WO2013145228A1

WO2013145228A1 - Part mounting device

Info

Publication number: WO2013145228A1
Application number: PCT/JP2012/058436
Authority: WO
Inventors: 浩二河口; 正隆岩▲崎▼
Original assignee: 富士機械製造株式会社
Priority date: 2012-03-29
Filing date: 2012-03-29
Publication date: 2013-10-03
Also published as: JP5813210B2; JPWO2013145228A1

Abstract

Provided is a part mounting device (1) that is capable of highly precisely detecting a suction-adhesion abnormality of a part (P) and a mounting abnormality of said part (P). In this part mounting device (1): a part mounting head (10) comprises a flow rate sensor (100) that measures an air flow rate (QN) of air drawn into a negative pressure source (14a) at the negative pressure source (14a) side of a branching flow channel (14b) that connects the negative pressure source (14a) and each of multiple suction-adhesion nozzles (18); and a suction-adhesion abnormality detection section (514) assesses that a suction-adhesion abnormality has occurred when the amount of change (ΔQN) of the air flow rate (QN) has exceeded a specified threshold value, said amount of change (ΔQN) being the amount of change in said air flow rate (QN) starting when one of the suction-adhesion nozzles (18) among the multiple suction-adhesion nozzles (18) has suction-adhered a part (P), until a next suction-adhesion nozzle (18) has suction-adhered a part (P).

Description

Component mounter

The present invention relates to a component mounter that mounts a plurality of components on a substrate, and more particularly to a component mounter that detects component adsorption abnormalities and mounting abnormalities.

As an example of a component mounter that detects an abnormal suction of a component, for example, a component mounter described in Patent Document 1 is known. The component mounting apparatus described in Patent Literature 1 includes a vacuum pressure sensor in a manifold that communicates a vacuum generation source and multiple nozzles. When the electronic components are sequentially mounted, the vacuum pressure in the manifold before and after the movement of the multiple nozzles is measured, and when the difference in vacuum pressure exceeds a predetermined threshold, the electronic components have fallen from the multiple nozzles. Deciding. In this case, the component mounting apparatus does not mount the electronic component.

JP 2007-27247 A

However, in the component mounting apparatus described in Patent Document 1, it is determined whether or not an electronic component has dropped from the multiple nozzles using a vacuum pressure sensor that is spaced apart from the tip of the multiple nozzles. . If the vacuum pressure sensor is arranged away from the tip of the multi-nozzle, the pipe diameter of the multi-nozzle is very small, so it is difficult to accurately detect pressure fluctuations at the tip of the multi-nozzle. is there.

Also, in the component mounting apparatus, there may occur a mounting abnormality such as so-called take-out of the component in which the component mounting fails and the component remains adsorbed to the multiple nozzles. For example, if an attempt is made to detect such a component mounting abnormality using a pressure sensor, it is not always possible to correctly detect whether a component can be mounted due to the state of the nozzle surface of the multiple nozzle and the component suction surface, the influence of static electricity, etc. Not exclusively. In addition, if it is attempted to detect an abnormal mounting of a component by imaging the tip of the multiple nozzles, the component mounting machine becomes large for the imaging unit, resulting in an increase in cost.

This invention is made in view of such a situation, and makes it a subject to provide the component mounting machine which can detect the adsorption | suction abnormality and mounting | wearing abnormality of components with high precision.

A component mounter according to claim 1 is a component mounter including a component mounting head having a plurality of suction nozzles for sucking and mounting a plurality of components on a substrate, and a suction abnormality detection unit that detects suction abnormality of the component. The component mounting head has a flow sensor for measuring a flow rate of air sucked into the negative pressure source on a side of the negative pressure source of a branch flow path communicating with the negative pressure source and each of the suction nozzles. In the suction abnormality detection unit, the amount of change in the air flow rate from when one suction nozzle of the plurality of suction nozzles picks up a component until the next suction nozzle picks up the component exceeds a predetermined threshold. Sometimes it is determined that the adsorption is abnormal.

The component mounter according to a second aspect of the present invention is the component mounter according to the first aspect, further comprising a component recognition camera that images each of the components that are attracted to the tip portions of the plurality of suction nozzles. The detection unit determines whether or not the suction is abnormal based on a suction state of the imaged part.

