WO2013051812A1 - Heat sink device for an led lighting apparatus - Google Patents
Heat sink device for an led lighting apparatus Download PDFInfo
- Publication number
- WO2013051812A1 WO2013051812A1 PCT/KR2012/007744 KR2012007744W WO2013051812A1 WO 2013051812 A1 WO2013051812 A1 WO 2013051812A1 KR 2012007744 W KR2012007744 W KR 2012007744W WO 2013051812 A1 WO2013051812 A1 WO 2013051812A1
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- WIPO (PCT)
- Prior art keywords
- heat dissipation
- pipe
- led lighting
- heat
- fin
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
Definitions
- the present invention relates to a heat dissipation device for an LED luminaire, and more particularly, to a heat dissipation device for an LED luminaire capable of efficiently dissipating heat generated from the LED luminaire.
- Lighting using a light emitting diode that is, a light emitting diode (LED) has recently received great attention as an environmentally friendly technology.
- the global white LED lighting market has grown by nearly 50% annually since 2006, and it is becoming increasingly realistic that LEDs will replace fluorescent lamps and other lighting fixtures in the future as LED technology advances.
- the recent LED lighting fixtures tend to reduce the number of LED mounting by using a high-power 1W or more LED package than to arrange a plurality of low-power LEDs.
- the problem is heat dissipation.
- a high power LED is used in a luminaire, a large amount of heat is generated in the LED itself due to the high power. If the heat generated from the LED is not properly radiated, that is, the LED is not properly cooled, the forward voltage may be lowered, thereby deteriorating the luminous efficiency and shortening the life of the LED.
- the trend is prominent because more and more bright lighting is preferred.
- Korean Patent Publication No. 10-1031650 invented by the present applicant discloses a cooling device for an LED lighting device and an LED cooling device using the same.
- the problem to be solved of the present invention is to provide a heat radiating device for an LED lighting fixture having a simple structure and excellent heat dissipation efficiency.
- the present invention includes a support unit coupled to the LED luminaire, and a heat dissipation unit coupled to the support unit, the heat dissipation unit transfers heat generated from the LED luminaire And a heat dissipation pipe having a working fluid containing therein a powder having a medium and an infrared ray emission characteristic, and a heat dissipation member installed on an outer circumferential surface of the heat dissipation pipe, wherein the heat dissipation pipe includes a pipe body part and the pipe body part.
- At least one end has a bending portion is bent in the upper direction, the heat dissipation member is installed on the bending portion, the support unit is a base member formed with a pipe seating portion corresponding to the outer surface shape of the heat dissipation pipe, And a coupling member for coupling the base member and the heat dissipation pipe.
- Mechanism for a LED fixture provides a heat radiating apparatus.
- the pipe body part and the bending part may be extended to each other to have a 'U' shape, and a pipe stopper for sealing the working fluid may be installed at an end of the bending part.
- the heat dissipation member may include a heat dissipation hub that is in close contact with the heat dissipation pipe, a first heat dissipation fin protruding radially from a first region on an outer circumferential surface of the heat dissipation hub, and a second heat dissipation fin opposite to the first heat dissipation fin. And a second heat dissipation fin protruding radially from the area, wherein the second heat dissipation fin may include a fin body extending from the heat dissipation hub and a plurality of branch fins branched from the fin body.
- At least a portion of the first heat dissipation fin and the second heat dissipation fin may have a shape cut to correspond to an inner space shape of the heat dissipation case installed while surrounding the heat dissipation unit.
- the base member may include a bottom plate in direct contact with the LED luminaire, and may form a heat dissipation space in communication with the outside in the bottom plate.
- the coupling member may include a coupling plate having a depression corresponding to an outer circumferential surface of the heat dissipation pipe, and a first auxiliary heat dissipation fin protruding from the coupling plate to discharge heat of the heat dissipation pipe to the outside.
- the heat dissipation unit may further include a second auxiliary heat dissipation fin wound around at least a portion of the outer circumferential surface of the heat dissipation pipe to dissipate heat of the heat dissipation pipe to the outside.
- a flow path forming rib may be formed in the heat dissipation pipe to form a return flow path for moving the working fluid liquefied in the bending part of the working fluid to the pipe body part.
- the heat dissipation pipe has a pipe body part and a bending part having both ends bent upward in the pipe body part to facilitate heat transfer from the heat dissipation pipe to the heat dissipation member, thereby simplifying the structure and increasing heat transfer efficiency. There is an advantage.
- the heat dissipation member is provided with a first heat dissipation fin and a second heat dissipation fin
- the second heat dissipation fin is configured to have a fin body extending from the heat dissipation hub and a plurality of branch fins branched from the fin body
- the second heat dissipation fin At least a part of the configuration may have a shape that is cut to correspond to the inner space shape of the heat dissipation case installed while surrounding the heat dissipation unit, thereby maximizing the heat dissipation effect and at the same time having a compact structure.
- a pipe seating portion corresponding to the outer surface shape of the heat dissipation pipe is formed on the upper surface of the bottom plate, and the heat dissipation space communicating with the outside is formed inside the bottom plate to dissipate heat generated from the LED lighting fixture to the outside as much as possible.
- the coupling plate is provided with a depression corresponding to the outer peripheral surface of the heat dissipation pipe, the upper surface of the coupling plate is formed by the first auxiliary heat dissipation fins for dissipating heat of the heat dissipation pipe to the outside is formed in the LED lighting fixture There is an advantage that can dissipate heat to the outside as possible.
- FIG. 1 is a perspective view showing a state in which the heat dissipation device for the LED lighting fixture according to the present invention is coupled with the LED lighting fixture.
- Figure 2 is a perspective view showing a heat radiation device for the LED lighting fixture according to the present invention.
- Figure 3 is a perspective view showing a first embodiment of the first heat dissipation unit provided in the heat dissipating device for LED lighting apparatus according to the present invention.
- Figure 4 is a perspective view showing a second embodiment of the first heat dissipation unit provided in the heat dissipation device for LED lighting apparatus according to the present invention.
- FIG. 5 is a cross-sectional view of the heat dissipation pipe according to the third embodiment of the first heat dissipation unit provided in the heat dissipation device for LED lighting apparatus according to the present invention.
- support unit 110 base member
- first auxiliary heat dissipation pin 200 first heat dissipation unit
- heat radiation pipe 211 flow path forming rib
- bending portion 215 pipe body portion
- heat dissipation member 221 heat dissipation hub
- first heat dissipation fin 225 second heat dissipation fin
- the heat dissipation device for an LED lighting device includes a support unit 100 coupled to the LED light fixture 10, and a heat dissipation unit coupled to the support unit 100.
- the LED lighting device 10 is a high power LED module 13 or more of 1W class, the module plate 11 is installed, the module plate 11 is installed for coupling the module plate 11 and the support unit 100 And a fastening screw 15.
- the heat dissipation unit includes a first heat dissipation unit 200 and a second heat dissipation unit 300 fastened to the support unit 100. Since the first heat dissipation unit 200 and the second heat dissipation unit 300 have substantially the same structure, only the first heat dissipation unit 200 will be described.
- the first heat dissipation unit 200 includes a heat dissipation pipe 210 having a working fluid containing a medium for transferring heat generated by the LED lighting device 10 and a powder having infrared ray emission characteristics, and the heat dissipation. And a heat dissipation member 220 installed on the outer circumferential surface of the pipe 210.
- Methyl alcohol, ammonia, methyl chloroform and the like may be used as the medium.
- the medium may be any liquid as long as the liquid has a lower boiling point than water at room temperature.
- a silicate mineral may be used as the powder.
