CN111818755B

CN111818755B - Heat dissipation metal part, preparation method thereof and electronic equipment

Info

Publication number: CN111818755B
Application number: CN201910289259.5A
Authority: CN
Inventors: 杨鑫
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-04-11
Filing date: 2019-04-11
Publication date: 2021-08-13
Anticipated expiration: 2039-04-11
Also published as: WO2020207478A1; CN111818755A

Abstract

The invention provides a heat dissipation metal piece, a preparation method thereof and electronic equipment. This heat dissipation metalwork includes: a metal substrate; the heat dissipation anti-corrosion film layer covers at least partial area of the heat dissipation surface of the metal substrate, the material of the heat dissipation anti-corrosion film layer comprises diamond-like carbon, and sp in the diamond-like carbon³The atomic proportion of the hybridized carbon is 60 to 80 percent. The diamond-like heat dissipation anti-corrosion film layer has good chemical stability and thermal conductivity and certain sp³The heat dissipation anticorrosive film layer of the atomic proportion of hybridized carbon has good transverse and longitudinal heat conduction capability, and can also keep good mechanical performance in a cold and hot alternate environment, so that the metal matrix can be protected on the premise of not influencing the heat conduction capability of the heat dissipation metal part, and the problem of heat dissipation performance reduction caused by oxidation of the metal matrix is solved.

Description

Heat dissipation metal part, preparation method thereof and electronic equipment

Technical Field

The invention relates to the field of materials, in particular to a heat dissipation metal piece, a preparation method of the heat dissipation metal piece and electronic equipment.

Background

With the fierce competition of electronic devices and the rapid development of the electronic field, the processing capability of the main board of various electronic devices is greatly improved. In order to prevent overheating of electronic components such as a main board, the demand for heat dissipation capability of the heat sink is also increased. In order to ensure the heat dissipation capability of the heat sink, the heat dissipation pipes in the heat sink are usually made of metal with good heat conductivity, such as copper or aluminum, and alloy materials thereof. However, most of the metals with good heat conductivity are active in chemical properties and are easily oxidized, so that the performance of the heat pipe is seriously attenuated in the using process. Although protection can be achieved by forming an inert metal or oxide coating, the coating has the problems of low thermal conductivity, easy peeling from the radiating pipe base body, and the like.

Therefore, the existing heat dissipation metal piece, the manufacturing method thereof and the electronic device still need to be improved.

Disclosure of Invention

The present invention is directed to solving, at least to some extent, one of the technical problems in the related art.

The present invention has been completed based on the following findings of the inventors:

at present, although a coating based on metal or metal oxide can prevent oxidation of a metal heat dissipation pipe to a certain extent, various problems still exist, for example, the heat dissipation pipe performance is affected due to low thermal conductivity of the coating, the oxidation of the metal heat pipe base body is difficult to prevent due to poor chemical stability of the heat dissipation pipe with the coating, the coating is not firmly combined with the base body, and the film layer is easily peeled off in the using process. If can be guaranteeing not to influence under the prerequisite of cooling tube heat dispersion, form the equal higher inoxidizing coating of a chemical stability and physical stability on the metallic base surface of cooling tube, then will be favorable to alleviating by a wide margin and solve above-mentioned problem even.

In view of the above, in one aspect of the present invention, a heat dissipation metal member is provided. This heat dissipation metalwork includes: a metal substrate; the heat dissipation anti-corrosion film layer covers at least partial area of the heat dissipation surface of the metal substrate, the material of the heat dissipation anti-corrosion film layer comprises diamond-like carbon, and sp in the diamond-like carbon³The atomic proportion of the hybridized carbon is 60 to 80 percent. The diamond-like heat dissipation anti-corrosion film layer has good chemical stability and thermal conductivity and certain sp³The heat dissipation anticorrosive film layer of the atomic proportion of hybridized carbon has good transverse and longitudinal heat conduction capability, and can also keep good mechanical performance in a cold and hot alternate environment, so that the metal matrix can be protected on the premise of not influencing the heat conduction capability of the heat dissipation metal part, and the problem of heat dissipation performance reduction caused by oxidation of the metal matrix is solved.

