WO2013051812A1

WO2013051812A1 - Heat sink device for an led lighting apparatus

Info

Publication number: WO2013051812A1
Application number: PCT/KR2012/007744
Authority: WO
Inventors: 김용길
Original assignee: 새빛테크 주식회사
Priority date: 2011-10-04
Filing date: 2012-09-26
Publication date: 2013-04-11
Also published as: KR200460223Y1; CN103946632A; CN103946632B; JP2014532266A; JP5780478B2

Abstract

The present invention relates to a heat sink device for an LED lighting apparatus, which has a simple structure and superior heat dissipation efficiency. To this end, the heat sink device includes: a support unit coupled to the LED lighting apparatus; and a heat sink unit coupled to the support unit. The heat sink unit includes: a heat sink pipe in which a medium for transferring heat generated in the LED lighting apparatus and a working fluid containing powder having an infrared emission characteristic are provided; and a heat sink member disposed on the outer circumferential surface of the heat sink pipe. The heat sink pipe includes a pipe body part and a bent part wherein at least one end of the pipe body part is bent upward. The heat sink member is disposed on the bent part.

Description

[Revision 23.10.2012 by Rule 26] 방열 Insulation device for LED lighting fixtures

The present invention relates to a heat dissipation device for an LED luminaire, and more particularly, to a heat dissipation device for an LED luminaire capable of efficiently dissipating heat generated from the LED luminaire.

Lighting using a light emitting diode, that is, a light emitting diode (LED), has recently received great attention as an environmentally friendly technology. The global white LED lighting market has grown by nearly 50% annually since 2006, and it is becoming increasingly realistic that LEDs will replace fluorescent lamps and other lighting fixtures in the future as LED technology advances.

In general, the recent LED lighting fixtures tend to reduce the number of LED mounting by using a high-power 1W or more LED package than to arrange a plurality of low-power LEDs.

When using high output LEDs in lighting fixtures, the problem is heat dissipation. When a high power LED is used in a luminaire, a large amount of heat is generated in the LED itself due to the high power. If the heat generated from the LED is not properly radiated, that is, the LED is not properly cooled, the forward voltage may be lowered, thereby deteriorating the luminous efficiency and shortening the life of the LED. In particular, in the case of outdoor lighting such as street lamps or picking lamps, the trend is prominent because more and more bright lighting is preferred.

In order to solve this heat dissipation problem, many LED lighting fixtures using a metal base substrate have been proposed. However, even metal base substrates are difficult to secure sufficient heat dissipation. As a substrate for a high output LED, a ceramic substrate printed with silver paste on an AlN (Aluminum Nitride) plate having high thermal conductivity is widely known, but a disadvantage is that the manufacturing cost is high.

Korean Patent Publication No. 10-1031650 invented by the present applicant discloses a cooling device for an LED lighting device and an LED cooling device using the same.

In recent years, there is an attempt to improve heat dissipation by improving the substrate structure of the LED package. As another approach, attempts have been made to improve the heat dissipation by improving the mechanical structure of the LED chip. However, all these methods have the disadvantage of being expensive.

The problem to be solved of the present invention is to provide a heat radiating device for an LED lighting fixture having a simple structure and excellent heat dissipation efficiency.

In order to achieve the above object to be solved, the present invention includes a support unit coupled to the LED luminaire, and a heat dissipation unit coupled to the support unit, the heat dissipation unit transfers heat generated from the LED luminaire And a heat dissipation pipe having a working fluid containing therein a powder having a medium and an infrared ray emission characteristic, and a heat dissipation member installed on an outer circumferential surface of the heat dissipation pipe, wherein the heat dissipation pipe includes a pipe body part and the pipe body part. At least one end has a bending portion is bent in the upper direction, the heat dissipation member is installed on the bending portion, the support unit is a base member formed with a pipe seating portion corresponding to the outer surface shape of the heat dissipation pipe, And a coupling member for coupling the base member and the heat dissipation pipe. Mechanism for a LED fixture provides a heat radiating apparatus.

The pipe body part and the bending part may be extended to each other to have a 'U' shape, and a pipe stopper for sealing the working fluid may be installed at an end of the bending part.