- the powder is irrelevant to any mineral that emits infrared rays when heated.
- the heat dissipation pipe 210 includes a pipe body 215 and a bending part 213 at least one end of which is bent upward in the pipe body 215.
- the pipe body 215 and the bending part 213 are extended to each other to have a 'U' shape.
- the heat dissipation member 220 is installed in pairs on the bending part 213.
- the heat dissipation member 220 is fitted on the outer surface of the bending portion 213 and then firmly pressed against the bending portion 213 by expansion of the bending portion 213.
- the heat dissipation pipe 210 is expanded by supplying a high pressure fluid into the heat dissipation pipe.
- the heat dissipation member 220 is in close contact with the bending part 213 and pressed.
- the heat dissipation pipe 210 may be made of stainless steel, and the heat dissipation member 220 may be made of aluminum.
- the present invention is not limited to the above-described embodiment, and the heat dissipation member 220 and the bending part 213 may be coupled by an adhesive or may be coupled by separate coupling means.
- the working fluid is primarily present in the pipe body 215. Then, when heat is generated in the LED lighting device 10, the powder emits infrared rays due to the heat of the LED lighting device 10, the medium starts to vaporize.
- the vaporized medium moves to the bending part 213 while transferring the heat to the bending part 213, and at the same time, the powder and the medium transfer radiant heat to the bending part 213.
- the vaporized medium inside the heat dissipation pipe 210 has a property of moving upward, the medium is moved to the bending part 213.
- the heat radiation pipe 210 has a 'U' shape, more efficient heat transfer occurs from the pipe body 215 to the bending part 213.
- the medium and the infrared emission inside the heat dissipation pipe 210 proceed at a considerably high speed. Since the inside of the heat dissipation pipe 210 maintains a vacuum state, heat transfer due to the radiant heat is greatly generated.
- a pipe stopper 250 for sealing the working fluid is installed at the end of the bending part 213.
- the heat transferred to the bending part 213 is conducted to the heat dissipation member 220 coupled to the bending part 213, and the heat dissipation member 220 radiates heat by external cold air. .
- the heat dissipation member 220 includes a heat dissipation hub 221 that is in close contact with the heat dissipation pipe 210, a first heat dissipation fin 223 radially protruding from a first area on an outer circumferential surface of the heat dissipation hub 221, and A second heat dissipation fin 225 facing the first heat dissipation fin 223 and protruding radially in a second area on the outer circumferential surface of the heat dissipation hub 221 is included.
- the second heat dissipation fin 225 includes a fin body 225c extending from the heat dissipation hub 221 and a plurality of branch fins 225a and 225b branched from the fin body 225c.
- the plurality of branching pins 225a and 225b are effective for heat dissipation because they increase the surface area in contact with the outside air.
- first heat dissipation fin 223 and the second heat dissipation fin 225 have a shape that is cut to correspond to the inner space shape of the heat dissipation case 1 installed while surrounding the heat dissipation unit.
- the height of the first heat dissipation fin 223 and the second heat dissipation fin 225 protruding from the heat dissipation hub 221 is different from each other depending on the shape of the heat dissipation case 1.
- the first heat dissipation fin 223 and the second heat dissipation fin 225 have a shape corresponding to the shape of the inner space of the heat dissipation case 1 and have a shape capable of maximizing the heat exchange area with the outside air. .
- the support unit 100 includes a base member 110, the coupling member 120 for coupling the base member 110 and the heat dissipation pipe 210.
- the base member 110 includes a bottom plate 111 directly contacting the LED lighting device 10, and a side wall 113 protruding at a predetermined interval from the bottom plate 111.
- the upper surface of the bottom plate 111 is formed with a pipe seating portion (111a) corresponding to the outer surface shape of the heat dissipation pipe (210).
- a pipe seating portion (111a) corresponding to the outer surface shape of the heat dissipation pipe (210).
- a heat dissipation space 111c is formed in the bottom plate 111 to communicate with the outside.
- the inner space of the bottom plate 111 is communicated with the outside while being supported by the support ribs 111b therein.
- the floor plate itself which is in direct contact with the LED lighting device 10, also emits heat generated by the LED lighting device 10 to the outside through heat exchange with external air.
- the side wall 113 is also formed to protrude from the bottom plate 111 to serve as one heat sink fin.
- the coupling member 120 includes a coupling plate 121 having a recess 121a corresponding to an outer circumferential surface of the heat dissipation pipe 210 and a protrusion formed on the coupling plate 121 to heat the heat dissipation pipe 210. It includes a first auxiliary heat dissipation fin 123 for discharging to the outside, and a fastener 125 for coupling the coupling plate 121 and the base member 110.
- the recess 121a and the pipe seat 111a are installed to face each other and completely surround the outer circumferential surface of the pipe body 215 of the heat dissipation pipe 210.
- the recess 121a widens the heat exchange area with the heat dissipation pipe 210, and heat transmitted from the heat dissipation pipe 210 is radiated to the outside by the first auxiliary heat dissipation fin 123.
- FIG. 4 a second embodiment of the first heat dissipation unit provided in the heat dissipation device for LED lighting apparatus according to the present invention.
- the first heat dissipation unit according to the present embodiment is mostly similar to the first heat dissipation unit according to the above-described embodiment, a detailed description of the same configuration is omitted.
- the first heat dissipation unit according to the present embodiment has a second auxiliary winding wound on at least a partial region on the outer circumferential surface of the heat dissipation pipe 210 to dissipate heat from the heat dissipation pipe 210 to the outside.
- the heat dissipation fin 240 is included.
- the second auxiliary heat dissipation fin 240 has a corrugated shape and is wound on the outer circumferential surface of the heat dissipation pipe 210.
- the second auxiliary heat dissipation fin 240 may be wound in a circular shape on the outer circumferential surface of the heat dissipation pipe or spirally.
- the second auxiliary heat dissipation fin 240 has a corrugated shape, a contact area with external air is increased to effectively discharge heat of the heat dissipation pipe 210 to the outside.
- the present invention is not limited to the above-described embodiment, and the outer circumferential surface itself may be formed to be wrinkled in a partial region of the heat dissipation pipe.
- FIG. 5 is a sectional view of a heat radiation pipe according to the present embodiment.
- the heat dissipation pipe provided in the first heat dissipation unit according to the present embodiment is mostly similar to the heat dissipation pipe provided in the first heat dissipation unit according to the above-described embodiment, detailed description of the same configuration will be omitted.
- the working fluid liquefied through heat exchange in the bending part 213 of the working fluid is transferred to the pipe body part 215 in the heat dissipation pipe provided in the first heat dissipation unit according to the present embodiment.
- a flow path forming rib 211 which protrudes a return flow path for movement is protruded.
- the flow path forming ribs 211 are provided in plural, with a predetermined distance on the inner peripheral surface of the bending portion 213 and a portion of the pipe body portion 215.
- the interval between the flow path forming ribs 211 forms a return flow path for allowing the working fluid to be moved from the bending part 213 to the working fluid initial position S of the pipe body part.
- the first heat dissipation unit according to the present embodiment is provided with a pipe cap 250 as described in the heat dissipation unit according to the first embodiment.
- the present invention relates to a heat dissipation device used in a high-power LED lighting device, and can be widely used in the industry because it can be used for fishing lamps as well as street lamps in general roads, government offices, schools and the like.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention relates to a heat sink device for an LED lighting apparatus, which has a simple structure and superior heat dissipation efficiency. To this end, the heat sink device includes: a support unit coupled to the LED lighting apparatus; and a heat sink unit coupled to the support unit. The heat sink unit includes: a heat sink pipe in which a medium for transferring heat generated in the LED lighting apparatus and a working fluid containing powder having an infrared emission characteristic are provided; and a heat sink member disposed on the outer circumferential surface of the heat sink pipe. The heat sink pipe includes a pipe body part and a bent part wherein at least one end of the pipe body part is bent upward. The heat sink member is disposed on the bent part.
