WO2013169033A1 - Heat radiation device for led lighting apparatus - Google Patents

Heat radiation device for led lighting apparatus Download PDF

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Publication number
WO2013169033A1
WO2013169033A1 PCT/KR2013/004085 KR2013004085W WO2013169033A1 WO 2013169033 A1 WO2013169033 A1 WO 2013169033A1 KR 2013004085 W KR2013004085 W KR 2013004085W WO 2013169033 A1 WO2013169033 A1 WO 2013169033A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
pipe
hub
led lighting
flange
Prior art date
Application number
PCT/KR2013/004085
Other languages
French (fr)
Korean (ko)
Inventor
김용길
Original Assignee
Kim Yong Gil
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kim Yong Gil filed Critical Kim Yong Gil
Publication of WO2013169033A1 publication Critical patent/WO2013169033A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to a heat dissipation device for LED lighting fixtures, and more particularly, it is possible to efficiently heat dissipated heat generated by the LED light fixtures, and also the heat dissipation device for LED lighting fixtures can be easily fixed by inserting the heat dissipation pipe into the heat dissipation hub It is about.
  • Lighting using a light emitting diode that is, a light emitting diode (LED) has recently received great attention as an environmentally friendly technology.
  • the global white LED lighting market has grown by nearly 50% annually since 2006, and it is becoming increasingly realistic that LEDs will replace fluorescent lamps and other lighting fixtures in the future as LED technology advances.
  • the recent LED lighting fixtures tend to reduce the number of LED mounting by using a high-power 1W or more LED package than to arrange a plurality of low-power LEDs.
  • the problem is heat dissipation.
  • a high power LED is used in a luminaire, a large amount of heat is generated in the LED itself due to the high power. If the heat generated from the LED is not properly radiated, that is, the LED is not properly cooled, the forward voltage may be lowered, thereby deteriorating the luminous efficiency and shortening the life of the LED.
  • the trend is prominent because more and more bright lighting is preferred.
  • the problem to be solved of the present invention is to provide a heat dissipation device for an LED lighting fixture that is simple in structure and excellent in heat dissipation efficiency, which can be easily fixed by inserting the heat dissipation pipe into the heat dissipation hub.
  • the present invention is installed in the LED lighting fixture, there is injected a working fluid containing a powder having a medium and infrared emission characteristics for transmitting heat generated from the LED lighting fixture Heat dissipation pipe;
  • the heat dissipation pipe is inserted into the inner close contact, the heat dissipation hub has an opening formed in the vertical direction in one side;
  • it provides a heat radiating device for an LED lighting device comprising a plurality of radiating fins protruding radially on the outer circumferential surface of the radiating hub.
  • the opening is formed in the heat dissipation hub and the heat dissipation hub forms a cylindrical shape with one side open, the diameter of the heat dissipation pipe and the diameter of the heat dissipation hub are exactly matched by an error occurring in the manufacturing process. If not, the heat dissipation pipe can be inserted and fixed relatively easily inside the heat dissipation hub.
  • the heat dissipation device for an LED lighting device is installed in the opening formed in the heat dissipation hub to install a clamping device that can adjust the width of the opening so that the heat dissipation pipe can be fixed tightly fixed inside the heat dissipation hub.
  • the heat dissipation device for an LED lighting device forms a bent portion that is bent in an upward direction at one end or both ends of the pipe body portion so that heat transfer from the heat dissipation pipe to the heat dissipation member can be made quickly.
  • the heat dissipation device for an LED lighting device is formed radially on the outer peripheral surface of the heat dissipation hub, the first heat dissipation fin is formed by a plurality of second heat dissipation fin branched from the first heat dissipation fin to maximize heat dissipation efficiency
  • the heat of the LED luminaire can be quickly released to the outside.
  • FIG. 1 is a perspective view showing a state in which a heat dissipation device for an LED lighting device according to the present invention is installed in the LED lighting device.
  • Figure 2 is a perspective view showing a state in which the heat dissipation device for the LED lighting fixture according to the present invention is coupled to the support unit.
  • FIG. 3 is a perspective view showing in more detail the structure of the heat dissipation hub according to the present invention.
  • FIG. 4 is a perspective view showing a first embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
  • FIG. 5 is a perspective view showing a second embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
  • FIG. 6 is a perspective view showing a third embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
  • FIG. 1 is a perspective view showing a state in which a heat dissipation device for an LED lighting device according to the present invention is installed in the LED lighting device.
  • the heat dissipation device for an LED lighting device includes a heat dissipation pipe 100 and a heat dissipation member 200 coupled to the heat dissipation pipe 100.
  • the heat dissipation pipe 100 is installed in the LED lighting fixture 10 consisting of a high output LED module 11 and 1W or more, and the module plate 12 on which the LED module 11 is installed, the LED lighting fixture 10 It receives heat generated from and heats it to the outside.
  • the heat dissipation pipe 100 is coupled to the support unit 300 is coupled to the screw (B) to the module plate 12 of the LED lighting device 10 to transfer the heat generated by the LED lighting device (10). Receive.
  • Figure 2 is a perspective view showing a state in which the heat dissipation device for the LED lighting fixture according to the invention is coupled to the support unit.
  • the heat dissipation pipe 100 is bent upward in one or both ends of the pipe body 110 and the pipe body 110 coupled to the support unit 300 in a horizontal state. And a bending part 120 extending therefrom. Accordingly, the heat dissipation pipe 100 has an overall 'U' shape.
  • the inside of the heat dissipation pipe 100 is injected with a working fluid including a medium for transferring heat generated by the LED lighting device 10 and a powder having infrared ray emission characteristics.
  • methyl alcohol methyl alcohol, ammonia, methyl chloroform, and the like may be used, but the present invention is not limited thereto, and any liquid may be used as long as it has a lower boiling point than water at room temperature.
  • silicate mineral may be used as the powder, but is not limited thereto, and any mineral may be used as long as it emits infrared rays when heated.
  • the working fluid that is, the medium and the powder injected into the heat dissipation pipe 100 as described above is connected to the support unit 300 in a horizontal state before the LED lighting device 10 starts to dissipate heat.
  • the medium starts to vaporize, and the powder is heated to start emitting infrared rays.
  • the heat is transferred to the bending unit 120 while naturally moving to the bending unit 120 of the heat dissipation pipe 100, and at the same time, the powder and the medium radiate heat. To be delivered to the bending unit 120.
  • the bending part 120 is formed in the heat dissipation pipe 100 so that the heat dissipation pipe 100 has a 'U' shape as a whole, heat transfer from the pipe body part 110 to the bending part 120 is more effective. This will happen.
  • the internal pressure of the heat dissipation pipe 100 is in a state of 0.001 to 0.0001 mmhg, the movement of the vaporized medium in the inside of the heat dissipation pipe 100 and the infrared emission by the powder proceed at a considerably high speed. The heat transfer due to the large will occur.
  • the end of the bending part 120 is naturally sealed by the pipe stopper 130.
  • the support unit 300 to which the heat dissipation pipe 100 is coupled includes a base member 310 and a coupling member 320 that couples the heat dissipation pipe 100 to the bottom surface of the base member 310. It is made to include.
  • the base member 310 includes a bottom plate 311 to which the LED lighting device 10 is directly coupled, and a plurality of side walls 312 protruding at a predetermined interval from the bottom plate 311.
  • the bottom plate 311 is a portion directly coupled to the pipe body portion 110 of the heat dissipation pipe 100, the upper surface is formed with a pipe seating portion (311a) corresponding to the outer surface shape of the pipe body portion (110). .
  • the pipe seating portion 311a is formed to surround a part of the outer surface of the pipe body 110 so that the contact area between the bottom plate 311 and the heat dissipation pipe 100 can be increased as much as possible. Therefore, when the pipe body portion 110 of the heat dissipation pipe 100 is inserted into and fixed to the pipe seating portion 311a, the heat exchange area of the bottom plate 311 and the heat dissipation pipe 100 is increased, and thus the LED lighting device 10 Heat transmitted to the bottom plate 311 is effectively transmitted to the heat dissipation pipe 100.
  • a plurality of heat dissipation spaces 311c are formed in communication with the outside in a state partitioned by the support ribs 311b.