According to a third aspect of the present invention, there is provided a component mounting machine including a component mounting head having a plurality of suction nozzles for sucking and mounting a plurality of components on a substrate, and a mounting abnormality detecting unit for detecting a mounting abnormality of the component. The component mounting head has a flow sensor for measuring a flow rate of air supplied from the positive pressure source to the positive pressure source side of a branch flow path communicating the positive pressure source and each of the suction nozzles, When the amount of change in the air flow from when one suction nozzle of the plurality of suction nozzles mounts a component to when the next suction nozzle mounts the component is less than a predetermined threshold, the mounting abnormality detection unit It is determined that the attachment is abnormal.

A component mounter according to a fourth aspect is the component mounter according to any one of the first to third aspects, wherein the component mounting head rotates the plurality of suction nozzles on a circumference concentric with an axis. A rotary head that is held movably.

According to the component mounting machine of the first aspect, the component mounting head measures the flow rate of air sucked into the negative pressure source on the negative pressure source side of the branch flow path communicating the negative pressure source and each suction nozzle. Has a sensor. The adsorption abnormality detection unit detects an adsorption abnormality of the component from the amount of change in the air flow rate on the negative pressure source side. When the component is adsorbed by the adsorption nozzle in a stable state, the suction port at the tip of the adsorption nozzle is appropriately blocked by the component, so that the amount of change in the air flow rate is small. On the other hand, when the component is adsorbed in an unstable state with respect to the adsorption nozzle, a gap is generated between the suction port at the tip of the adsorption nozzle and the component, and the amount of change in the air flow rate increases. That is, since the adsorption abnormality detection unit can detect the adsorption abnormality of the component from the amount of change in the air flow rate, it is easy to determine whether or not the adsorption state of the component is stable.

In addition, the adsorption abnormality detection unit is configured to detect a change in the air flow rate from when one of the plurality of adsorption nozzles adsorbs a component until the next adsorption nozzle adsorbs the component exceeds a predetermined threshold value. Therefore, it is possible to detect the suction abnormality without depending on the air leak state of the suction nozzle that has already picked up the component. For this reason, it is possible to detect an abnormal suction of a component with high accuracy.

According to the component mounting machine of the second aspect, the suction abnormality detection unit determines whether or not there is a suction abnormality based on the suction state of the component imaged by the component recognition camera. Therefore, it can be recognized whether or not the component is sucked by the suction nozzle in the normal suction posture, and the detection accuracy of the suction abnormality can be improved.

According to the component mounting machine of the third aspect, the component mounting head measures the flow rate of air supplied from the positive pressure source to the positive pressure source side of the branch flow path communicating the positive pressure source and each suction nozzle. Has a sensor. The mounting abnormality detection unit detects a component mounting abnormality from the amount of change in the air flow rate on the positive pressure source side. When the component is mounted on the board, the suction port of the suction nozzle on which the component is mounted does not suck the component, so that the amount of change in the air flow rate on the positive pressure source side becomes large. On the other hand, when a mounting abnormality such as take-out of a part occurs, the suction port of the suction nozzle is blocked by the part, so that the amount of change in the air flow rate on the positive pressure source side becomes small.

Therefore, the mounting abnormality detection unit can detect a component mounting abnormality from the amount of change in the air flow rate on the positive pressure source side, and detects a component mounting abnormality without being affected by the air path on the downstream side of the flow sensor. can do. Therefore, it is possible to detect a component mounting abnormality with high accuracy. In addition, since mounting abnormalities are detected using a flow sensor provided on the positive pressure source side, the component mounter is downsized and reduced compared to the case where the tip of the suction nozzle is imaged to detect component mounting abnormalities. Cost can be increased.

According to the component mounting machine of the fourth aspect, the component mounting head is a rotary head in which a plurality of suction nozzles are rotatably held on a circumference concentric with the axis. In the rotary head, a detection sensor for detecting a suction abnormality is generally arranged apart from the tip of the suction nozzle. Also in such a rotary head, the adsorption abnormality detection unit can detect the component adsorption abnormality from the amount of change in the air flow rate, and can detect the component adsorption abnormality with high accuracy. Further, in the present invention, it is only necessary to provide one flow sensor on the negative pressure source side of the branch flow path, so that the component mounting machine can be reduced in cost compared with the case where the flow sensor is provided at each tip of the suction nozzle. can do.