Description
본 발명은 엘이디 조명기구용 방열장치에 관한 것으로서, 보다 상세하게는 엘이디 조명기구에서 발생되는 열을 효율적으로 방열시킬 수 있는 엘이디 조명기구용 방열장치에 관한 것이다.The present invention relates to a heat dissipation device for an LED luminaire, and more particularly, to a heat dissipation device for an LED luminaire capable of efficiently dissipating heat generated from the LED luminaire.
발광 다이오드, 즉 엘이디(LED: Light Emitting Diode)를 이용한 조명은 최근 친환경 기술로서 큰 관심을 받고 있다. 세계적으로 백색 엘이디 조명 시장은 2006년 이후 연간 50% 가까이 성장해 왔으며, 엘이디 기술의 발전에 따라 향후 엘이디가 형광등 및 기타 다른 광기구를 대체할 것이라는 전망이 점차 현실화되고 있다.Lighting using a light emitting diode, that is, a light emitting diode (LED), has recently received great attention as an environmentally friendly technology. The global white LED lighting market has grown by nearly 50% annually since 2006, and it is becoming increasingly realistic that LEDs will replace fluorescent lamps and other lighting fixtures in the future as LED technology advances.
일반적으로 최근의 엘이디 조명기구는 여러 개의 저출력 엘이디를 배열하는 것보다 고출력형인 1W급 이상의 엘이디 패키지를 사용하여 엘이디 장착 개수를 줄이려는 경향을 나타낸다. In general, the recent LED lighting fixtures tend to reduce the number of LED mounting by using a high-power 1W or more LED package than to arrange a plurality of low-power LEDs.
고출력 엘이디를 조명기구에 이용하는 경우 문제가 되는 것이 방열이다. 고출력 엘이디를 조명기구에 사용하면, 고출력으로 인하여 엘이디 자체에서 많은 양의 열이 발생하게 된다. 상기 엘이디에서 발생하는 열을 적절하게 방열, 즉 상기 엘이디를 적절하게 냉각시키지 못하면 순전압이 떨어져 발광효율이 악화될 뿐만 아니라 상기 엘이디의 수명이 단축되는 문제가 발생하게 된다. 특히, 가로등이나 집어등과 같은 실외 조명의 경우 점점 더 밝은 조명이 선호되고 있기 때문에 경향이 두드러진다. When using high output LEDs in lighting fixtures, the problem is heat dissipation. When a high power LED is used in a luminaire, a large amount of heat is generated in the LED itself due to the high power. If the heat generated from the LED is not properly radiated, that is, the LED is not properly cooled, the forward voltage may be lowered, thereby deteriorating the luminous efficiency and shortening the life of the LED. In particular, in the case of outdoor lighting such as street lamps or picking lamps, the trend is prominent because more and more bright lighting is preferred.
이러한 방열 문제를 해결하기 위하여, 메탈 베이스 기판을 사용하는 엘이디 조명기구들이 많이 제안되고 있다. 그러나 메탈 베이스 기판조차도 방열성을 충분히 확보하기가 어려운 형편이다. 고출력 엘이디용 기판으로는 열전도율이 높은 AlN(Aluminum Nitride)판에 은 페이스트를 인쇄한 세라믹 기판이 널리 알려져 있는데, 제조비용이 높다는 게 단점이다.In order to solve this heat dissipation problem, many LED lighting fixtures using a metal base substrate have been proposed. However, even metal base substrates are difficult to secure sufficient heat dissipation. As a substrate for a high output LED, a ceramic substrate printed with silver paste on an AlN (Aluminum Nitride) plate having high thermal conductivity is widely known, but a disadvantage is that the manufacturing cost is high.
본 출원인에 의하여 발명된 한국등록특허공보 10-1031650호에는 LED 조명기구용 냉각장치 및 이를 이용한 LED 냉각기구가 개시되어 있다.Korean Patent Publication No. 10-1031650 invented by the present applicant discloses a cooling device for an LED lighting device and an LED cooling device using the same.
또한, 최근에는 엘이디 패키지의 기판 구조를 개선함으로써 방열성을 높이려는 시도가 있다. 다른 접근방법으로서, 엘이디 칩의 기계적 구조를 개선하여 방열성을 높이려는 시도도 발견된다. 그러나, 이러한 방법은 모두 비용이 많이 소요된다는 단점이 있다.In recent years, there is an attempt to improve heat dissipation by improving the substrate structure of the LED package. As another approach, attempts have been made to improve the heat dissipation by improving the mechanical structure of the LED chip. However, all these methods have the disadvantage of being expensive.
본 발명의 해결하고자 하는 과제는 구조가 간단하면서도 방열효율이 우수한 엘이디 조명기구용 방열장치를 제공하는 것이다.The problem to be solved of the present invention is to provide a heat radiating device for an LED lighting fixture having a simple structure and excellent heat dissipation efficiency.
상술한 해결하고자 하는 과제를 달성하기 위하여, 본 발명은 엘이디 조명기구에 결합되는 지지유닛, 그리고 상기 지지유닛에 결합되는 방열유닛을 포함하며,상기 방열유닛은 상기 엘이디 조명기구에서 발생하는 열을 전달하기 위한 매질과 적외선 방출특성을 갖는 분말을 포함하는 작동유체가 내장되어 있는 방열파이프와, 상기 방열파이프의 외주면 상에 설치되는 방열부재를 포함하고, 상기 방열파이프는 파이프 몸체부와 상기 파이프 몸체부에서 적어도 일측 끝단이 상부방향으로 벤딩되어 있는 벤딩부를 가지며, 상기 방열부재는 상기 벤딩부 상에 설치되며, 상기 지지유닛은 상기 방열파이프의 외측면 형상과 대응되는 파이프 안착부가 형성된 베이스 부재와, 상기 베이스 부재와 상기 방열파이프를 결합하기 위한 결합부재를 갖는 것을 특징으로 하는 엘이디 조명기구용 방열장치를 제공한다.In order to achieve the above object to be solved, the present invention includes a support unit coupled to the LED luminaire, and a heat dissipation unit coupled to the support unit, the heat dissipation unit transfers heat generated from the LED luminaire And a heat dissipation pipe having a working fluid containing therein a powder having a medium and an infrared ray emission characteristic, and a heat dissipation member installed on an outer circumferential surface of the heat dissipation pipe, wherein the heat dissipation pipe includes a pipe body part and the pipe body part. At least one end has a bending portion is bent in the upper direction, the heat dissipation member is installed on the bending portion, the support unit is a base member formed with a pipe seating portion corresponding to the outer surface shape of the heat dissipation pipe, And a coupling member for coupling the base member and the heat dissipation pipe. Mechanism for a LED fixture provides a heat radiating apparatus.
상기 파이프 몸체부와 상기 벤딩부는 서로 연장형성되어 'U'자 형상을 가지며, 상기 벤딩부의 끝단에는 상기 작동유체를 밀봉하기 위한 파이프 마개가 설치될 수 있다.The pipe body part and the bending part may be extended to each other to have a 'U' shape, and a pipe stopper for sealing the working fluid may be installed at an end of the bending part.