In another aspect of the present invention, a heat dissipating metal piece is provided. This heat dissipation metalwork includes: a metal substrate; and the heat dissipation anti-corrosion film layer covers at least partial area of the heat dissipation surface of the metal substrate, and the material forming the heat dissipation anti-corrosion film layer comprises at least one of diamond-like carbon and graphene. Therefore, the heat dissipation metal part is good in chemical stability and heat conductivity, and good mechanical performance can be kept in a cold and hot alternate environment, so that the metal matrix can be protected on the premise of not influencing the heat conduction capability of the heat dissipation metal part, and the problem of heat dissipation performance reduction caused by oxidation of the metal matrix is solved.

In another aspect of the present invention, a method of making a heat dissipating metal article is provided. The method comprises the following steps: providing a metal matrix; formed on at least a partial region of the heat dissipation surface of the metal substrateThe heat dissipation anti-corrosion film layer is made of diamond-like carbon (DLC) which is sp-doped³The atomic proportion of the hybridized carbon is 60 to 80 percent. The method can simply and conveniently obtain the heat dissipation metal part, and the prepared heat dissipation metal part has at least one of the advantages of good heat dissipation performance, durability and the like.

In yet another aspect of the present invention, a heat sink is provided. The heat sink comprises the heat-dissipating metal member described above. Therefore, the heat sink has all the features and advantages of the heat dissipation metal part described above, and will not be described herein again.

In yet another aspect of the present invention, an electronic device is presented. The electronic device includes: a housing defining an accommodating space; the main board is positioned inside the accommodating space; and the radiator comprises the metal radiating piece, and the metal radiating piece is connected with the mainboard. Therefore, the electronic equipment has at least one of the advantages of good heat dissipation performance and the like.

Drawings

FIG. 1 is a schematic structural diagram of a heat-dissipating metal member according to an embodiment of the present invention; and

FIG. 2 is a schematic structural diagram of a heat-dissipating metal member according to another embodiment of the present invention;

fig. 3 shows a schematic flow chart of a method for preparing a heat-dissipating metal piece according to an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In one aspect of the invention, a heat-dissipating metal piece is provided. Referring to fig. 1, the heat dissipation metal member 100 includes a metal substrate 110 and a heat dissipation anti-corrosion film layer 120. Heat radiation anti-corrosion film layer 120At least a partial region of the heat dissipation surface in the lid metal base 110. The material of the heat dissipation anti-corrosion film layer 120 includes diamond-like carbon, and sp in the diamond-like carbon in the heat dissipation anti-corrosion film layer 120³The atomic proportion of the hybridized carbon is 60 to 80 percent. The heat dissipation metal piece 100 has at least one of the following advantages: the chemical stability and the thermal conductivity are good, the transverse and longitudinal heat conduction capability is good, and the mechanical property can be kept in the cold and hot alternating environment.

For convenience of understanding, the following first briefly explains the principle that the heat-dissipating metal part of the present invention can achieve the above-mentioned advantageous effects.

In the conventional heat dissipating metal member, in order to ensure the heat dissipating performance, the metal base 110 is often made of a metal having good heat conductivity, such as copper or aluminum. The metal with good heat conductivity has the problems of poor chemical stability and easy oxidation. Once the surface of the metal substrate 110 is oxidized, the heat dissipation performance of the heat dissipation metal member is greatly reduced. Namely: the metal oxide is formed on the surface of the metal substrate 110 during the use process, and the heat dissipation performance of the heat dissipation metal part is seriously attenuated along with the increase of the use time due to the poor heat conduction performance of the metal oxide. Although the above problems can be alleviated to some extent by forming a protective film layer on the metal substrate 110, the selection and thickness of the protective film layer are greatly limited in terms of ensuring the heat dissipation performance of the metal heat sink, so that it is difficult to ensure that the metal heat sink can maintain stable and considerable heat dissipation performance for a long time. Particularly for a metal heat sink applied in an electronic device, the metal heat sink needs to be in an environment where the temperature difference is large and the temperature is alternating, so the requirement for the metal heat sink is more severe. In addition, space in the electronic device is limited, and thus volume control of the metal heat sink is strict. Furthermore, the metal heat sink is required to rapidly transfer heat generated by the motherboard and other structures to the other end along one end of the metal heat sink. Namely: the metallic heat sink is required to have a good lateral heat conduction capability.