In addition, the mounting abnormality detection unit is configured such that the amount of change in the air flow rate on the positive pressure source side from when one suction nozzle of the plurality of suction nozzles mounts a component until the next suction nozzle mounts the component is a predetermined threshold value. If it is less than that, it is determined that there is a component mounting abnormality, so that it is possible to detect the mounting abnormality without depending on the air leak state of the suction nozzle that has already mounted the component. Therefore, in the rotary head, the component mounting abnormality can be detected with high accuracy.

1 is a perspective view showing an example of a component mounter 1. FIG. It is a front view which shows the component mounting head 10 of FIG. 2 is a configuration diagram schematically illustrating an example of a positive pressure / negative pressure supply device 14. FIG. It is a figure which shows an example of the output characteristic of the flow sensor. It is an example of the side image which shows the adsorption | suction state of the components P. (A) is a side image showing a state in which the component P is sucked by the suction nozzle 18 in a normal suction posture. (B) is a side image showing a state in which the component P is attracted to the suction nozzle 18 in an inclined posture. It is a block diagram which shows an example of a control block. It is a figure which shows an example of the relationship between the nozzle number N of the adsorption nozzle 18 in the case of components adsorption | suction, and the air flow rate QN. It is a figure which shows an example of the relationship between the nozzle number N of the suction nozzle 18 at the time of components mounting | wearing, and the air flow rate QP.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each figure is a conceptual diagram and does not define the dimensions of the detailed structure.

(1) Configuration of Component Mounter 1 FIG. 1 is a perspective view showing an example of a component mounter 1. FIG. FIG. 2 is a front view showing the component mounting head 10 of FIG. As shown in FIG. 1, the component mounter 1 includes a component supply device 70, a board transfer device 60, and a component transfer device 80. In the component supply device 70, a plurality of cassette type feeders 71 are arranged in parallel on a base frame 90. The cassette type feeder 71 includes a main body 72 that is detachably attached to the base frame 90, a supply reel 73 provided at the rear portion of the main body 72, and a component take-out portion 74 provided at the tip of the main body 72. The supply reel 73 is wound and held with a long and narrow tape in which the parts P are sealed at a predetermined pitch, and the tape is pulled out at a predetermined pitch by a sprocket (not shown), and the parts P are released from the sealed state and sequentially fed to the part take-out portion 74. It is.

A CCD camera 75 that detects the holding position of the component P is provided between the component supply device 70 and the substrate transfer device 60. The CCD camera 75 can detect a positional shift and an angular shift of the sucked component P with respect to the suction nozzle 18. The detection result of the positional deviation and the angular deviation can be used when correcting the mounting position of the component P.

The substrate transfer device 60 is a so-called double conveyor type device that transfers a printed circuit board in the X-axis direction shown in FIG. 1 and includes two rows of first transfer devices 61 and second transfer devices 62 arranged side by side. In the first transport device 61 and the second transport device 62, a pair of

guide rails

64a, 64b, 65a, 65b are arranged in parallel on the base 63 so as to face each other in parallel. In the first transport device 61 and the second transport device 62, a pair of conveyor belts (not shown) that support and transport the printed circuit boards guided by the

guide rails

64a, 64b, 65a, and 65b are arranged opposite to each other. ing. Further, the substrate transport device 60 is provided with a clamp device (not shown) that pushes up and clamps the printed circuit board transported to a predetermined position. The printed circuit board is positioned and fixed at the component mounting position by the clamp device.

The component transfer device 80 is of the XY robot type, is mounted on the base frame 90 and is disposed above the substrate transfer device 60 and the component supply device 70, and is moved in the Y axis direction by the Y axis servo motor 11. The Y-axis slider 12 is provided. As shown in FIG. 2, an X-axis slider 13 is guided by the Y-axis slider 12 so as to be movable in the X-axis direction orthogonal to the Y-axis direction.

The X-axis slider 13 is connected to the Y-axis slider 12 via a pair of guide rails 12 a that are fixed to the Y-axis slider 12 and extend in the X-axis direction, and a pair of guide blocks 13 a that are fixed to the X-axis slider 13. In contrast, it is held movable. An X-axis servo motor (not shown) is fixed to the Y-axis slider 12, and a ball screw shaft 12b extending in the X-axis direction is connected to the output shaft of the X-axis servo motor. The ball screw shaft 12b is screwed to a ball nut 13b fixed to the X-axis slider 13 via a ball (not shown). Thus, when the X-axis servo motor rotates, the ball screw shaft 12b rotates, and the X-axis slider 13 is guided by the guide rail 12a via the ball nut 13b and moves in the X-axis direction.

