WO2013169033A1 - Dispositif de rayonnement de chaleur pour appareil d'éclairage à diodes électroluminescentes - Google Patents

Dispositif de rayonnement de chaleur pour appareil d'éclairage à diodes électroluminescentes Download PDF

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Publication number
WO2013169033A1
WO2013169033A1 PCT/KR2013/004085 KR2013004085W WO2013169033A1 WO 2013169033 A1 WO2013169033 A1 WO 2013169033A1 KR 2013004085 W KR2013004085 W KR 2013004085W WO 2013169033 A1 WO2013169033 A1 WO 2013169033A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
pipe
hub
led lighting
flange
Prior art date
Application number
PCT/KR2013/004085
Other languages
English (en)
Korean (ko)
Inventor
김용길
Original Assignee
Kim Yong Gil
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kim Yong Gil filed Critical Kim Yong Gil
Publication of WO2013169033A1 publication Critical patent/WO2013169033A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a heat dissipation device for LED lighting fixtures, and more particularly, it is possible to efficiently heat dissipated heat generated by the LED light fixtures, and also the heat dissipation device for LED lighting fixtures can be easily fixed by inserting the heat dissipation pipe into the heat dissipation hub It is about.
  • Lighting using a light emitting diode that is, a light emitting diode (LED) has recently received great attention as an environmentally friendly technology.
  • the global white LED lighting market has grown by nearly 50% annually since 2006, and it is becoming increasingly realistic that LEDs will replace fluorescent lamps and other lighting fixtures in the future as LED technology advances.
  • the recent LED lighting fixtures tend to reduce the number of LED mounting by using a high-power 1W or more LED package than to arrange a plurality of low-power LEDs.
  • the problem is heat dissipation.
  • a high power LED is used in a luminaire, a large amount of heat is generated in the LED itself due to the high power. If the heat generated from the LED is not properly radiated, that is, the LED is not properly cooled, the forward voltage may be lowered, thereby deteriorating the luminous efficiency and shortening the life of the LED.
  • the trend is prominent because more and more bright lighting is preferred.
  • the problem to be solved of the present invention is to provide a heat dissipation device for an LED lighting fixture that is simple in structure and excellent in heat dissipation efficiency, which can be easily fixed by inserting the heat dissipation pipe into the heat dissipation hub.
  • the present invention is installed in the LED lighting fixture, there is injected a working fluid containing a powder having a medium and infrared emission characteristics for transmitting heat generated from the LED lighting fixture Heat dissipation pipe;
  • the heat dissipation pipe is inserted into the inner close contact, the heat dissipation hub has an opening formed in the vertical direction in one side;
  • it provides a heat radiating device for an LED lighting device comprising a plurality of radiating fins protruding radially on the outer circumferential surface of the radiating hub.
  • the opening is formed in the heat dissipation hub and the heat dissipation hub forms a cylindrical shape with one side open, the diameter of the heat dissipation pipe and the diameter of the heat dissipation hub are exactly matched by an error occurring in the manufacturing process. If not, the heat dissipation pipe can be inserted and fixed relatively easily inside the heat dissipation hub.
  • the heat dissipation device for an LED lighting device is installed in the opening formed in the heat dissipation hub to install a clamping device that can adjust the width of the opening so that the heat dissipation pipe can be fixed tightly fixed inside the heat dissipation hub.
  • the heat dissipation device for an LED lighting device forms a bent portion that is bent in an upward direction at one end or both ends of the pipe body portion so that heat transfer from the heat dissipation pipe to the heat dissipation member can be made quickly.
  • the heat dissipation device for an LED lighting device is formed radially on the outer peripheral surface of the heat dissipation hub, the first heat dissipation fin is formed by a plurality of second heat dissipation fin branched from the first heat dissipation fin to maximize heat dissipation efficiency
  • the heat of the LED luminaire can be quickly released to the outside.
  • FIG. 1 is a perspective view showing a state in which a heat dissipation device for an LED lighting device according to the present invention is installed in the LED lighting device.
  • Figure 2 is a perspective view showing a state in which the heat dissipation device for the LED lighting fixture according to the present invention is coupled to the support unit.
  • FIG. 3 is a perspective view showing in more detail the structure of the heat dissipation hub according to the present invention.
  • FIG. 4 is a perspective view showing a first embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
