WO2013165223A1 - Composition d'encre apte à être utilisée pour fabriquer des cellules solaires et procédé de formation de motif l'utilisant - Google Patents

Composition d'encre apte à être utilisée pour fabriquer des cellules solaires et procédé de formation de motif l'utilisant Download PDF

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Publication number
WO2013165223A1
WO2013165223A1 PCT/KR2013/003882 KR2013003882W WO2013165223A1 WO 2013165223 A1 WO2013165223 A1 WO 2013165223A1 KR 2013003882 W KR2013003882 W KR 2013003882W WO 2013165223 A1 WO2013165223 A1 WO 2013165223A1
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WIPO (PCT)
Prior art keywords
ink composition
weight
parts
solar cell
fluorine
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PCT/KR2013/003882
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English (en)
Korean (ko)
Inventor
유민아
구용성
김준형
Original Assignee
주식회사 엘지화학
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Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to CN201380002253.6A priority Critical patent/CN103687915B/zh
Priority to US14/126,189 priority patent/US9302466B2/en
Priority claimed from KR1020130050314A external-priority patent/KR101431485B1/ko
Publication of WO2013165223A1 publication Critical patent/WO2013165223A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
    • B41M2205/14—Production or use of a mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells

Definitions

  • the present invention relates to an ink composition and a pattern forming method using the same, which can be used in manufacturing a solar cell that can be patterned on a silicon substrate having surface irregularities by controlling the fluidity of the ink composition.
  • Solar cells are the core elements of photovoltaic power generation that directly converts solar energy into electricity, and are currently applied to various fields such as electricity, electronic products, or electricity supply to houses or buildings.
  • the manufacturing process of the solar cell includes an electroplating or etching process, and during this process, a material for selectively masking a specific portion of the silicon substrate or applying a material to be used as an insulating film in a solar cell is required.
  • a material for selectively masking a specific portion of the silicon substrate or applying a material to be used as an insulating film in a solar cell is required.
  • the screen printing method it is very difficult to form a fine line width required for manufacturing a solar cell.
  • the present invention is to provide an ink composition and a pattern forming method using the same, which can be used in manufacturing a solar cell that can be patterned on a silicon substrate having surface irregularities such as a solar cell by controlling the fluidity of the ink composition.
  • 1st aspect of this invention is a) polymeric compound which has ethylenically unsaturated bond, b) fluorine-type surfactant; And c) a solvent, wherein the solid content is 45 parts by weight to 99.99 parts by weight based on the total ink composition.
  • a second aspect of the present invention provides a pattern forming method comprising applying the ink composition using a head of an inkjet printer and heat treating the applied ink composition.
  • the third aspect of the present invention provides an etching mask formed by using the ink composition on a silicon substrate for solar cells having irregularities.
  • a fourth aspect of the present invention provides an insulating film formed by using the ink composition on a silicon substrate for solar cells having irregularities.
  • the ink composition usable in the solar cell manufacturing according to the present invention can control the fluidity according to the solid content, so that the pattern can be formed on the silicon substrate having the surface irregularities.
  • the pattern forming method using the ink composition is very useful when forming a solar cell because it is possible to form a fine line width in a non-contact manner by using an inkjet printer.
  • the solar cell may be used as an insulating film or as an etch mask in manufacturing the solar cell, and thus has excellent utility.
  • FIG. 1 is a photograph showing a pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared in Example 1.
  • FIG. 1 is a photograph showing a pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared in Example 1.
  • FIG. 2 is a photograph showing a pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared in Example 2.
  • FIG. 2 is a photograph showing a pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared in Example 2.
  • FIG. 3 is a photograph showing a pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared in Example 3.
  • FIG. 3 is a photograph showing a pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared in Example 3.
  • FIG. 4 is a photograph showing a pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared in Comparative Example 1.
  • FIG. 4 is a photograph showing a pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared in Comparative Example 1.
  • FIG. 5 is a photograph showing a pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared in Comparative Example 2.
  • FIG. 5 is a photograph showing a pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared in Comparative Example 2.
  • FIG. 6 is a photograph showing a pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared in Comparative Example 3.
  • FIG. 7 is a photograph showing a pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared in Comparative Example 4.