On the X-axis slider 13, a component mounting head 10 for attaching the component P to the printed circuit board is mounted. The component mounting head 10 includes a positive / negative pressure supply device 14, an R-axis motor 15, an index shaft 16, a nozzle holder 17, a suction nozzle 18, a θ-axis motor 19, a Z-axis motor 20, and a component recognition camera 21. Yes.

As shown in FIG. 2, the X-axis slider 13 is integrally provided with a first frame 25 and a second frame 26 extending in the horizontal direction so as to be separated from each other in the vertical direction (Z-axis direction). An R-axis motor 15 is fixed. The output shaft of the R-axis motor 15 is connected to an index shaft 16 that is rotatably supported around the vertical axis AL (R-axis direction). A rotating body 28 that forms a driven gear 27 and a θ-axis gear 29 is rotatably supported on the index shaft 16. A cylindrical nozzle holder 17 is fixed to the lower end portion of the index shaft 16.

The nozzle holder 17 holds a plurality of suction nozzles 18 movably in the Z-axis direction on a circumference concentric with the vertical axis AL. Each suction nozzle 18 is attached to a lower end portion of a nozzle spindle 33 supported by the nozzle holder 17 so as to be slidable in the Z-axis direction. A large diameter portion 33 a is formed at the lower end portion of the nozzle spindle 33, and a nozzle gear 34 is fixed to the upper end portion of the nozzle spindle 33. A compression spring 35 is provided between the nozzle gear 34 and the nozzle holder 17. The compression spring 35 urges the nozzle spindle 33 and the suction nozzle 18 upward, and the large diameter portion 33 a is formed on the lower surface of the nozzle holder 17. By abutting, the upward movement of the nozzle spindle 33 and the suction nozzle 18 is restricted. A negative pressure is supplied to each suction nozzle 18 from the positive / negative pressure supply device 14 via the nozzle spindle 33, and each suction nozzle 18 can suck the component P at the tip 18a.

A cylindrical reflector 31 capable of reflecting light is fixed to the center of the lower end of the nozzle holder 17. The nozzle holder 17 and the reflector 31 are rotated around the vertical axis AL together with the index shaft 16. As a result, when the R-axis motor 15 is rotated, the nozzle holder 17 holding the plurality of suction nozzles 18 can be rotated around the vertical axis AL (R-axis direction) via the index shaft 16. The suction nozzle 18 can be sequentially indexed to the work position S1.

FIG. 3 is a block diagram schematically showing an example of the positive / negative pressure supply device 14. The positive / negative pressure supply device 14 includes a negative pressure source 14a, a negative pressure branch flow path 14b, a spool valve 14c, a positive pressure source 14d, and a positive pressure branch flow path 14e. The negative pressure source 14a is a source of negative pressure, and the negative pressure branch flow path 14b communicates the negative pressure source 14a with each suction nozzle 18. The positive pressure source 14d is a source of positive pressure, and the positive pressure branch flow path 14e communicates the positive pressure source 14d with each suction nozzle 18. The spool valve 14c can open and close the negative pressure branch flow path 14b and the positive pressure branch flow path 14e, respectively.

The negative pressure source 14a is connected to the main stream side tip of the negative pressure branch flow path 14b, and the suction nozzle 18 is connected to the tributary side of the negative pressure branch flow path 14b. As the negative pressure source 14 a, for example, a known vacuum pump can be used, and negative pressure can be supplied to each suction nozzle 18. A spool valve 14c is provided on the tributary side of the negative pressure branch flow path 14b. By opening and closing the spool valve 14c, the negative pressure branch flow path 14b between the negative pressure source 14a and each suction nozzle 18 is provided. Can be opened and closed. In the figure, two

suction nozzles

18 and 18 are shown, but all the suction nozzles 18 arranged on the circumference concentric with the vertical axis AL are connected to the negative pressure source 14b by the negative pressure branch flow path 14b. Communication with 14a is possible.

The positive pressure source 14d is connected to the main stream side tip of the positive pressure branch flow path 14e, and the branch side of the positive pressure branch flow path 14e is connected to the spool valve 14c. As the positive pressure source 14d, for example, a known compressor (compressor) can be used, and a positive pressure can be supplied to each suction nozzle 18. The branch side of the positive pressure branch flow path 14e is connected to the spool valve 14c. By opening and closing the spool valve 14c, the positive pressure branch flow path 14e between the positive pressure source 14d and each suction nozzle 18 is opened and closed. can do. Similar to the negative pressure branch flow path 14b, all the suction nozzles 18 arranged on the circumference concentric with the vertical axis AL can communicate with the positive pressure source 14d by the positive pressure branch flow path 14e.