  • FIG. 5 is a perspective view showing a second embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
  • FIG. 6 is a perspective view showing a third embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
  • FIG. 1 is a perspective view showing a state in which a heat dissipation device for an LED lighting device according to the present invention is installed in the LED lighting device.
  • the heat dissipation device for an LED lighting device includes a heat dissipation pipe 100 and a heat dissipation member 200 coupled to the heat dissipation pipe 100.
  • the heat dissipation pipe 100 is installed in the LED lighting fixture 10 consisting of a high output LED module 11 and 1W or more, and the module plate 12 on which the LED module 11 is installed, the LED lighting fixture 10 It receives heat generated from and heats it to the outside.
  • the heat dissipation pipe 100 is coupled to the support unit 300 is coupled to the screw (B) to the module plate 12 of the LED lighting device 10 to transfer the heat generated by the LED lighting device (10). Receive.
  • Figure 2 is a perspective view showing a state in which the heat dissipation device for the LED lighting fixture according to the invention is coupled to the support unit.
  • the heat dissipation pipe 100 is bent upward in one or both ends of the pipe body 110 and the pipe body 110 coupled to the support unit 300 in a horizontal state. And a bending part 120 extending therefrom. Accordingly, the heat dissipation pipe 100 has an overall 'U' shape.
  • the inside of the heat dissipation pipe 100 is injected with a working fluid including a medium for transferring heat generated by the LED lighting device 10 and a powder having infrared ray emission characteristics.
  • methyl alcohol methyl alcohol, ammonia, methyl chloroform, and the like may be used, but the present invention is not limited thereto, and any liquid may be used as long as it has a lower boiling point than water at room temperature.
  • silicate mineral may be used as the powder, but is not limited thereto, and any mineral may be used as long as it emits infrared rays when heated.
  • the working fluid that is, the medium and the powder injected into the heat dissipation pipe 100 as described above is connected to the support unit 300 in a horizontal state before the LED lighting device 10 starts to dissipate heat.
  • the medium starts to vaporize, and the powder is heated to start emitting infrared rays.
  • the heat is transferred to the bending unit 120 while naturally moving to the bending unit 120 of the heat dissipation pipe 100, and at the same time, the powder and the medium radiate heat. To be delivered to the bending unit 120.
  • the bending part 120 is formed in the heat dissipation pipe 100 so that the heat dissipation pipe 100 has a 'U' shape as a whole, heat transfer from the pipe body part 110 to the bending part 120 is more effective. This will happen.
  • the internal pressure of the heat dissipation pipe 100 is in a state of 0.001 to 0.0001 mmhg, the movement of the vaporized medium in the inside of the heat dissipation pipe 100 and the infrared emission by the powder proceed at a considerably high speed. The heat transfer due to the large will occur.
  • the end of the bending part 120 is naturally sealed by the pipe stopper 130.
  • the support unit 300 to which the heat dissipation pipe 100 is coupled includes a base member 310 and a coupling member 320 that couples the heat dissipation pipe 100 to the bottom surface of the base member 310. It is made to include.
  • the base member 310 includes a bottom plate 311 to which the LED lighting device 10 is directly coupled, and a plurality of side walls 312 protruding at a predetermined interval from the bottom plate 311.
  • the bottom plate 311 is a portion directly coupled to the pipe body portion 110 of the heat dissipation pipe 100, the upper surface is formed with a pipe seating portion (311a) corresponding to the outer surface shape of the pipe body portion (110). .
  • the pipe seating portion 311a is formed to surround a part of the outer surface of the pipe body 110 so that the contact area between the bottom plate 311 and the heat dissipation pipe 100 can be increased as much as possible. Therefore, when the pipe body portion 110 of the heat dissipation pipe 100 is inserted into and fixed to the pipe seating portion 311a, the heat exchange area of the bottom plate 311 and the heat dissipation pipe 100 is increased, and thus the LED lighting device 10 Heat transmitted to the bottom plate 311 is effectively transmitted to the heat dissipation pipe 100.
  • a plurality of heat dissipation spaces 311c are formed in communication with the outside in a state partitioned by the support ribs 311b.
  • the heat dissipation space 311c is formed in the bottom plate 311 and communicates with the outside, the outside air flows through the heat dissipation space 311c, so that heat exchange is performed, and thus, from the LED lighting device 10 to the bottom plate 311. Heat transmitted is released to the outside more quickly.
