WO2013149420A1

WO2013149420A1 - Highly heat-conductive adhesive tape of metal foil

Info

Publication number: WO2013149420A1
Application number: PCT/CN2012/075192
Authority: WO
Inventors: 吴晓宁
Original assignee: 北京中石伟业科技股份有限公司
Priority date: 2012-04-06
Filing date: 2012-05-08
Publication date: 2013-10-10
Also published as: CN103107147A; DE112012006196T5; WO2013149446A1; DE112012006195T5

Abstract

Disclosed in the present invention is a highly heat-conductive adhesive tape of metal foil. The metal foil comprises a metal foil support, a graphene thin film coated on one side of the metal foil support, and an adhesive surface coated on the other side of the metal foil support. By means of the extremely high heat-conductivity of the graphene, the highly heat-conductive adhesive tape of metal foil provided in the present invention enables the heat to be spread rapidly over the surface of the graphene, and finally reaches a thermal equilibrium within a heat-dissipating device. This reduces or eliminates the temperature gradient on the heat-conductive path, thereby greatly improving the heat-dissipating efficiency of the heat-dissipating device, reducing the temperature of the device, eliminating the hot spot regions inside an apparatus where the temperatures are unbalanced, and increasing the overall reliability of the device and the apparatus as well as their ability to operate for long periods of time. In addition, the highly heat-conductive adhesive tape of metal foil provided in the present invention is convenient for carrying and using, rapid in heat conduction speed, high in mechanical strength, suitable for various environments and requirements, and overcomes the problem of temperature gradient inside the heat-dissipating device caused by highly heat-generating devices and multiple heat-generating devices, and shortens the length of the effective heat-conductive path.

Description

High thermal conductivity metal foil tape

The present invention relates to a thermally conductive material, and more particularly to a highly thermally conductive metal foil tape having a surface covered with a graphene film. Background technique

Thermal design is a specialized discipline that studies the transfer or maintenance of heat in equipment. In the heat transfer design, it is often necessary to select the heat transfer medium reasonably. It is necessary to consider not only the heat transfer efficiency and heat transfer capacity of the heat sink, but also the factors such as optimizing its shape design and outer surface area to improve the overall heat dissipation efficiency of the heat transfer system. .

At the same time, with the rapid development of technology, electronic and optoelectronic products are developing towards light, thin, short, small and high power. Such development will increase the heat density of electronic and optoelectronic products, resulting in an increase in power loss. As a result, the demand for heat dissipation in electronic and optoelectronic products has also increased significantly.

Especially with the popularization of ultra-thin equipment and outdoor equipment, it is not allowed to use fans for direct heat dissipation, such as: wireless communication outdoor base stations, automotive electronic units and smart phones, etc. Their thermal design schemes are often shared by multiple heating devices. A heat sink component, which will cause a serious imbalance of the temperature gradient in the heat sink component, greatly affecting the efficiency of the heat sink component, and restricting the speed and power of the electronic device. Therefore, new technical solutions are needed to solve this new challenge. Summary of the invention

In view of the above, the object of the present invention is to provide a high thermal conductivity metal foil tape, which solves the disadvantages of a high heat generating device or a plurality of heat generating devices sharing a heat sink member, causing a serious imbalance in the temperature gradient in the heat sink member and a decrease in the efficiency of the heat sink device.

A high thermal conductivity metal foil tape provided by the present invention based on the above object comprises a metal foil carrier, a graphene film covering one side of the metal foil carrier, and a rubber surface overlying the other side of the metal foil carrier.

Optionally, the graphene film is directly deposited on the surface of the metal foil carrier by chemical vapor deposition.

Preferably, the metal foil carrier is a metal material capable of withstanding a high temperature of 1000 ° C or higher. Optionally, the metal foil carrier is any one of an aluminum foil and a copper foil.

Preferably, the metal foil carrier has a thickness of 0.01 to 0.1 mm.

Preferably, the glue on the rubber surface is an adhesive tape.

Optionally, the glue on the rubber surface is a pressure sensitive adhesive tape.

Preferably, the glue on the rubber surface has thermal conductivity.

Optionally, the metal foil tape is used to reduce the temperature gradient induced by one or more hot spots inside the heat sink member.

It can be seen from the above that the high thermal conductivity metal foil tape provided by the present invention utilizes the extremely high thermal conductivity of the graphene (planar thermal conductivity 3000-5000 W/mK), so that the heat of each heat generating device is rapidly performed on the surface of the graphene film. Heat spread. The temperature of the surface of the graphene film is quickly balanced, so that the heat of the metal foil carrier is evenly distributed, and finally the heat balance is achieved in the heat sink member. Thereby reducing or eliminating the temperature gradient on the heat conduction path, the heat dissipation efficiency of the heat sink member is greatly improved, the temperature of the device is lowered, the temperature unbalanced hot spot region inside the device is eliminated, and the overall reliability and long-term working ability of the device and the device are improved. . Moreover, the high thermal conductivity metal foil tape provided by the invention is easy to process, convenient to carry and use, and is designed in recent years for the heat conduction requirement of the device, has high heat conduction speed, is suitable for various environments and requirements, and overcomes high heat generating devices and heat generation. The internal temperature gradient of the heat sink component caused by the device shortens the effective heat transfer path length. Proper countermeasures for possible heat conduction problems, and a powerful help for the high integration of equipment and ultra-small and ultra-thin. DRAWINGS