A spool (not shown) is fitted to the spool valve 14c so as to be relatively movable in the vertical direction (Z-axis direction) at the outer peripheral side portion of the nozzle holder 17. The spool valve 14c has an initial position where the supply of negative pressure and positive pressure to each suction nozzle 18 is blocked, and the supply of negative pressure to the suction nozzle 18 is allowed while blocking the supply of positive pressure to the suction nozzle 18 And a positive pressure supply position that blocks supply of negative pressure to the suction nozzle 18 and allows supply of positive pressure to the suction nozzle 18. A friction ring (not shown) is fitted to the spool valve 14c, and the spool is held at the initial position, the negative pressure supply position, or the positive pressure supply position by the frictional force between the spool and the friction ring. The spool valve 14 c is provided for each nozzle spindle 33.

A pressing member that is moved up and down by a motor (not shown) is provided at a position facing the nozzle spindle 33 indexed to the work position S1. When the pressing member moves in the vertical direction at the component suction position, the nozzle spindle 33 and the suction nozzle 18 indexed to the work position S1 move in the vertical direction as the pressing member moves in the vertical direction. Accordingly, the spool of the spool valve 14c is moved and held from the initial position to the negative pressure supply position, and the negative pressure branch flow between the suction nozzle 18 indexed to the work position S1 and the negative pressure source 14a. The path 14b is opened. And a negative pressure is supplied to the suction nozzle 18 indexed to the work position S1, and the component P can be sucked. When the next suction nozzle 18 is indexed, similarly, the spool of the corresponding spool valve 14c is moved from the initial position to the negative pressure supply position and held, and negative pressure is supplied to the indexed suction nozzle 18. The part P is adsorbed. By repeating this operation for all the suction nozzles 18, the negative pressure can be sequentially supplied to each suction nozzle 18 to suck the component P.

On the other hand, when the pressing member moves in the vertical direction at the component mounting position, the nozzle spindle 33 and the suction nozzle 18 indexed to the work position S1 move in the vertical direction as the pressing member moves in the vertical direction. Along with this, the spool of the spool valve 14c moves from the negative pressure supply position to the positive pressure supply position and is held, and the positive pressure between the suction nozzle 18 indexed to the work position S1 and the positive pressure source 14d. The branch flow path 14e is opened. Then, a positive pressure is supplied to the suction nozzle 18 indexed at the work position S1, and the negative pressure in the indexed suction nozzle 18 disappears so that the part P can be released. When the next suction nozzle 18 is indexed, similarly, the spool of the corresponding spool valve 14c is moved from the negative pressure supply position to the positive pressure supply position and held, and positive pressure is supplied to the indexed suction nozzle 18. Then, the part P is released. By repeating this for all the suction nozzles 18, the component P can be released from each suction nozzle 18 and mounted on the printed circuit board. Note that the spool of each spool valve 14c is returned to the initial position until the next component suction.

The flow sensor 100 is provided on the negative pressure source 14a side of the negative pressure branch flow path 14b. A flow sensor 101 is provided on the positive pressure source 14d side of the positive pressure branch flow path 14e. As the

flow sensors

100 and 101, for example, a known mass flow sensor can be used. The flow sensor 100 can measure the air flow rate QN sucked from the suction nozzle 18 into the negative pressure source 14a. The flow sensor 101 can measure the air flow rate QP supplied to the suction nozzle 18 from the positive pressure source 14d.

FIG. 4 is a diagram illustrating an example of output characteristics of the flow sensor 100. The horizontal axis represents the air flow rate QN measured by the flow sensor 100, and the vertical axis represents the output voltage V of the flow sensor 100. The flow sensor 100 outputs the measurement result of the air flow rate QN as the output voltage V. The output voltage V of the flow sensor 100 is transmitted to the control device 51 described later, and the control device 51 A / D converts the output voltage V of the flow sensor 100. In the memory of the control device 51, the characteristics shown in the figure are stored in advance by a map, a table, a relational expression, and the like. The air flow rate QN passing through can be converted. For example, when the output voltage V of the flow sensor 100 is V1, the control device 51 acquires the air flow rate Q1 corresponding to the output voltage V1 from the map. The same applies to the flow sensor 101.