  • the heat dissipation space 311c is formed in the bottom plate 311 and communicates with the outside, the outside air flows through the heat dissipation space 311c, so that heat exchange is performed, and thus, from the LED lighting device 10 to the bottom plate 311. Heat transmitted is released to the outside more quickly.
  • the side wall 312 is a kind of heat dissipation fin that protrudes from the bottom plate 311, and increases the contact area with the outside air, such as the heat dissipation space 311c, from the LED lighting device 10 to the bottom plate 311. It is responsible for the rapid discharge of heat transferred to the outside.
  • the coupling member 320 may include a coupling plate 321 having a depression 321a corresponding to an outer circumferential surface of the pipe body 110 of the heat dissipation pipe 100, and the coupling plate 321 with the base member 310. It includes a fastener 322 coupled to the bottom plate 311 of the).
  • the recessed portion 321a is manufactured to be symmetrical with the pipe seating portion 311a, and thus the pipe body 110 of the heat dissipation pipe 100 is fastened in a state in which the pipe seating portion 311a is inserted into the pipe seating portion 311a.
  • the coupling plate 321 is coupled to the bottom plate 311 by the sphere 322
  • the outer circumferential surface of the pipe body 110 is inserted into the recess 321a and the pipe seating portion 311a is provided. And it is completely wrapped by the depression 321a.
  • the recess 321a increases the overall heat exchange area between the bottom plate 311 and the heat dissipation pipe 100, like the pipe seating portion 311a described above, and transfers the LED luminaire 10 to the bottom plate 311. The heat is to be quickly transferred to the heat radiation pipe (100).
  • the auxiliary heat dissipation fin 323 is formed on the outer surface of the coupling plate 321 in which the depression 321a is formed.
  • the auxiliary heat dissipation fin 323 serves to improve the heat dissipation efficiency by quickly discharging a part of the heat transferred from the LED lighting device 10 to the bottom plate 311 to the outside similar to the side wall 312 described above.
  • the heat dissipation member 200 includes a heat dissipation hub 210 coupled to the heat dissipation pipe 110, and a plurality of heat dissipation fins 220 radially formed on an outer circumferential surface of the heat dissipation hub 210.
  • One end of the heat dissipation pipe 100 is inserted and fixed inside the heat dissipation hub 210.
  • the heat dissipation pipe 210 is disposed inside the heat dissipation hub 210. End of the bending part 120 of 100 is inserted and fixed.
  • FIG. 3 is a perspective view showing in more detail the structure of the heat dissipation hub according to the present invention.
  • an opening 211 is formed at one side of the heat dissipation hub 210 to open one side of the heat dissipation hub 210 in the vertical direction.
  • the heat dissipation hub 210 has a cylindrical shape with one side open.
  • the heat dissipation pipe 100 may not exactly match the diameter of the heat dissipation pipe 100 and the diameter of the heat dissipation hub 210 due to an error occurring in the manufacturing process. That is, the ends of the bending part 120 can be inserted into the heat dissipation hub 210 relatively easily and fixed.
  • the heat dissipation pipe 100 when the diameter of the heat dissipation pipe 100 is larger than that of the heat dissipation hub 210, when the heat dissipation pipe 100 is strongly pushed into the heat dissipation hub 210 by applying an external force, the heat dissipation pipe (opening 211) is opened. 100 is slid into the heat dissipation hub 210, in which case the heat dissipation pipe 100 is inserted into the heat dissipation hub 210 in an interference fit manner so that the heat dissipation pipe 100 is in close contact with the heat dissipation hub 210. It will be kept firmly fixed.
  • the heat dissipation pipe 100 is fixed to the heat dissipation hub 210 by using an adhesive or the like, or inside the heat dissipation pipe 100.
  • the bending part 120 of the heat dissipation pipe 100 may be expanded by supplying a high pressure fluid to the bending part 120 so that the bending part 120 may be tightly fixed inside the heat dissipation hub 210.
  • a separate clamping device (Clamping Device) to adjust the width of the opening 211 to the heat dissipation hub 210 to maintain a state in which the heat dissipation pipe 100 is in close contact with the inner surface of the heat dissipation hub 210 ( 400, 500, 600 (see Figs. 4 to 6) is preferably installed.
  • FIG. 4 is a perspective view showing a first embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
  • the second embodiment 500 of the clamping device according to the present invention is the third, fourth protruding from the outer surface of the heat dissipation hub 210 located on both sides of the opening 211, respectively It consists of a flange (510, 520) and the fixing clip 530 is elastically opened by the external force and fitted to the third, fourth flanges (510, 520) to press and hold the third, fourth flanges (510, 520).
  • the heat dissipation pipe 100 is inserted into the heat dissipation hub 210, and then the fixing clip 530 is opened to open the third and fourth flanges ( Holding the 510 and 520, the width of the opening 211 is narrowed while the third and fourth flanges 510 and 520 are pressed by the fixing clip 530, so that the heat dissipation hub 210 naturally Since the outer surface is pressurized, the heat dissipation pipe 100 is tightly fixed to the inside of the heat dissipation hub 210.
  • FIG. 5 is a perspective view showing a second embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
  • the first embodiment 400 of the clamping device according to the present invention includes first and second flanges protruding from the outer surface of the heat dissipation hub 210 positioned at both sides of the opening 211. 410 and 420, and fastening screws 430 for coupling the first and second flanges 410 and 420.
  • the clamping device is composed of the first and second flanges 410 and 420 and the fastening screw 430, the fastening screw 430 after inserting the heat dissipation pipe 100 into the heat dissipating hub 210 while the fastening screw 430 is loosened.
  • the first and second flanges 410 and 420 are tightened, the width of the opening 211 is narrowed, so that the heat dissipation hub 210 naturally pressurizes the outer surface of the heat dissipation pipe 100. Therefore, the heat dissipation pipe 100 is fixed in close contact with the inside of the heat dissipation hub 210.
  • the nut (N) may be separately coupled to the end of the fastening screw (430) to prevent the fastening screw (430) is released.
  • FIG. 6 is a perspective view showing a third embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
  • the third embodiment 600 of the clamping device according to the present invention is first and second protruding from the outer surface of the heat dissipation hub 210 located on both sides of the opening 211, respectively.
  • the guide rails 610 and 620 and the guide blocks 630 slidingly coupled to the first and second guide rails 610 and 620 to press and hold the first and second guide rails 610 and 620.
  • the heat dissipation pipe 100 is inserted into the heat dissipation hub 210 and the guide block 630 is inserted into the first and second guide rails 610 and 620. If the sliding coupling is inserted into the first and second guide rails 610 and 620 are pressed by the guide convex 630, the width of the opening 211 is narrowed. Accordingly, the heat dissipation hub 210 naturally radiates the heat dissipation pipe 100. Since the outer surface of the heat dissipation pipe 100 is in close contact with the inside of the heat dissipation hub 210 is to be fixed.
  • the clamping device according to the present invention is not limited to the above-described embodiment, and any device may be used as long as the device can adjust the width of the opening 211.
  • the heat dissipation fin 220 includes a first heat dissipation fin 221 radially protruding from the outer circumferential surface of the heat dissipation hub 210, and a plurality of second heat dissipation fins 222 branched from the first heat dissipation fin 221.
  • the first and second heat dissipation fins 221 and 222 serve to discharge heat transferred from the bending part 120 of the heat dissipation pipe 110 to the outside in contact with the outside air.
  • the second heat dissipation fin 222 extends from the first heat dissipation fin 221 to widen the surface area in contact with the outside air so that heat transferred to the heat dissipation fin 220 can be quickly discharged to the outside.
  • the second heat dissipation fin 222 may be selectively formed only on a part of the first heat dissipation fin 221 in consideration of a free space in which the heat dissipation fin 220 is installed.
  • the present invention relates to a heat dissipation device for LED lighting fixtures, because it can be efficiently used to receive heat generated from a heat source to the outside can be used in the streets of public roads, government offices, schools, as well as fishing for fishing Phase can be widely used.

