inner diameters of the three sections are equal.
  • the upper half of the male nut 120 is the upper end narrow portion 121, and the second thread 122 is disposed outside the middle section of the male nut 120.
  • Upper side, and the outer diameter of the upper end narrow portion 121 is smaller than the outer diameter of the intermediate portion of the outer thread nut 120, and the outer thread diameter of the intermediate portion of the outer thread nut 120 matches the inner diameter of the wide diameter portion 112 of the threaded hole 110;
  • the lower half of the threaded nut 120 is provided as a tightening structure, specifically a hexagonal structure 123.
  • the tightening structure can also be implemented by other forms, which may be determined according to specific conditions, and is not limited herein.
  • the diameter of the three sections of the externally threaded nut 120 may be determined according to the specific situation, and the externally threaded nut 120 may not be divided into three sections, or may be directly one section, and the outer surface thereof is provided with a thread, which may be determined according to specific conditions. No restrictions are imposed.
  • the "T"-shaped sealing ring 130 is hollow, and its upper width is narrower, that is, as shown in FIG. 9, the upper end is a wide crown portion 134, the lower end is a narrow portion 132, and is narrow.
  • a second transition land 133 is provided between the portion 132 and the crown 134.
  • the narrow portion 132 has a truncated cone shape, and the diameter of the end surface of the narrow portion 132 where the narrow portion 132 and the crown portion 134 are connected is larger than the diameter of the end surface of the other end portion of the narrow portion 132.
  • the narrow portion 132 may also have a straight shape or the like, and the narrow portion in this embodiment
  • the shape of the truncated cone 132 is more easily set when the externally threaded nut 120 is sleeved on the narrow portion 132 of the "T" shaped seal ring 130.
  • the diameter of the crown portion 134 of the "T"-shaped seal ring 130 is larger than the diameter of the upper end narrow portion 121 of the male nut 120.
  • the externally threaded nut 120 is sleeved over the narrow portion 132 of the "T” seal 130, and one end of the externally threaded nut 120 is pressed against the "T" On the second transition land 133 of the seal, the wire sheathed with the "T" seal and the externally threaded nut is threaded into the wide bore portion 112 of the wire bore by a second thread on the male nut 120. As shown in FIG.
  • the upper end surface of the crown portion 134 of the "T"-shaped seal ring 130 is over The first transition land 114 at the junction of the narrow bore portion 111 of the wire hole and the wide diameter diameter 112, the upper end of the male nut 120 and the lower end of the narrow bore portion 111 of the wire hole are pressed by the "T" seal 130 To the deformation, the "T"-shaped sealing ring is closely attached to the wire and the wire hole to seal.
  • the sealing layer is filled with a sealing layer to further seal the wire hole.
  • the type of the sealing glue can be determined according to specific conditions, and is not limited herein.
  • the invention seals through the "T"-shaped sealing ring, the externally threaded nut, the sealing glue, the thread in the wire hole, and adopts two sealing methods of sealing ring and sealing glue, if one of the methods fails, another One can also be sealed independently.
  • the narrow diameter portion 111 of the upper end of the wire hole is provided with a third thread 115, and the sealant layer is adhered to the third thread 115, which can enhance the adhesion of the sealant layer, and can be carried out according to specific conditions.
  • the second transition land 133 of the "T" seal 130 has a certain angle of inclination, and one end of the externally threaded nut 120 is pressed against the second transition land 133 of the "T" seal.
  • the forces in the inward and upward directions are generated as follows: (1) The inward force causes the externally threaded nut 120 to be pressed against the "T" shaped seal 130, while the "T" shaped seal 130 is pressed against the wire 140.
  • the outer surface of the electric wire 140 may be provided with a protective cover, which has the functions of waterproofing and insulating, and may be disposed according to specific conditions without limitation.
  • the sealing process of the wire hole sealing device provided by the present invention in the specific implementation is as follows: First, the "T"-shaped sealing ring 130 is sleeved on the electric wire 140, that is, the electric wire 140 sequentially passes through the "T"-shaped sealing ring 130.
  • the sealing hole layer is filled with a sealant layer in the gap between the wire hole and the wire 140 on the "T"-shaped sealing ring 130.
  • the present embodiment provides a seal.
  • the wire hole sealing device has a narrow hole width and a threaded inside. The wire is connected to the wide diameter portion of the wire hole through a hollow "T" ring seal and a hollow external thread nut.
  • the "T" shaped seal ring includes a narrow portion and A wide crown, a second transitional table with a certain inclination between the narrow and the crown, a "T” seal is placed on the wire, and the externally threaded nut is sleeved on the "T” seal On the narrow part, one end face is pressed against the second transitional surface of the "T"-shaped sealing ring, and the externally threaded nut is screwed to the through-hole hole, and the crown of the "T"-shaped sealing ring is in the crossing line
  • the boundary between the wide diameter portion and the narrow diameter portion of the hole has a certain gradient on the first transition surface, and the gap between the electric wire and the through hole is filled with a sealant layer.
  • the invention adopts a "T" type seal ring, The externally threaded nut, sealant, and thread in the wire hole are sealed to provide a double seal.
  • the externally threaded nut has a hollow structure, and the waterproof wire and the sealing ring can pass through the center.
  • the inner wall of the through hole has a threaded structure and cooperates with the externally threaded nut.
  • One side of the two-way wedge seal is installed in the gap between the through hole and the waterproof line, and the other side of the dome is squeezed and assembled by the externally threaded nut, so that the through hole, the seal, and the waterproof
  • the external thread nut is tightly fitted by the deformation caused by the sealing ring during the above process, and the waterproof effect is achieved. 2.
  • the two-component insulating sealant or other sealant to pass through the positive and negative solder joints of the PCB and the waterproof wire of the heat sink.
  • the position sealant 33 is cured at room temperature for 1 hour after sealing. Further strengthen the sealing effect of the waterproof wire at the through hole.
  • the two-component insulating rubber here selects a tough epoxy resin system, and the bonding metal has excellent impact resistance and chemical resistance.
  • the amount of liquid silicone gel is based on the ability to completely adhere to the solid silicone ring and cure at room temperature for 2 hours.
  • the liquid glue is made of silica gel.
  • the silica gel has excellent adhesion, impact resistance and UV resistance to metal and PC materials.
  • step 6 Pass the heat sink with the PCB board and the waterproof wire in step 2 on the lens set with the solid silicone ring and the liquid silicone gel processed in step 3, and press the whole heat sink into the lens group.
  • the closed and fixed connection of the heat sink and the lens group is realized, and the deformation of the solid silicone ring and the liquid silicone gel achieves the double protection effect.
  • Example 2 and Example 1 are substantially the same, except that: a solid silicone ring is placed in the outer ring groove of the lens group, and a liquid silicone gel is uniformly applied along the inner ring groove of the lens group.
  • the other process steps are the same as those in Embodiment 1, and will not be described again.
  • a sealing process of an LED module includes:
  • the waterproof wire is connected to the positive and negative solder joints on the PCB through the heat sink through-hole, the positive and negative solder joints and the waterproof wire pass through the position for sealing treatment, and between the waterproof wire and the wire hole Sealed waterproof operation;
  • the lens group can be provided with only one outer circumference without setting the inner circumference, or only the inner circumference can be set to the outer circumference.