The heat dissipation member may include a heat dissipation hub that is in close contact with the heat dissipation pipe, a first heat dissipation fin protruding radially from a first region on an outer circumferential surface of the heat dissipation hub, and a second heat dissipation fin opposite to the first heat dissipation fin. And a second heat dissipation fin protruding radially from the area, wherein the second heat dissipation fin may include a fin body extending from the heat dissipation hub and a plurality of branch fins branched from the fin body.

At least a portion of the first heat dissipation fin and the second heat dissipation fin may have a shape cut to correspond to an inner space shape of the heat dissipation case installed while surrounding the heat dissipation unit.

The base member may include a bottom plate in direct contact with the LED luminaire, and may form a heat dissipation space in communication with the outside in the bottom plate.

The coupling member may include a coupling plate having a depression corresponding to an outer circumferential surface of the heat dissipation pipe, and a first auxiliary heat dissipation fin protruding from the coupling plate to discharge heat of the heat dissipation pipe to the outside.

According to another embodiment of the present invention, the heat dissipation unit may further include a second auxiliary heat dissipation fin wound around at least a portion of the outer circumferential surface of the heat dissipation pipe to dissipate heat of the heat dissipation pipe to the outside.

According to another embodiment of the present invention, a flow path forming rib may be formed in the heat dissipation pipe to form a return flow path for moving the working fluid liquefied in the bending part of the working fluid to the pipe body part.

Referring to the heat dissipation device for an LED lighting device according to the present invention.

First, the heat dissipation pipe has a pipe body part and a bending part having both ends bent upward in the pipe body part to facilitate heat transfer from the heat dissipation pipe to the heat dissipation member, thereby simplifying the structure and increasing heat transfer efficiency. There is an advantage.

Second, the heat dissipation member is provided with a first heat dissipation fin and a second heat dissipation fin, the second heat dissipation fin is configured to have a fin body extending from the heat dissipation hub and a plurality of branch fins branched from the fin body, the second heat dissipation fin At least a part of the configuration may have a shape that is cut to correspond to the inner space shape of the heat dissipation case installed while surrounding the heat dissipation unit, thereby maximizing the heat dissipation effect and at the same time having a compact structure.

Third, a pipe seating portion corresponding to the outer surface shape of the heat dissipation pipe is formed on the upper surface of the bottom plate, and the heat dissipation space communicating with the outside is formed inside the bottom plate to dissipate heat generated from the LED lighting fixture to the outside as much as possible. There is an advantage to this.

Fourth, the coupling plate is provided with a depression corresponding to the outer peripheral surface of the heat dissipation pipe, the upper surface of the coupling plate is formed by the first auxiliary heat dissipation fins for dissipating heat of the heat dissipation pipe to the outside is formed in the LED lighting fixture There is an advantage that can dissipate heat to the outside as possible.

1 is a perspective view showing a state in which the heat dissipation device for the LED lighting fixture according to the present invention is coupled with the LED lighting fixture.

Figure 2 is a perspective view showing a heat radiation device for the LED lighting fixture according to the present invention.

Figure 3 is a perspective view showing a first embodiment of the first heat dissipation unit provided in the heat dissipating device for LED lighting apparatus according to the present invention.

Figure 4 is a perspective view showing a second embodiment of the first heat dissipation unit provided in the heat dissipation device for LED lighting apparatus according to the present invention.

5 is a cross-sectional view of the heat dissipation pipe according to the third embodiment of the first heat dissipation unit provided in the heat dissipation device for LED lighting apparatus according to the present invention.

1: heat dissipation case 10: LED lighting fixture

100: support unit 110: base member

111: bottom plate 113: side wall

120: coupling member 121: coupling plate

123: first auxiliary heat dissipation pin 200: first heat dissipation unit

210: heat radiation pipe 211: flow path forming rib

213: bending portion 215: pipe body portion

220: heat dissipation member 221: heat dissipation hub

223: first heat dissipation fin 225: second heat dissipation fin

240: second auxiliary heat sink 250: pipe stopper

300: second heat dissipation unit

Hereinafter, with reference to the accompanying drawings, it will be described an embodiment of a heat radiating device for an LED lighting device according to the present invention.