Abstract

The present invention provides a heat radiation device for an LED lighting apparatus, comprising: a heat radiation pipe which is provided in an LED lighting apparatus, and in which a working fluid comprising a medium for transferring the heat generated from the LED lighting apparatus and powder having infrared emission characteristics is injected; a heat radiation hub having the heat radiation pipe which is inserted and comes in close contact with the inside of the heat radiation hub and an opening formed at one side thereof in the vertical direction; and a plurality of heat radiation fins formed to radially protrude from the outer surface of the heat radiation hub.

Description

엘이디 조명기구용 방열장치Radiator for LED Lighting Fixture
본 발명은 엘이디 조명기구용 방열장치에 관한 것으로서, 보다 상세하게는 엘이디 조명기구에서 발생되는 열을 효율적으로 방열시킬 수 있으며, 또한 방열 파이프를 방열 허브에 손쉽게 삽입시켜 고정시킬 수 있는 엘이디 조명기구용 방열장치에 관한 것이다.The present invention relates to a heat dissipation device for LED lighting fixtures, and more particularly, it is possible to efficiently heat dissipated heat generated by the LED light fixtures, and also the heat dissipation device for LED lighting fixtures can be easily fixed by inserting the heat dissipation pipe into the heat dissipation hub It is about.
발광 다이오드, 즉 엘이디(LED: Light Emitting Diode)를 이용한 조명은 최근 친환경 기술로서 큰 관심을 받고 있다. 세계적으로 백색 엘이디 조명 시장은 2006년 이후 연간 50% 가까이 성장해 왔으며, 엘이디 기술의 발전에 따라 향후 엘이디가 형광등 및 기타 다른 광기구를 대체할 것이라는 전망이 점차 현실화되고 있다.Lighting using a light emitting diode, that is, a light emitting diode (LED), has recently received great attention as an environmentally friendly technology. The global white LED lighting market has grown by nearly 50% annually since 2006, and it is becoming increasingly realistic that LEDs will replace fluorescent lamps and other lighting fixtures in the future as LED technology advances.
일반적으로 최근의 엘이디 조명기구는 여러 개의 저출력 엘이디를 배열하는 것보다 고출력형인 1W급 이상의 엘이디 패키지를 사용하여 엘이디 장착 개수를 줄이려는 경향을 나타낸다.In general, the recent LED lighting fixtures tend to reduce the number of LED mounting by using a high-power 1W or more LED package than to arrange a plurality of low-power LEDs.
고출력 엘이디를 조명기구에 이용하는 경우 문제가 되는 것이 방열이다. 고출력 엘이디를 조명기구에 사용하면, 고출력으로 인하여 엘이디 자체에서 많은 양의 열이 발생하게 된다. 상기 엘이디에서 발생하는 열을 적절하게 방열, 즉 상기 엘이디를 적절하게 냉각시키지 못하면 순전압이 떨어져 발광효율이 악화될 뿐만 아니라 상기 엘이디의 수명이 단축되는 문제가 발생하게 된다. 특히, 가로등이나 집어등과 같은 실외 조명의 경우 점점 더 밝은 조명이 선호되고 있기 때문에 경향이 두드러진다. When using high output LEDs in lighting fixtures, the problem is heat dissipation. When a high power LED is used in a luminaire, a large amount of heat is generated in the LED itself due to the high power. If the heat generated from the LED is not properly radiated, that is, the LED is not properly cooled, the forward voltage may be lowered, thereby deteriorating the luminous efficiency and shortening the life of the LED. In particular, in the case of outdoor lighting such as street lamps or picking lamps, the trend is prominent because more and more bright lighting is preferred.
이러한 방열 문제를 해결하기 위하여, 메탈 베이스 기판을 사용하는 엘이디 조명기구들이 많이 제안되고 있다. 그러나 메탈 베이스 기판조차도 방열성을 충분히 확보하기가 어려운 형편이다. 고출력 엘이디용 기판으로는 열전도율이 높은 AlN(Aluminum Nitride)판에 은 페이스트를 인쇄한 세라믹 기판이 널리 알려져 있는데, 제조비용이 높다는 게 단점이다.In order to solve this heat dissipation problem, many LED lighting fixtures using a metal base substrate have been proposed. However, even metal base substrates are difficult to secure sufficient heat dissipation. As a substrate for a high output LED, a ceramic substrate printed with silver paste on an AlN (Aluminum Nitride) plate having high thermal conductivity is widely known, but a disadvantage is that the manufacturing cost is high.
최근에는 엘이디 패키지의 기판 구조를 개선함으로써 방열성을 높이려는 시도가 있다. 다른 접근방법으로서, 엘이디 칩의 기계적 구조를 개선하여 방열성을 높이려는 시도도 발견된다. 그러나, 이러한 방법은 모두 비용이 많이 소요된다는 단점이 있다.Recently, there are attempts to improve heat dissipation by improving the substrate structure of the LED package. As another approach, attempts have been made to improve the heat dissipation by improving the mechanical structure of the LED chip. However, all these methods have the disadvantage of being expensive.
본 발명의 해결하고자 하는 과제는 구조가 간단하면서도 방열효율이 우수하고, 방열 파이프를 방열 허브에 손쉽게 삽입시켜 고정시킬 수 있는 엘이디 조명기구용 방열장치를 제공하는 것이다.The problem to be solved of the present invention is to provide a heat dissipation device for an LED lighting fixture that is simple in structure and excellent in heat dissipation efficiency, which can be easily fixed by inserting the heat dissipation pipe into the heat dissipation hub.
상술한 해결하고자 하는 과제를 달성하기 위하여, 본 발명은 엘이디 조명기구에 설치되며, 내부에는 엘이디 조명기구에서 발생하는 열을 전달하기 위한 매질과 적외선 방출특성을 가지는 분말을 포함하는 작동유체가 주입되어 있는 방열 파이프; 상기 방열 파이프가 내부에 삽입되어 밀착되며, 일측면에는 개구부가 상하 길이방향으로 형성되어 있는 방열 허브; 그리고, 상기 방열 허브의 외주면에 방사상으로 돌출형성되는 복수개의 방열핀을 포함하여 이루어지는 엘이디 조명기구용 방열장치를 제공한다.In order to achieve the above object to be solved, the present invention is installed in the LED lighting fixture, there is injected a working fluid containing a powder having a medium and infrared emission characteristics for transmitting heat generated from the LED lighting fixture Heat dissipation pipe; The heat dissipation pipe is inserted into the inner close contact, the heat dissipation hub has an opening formed in the vertical direction in one side; In addition, it provides a heat radiating device for an LED lighting device comprising a plurality of radiating fins protruding radially on the outer circumferential surface of the radiating hub.
본 발명에 따른 엘이디 조명기구용 방열장치는 방열 허브에 개구부가 형성되어 방열 허브가 일측면이 개방된 원통 형상을 이루므로 제작과정에서 발생하는 오차 등에 의해 방열 파이프의 직경과 방열 허브의 직경이 정확히 일치하지 않더라도 방열 파이프를 비교적 손쉽게 방열 허브 내부에 삽입하여 고정시킬 수 있다.In the heat dissipation device for LED lighting fixture according to the present invention, since the opening is formed in the heat dissipation hub and the heat dissipation hub forms a cylindrical shape with one side open, the diameter of the heat dissipation pipe and the diameter of the heat dissipation hub are exactly matched by an error occurring in the manufacturing process. If not, the heat dissipation pipe can be inserted and fixed relatively easily inside the heat dissipation hub.
또한, 본 발명에 따른 엘이디 조명기구용 방열장치는 방열 허브에 형성된 개구부에 개구부의 폭을 조절할 수 있는 클램핑 장치를 설치하여 방열 파이프가 방열 허브 내부에 견고하게 밀착되어 고정될 수 있게 한다.In addition, the heat dissipation device for an LED lighting device according to the present invention is installed in the opening formed in the heat dissipation hub to install a clamping device that can adjust the width of the opening so that the heat dissipation pipe can be fixed tightly fixed inside the heat dissipation hub.
또한, 본 발명에 따른 엘이디 조명기구용 방열장치는 파이프 몸체부의 일단 또는 양단에 상부방향으로 절곡되어 연장되는 벤딩부를 형성시켜 방열 파이프에서 방열부재로의 열전달이 신속하게 이루어질 수 있도록 한다.In addition, the heat dissipation device for an LED lighting device according to the present invention forms a bent portion that is bent in an upward direction at one end or both ends of the pipe body portion so that heat transfer from the heat dissipation pipe to the heat dissipation member can be made quickly.