  • the solid glue and the liquid glue can be placed on the same, or only the fixing glue can be placed, or only the liquid can be applied. gum.
  • the LED lighting device comprises a heat sink 11 comprising different numbers of lamp holder units, and the lamp holder unit on the heat sink 11 may be arranged horizontally as shown in FIG.
  • each lamp holder unit corresponds to one PCB board and one lens group constitutes one LED module, and each LED module performs sealing operation using one of the above two sealing processes.
  • the heat sink is further provided with a power waterproof box 42 for mounting an external driving power source and a mounting bracket 41, and the lighting device is rotated and fixed by the mounting bracket.
  • a sealing process of an LED lighting device includes a lamp holder 11', a lens group 13, a PCB board 12, and a power supply box 51.
  • the lamp holder 1 is used instead of the radiator frame 11, and the lamp holder 11' ,
  • the PCB board 12 and the lens group 13 constitute an LED module, and the LED module is sealed by one of the above two sealing processes.
  • the lamp holder is connected to the power source box 51 through a lamp holder connector 52, and the driving power source 53 is disposed in the power source box 51.
  • the accommodating groove 54 is provided with a receiving groove 54.
  • the bottom of the accommodating groove 54 is provided with a groove matching with the inverted buckle of the lens group, and the undercut of the lens group can be pressed into the groove.
  • the lens group 13 is fixed in the accommodating groove 54 together with the PCB board 12.
  • One side of the PCB board is provided with an LED light source, and the other side of the PCB board is closely connected with the bottom surface of the lamp holder accommodating groove 54 for heat dissipation.
  • the lamp holder is made of an aluminum plate with good thermal conductivity.
  • FIG. 1B illustrates an application example of an LED module to which the sealing process of the present invention is applicable.
  • DETAILED DESCRIPTION OF THE INVENTION in contrast to Figure 1, a suitable heat sink for the present invention can be found in Figure 12.
  • the heat sink 11 can be provided with heat-dissipating fins, and the heat-conducting support frame can also be provided on both sides.
  • the heat-conducting support frame of the heat-dissipating heat-dissipating body can also be provided with at least one end of a "several” type buckle, and the inner side of the side beam has "J"
  • the "type card slot” is connected to the side beam assembly by the "several” type shackle, and is engaged with the "type card slot” to form a surface contact.
  • the difference of the present invention is that the heat sink 1 is a heat sink with heat sink fins having better heat dissipation effect, and other components are basically similar.
  • the LED module to which the sealing process of the present invention is applicable is not limited to the shape of the heat sink.
  • another LED module to which the sealing process of the present invention is applicable is not limited to the lens format shown in FIG. 1 for the LED lens.