Diamond-like carbon is an atomic arrangement between graphites (sp)²Hybrid carbon formation) and diamond (sp)³Hybrid carbon) with good thermal conductivity and chemical stability. Therefore, the heat dissipation anti-corrosion film layer 120 made of diamond-like carbon does not affect the good heat conductivity of the metal substrate 110, and the diamond-like carbon has strong chemical inertness, so that oxidation is not easy to occur even in a cold and hot alternating environment, and the mechanical properties of the diamond-like carbon film layer are suitable for forming stable coating on the surface of the metal substrate 110, so that the problem that the metal substrate 110 is exposed due to the conditions of film collapse, peeling, cracking and the like of the heat dissipation anti-corrosion film layer 120 in the using process can be relieved or even avoided. Also, the inventors found that sp in the heat-dissipating anti-corrosion film layer 120 is present³When the atomic ratio of the hybrid carbon is 60% to 80% (accounting for the total carbon atoms in the heat-dissipating anti-corrosion film layer 120), the heat-dissipating anti-corrosion film layer 120 can have good transverse and longitudinal heat conduction properties at the same time.

Specifically, in the present invention, "transverse direction" and "longitudinal direction" are based on the direction in which the metal base 110 extends, that is: referring to fig. 2, a direction along which the metal base 110 extends (a first direction as shown in the drawing) is "transverse", and a direction perpendicular to the direction in which the metal base 110 extends (a second direction as shown in the drawing) is "longitudinal". In the present invention, the terms "lateral" and "longitudinal" are merely used to distinguish the above two directions, and are not to be construed as limiting the present invention or limiting the position where the metal heat sink is disposed in a device such as an electronic apparatus.

The inventors found that for metal heat sink, sp in the heat sink anti-corrosion film layer 120³Too high or too low atomic ratio of the hybrid carbon will negatively affect the heat dissipation metal part. Specifically, when sp³When the atomic proportion of the hybrid carbon is too high, the diamond-like carbon in the heat dissipation anti-corrosion film layer 120 is too close to the diamond structure, and then the production cost of the heat dissipation anti-corrosion film layer 120 will be greatly increased and the adhesive force with the metal base material will be worsened: to obtain sp with regular tetrahedral packing³Hybrid carbon, requiring strict shape pairingThe process of forming the heat-dissipating anticorrosive film layer 120 is controlled. And sp³The atomic ratio of the hybrid carbon is higher than a certain level (e.g., 80% or more according to the present invention), which does not significantly increase the heat dissipation performance or chemical stability of the heat dissipation anti-corrosion film layer 120. And when sp³If the atomic ratio of the hybrid carbon is too low (e.g. less than 60% according to the present invention), it is not favorable to enhance the heat dissipation performance of the heat dissipation anti-corrosion film layer 120: for diamond-like carbon, sp³The atomic proportion of the hybridized carbon is too low, and the atomic packing mode of the diamond-like material is more inclined to the two-position structure of graphite. Although graphite structures have good thermal conductivity, they have only a high thermal conductivity along the direction in which the plane of the graphite extends. Therefore, the heat dissipation anti-corrosion film layer 120, which is too prone to graphitize the pile, is not ideal in the longitudinal direction. According to some examples of the invention, sp in the heat-dissipating anti-corrosion film layer 120³The atomic proportion of hybrid carbon may be 65% to 77%. Therefore, the heat dissipation anti-corrosion film layer with ideal longitudinal and transverse heat conducting performance and low production cost can be obtained.

In the present invention, the thickness of the heat-dissipating anticorrosive film layer is not particularly limited. For example, the thickness of the heat dissipation anti-corrosion film layer can be 0.5 to 8 micrometers, and for example, 0.5 to 6 micrometers can be preferred. The heat dissipation anti-corrosion film layer with the thickness within the range is moderate in thickness, on one hand, the heat dissipation anti-corrosion film layer can well play a role in protecting the metal substrate 110, and on the other hand, for the heat dissipation square film layer 120 with the diamond-like structure, the heat dissipation performance which is ideal can be obtained within the range. In addition, the heat dissipation anti-corrosion film layer 120 is not prone to defects such as film collapse and cracking due to excessive thickness. Therefore, the service life of the heat dissipation anti-corrosion film layer 120 can be prolonged, and the heat dissipation metal piece can maintain the initial heat dissipation performance for a long time, and the heat dissipation performance cannot be attenuated too fast. More specifically, the thickness of the heat dissipation anti-corrosion film layer 120 may be 0.5 to 3 μm.