  • Ink compositions usable in the solar cell production of the present invention include a) a polymerizable compound having an ethylenically unsaturated bond b) a fluorine-based surfactant; And c) a solvent, wherein the solid content is 45 parts by weight to 99.99 parts by weight based on the total ink composition.
  • the a) polymerizable compound having an ethylenically unsaturated bond is formed of a material which can be polymerized by the generated radicals, and is intended to increase durability of the pattern.
  • the polymerizable compound is viscous and can control the fluidity of the ink on the silicon substrate having surface irregularities.
  • the polymerizable compound having a) ethylenically unsaturated bonds is preferably an acrylic monomer. It is preferable that it is a polyfunctional acrylate which can specifically crosslink, For example, neopentyl glycol diacrylate, ditrimethylol propane tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, Dipentaerythritol hexaacrylate, dipropylene glycol diacrylate, butanediol diacrylate, ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylol triacrylate, trimethylolpropane triacrylate, tripropylene glycol di It may be two or more selected from the group consisting of acrylate, pentaerythritol triacrylate, propylene glycol diacrylate and hexanediol diacrylate, but is
  • the a) polymerizable compound having an ethylenically unsaturated bond may be dipentaerythritol hexaacrylate, trimethylolpropane triacrylate and / or dipropylene glycol diacrylate.
  • the dipentaerythritol hexaacrylate and trimethylolpropane triacrylate can be cross-linked with a multifunctional acrylate, thereby improving chemical resistance, and dipropylene glycol diacrylate has a low viscosity.
  • the polymerizable compound having an ethylenically unsaturated bond may be 40 parts by weight to 98 parts by weight, 60 parts by weight to 96 parts by weight or 70 parts by weight to 94 parts by weight based on the total ink composition.
  • the content of the polymerizable compound having an ethylenically unsaturated bond satisfies the above numerical range, it is possible to form a good line pattern even on a silicon substrate having surface irregularities, and to improve adhesion by adding a substance other than the polymerizable compound.
  • the addition of a surfactant has the advantage of controlling the spreadability of the ink.
  • the b) fluorine-based surfactant is to control the spreadability of the ink, it is preferable that the excellent defoaming characteristics because the poor discharge occurs when bubbles generated during the ink injection into the inkjet equipment is not easily removed.
  • the b) fluorine-based surfactants more preferably include polyethylene glycol and perfluorocarbon.
  • a fluorine-based surfactant including the polyethylene glycol and perfluorocarbon it is easy to control the spreadability of the ink, and the ink does not flow easily, and thus the pattern is easily formed on the silicon substrate having the surface irregularities. There is an advantage.
  • the fluorine-based surfactant has a surface tension of 20 to 30 mN / m or 23 to 27 mN /, for example, when it is made of a toluene solution containing 0.1 wt% of the fluorine-based surfactant. may be m.
  • the surface tension is preferably 20 to 30 mN / m or 24 to 28 mN / m when made of a propyleneglycolmethylether solution containing 0.1% by weight of the fluorine-based surfactant.
  • the fluorine-based surfactant simultaneously satisfies the surface tension values of the toluene solution and the propylene glycol methyl ether solution each containing 0.1 wt% of the surfactant.
  • the surface tension of the toluene solution and / or the propylene glycol methyl ether solution containing 0.1% by weight of a fluorine-based surfactant satisfies the above numerical range, the ink does not spread too much while appropriately covering the surface of the silicon substrate having surface irregularities. This is because there is an advantage that can be kept stable.
  • the surface tension means a tension between air and the solution.
  • the measurement of the surface tension was performed at room temperature using the Du Nouy ring equipment.
  • the b) fluorine-based surfactant may be included in 0.01 parts by weight to 1.0 parts by weight, 0.01 parts by weight to 0.5 parts by weight or 0.03 parts by weight to 0.1 parts by weight based on the total ink composition.
  • the content of the surfactant satisfies the numerical range, the pattern may be formed reproducibly, and the storage stability of the ink is excellent.
  • the c) solvent is to control the viscosity of the ink and the thickness of the formed film is preferably an organic solvent. More specifically, for example, diethylene glycol butyl methyl ether, dielene glycol monobutyl ether acetate, diethylene glycol monomail ether acetate, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate , Butyl lactate, ethoxy ethyl acetate, ethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, ethyl ethoxy propionate, propylene glycol methyl ether acetate, propylene glycol monoethyl ether and propylene glycol butyl ether It may be one or more selected from, but is not limited thereto.
  • the c) solvent may include 0.001 parts by weight to 55 parts by weight based on the total ink composition.
  • the content of the solvent satisfies the above numerical range, line patterning can be formed, the spreadability of the ink decreases, and the pattern uniformity increases.
  • the solid content except for c) the solvent is preferably 45 parts by weight to 99.99 parts by weight, 63 to 99.99 parts by weight or 70 to 99.99 parts by weight based on the total ink composition. That is, as the solid content is increased, the spreadability of the ink decreases, and the uniformity of the pattern is increased, so that stable pattern formation is possible.