  • the lens format 131 of the LED module to which the present invention is applicable may be used. Any shape, no longer detailed. Application example four:
  • the LED module includes a lens group, LED particles, a circuit board and a heat sink.
  • the LED particles are soldered on the circuit board, the circuit board is closely attached to the heat sink, and the lens group cover is disposed on the heat sink.
  • the lens group is located above the LED particles, and the sealed space formed by the lens group and the heat sink is filled in Filled with encapsulant.
  • the refractive index of the encapsulant is 1.3 to 1.7, and the refractive index of the encapsulant is close to the refractive index of the lens on the lens group.
  • the light emitted by the LED chip replaces the original air medium during the propagation process, and the refractive index of the encapsulant matches the lens on the lens group, thereby maximizing the light extraction rate.
  • the light efficiency is improved by 10-15%.
  • the LED particles include the LED chip and the heat sink base
  • the LED chip is disposed on the heat dissipation base, the LED chip is coated with the phosphor, and the electrode pad is disposed on the heat dissipation base.
  • the refractive index of the encapsulant is 1.3 to 1.7.
  • the sealed space of the heat sink and the lens group is filled with the encapsulant, and the circuit board and each of the LED particles are covered by the encapsulant, so that the waterproof performance is excellent.
  • the heat generated by the LED particles can be transmitted not only through the bottom of the heat sink base to the circuit board, but also through the package gel, so that the heat dissipation effect is better.

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Abstract

一种LED模组的密封工艺，包括：（1）防水线（22）穿过散热器过线孔（21）与PCB板（12）上的正负焊点连接，所述正负焊点和防水线（22）穿过位置进行封胶处理，并且防水线（22）与过线孔（21）之间进行密封防水操作；（2）将PCB板（12）固定在散热器（11）上；（3）将固体硅胶圈（14）放置在透镜组（13）的外周；（4）沿着该透镜组（13）的外周打上液体硅胶（15），液体硅胶量以完全粘连住固体硅胶圈（14）为线；（5）装有PCB板（12）和防水线（22）的散热器（11）倒扣在经步骤（4）处理的设有固体硅胶圈（14）和液体硅胶（15）的透镜组（13）上，将散热器整体和透镜组（13）进行固定。至少两重防水密封圈将LED芯片与外界彻底隔绝，杜绝一切水汽或者其他有害气体侵蚀芯片和PCB板，实现透镜组和散热器间的密封性能的保障。

Description

一种 LED模组的密封工艺
技术领域
本发明涉及 LED照明装置， 尤其涉及一种针对该 LED模组的密封工艺。 背景技术
在当今推崇节能环保的大趋势下， LED以其节能环保、 使用寿命长、 启 动时间短、 安全性和稳定性好等特点， 得到越来越广泛的应用， 目前其他光 源的照明装置逐渐被 LED照明装置代替。
LED使用过程中， 常常会由于水汽或其他有害气体渗入基板， 或者金属 氧化从而导致产品出故障。 当产品用于户外照明时， 其密封性和防水性更是 一个需要考虑的问题。
传统的 LED产品防水结构采用盒封装以螺丝紧固， 产品厚重， 对散热影 响较大。在申请号为 200910054820.8的专利中公开了一种 LED模组的防水密 封结构及其制备工艺， 其 LED模组的防水密封结构包括 LED元件、基板、 电 极、 线路板, LED模组整体表面包覆一层 PARYLENE 薄膜,薄膜厚度为 3 ~ 25MM,该薄膜均匀、 致密、 透明、 无任何孔隙且完全敷形,保护 LED模组不受 水、 潮气、 空气等的侵蚀,不影响 LED 元件的散热,该 PARYLENE 薄膜为 PARYLENE N、 PARYLENE C、 PARYLENE D、 PARYLENE VT4中的一种。
上述专利采用在 LED模组整体表面包覆一层 parylene薄膜的方式来实现 密封和防水。 其不足之处在于： 薄膜易划伤、 损坏， 使用寿命短； 要在整灯 表面完全覆膜， 工艺难度较高， 成本较高。
发明内容
本发明的目的在于提供一种 LED模组的密封工艺， 以解决密封成本高、 效果不佳的技术问题。
一种 LED模组的密封工艺， 包括：
(1)防水线穿过散热器过线孔与 PCB板上的正负焊点连接， 所述正负焊点 和防水线穿过位置进行封胶处理， 并且防水线与过线孔之间进行密封防水操 作； (2)将 PCB板固定在散热器上；
(3)将至少带有内外双圈凹槽的透镜组固定在打胶机的固定夹具内， 将一 个密封圈放置在透镜组内外双圈凹槽的其中之一内；
(4)沿着该透镜组的另外一凹槽均匀的打上一圈层液体硅胶， 液体硅胶量 以完全粘连住固体硅胶密封圈为限；
(5)将经步骤（2 )处理的装有 PCB板和防水线的散热器倒扣在经步骤 (4) 处理的设有固体硅胶圈和液体硅胶的透镜组上， 将散热器整体和透镜组进行 固定；