상기 방열부재는 상기 방열파이프가 관통하면서 밀착되는 방열허브와, 상기 방열허브의 외주면 상의 제1 영역에서 방사형으로 돌출되는 제1 방열핀과, 상기 제1 방열핀과 대향하며 상기 방열허브의 외주면 상의 제2 영역에서 방사형으로 돌출되는 제2 방열핀을 포함하며, 상기 제2 방열핀은 상기 방열허브에서 연장되는 핀몸체와, 상기 핀몸체에서 분지되는 복수의 분지핀을 포함할 수 있다.The heat dissipation member may include a heat dissipation hub that is in close contact with the heat dissipation pipe, a first heat dissipation fin protruding radially from a first region on an outer circumferential surface of the heat dissipation hub, and a second heat dissipation fin opposite to the first heat dissipation fin. And a second heat dissipation fin protruding radially from the area, wherein the second heat dissipation fin may include a fin body extending from the heat dissipation hub and a plurality of branch fins branched from the fin body.
상기 제1 방열핀 및 상기 제2 방열핀의 적어도 일부는 상기 방열유닛을 감싸면서 설치되는 방열케이스의 내측공간 형상에 대응되도록 잘려진 형상을 가질 수 있다.At least a portion of the first heat dissipation fin and the second heat dissipation fin may have a shape cut to correspond to an inner space shape of the heat dissipation case installed while surrounding the heat dissipation unit.
상기 베이스 부재는 상기 엘이디 조명기구와 직접적으로 접촉하는 바닥플레이트를 포함하며, 상기 바닥플레이트의 내부에는 외부와 연통되는 방열공간을 형성할 수 있다.The base member may include a bottom plate in direct contact with the LED luminaire, and may form a heat dissipation space in communication with the outside in the bottom plate.
상기 결합부재는 상기 방열파이프의 외주면과 대응되는 함몰부가 형성된 결합플레이트와, 상기 결합플레이트 상에서 돌출형성되어 상기 방열파이프의 열을 외부로 방출시키는 제1 보조 방열핀을 포함할 수 있다.The coupling member may include a coupling plate having a depression corresponding to an outer circumferential surface of the heat dissipation pipe, and a first auxiliary heat dissipation fin protruding from the coupling plate to discharge heat of the heat dissipation pipe to the outside.
본 발명의 다른 실시 예에 따르면, 상기 방열유닛은 상기 방열파이프의 열을 외부로 방출하기 위하여 상기 방열파이프의 외주면 상의 적어도 일부영역에 감기는 제2 보조 방열핀을 더 포함할 수 있다.According to another embodiment of the present invention, the heat dissipation unit may further include a second auxiliary heat dissipation fin wound around at least a portion of the outer circumferential surface of the heat dissipation pipe to dissipate heat of the heat dissipation pipe to the outside.
본 발명의 또 다른 실시 예에 따르면, 상기 방열파이프의 내부에는 상기 작동유체 중 상기 벤딩부에서 액화된 작동유체가 상기 파이프 몸체부로 이동되도록 하기 위한 복귀유로를 형성하는 유로형성리브가 형성될 수 있다.According to another embodiment of the present invention, a flow path forming rib may be formed in the heat dissipation pipe to form a return flow path for moving the working fluid liquefied in the bending part of the working fluid to the pipe body part.
본 발명에 따른 엘이디 조명기구용 방열장치에 대하여 설명하면 다음과 같다.Referring to the heat dissipation device for an LED lighting device according to the present invention.
첫째, 방열파이프가 파이프 몸체부 및 상기 파이프 몸체부에서 양측 끝단이 상부방향으로 벤딩되어 있는 벤딩부를 가지도록 구성하여 상기 방열파이프에서 방열부재로의 열전달이 용이하도록 함으로써 구조가 간단하면서도 열전달 효율이 증가되는 이점이 있다.First, the heat dissipation pipe has a pipe body part and a bending part having both ends bent upward in the pipe body part to facilitate heat transfer from the heat dissipation pipe to the heat dissipation member, thereby simplifying the structure and increasing heat transfer efficiency. There is an advantage.
둘째, 상기 방열부재에 제1 방열핀 및 제2 방열핀이 구비되고, 상기 제2 방열핀은 방열허브에서 연장되는 핀몸체와 상기 핀몸체에서 분지되는 복수의 분지핀을 가지도록 구성되고, 상기 제2 방열핀의 적어도 일부는 상기 방열유닛을 감싸면서 설치되는 방열케이스의 내측공간 형상에 대응되도록 잘려진 형상을 가지도록 구성함으로써 방열효과를 극대화 시킴과 동시에 컴팩트한 구조를 가질 수 있는 이점이 있다.Second, the heat dissipation member is provided with a first heat dissipation fin and a second heat dissipation fin, the second heat dissipation fin is configured to have a fin body extending from the heat dissipation hub and a plurality of branch fins branched from the fin body, the second heat dissipation fin At least a part of the configuration may have a shape that is cut to correspond to the inner space shape of the heat dissipation case installed while surrounding the heat dissipation unit, thereby maximizing the heat dissipation effect and at the same time having a compact structure.
셋째, 바닥플레이트의 상면에는 방열파이프의 외측면 형상과 대응되는 파이프 안착부가 형성되고, 상기 바닥플레이트의 내부에는 외부와 연통되는 방열공간을 형성함으로써 엘이디 조명기구에서 발생하는 열을 최대한 외부로 방열시킬 수 있는 이점이 있다.Third, a pipe seating portion corresponding to the outer surface shape of the heat dissipation pipe is formed on the upper surface of the bottom plate, and the heat dissipation space communicating with the outside is formed inside the bottom plate to dissipate heat generated from the LED lighting fixture to the outside as much as possible. There is an advantage to this.
넷째, 결합플레이트에는 상기 방열파이프의 외주면과 대응되는 함몰부가 형성되고, 상기 결합플레이트의 상면에는 상기 방열파이프의 열을 외부로 방출시키는 제1 보조 방열핀이 돌출형성되도록 함으로써 상기 엘이디 조명기구에서 발생하는 열을 최대한 외부로 방열시킬 수 있는 이점이 있다.Fourth, the coupling plate is provided with a depression corresponding to the outer peripheral surface of the heat dissipation pipe, the upper surface of the coupling plate is formed by the first auxiliary heat dissipation fins for dissipating heat of the heat dissipation pipe to the outside is formed in the LED lighting fixture There is an advantage that can dissipate heat to the outside as possible.
도 1은 본 발명에 따른 엘이디 조명기구용 방열장치가 엘이디 조명기구와 결합된 상태를 나타내는 사시도.1 is a perspective view showing a state in which the heat dissipation device for the LED lighting fixture according to the present invention is coupled with the LED lighting fixture.
도 2는 본 발명에 따른 엘이디 조명기구용 방열장치를 나타낸 사시도.Figure 2 is a perspective view showing a heat radiation device for the LED lighting fixture according to the present invention.
도 3은 본 발명에 따른 엘이디 조명기구용 방열장치에 구비된 제1 방열유닛의 제1 실시 예를 나타낸 사시도.Figure 3 is a perspective view showing a first embodiment of the first heat dissipation unit provided in the heat dissipating device for LED lighting apparatus according to the present invention.
도 4는 본 발명에 따른 엘이디 조명기구용 방열장치에 구비된 제1 방열유닛의 제2 실시 예를 나타낸 사시도.Figure 4 is a perspective view showing a second embodiment of the first heat dissipation unit provided in the heat dissipation device for LED lighting apparatus according to the present invention.
