WO2013019040A2 - Composition de résine hybride organique-inorganique photodurcissable - Google Patents

Composition de résine hybride organique-inorganique photodurcissable Download PDF

Info

Publication number
WO2013019040A2
WO2013019040A2 PCT/KR2012/006035 KR2012006035W WO2013019040A2 WO 2013019040 A2 WO2013019040 A2 WO 2013019040A2 KR 2012006035 W KR2012006035 W KR 2012006035W WO 2013019040 A2 WO2013019040 A2 WO 2013019040A2
Authority
WO
WIPO (PCT)
Prior art keywords
group
resin composition
methacrylate
acrylate
inorganic hybrid
Prior art date
Application number
PCT/KR2012/006035
Other languages
English (en)
Korean (ko)
Other versions
WO2013019040A3 (fr
Inventor
유재원
남동진
김두식
박경민
Original Assignee
주식회사 동진쎄미켐
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120081536A external-priority patent/KR101937140B1/ko
Application filed by 주식회사 동진쎄미켐 filed Critical 주식회사 동진쎄미켐
Priority to CN201280038497.5A priority Critical patent/CN103732689B/zh
Priority to JP2014523838A priority patent/JP6117783B2/ja
Publication of WO2013019040A2 publication Critical patent/WO2013019040A2/fr
Publication of WO2013019040A3 publication Critical patent/WO2013019040A3/fr
Priority to US14/161,778 priority patent/US9469763B2/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/06—Crosslinking by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a photocurable organic-inorganic hybrid resin composition, and more particularly, has excellent physical properties such as UV resistance, chemical resistance, light transmittance, adhesiveness, insulation, heat resistance, flatness, and water resistance, and particularly after coating film curing.
  • the present invention relates to a photocurable organic-inorganic hybrid resin composition having excellent heat resistance and adhesiveness that can withstand thermal deformation due to a change in process temperature in a later process, which is suitable as an insulating material and an encapsulant of an optical device and a semiconductor including a display device.
  • Optical devices including display devices such as liquid crystal displays and OLEDs are subjected to chemical treatments such as acids or alkalis during the manufacturing process, and when the wiring electrode layer is manufactured, the surface is subjected to harsh processing such as exposing the surface to local high temperature heating by sputtering. In order to prevent the device from being damaged by such a treatment, a protective film resistant to a series of treatments is provided on the surface.
  • the protective film Since the protective film must withstand harsh processing in the process, it is required to have excellent adhesion to the substrate or the lower layer of the protective film and to have excellent chemical resistance, light transmittance, insulation, UV resistance, heat resistance, and water resistance. In addition, deterioration such as coloring, yellowing, and whitening should not occur over a long period of time. In some cases, when the protective film is applied to the color filter of the color liquid crystal display device, the step of the color filter may be flattened.
  • thermosetting resin composition containing a polymer having a glycidyl group is known as a material for forming a protective film having various performances.
  • shrinkage of the protective film during chemical treatment or when locally exposed to high temperature is achieved. This can easily cause cracking, including deformation due to expansion.
  • a protective film is generally formed at high temperature 220 degreeC or more. This is a problem when using heat-sensitive substrates such as in organic TFT processes, flexible displays, and OLED processes.
  • the protective film forming conditions used must be low temperature, and in the OLED process, the organic light emitting device is easily deteriorated at high temperature, and materials in the organic TFT process are used.
  • the thermosetting resin composition having a glycidyl group showed a weak characteristic at a high temperature has a problem that is difficult to apply. Therefore, it is easy to form a protective film even at low temperatures, and there is an urgent need for development of materials having improved physical properties such as chemical resistance.
  • the present invention is excellent in physical properties such as UV resistance, chemical resistance, light transmittance, adhesiveness, insulation, heat resistance, flatness, water resistance, in particular in the process temperature change in the post-process after coating film curing
  • An object of the present invention is to provide a photocurable organic-inorganic hybrid resin composition capable of withstanding thermal deformation and a pattern forming method of a substrate using the same.
  • the present invention has excellent physical resistance, such as chemical resistance, UV resistance, water resistance, heat resistance, light transmittance and adhesiveness, photocurable organic-inorganic hybrid resin composition suitable as an encapsulant used in the packaging process such as semiconductor and LED, and using the same