(6)将组装好的 LED模组静置在常温下 2小时， 使液体硅胶固化。
较佳地， 防水线与过线孔之间进行密封防水操作进一步包括：
在防水线上依次套上双向锲形密封圈、 外螺纹螺母， 然后穿过散热器的 过线孔， 将双向楔形密封圈的一侧锲形部分安装在通孔与防水线的间隙中， 将外螺纹螺母旋进散热器的过线孔， 使其压紧双向楔形密封圈的另一侧。
较佳地， 外螺纹螺母为中空结构， 防水线及密封圈可从中心穿过， 通孔 内壁上有螺纹结构， 与外螺纹螺母进行配合， 双向楔形密封圈的一侧锲形部 分安装在通孔与防水线的间隙中， 另一侧锲形部分由外螺纹螺母旋紧时挤压 安装好， 使所述通孔、 密封圈、 防水线外螺纹螺母通过上述过程中密封圈受 挤压时造成的形变紧密贴合， 以达到防水效果。
较佳地， 用双组分绝缘密封胶或其他密封胶在 PCB板正负焊点以及散热 器防水线穿过的位置封胶， 封胶后在常温下固化处理。 其他密封胶指除双组 分胶外适合密封的所有种类的胶水。
较佳地， 将散热器整体和透镜组进行固定进一步包括：
将散热器整体压入透镜组的倒扣结构内， 并使得固体硅胶圈和液体硅胶 进行形变， 通过透镜组一周的倒扣结构以使得散热器和透镜组的紧闭固定连 接， 并通过固体硅胶圈和液体硅胶的形变达到防护。
较佳地， 该工艺方法还包括： 所述起到灯架和散热器双重功效的散热器 可由型材截成， 散热器可选择不同形状的型材。 一种 LED模组的密封工艺， 包括：
(1)防水线穿过散热器过线孔与 PCB板上的正负焊点连接， 所述正负焊点 和防水线穿过位置进行封胶处理， 并且防水线与过线孔之间进行密封防水操 作；
(2)将 PCB板固定在散热器上；
(3)将透镜组固定在打胶机的固定夹具内， 将一个密封圈放置在透镜组；
(4)沿着该透镜组外周均匀的打上一圈层液体硅胶， 液体硅胶量以完全粘 连住固体硅胶密封圈为限；
(5)将经步骤（2 )处理的装有 PCB板和防水线的散热器倒扣在经步骤 (4) 处理的设有固体硅胶圈和液体硅胶的透镜组上， 将散热器整体和透镜组进行 固定；
(6)将组装好的 LED模组静置在常温下 2小时， 使液体硅胶固化。
透镜组的外周未设置有凹槽； 步骤 (3)和步骤 (4)中密封圈和液体硅胶分别 并列设置在外周上。
透镜组的外周仅设置一凹槽， 步骤 (3)和步骤 (4)中密封圈和液体硅胶的其 中之一设置在该凹槽， 另外一个设置在该凹槽的内周或外周上。
较佳的， 防水线与过线孔之间进行密封防水操作进一步包括：
在防水线上依次套上双向锲形密封圈、 外螺纹螺母， 然后穿过散热器的 过线孔， 将双向楔形密封圈的一侧锲形部分安装在通孔与防水线的间隙中， 将外螺纹螺母旋进散热器的过线孔， 使其压紧双向楔形密封圈的另一侧。
较佳的， 外螺纹螺母为中空结构， 防水线及密封圈可从中心穿过， 通孔 内壁上有螺纹结构， 与外螺纹螺母进行配合， 双向楔形密封圈的一侧锲形部 分安装在通孔与防水线的间隙中， 另一侧锲形部分由外螺纹螺母旋紧时挤压 安装好， 使所述通孔、 密封圈、 防水线外螺纹螺母通过上述过程中密封圈受 挤压时造成的形变紧密贴合， 以达到防水效果。
一种 LED照明装置的密封工艺， LED照明装置包括包含不同数量灯架单 元的散热器，每个灯架单元对应一个 PCB板、一个透镜组组成一个 LED模组， 每个 LED模组采用权项 1所述的密封工艺进行密封操作。
一种 LED模组的密封工艺， 包括：
(1)防水线穿过散热器过线孔与 PCB板上的正负焊点连接， 所述正负焊点 和防水线穿过位置进行封胶处理， 并且防水线与过线孔之间进行密封防水操 作；
(2)将 PCB板固定在散热器上；
(3)沿着该透镜组外周或内周分别放置固体胶和涂上液体胶， 或者只在外 周或只在内周放置固体胶和 /或涂上液体胶；
(4)将经步骤（2 )处理的装有 PCB板和防水线的散热器倒扣在经步骤 (3) 的透镜组上， 将散热器整体和透镜组进行固定
与现有技术相比， 本发明具有以下优点：
首先， 用至少两重硅橡胶圈将 LED芯片与外界彻底隔绝， 杜绝一切水汽 或者其他有害气体侵蚀芯片和 PCB板，且相对于薄膜密封更坚固，寿命更长， 相对于灌胶密封， 可减少胶水使用量和产品重量。 通过打胶工艺、 加以透镜 组的特殊设计和固体密封圈， 实现透镜组和散热器间的密封性能的保障。
通过双向锲形的密封圈和螺母， 加以 PCB板、 防水线连接处涂胶工艺设 置， 实现散热器出防水线通孔密封性能的保障。 另外， 本发明还可以通过" T" 字型密封圈、 外螺纹螺母、 密封胶、 过线孔内的螺纹进行密封， 密封效果好； 同时采用密封圈和密封胶两种密封方式相结合， 如若其中一种方法失效， 另 有另外一种也能进行独立密封， 进一步保证了密封效果。
透镜组的倒扣结构设计， 加以固体硅胶圈和液体硅胶的双重防护作用， 透镜组和散热器间达到很好的密封效果。 由于透镜组上的倒扣结构， 使得固 体硅胶圈和液体硅胶在整圈位置上能够产生相同的形变量， 各部分受压一致， 所以能够保证模组在封闭性上达到整体统一， 不会出现个别部位的缺陷。
根据不同需求， 可选择不同形状的散热器， 且所述散热器可包含不同数 量的灯架单元以满足不同功率的需求， 每个灯架单元单独对应一个 PCB板、 一个透镜组以及密封硅胶， 当散热器包含多个灯架单元时， 整灯大面积的密 封就分解为多个灯架单元的密封， 通过提高灯架单元的密封性， 即可提高整 灯的密封性。 且由于灯架单元密封圈周长小于整灯， 更易提高密封性能。
通过筒单的工艺就可达到很好的密封效果， 成本低廉， 寿命长， 对产品 本身无损坏， 生产效率高： 整个产品密封工艺可降低成本， 同时可达到 ^艮好 的密封效果， 实现防水、 防潮、 防腐蚀、 防氧化， 以利于 LED照明产品使用 寿命的延长及安全性的提高。
通过本密封工艺制成的产品可通过严苛的实验验证， 除了普通的水下测 试外， 还能通过 100 °C的沸腾红墨水煮水试验， 两重防护中， 每一道都要经历 30分钟以上的煮水试验的考验， 煮完后， 立即放入室温的冷水， 用骤冷来考 核其防水能力。 两重防护一起要经历 3小时 6个循环以上的煮水和骤冷试验。 附图说明
图 1A为 LED模组的实施例爆炸图； 图 1B为 LED模组的另一实施例爆 炸图；
图 2为出线孔结构剖视示意图；
图 3为点胶示意图；
图 4为 LED照明装置的实施例爆炸图；
图 5为 LED散热器的一种实施例的结构示意图；
图 6为一种 LED照明装置的密封工艺的结构示意图；
图 7为本发明防水线通孔密封第二实施例的整体立体示意图为过线孔的 剖面示意图；
图 8为防水线通孔密封中的外螺纹螺母的结构示意图；
图 9为防水线通孔密封中的" T"字型密封圈的结构示意图；
图 10为防水线通孔密封中的外螺纹螺母和 "T"字型密封圈套设于电线上 的结构示意图； 图 11为防水线通孔密封中具体实施例的剖视图；
图 12为本发明 LED密封工艺可适用的另一种应用 LED照明装置的结构 示意图；
图 13为本发明适用的 LEDS照明模组的结构实例图；
图 14为本发明适用的 LEDS照明模组的爆炸图。
具体实施方式
实施例 1
请参阅图 1至图 3, —种 LED密封工艺采用的技术方案是： 一种 LED照 明装置， 包括散热器 （本发明中散热器与散热架说的是一回事， 考虑到名称 统一， 现将所有散热架统一成散热器， 以便名称混洧） 11、 PCB板 12、 LED 芯片、 密封硅胶和透镜组 13 , LED芯片焊接在 PCB板 12上， PCB板 12与 散热器 11贴合， 透镜组 13安装在 LED芯片上方。
