WO2013172609A1 - 지문센서 패키지 및 그 제조방법 - Google Patents

지문센서 패키지 및 그 제조방법 Download PDF

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Publication number
WO2013172609A1
WO2013172609A1 PCT/KR2013/004202 KR2013004202W WO2013172609A1 WO 2013172609 A1 WO2013172609 A1 WO 2013172609A1 KR 2013004202 W KR2013004202 W KR 2013004202W WO 2013172609 A1 WO2013172609 A1 WO 2013172609A1
Authority
WO
WIPO (PCT)
Prior art keywords
fingerprint sensor
driving electrode
base substrate
fingerprint
mold body
Prior art date
Application number
PCT/KR2013/004202
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
손동남
박영문
김기돈
Original Assignee
크루셜텍(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 크루셜텍(주) filed Critical 크루셜텍(주)
Priority to CN201380025789.XA priority Critical patent/CN104303288A/zh
Publication of WO2013172609A1 publication Critical patent/WO2013172609A1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/38—Payment protocols; Details thereof
    • G06Q20/40—Authorisation, e.g. identification of payer or payee, verification of customer or shop credentials; Review and approval of payers, e.g. check credit lines or negative lists
    • G06Q20/401—Transaction verification
    • G06Q20/4014—Identity check for transactions
    • G06Q20/40145—Biometric identity checks
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
    • G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
    • G07F7/0806—Details of the card
    • G07F7/0833—Card having specific functional components
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
    • G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
    • G07F7/10—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means together with a coded signal, e.g. in the form of personal identification information, like personal identification number [PIN] or biometric data
    • G07F7/1008—Active credit-cards provided with means to personalise their use, e.g. with PIN-introduction/comparison system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Definitions

  • the present invention relates to a fingerprint sensor package, and more particularly, to provide a package and a manufacture capable of improving the acquisition sensitivity of the fingerprint sensor through a smooth sweep (improved mechanical strength and durability against electrostatic discharge, and structurally simple) It is about a method.
  • the mold body 5 is formed by molding with an encapsulant, wherein the surface of the driving electrode 3 has a mold body. (5) The fingerprint sensor 1 and the driving electrode 3 positioned on the base substrate 2 while being exposed to the outside are protected so as to be protected from the external environment.
  • the present invention can be used for a variety of fields, such as security, authentication or the interface of the electronic device using the fingerprint detection, it is structurally simple to improve productivity, the distance between the sensing unit top surface of the fingerprint sensor and the fingerprint This minimizes accurate fingerprint image data and improves mechanical strength and resistance to electrostatic discharge, which can be effectively applied to various devices including mobile and computers requiring authentication through fingerprint recognition and pointing function using fingerprint recognition. It is an invention of high industrial applicability since it is applicable.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Business, Economics & Management (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Accounting & Taxation (AREA)
  • General Business, Economics & Management (AREA)
  • Theoretical Computer Science (AREA)
  • Strategic Management (AREA)
  • Computer Security & Cryptography (AREA)
  • Finance (AREA)
  • Manufacturing & Machinery (AREA)
  • Image Input (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
PCT/KR2013/004202 2012-05-15 2013-05-13 지문센서 패키지 및 그 제조방법 WO2013172609A1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201380025789.XA CN104303288A (zh) 2012-05-15 2013-05-13 指纹传感器封装件及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0051487 2012-05-15
KR1020120051487A KR101362348B1 (ko) 2012-05-15 2012-05-15 지문센서 패키지 및 그 제조방법

Publications (1)

Publication Number Publication Date
WO2013172609A1 true WO2013172609A1 (ko) 2013-11-21

Family

ID=49583967

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2013/004202 WO2013172609A1 (ko) 2012-05-15 2013-05-13 지문센서 패키지 및 그 제조방법

Country Status (3)

Country Link
KR (1) KR101362348B1 (zh)
CN (1) CN104303288A (zh)
WO (1) WO2013172609A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051367A (zh) * 2014-07-01 2014-09-17 苏州晶方半导体科技股份有限公司 指纹识别芯片封装结构和封装方法
CN104051368A (zh) * 2014-07-01 2014-09-17 苏州晶方半导体科技股份有限公司 指纹识别芯片封装结构和封装方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104576594A (zh) * 2014-12-31 2015-04-29 华天科技（西安）有限公司 一种利用点胶工艺的指纹设计封装结构及其制备方法
CN106252345A (zh) * 2016-09-20 2016-12-21 苏州科阳光电科技有限公司 指纹传感器模组及其制作方法
CN107273854A (zh) * 2017-06-16 2017-10-20 广东欧珀移动通信有限公司 指纹识别模组的制作方法和输入组件的制作方法
KR102615589B1 (ko) * 2017-12-28 2023-12-18 엘지디스플레이 주식회사 지문 인식이 가능한 표시 장치
EP3789912B1 (en) * 2019-07-04 2023-05-17 Shenzhen Goodix Technology Co., Ltd. Fingerprint sensor, fingerprint recognition module and fingerprint recognition system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003083708A (ja) * 2001-09-10 2003-03-19 Nec Corp 指紋センサ及び指紋センサ実装構造並びに該指紋センサを備えた指紋検出器
JP2003282609A (ja) * 2002-03-27 2003-10-03 Fujitsu Ltd 指紋認識用半導体装置及びその製造方法
KR100946074B1 (ko) * 2003-03-31 2010-03-10 후지쯔 마이크로일렉트로닉스 가부시키가이샤 지문 인식용 반도체 장치
JP2011175505A (ja) * 2010-02-25 2011-09-08 Egis Technology Inc 平面式半導体指紋検出装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4024335B2 (ja) * 1996-01-26 2007-12-19 ハリス コーポレイション 集積回路のダイを露出させる開口部を有する集積回路装置とその製造方法
CN101512765A (zh) * 2006-09-15 2009-08-19 富士通微电子株式会社 半导体器件及其制造方法
JP4501995B2 (ja) * 2007-11-20 2010-07-14 ソニー株式会社 表示装置
US8378508B2 (en) * 2010-03-05 2013-02-19 Authentec, Inc. Integrally molded die and bezel structure for fingerprint sensors and the like

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003083708A (ja) * 2001-09-10 2003-03-19 Nec Corp 指紋センサ及び指紋センサ実装構造並びに該指紋センサを備えた指紋検出器
JP2003282609A (ja) * 2002-03-27 2003-10-03 Fujitsu Ltd 指紋認識用半導体装置及びその製造方法
KR100946074B1 (ko) * 2003-03-31 2010-03-10 후지쯔 마이크로일렉트로닉스 가부시키가이샤 지문 인식용 반도체 장치
JP2011175505A (ja) * 2010-02-25 2011-09-08 Egis Technology Inc 平面式半導体指紋検出装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051367A (zh) * 2014-07-01 2014-09-17 苏州晶方半导体科技股份有限公司 指纹识别芯片封装结构和封装方法
CN104051368A (zh) * 2014-07-01 2014-09-17 苏州晶方半导体科技股份有限公司 指纹识别芯片封装结构和封装方法
US10096643B2 (en) 2014-07-01 2018-10-09 China Wafer Level Csp Co., Ltd. Fingerprint recognition chip packaging structure and packaging method
US10108837B2 (en) 2014-07-01 2018-10-23 China Wafer Level Csp Co., Ltd. Fingerprint recognition chip packaging structure and packaging method

Also Published As

Publication number Publication date
KR20130127740A (ko) 2013-11-25
CN104303288A (zh) 2015-01-21
KR101362348B1 (ko) 2014-02-13

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