  • the c) solvent may be one or a mixture of two or more of those having a boiling point of 140 °C to 250 °C.
  • the boiling point of the solvent satisfies the above numerical range, drying does not occur at the nozzle surface of the inkjet printer, so that the ejection is good, and the solvent can be completely dried after the pattern is formed, thereby providing excellent processability.
  • the ink composition according to the present invention may further include an adhesion promoter in order to improve the adhesion property with the silicon substrate.
  • an acid solution treatment is required for selective etching of the emitter layer in manufacturing a solar cell, in order to prevent a problem of dropping of the pattern.
  • the adhesion promoter may be one having a substituent which generates a silanol group by hydrolysis, or one having a methoxy silyl group or an ethoxy silyl group in a molecule.
  • vinyltrimethoxysilane, vinyltriethoxysilane, glycidoxypropyltrimethoxysilane, glycidoxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane and methacryloxypropyltriethoxysilane It may be one or more selected from the group consisting of, but is not limited thereto.
  • the adhesion promoter may include 0.1 parts by weight to 5.0 parts by weight based on the total ink composition.
  • the content of the adhesion promoter satisfies the numerical range, there is an advantage in that the storage stability of the ink is excellent.
  • acid solution treatment is required. In this case, separation or dropping of the pattern may be prevented.
  • the ink composition of the present invention may further include at least one additive selected from the group consisting of a polymerization initiator, a binder, and the like.
  • the polymerization initiator is for curing the polymerizable compound having an ethylenically unsaturated bond and may be a thermal initiator, a photoinitiator or a combination thereof.
  • a thermal initiator capable of simplifying the process by completing the curing by only one step of heat treatment without an additional process for removing the solvent is preferable.
  • the polymerization initiator preferably contains 0.1 parts by weight to 5.0 parts by weight based on the total ink composition.
  • the content of the polymerization initiator satisfies the numerical range, radicals are not sufficiently generated to prevent thermal polymerization from progressing, and when the polymerization initiator is well dissolved, the ink composition is used as an insulating film. The incidence of defects can be reduced, and when used as an etching mask, the stripper can be easily removed.
  • the content of the polymerization initiator is also the same when using a thermal initiator, a photoinitiator or a combination thereof.
  • the thermal initiator may be, for example, one or more selected from the group consisting of azo compounds, organic peroxides, and hydrogen peroxide, but is not limited thereto.
  • the photoinitiator may be a photopolymerization initiator or a photosensitizer well known in the art, but is not limited thereto.
  • it may be at least one selected from the group consisting of a triazine compound, a biimidazole compound, an acetophenone compound benzophenone compound, and a thioxanthone compound.
  • the binder is not particularly limited as long as it improves the adhesive properties of the formed ink film, facilitates the formation of the ink film, and controls the strength of the formed ink film without impairing the original properties of the composition.
  • binders include styrene, chloro styrene, ⁇ -methyl styrene, vinyltoluene, 2-ethylhexyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, and butyl (meth) acrylic.
  • benzyl (meth) acrylate glycidyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, cyclohexyl (meth) acrylic Latex, dicyclopentanyl (meth) acrylate, isobonyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, tetrahydroperpril (meth) acrylate, hydroxyethyl (meth) acrylate, 2 -Hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxy-3-chloropropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxy Roxybutyl (meth) acrylate, di Methylaminomethyl (meth) acrylate,
  • the binder preferably comprises 0.01 to 8 parts by weight based on the total ink composition.
  • the content of the binder satisfies the numerical range, the viscosity of the ink does not increase, and thus pattern formation is easy.
  • the ink composition usable in the solar cell production according to the invention preferably has a contact angle of 30 ° to 60 °.
  • the contact angle means an angle formed by the tangent leading to the surface of the droplet and the surface of the substrate at the point where the droplet of the dropped ink is in contact with the substrate, and as an apparatus for measuring the contact angle, for example, a contact angle measuring instrument (KRUSS DSA100) There is this.
  • the contact angle is a value measured by dropping ink on a glass substrate.
  • the contact angle of the ink composition satisfies the above numerical range, the spreadability of the ink is small on the silicon substrate having the surface irregularities, so that a pattern having a desired line width can be formed, and the pattern can be formed without breaking the ink without partially clumping the ink. It also has excellent adhesion to the substrate.
  • the pattern forming method includes applying the ink composition according to the present invention using a head of an inkjet printer, and heat treating the applied ink composition.