散热器可包含一个灯架单元或多个灯架单元， 每个灯架单元单独对应一 个 PCB板 12、 一个透镜组 13以及密封硅胶。 以下以单个灯架单元为例： 散热器 11可由型材截成， 起到灯架作用的同时， 又是散热器， 加工过程 筒单， 成本较低。 根据不同需要， 散热器可选择不同形状的型材。
散热器 11上设有横截面为台阶状的通孔 21 , PCB板 12的防水线 22从通 孔 21穿过， 在通孔 21与防水线 22的间隙安装有密封圈 31。 密封圈 31为双 向锲形的密封圈， 一侧锲形部分安装在通孔 21与防水线 22的间隙中， 另一 侧锲形部分与通孔壁间通过螺母 32向下固定安装， 使所述的通孔 21与防水 线 22间通过密封圈 31贴合。
所述散热器 11上设置有 PCB板 12, PCB板 12和散热器 11间成面接触 连接， 且通过螺丝固定， PCB板 12上产生的热量可以通过散热器 11迅速传 导散开。
所述 PCB板 12上设有 LED光源， LED光源可以为带支架的 LED光源， 也可以为不带支架的 LED光源， 直接覆在 PCB板 12上。
所述的密封硅胶包括安装在透镜组 13上的固体硅胶圈 14,以及涂在固体 硅胶圈 14侧边的液体硅胶形成的凝胶硅胶圈 15。 所述的固体硅胶圈 14侧边 对应的透镜平面的位置上， 开有凹槽， 用于涂液体硅胶。
所述透镜组 13平面上有数个透镜， 每个透镜对应一个 LED光源。
透镜组 13—周设计有倒扣结构 18, 通过倒扣结构 18, 将安装有 PCB板 12的散热器 11倒扣在设置有硅胶圈 14和液体硅胶 15的透镜组 13上形成紧 闭固定。
其原理工艺可以为：
(1)防水线穿过散热器过线孔与 PCB板上的正负焊点连接， 所述正负焊点 和防水线穿过位置进行封胶处理， 并且防水线与过线孔之间进行密封防水操 作；
(2)将 PCB板固定在散热器上；
(3)将带有内外双圈凹槽的透镜组固定在打胶机的固定夹具内， 将一个密 封圈放置在透镜组内圈凹槽内；
(4)沿着该透镜组的外圈凹槽均匀的打上一圈层液体硅胶， 液体硅胶量以 完全粘连住固体硅胶密封圈为限；
(5)将打好胶的透镜组静置在常温下固化 2小时；
(6)将经步骤（2 )处理的装有 PCB板和防水线的散热器倒扣在经步骤 (5) 处理的设有固体硅胶圈和液体硅胶的透镜组上， 将散热器整体和透镜组进行 固定。 用至少两重硅橡胶圈将 LED芯片与外界彻底隔绝， 杜绝一切水汽或者 其他有害气体侵蚀芯片和 PCB板， 且相对于薄膜密封更坚固， 寿命更长， 相 对于灌胶密封， 可减少胶水使用量和产品重量。 需要说明的是，过线孔密封还可以通过其它装置来实现。参考图 7-11所示， 本发明提供了一种过线孔密封装置， 用于密封一电线 140 (或称防水线）穿过 的过线孔 110, 该过线孔密封装置包括套设于密封线上的 "T"字型密封圈 130, 以及套设于" T"字型密封圈 130下端上的外螺纹螺母 120。 在本实施例中， 如图 7所示， 过线孔 110呈圆柱形结构， 且过线孔 110设置 为上窄下宽的结构， 即过线孔 110的上段为窄口径部分 111 ,其下段为宽口径部 分 112, 窄口径部分 111和宽口径部分 112的分界处设有第一过渡台面 114, 过线 孔 110的下端的宽口径部分 112内侧设置有第一螺纹 113; 其中， 第一过渡台面 114具有一定的倾角； 窄口径部分 111靠近过线孔设置的目标处的电路板， 宽口 径部分 112远离目标处的电路板。 在本实施例中， 如图 8所示， 外螺纹螺母 120呈中空状， 其外表面上设置 有与第一螺纹 113相匹配的第二螺纹 122。 具体的， 外螺纹螺母 120分为三段， 且其三段的内侧直径相等， 外螺纹螺母 120的上半段为上端窄部 121 , 第二螺 纹 122设置于外螺纹螺母 120的中间段的外侧上， 且上端窄部 121的外侧直径小 于外螺纹螺母 120中间段的外侧直径， 外螺纹螺母 120中间段的外侧螺纹直径 与过线孔 110的宽口径部分 112的内侧的螺纹直径相匹配； 外螺纹螺母 120的下 半段上设置为拧紧结构， 具体的为六角结构 123 , 当然此处只为举例， 拧紧结 构也可通过其他形式来实现， 可根据具体情况而定， 此处不做限制。 当然， 外螺纹螺母 120三段的直径可根据具体情况而定， 外螺纹螺母 120也可不分为 三段， 也可直接为一段， 且其外表面上设置螺纹， 可根据具体情况而定， 此 处不做限制。 在本实施例中， "T"字型密封圈 130呈中空状， 且其上宽下窄， 即图 9中所 示， 上端为一宽的冠状部 134, 下端为一窄部 132, 且窄部 132和冠状部 134之 间设有第二过渡台面 133。 窄部 132呈圆台状， 窄部 132与冠状部 134连接处窄 部 132的端面的直径大于窄部 132另一端端面的直径， 当然窄部 132也可呈直筒 状等， 本实施例中窄部 132呈圆台状是为了外螺纹螺母 120套设于 "T"字型密封 圈 130的窄部 132上时更易套设。 其中， "T"字型密封圈 130的冠状部 134的直径 大于外螺纹螺母 120的上端窄部 121的直径。 电线 140穿过" T"字型密封圈 130 后， 外螺纹螺母 120套设于 "T"字型密封圈 130的窄部 132上， 且外螺纹螺母 120 的一端面压紧在" T"字型密封圈的第二过渡台面 133上， 通过外螺纹螺母 120上 的第二螺纹将套设有 "T"字型密封圈和外螺纹螺母的电线拧进过线孔的宽口 径部分 112内。 如图 11所示， "T"字型密封圈 130的冠状部 134的上端面顶在过 线孔的窄口径部分 111与宽口径直径 112的交界处的第一过渡台面 114上， 外螺 纹螺母 120的上端和过线孔窄口径部分 111的下端将" T"字型密封圈 130挤压至 变形， 从而使得" T"字型密封圈与电线和过线孔及紧密贴合， 起到密封作用。
在本实施例中， 电线 140通过外螺纹螺母 120和" T"字型密封圈 130连接到 过线孔后， 在" T"字型密封圈 130之上的过线孔与电线 140的空隙内灌注有密封 胶层， 进一步的对过线孔进行密封， 当然密封胶的类型可根据具体情况而定， 此处不做限制。 本发明通过" T"字型密封圈、 外螺纹螺母、 密封胶、 过线孔内 的螺纹进行密封， 采用密封圈和密封胶两种密封方式相结合， 如若其中一种 方法失效， 另有另外一种也能进行独立密封。