1 to 3, an embodiment of a heat dissipation device for an LED lighting device according to the present invention will be described in detail.

The heat dissipation device for an LED lighting device according to the present embodiment includes a support unit 100 coupled to the LED light fixture 10, and a heat dissipation unit coupled to the support unit 100.

The LED lighting device 10 is a high power LED module 13 or more of 1W class, the module plate 11 is installed, the module plate 11 is installed for coupling the module plate 11 and the support unit 100 And a fastening screw 15.

The heat dissipation unit includes a first heat dissipation unit 200 and a second heat dissipation unit 300 fastened to the support unit 100. Since the first heat dissipation unit 200 and the second heat dissipation unit 300 have substantially the same structure, only the first heat dissipation unit 200 will be described.

The first heat dissipation unit 200 includes a heat dissipation pipe 210 having a working fluid containing a medium for transferring heat generated by the LED lighting device 10 and a powder having infrared ray emission characteristics, and the heat dissipation. And a heat dissipation member 220 installed on the outer circumferential surface of the pipe 210.

Methyl alcohol, ammonia, methyl chloroform and the like may be used as the medium. Herein, the medium may be any liquid as long as the liquid has a lower boiling point than water at room temperature.

In addition, a silicate mineral may be used as the powder. Herein, the powder is irrelevant to any mineral that emits infrared rays when heated.

The heat dissipation pipe 210 includes a pipe body 215 and a bending part 213 at least one end of which is bent upward in the pipe body 215.

In detail, the pipe body 215 and the bending part 213 are extended to each other to have a 'U' shape. Here, the heat dissipation member 220 is installed in pairs on the bending part 213.

In particular, the heat dissipation member 220 is fitted on the outer surface of the bending portion 213 and then firmly pressed against the bending portion 213 by expansion of the bending portion 213. For example, after inserting the heat dissipation member 220 on the outer surface of the bending part 213, the heat dissipation pipe 210 is expanded by supplying a high pressure fluid into the heat dissipation pipe.

Then, the heat dissipation member 220 is in close contact with the bending part 213 and pressed. The heat dissipation pipe 210 may be made of stainless steel, and the heat dissipation member 220 may be made of aluminum.

Of course, the present invention is not limited to the above-described embodiment, and the heat dissipation member 220 and the bending part 213 may be coupled by an adhesive or may be coupled by separate coupling means.

Before the LED luminaire 10 generates heat, the working fluid is primarily present in the pipe body 215. Then, when heat is generated in the LED lighting device 10, the powder emits infrared rays due to the heat of the LED lighting device 10, the medium starts to vaporize.

Thereafter, the vaporized medium moves to the bending part 213 while transferring the heat to the bending part 213, and at the same time, the powder and the medium transfer radiant heat to the bending part 213.

Here, since the vaporized medium inside the heat dissipation pipe 210 has a property of moving upward, the medium is moved to the bending part 213. As a result, since the heat radiation pipe 210 has a 'U' shape, more efficient heat transfer occurs from the pipe body 215 to the bending part 213.

In particular, since the internal pressure of the heat dissipation pipe 210 is in a state of 0.001 to 0.0001 mmhg, the medium and the infrared emission inside the heat dissipation pipe 210 proceed at a considerably high speed. Since the inside of the heat dissipation pipe 210 maintains a vacuum state, heat transfer due to the radiant heat is greatly generated. To this end, a pipe stopper 250 for sealing the working fluid is installed at the end of the bending part 213.

Next, the heat transferred to the bending part 213 is conducted to the heat dissipation member 220 coupled to the bending part 213, and the heat dissipation member 220 radiates heat by external cold air. .

The heat dissipation member 220 includes a heat dissipation hub 221 that is in close contact with the heat dissipation pipe 210, a first heat dissipation fin 223 radially protruding from a first area on an outer circumferential surface of the heat dissipation hub 221, and A second heat dissipation fin 225 facing the first heat dissipation fin 223 and protruding radially in a second area on the outer circumferential surface of the heat dissipation hub 221 is included.