The θ-axis motor 19 is fixed to the first frame 25, and the drive gear 36 is fixed to the output shaft of the θ-axis motor 19. The drive gear 36 is meshed with a driven gear 27 on a rotating body 28 that is rotatably supported by the index shaft 16. A θ-axis gear 29 is formed on the rotating body 28 over a predetermined length in the axial direction, and the θ-axis gear 29 is slidably engaged with each nozzle gear 34 fixed to the nozzle spindle 33. Yes. Accordingly, when the θ-axis motor 19 is rotated, all the suction nozzles 18 can be rotated with respect to the nozzle holder 17 via the drive gear 36, the driven gear 27, the θ-axis gear 29, and the nozzle gear 34.

Further, the Z-axis motor 20 is fixed to the first frame 25, and a ball screw shaft 37 is connected to the output shaft of the Z-axis motor 20. The ball screw shaft 37 is rotatably supported around an axis parallel to the vertical axis AL by a bearing 38 fixed to the first frame 25 and a bearing 39 fixed to the second frame 26. A ball nut 40 that converts the rotational motion of the Z-axis motor 20 into a linear motion is screwed onto the ball screw shaft 37 via a ball (not shown). The ball nut 40 is fixed to a nozzle lever 41 that is slidably guided in a vertical direction by a guide 42 extending in the vertical direction fixed to the first frame 25 and the second frame 26.

The nozzle lever 41 is provided with a pressing portion 41a that abuts the upper end of the nozzle spindle 33 indexed at the work position S1 and presses the nozzle spindle 33 downward in the Z-axis direction. Accordingly, when the Z-axis motor 20 is rotated, the ball screw shaft 37 is rotated, and the nozzle lever 41 is guided by the guide 42 via the ball nut 40 and moves up and down. When the nozzle lever 41 moves up and down, the nozzle spindle 33 and the suction nozzle 18 corresponding to the pressing portion 41a can be moved up and down.

The pressing portion 41a of the nozzle lever 41 has a predetermined width around the work position S1 in the rotation direction of the nozzle holder 17, and the suction nozzle 18 is located in a predetermined angle range before and after the work position S1. The pressing portion 41a can be brought into contact with the upper end of the nozzle spindle 33 of the suction nozzle 18. Accordingly, the suction nozzle 18 can be moved in the vertical direction (Z-axis direction) during the rotation of the nozzle holder 17 in a predetermined angular range before and after the work position S1.

A support bracket 43 is suspended from the second frame 26, and the support bracket 43 is provided with one component recognition camera 21. The component recognition camera 21 is a side imaging camera, and for example, a known CCD camera can be used. The component recognition camera 21 includes a suction nozzle 18 indexed to a preceding position S1 + 1 ahead of the work position S1 in the rotation direction of the nozzle holder 17, and a component P sucked by the tip 18a of the suction nozzle 18. The preceding position side image can be captured by the reflected light reflected by the reflector 31. At the same time, the component recognition camera 21 includes the suction nozzle 18 indexed to the succeeding position S1-1 that is one pitch behind the work position S1 in the rotation direction of the nozzle holder 17, and the tip of the suction nozzle 18. The part P adsorbed by 18a and the succeeding position side image can be captured by the reflected light reflected by the reflector 31.

FIG. 5 is an example of a side image showing the suction state of the component P. (A) is a side image showing a state in which the component P is sucked by the suction nozzle 18 in a normal suction posture. (B) is a side image showing a state in which the component P is attracted to the suction nozzle 18 in an inclined posture. As shown in the figure, the component recognition camera 21 can acquire a preceding position side image 77a and a following position side image 77b on one screen 78. The preceding position side image 77a is an image obtained by capturing the preceding position side image, and the succeeding position side image 77b is an image obtained by capturing the following position side image.

(2) Method of detecting suction abnormality and mounting abnormality The component mounter 1 is controlled by the control device 51. The control device 51 includes a CPU and a memory (not shown), and can drive the component mounter 1 by executing a program stored in the memory. FIG. 6 is a block diagram illustrating an example of a control block. The control device 51 includes a mounting control unit 511, a flow rate calculation unit 512, an image recognition unit 513, an adsorption abnormality detection unit 514, and a mounting abnormality detection unit 515 when viewed as control blocks. The mounting control unit 511 drives the substrate transport device 60, the component supply device 70, and the component transfer device 80 based on a predetermined component mounting program to mount the component P on the printed board.