在本实施例中，过线孔上端的窄口径部位 111设置有第三螺纹 115 , 密封胶 层粘附于所述第三螺纹 115上， 可增强密封胶层的附着力， 可根据具体情况进 行设置此处不做限制。 在本是实例中， "T"字型密封圈 130的第二过渡台面 133具有一定倾角， 外 螺纹螺母 120的一端面压紧在" T"字型密封圈的第二过渡台面 133的过程中产 生向内和向上两个方向的力， 作用如下： （ 1 )向内的力使外螺纹螺母 120压紧 "T"字型密封圈 130, 同时" T"字型密封圈 130压紧电线 140, 这样电线 140和" T" 字型密封圈 130之间、 "T"字型密封圈和外螺纹螺母 120之间紧密贴合， 中间没 有间隙； （2 )外螺纹螺母 120顶部压紧" T"字型密封圈 130的冠状部 134的底部， 同时" T"字型密封圈 130的冠状部 134的顶部压紧第一过渡台面 114。 在本实施例中， 电线 140的外表面上可设置有防护套， 具有防水、 绝缘的 作用， 可根据具体情况进行设置此处不做限制。 本发明提供的过线孔密封装置在具体实施里中的密封过程如下： 首先将 "T"字型密封圈 130套设于电线 140上， 即电线 140依次穿过" T"字型 密封圈 130的窄部 132和冠状部 134; 将外螺纹螺母 120套设于 "T"字型密封圈 130的窄部 132上， 由于" T"字型密封圈 130的冠状部 134的直径大于外螺纹螺母 120的上端窄部 121的直径， 所以" T"字型密封圈 130的第二过渡台面 133与外螺 纹螺母 120的上端窄部 121的上端面接触； 再将套设有" T"字型密封圈 130和外 螺纹螺母 120的电线依次穿过过线孔的宽口径部分 112和窄口径部分 111 , 通过 过线孔上的第一螺纹 113和外螺纹螺母中间段上的第二螺纹 122连接到过线孔 的内侧， 此时 T"字型密封圈 130的第二过渡台面 133顶在过线孔的窄口径部分 111与宽口径直径 112的交界处的第一过渡台面 114上，在外螺纹螺母 120上端面 的挤压下， 外螺纹螺母 120的上端和第一过渡台面 114将" T"字型密封圈 130挤 压至变形， 从而使得" T"字型密封圈与电线和过线孔及紧密贴合， 起到密封作 用； 最后， 再在" T"字型密封圈 130之上的过线孔与电线 140的空隙内灌注有密 封胶层， 进行进一步的密封。 综上所述， 本实例提供了一种过线孔密封装置， 过线孔呈上窄下宽且其 内部设置有螺纹。 电线通过一中空的" T"字型密封圈和一中空的外螺纹螺母连 接在过线孔的宽口径部内。其中， "T"字型密封圈包括一窄部和一宽的冠状部， 窄部和冠状部之间设置有具有一定倾斜率的第二过渡台面， "T"字型密封圈套 设于电线上， 外螺纹螺母套设于" T"字型密封圈的窄部上， 且其一端面压紧在 "T"字型密封圈的第二过渡台面上， 外螺纹螺母与过线孔螺纹连接， "T"字型 密封圈的冠状部抵在过线孔的宽口径部和窄口径部的分界处有一定倾斜率的 的第一过渡台面上， 并且电线与过线孔的空隙内灌注有密封胶层。 本发明通 过" T"字型密封圈、 外螺纹螺母、 密封胶、 过线孔内的螺纹进行密封， 起到双 层密封作用。
具体工艺流程如下：
1、 在防水线上依次套上双向锲形密封圈、 外螺纹螺母， 然后穿过散热器 的过线孔， 将双向楔形密封圈的一侧锲形部分安装在通孔与防水线的间隙中， 将外螺纹螺母旋进散热器的过线孔， 使其压紧双向楔形密封圈的另一侧。
外螺纹螺母为中空结构， 防水线及密封圈可从中心穿过。 通孔内壁上有 螺纹结构， 与外螺纹螺母进行配合。 双向楔形密封圈的一侧锲形部分安装在 通孔与防水线的间隙中， 另一侧锲形部分由外螺纹螺母旋紧时挤压安装好， 使所述的通孔、 密封圈、 防水线外螺纹螺母通过上述过程中密封圈受挤压时 造成的形变紧密贴合， 达到防水效果。 2、防水线穿过散热器过线孔后与 PCB板上的正负焊点连接后，用双组分 绝缘密封胶或其他密封胶在 PCB板正负焊点以及散热器防水线穿过的位置封 胶 33 ,封胶后在常温下固化 1小时。 进一步加强防水线在通孔处的密封效果。 较佳地， 此处的双组分绝缘胶选择韧性环氧胶体系， 粘结金属有极佳的耐沖 击和抗化学品性能。
4、 将带有内外两圈凹槽的透镜组固定在打胶机 16 的固定夹具内， 将一 个大小合适的固体硅胶圈 14放置在透镜组内圈凹槽内。
5、设定桌面机器人和点胶机通过胶枪 19, 沿着透镜组上外圈凹槽均匀地 打一圈液体硅胶。 液体硅胶量以能够完全粘连住固体硅胶圈为准， 常温下固 化 2小时。 液体胶选用硅胶， 硅胶对金属和 PC材质有极佳粘性、 耐沖击和抗 紫外性能。
6、 将经过步骤 2的装有 PCB板和防水线的散热器倒扣 18在经步骤 3处 理的设有固体硅胶圈和液体硅胶的透镜组上， 将散热器整体压入透镜组的倒 扣结构内。 通过透镜组一周的倒扣结构， 实现散热器和透镜组的紧闭固定连 接， 并通过固体硅胶圈和液体硅胶的形变达到双重防护的作用。
实施例 2
实施例 2与实施例 1工艺步骤大致相同， 不同之处在于： 将固体硅胶圈 设置在透镜组的外圈凹槽内， 再沿透镜组的内圈凹槽均匀地打一圈液体硅胶。 其他工艺步骤与实施例 1相同， 不再赘述。
实施例 3
透镜组的外周仅设置一凹槽， 密封圈和液体硅胶的其中之一设置在该凹 槽， 另外一个设置在该凹槽的内周或外周上。 实施例 4
透镜组的外周未设置有凹槽； 密封圈和液体硅胶分别并列设置在外周上。 也就是说， 一种 LED模组的密封工艺， 包括：
(1)防水线穿过散热器过线孔与 PCB板上的正负焊点连接， 所述正负焊点 和防水线穿过位置进行封胶处理， 并且防水线与过线孔之间进行密封防水操 作；
(2)将 PCB板固定在散热器上；
(3)沿着该透镜组外周或内周分别放置固体胶和涂上液体胶， 或者只在外 周或只在内周放置固体胶和 /或涂上液体胶；
(4)将经步骤（2 )处理的装有 PCB板和防水线的散热器倒扣在经步骤 (3) 的透镜组上， 将散热器整体和透镜组进行固定。
当然， 透镜组可以只设置一外周而不设置内周， 或只设置内周设置外周， 同样， 可以在其上同时放置固体胶和涂上液体胶， 或只放置固定胶， 或只涂 上液体胶。
这些并不是本发明的重点， 本发明只需要能实现将散热器整体和透镜组 进行固定连接即可。
应用例一：
如图 4、 5所示， 一种 LED照明装置的密封工艺， LED照明装置包括包 含不同数量灯架单元的散热器 11 ,散热器 11上的灯架单元可以是如图 4所示 的横向排列， 也可以是如图 5的纵向排列， 每个灯架单元对应一个 PCB板、 一个透镜组组成一个 LED模组，每个 LED模组采用上述两种密封工艺中的一 种进行密封操作。 所述散热器上还设置有用于安装外置驱动电源的电源防水 盒 42和安装支架 41 , 照明装置通过安装支架进行转动及固定。
如图 6所示，一种 LED照明装置的密封工艺， LED照明装置包括灯架 11'、 透镜组 13、 PCB板 12和电源盒 51 , 采用灯架 1Γ替代散热器架 11 , 灯架 11'、 PCB板 12和透镜组 13组成一个 LED模组， LED模组的采用上述两种密封工 艺中的一种进行密封操作。 灯架通过灯架连接件 52连接于所述电源盒 51 , 驱 动电源 53设置在电源盒 51内。 所述灯架上设置一容置槽 54, 容置槽 54底部 设置有与透镜组的倒扣相配合的凹槽， 透镜组的倒扣可压入到该凹槽内。 透 镜组 13连同 PCB板 12—起固定在容置槽 54内， 所述 PCB板的一面设置有 LED光源， 其另一面与所述灯架容置槽 54的底面面贴合连接进行散热， 所述 灯架采用导热效果良好的铝板制成。 应用例二：
请参阅图 1B, 其为本发明密封工艺可适用的一种 LED模组的应用例图。 本发明与图 1相比， 本发明适合的散热器可采用图 12所示。 散热器 11，上可 设置散热鳍， 两侧也可以带有导热支撑架， 散热所述的散热器的导热支撑架 也可以设置至少有一末端为 "几"型挂扣， 侧梁内侧有" J"型卡槽，散热器与侧 梁组件的连接是通过所述的 "几"型挂扣与所述的 "型卡槽进行啮合固定、且 形成面接触。
也就是说， 与图 1相比， 本发明不同的区别点在于散热器 1Γ采用具有更 佳散热功效的带有散热鳍的散热器， 其它的组成部件基本类似。