  • the side wall 312 is a kind of heat dissipation fin that protrudes from the bottom plate 311, and increases the contact area with the outside air, such as the heat dissipation space 311c, from the LED lighting device 10 to the bottom plate 311. It is responsible for the rapid discharge of heat transferred to the outside.
  • the coupling member 320 may include a coupling plate 321 having a depression 321a corresponding to an outer circumferential surface of the pipe body 110 of the heat dissipation pipe 100, and the coupling plate 321 with the base member 310. It includes a fastener 322 coupled to the bottom plate 311 of the).
  • the recessed portion 321a is manufactured to be symmetrical with the pipe seating portion 311a, and thus the pipe body 110 of the heat dissipation pipe 100 is fastened in a state in which the pipe seating portion 311a is inserted into the pipe seating portion 311a.
  • the coupling plate 321 is coupled to the bottom plate 311 by the sphere 322
  • the outer circumferential surface of the pipe body 110 is inserted into the recess 321a and the pipe seating portion 311a is provided. And it is completely wrapped by the depression 321a.
  • the recess 321a increases the overall heat exchange area between the bottom plate 311 and the heat dissipation pipe 100, like the pipe seating portion 311a described above, and transfers the LED luminaire 10 to the bottom plate 311. The heat is to be quickly transferred to the heat radiation pipe (100).
  • the auxiliary heat dissipation fin 323 is formed on the outer surface of the coupling plate 321 in which the depression 321a is formed.
  • the auxiliary heat dissipation fin 323 serves to improve the heat dissipation efficiency by quickly discharging a part of the heat transferred from the LED lighting device 10 to the bottom plate 311 to the outside similar to the side wall 312 described above.
  • the heat dissipation member 200 includes a heat dissipation hub 210 coupled to the heat dissipation pipe 110, and a plurality of heat dissipation fins 220 radially formed on an outer circumferential surface of the heat dissipation hub 210.
  • One end of the heat dissipation pipe 100 is inserted and fixed inside the heat dissipation hub 210.
  • the heat dissipation pipe 210 is disposed inside the heat dissipation hub 210. End of the bending part 120 of 100 is inserted and fixed.
  • FIG. 3 is a perspective view showing in more detail the structure of the heat dissipation hub according to the present invention.
  • an opening 211 is formed at one side of the heat dissipation hub 210 to open one side of the heat dissipation hub 210 in the vertical direction.
  • the heat dissipation hub 210 has a cylindrical shape with one side open.
  • the heat dissipation pipe 100 may not exactly match the diameter of the heat dissipation pipe 100 and the diameter of the heat dissipation hub 210 due to an error occurring in the manufacturing process. That is, the ends of the bending part 120 can be inserted into the heat dissipation hub 210 relatively easily and fixed.
  • the heat dissipation pipe 100 when the diameter of the heat dissipation pipe 100 is larger than that of the heat dissipation hub 210, when the heat dissipation pipe 100 is strongly pushed into the heat dissipation hub 210 by applying an external force, the heat dissipation pipe (opening 211) is opened. 100 is slid into the heat dissipation hub 210, in which case the heat dissipation pipe 100 is inserted into the heat dissipation hub 210 in an interference fit manner so that the heat dissipation pipe 100 is in close contact with the heat dissipation hub 210. It will be kept firmly fixed.
  • the heat dissipation pipe 100 is fixed to the heat dissipation hub 210 by using an adhesive or the like, or inside the heat dissipation pipe 100.
  • the bending part 120 of the heat dissipation pipe 100 may be expanded by supplying a high pressure fluid to the bending part 120 so that the bending part 120 may be tightly fixed inside the heat dissipation hub 210.
  • a separate clamping device (Clamping Device) to adjust the width of the opening 211 to the heat dissipation hub 210 to maintain a state in which the heat dissipation pipe 100 is in close contact with the inner surface of the heat dissipation hub 210 ( 400, 500, 600 (see Figs. 4 to 6) is preferably installed.
  • FIG. 4 is a perspective view showing a first embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
  • the second embodiment 500 of the clamping device according to the present invention is the third, fourth protruding from the outer surface of the heat dissipation hub 210 located on both sides of the opening 211, respectively It consists of a flange (510, 520) and the fixing clip 530 is elastically opened by the external force and fitted to the third, fourth flanges (510, 520) to press and hold the third, fourth flanges (510, 520).
  • the heat dissipation pipe 100 is inserted into the heat dissipation hub 210, and then the fixing clip 530 is opened to open the third and fourth flanges ( Holding the 510 and 520, the width of the opening 211 is narrowed while the third and fourth flanges 510 and 520 are pressed by the fixing clip 530, so that the heat dissipation hub 210 naturally Since the outer surface is pressurized, the heat dissipation pipe 100 is tightly fixed to the inside of the heat dissipation hub 210.