또한, 본 발명에 따른 엘이디 조명기구용 방열장치는 방열 허브의 외주면에 제1 방열핀이 방사상으로 형성되고, 상기 제1 방열핀에는 제1 방열핀에서 분지되는 복수개의 제2 방열핀이 형성되므로 방열효율을 극대화하여 엘이디 조명기구의 열을 신속하게 외부로 방출시킬 수 있다.In addition, the heat dissipation device for an LED lighting device according to the present invention, the first heat dissipation fin is formed radially on the outer peripheral surface of the heat dissipation hub, the first heat dissipation fin is formed by a plurality of second heat dissipation fin branched from the first heat dissipation fin to maximize heat dissipation efficiency The heat of the LED luminaire can be quickly released to the outside.
도 1은 본 발명에 따른 엘이디 조명기구용 방열장치가 엘이디 조명기구에 설치된 상태를 나타내는 사시도이다. 1 is a perspective view showing a state in which a heat dissipation device for an LED lighting device according to the present invention is installed in the LED lighting device.
도 2는 본 발명에 따른 엘이디 조명기구용 방열장치가 지지유닛에 결합된 상태를 나타내는 사시도이다.Figure 2 is a perspective view showing a state in which the heat dissipation device for the LED lighting fixture according to the present invention is coupled to the support unit.
도 3은 본 발명에 따른 방열 허브의 구조를 보다 상세히 나타내는 사시도이다.Figure 3 is a perspective view showing in more detail the structure of the heat dissipation hub according to the present invention.
도 4는 본 발명에 따른 방열 허브에 설치되는 클램핑 장치의 제1 실시예를 나타내는 사시도이다.4 is a perspective view showing a first embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
도 5는 본 발명에 따른 방열 허브에 설치되는 클램핑 장치의 제2 실시예를 나타내는 사시도이다.5 is a perspective view showing a second embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
도 6은 본 발명에 따른 방열 허브에 설치되는 클램핑 장치의 제3 실시예를 나타내는 사시도이다.6 is a perspective view showing a third embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
이하, 상기 목적이 구체적으로 실현될 수 있는 본 발명의 바람직한 실시예가 첨부된 도면을 참조하여 설명된다. 본 실시예를 설명함에 있어서, 동일 구성에 대해서는 동일 명칭 및 동일 부호가 사용되며 이에 따른 부가적인 설명은 하기에서 생략된다.Hereinafter, preferred embodiments of the present invention, in which the above object can be specifically realized, are described with reference to the accompanying drawings. In describing the present embodiment, the same name and the same reference numerals are used for the same configuration and additional description thereof will be omitted below.
도 1은 본 발명에 따른 엘이디 조명기구용 방열장치가 엘이디 조명기구에 설치된 상태를 나타내는 사시도이다. 1 is a perspective view showing a state in which a heat dissipation device for an LED lighting device according to the present invention is installed in the LED lighting device.
도 1에 도시된 바와 같이, 본 발명에 따른 엘이디 조명기구용 방열장치는 크게 방열 파이프(100)와, 상기 방열 파이프(100)에 결합되는 방열 부재(200)로 이루어진다.As shown in FIG. 1, the heat dissipation device for an LED lighting device according to the present invention includes a heat dissipation pipe 100 and a heat dissipation member 200 coupled to the heat dissipation pipe 100.
상기 방열 파이프(100)는 1W 급 이상의 고출력 엘이디 모듈(11)과, 상기 엘이디 모듈(11)이 설치되는 모듈 플레이트(12)로 구성되는 엘이디 조명기구(10)에 설치되어 엘이디 조명기구(10)에서 발생하는 열을 전달받아 외부로 방열시키는 역할을 한다.The heat dissipation pipe 100 is installed in the LED lighting fixture 10 consisting of a high output LED module 11 and 1W or more, and the module plate 12 on which the LED module 11 is installed, the LED lighting fixture 10 It receives heat generated from and heats it to the outside.
구체적으로, 상기 방열 파이프(100)는 엘이디 조명기구(10)의 모듈 플레이트(12)에 나사(B) 결합되어 있는 지지유닛(300)에 결합되어 엘이디 조명기구(10)에서 발생하는 열을 전달받는다.Specifically, the heat dissipation pipe 100 is coupled to the support unit 300 is coupled to the screw (B) to the module plate 12 of the LED lighting device 10 to transfer the heat generated by the LED lighting device (10). Receive.
도 2는 본 발명에 따른 엘이디 조명기구용 방열장치가 지지유닛에 결합된 상태를 나타내는 사시도이다.Figure 2 is a perspective view showing a state in which the heat dissipation device for the LED lighting fixture according to the invention is coupled to the support unit.
이러한 방열 파이프(100)는 도 2에 도시된 바와 같이, 지지유닛(300)에 수평상태로 결합되는 파이프 몸체부(110)와, 상기 파이프 몸체부(110)의 일단 또는 양단에서 상부방향으로 절곡되어 연장되는 벤딩부(120)로 이루어진다. 이에 따라 방열 파이프(100)는 전체적으로 'U'자 형상을 이루게 된다. 2, the heat dissipation pipe 100 is bent upward in one or both ends of the pipe body 110 and the pipe body 110 coupled to the support unit 300 in a horizontal state. And a bending part 120 extending therefrom. Accordingly, the heat dissipation pipe 100 has an overall 'U' shape.
이와 같은 방열 파이프(100)의 내부에는 엘이디 조명기구(10)에서 발생하는 열을 전달하기 위한 매질과 적외선 방출특성을 갖는 분말을 포함하는 작동유체가 주입된다.The inside of the heat dissipation pipe 100 is injected with a working fluid including a medium for transferring heat generated by the LED lighting device 10 and a powder having infrared ray emission characteristics.
상기 매질로는 메틸 알코올, 암모니아, 메틸 클로로포름 등이 사용될 수 있지만, 이에 한정되는 것은 아니며 상온에서 물보다 비등점이 낮은 액체라면 어떠한 액체라도 사용될 수 있다. As the medium, methyl alcohol, ammonia, methyl chloroform, and the like may be used, but the present invention is not limited thereto, and any liquid may be used as long as it has a lower boiling point than water at room temperature.
또한, 상기 분말로는 규산염 광물이 사용될 수 있지만, 이에 한정되는 것은 아니며 가열되었을 때 적외선을 방출하는 광물이라면 어떠한 광물이라도 사용될 수 있다. In addition, a silicate mineral may be used as the powder, but is not limited thereto, and any mineral may be used as long as it emits infrared rays when heated.
상기와 같은 방열 파이프(100) 내부에 주입되는 작동유체 즉, 매질과 분말은 엘이디 조명기구(10)가 동작을 시작하여 열을 발산하기 전에는 수평상태로 지지유닛(300)에 결합되어 있는 파이프 몸체부(110)에 위치하다가, 엘이디 조명기구(10)가 동작을 시작하여 열이 방열 파이프(100)로 전달되면 상기 매질은 기화하기 시작하고, 상기 분말은 가열되어 적외선을 방출하기 시작한다.The working fluid, that is, the medium and the powder injected into the heat dissipation pipe 100 as described above is connected to the support unit 300 in a horizontal state before the LED lighting device 10 starts to dissipate heat. Located in the unit 110, when the LED luminaire 10 starts to operate and heat is transferred to the heat dissipation pipe 100, the medium starts to vaporize, and the powder is heated to start emitting infrared rays.
이때, 기화된 매질은 상부로 이동하려는 성질을 가지기 때문에 자연히 방열 파이프(100)의 벤딩부(120)로 이동하면서 열을 상기 벤딩부(120)로 전달시키며, 이와 동시에 상기 분말과 상기 매질은 복사열을 상기 벤딩부(120)로 전달하게 된다. 결과적으로, 상기 방열 파이프(100)에 벤딩부(120)가 형성되어 방열 파이프(100)가 전체적으로 'U'자 형상을 이루게 되면 상기 파이프 몸체부(110)에서 벤딩부(120)로 보다 효과적인 열전달이 일어나게 된다.At this time, since the vaporized medium has a property to move to the upper portion, the heat is transferred to the bending unit 120 while naturally moving to the bending unit 120 of the heat dissipation pipe 100, and at the same time, the powder and the medium radiate heat. To be delivered to the bending unit 120. As a result, when the bending part 120 is formed in the heat dissipation pipe 100 so that the heat dissipation pipe 100 has a 'U' shape as a whole, heat transfer from the pipe body part 110 to the bending part 120 is more effective. This will happen.