也就是说，本发明的密封工艺可适用的 LED模组不局限于散热器的形状。 应用例三：
同样， 本发明密封工艺可适用的另一种 LED模组， 对于 LED透镜也不 仅局限于图 1所示的透镜格式， 请参阅图 12, 本发明适用的 LED模组的透镜 格式 131可以采用现有的任何形状， 就不再详细说明。 应用例四：
请参阅图 13和图 14, LED模组， 包括透镜组、 LED颗粒、 电路板和散 热器， LED颗粒焊接在电路板上， 电路板与散热器紧密贴合， 透镜组盖设在 散热器上， 透镜组位于 LED颗粒上方， 透镜组和散热器构成的密闭空间内填 充有封装胶体。
在本实例中， 封装胶体的折射率为 1.3~1.7, 封装胶体的折射率与透镜组 上的透镜的折射率接近。 本发明的 LED模组中， LED芯片发出的光在传播 过程中封装胶体替代了原有的空气介质 ,并且封装胶体的折射率与透镜组上 的透镜匹配， 这样在最大程度上提高了出光率， 与现有技术相比， 光效提高 了 10~15%。
针对上述的 LED模组， 具有以下密封工艺：
( 1 )在散热器和电路板上分别开有相对应的注胶孔和排气孔；
( 2 )将 LED颗粒焊接在电路板上， 将电路板与散热器紧密贴合， 将透 镜组盖设在散热器上， 透镜组位于 LED颗粒上方； 其中， LED颗粒包括 LED 芯片和散热基座， LED芯片设置于散热基座上， LED芯片涂覆有荧光粉， 散热基座上设置有电极焊盘。
( 3 )将封装胶体通过散热器底部的注胶孔注入散热器和透镜组之间的间 隙， 封装胶体填满透镜组与散热器之间的间隙， 多余的空气从排气孔排出； 其中， 封装胶体的折射率为 1.3~1.7。
( 4 )用螺丝拧紧的方式或者用胶水封口的方式密封注胶孔和排气孔。 本发明的 LED模组中， 散热器和透镜组的密闭空间内填充有封装胶体， 电路板和每个 LED颗粒都被封装胶体包覆， 因此具有很好的防水性能。 本发 明的 LED模组中， LED颗粒产生的热量不仅可以通过散热基座的底面向电 路板传递， 而且可以通过封装胶体向外传递， 使得散热效果更好。
以上公开的仅为本申请的几个具体实施例， 但本申请并非局限于此， 任 何本领域的技术人员能思之的变化， 都应落在本申请的保护范围内。

Claims

1、 一种 LED模组的密封工艺， 其特征在于， 包括：
(1)防水线穿过散热器过线孔与 PCB板上的正负焊点连接， 所述正负焊点 和防水线穿过位置进行封胶处理， 并且防水线与过线孔之间进行密封防水操 作；
(2)将 PCB板固定在散热器上；
(3)将至少带有内外双圈凹槽的透镜组固定在打胶机的固定夹具内， 将一 个密封圈放置在透镜组内外圈凹槽的其中一凹槽内；
(4)沿着该透镜组的另外一凹槽上均匀的打上一圈液体硅胶， 液体硅胶量 以完全粘连住固体硅胶密封圈为限；
(5)将经步骤（2 )处理的装有 PCB板和防水线的散热器倒扣在经步骤 (4) 处理的设有固体硅胶圈和液体硅胶的透镜组上， 将散热器整体和透镜组进行 固定；
(6)将组装好的 LED模组静置， 使液体硅胶固化。
2、 如权利要求 1所述的一种 LED模组的密封工艺， 其特征在于， 防水 线与过线孔之间进行密封防水操作进一步包括：
在防水线上依次套上双向锲形密封圈、 外螺纹螺母， 然后穿过散热器的 过线孔， 将双向楔形密封圈的一侧锲形部分安装在通孔与防水线的间隙中， 将外螺纹螺母旋进散热器的过线孔， 使其压紧双向楔形密封圈的另一侧。
3、 如权利要求 2所述的一种 LED模组的密封工艺， 其特征在于， 外螺 纹螺母为中空结构， 防水线及密封圈可从中心穿过， 通孔内壁上有螺纹结构， 与外螺纹螺母进行配合， 双向楔形密封圈的一侧锲形部分安装在通孔与防水 线的间隙中， 另一侧锲形部分由外螺纹螺母旋紧时挤压安装好， 使所述通孔、 密封圈、 防水线外螺纹螺母通过上述过程中密封圈受挤压时造成的形变紧密 贴合， 以达到防水效果。
4、 如权利要求 1所述的 LED模组的密封工艺， 其特征在于， 防水线与 过线孔之间进行密封防水操作进一步包括： 所述过线孔包括上端的窄口径部分和下端的宽口径部分， 且所述窄口径 部分和所述宽口径部分的分界处设置第一过渡台面， 所述过线孔下端的宽口 径部分内侧设置有第一螺纹， 并且该过线孔密封通过以下方式设置：
设置" T"字型密封圈， 呈中空状， 所述" T"字型密封圈包括一窄部和一宽 的冠状部， 且所述窄部和所述冠状部之间具有第二过渡台面， 所述" T"字型密 封圈套设于电线上；
设置外螺纹螺母， 呈中空状， 所述外螺纹螺母的外侧面上设置有与所述 第一螺紋相匹配的第二螺纹；
所述" T"字型密封圈套设于电线或防水线上， 所述外螺纹螺母套设于所述 "T"字型密封圈的窄部上， 套设有所述" T"字型密封圈和所述外螺纹螺母的电 线依次穿过所述过线孔的宽口径部分和窄口径部分， 所述外螺纹螺母通过所 述第一螺纹和所述第二螺紋设置于所述过线孔的宽口径部分内， 所述外螺纹 螺母向内压紧所述" T"字型密封圈， 同时" T"字型密封圈压紧所述电线； 且所 述外螺纹螺母的一端面压紧在所述" T"字型密封圈的第二过渡台面上， 同时 "T"字型密封圈冠状部的顶部压紧第一过渡台面；
所述电线或所述防水线与所述过线孔的空隙内灌注有密封胶层。
5、 根据权利要求 4所述的一种 LED模组的密封工艺， 其特征在于， 所述 过线孔上端的窄口径部位设置有第三螺纹， 所述密封胶层粘附于所述第三螺 纹。
6、 根据权利要求 4所述的一种 LED模组的密封工艺， 其特征在于， 所述 外螺纹螺母呈中空状的三段结构， 且所述外螺纹螺母的三段结构的内侧直径 一样； 所述外螺纹螺母的上半段的外侧直径小于中间段的外侧直径， 所述第 二螺紋设置于所述外螺纹螺母的中间段的外侧上， 所述外螺纹螺母的下半段 的外侧上设置有拧紧结构。
7、 根据权利要求 4或 6所述的一种 LED模组的密封工艺， 其特征在于， 所 述" T"字型密封圈呈三段结构， 包括依次相连的冠状部、第二过渡台面和窄部， 其中所述窄部呈上宽下窄状， 所述窄部与所述冠状部连接端的端面直径大于 所述窄部另一端面的直径。
8、 如权利要求 1或 2或 4所述的一种 LED模组的密封工艺， 其特征在 于， 用双组分绝缘密封胶或其他密封胶在 PCB板正负焊点以及散热器防水线 穿过的位置封胶， 封胶后在常温下固化处理。
9、 如权利要求 1所述的一种 LED模组的密封工艺， 其特征在于， 将散 热器整体和透镜组进行固定进一步包括：
将散热器整体压入透镜组的倒扣结构内， 并使得固体硅胶圈和液体硅胶 进行形变， 通过透镜组一周的倒扣结构以使得散热器和透镜组的紧闭固定连 接， 并通过固体硅胶圈和液体硅胶的形变达到防护。
10、 如权利要求 1所述的一种 LED模组的密封工艺， 其特征在于， 还包 括：
所述起到灯架和散热器双重功效的散热器可由型材截成， 散热器可选择 不同形状的型材。
11、 一种 LED模组的密封工艺， 其特征在于： 包括：
(1)防水线穿过散热器过线孔与 PCB板上的正负焊点连接， 所述正负焊点 和防水线穿过位置进行封胶处理， 并且防水线与过线孔之间进行密封防水操 作；
(2)将 PCB板固定在散热器上；
(3)将透镜组固定在打胶机的固定夹具内， 将一个密封圈放置在透镜组外 周上；
(4)沿着该透镜组外周打上一圈液体硅胶， 液体硅胶量以完全粘连住固体 硅胶密封圈为限；