  • FIG. 5 is a perspective view showing a second embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
  • the first embodiment 400 of the clamping device according to the present invention includes first and second flanges protruding from the outer surface of the heat dissipation hub 210 positioned at both sides of the opening 211. 410 and 420, and fastening screws 430 for coupling the first and second flanges 410 and 420.
  • the clamping device is composed of the first and second flanges 410 and 420 and the fastening screw 430, the fastening screw 430 after inserting the heat dissipation pipe 100 into the heat dissipating hub 210 while the fastening screw 430 is loosened.
  • the first and second flanges 410 and 420 are tightened, the width of the opening 211 is narrowed, so that the heat dissipation hub 210 naturally pressurizes the outer surface of the heat dissipation pipe 100. Therefore, the heat dissipation pipe 100 is fixed in close contact with the inside of the heat dissipation hub 210.
  • the nut (N) may be separately coupled to the end of the fastening screw (430) to prevent the fastening screw (430) is released.
  • FIG. 6 is a perspective view showing a third embodiment of the clamping device installed in the heat dissipation hub according to the present invention.
  • the third embodiment 600 of the clamping device according to the present invention is first and second protruding from the outer surface of the heat dissipation hub 210 located on both sides of the opening 211, respectively.
  • the guide rails 610 and 620 and the guide blocks 630 slidingly coupled to the first and second guide rails 610 and 620 to press and hold the first and second guide rails 610 and 620.
  • the heat dissipation pipe 100 is inserted into the heat dissipation hub 210 and the guide block 630 is inserted into the first and second guide rails 610 and 620. If the sliding coupling is inserted into the first and second guide rails 610 and 620 are pressed by the guide convex 630, the width of the opening 211 is narrowed. Accordingly, the heat dissipation hub 210 naturally radiates the heat dissipation pipe 100. Since the outer surface of the heat dissipation pipe 100 is in close contact with the inside of the heat dissipation hub 210 is to be fixed.
  • the clamping device according to the present invention is not limited to the above-described embodiment, and any device may be used as long as the device can adjust the width of the opening 211.
  • the heat dissipation fin 220 includes a first heat dissipation fin 221 radially protruding from the outer circumferential surface of the heat dissipation hub 210, and a plurality of second heat dissipation fins 222 branched from the first heat dissipation fin 221.
  • the first and second heat dissipation fins 221 and 222 serve to discharge heat transferred from the bending part 120 of the heat dissipation pipe 110 to the outside in contact with the outside air.
  • the second heat dissipation fin 222 extends from the first heat dissipation fin 221 to widen the surface area in contact with the outside air so that heat transferred to the heat dissipation fin 220 can be quickly discharged to the outside.
  • the second heat dissipation fin 222 may be selectively formed only on a part of the first heat dissipation fin 221 in consideration of a free space in which the heat dissipation fin 220 is installed.
  • the present invention relates to a heat dissipation device for LED lighting fixtures, because it can be efficiently used to receive heat generated from a heat source to the outside can be used in the streets of public roads, government offices, schools, as well as fishing for fishing Phase can be widely used.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention porte sur un dispositif de rayonnement de chaleur pour un appareil d'éclairage à diodes électroluminescentes, lequel dispositif comprend : un tuyau de rayonnement de chaleur qui est disposé dans un appareil d'éclairage à diodes électroluminescentes, et dans lequel un fluide de travail comprenant un milieu pour transférer la chaleur générée à partir de l'appareil d'éclairage à diodes électroluminescentes et une poudre ayant des caractéristiques d'émission des infrarouges est injecté ; un moyeu de rayonnement de chaleur ayant le tuyau de rayonnement de chaleur qui est inséré dans l'intérieur du moyeu de rayonnement de chaleur et qui vient en contact étroit avec celui-ci, et une ouverture formée d'un côté de celui-ci dans la direction verticale ; et une pluralité d'ailettes de rayonnement de chaleur formées de façon à faire saillie radialement à partir de la surface externe du moyeu de rayonnement de chaleur.
PCT/KR2013/004085 2012-05-11 2013-05-09 Dispositif de rayonnement de chaleur pour appareil d'éclairage à diodes électroluminescentes WO2013169033A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20-2012-0003902 2012-05-11
KR2020120003902U KR200461899Y1 (ko) 2012-05-11 2012-05-11 엘이디 조명기구용 방열장치