  • the substrate to which the ink composition is applied may be a glass substrate, a silicon substrate, or a substrate on which metal, SiO 2, or ITO is deposited, and may preferably be a silicon substrate for solar cells having surface irregularities.
  • applying the ink composition may be performed by a method of ejecting ink on a substrate through a inkjet head in a non-contact manner.
  • the inkjet head may be further heated in order to lower the viscosity to allow ink ejection from the inkjet head.
  • the inkjet head is preferably heated to 40 ° C. to 80 ° C. such that the viscosity of the ink composition satisfies 10 cP to 20 cP.
  • the heating temperature of the inkjet head satisfies the numerical range, the viscosity of the ink is low, so that the ejection of the ink from the inkjet head is stable, the problem does not occur in the driving portion of the inkjet equipment, and the storage stability of the ink is increased.
  • the heat treatment step is to dry the film of the applied ink composition, it may be performed using a reduced pressure dryer, a convection oven, a hot plate or an IR oven.
  • the heat treatment temperature may be carried out at 130 °C to 250 °C.
  • thermal curing is insufficient, and thus, the film cannot be used as an etching mask or an insulating film, or when used as an etching mask, it is difficult to remove the pattern and part of the reactant to be reacted is lost by heat. This can prevent problems.
  • the heat treatment step may be performed at a temperature of 160 °C to 200 °C.
  • the heat treatment temperature satisfies the numerical range, the formed etching mask pattern may have a good ability to withstand etching in the selective etching process of the emitter layer for forming the selective emitter, thereby preventing the pattern from falling off or decomposition.
  • removing the etching mask pattern can be easily removed from the alkaline solution.
  • the heat treatment step may be performed at 220 °C to 250 °C.
  • the heat treatment temperature satisfies the above numerical range, a sufficient curing may be achieved since the treatment is performed at a high temperature.
  • the etching mask of the present invention is formed on the silicon substrate for solar cells having irregularities by using the ink composition.
  • the etching mask may be formed by a method well known in the art, for example, may be used as an etching mask after forming a pattern using the pattern forming method according to the present invention.
  • the insulating film of this invention was formed using the said ink composition on the silicon substrate for solar cells with an unevenness
  • the insulating film may be formed by a method well known in the art, but may be used as an insulating film, for example, after forming a pattern using the pattern forming method according to the present invention.
  • V65 1.6 parts by weight was dissolved in a solvent as a thermal initiator in a reaction vessel, and then benzyl methacrylate / methacrylic acid was added at a molar ratio of 68/32. The reaction was carried out for 7.5 hours while maintaining the temperature at 65 ° C. in a nitrogen atmosphere.
  • the copolymer solution obtained above was added to a flask with a stirrer, glycidyl methacrylate was added, and then reacted at 110 ° C. for 6 hours to prepare an acrylic copolymer.
  • V65 1.6 parts by weight was dissolved in a solvent as a thermal initiator in a reaction vessel, and then benzyl methacrylate / styrene / methacrylic acid / lauryl methacrylate was added at a molar ratio of 52/19/12/17.
  • the reaction was carried out for 7.5 hours while maintaining the temperature at 65 ° C. in a nitrogen atmosphere, which was used as a binder resin.
  • the ink composition of the present invention was prepared by mixing 2.00 parts by weight of methoxysilane, 0.04 part by weight of a fluorine-based surfactant, 0.25 parts by weight of V40 manufactured by Wako as an initiator, and 3.47 parts by weight of diethylene glycol methylbutyl ether as a solvent for 2 hours. .
  • the solid content is a value calculated based on the weight part of the total ink composition, excluding the solvent, and the viscosity is a value measured at room temperature (25 ° C.) using a viscometer.
  • Example 1 To the ink composition was prepared in the same manner as in Example 1 in the composition and content shown in Table 1.
  • TMPTA 2 trimethylolpropanetriacrylate
  • ** is when a silicone surfactant is used.
  • Example 1 and Comparative Example 3 were heated to 45.5 ° C, Comparative Example 1 to 37.6 ° C, and Comparative Example 2 to 42.7 ° C.
  • Example 2 Example 3 and Comparative Example 4 discharged the ink at room temperature. After the pattern was formed, the solvent was removed and heat treated at a temperature of 130 ° C. or higher to cure the polymerizable compound having an ethylenically unsaturated bond.
  • FIGS. 4 to 7 are Comparative Examples 1 to 3 It is a photograph showing the pattern formation result after forming a pattern by discharging onto a silicon substrate having surface irregularities using the ink composition prepared according to the fourth.
  • the uniformity of the pattern is reduced when the content of the solid content is 40 parts by weight or less. That is, as the solid content decreases, the spreadability of the ink increases, and when the solid content is 40 parts by weight or less, line patterning is difficult, and the pattern formed by drying the solvent of the ink ensures that the tip of the surface irregularities of the solar cell silicon substrate is properly formed. There was also a problem that could not be covered. In addition, when the fluorine-based surfactant is not used, it can be seen that even if the solid content is high, it is difficult to form a line pattern on a substrate having surface irregularities.