1 is a structure of a high thermal conductivity metal foil tape according to an embodiment of the present invention ^

2 is a schematic view showing the use of a high thermal conductive metal foil tape between a heat generating device and a heat sink member according to an embodiment of the present invention;

Fig. 3 is a schematic view showing the application of a high thermal conductivity metal foil tape in the case of a multi-heat generating device sharing a heat sink member according to an embodiment of the present invention. Detailed ways

In order to make the objects, the technical solutions and the advantages of the present invention more comprehensible, the present invention will be further described in detail below with reference to the accompanying drawings.

Graphene is a new carbonaceous material that is closely packed into a two-dimensional honeycomb lattice structure by a single layer of carbon atoms. The research results show that the thermal conductivity of graphene is better than that of carbon nanotubes. The thermal conductivity of ordinary carbon nanotubes can reach more than 3000W/mK. Silver has a relatively high thermal conductivity among various metals. (429W/mK), copper (401W/mK), gold (317W/mK), aluminum (237W/mK), and the thermal conductivity of single-layer graphene can reach 5300W/mK.

Therefore, in the present invention, a graphene film is directly deposited on one side of a metal foil carrier by a chemical vapor deposition method, and the metal foil carrier is a metal material capable of withstanding a high temperature of 1000 ° C or higher.

The high thermal conductivity metal foil tape provided by the invention comprises a metal foil carrier, a graphene film covering one side of the metal foil carrier and a rubber surface covering the other side of the metal foil carrier. The glue on the rubber surface is an adhesive tape.

Preferably, the glue on the rubber surface is a pressure sensitive adhesive tape.

Optionally, the glue on the rubber surface has thermal conductivity.

Wherein, the adhesive tape includes, but is not limited to, an adhesive and a release paper, and the adhesive is used to bond the metal foil carrier and the release paper, so that one side of the adhesive is a metal foil carrier and the other side is a release paper.

The shape of the tape is not necessarily strip-shaped, and may be any planar shape, and any shape that can adhere the metal foil carrier to the surface of the device.

Referring to FIG. 1, a schematic structural view of a high thermal conductive metal foil tape according to an embodiment of the present invention is shown. The highly thermally conductive metal foil tape 4 provided by the present invention comprises a metal foil carrier 1, a graphene film 2 coated on one side of the metal foil carrier 1, and an adhesive tape 3 overlying the other side of the metal foil carrier 1.

The graphene film 2 is directly deposited on the surface of the metal foil carrier 1 by chemical vapor deposition.

Preferably, the metal foil carrier 1 has a thickness of 0.01 to 0.1 mm.

Preferably, the metal foil carrier 1 is any one of a copper foil and an aluminum foil.

When used as a heat diffusion sheet for a heat generating device, the release paper on the surface of the high heat conductive metal foil tape 4 is peeled off, and the high heat conductive metal foil tape 4 provided by the present invention is directly adhered to the surface of the heat generating device.

When any part of the graphene film 2 receives the heat from the heat generating device, the heat is rapidly conducted laterally on the graphene film 2, and the temperature of the surface of the graphene film 2 is quickly balanced, and the heat of diffusion is simultaneously transmitted to The metal foil carrier 1 uniformly distributes the heat of the metal foil carrier 1. Therefore, the heat transfer speed of the heat-generating device is increased, and the heat balance is quickly achieved inside the heat-dissipating device, thereby eliminating the temperature imbalance hot spot region inside.

Referring to FIG. 2, there is shown a schematic view of a high thermal conductivity metal foil tape used between a heat generating device and a heat sink member according to an embodiment of the present invention. The high thermal conductive metal foil tape 4 is adhered to the surface of the heat generating device 5 or the heat sink member 6, and the heat generating device 5 and the heat sink member 6 are tightly connected by the high heat conductive metal foil tape 4. When any portion of the graphene film 2 receives the heat transferred from the heat generating device 5, the heat is rapidly conducted laterally on the graphene film 2, and then the entire graphene film 2 simultaneously transfers heat to the heat sink member 6, thereby improving heat generation. The rate at which the device 5 transfers heat to the heat sink member 6.

Further, when heat needs to be transferred between the two non-contacting devices, it is only necessary to peel off the release paper of the high thermal conductive metal foil tape 4 provided by the present invention and adhere them to the two devices, respectively. The heat passes through the high thermal conductivity foil tape 4 and the graphene film 2 on the surface of the film 4 is quickly transferred from one device to the other to achieve a rapid heat transfer process.