It should be noted that, in the present invention, the "thickness of the heat dissipation anti-corrosion film layer 120" refers to the thickness of the heat dissipation anti-corrosion film layer 120 in the direction perpendicular to the extending direction of the metal substrate 110. Namely: the thickness of the heat spreading corrosion protection film layer 120 in the aforementioned "longitudinal" direction, or second direction such as that shown in fig. 2.

In the present invention, the specific shape of the heat dissipation metal part is not particularly limited, and a person skilled in the art can select parameters such as the setting position and the shape of the heat dissipation metal part according to the actual situation. For example, the heat dissipation metal member may be a heat dissipation pipe. Alternatively, the structure may include, but is not limited to, heat dissipation fins.

In other embodiments of the present invention, the heat dissipation anti-corrosion film layer 120 may also be formed of a material with good thermal conductivity and good chemical stability, such as graphene and silicon carbide. Thus, a chemically inert protection can be provided for the metal substrate that is susceptible to oxidation without losing the thermal conductivity of the metal substrate 110. For example, when the metal heat sink is a heat pipe, the heat dissipation anti-corrosion film layer 120 formed by graphene may have a thickness of 5 to 100 μm. In particular, it may have a thickness of around 10 microns. The whole thickness of the radiating pipe can be controlled below 0.15 mm. Therefore, the heat radiation performance of the metal heat radiation piece can be ensured under the condition that the whole occupied volume of the metal heat radiation piece is smaller. The heat dissipation anti-corrosion film layer 120 formed by graphene may be formed on the surface of the metal substrate 110 by spraying or chemical vapor deposition. For example, according to some examples of the present disclosure, graphene, dimethyl amide, and ethanol may be mixed to form a graphene slurry, and the graphene slurry may include the following raw materials in parts by weight: 10-15 parts of graphene powder, 1.5-2.5 parts of dimethyl amide and 75-80 parts of ethanol. And then, spraying the prepared graphene slurry on the surface of the metal matrix by using a spraying machine, and baking and curing. Specifically, the temperature for baking and curing can be 70-150 ℃, and the baking time can be 20-50 minutes.

In another aspect of the present invention, a method of making a heat dissipating metal article is provided. The heat dissipation metal piece prepared by the method has the same characteristics and advantages as those of the heat dissipation metal piece described above, and is not described again here. Specifically, referring to fig. 3, the method may include:

s100: providing a metal matrix

In this step, a metal base for forming the heat-dissipating metal piece is provided. The specific chemical composition of the metal matrix has been described in detail above and will not be described further herein.

S200: form a heat-dissipating anti-corrosion film layer

In the step, a heat dissipation anticorrosive film layer is formed on the surface of the metal substrate. The heat dissipation anti-corrosion film layer at least covers partial area of the heat dissipation surface used for heat dissipation on the surface of the metal base body. The material for forming the heat dissipation anti-corrosion film layer comprises diamond-like carbon. In the step, parameters for forming the heat dissipation anti-corrosion film layer are controlled to enable sp in the diamond-like carbon³The atomic proportion of the hybridized carbon is 60 to 80 percent.

About sp³The advantages of the heat-dissipating anticorrosive layer having the atomic ratio of the hybrid carbon within the above range are described in detail above and will not be described herein again.

Specifically, the heat dissipation anti-corrosion film layer may be formed by chemical vapor deposition, physical vapor deposition, or magnetron sputtering. In the process of carrying out chemical vapor deposition, physical vapor deposition or magnetron sputtering, sp in the formed heat dissipation anticorrosive film layer can be obtained by regulating and controlling deposition or sputtering parameters and properly selecting carbon source materials³The atomic ratio of the hybridized carbon is controlled within a more appropriate range. E.g. sp³The atomic proportion of the hybridized carbon can account for 60 to 80 percent of the total amount of C atoms in the heat dissipation anticorrosive film layer. Specifically, it may be 65% to 77%.