  • An object of the present invention is to provide a sealing method.
  • R One To R 4 Each independently represent a hydrogen atom; C 2-20 Of ethylenically unsaturated groups, fluorine or C 6-20 Unsubstituted or substituted with an aromatic group 1-20 of Alkyl group or alkoxy group, where R One To R 4 At least one of C includes the ethylenically unsaturated group 1-20 of Alkyl group or alkoxy group, and R One To R 4 At least one of C contains fluorine 1-20 of An alkyl group or an alkoxy group,
  • n is an integer from 1-30,
  • R 5 to R 8 are each independently a hydrogen atom, an alkyl group of C 1-20 or an alkoxy group.
  • R 9 is selected from the group consisting of a phenyl group, an amino group, a (meth) acryl group, a vinyl group, an epoxy group and combinations thereof,
  • R ' is an alkyl group of C 1-6 ,
  • Q is a C 2-6 alkylene group or C 2-6 alkyleneoxy group
  • n is an integer from 0 to 4,
  • p is an integer of 0 or 1.
  • the present invention provides a pattern forming method of the substrate using the organic-inorganic hybrid resin composition.
  • the present invention provides a method for sealing a semiconductor or LED using the organic-inorganic hybrid resin composition.
  • the photocurable organic-inorganic hybrid resin composition according to the present invention has excellent physical properties such as UV resistance, chemical resistance, light transmittance, adhesiveness, insulation, heat resistance, flatness and water resistance, and in particular, changes in process temperature in a post-process after coating film curing Excellent heat resistance and adhesion that can withstand thermal deformation due to the film is suitable as a protective film insulating material and encapsulant of optical devices and semiconductors including display devices.
  • R One To R 4 Each independently represent a hydrogen atom; C 2-20 Of ethylenically unsaturated groups, fluorine or C 6-20 Unsubstituted or substituted with an aromatic group 1-20 of Alkyl group or alkoxy group, where R One To R 4 At least one of C includes the ethylenically unsaturated group 1-20 of Alkyl group or alkoxy group, and R One To R 4 At least one of C contains fluorine 1-20 of An alkyl group or an alkoxy group,
  • n is an integer from 1-30,
  • R 5 to R 8 are each independently a hydrogen atom, an alkyl group of C 1-20 or an alkoxy group.
  • R 9 is selected from the group consisting of a phenyl group, an amino group, a (meth) acryl group, a vinyl group, an epoxy group and combinations thereof,
  • R ' is an alkyl group of C 1-6 ,
  • Q is a C 2-6 alkylene group or C 2-6 alkyleneoxy group
  • n is an integer from 0 to 4,
  • p is an integer of 0 or 1.
  • the content of each component of the photocurable organic-inorganic hybrid resin composition may be as follows.
  • the polyaliphatic aromatic silsesquioxane comprising an ethylenically unsaturated group and a fluorine group usable in the photocurable organic-inorganic hybrid resin composition of the present invention preferably has at least one ethylenically unsaturated group and at least one fluorine group, and has a weight average It may be a compound having a ladder to cage structure having a molecular weight of 1,000 to 200,000.
  • polyaliphatic aromatic silsesquioxane containing the ethylenically unsaturated group and the fluorine group may be represented by the following Formula 1:
  • R 1 to R 8 and n are as defined above.
  • the polyaliphatic aromatic silsesquioxane having the ethylenically unsaturated group and the fluorine group of the formula (1) is preferably included in 30 to 80 parts by weight in the photocurable organic-inorganic hybrid resin composition of the present invention.
  • Reactive monomers comprising at least one ethylenically unsaturated group in a molecule usable in the photocurable organic-inorganic hybrid resin composition of the present invention are selected from among unsaturated carboxylic acids, unsaturated carboxylic anhydrides and acrylic unsaturated compounds containing at least one ethylenically unsaturated group in a molecule. There may be more than one.
  • a reactive monomer comprising a (meth) acryl group or an epoxy group together with one or more ethylenically unsaturated groups can be used.
  • Examples of the reactive monomer containing the epoxy group include glycidyl acrylate, glycidyl methacrylate, glycidyl ⁇ -ethyl acrylate, glycidyl ⁇ -n-propyl acrylate, glycidyl ⁇ -n-butyl acrylate, and acrylic acid.
  • Reactive monomers containing one or more ethylenically unsaturated groups in such a molecule may be used alone or in combination of two or more thereof.
  • the reactive monomer including at least one ethylenically unsaturated group in the molecule is preferably included in the resin mold composition 5 to 50 parts by weight, more preferably 10 to 45 parts by weight.
  • the photocurable organic-inorganic hybrid resin composition of the present invention may further include a reactive monomer including at least one fluorine group in a molecule together with a reactive monomer including at least one ethylenically unsaturated group in the molecule.