특히, 상기 방열 파이프(100)의 내부압력이 0.001 ~ 0.0001mmhg 의 상태에 있기 때문에 상기 방열 파이프(100)의 내부에서 기화된 매질의 이동 및 분말에 의한 적외선 방출은 상당히 빠른 속도로 진행되므로 상기 복사열로 인한 열전달이 크게 일어나게 된다. 물론, 기화된 매질 및 분말이 방열 파이프(100) 외부로 빠져나가는 것을 방지하기 위해 당연히 벤딩부(120)의 끝단은 파이프 마개(130)에 의해 밀봉되어져 있다. In particular, since the internal pressure of the heat dissipation pipe 100 is in a state of 0.001 to 0.0001 mmhg, the movement of the vaporized medium in the inside of the heat dissipation pipe 100 and the infrared emission by the powder proceed at a considerably high speed. The heat transfer due to the large will occur. Of course, in order to prevent the vaporized medium and powder from escaping to the outside of the heat dissipation pipe 100, the end of the bending part 120 is naturally sealed by the pipe stopper 130.
한편, 상술한 방열 파이프(100)가 결합되는 상기 지지유닛(300)은 베이스 부재(310)와, 상기 베이스 부재(310)의 하면에 상기 방열 파이프(100)를 결합시키는 결합부재(320)를 포함하여 이루어진다.Meanwhile, the support unit 300 to which the heat dissipation pipe 100 is coupled includes a base member 310 and a coupling member 320 that couples the heat dissipation pipe 100 to the bottom surface of the base member 310. It is made to include.
상기 베이스 부재(310)는 엘이디 조명기구(10)가 직접 결합되는 바닥 플레이트(311)와, 상기 바닥 플레이트(311)에서 일정간격을 가지면서 돌출되는 복수개의 측벽(312)을 포함하여 이루어진다.The base member 310 includes a bottom plate 311 to which the LED lighting device 10 is directly coupled, and a plurality of side walls 312 protruding at a predetermined interval from the bottom plate 311.
상기 바닥 플레이트(311)는 방열 파이프(100)의 파이프 몸체부(110)가 직접 결합되는 부분으로, 상면에는 상기 파이프 몸체부(110) 외측면 형상과 대응되는 파이프 안착부(311a)가 형성된다. The bottom plate 311 is a portion directly coupled to the pipe body portion 110 of the heat dissipation pipe 100, the upper surface is formed with a pipe seating portion (311a) corresponding to the outer surface shape of the pipe body portion (110). .
상기 파이프 안착부(311a)는 파이프 몸체부(110)의 외면 일부를 감싸는 형태로 제작되어 바닥 플레이트(311)와 방열 파이프(100)의 접촉면적이 최대한 증가될 수 있도록 한다. 따라서 방열 파이프(100)의 파이프 몸체부(110)가 파이프 안착부(311a)에 삽입되어 고정되면, 바닥 플레이트(311)와 방열 파이프(100)의 열교환면적이 증가되어 엘이디 조명기구(10)로부터 상기 바닥 플레이트(311)로 전달되는 열이 방열 파이프(100)로 효과적으로 전달되게 된다.The pipe seating portion 311a is formed to surround a part of the outer surface of the pipe body 110 so that the contact area between the bottom plate 311 and the heat dissipation pipe 100 can be increased as much as possible. Therefore, when the pipe body portion 110 of the heat dissipation pipe 100 is inserted into and fixed to the pipe seating portion 311a, the heat exchange area of the bottom plate 311 and the heat dissipation pipe 100 is increased, and thus the LED lighting device 10 Heat transmitted to the bottom plate 311 is effectively transmitted to the heat dissipation pipe 100.
이러한 바닥 플레이트(311)의 내부에는 지지 리브(311b)에 의하여 구획된 상태로 외부와 연통되는 복수개의 방열공간(311c)이 형성된다. 바닥 플레이트(311) 내부에 외부와 연통되는 방열공간(311c)이 형성되면, 상기 방열공간(311c)을 통해 외부 공기가 유입되어 열교환이 이루어지므로 엘이디 조명기구(10)에서 바닥 플레이트(311)로 전달되는 열이 보다 신속하게 외부로 방출되게 된다.Inside the bottom plate 311, a plurality of heat dissipation spaces 311c are formed in communication with the outside in a state partitioned by the support ribs 311b. When the heat dissipation space 311c is formed in the bottom plate 311 and communicates with the outside, the outside air flows through the heat dissipation space 311c, so that heat exchange is performed, and thus, from the LED lighting device 10 to the bottom plate 311. Heat transmitted is released to the outside more quickly.
상기 측벽(312)은 바닥 플레이트(311)에 돌출형성되는 일종의 방열핀으로서, 상술한 방열공간(311c)과 같이 외부 공기와의 접촉면적을 증가시켜 엘이디 조명기구(10)로부터 바닥 플레이트(311)로 전달되는 열이 외부로 신속하게 배출될 수 있도록 하는 역할을 한다.The side wall 312 is a kind of heat dissipation fin that protrudes from the bottom plate 311, and increases the contact area with the outside air, such as the heat dissipation space 311c, from the LED lighting device 10 to the bottom plate 311. It is responsible for the rapid discharge of heat transferred to the outside.
상기 결합부재(320)는 상기 방열 파이프(100)의 파이프 몸체부(110) 외주면과 대응되는 함몰부(321a)가 형성된 결합 플레이트(321)와, 상기 결합플레이트(321)를 상기 베이스 부재(310)의 바닥 플레이트(311)에 결합시키는 체결구(322)를 포함하여 이루어진다.The coupling member 320 may include a coupling plate 321 having a depression 321a corresponding to an outer circumferential surface of the pipe body 110 of the heat dissipation pipe 100, and the coupling plate 321 with the base member 310. It includes a fastener 322 coupled to the bottom plate 311 of the).
상기 함몰부(321a)는 상기 파이프 안착부(311a)와 서로 대칭되는 형상으로 제작되며, 이에 따라 방열 파이프(100)의 파이프 몸체부(110)가 파이프 안착부(311a)에 삽입된 상태로 체결구(322)에 의해 결합 플레이트(321)가 바닥 플레이트(311)에 결합되면 함몰부(321a)에 파이프 몸체부(110)가 삽입되면서 파이프 몸체부(110)의 외주면은 파이프 안착부(311a) 및 함몰부(321a)에 의해 완전하게 감싸여 진다.The recessed portion 321a is manufactured to be symmetrical with the pipe seating portion 311a, and thus the pipe body 110 of the heat dissipation pipe 100 is fastened in a state in which the pipe seating portion 311a is inserted into the pipe seating portion 311a. When the coupling plate 321 is coupled to the bottom plate 311 by the sphere 322, the outer circumferential surface of the pipe body 110 is inserted into the recess 321a and the pipe seating portion 311a is provided. And it is completely wrapped by the depression 321a.
이러한 상기 함몰부(321a)는 상술한 파이프 안착부(311a)와 같이 바닥 플레이트(311)와 방열 파이프(100)의 전체적인 열교환 면적을 증가시켜 엘이디 조명기구(10)로부터 바닥 플레이트(311)로 전달되는 열이 방열 파이프(100)로 신속하게 전달될 수 있도록 한다.The recess 321a increases the overall heat exchange area between the bottom plate 311 and the heat dissipation pipe 100, like the pipe seating portion 311a described above, and transfers the LED luminaire 10 to the bottom plate 311. The heat is to be quickly transferred to the heat radiation pipe (100).