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

La présente invention porte sur une composition d'encre, qui peut être utilisée pour fabriquer des cellules solaires. Plus particulièrement, la présente invention porte sur une composition d'encre, qui peut être utilisée pour fabriquer des cellules solaires, laquelle composition d'encre comprend a) un composé polymérisable ayant une liaison éthyléniquement insaturée, b) un tensioactif fluoré, et c) un solvant, la composition d'encre ayant de 45 parties en poids à 99,99 parties en poids d'un contenu solide. La présente invention porte également sur un procédé de formation de motif utilisant la composition d'encre et sur un film d'isolation et sur un masque de gravure formés à partir de la composition d'encre.
PCT/KR2013/003882 2012-05-03 2013-05-03 Composition d'encre apte à être utilisée pour fabriquer des cellules solaires et procédé de formation de motif l'utilisant WO2013165223A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201380002253.6A CN103687915B (zh) 2012-05-03 2013-05-03 可用于太阳能电池制造工艺中的油墨组合物以及使用该组合物形成图案的方法
US14/126,189 US9302466B2 (en) 2012-05-03 2013-05-03 Ink composition usable in solar battery manufacturing process, and method of forming pattern using the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2012-0046866 2012-05-03
KR20120046866 2012-05-03
KR10-2013-0050314 2013-05-03
KR1020130050314A KR101431485B1 (ko) 2012-05-03 2013-05-03 태양전지 제조에서 이용 가능한 잉크 조성물 및 이를 이용한 패턴형성방법

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WO2013165223A1 true WO2013165223A1 (fr) 2013-11-07

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090005990A (ko) * 2007-07-09 2009-01-14 제이에스알 가부시끼가이샤 감광성 페이스트 조성물 및 패턴 형성 방법
US20090163615A1 (en) * 2005-08-31 2009-06-25 Izhar Halahmi Uv curable hybridcuring ink jet ink composition and solder mask using the same
KR100955977B1 (ko) * 2005-06-03 2010-05-04 다이킨 고교 가부시키가이샤 패턴 형성용 표면 처리제
KR100983010B1 (ko) * 2007-12-27 2010-09-17 한국생산기술연구원 잉크젯을 이용한 유기박막 태양전지 제조방법
KR20110120211A (ko) * 2010-04-28 2011-11-03 칫소가부시키가이샤 잉크젯용 잉크 및 그 용도
KR20120038360A (ko) * 2010-10-13 2012-04-23 제이엔씨 주식회사 광경화성 조성물

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100955977B1 (ko) * 2005-06-03 2010-05-04 다이킨 고교 가부시키가이샤 패턴 형성용 표면 처리제
US20090163615A1 (en) * 2005-08-31 2009-06-25 Izhar Halahmi Uv curable hybridcuring ink jet ink composition and solder mask using the same
KR20090005990A (ko) * 2007-07-09 2009-01-14 제이에스알 가부시끼가이샤 감광성 페이스트 조성물 및 패턴 형성 방법
KR100983010B1 (ko) * 2007-12-27 2010-09-17 한국생산기술연구원 잉크젯을 이용한 유기박막 태양전지 제조방법
KR20110120211A (ko) * 2010-04-28 2011-11-03 칫소가부시키가이샤 잉크젯용 잉크 및 그 용도
KR20120038360A (ko) * 2010-10-13 2012-04-23 제이엔씨 주식회사 광경화성 조성물

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