The following will explain the specific operation in this step in detail by taking the formation of the heat-dissipating anti-corrosion film layer by magnetron sputtering as an example:

in this step, magnetron sputtering may be performed on the surface of the metal substrate in an inert gas atmosphere, for example, an argon gas atmosphere, using high-purity graphite as a target. The power of a magnetron sputtering power supply can be controlled to be 5-20 KW, the bias voltage of a substrate is 100-250V, and the heating temperature is 100-160 ℃. After sputtering for a period of time, carbon source gas can be introduced into the sputtering chamber (with the metal matrix inside) while controlling magnetron sputteringThe power of the target power supply is 5-15 KW. Thereby, sp in the formed diamond-like carbon can be controlled³Atomic ratio of hybridized carbon. The specific kind of the carbon source gas is not particularly limited, and for example, the carbon source may include CH₄、C₂H₂、C₃H₈And the like. For example, acetylene may be used as the carbon source, and the amount of the carbon source gas introduced may be gradually increased after the carbon source gas is introduced. Meanwhile, the power of the power source target can be adjusted to 10-20 KW, the bias voltage of the substrate can be adjusted to 60-150V, and the sputtering time can be 75-180 min. For example, the gas flow rate of the carbon source gas may be set to 50Sccm to 150 Sccm. Namely: in the sputtering process, firstly, a carbon source gas is introduced at a flow rate of 50Sccm, and the gas flow rate is gradually increased until the flow rate of the carbon source gas reaches 150 Sccm. Therefore, sp in the formed heat dissipation anti-corrosion film layer can be removed³The atomic ratio of the hybridized carbon is controlled within the above range.

In the step, the thickness of the formed heat dissipation anti-corrosion film layer can be controlled by controlling the sputtering or deposition time and the gas flow. For example, the thickness of the formed heat dissipation anti-corrosion film layer can be controlled to be 0.5-6 microns. More specifically, the thickness of the heat dissipation anti-corrosion film layer can be controlled to be 0.5-3 microns.

In order to further improve the performance of the heat dissipation metal part formed by the method, the metal substrate can be subjected to conventional cleaning and ion cleaning before magnetron sputtering. For example, prior to placing the metal substrate in the magnetron sputtering chamber, the surface may be first cleaned by ultrasonic cleaning or the like to remove dust and grease. The dried metal matrix can be placed in a sputtering cavity of magnetron sputtering for ion cleaning. Specifically, the ion cleaning can be performed in an inert atmosphere (such as high purity Ar gas) and under a certain vacuum degree (the vacuum degree can be maintained at 2.0-8.0 x 10)^-5Torr), and the power of the power supply can be 0-10 KW during ion cleaning.

In yet another aspect of the present invention, a heat sink is provided. In particular, the heat sink comprises the metal heat sink described above. Thus, the heat sink may have all the features and advantages of the metal heat sink described above, which are not described in detail herein. Generally, the radiator has good transverse and longitudinal heat conduction capability, can keep good mechanical performance and heat conduction performance in an environment with alternating cold and heat, relieves the problem of heat dissipation performance reduction caused by oxidation of a metal matrix, and prolongs the service life of the radiator.

In yet another aspect of the present invention, an electronic device is presented. The electronic device includes: the heat sink comprises a shell for limiting a containing space, a main board and a heat sink. The mainboard is located accommodation space inside, and the radiator includes preceding metal radiating element, metal radiating element and mainboard connection. Thus, the electronic device has all the features and advantages of the heat sink described above, and will not be described herein. In general, the electronic device has at least one of the advantages of good heat dissipation function and the like.

It should be noted that the specific type of the electronic device in the present invention is not particularly limited. For example, the electronic device may be any of various types of computer system devices that are mobile or portable and that perform wireless communications. In particular, the electronic device may be a mobile or smart phone (e.g., an iPhone (TM) based phone), a Portable gaming device (e.g., Nintendo DS (TM), PlayStation Portable (TM), Gameboy Advance (TM), iPhone (TM)), a laptop, a PDA, a Portable internet device, a music player, and a data storage device, other handheld devices, and a headset such as a watch, an in-ear headphone, a pendant, a headset, etc., and other wearable devices (e.g., a Head Mounted Device (HMD) such as an electronic necklace, an electronic garment, an electronic bracelet, an electronic necklace, an electronic tattoo, an electronic device, or a smart watch). The electronic device may also be any of a number of electronic devices including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controllers, pagers, laptop computers, desktop computers, printers, netbook computers, Personal Digital Assistants (PDAs), Portable Multimedia Players (PMPs), moving picture experts group (MPEG-1 or MPEG-2) audio layer 3(MP3) players, portable medical devices, and digital cameras and combinations thereof. In some cases, the electronic device may perform a variety of functions (e.g., playing music, displaying videos, storing pictures, and receiving and sending telephone calls). If desired, the electronic device may be a portable device such as a cellular telephone, media player, other handheld device, wristwatch device, pendant device, earpiece device, or other compact portable device.