  • the reactive monomer including at least one fluorine group in the molecule may be at least one of unsaturated carboxylic acid, unsaturated carboxylic anhydride and acrylic unsaturated compound including at least one fluorine group in the molecule.
  • a reactive monomer comprising at least one fluorine group (meth) acryl group or epoxy group can be used.
  • the reactive monomer containing the fluorine group perfluorohexylethylene, 1,4-divinyldodecafluorohexane, 3-perfluorobutylhydroxypropyl methacrylate, 3-perfluorohexyl Hydroxylpropyl methacrylate, trifluoroethyl methacrylate, tetrafluoropropyl methacrylate, 2-perfluorohexylethyl acrylate, 3-perfluoromethylbutyl-2-hydroxypropyl acrylate and the like Derivatives.
  • a reactive monomer including a (meth) acryl group which may be bonded to the fluorine group methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, tert-butyl methacrylate , Methyl acrylate, isopropyl acrylate, cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, dicyclopentenyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl methacrylate, dicyclopentanyl methacrylate Acrylate, 1-adamantyl acrylate, 1-adamantyl methacrylate, dicyclopentanyloxyethyl methacrylate, isobornylmethacrylate, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, Dicyclopentanyloxyethyl acrylate, isobornyl
  • Reactive monomers comprising an epoxy group which may be bonded to the fluorine group include glycidyl acrylate, glycidyl methacrylate, glycidyl ⁇ -ethyl acrylate, glycidyl ⁇ -propyl acrylate, ⁇ -n-butyl Glycidyl acrylate, acrylate- ⁇ -methylglycidyl, methacrylic acid- ⁇ -methylglycidyl, acrylic acid- ⁇ -ethylglycidyl, methacrylic acid- ⁇ -ethylglycidyl, acrylic acid-3,4 Epoxybutyl, methacrylic acid-3,4-epoxybutyl, acrylic acid-6,7-epoxyheptyl, methacrylic acid-6,7-epoxyheptyl, ⁇ -ethylacrylic acid-6,7-epoxyheptyl, acrylic acid-3 , 4-epoxy cyclohexylmethyl, methacryl
  • Reactive monomers containing one or more fluorine groups in the above molecules may be used alone or in combination of two or more thereof.
  • the reactive monomer containing at least one fluorine group in the molecule is preferably included in the composition 5 to 50 parts by weight, more preferably 10 to 45 parts by weight. If it is in the above range, all viscosity, chemical resistance and other physical properties are good.
  • organic silane compound usable in the photocurable organic-inorganic hybrid resin composition of the present invention an organic silane compound including a phenyl group, an amino group, a (meth) acryl group, a vinyl group or an epoxy group can be used.
  • the organosilane compound is a compound having a structure of Formula 2:
  • R 10 , m and p are as defined above.
  • the organic silane compound containing a phenyl group or an amino group has an effect of improving chemical resistance of the composition to improve non-swelling properties
  • the organic silane compound containing an epoxy group or a (meth) acryl group may increase the curing density of the composition.
  • organosilane compounds include (3-glycidoxypropyl) trimethoxysilane, (3-glycidoxypropyl) triethoxysilane, (3-glycidoxypropyl) methyldimethoxysilane, (3- Glycidoxypropyl) dimethylethoxysilane, 3- (methacryloxy) propyltrimethoxysilane, 3,4-epoxybutyltrimethoxysilane, 3,4-epoxybutyltriethoxysilane, 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltriethoxysilane, aminopropyltriethoxysilane, vinyltriethoxysilane, vinyltri-t-butoxysilane , Vinyltriisobutoxysilane, vinyltriisopropoxysilane, vinyltriphenoxysilane,
  • Such organosilane compounds are preferably included in an amount of 5 to 50 parts by weight in the composition. If the content of the organosilane compound is less than 5 parts by weight, the effect of using the organosilane compound is insignificant, and if the content of the organosilane compound exceeds 50 parts by weight, the viscosity decreases, making it difficult to work, and there is a risk of cracking during coating.
  • the photoinitiator used in the present invention may be a conventional photoinitiator that can be used in the conventional photocurable resin composition, specifically, Irgacure 369 (hereinafter referred to as Shiva Specialty Chemical Co., Ltd.), Irgacure 651, Irgacure 907, Irgacure 819, diphenyl- (2,4,6-trimethylbenzoyl) phosphine oxide, methylbenzoylformate, ethyl (2,4,6-trimethylbenzoyl) phenylphosphinate, 2,4-bistrichloromethyl-6-p-methoxy Styryl-s-triazine, 2-p-methoxystyryl-4,6-bistrichloromethyl-s-triazine, 2,4-trichloromethyl-6-triazine, 2,4-trichloro Methyl-4-methylnaphthyl-6-triazine, benzophenone, p-
  • the photoinitiator is preferably included in 0.1-10 parts by weight with respect to 100 parts by weight of the total amount of the components (1), (2), and (3), and when included in the content within the above range, the transmittance and curing stability after curing Can be satisfied at the same time.
  • the photocurable organic-inorganic hybrid resin composition according to the present invention comprising the components of (1) to (5) as described above may further include a surfactant in order to improve applicability.