The second heat dissipation fin 225 includes a fin body 225c extending from the heat dissipation hub 221 and a plurality of

branch fins

225a and 225b branched from the fin body 225c. The plurality of branching

pins

225a and 225b are effective for heat dissipation because they increase the surface area in contact with the outside air.

Here, at least some of the first heat dissipation fin 223 and the second heat dissipation fin 225 have a shape that is cut to correspond to the inner space shape of the heat dissipation case 1 installed while surrounding the heat dissipation unit. The height of the first heat dissipation fin 223 and the second heat dissipation fin 225 protruding from the heat dissipation hub 221 is different from each other depending on the shape of the heat dissipation case 1.

As a result, the first heat dissipation fin 223 and the second heat dissipation fin 225 have a shape corresponding to the shape of the inner space of the heat dissipation case 1 and have a shape capable of maximizing the heat exchange area with the outside air. .

On the other hand, the support unit 100 includes a base member 110, the coupling member 120 for coupling the base member 110 and the heat dissipation pipe 210.

The base member 110 includes a bottom plate 111 directly contacting the LED lighting device 10, and a side wall 113 protruding at a predetermined interval from the bottom plate 111.

The upper surface of the bottom plate 111 is formed with a pipe seating portion (111a) corresponding to the outer surface shape of the heat dissipation pipe (210). When the heat dissipation pipe 210 is inserted and installed in the pipe seating portion 111a, the heat exchange area in which the heat of the bottom plate 111 is conducted to the heat dissipation pipe 210 increases, and thus the bottom plate 111 Heat is effectively transmitted to the heat dissipation pipe 210.

In addition, a heat dissipation space 111c is formed in the bottom plate 111 to communicate with the outside. As a result, the inner space of the bottom plate 111 is communicated with the outside while being supported by the support ribs 111b therein.

As a result, the floor plate itself, which is in direct contact with the LED lighting device 10, also emits heat generated by the LED lighting device 10 to the outside through heat exchange with external air.

The side wall 113 is also formed to protrude from the bottom plate 111 to serve as one heat sink fin.

The coupling member 120 includes a coupling plate 121 having a recess 121a corresponding to an outer circumferential surface of the heat dissipation pipe 210 and a protrusion formed on the coupling plate 121 to heat the heat dissipation pipe 210. It includes a first auxiliary heat dissipation fin 123 for discharging to the outside, and a fastener 125 for coupling the coupling plate 121 and the base member 110.

The recess 121a and the pipe seat 111a are installed to face each other and completely surround the outer circumferential surface of the pipe body 215 of the heat dissipation pipe 210.

As a result, the recess 121a widens the heat exchange area with the heat dissipation pipe 210, and heat transmitted from the heat dissipation pipe 210 is radiated to the outside by the first auxiliary heat dissipation fin 123.

Referring to Figure 4, a second embodiment of the first heat dissipation unit provided in the heat dissipation device for LED lighting apparatus according to the present invention.

Since the first heat dissipation unit according to the present embodiment is mostly similar to the first heat dissipation unit according to the above-described embodiment, a detailed description of the same configuration is omitted. However, unlike the above-described embodiment, the first heat dissipation unit according to the present embodiment has a second auxiliary winding wound on at least a partial region on the outer circumferential surface of the heat dissipation pipe 210 to dissipate heat from the heat dissipation pipe 210 to the outside. The heat dissipation fin 240 is included.

The second auxiliary heat dissipation fin 240 has a corrugated shape and is wound on the outer circumferential surface of the heat dissipation pipe 210. The second auxiliary heat dissipation fin 240 may be wound in a circular shape on the outer circumferential surface of the heat dissipation pipe or spirally.

Since the second auxiliary heat dissipation fin 240 has a corrugated shape, a contact area with external air is increased to effectively discharge heat of the heat dissipation pipe 210 to the outside.

Of course, the present invention is not limited to the above-described embodiment, and the outer circumferential surface itself may be formed to be wrinkled in a partial region of the heat dissipation pipe.