The present invention is illustrated below by way of specific examples, which are intended to be illustrative only and not to limit the scope of the present invention in any way, and reagents and materials used therein are commercially available, unless otherwise specified, and conditions or steps thereof are not specifically described.

Example 1

1. The cleaned copper heat pipe is placed in a vacuum coating machine and is vacuumized to 5.0 x 10^-5Torr and the heating temperature was 80 ℃.

2. Carrying out ion cleaning on the copper heat pipe: introducing high-purity Ar gas, and keeping the vacuum degree at 2.0-8.0 x 10^-5And Torr, opening the bias voltage, setting the DC voltage applied on the ion beam to be 500-800V and the DC current to be 20-100 mA, setting the bias voltage applied on the base material to be 50-150V, and carrying out ion cleaning for 10 min.

3. And turning on a medium-frequency magnetron sputtering power supply, wherein the target material is high-purity graphite. Introducing high-purity Ar gas, with power supply of 8KW, substrate bias voltage of 100V, heating temperature of 100 deg.C, and introducing high-purity C₂H₂The gas flow rate is gradually increased from 50Sccm to 150 Sccm. The target power is 15KW, the bias voltage of the substrate is 100V, the sputtering time is 75min, and the thickness of the formed heat dissipation anti-corrosion film layer is about 1.2 microns.

Example 2

Step 1 and step 2 are the same as example 1, the copper heat pipe is used as the metal substrate, and the step of ion cleaning is performed.

And turning on a medium-frequency magnetron sputtering power supply, wherein the target material is high-purity graphite. Introducing high-purity Ar gas, with power supply of 10KW, substrate bias voltage of 120V, heating temperature of 120 deg.C, and introducing high-purity C₂H₂The gas flow rate is gradually increased from 50Sccm to 150 Sccm. The target power is 15KW, the bias voltage of the substrate is 90V, the sputtering time is 110min, and the thickness of the formed heat dissipation anti-corrosion film layer is about 2 microns.

Example 3

And turning on a medium-frequency magnetron sputtering power supply, wherein the target material is high-purity graphite. Introducing high-purity Ar gas, with power supply of 20KW, substrate bias voltage of 150V, heating temperature of 160 deg.C, and introducing high-purity C₂H₂The gas flow rate is gradually increased from 50Sccm to 150 Sccm. The target power is 15KW, the bias voltage of the base material is 150V, the sputtering time is 180min, and the thickness of the formed heat dissipation anti-corrosion film layer is about 2.5 microns.

Example 4

The procedure of example 1 was repeated except that an aluminum tube was used as the metal substrate.

Comparative example 1

The rest steps are the same as the embodiment 1, except that the sputtering time is prolonged, and the thickness of the formed heat dissipation anti-corrosion film layer is 10 microns.

Comparative example 2

The rest of the procedure was the same as in example 1, except that no ethylene carbon source was introduced during sputtering.

The performance of the radiating pipes obtained in examples 1 to 4 was tested. The radiating pipe is maintained at 85 degrees celsius for 0.5 hour, then rapidly cooled, and the heating and cooling steps are repeated 480 times, after which the thermal conductivity of the radiating pipe is measured.

The heat conductivity of the radiating pipes prepared in the embodiments 1 to 4 is kept at 96 to 98 percent and above. Comparative example 1 a radiating pipe, after 480 cycles of heating and cooling, the thermal conductivity decreased by 7% to 15% on average. By comparison, when the thickness of the heat-dissipating metal film layer is too thick (comparative example)1) The film collapse is likely to occur to cause the heat conduction performance of the heat pipe to be reduced. The heat dissipating tube obtained in comparative example 2 can maintain the heat conductive performance not to be decreased too fast after a plurality of cooling and heating cycles, but the heat dissipating performance of the heat dissipating tube is significantly lower than that of the heat dissipating tubes obtained in examples 1 to 4. Therefore, sp in the heat dissipation metal film layer²When the proportion of carbon is too high (comparative example 2), the longitudinal heat-conducting property of the heat pipe is not good.