  • surfactants examples include polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, F171 (hereinafter referred to as Nippon Ink Co., Ltd.), F172, F173 FC430 (hereinafter referred to as Sumitomo Trim Corporation), FC431, KP341 (Shin-Etsu Chemical Co., Ltd.). And the like, and the content thereof is preferably contained in an amount of 0.01-2 parts by weight based on 100 parts by weight of the total amount of the components (1), (2), (3) and (4).
  • the present invention provides a method of forming a pattern of the substrate using the photocurable organic-inorganic hybrid resin composition.
  • a general pattern forming method may be applied, and the substrate may be, for example, a liquid crystal display.
  • optical devices including display devices such as TFTs and OLEDs.
  • the present invention provides a sealing method of the base conductor or LED using the photocurable organic-inorganic hybrid resin composition.
  • a normal sealing method may be applied except that the photocurable organic-inorganic hybrid resin composition is used as a sealing material.
  • the stirred liquid was washed with distilled water several times to remove impurities, and then the dried liquid was vacuum-dried at room temperature for 20 hours or more to obtain a polyaliphatic aromatic silsesqui containing a desired ethylenically unsaturated group and a fluorine group having a molecular weight of 25,000 styrene.
  • Oxane 1a was prepared.
  • the stirred liquid was washed several times with distilled water to remove impurities, and then the washed liquid was vacuum-dried at room temperature for 20 hours or more to obtain a polyaliphatic aromatic silsesqui including a desired ethylenically unsaturated group and a fluorine group having a styrene equivalent molecular weight of 25,000.
  • Oxane 1b was prepared.
  • A) Water resistance The resin compositions of Examples 1 to 6 and Comparative Examples 1 to 3 were cured by UV irradiation, and placed in a 100 ° C. convention oven for additional 1 hour to be cured to a thickness of 100 ⁇ m. Psalms were obtained. Cured specimens were measured by MOCON TEST equipment. As a result of the measurement, when the moisture permeability is less than 10 g / m 2 .day,?, 10 to 20 g / m 2 .day,?, 20 to 30 g / m 2 .day,?
  • UV resistance UV was irradiated to the formed final coating for 30 hours.
  • the light transmittance of the protective film was measured before and after UV irradiation, and when the change rate was 0-1%, ⁇ , 1-3% were ⁇ , 3-5% or more ⁇ , and 5% or more.
  • Adhesive force The adhesive force was measured by applying a protective film resin composition to the Mo, Al, ITO substrate, and then taping test using a 3M tape to the finished coating film. Dividing the coating into 100 cells at regular intervals, attaching 3M tape, and then detaching them slowly, the number of remaining cells out of 100 cells is very good at 95 or more, less than 95 and 90 or more, 90 If less than 80 and usually more than 80, less than 80 was indicated as bad.
  • TGA Heat resistance: TGA was measured by scraping the formed final coating to measure the temperature at the point where the weight loss rate was 5%. At this time, the case where the temperature was 300 ° C. or more was very excellent, the case where 280 ° C. or more was excellent, and the case where the temperature was 250 ° C. or more was usually indicated as bad when the temperature was 250 ° C.
  • Light transmittance The light absorption spectrum of visible light was measured about the formed best coating film, and the light transmittance was measured and described at 400 nm.
  • Example 1 Water resistance Chemical resistance UV resistance Adhesion Chemical resistance Light transmittance
  • Example 2 ⁇ ⁇ ⁇ Very good Very good 98.7
  • Example 3 ⁇ ⁇ ⁇ Great Very good 96.3
  • Example 4 ⁇ ⁇ ⁇ Very good Great 97.0
  • Example 5 ⁇ ⁇ ⁇ Very good Very good 98.8
  • Example 6 ⁇ ⁇ ⁇ Great Very good 97.4 Comparative Example 1 X X X Very good Bad 95.8 Comparative Example 2 ⁇ ⁇ ⁇ Very good Bad 96.3 Comparative Example 3 ⁇ ⁇ X usually Very good 97.2
  • the coating film obtained from the photocurable organic-inorganic hybrid resin composition of Examples 1 to 6 of the present invention is excellent in water resistance, chemical resistance, UV resistance and heat resistance compared to Comparative Examples 1 and 3, Adhesion and light transmittance also showed excellent characteristics.
  • the photocurable organic-inorganic hybrid resin composition according to the present invention has excellent physical properties such as UV resistance, chemical resistance, light transmittance, adhesiveness, insulation, heat resistance, flatness and water resistance, and in particular, changes in process temperature in a post-process after coating film curing Excellent heat resistance and adhesion that can withstand thermal deformation due to the film is suitable as a protective film insulating material and encapsulant of optical devices and semiconductors including display devices.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Wood Science & Technology (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