여기서, 상기 함몰부(321a)가 형성되는 결합 플레이트(321)의 외면에는 보조 방열핀(323)이 형성됨이 바람직하다. 상기 보조 방열핀(323)은 상술한 측벽(312)과 유사하게 엘이디 조명기구(10)로부터 바닥 플레이트(311)로 전달되는 열의 일부를 외부로 신속하게 배출시켜 방열 효율을 향상시키는 역할을 한다. Here, it is preferable that the auxiliary heat dissipation fin 323 is formed on the outer surface of the coupling plate 321 in which the depression 321a is formed. The auxiliary heat dissipation fin 323 serves to improve the heat dissipation efficiency by quickly discharging a part of the heat transferred from the LED lighting device 10 to the bottom plate 311 to the outside similar to the side wall 312 described above.
상기 방열 부재(200)는 방열 파이프(110)와 결합되는 방열 허브(210)와, 상기 방열 허브(210)의 외주면에 방사상으로 형성되는 복수개의 방열핀(220)으로 이루어진다.The heat dissipation member 200 includes a heat dissipation hub 210 coupled to the heat dissipation pipe 110, and a plurality of heat dissipation fins 220 radially formed on an outer circumferential surface of the heat dissipation hub 210.
상기 방열 허브(210)의 내부에는 방열 파이프(100)의 일단이 삽입되어 고정되며, 상술한 바와 같이 방열 파이프(100)에 벤딩부(120)가 형성되면 방열 허브(210)의 내부에는 방열 파이프(100)의 벤딩부(120) 끝단이 삽입되어 고정되게 된다.One end of the heat dissipation pipe 100 is inserted and fixed inside the heat dissipation hub 210. When the bending part 120 is formed in the heat dissipation pipe 100 as described above, the heat dissipation pipe 210 is disposed inside the heat dissipation hub 210. End of the bending part 120 of 100 is inserted and fixed.
도 3은 본 발명에 따른 방열 허브의 구조를 보다 상세히 나타내는 사시도이다.Figure 3 is a perspective view showing in more detail the structure of the heat dissipation hub according to the present invention.
이러한 방열 허브(210)의 일측면에는 도 3에 도시된 바와 같이, 상하 길이방향으로 방열 허브(210)의 일측면을 개방시키는 개구부(211)가 형성된다. 따라서, 상기 방열 허브(210)는 일측면이 개방된 원통 형상을 이루게 된다.As shown in FIG. 3, an opening 211 is formed at one side of the heat dissipation hub 210 to open one side of the heat dissipation hub 210 in the vertical direction. Thus, the heat dissipation hub 210 has a cylindrical shape with one side open.
이와 같이 방열 허브(210)가 일측면이 개방된 형상을 가지게 되면 제작과정에서 발생하는 오차 등에 의해 방열 파이프(100)의 직경과 방열 허브(210)의 직경이 정확히 일치하지 않더라도 방열 파이프(100) 즉, 벤딩부(120) 끝단을 비교적 손쉽게 방열 허브(210) 내부에 삽입하여 고정시킬 수 있게 된다.As such, when the heat dissipation hub 210 has an open shape on one side, the heat dissipation pipe 100 may not exactly match the diameter of the heat dissipation pipe 100 and the diameter of the heat dissipation hub 210 due to an error occurring in the manufacturing process. That is, the ends of the bending part 120 can be inserted into the heat dissipation hub 210 relatively easily and fixed.
예를 들어, 방열 파이프(100)의 직경이 방열 허브(210)에 비해 큰 경우 외력을 가해 방열 파이프(100)를 방열 허브(210) 내부로 강하게 밀어넣으면 개구부(211)가 벌어지면서 방열 파이프(100)가 방열 허브(210) 내부로 미끄러져 들어가게 되고, 이 경우 방열 파이프(100)는 방열 허브(210) 내부에 억지끼움 방식으로 삽입되므로 방열 파이프(100)는 방열 허브(210) 내부에 밀착되어 견고하게 고정된 상태를 유지하게 된다.For example, when the diameter of the heat dissipation pipe 100 is larger than that of the heat dissipation hub 210, when the heat dissipation pipe 100 is strongly pushed into the heat dissipation hub 210 by applying an external force, the heat dissipation pipe (opening 211) is opened. 100 is slid into the heat dissipation hub 210, in which case the heat dissipation pipe 100 is inserted into the heat dissipation hub 210 in an interference fit manner so that the heat dissipation pipe 100 is in close contact with the heat dissipation hub 210. It will be kept firmly fixed.
물론, 방열 파이프(100)의 직경이 방열 허브(210)에 비해 작거나 거의 동일한 경우 등에는 접착제 등을 이용해 방열 파이프(100)를 방열 허브(210) 내부에 고정하거나 또는 방열 파이프(100) 내부에 고압의 유체를 공급하여 방열 파이프(100)의 벤딩부(120)가 확관되도록 함으로써 벤딩부(120)가 방열 허브(210) 내부에 밀착고정되게 할 수도 있다.Of course, when the diameter of the heat dissipation pipe 100 is smaller or substantially the same as that of the heat dissipation hub 210, the heat dissipation pipe 100 is fixed to the heat dissipation hub 210 by using an adhesive or the like, or inside the heat dissipation pipe 100. The bending part 120 of the heat dissipation pipe 100 may be expanded by supplying a high pressure fluid to the bending part 120 so that the bending part 120 may be tightly fixed inside the heat dissipation hub 210.
하지만, 접착제를 이용해 방열 파이프(100)를 방열 허브(210)의 내면에 고정시킬 경우 벤딩부(120)로 전달되는 열에 의해 접착제의 접착력이 약화될 위험이 있으며, 또한 방열 파이프(100) 내부에 고압의 유체를 공급하여 벤딩부(120)를 확관시킬 경우에는 작업시간이 많이 소요되고 고압의 유체를 다루어야 하므로 안전사고가 발생할 위험이 상존한다. However, when the heat dissipation pipe 100 is fixed to the inner surface of the heat dissipation hub 210 by using an adhesive, there is a risk that the adhesive force of the adhesive is weakened by the heat transferred to the bending part 120, and also inside the heat dissipation pipe 100. When expanding the bending unit 120 by supplying a high pressure fluid, a lot of work time is required and a high pressure fluid must be handled, so there is a risk of a safety accident.
따라서, 상기 방열 허브(210)에는 개구부(211)의 폭을 조절하여 방열 파이프(100)가 방열 허브(210)의 내면에 밀착고정된 상태를 유지할 수 있도록 하는 별도의 클램핑 장치(Clamping Device)(400,500,600)(도 4 내지 도 6 참조)가 설치됨이 바람직하다.Therefore, a separate clamping device (Clamping Device) to adjust the width of the opening 211 to the heat dissipation hub 210 to maintain a state in which the heat dissipation pipe 100 is in close contact with the inner surface of the heat dissipation hub 210 ( 400, 500, 600 (see Figs. 4 to 6) is preferably installed.
도 4는 본 발명에 따른 방열 허브에 설치되는 클램핑 장치의 제1 실시예를 나타내는 사시도이다.4 is a perspective view showing a first embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
한편, 도 4에 도시된 바와 같이, 본 발명에 따른 클램핑 장치의 제2 실시예(500)는 개구부(211)의 양측에 위치하는 방열 허브(210)의 외면에서 각각 돌출형성되는 제3, 4 플랜지(510,520)와, 외력에 의해 탄성적으로 벌어지며 상기 제3, 4 플랜지(510,520)에 끼워져 상기 제3, 4 플랜지(510,520)를 가압하여 잡아주는 고정용 클립(530)으로 이루어진다.On the other hand, as shown in Figure 4, the second embodiment 500 of the clamping device according to the present invention is the third, fourth protruding from the outer surface of the heat dissipation hub 210 located on both sides of the opening 211, respectively It consists of a flange (510, 520) and the fixing clip 530 is elastically opened by the external force and fitted to the third, fourth flanges (510, 520) to press and hold the third, fourth flanges (510, 520).