Of course, if heat needs to be transferred between more than two non-contacting devices, the highly thermally conductive metal foil tape 4 can also be adhered to the device so that heat is quickly transferred between the devices.

It should be noted that the method of coating the tape 3 on the other side of the foil carrier 1 is not unique. A commercially available double-sided tape can be used to directly coat the other side of the foil carrier 1. It is also possible to coat the other side of the foil carrier 1 and then apply a release paper to the glue.

Thus, the use of the high thermal conductivity metal foil tape is very convenient. In use, simply remove the release paper on the surface of the tape 3, and the high thermal conductive metal foil can be adhered to any surface of the device or the heat sink member that needs to be thermally conductive, so that heat is quickly conducted on the high thermal conductive metal foil to eliminate heat dissipation. The temperature inside the device is unbalanced hotspot area.

Referring to FIG. 3, it is a schematic diagram of the application of the high thermal conductivity metal foil tape in the case where the multi-heat generating device shares the heat sink device according to the embodiment of the present invention. In the case where the plurality of heat generating devices 5 share the same heat sink member 6, the high heat conductive metal foil tape 4 can be adhered to the area corresponding to each hot spot of the heat sink member 6 simply by removing the release paper on the surface of the tape 3. The heat generating device 5 and the heat sink member 6 are tightly connected by a high heat conductive metal foil tape 4 by mechanical pressing.

Therefore, when any portion of the graphene film 2 receives the heat from the heat generating device 5, the heat is rapidly conducted laterally on the graphene film 2. The diffused heat is transferred to the foil carrier 1 at the same time and then transferred to the heat sink member 6, which greatly shortens the heat transfer path of each hot spot, thereby improving the heat transfer efficiency of the heat sink member 6, and quickly achieving the balance of the heat transfer system.

If due to the spatial position, these heat-generating components and heat sink parts cannot pass the high thermal conductivity foil tape.

4 Tightly connected, the high thermal conductive foil tape 4 can also be adhered to the heat generating device and the heat sink member respectively, so that the heat generating device and the heat sink member are connected at a long distance, and the heat is transferred from the heat generating device to the heat sink through the high heat conductive metal foil tape 4 at the same time. The device allows the heat transfer system to quickly reach equilibrium.

As can be seen from the above, the high thermal conductivity metal foil tape provided by the present invention utilizes the extremely high thermal conductivity of the graphene (planar thermal conductivity 3000-5000 W/mK) to rapidly heat the surface of the graphene. With heat propagation, the temperature of the graphene surface quickly reaches equilibrium, so that the heat of the foil carrier is evenly distributed, and finally the heat balance is achieved in the heat sink member. Thereby, the temperature gradient on the heat conduction path is reduced or eliminated, the heat dissipation efficiency of the heat sink member is greatly improved, the temperature of the device is lowered, the temperature unbalanced hot spot region inside the device is eliminated, and the overall reliability and long-term operation of the device and the device are improved. ability.

The high thermal conductivity metal foil tape provided by the invention is convenient to carry and use, and easy to process. It is designed in recent years for the heat conduction requirement of the device, has high heat conduction speed, is suitable for various environments and requirements, and overcomes the problems caused by high heat generating devices and multiple heat generating devices. The internal temperature gradient of the heat sink component reduces the effective heat transfer path length. Proper countermeasures are available for possible heat conduction problems, which provide a powerful help for the high level of equipment and ultra-small and ultra-thin.

It should be understood by those skilled in the art that the above description is only the embodiment of the present invention, and is not intended to limit the invention, and any modifications, equivalents, and improvements made within the spirit and principles of the present invention. And so on, should be included in the scope of protection of the present invention.

Claims

Claim

A highly thermally conductive metal foil tape, characterized in that the metal foil tape comprises a metal foil carrier, a graphene film coated on one side of the metal foil carrier, and a rubber surface overlying the other side of the metal foil carrier.

2. The high thermal conductivity metal foil tape according to claim 1, wherein the graphene film is directly deposited on the surface of the metal foil carrier by chemical vapor deposition.

The high thermal conductive metal foil tape according to claim 2, wherein the metal foil carrier is a metal material capable of withstanding a high temperature of 1000 ° C or higher.

The high thermal conductive metal foil tape according to claim 3, wherein the metal foil carrier is any one of an aluminum foil and a copper foil.

The high thermal conductive metal foil tape according to claim 4, wherein the metal foil carrier has a thickness of 0.01 to 0.1 mm.

6. The high thermal conductivity metal foil tape according to claim 1, wherein the glue on the rubber surface is an adhesive tape.

7. The high thermal conductivity metal foil tape according to claim 1, wherein the glue on the rubber surface is a pressure sensitive adhesive tape.

8. The high thermal conductivity metal foil tape according to claim 1, wherein the glue on the rubber surface has thermal conductivity.

9. The high thermal conductivity metal foil tape of claim 1 wherein the metal foil tape is used to reduce a temperature gradient induced by one or more hot spots within the heat sink member.