도 5는 본 발명에 따른 엘이디 조명기구용 방열장치에 구비된 제1 방열유닛의 제3 실시 예에 따른 방열파이프의 단면도.5 is a cross-sectional view of the heat dissipation pipe according to the third embodiment of the first heat dissipation unit provided in the heat dissipation device for LED lighting apparatus according to the present invention.
<주요도면부호의 설명><Description of Major Drawing Codes>
1: 방열케이스 10: 엘이디 조명기구1: heat dissipation case 10: LED lighting fixture
100: 지지유닛 110: 베이스 부재100: support unit 110: base member
111: 바닥플레이트 113: 측벽111: bottom plate 113: side wall
120: 결합부재 121: 결합플레이트120: coupling member 121: coupling plate
123: 제1 보조방열핀 200: 제1 방열유닛123: first auxiliary heat dissipation pin 200: first heat dissipation unit
210: 방열파이프 211: 유로형성리브210: heat radiation pipe 211: flow path forming rib
213: 벤딩부 215: 파이프 몸체부213: bending portion 215: pipe body portion
220: 방열부재 221: 방열허브220: heat dissipation member 221: heat dissipation hub
223: 제1 방열핀 225: 제2 방열핀223: first heat dissipation fin 225: second heat dissipation fin
240: 제2 보조방열판 250: 파이프 마개240: second auxiliary heat sink 250: pipe stopper
300: 제2 방열유닛300: second heat dissipation unit
이하, 첨부된 도면을 참조하여, 본 발명에 따른 엘이디 조명기구용 방열장치의 실시 예를 설명한다.Hereinafter, with reference to the accompanying drawings, it will be described an embodiment of a heat radiating device for an LED lighting device according to the present invention.
도 1 내지 도 3을 참조하여, 본 발명에 따른 엘이디 조명기구용 방열장치의 일 실시 예를 구체적으로 설명한다.1 to 3, an embodiment of a heat dissipation device for an LED lighting device according to the present invention will be described in detail.
본 실시 예에 따른 엘이디 조명기구용 방열장치는 엘이디 조명기구(10)에 결합되는 지지유닛(100), 그리고 상기 지지유닛(100)에 결합되는 방열유닛을 포함한다.The heat dissipation device for an LED lighting device according to the present embodiment includes a support unit 100 coupled to the LED light fixture 10, and a heat dissipation unit coupled to the support unit 100.
상기 엘이디 조명기구(10)는 1W 급 이상의 고출력 엘이디 모듈(13)과, 상기 엘이디 모듈(13)이 설치된 모듈 플레이트(11), 상기 모듈 플레이트(11)와 상기 지지유닛(100)을 결합하기 위한 체결나사(15)를 포함한다.The LED lighting device 10 is a high power LED module 13 or more of 1W class, the module plate 11 is installed, the module plate 11 is installed for coupling the module plate 11 and the support unit 100 And a fastening screw 15.
상기 방열유닛은 상기 지지유닛(100)에 체결되는 제1 방열유닛(200) 및 제2 방열유닛(300)을 포함한다. 상기 제1 방열유닛(200)과 상기 제2 방열유닛(300)은 실질적으로 동일한 구조를 가지므로, 상기 제1 방열유닛(200)에 대해서만 설명한다.The heat dissipation unit includes a first heat dissipation unit 200 and a second heat dissipation unit 300 fastened to the support unit 100. Since the first heat dissipation unit 200 and the second heat dissipation unit 300 have substantially the same structure, only the first heat dissipation unit 200 will be described.
상기 제1 방열유닛(200)은 상기 엘이디 조명기구(10)에서 발생하는 열을 전달하기 위한 매질과 적외선 방출특성을 갖는 분말을 포함하는 작동유체가 내장되어 있는 방열파이프(210)와, 상기 방열파이프(210)의 외주면 상에 설치되는 방열부재(220)를 포함한다.The first heat dissipation unit 200 includes a heat dissipation pipe 210 having a working fluid containing a medium for transferring heat generated by the LED lighting device 10 and a powder having infrared ray emission characteristics, and the heat dissipation. And a heat dissipation member 220 installed on the outer circumferential surface of the pipe 210.
상기 매질로는 메틸 알코올, 암모니아, 메틸 클로로포름 등이 사용될 수 있다. 여기서, 상기 매질은 상온에서 물보다 비등점이 낮은 액체라면 어떠한 액체라도 무관하다. Methyl alcohol, ammonia, methyl chloroform and the like may be used as the medium. Herein, the medium may be any liquid as long as the liquid has a lower boiling point than water at room temperature.
또한, 상기 분말로는 규산염 광물이 사용될 수 있다. 여기서, 상기 분말은 가열되었을 때 적외선을 방출하는 어떠한 광물이 사용되더라도 무관하다.In addition, a silicate mineral may be used as the powder. Herein, the powder is irrelevant to any mineral that emits infrared rays when heated.
상기 방열파이프(210)는 파이프 몸체부(215)와, 상기 파이프 몸체부(215)에서 적어도 일측 끝단이 상부방향으로 벤딩되어 있는 벤딩부(213)를 포함한다. The heat dissipation pipe 210 includes a pipe body 215 and a bending part 213 at least one end of which is bent upward in the pipe body 215.
구체적으로, 상기 파이프 몸체부(215)와 상기 벤딩부(213)는 서로 연장형성되어 'U'자 형상을 가지게 된다. 여기서, 상기 방열부재(220)는 상기 벤딩부(213) 상에 각각 한 쌍으로 설치된다. In detail, the pipe body 215 and the bending part 213 are extended to each other to have a 'U' shape. Here, the heat dissipation member 220 is installed in pairs on the bending part 213.
특히, 상기 방열부재(220)는 상기 벤딩부(213)의 외측면 상에 끼워진 후 상기 벤딩부(213)의 확관에 의하여 상기 벤딩부(213)와 견고하게 압착된다. 예를 들면, 상기 벤딩부(213)의 외측면 상에 상기 방열부재(220)를 끼운 후, 상기 방열파이프의 내부에 고압의 유체를 공급함으로써 상기 방열파이프(210)를 확관시키게 된다. In particular, the heat dissipation member 220 is fitted on the outer surface of the bending portion 213 and then firmly pressed against the bending portion 213 by expansion of the bending portion 213. For example, after inserting the heat dissipation member 220 on the outer surface of the bending part 213, the heat dissipation pipe 210 is expanded by supplying a high pressure fluid into the heat dissipation pipe.
그러면, 상기 벤딩부(213)과 확관되면서 상기 방열부재(220)가 밀착되어 압착된다. 여기서, 상기 방열파이프(210)는 스테인레스강으로 제작되고, 상기 방열부재(220)는 알루미늄으로 제작될 수 있다.Then, the heat dissipation member 220 is in close contact with the bending part 213 and pressed. The heat dissipation pipe 210 may be made of stainless steel, and the heat dissipation member 220 may be made of aluminum.
물론, 본 발명은 상술한 실시 예에 한정되지 않고, 상기 방열부재(220)와 상기 벤딩부(213)는 접착제에 의하여 결합될 수도 있고, 별도의 결합수단에 의하여 결합될 수도 있을 것이다.Of course, the present invention is not limited to the above-described embodiment, and the heat dissipation member 220 and the bending part 213 may be coupled by an adhesive or may be coupled by separate coupling means.
상기 엘이디 조명기구(10)가 발열하기 전에 상기 작동유체는 일차적으로는 상기 파이프 몸체부(215)에 존재하게 된다. 이후, 상기 엘이디 조명기구(10)에서 열이 발생하게 되면 상기 분말은 상기 엘이디 조명기구(10)의 열로 인하여 적외선을 방출하게 되고, 상기 매질은 기화하기 시작한다.Before the LED luminaire 10 generates heat, the working fluid is primarily present in the pipe body 215. Then, when heat is generated in the LED lighting device 10, the powder emits infrared rays due to the heat of the LED lighting device 10, the medium starts to vaporize.