(5)将经步骤（2 )处理的装有 PCB板和防水线的散热器倒扣在经步骤 (4) 处理的设有固体硅胶圈和液体硅胶的透镜组上， 将散热器整体和透镜组进行 固定；
(6)将组装好的 LED模组静置， 使液体硅胶固化。
12、 如权利要求 11所述的一种 LED模组的密封工艺， 其特征在于： 还 包括：
透镜组的外周未设置有凹槽；
步骤 (3)和步骤 (4)中密封圈和液体硅胶分别并列设置在外周上。
13、 如权利要求 11所述的一种 LED模组的密封工艺， 其特征在于： 还 包括：
透镜组的外周仅设置一凹槽；
步骤 (3)和步骤 (4)中密封圈和液体硅胶的其中之一设置在该凹槽， 另外一 个设置在该凹槽的内周或外周上。
14、 如权利要求 11所述的一种 LED模组的密封工艺， 其特征在于， 防 水线与过线孔之间进行密封防水操作进一步包括：
在防水线上依次套上双向锲形密封圈、 外螺纹螺母， 然后穿过散热器的 过线孔， 将双向楔形密封圈的一侧锲形部分安装在通孔与防水线的间隙中， 将外螺纹螺母旋进散热器的过线孔， 使其压紧双向楔形密封圈的另一侧。
15、 如权利要求 14所述的一种 LED模组的密封工艺， 其特征在于， 外 螺纹螺母为中空结构， 防水线及密封圈可从中心穿过， 通孔内壁上有螺纹结 构， 与外螺纹螺母进行配合， 双向楔形密封圈的一侧锲形部分安装在通孔与 防水线的间隙中， 另一侧锲形部分由外螺纹螺母旋紧时挤压安装好， 使所述 通孔、 密封圈、 防水线外螺纹螺母通过上述过程中密封圈受挤压时造成的形 变紧密贴合， 以达到防水效果。
16、 如权利要求 11所述的 LED模组的密封工艺， 其特征在于， 防水线 与过线孔之间进行密封防水操作进一步包括： 所述过线孔包括上端的窄口径部分和下端的宽口径部分， 且所述窄口径 部分和所述宽口径部分的分界处设置第一过渡台面， 所述过线孔下端的宽口 径部分内侧设置有第一螺纹， 并且该过线孔密封通过以下方式设置： 设置" T"字型密封圈， 呈中空状， 所述" Τ"字型密封圈包括一窄部和一宽 的冠状部， 且所述窄部和所述冠状部之间具有第二过渡台面， 所述" Τ"字型密 封圈套设于电线上；
设置外螺纹螺母， 呈中空状， 所述外螺纹螺母的外侧面上设置有与所述 第一螺紋相匹配的第二螺纹；
所述" Τ"字型密封圈套设于电线或防水线上， 所述外螺纹螺母套设于所述 "Τ"字型密封圈的窄部上， 套设有所述" Τ"字型密封圈和所述外螺纹螺母的电 线依次穿过所述过线孔的宽口径部分和窄口径部分， 所述外螺纹螺母通过所 述第一螺纹和所述第二螺紋设置于所述过线孔的宽口径部分内， 所述外螺纹 螺母向内压紧所述" Τ"字型密封圈， 同时" Τ"字型密封圈压紧所述电线； 且所 述外螺纹螺母的一端面压紧在所述" Τ"字型密封圈的第二过渡台面上， 同时 "Τ"字型密封圈冠状部的顶部压紧第一过渡台面；
所述电线或所述防水线与所述过线孔的空隙内灌注有密封胶层。
17、 一种 LED照明装置的密封工艺， LED照明装置包括包含不同数量灯 架单元的散热器， 每个灯架单元对应一个 PCB板、 一个透镜组组成一个 LED 模组， 每个 LED模组采用权项 1或 16所述的密封工艺进行密封操作。
18、 一种应用于 LED模组的过线孔密封装置， 用于密封一电线穿过的过 线孔， 其特征在于， 所述过线孔包括上端的窄口径部分和下端的宽口径部分， 且所述窄口径部分和所述宽口径部分的分界处具有第一过渡台面， 所述过线 孔下端的宽口径部分内侧设置有第一螺纹， 该过线孔密封装置包括：
"T"字型密封圈， 呈中空状， 所述" T"字型密封圈包括一窄部和一宽的冠 状部， 且所述窄部和所述冠状部之间具有第二过渡台面， 所述" T"字型密封圈 套设于电线上；
外螺纹螺母， 呈中空状， 所述外螺纹螺母的外侧面上设置有与所述第一 螺纹相匹配的第二螺纹；
所述" T"字型密封圈套设于所述电线上， 所述外螺纹螺母套设于所述 "T" 字型密封圈的窄部上， 套设有所述" T"字型密封圈和所述外螺纹螺母的电线依 次穿过所述过线孔的宽口径部分和窄口径部分， 所述外螺纹螺母通过所述第 一螺纹和所述第二螺纹设置于所述过线孔的宽口径部分内， 所述外螺纹螺母 向内压紧所述 "T"字型密封圈， 同时" T"字型密封圈压紧所述电线； 且所述外 螺纹螺母的一端面压紧在所述" T"字型密封圈的第二过渡台面上， 同时" T"字 型密封圈冠状部的顶部压紧第一过渡台面；
所述电线与所述过线孔的空隙内灌注有密封胶层。
19、 一种应用于 LED模组的过线孔密封装置， 其特征在于， 在防水线上 依次套设上双向锲形密封圈和外螺纹螺母， 双向楔形密封圈的一侧锲形部分 安装在通孔与防水线的间隙中， 外螺纹螺母旋设进散热器的过线孔， 使其压 紧双向楔形密封圈的另一侧， 外螺纹螺母为中空结构， 防水线及密封圈可从 中心穿过， 通孔内壁上有螺纹结构， 与外螺纹螺母进行配合， 双向楔形密封 圈的一侧锲形部分安装在通孔与防水线的间隙中， 另一侧锲形部分由外螺纹 螺母旋紧时挤压安装好， 使所述通孔、 密封圈、 防水线外螺纹螺母通过上述 过程中密封圈受挤压时造成的形变紧密贴合。
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KR102232932B1 (ko) * 2020-10-07 2021-03-29 주식회사 윤산피엠아이 렌즈 및 결합부재 일체형 전면 커버를 구비한 led 라이트
CN112599029B (zh) * 2020-11-27 2022-07-12 佛山市青松科技股份有限公司 一种led显示屏的制备方法
CN112770544A (zh) * 2020-12-16 2021-05-07 中山市立体光电科技有限公司 复合型柔性线路板的制作方法
KR102257937B1 (ko) * 2021-01-12 2021-05-28 (주)코리아반도체조명 엘이디 조명장치
CN112951773A (zh) * 2021-01-28 2021-06-11 安阳师范学院 一种大功率半导体装置的焊接及密封结构
CN115050272B (zh) * 2021-03-09 2023-09-22 西安青松光电技术有限公司 一种cob模组加工方法、cob模组及cob显示屏
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US20150128409A1 (en) 2015-05-14
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TR201807698T4 (tr) 2018-06-21
AU2013271129B2 (en) 2016-10-20
PL2863119T3 (pl) 2018-07-31
EP2863119B1 (en) 2018-03-14
HUE037199T2 (hu) 2018-08-28
JP2015522906A (ja) 2015-08-06
ES2663994T3 (es) 2018-04-17
US9788444B2 (en) 2017-10-10
JP5953428B2 (ja) 2016-07-20
AU2013271129A1 (en) 2014-11-06
ZA201407956B (en) 2015-12-23
KR101820391B1 (ko) 2018-01-19

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