In the description herein, references to the description of "one embodiment," "another embodiment," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims

1. A heat dissipation metal piece is characterized in that the heat dissipation metal piece is applied to electronic equipment; the heat dissipation metal piece includes:

a metal substrate; and

the heat dissipation anti-corrosion film layer covers at least partial area of the heat dissipation surface of the metal substrate, the material of the heat dissipation anti-corrosion film layer comprises diamond-like carbon, and sp in the diamond-like carbon³The atomic ratio of hybrid carbon is 65% -77%;

the heat dissipation anticorrosive film layer has heat conductivity in a first direction and a second direction; the first direction is along the extending direction of the metal base body, and the second direction is perpendicular to the extending direction of the metal base body.

2. The heat-dissipating metallic article of claim 1 wherein the material forming the metallic matrix comprises at least one of copper and aluminum.

3. The heat-dissipation metal piece as claimed in claim 1 or 2, wherein the thickness of the heat-dissipation anticorrosive film layer is 0.5-8 μm.

4. The heat dissipation metal piece as claimed in claim 3, wherein the thickness of the heat dissipation anti-corrosion film layer is 0.5-3 μm.

5. The heat dissipating metal piece of claim 1, wherein the heat dissipating metal piece is a heat dissipating tube.

6. A heat dissipation metal piece is characterized in that the heat dissipation metal piece is applied to electronic equipment; the heat dissipation metal piece includes:

a metal substrate; and

the heat dissipation anti-corrosion film layer covers at least partial area of the heat dissipation surface of the metal matrix, and the material forming the heat dissipation anti-corrosion film layer comprises graphene;

7. The heat dissipation metal piece as claimed in claim 6, wherein the heat dissipation anti-corrosion film layer is formed by spraying graphene slurry, the heat dissipation anti-corrosion film layer has a thickness of 5-100 micrometers, and the graphene slurry comprises the following components: 10-15 parts of graphene powder, 1.5-2.5 parts of dimethyl amide and 75-80 parts of ethanol.

8. A method of making the heat dissipating metal part of any of claims 1 to 5, comprising:

providing a metal matrix;

forming a heat dissipation anti-corrosion film layer on at least partial area of the heat dissipation surface of the metal substrate, wherein the material for forming the heat dissipation anti-corrosion film layer comprises diamond-like carbon, and sp in the diamond-like carbon is enabled³The atomic ratio of hybrid carbon is 65% -77%;

9. The method of claim 8, wherein the heat-dissipating anti-corrosion film layer is formed by chemical vapor deposition, physical vapor deposition, or magnetron sputtering.

10. The method of claim 9, wherein the heat spreading anticorrosive film layer is formed by magnetron sputtering, and forming the heat spreading anticorrosive film layer comprises:

the method comprises the steps of taking high-purity graphite as a target, controlling the power supply power of magnetron sputtering to be 5-20 KW and the substrate bias voltage to be 100-250V under the argon atmosphere, heating at 100-160 ℃, and then introducing a carbon source gas, wherein the carbon source gas comprises CH₄、C₂H₂、C₃H₈At least one of (1).

11. The method of claim 10, wherein after the carbon source gas is introduced, the amount of the introduced carbon source gas is increased, the power of the power supply is adjusted to 5-15 KW, the substrate bias voltage is adjusted to 60-150V, the sputtering time is 75-180 min,

the gas flow of the carbon source gas is 50 Sccm-150 Sccm.

12. The method as claimed in claim 10 or 11, wherein the thickness of the formed heat-dissipating anticorrosive film layer is controlled to be 3 to 5 μm.

13. A heat sink comprising the heat-dissipating metal member as recited in any one of claims 1 to 7.

14. An electronic device, comprising:

a housing defining an accommodating space;

the main board is positioned inside the accommodating space; and

a heat sink comprising the heat dissipating metal piece of any of claims 1-7, the heat dissipating metal piece being connected to the motherboard.