이후에, 기화된 매질이 상기 벤딩부(213)로 이동하면서 상기 열을 상기 벤딩부(213)로 전달시킴과 동시에 상기 분말과 상기 매질은 복사열을 상기 벤딩부(213)로 전달하게 된다. Thereafter, the vaporized medium moves to the bending part 213 while transferring the heat to the bending part 213, and at the same time, the powder and the medium transfer radiant heat to the bending part 213.
여기서, 상기 방열파이프(210)의 내부에서 기화된 매질이 상부로 이동하려는 성질을 가지고 있기 때문에 상기 벤딩부(213)로 이동하게 된다. 결과적으로, 상기 방열파이프(210)가 'U'자 형상을 가짐으로 인하여 상기 파이프 몸체부(215)에서 상기 벤딩부(213)로 보다 효과적인 열전달이 일어나게 된다.Here, since the vaporized medium inside the heat dissipation pipe 210 has a property of moving upward, the medium is moved to the bending part 213. As a result, since the heat radiation pipe 210 has a 'U' shape, more efficient heat transfer occurs from the pipe body 215 to the bending part 213.
특히, 상기 방열파이프(210)의 내부압력이 0.001 ~ 0.0001mmhg 의 상태에 있기 때문에 상기 방열파이프(210) 내부의 매질 및 적외선 방출은 상당히 빠른 속도로 진행된다. 상기 방열파이프(210)의 내부는 진공상태를 유지하고 있기 때문에 상기 복사열로 인한 열전달이 크게 일어나게 된다. 이를 위해, 상기 벤딩부(213)의 끝단에는 상기 작동유체를 밀봉하기 위한 파이프 마개(도 5의 250)가 설치되어 있다.In particular, since the internal pressure of the heat dissipation pipe 210 is in a state of 0.001 to 0.0001 mmhg, the medium and the infrared emission inside the heat dissipation pipe 210 proceed at a considerably high speed. Since the inside of the heat dissipation pipe 210 maintains a vacuum state, heat transfer due to the radiant heat is greatly generated. To this end, a pipe stopper 250 for sealing the working fluid is installed at the end of the bending part 213.
다음으로, 상기 벤딩부(213)로 전달된 열은 상기 벤딩부(213)에 결합되어 있는 상기 방열부재(220)로 전도되고, 상기 방열부재(220)는 외부의 차가운 공기에 의하여 방열하게 된다.Next, the heat transferred to the bending part 213 is conducted to the heat dissipation member 220 coupled to the bending part 213, and the heat dissipation member 220 radiates heat by external cold air. .
상기 방열부재(220)는 상기 방열파이프(210)가 관통하면서 밀착되는 방열허브(221)와, 상기 방열허브(221)의 외주면 상의 제1 영역에서 방사형으로 돌출되는 제1 방열핀(223)과, 상기 제1 방열핀(223)과 대향하며 상기 방열허브(221)의 외주면 상의 제2 영역에서 방사형으로 돌출되는 제2 방열핀(225)을 포함한다.The heat dissipation member 220 includes a heat dissipation hub 221 that is in close contact with the heat dissipation pipe 210, a first heat dissipation fin 223 radially protruding from a first area on an outer circumferential surface of the heat dissipation hub 221, and A second heat dissipation fin 225 facing the first heat dissipation fin 223 and protruding radially in a second area on the outer circumferential surface of the heat dissipation hub 221 is included.
상기 제2 방열핀(225)은 상기 방열허브(221)에서 연장되는 핀몸체(225c)와, 상기 핀몸체(225c)에서 분지되는 복수 개의 분지핀(225a,225b)을 포함한다. 상기 복수 개의 분지핀(225a,225b)들은 외부의 공기와 접촉하는 표면적을 넓혀 주게 되기 때문에 방열에 효과적이다.The second heat dissipation fin 225 includes a fin body 225c extending from the heat dissipation hub 221 and a plurality of branch fins 225a and 225b branched from the fin body 225c. The plurality of branching pins 225a and 225b are effective for heat dissipation because they increase the surface area in contact with the outside air.
여기서, 상기 제1 방열핀(223) 및 상기 제2 방열핀(225)의 적어도 일부는 상기 방열유닛을 감싸면서 설치되는 방열케이스(1)의 내측공간 형상에 대응되도록 잘려진 형상을 가진다. 상기 제1 방열핀(223) 및 상기 제2 방열핀(225)이 상기 방열허브(221)에서 돌출된 높이는 상기 방열케이스(1)의 형상에 따라 서로 다르게 제작된다.Here, at least some of the first heat dissipation fin 223 and the second heat dissipation fin 225 have a shape that is cut to correspond to the inner space shape of the heat dissipation case 1 installed while surrounding the heat dissipation unit. The height of the first heat dissipation fin 223 and the second heat dissipation fin 225 protruding from the heat dissipation hub 221 is different from each other depending on the shape of the heat dissipation case 1.
결과적으로, 상기 제1 방열핀(223) 및 제2 방열핀(225)은 상기 방열케이스(1)의 내부공간 형상에 대응되는 형상으로 구비되면서도 외부 공기와의 열교환 면적을 최대화시킬 수 있는 형상을 가지게 된다.As a result, the first heat dissipation fin 223 and the second heat dissipation fin 225 have a shape corresponding to the shape of the inner space of the heat dissipation case 1 and have a shape capable of maximizing the heat exchange area with the outside air. .
한편, 상기 지지유닛(100)은 베이스 부재(110)와, 상기 베이스 부재(110)와 상기 방열파이프(210)를 결합하기 위한 결합부재(120)를 포함한다.On the other hand, the support unit 100 includes a base member 110, the coupling member 120 for coupling the base member 110 and the heat dissipation pipe 210.
상기 베이스 부재(110)는 상기 엘이디 조명기구(10)와 직접적으로 접촉하는 바닥플레이트(111)와, 상기 바닥플레이트(111)에서 일정간격을 가지면서 돌출된 측벽(113)을 포함한다.The base member 110 includes a bottom plate 111 directly contacting the LED lighting device 10, and a side wall 113 protruding at a predetermined interval from the bottom plate 111.
상기 바닥플레이트(111)의 상면에는 상기 방열파이프(210)의 외측면 형상과 대응되는 파이프 안착부(111a)가 형성되어 있다. 상기 파이프 안착부(111a)에 상기 방열파이프(210)가 삽입 설치되면, 상기 바닥플레이트(111)의 열이 상기 방열파이프(210)로 전도되는 열교환면적이 늘어나게 되고 이로 인하여 상기 바닥플레이트(111)의 열이 상기 방열파이프(210)로 효과적으로 전달되게 된다.The upper surface of the bottom plate 111 is formed with a pipe seating portion (111a) corresponding to the outer surface shape of the heat dissipation pipe (210). When the heat dissipation pipe 210 is inserted and installed in the pipe seating portion 111a, the heat exchange area in which the heat of the bottom plate 111 is conducted to the heat dissipation pipe 210 increases, and thus the bottom plate 111 Heat is effectively transmitted to the heat dissipation pipe 210.
또한, 상기 바닥플레이트(111)의 내부에는 외부와 연통되는 방열공간(111c)이 형성되어 있다. 결과적으로, 상기 바닥플레이트(111)의 내부공간은 내부의 지지리브(111b)에 의하여 지지되면서 외부와 연통되어 있다.In addition, a heat dissipation space 111c is formed in the bottom plate 111 to communicate with the outside. As a result, the inner space of the bottom plate 111 is communicated with the outside while being supported by the support ribs 111b therein.