클램핑 장치가 제3, 4 플랜지(510,520)와 고정용 클립(530)으로 이루어질 경우 방열 파이프(100)를 방열 허브(210)에 삽입한 후 고정용 클립(530)을 벌려 제3, 4 플랜지(510,520)를 잡아주면 제3, 4 플랜지(510,520)가 고정용 클립(530)에 의해 가압되면서 개구부(211)의 폭이 좁혀지게 되고, 이에 따라 방열 허브(210)는 자연히 방열 파이프(100)의 외면을 가압하게 되므로 방열 파이프(100)는 방열 허브(210)의 내부에 밀착되어 고정되게 된다. When the clamping device is composed of the third and fourth flanges 510 and 520 and the fixing clip 530, the heat dissipation pipe 100 is inserted into the heat dissipation hub 210, and then the fixing clip 530 is opened to open the third and fourth flanges ( Holding the 510 and 520, the width of the opening 211 is narrowed while the third and fourth flanges 510 and 520 are pressed by the fixing clip 530, so that the heat dissipation hub 210 naturally Since the outer surface is pressurized, the heat dissipation pipe 100 is tightly fixed to the inside of the heat dissipation hub 210.
도 5는 본 발명에 따른 방열 허브에 설치되는 클램핑 장치의 제2 실시예를 나타내는 사시도이다.5 is a perspective view showing a second embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
도 4에 도시된 바와 같이, 본 발명에 따른 클램핑 장치의 제1 실시예(400)는 개구부(211)의 양측에 위치하는 방열 허브(210)의 외면에서 각각 돌출형성되는 제1, 2 플랜지(410,420)와, 상기 제1, 2 플랜지(410,420)를 결합시키는 체결나사(430)로 이루어진다.As shown in FIG. 4, the first embodiment 400 of the clamping device according to the present invention includes first and second flanges protruding from the outer surface of the heat dissipation hub 210 positioned at both sides of the opening 211. 410 and 420, and fastening screws 430 for coupling the first and second flanges 410 and 420.
클램핑 장치가 제1, 2 플랜지(410,420)와 체결나사(430)로 이루어질 경우 체결나사(430)를 느슨하게 한 상태에서 방열 파이프(100)를 방열 허브(210)에 삽입한 후 체결나사(430)를 조이면 제1, 2 플랜지(410,420)가 체결나사(430)에 의해 결합되면서 개구부(211)의 폭이 좁혀지게 되고, 이에 따라 방열 허브(210)는 자연히 방열 파이프(100)의 외면을 가압하게 되므로 방열 파이프(100)는 방열 허브(210)의 내부에 밀착되어 고정되게 된다. When the clamping device is composed of the first and second flanges 410 and 420 and the fastening screw 430, the fastening screw 430 after inserting the heat dissipation pipe 100 into the heat dissipating hub 210 while the fastening screw 430 is loosened. When the first and second flanges 410 and 420 are tightened, the width of the opening 211 is narrowed, so that the heat dissipation hub 210 naturally pressurizes the outer surface of the heat dissipation pipe 100. Therefore, the heat dissipation pipe 100 is fixed in close contact with the inside of the heat dissipation hub 210.
물론, 체결나사(430)가 풀리는 것을 방지하기 위해 체결나사(430)의 끝단에는 너트(N)가 별도로 결합될 수도 있다.Of course, the nut (N) may be separately coupled to the end of the fastening screw (430) to prevent the fastening screw (430) is released.
도 6은 본 발명에 따른 방열 허브에 설치되는 클램핑 장치의 제3 실시예를 나타내는 사시도이다.6 is a perspective view showing a third embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
한편, 도 6에 도시된 바와 같이, 본 발명에 따른 클램핑 장치의 제3 실시예(600)는 개구부(211)의 양측에 위치하는 방열 허브(210)의 외면에서 각각 돌출형성되는 제1, 2 가이드 레일(610,620)과, 상기 제1, 2 가이드 레일(610,620)에 슬라이딩 결합되어 제1, 2 가이드 레일(610,620)을 가압하여 잡아주는 가이드 블록(630)으로 이루어진다.On the other hand, as shown in Figure 6, the third embodiment 600 of the clamping device according to the present invention is first and second protruding from the outer surface of the heat dissipation hub 210 located on both sides of the opening 211, respectively The guide rails 610 and 620 and the guide blocks 630 slidingly coupled to the first and second guide rails 610 and 620 to press and hold the first and second guide rails 610 and 620.
클램핑 장치가 제1, 2 가이드 레일(610,620)과 가이드 블록(630)으로 이루어질 경우 방열 파이프(100)를 방열 허브(210)에 삽입한 후 가이드 블록(630)을 제1, 2 가이드 레일(610,620)에 끼워 슬라이딩 결합시키면 제1, 2 가이드 레일(610,620)이 가이드 볼록(630)에 의해 가압되어 개구부(211)의 폭이 좁혀지게 되고, 이에 따라 방열 허브(210)는 자연히 방열 파이프(100)의 외면을 가압하게 되므로 방열 파이프(100)는 방열 허브(210)의 내부에 밀착되어 고정되게 된다. When the clamping device is composed of the first and second guide rails 610 and 620 and the guide block 630, the heat dissipation pipe 100 is inserted into the heat dissipation hub 210 and the guide block 630 is inserted into the first and second guide rails 610 and 620. If the sliding coupling is inserted into the first and second guide rails 610 and 620 are pressed by the guide convex 630, the width of the opening 211 is narrowed. Accordingly, the heat dissipation hub 210 naturally radiates the heat dissipation pipe 100. Since the outer surface of the heat dissipation pipe 100 is in close contact with the inside of the heat dissipation hub 210 is to be fixed.
이와 같이 상기 클램징 장치의 구조는 매우 다양한 변형이 가능하므로 본 발명에 따른 클램핑 장치는 상술한 실시예에 한정되지 않으며 개구부(211)의 폭을 조절할 수 있는 장치라면 어떠한 장치라도 사용될 수 있다.As such, since the structure of the clamping device can be modified in various ways, the clamping device according to the present invention is not limited to the above-described embodiment, and any device may be used as long as the device can adjust the width of the opening 211.
상기 방열핀(220)은 방열 허브(210)의 외주면에서 방사상으로 돌출형성되는 제1 방열핀(221)과, 상기 제1 방열핀(221)에서 분지되는 복수개의 제2 방열핀(222)으로 이루어진다.The heat dissipation fin 220 includes a first heat dissipation fin 221 radially protruding from the outer circumferential surface of the heat dissipation hub 210, and a plurality of second heat dissipation fins 222 branched from the first heat dissipation fin 221.
상기 제1, 2 방열핀(221,222)은 외부 공기와 접촉하여 방열 파이프(110)의 벤딩부(120)로부터 전달되는 열을 외부로 배출시키는 역할을 한다. 특히, 상기 제2 방열핀(222)은 제1 방열핀(221)에서 연장되어 외부 공기와 접촉하는 표면적을 넓혀 주어 방열핀(220)으로 전달되는 열이 신속하게 외부로 배출될 수 있도록 한다. 이러한 상기 제2 방열핀(222)은 방열핀(220)이 설치되는 여유 공간 등을 고려하여 제1 방열핀(221)의 일부에만 선택적으로 형성될 수 있다.The first and second heat dissipation fins 221 and 222 serve to discharge heat transferred from the bending part 120 of the heat dissipation pipe 110 to the outside in contact with the outside air. In particular, the second heat dissipation fin 222 extends from the first heat dissipation fin 221 to widen the surface area in contact with the outside air so that heat transferred to the heat dissipation fin 220 can be quickly discharged to the outside. The second heat dissipation fin 222 may be selectively formed only on a part of the first heat dissipation fin 221 in consideration of a free space in which the heat dissipation fin 220 is installed.
이상 설명한 내용을 통해 당업자라면 본 발명의 기술사상을 일탈하지 아니하는 범위에서 다양한 변경 및 수정이 가능함을 알 수 있을 것이다. 따라서, 본 발명의 기술적 범위는 명세서의 상세한 설명에 기재된 내용으로 한정되는 것이 아니라 특허청구범위에 의해 정하여 져야만 할 것이다.Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.
본 발명은 엘이디 조명기구용 방열장치에 관한 것으로서, 열원에서 발생하는 열을 전달받아 외부로 효율적으로 방출할 수 있음으로 일반도로, 관공서, 학교 등의 가로등뿐만 아니라 고기잡이를 위한 집어등에 사용될 수 있으므로 산업상 널리 이용될 수 있다.The present invention relates to a heat dissipation device for LED lighting fixtures, because it can be efficiently used to receive heat generated from a heat source to the outside can be used in the streets of public roads, government offices, schools, as well as fishing for fishing Phase can be widely used.