Referring to Figure 5, a third embodiment of the first heat dissipation unit provided in the heat dissipation device for LED lighting apparatus according to the present invention. 5 is a sectional view of a heat radiation pipe according to the present embodiment.

Since the heat dissipation pipe provided in the first heat dissipation unit according to the present embodiment is mostly similar to the heat dissipation pipe provided in the first heat dissipation unit according to the above-described embodiment, detailed description of the same configuration will be omitted. However, unlike the above-described embodiment, the working fluid liquefied through heat exchange in the bending part 213 of the working fluid is transferred to the pipe body part 215 in the heat dissipation pipe provided in the first heat dissipation unit according to the present embodiment. A flow path forming rib 211 which protrudes a return flow path for movement is protruded.

Specifically, the flow path forming ribs 211 are provided in plural, with a predetermined distance on the inner peripheral surface of the bending portion 213 and a portion of the pipe body portion 215. The interval between the flow path forming ribs 211 forms a return flow path for allowing the working fluid to be moved from the bending part 213 to the working fluid initial position S of the pipe body part.

In addition, the first heat dissipation unit according to the present embodiment is provided with a pipe cap 250 as described in the heat dissipation unit according to the first embodiment.

The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by any person having ordinary skill in the art without departing from the gist of the present invention claimed in the utility model registration claims. Of course, such changes are within the scope of the claims.

The present invention relates to a heat dissipation device used in a high-power LED lighting device, and can be widely used in the industry because it can be used for fishing lamps as well as street lamps in general roads, government offices, schools and the like.

Claims

A support unit coupled to the LED lighting fixture; And,

It includes a heat dissipation unit coupled to the support unit,

The heat dissipation unit includes a heat dissipation pipe having a working fluid containing a medium for transferring heat generated by the LED lighting device and a powder having infrared emission characteristics, and a heat dissipation member installed on an outer circumferential surface of the heat dissipation pipe. ,

The heat dissipation pipe has a pipe body part and a bending part at least one end of which is bent upward in the pipe body part, and the heat dissipation member is installed on the bending part,

The support unit has a base member formed with a pipe seating portion corresponding to the outer surface shape of the heat dissipation pipe, and a heat dissipation device for an LED lighting device, characterized in that the coupling member for coupling the base member and the heat dissipation pipe.
The method of claim 1,

The pipe body portion and the bending portion extending from each other has a 'U' shape, the heat dissipation device for an LED lighting device, characterized in that the end of the bending portion is provided with a pipe cap for sealing the working fluid.
The method of claim 1,

The heat dissipation member may include a heat dissipation hub that is in close contact with the heat dissipation pipe, a first heat dissipation fin protruding radially from a first region on an outer circumferential surface of the heat dissipation hub, and a second heat dissipation fin opposite to the first heat dissipation fin. And a second heat dissipation fin protruding radially from the region, wherein the second heat dissipation fin includes a fin body extending from the heat dissipation hub and a plurality of branch fins branched from the fin body. .
The method of claim 3,

At least a portion of the first heat dissipation fin and the second heat dissipation fin has a shape cut to correspond to the inner space shape of the heat dissipation case is installed while surrounding the heat dissipation unit.
The method of claim 1,

The base member includes a bottom plate in direct contact with the LED lighting fixture, the heat dissipation device for an LED lighting fixture, characterized in that the inside of the bottom plate to form a heat dissipation space in communication with the outside.
The method of claim 1,

The coupling member includes a coupling plate having a depression corresponding to an outer circumferential surface of the heat dissipation pipe, and a first auxiliary heat dissipation fin protruding from the coupling plate to dissipate heat of the heat dissipation pipe to the outside. Heat dissipation.
The method of claim 1,

And the heat dissipation unit further includes a second auxiliary heat dissipation fin wound around at least a portion of an outer circumferential surface of the heat dissipation pipe to dissipate heat of the heat dissipation pipe to the outside.
The method of claim 1,

The heat dissipation device for an LED lighting device, characterized in that the flow path forming ribs are formed in the heat dissipation pipe to form a return flow path for allowing the working fluid liquefied in the bending part of the working fluid to move to the pipe body.