결과적으로, 상기 엘이디 조명기구(10)와 직접적으로 접촉하고 있는 상기 바닥플레이트 자체도 외부 공기와의 열교환을 통하여 상기 엘이디 조명기구(10)에서 발생하는 열을 외부로 방출하고 있다.As a result, the floor plate itself, which is in direct contact with the LED lighting device 10, also emits heat generated by the LED lighting device 10 to the outside through heat exchange with external air.
상기 측벽(113)도 상기 바닥플레이트(111)로부터 돌출 형성되어 하나의 방열핀 역할을 수행하게 된다.The side wall 113 is also formed to protrude from the bottom plate 111 to serve as one heat sink fin.
상기 결합부재(120)는 상기 방열파이프(210)의 외주면과 대응되는 함몰부(121a)가 형성된 결합플레이트(121)와, 상기 결합플레이트(121) 상에서 돌출형성되어 상기 방열파이프(210)의 열을 외부로 방출시키는 제1 보조 방열핀(123)과, 상기 결합플레이트(121)와 상기 베이스 부재(110)를 결합시키기 위한 체결구(125)를 포함한다.The coupling member 120 includes a coupling plate 121 having a recess 121a corresponding to an outer circumferential surface of the heat dissipation pipe 210 and a protrusion formed on the coupling plate 121 to heat the heat dissipation pipe 210. It includes a first auxiliary heat dissipation fin 123 for discharging to the outside, and a fastener 125 for coupling the coupling plate 121 and the base member 110.
상기 함몰부(121a)와 상기 파이프 안착부(111a)는 서로 대향되도록 설치되면서 상기 방열파이프(210)의 파이프 몸체부(215)의 외주면을 완전하게 감싸게 된다.The recess 121a and the pipe seat 111a are installed to face each other and completely surround the outer circumferential surface of the pipe body 215 of the heat dissipation pipe 210.
결과적으로, 상기 함몰부(121a)는 상기 방열파이프(210)와의 열교환 면적을 넓히게 되고, 상기 방열파이프(210)에서 전달된 열은 상기 제1 보조 방열핀(123)에 의하여 외부로 방열되게 된다.As a result, the recess 121a widens the heat exchange area with the heat dissipation pipe 210, and heat transmitted from the heat dissipation pipe 210 is radiated to the outside by the first auxiliary heat dissipation fin 123.
도 4를 참조하여, 본 발명에 따른 엘이디 조명기구용 방열장치에 구비된 제1 방열유닛의 제2 실시 예를 설명한다.Referring to Figure 4, a second embodiment of the first heat dissipation unit provided in the heat dissipation device for LED lighting apparatus according to the present invention.
본 실시 예에 따른 제1 방열유닛은 상술한 실시 예에 따른 제1 방열유닛과 대부분 유사하므로 동일한 구성에 대한 상세한 설명은 생략한다. 다만, 본 실시 예에 따른 제1 방열유닛은 상술한 실시예와 달리, 방열파이프(210)의 열을 외부로 방출하기 위하여 상기 방열파이프(210)의 외주면 상의 적어도 일부영역에 감기는 제2 보조 방열핀(240)을 포함하고 있다.Since the first heat dissipation unit according to the present embodiment is mostly similar to the first heat dissipation unit according to the above-described embodiment, a detailed description of the same configuration is omitted. However, unlike the above-described embodiment, the first heat dissipation unit according to the present embodiment has a second auxiliary winding wound on at least a partial region on the outer circumferential surface of the heat dissipation pipe 210 to dissipate heat from the heat dissipation pipe 210 to the outside. The heat dissipation fin 240 is included.
상기 제2 보조 방열핀(240)은 주름진 형상을 가지면서 상기 방열파이프(210)의 외주면에 감겨진다. 상기 제2 보조 방열핀(240)은 상기 방열파이프의 외주면에 원형으로 감겨질 수도 있고, 나선형으로 감겨질 수 있다.The second auxiliary heat dissipation fin 240 has a corrugated shape and is wound on the outer circumferential surface of the heat dissipation pipe 210. The second auxiliary heat dissipation fin 240 may be wound in a circular shape on the outer circumferential surface of the heat dissipation pipe or spirally.
상기 제2 보조 방열핀(240)이 주름진 형상을 가짐으로써 외부 공기와의 접촉면적이 증가하게 되어 상기 방열파이프(210)의 열을 외부로 효과적으로 방출하게 된다. Since the second auxiliary heat dissipation fin 240 has a corrugated shape, a contact area with external air is increased to effectively discharge heat of the heat dissipation pipe 210 to the outside.
물론, 본 발명은 상술한 실시 예에 한정되지 않고, 상기 방열파이프의 일부영역에서 외주면 자체가 주름지게 형성될 수도 있을 것이다.Of course, the present invention is not limited to the above-described embodiment, and the outer circumferential surface itself may be formed to be wrinkled in a partial region of the heat dissipation pipe.
도 5를 참조하여, 본 발명에 따른 엘이디 조명기구용 방열장치에 구비된 제1 방열유닛의 제3 실시 예를 설명한다. 도 5는 본 실시 예에 따른 방열파이프의 단면도를 나타낸다.Referring to Figure 5, a third embodiment of the first heat dissipation unit provided in the heat dissipation device for LED lighting apparatus according to the present invention. 5 is a sectional view of a heat radiation pipe according to the present embodiment.
본 실시 예에 따른 제1 방열유닛에 구비된 방열파이프는 상술한 실시 예에 따른 제1 방열유닛에 구비된 방열파이프와 대부분 유사하므로 동일한 구성에 대한 상세한 설명은 생략한다. 다만, 본 실시 예에 따른 제1 방열유닛에 구비된 방열파이프의 내부에는 상술한 실시 예와 달리, 작동유체 중 벤딩부(213)에서 열교환을 통하여 액화된 작동유체가 파이프 몸체부(215)로 이동되도록 하기 위한 복귀유로를 형성하는 유로형성리브(211)가 돌출되어 있다.Since the heat dissipation pipe provided in the first heat dissipation unit according to the present embodiment is mostly similar to the heat dissipation pipe provided in the first heat dissipation unit according to the above-described embodiment, detailed description of the same configuration will be omitted. However, unlike the above-described embodiment, the working fluid liquefied through heat exchange in the bending part 213 of the working fluid is transferred to the pipe body part 215 in the heat dissipation pipe provided in the first heat dissipation unit according to the present embodiment. A flow path forming rib 211 which protrudes a return flow path for movement is protruded.
구체적으로, 상기 유로형성리브(211)는 상기 벤딩부(213)와, 상기 파이프 몸체부(215)의 일부분의 내주면 상에서 일정한 간격을 가지면서 복수개 설치된다. 상기 유로형성리브(211)들 사이의 간격은 상기 작동유체가 상기 벤딩부(213)에서 상기 파이프 몸체부의 작동유체 초기장소(S)로 이동되도록 하는 복귀유로를 형성하게 된다.Specifically, the flow path forming ribs 211 are provided in plural, with a predetermined distance on the inner peripheral surface of the bending portion 213 and a portion of the pipe body portion 215. The interval between the flow path forming ribs 211 forms a return flow path for allowing the working fluid to be moved from the bending part 213 to the working fluid initial position S of the pipe body part.