La présente invention concerne une composition de résine hybride organique-inorganique photodurcissable pour film protecteur. Plus particulièrement, la présente invention concerne une composition de résine hybride organique-inorganique photodurcissable qui présente d'excellentes propriétés physiques, telles qu'une résistance aux UV, une résistance aux produits chimiques, une transmission de la lumière, des propriétés adhésives, des propriétés isolantes, une résistance à la chaleur, une planéité et une résistance à l'eau. En particulier, les excellentes propriétés de résistance à la chaleur et d'adhérence permettent à la composition d'endurer une déformation thermique provoquée par la variation d'une température de traitement lors d'un post-traitement après le durcissement d'un film. La composition de l'invention peut donc être utilisée comme matériau isolant et matériau d'encapsulation, à la fois pour un film protecteur d'un dispositif optique comportant un dispositif d'affichage et pour un semi-conducteur.
PCT/KR2012/006035 2011-08-03 2012-07-27 Composition de résine hybride organique-inorganique photodurcissable WO2013019040A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201280038497.5A CN103732689B (zh) 2011-08-03 2012-07-27 光固化型有机无机杂化树脂组合物
JP2014523838A JP6117783B2 (ja) 2011-08-03 2012-07-27 光硬化型有機−無機ハイブリッド樹脂組成物
US14/161,778 US9469763B2 (en) 2011-08-03 2014-01-23 Photo-curable organic-inorganic hybrid resin composition