Claims (7)

  1. 엘이디 조명기구에 설치되며, 내부에는 상기 엘이디 조명기구에서 발생하는 열을 전달하기 위한 매질과 적외선 방출특성을 가지는 분말을 포함하는 작동유체가 주입되어 있는 방열 파이프;A heat dissipation pipe installed in the LED luminaire, into which a working fluid containing a medium for transferring heat generated by the LED luminaire and a powder having infrared emission characteristics are injected;
    상기 방열 파이프가 내부에 삽입되어 밀착되며, 일측면에는 개구부가 상하 길이방향으로 형성되어 있는 방열 허브; 그리고,The heat dissipation pipe is inserted into the inner close contact, the heat dissipation hub has an opening formed in the vertical direction in one side; And,
    상기 방열 허브의 외주면에 방사상으로 돌출형성되는 복수개의 방열핀을 포함하며,It includes a plurality of radiating fins protruding radially on the outer peripheral surface of the radiating hub,
    상기 방열 허브에는 상기 개구부의 폭을 조절하여 상기 방열 파이프가 상기 방열 허브의 내면에 밀착고정된 상태를 유지할 수 있도록 하는 클램핑 장치가 설치되는 것을 특징으로 하는 엘이디 조명기구용 방열장치.The heat dissipation device for an LED lighting device, characterized in that a clamping device is installed in the heat dissipation hub to adjust the width of the opening to maintain the heat dissipation pipe in close contact with the inner surface of the heat dissipation hub.
  2. 제1 항에 있어서,The method of claim 1,
    상기 클램핑 장치는 상기 개구부의 양측에 위치하는 상기 방열 허브의 외면에서 각각 돌출형성되는 제1 플랜지 및 제2 플랜지와, 상기 제1 플랜지 및 상기 2 플랜지를 결합시키는 체결나사로 이루어지는 것을 특징으로 하는 엘이디 조명기구용 방열장치.The clamping device is an LED illuminator, characterized in that the first flange and the second flange protruding from the outer surface of the heat dissipation hub located on both sides of the opening and a fastening screw for coupling the first flange and the second flange Old heat sink.
  3. 제1 항에 있어서,The method of claim 1,
    상기 클램핑 장치는 상기 개구부의 양측에 위치하는 상기 방열 허브의 외면에서 각각 돌출형성되는 제3 플랜지 및 제4 플랜지와, 외력에 의해 탄성적으로 벌어지며 상기 제3 플랜지 및 상기 제4 플랜지를 끼워져 상기 제3 플랜지 및 상기 제4 플랜지를 가압하여 잡아주는 고정용 클립으로 이루어지는 것을 특징으로 하는 엘이디 조명기구용 방열장치.The clamping device is elastically opened by an external force and a third flange and a fourth flange protruding from the outer surfaces of the heat dissipation hubs located at both sides of the opening, respectively, and the third flange and the fourth flange are fitted to each other. LED lighting fixture heat dissipation device, characterized in that consisting of a fixing clip for pressing and holding the third flange and the fourth flange.
  4. 제1 항에 있어서,The method of claim 1,
    상기 클램핑 장치는 상기 개구부의 양측에 위치하는 상기 방열 허브의 외면에서 각각 돌출형성되는 제1 가이드레일 및 제2 가이드 레일과, 상기 제1 가이드레일 및 상기 제2 가이드 레일에 슬라이딩 결합되어 상기 제1 가이드레일 및 상기 제2 가이드 레일을 가압하는 가이드 블록으로 이루어지는 것을 특징으로 하는 엘이디 조명기구용 방열장치.The clamping device is slidably coupled to the first guide rail and the second guide rail, respectively protruding from the outer surfaces of the heat dissipation hubs positioned at both sides of the opening, and the first guide rail and the second guide rail. LED radiator for heat dissipation device comprising a guide block and a guide block for pressing the second guide rail.
  5. 제1 항에 있어서,The method of claim 1,
    상기 방열핀은 상기 방열 허브의 외주면에서 방사상으로 돌출형성되는 제1 방열핀과, 상기 제1 방열핀에서 분지되는 복수개의 제2 방열핀으로 이루어지는 것을 특징으로 하는 엘이디 조명기구용 방열장치. The heat dissipation fin is a heat dissipation device for an LED lighting device, characterized in that consisting of a first heat dissipation fin radially protruding from the outer peripheral surface of the heat dissipation hub, and a plurality of second heat dissipation fins branched from the first heat dissipation fin.
  6. 제1 항에 있어서,The method of claim 1,
    상기 방열 파이프는 파이프 몸체부와, 상기 파이프 몸체부의 일단 또는 양단에서 상부방향으로 절곡되어 연장되는 벤딩부로 이루어지는 것을 특징으로 하는 엘이디 조명기구용 방열장치.The heat dissipation pipe is a heat dissipation device for an LED lighting device, characterized in that consisting of a pipe body portion and a bending portion extending in an upward direction from one end or both ends of the pipe body portion.
  7. 제1 항에 있어서,The method of claim 1,
    상기 방열 파이프는 엘이디 조명기구에 결합되어 있는 지지유닛에 결합되며,The heat dissipation pipe is coupled to a support unit coupled to the LED lighting fixture,
    상기 지지유닛은 상기 방열 파이프의 외측면 형상과 대응되는 파이프 안착부가 형성된 베이스 부재와, 상기 베이스 부재에 상기 방열파이프를 결합시키는 결합부재를 포함하여 이루어지는 것을 특징으로 하는 엘이디 조명기구용 방열장치.The support unit includes a base member having a pipe seating portion corresponding to the outer surface shape of the heat dissipation pipe, and a coupling member for coupling the heat dissipation pipe to the base member.
PCT/KR2013/004085 2012-05-11 2013-05-09 Heat radiation device for led lighting apparatus WO2013169033A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016090069A1 (en) * 2014-12-03 2016-06-09 GE Lighting Solutions, LLC Led lamps for retrofit on high wattage metal halide ballasts
US9775199B2 (en) 2014-07-31 2017-09-26 GE Lighting Solutions, LLC Light emitting diode retrofit lamp for high intensity discharge ballast
EP3343162A1 (en) * 2017-01-03 2018-07-04 Quanta Computer Inc. Heat dissipation apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101464519B1 (en) * 2013-04-23 2014-11-24 주식회사 탑솔 Heat radiating device of contact and assembly type for pipe

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990037855U (en) * 1998-03-13 1999-10-15 구효회 Heatsink Fixtures on Heatpipes
KR100944986B1 (en) * 2009-08-04 2010-03-05 이주동 Cooling device for led lamp
KR20100005391U (en) * 2008-11-17 2010-05-26 임파워 옵트로닉스 코포레이션 Led lighting fixture
KR20110020491A (en) * 2009-08-24 2011-03-03 삼성전기주식회사 Radiating package module in exothermic element
KR20110072651A (en) * 2009-12-23 2011-06-29 김동섭 Led light module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990037855U (en) * 1998-03-13 1999-10-15 구효회 Heatsink Fixtures on Heatpipes
KR20100005391U (en) * 2008-11-17 2010-05-26 임파워 옵트로닉스 코포레이션 Led lighting fixture
KR100944986B1 (en) * 2009-08-04 2010-03-05 이주동 Cooling device for led lamp
KR20110020491A (en) * 2009-08-24 2011-03-03 삼성전기주식회사 Radiating package module in exothermic element
KR20110072651A (en) * 2009-12-23 2011-06-29 김동섭 Led light module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9775199B2 (en) 2014-07-31 2017-09-26 GE Lighting Solutions, LLC Light emitting diode retrofit lamp for high intensity discharge ballast
WO2016090069A1 (en) * 2014-12-03 2016-06-09 GE Lighting Solutions, LLC Led lamps for retrofit on high wattage metal halide ballasts
US9989240B2 (en) 2014-12-03 2018-06-05 GE Lighting Solutions, LLC LED lamps for retrofit on high wattage metal halide ballasts
EP3343162A1 (en) * 2017-01-03 2018-07-04 Quanta Computer Inc. Heat dissipation apparatus

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