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WO2013169033A1 true WO2013169033A1 (fr) 2013-11-14

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016090069A1 (fr) * 2014-12-03 2016-06-09 GE Lighting Solutions, LLC Lampes à del pour montage en rattrapage sur des ballasts pour lampes à halogénures métalliques de forte puissance
US9775199B2 (en) 2014-07-31 2017-09-26 GE Lighting Solutions, LLC Light emitting diode retrofit lamp for high intensity discharge ballast
EP3343162A1 (fr) * 2017-01-03 2018-07-04 Quanta Computer Inc. Appareil de dissipation thermique

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101464519B1 (ko) * 2013-04-23 2014-11-24 주식회사 탑솔 밀착조립형 배관용 방열장치

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KR19990037855U (ko) * 1998-03-13 1999-10-15 구효회 히트파이프의 방열기 고정구
KR100944986B1 (ko) * 2009-08-04 2010-03-05 이주동 Ｌｅｄ조명등 냉각장치
KR20100005391U (ko) * 2008-11-17 2010-05-26 임파워 옵트로닉스 코포레이션 Ｌｅｄ 조명 기구
KR20110020491A (ko) * 2009-08-24 2011-03-03 삼성전기주식회사 발열소자의 방열패키지 모듈
KR20110072651A (ko) * 2009-12-23 2011-06-29 김동섭 엘이디 조명 모듈

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Publication number Priority date Publication date Assignee Title
KR19990037855U (ko) * 1998-03-13 1999-10-15 구효회 히트파이프의 방열기 고정구
KR20100005391U (ko) * 2008-11-17 2010-05-26 임파워 옵트로닉스 코포레이션 Ｌｅｄ 조명 기구
KR100944986B1 (ko) * 2009-08-04 2010-03-05 이주동 Ｌｅｄ조명등 냉각장치
KR20110020491A (ko) * 2009-08-24 2011-03-03 삼성전기주식회사 발열소자의 방열패키지 모듈
KR20110072651A (ko) * 2009-12-23 2011-06-29 김동섭 엘이디 조명 모듈

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9775199B2 (en) 2014-07-31 2017-09-26 GE Lighting Solutions, LLC Light emitting diode retrofit lamp for high intensity discharge ballast
WO2016090069A1 (fr) * 2014-12-03 2016-06-09 GE Lighting Solutions, LLC Lampes à del pour montage en rattrapage sur des ballasts pour lampes à halogénures métalliques de forte puissance
US9989240B2 (en) 2014-12-03 2018-06-05 GE Lighting Solutions, LLC LED lamps for retrofit on high wattage metal halide ballasts
EP3343162A1 (fr) * 2017-01-03 2018-07-04 Quanta Computer Inc. Appareil de dissipation thermique

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