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20110077185 2011-08-03
KR10-2011-0077185 2011-08-03
KR1020120081536A KR101937140B1 (ko) 2011-08-03 2012-07-26 광경화형 유-무기 하이브리드 수지 조성물
KR10-2012-0081536 2012-07-26

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/161,778 Continuation US9469763B2 (en) 2011-08-03 2014-01-23 Photo-curable organic-inorganic hybrid resin composition

Publications (2)

Publication Number Publication Date
WO2013019040A2 true WO2013019040A2 (fr) 2013-02-07
WO2013019040A3 WO2013019040A3 (fr) 2013-06-13

Family

ID=47629785

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/006035 WO2013019040A2 (fr) 2011-08-03 2012-07-27 Composition de résine hybride organique-inorganique photodurcissable

Country Status (1)

Country Link
WO (1) WO2013019040A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104109381A (zh) * 2014-03-18 2014-10-22 广东生益科技股份有限公司 改性有机硅树脂组合物
CN105873983A (zh) * 2013-12-26 2016-08-17 东进世美肯株式会社 能够热熔融挤压成型的倍半硅氧烷、利用其的高透明及高耐热塑料透明基板及其制造方法
CN114891225A (zh) * 2022-05-10 2022-08-12 杭州福斯特应用材料股份有限公司 含氟的poss杂化体及其制备方法、光固化组合物和有机封装薄膜

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006328231A (ja) * 2005-05-26 2006-12-07 Nagase Chemtex Corp 光素子用封止樹脂組成物
KR20080080942A (ko) * 2007-03-02 2008-09-05 린텍 가부시키가이샤 래더형 폴리실세스퀴옥산을 함유하는 접착제 및 접착 시트
KR20090004536A (ko) * 2007-06-29 2009-01-12 린텍 가부시키가이샤 폴리실세스퀴옥산 화합물로 이루어지는 성형 재료, 밀봉재및 광소자 밀봉체
KR20100126686A (ko) * 2008-02-14 2010-12-02 다이셀 가가꾸 고교 가부시끼가이샤 나노임프린트용 경화성 수지 조성물

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006328231A (ja) * 2005-05-26 2006-12-07 Nagase Chemtex Corp 光素子用封止樹脂組成物
KR20080080942A (ko) * 2007-03-02 2008-09-05 린텍 가부시키가이샤 래더형 폴리실세스퀴옥산을 함유하는 접착제 및 접착 시트
KR20090004536A (ko) * 2007-06-29 2009-01-12 린텍 가부시키가이샤 폴리실세스퀴옥산 화합물로 이루어지는 성형 재료, 밀봉재및 광소자 밀봉체
KR20100126686A (ko) * 2008-02-14 2010-12-02 다이셀 가가꾸 고교 가부시끼가이샤 나노임프린트용 경화성 수지 조성물