또한, 본 실시 예에 따른 제1 방열유닛에는 제1 실시예에 따른 방열유닛에서 설명한 바 있는 파이프 마개(250)가 설치되어 있다.In addition, the first heat dissipation unit according to the present embodiment is provided with a pipe cap 250 as described in the heat dissipation unit according to the first embodiment.
본 발명은 상술한 특정의 바람직한 실시 예에 한정되지 아니하며, 실용신안등록청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형실시가 가능한 것은 물론이고, 그와 같은 변경은 청구범위 기재의 범위 내에 있게 된다.The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by any person having ordinary skill in the art without departing from the gist of the present invention claimed in the utility model registration claims. Of course, such changes are within the scope of the claims.
본 발명은 고출력 엘이디 도명기구에 사용되는 방열장치에 관한 것으로서, 일반도로, 관공서, 학교 등의 가로등 뿐만 아니라 고기잡이를 위한 집어등에 사용될 수 있으므로 산업상 널리 이용될 수 있다. The present invention relates to a heat dissipation device used in a high-power LED lighting device, and can be widely used in the industry because it can be used for fishing lamps as well as street lamps in general roads, government offices, schools and the like.
Claims (8)
- 엘이디 조명기구에 결합되는 지지유닛; 그리고,A support unit coupled to the LED lighting fixture; And,상기 지지유닛에 결합되는 방열유닛을 포함하며,It includes a heat dissipation unit coupled to the support unit,상기 방열유닛은 상기 엘이디 조명기구에서 발생하는 열을 전달하기 위한 매질과 적외선 방출특성을 갖는 분말을 포함하는 작동유체가 내장되어 있는 방열파이프와, 상기 방열파이프의 외주면 상에 설치되는 방열부재를 포함하며,The heat dissipation unit includes a heat dissipation pipe having a working fluid containing a medium for transferring heat generated by the LED lighting device and a powder having infrared emission characteristics, and a heat dissipation member installed on an outer circumferential surface of the heat dissipation pipe. ,상기 방열파이프는 파이프 몸체부와 상기 파이프 몸체부에서 적어도 일측 끝단이 상부방향으로 벤딩되어 있는 벤딩부를 가지며, 상기 방열부재는 상기 벤딩부 상에 설치되고,The heat dissipation pipe has a pipe body part and a bending part at least one end of which is bent upward in the pipe body part, and the heat dissipation member is installed on the bending part,상기 지지유닛은 상기 방열파이프의 외측면 형상과 대응되는 파이프 안착부가 형성된 베이스 부재와, 상기 베이스 부재와 상기 방열파이프를 결합하기 위한 결합부재를 갖는 것을 특징으로 하는 엘이디 조명기구용 방열장치.The support unit has a base member formed with a pipe seating portion corresponding to the outer surface shape of the heat dissipation pipe, and a heat dissipation device for an LED lighting device, characterized in that the coupling member for coupling the base member and the heat dissipation pipe.
- 제1항에 있어서,The method of claim 1,상기 파이프 몸체부와 상기 벤딩부는 서로 연장형성되어 'U'자 형상을 가지며, 상기 벤딩부의 끝단에는 상기 작동유체를 밀봉하기 위한 파이프 마개가 설치되는 것을 특징으로 하는 엘이디 조명기구용 방열장치.The pipe body portion and the bending portion extending from each other has a 'U' shape, the heat dissipation device for an LED lighting device, characterized in that the end of the bending portion is provided with a pipe cap for sealing the working fluid.
- 제1항에 있어서,The method of claim 1,상기 방열부재는 상기 방열파이프가 관통하면서 밀착되는 방열허브와, 상기 방열허브의 외주면 상의 제1 영역에서 방사형으로 돌출되는 제1 방열핀과, 상기 제1 방열핀과 대향하며 상기 방열허브의 외주면 상의 제2 영역에서 방사형으로 돌출되는 제2 방열핀을 포함하며, 상기 제2 방열핀은 상기 방열허브에서 연장되는 핀몸체와, 상기 핀몸체에서 분지되는 복수의 분지핀을 포함하는 것을 특징으로 하는 엘이디 조명기구용 방열장치.The heat dissipation member may include a heat dissipation hub that is in close contact with the heat dissipation pipe, a first heat dissipation fin protruding radially from a first region on an outer circumferential surface of the heat dissipation hub, and a second heat dissipation fin opposite to the first heat dissipation fin. And a second heat dissipation fin protruding radially from the region, wherein the second heat dissipation fin includes a fin body extending from the heat dissipation hub and a plurality of branch fins branched from the fin body. .
- 제3항에 있어서,The method of claim 3,상기 제1 방열핀 및 상기 제2 방열핀의 적어도 일부는 상기 방열유닛을 감싸면서 설치되는 방열케이스의 내측공간 형상에 대응되도록 잘려진 형상을 가지는 것을 특징으로 하는 엘이디 조명기구용 방열장치.At least a portion of the first heat dissipation fin and the second heat dissipation fin has a shape cut to correspond to the inner space shape of the heat dissipation case is installed while surrounding the heat dissipation unit.
- 제1항에 있어서,The method of claim 1,상기 베이스 부재는 상기 엘이디 조명기구와 직접적으로 접촉하는 바닥플레이트를 포함하며, 상기 바닥플레이트의 내부에는 외부와 연통되는 방열공간을 형성하는 것을 특징으로 하는 엘이디 조명기구용 방열장치. The base member includes a bottom plate in direct contact with the LED lighting fixture, the heat dissipation device for an LED lighting fixture, characterized in that the inside of the bottom plate to form a heat dissipation space in communication with the outside.
- 제1항에 있어서,The method of claim 1,상기 결합부재는 상기 방열파이프의 외주면과 대응되는 함몰부가 형성된 결합플레이트와, 상기 결합플레이트 상에서 돌출형성되어 상기 방열파이프의 열을 외부로 방출시키는 제1 보조 방열핀을 포함하는 것을 특징으로 하는 엘이디 조명기구용 방열장치.The coupling member includes a coupling plate having a depression corresponding to an outer circumferential surface of the heat dissipation pipe, and a first auxiliary heat dissipation fin protruding from the coupling plate to dissipate heat of the heat dissipation pipe to the outside. Heat dissipation.
- 제1항에 있어서,The method of claim 1,상기 방열유닛은 상기 방열파이프의 열을 외부로 방출하기 위하여 상기 방열파이프의 외주면 상의 적어도 일부영역에 감기는 제2 보조 방열핀을 더 포함하는 것을 특징으로 하는 엘이디 조명기구용 방열장치. And the heat dissipation unit further includes a second auxiliary heat dissipation fin wound around at least a portion of an outer circumferential surface of the heat dissipation pipe to dissipate heat of the heat dissipation pipe to the outside.
- 제1항에 있어서,The method of claim 1,상기 방열파이프의 내부에는 상기 작동유체 중 상기 벤딩부에서 액화된 작동유체가 상기 파이프 몸체부로 이동되도록 하기 위한 복귀유로를 형성하는 유로형성리브가 형성되어 있는 것을 특징으로 하는 엘이디 조명기구용 방열장치.The heat dissipation device for an LED lighting device, characterized in that the flow path forming ribs are formed in the heat dissipation pipe to form a return flow path for allowing the working fluid liquefied in the bending part of the working fluid to move to the pipe body.
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JP2014534466A JP5780478B2 (en) | 2011-10-04 | 2012-09-26 | Heat dissipation device for LED lighting fixtures |
CN201280056955.8A CN103946632B (en) | 2011-10-04 | 2012-09-26 | Heat sink device for an LED lighting apparatus |
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JP5780478B2 (en) | 2015-09-16 |
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