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105873983A (zh) * 2013-12-26 2016-08-17 东进世美肯株式会社 能够热熔融挤压成型的倍半硅氧烷、利用其的高透明及高耐热塑料透明基板及其制造方法
CN105873983B (zh) * 2013-12-26 2019-08-16 东进世美肯株式会社 能够热熔融挤压成型的倍半硅氧烷、利用其的高透明及高耐热塑料透明基板及其制造方法
CN104109381A (zh) * 2014-03-18 2014-10-22 广东生益科技股份有限公司 改性有机硅树脂组合物
CN114891225A (zh) * 2022-05-10 2022-08-12 杭州福斯特应用材料股份有限公司 含氟的poss杂化体及其制备方法、光固化组合物和有机封装薄膜

Also Published As

Publication number Publication date
WO2013019040A3 (fr) 2013-06-13

Similar Documents

Publication Publication Date Title
KR101937140B1 (ko) 광경화형 유-무기 하이브리드 수지 조성물
WO2011099777A2 (fr) Feuille pour la formation de revêtement dur
WO2011099778A2 (fr) Composite de résine pour la formation de couche de revêtement dur
WO2013165207A1 (fr) Nouveau composé ester d'oxime fluoré et initiateur de photopolymérisation et composition de résine photosensible le comprenant
WO2011099766A2 (fr) Procédé de formation de revêtement superficiel dur
KR101475780B1 (ko) 보호막으로서 유용한 유-무기 복합체 수지 조성물
WO2010068027A2 (fr) Composition d'isolant hybride organique-inorganique photosensible positif
WO2017116103A1 (fr) Substrat de polyimide et module de substrat d'affichage comprenant celui-ci
WO2011016651A9 (fr) Composition de résine photodurcissable pour lithographie d'impression et procédé de fabrication d'un moule d'impression l'utilisant
WO2014069808A1 (fr) Composition de revêtement anti-réfléchissant comprenant un composé siloxane, et film anti-réfléchissant dont l'énergie de surface est réglée en l'utilisant
WO2011007979A2 (fr) Composition de résine photodurcissable fluorée, et procédé de production d'un moule en résine au moyen de cette composition
WO2013019040A2 (fr) Composition de résine hybride organique-inorganique photodurcissable
WO2014007470A1 (fr) Composition photodurcissable et élément optique comprenant une couche protectrice constituée de ladite composition
WO2010058987A2 (fr) Film multicouche et son procédé de production
WO2012173459A2 (fr) Composition ayant une réfraction élevée
KR101917156B1 (ko) 프린팅 프로세스용 광경화성 수지 조성물
KR20090084340A (ko) 광경화형 수지 조성물 및 이를 이용한 수지 몰드의제조방법
WO2017061778A1 (fr) Composition permettant d'augmenter l'adhérence d'interfaces durcissables par rayonnement, et procédé permettant de modifier la surface d'un substrat au moyen de cette dernière
WO2014003211A1 (fr) Substrat de polyimide transparent et son procédé de fabrication
WO2014163376A1 (fr) Composition de revêtement comprenant un composé de silane de type bis
WO2018124597A1 (fr) Composition d'encapsulation de dispositif électronique organique et encapsulation formée à l'aide de celle-ci
WO2014088189A1 (fr) Procédé de formation d'un film aplati comportant une résine d'organosiloxane durcissable par uv, et film aplati ainsi formé
WO2014092253A1 (fr) Composition photodurcissable, couche de barrière la comprenant, et dispositif encapsulé la comprenant
WO2012102498A2 (fr) Composition de résine pouvant durcir par effet photochimique destinée à une lithographie d'impression
WO2018106011A1 (fr) Composition pour agent d'encapsulation d'élément électronique organique et agent d'encapsulation formé en utilisant celle-ci

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12820829

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2014523838

Country of ref document: JP

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 12820829

Country of ref document: EP

Kind code of ref document: A2