When the component P is attracted to each suction nozzle 18, the flow rate calculation unit 512 has an air flow rate QN from when one suction nozzle 18 sucks the component P to when the next suction nozzle 18 sucks the component P. A change amount ΔQN is calculated. The flow rate calculation unit 512 calculates the change amount ΔQN of the air flow rate QN for all the suction nozzles 18. The image recognizing unit 513 recognizes the component P imaged by the component recognition camera 21 and the preceding position side image 77a and the succeeding position side image 77b of the suction nozzle 18. The adsorption abnormality detection unit 514 detects an adsorption abnormality of the component P based on the calculation result of the flow rate calculation unit 512 and the recognition result of the image recognition unit 513.

Further, when the component P is mounted on the printed circuit board, the flow rate calculation unit 512 has an air flow rate QP from when one suction nozzle 18 mounts the component P to when the next suction nozzle 18 mounts the component P. A change amount ΔQP is calculated. The flow rate calculation unit 512 calculates the change amount ΔQP of the air flow rate QP for all the suction nozzles 18. The mounting abnormality detection unit 515 detects mounting abnormality of the component P based on the calculation result of the flow rate calculation unit 512.

Hereinafter, a procedure for mounting the component P on the printed circuit board by the component mounting machine 1 will be described, and a method for detecting an adsorption abnormality and a mounting abnormality of the component P will be described. First, based on a command from the mounting control unit 511, the conveyor belt of the board conveying device 60 is driven, and the printed board is guided to the

guide rails

64a and 64b (65a and 65b) and conveyed to a predetermined position. Then, the printed circuit board is pushed up and clamped by the clamping device, and is positioned and fixed at a predetermined position. Subsequently, the Y-axis servo motor 11 and the X-axis servo motor are driven, the Y-axis slider 12 and the X-axis slider 13 are moved, and the component mounting head 10 is moved to the component extraction unit 74. Thereafter, the R-axis motor 15 is rotated, the nozzle holder 17 is rotated by one pitch, and the nozzle spindle 33 equipped with the suction nozzle 18 that has been indexed at the subsequent position S1-1 is indexed at the work position S1. .

When the Z-axis motor 20 is rotated forward while the nozzle holder 17 rotates by one pitch, the nozzle spindle 33 is pushed downward by the nozzle lever 41 against the urging force of the compression spring 35 and descends. . Before the nozzle spindle 33 is positioned at the descending end, the nozzle holder 17 stops the rotation by indexing the nozzle spindle 33 to the working position S1. In this state, the nozzle spindle 33 is pushed down to a position where the tip end portion 18a of the suction nozzle 18 approaches the component P conveyed to the component take-out portion 74, and negative pressure is applied from the positive / negative pressure supply device 14 to the suction nozzle 18. Is supplied, and the component P is sucked and held at the tip 18 a of the suction nozzle 18.

Thereafter, when the Z-axis motor 20 is reversed, the nozzle lever 41 is moved upward, and the suction nozzle 18 is pushed up to the rising end position by the urging force of the compression spring 35. Before the suction nozzle 18 moves back to the rising end position, the nozzle holder 17 is rotated by the R-axis motor 15, and the suction nozzle 18 that has been indexed at the work position S1 is indexed at the subsequent position S1 + 1. By repeating such an operation, the parts P are sequentially sucked and held by the plurality of suction nozzles 18. As a result, during the rotational indexing operation of the nozzle holder 17, so-called simultaneous operation control can be performed in which the suction nozzle 18 is simultaneously moved back and forth in the vertical direction. Can be improved.

The flow rate calculation unit 512 measures the air flow rate QN sucked from the suction nozzle 18 to the negative pressure source 14a using the flow rate sensor 100 when each suction nozzle 18 is pushed up to the rising end position. FIG. 7 is a diagram illustrating an example of the relationship between the nozzle number N of the suction nozzle 18 and the air flow rate QN during component suction. The horizontal axis indicates the nozzle number N of the suction nozzle 18, and the vertical axis indicates the air flow rate QN. The suction nozzle 18 that first picks up the component P among the plurality of suction nozzles 18 is referred to as the suction nozzle 18 having the nozzle number N1. The air flow rate QN measured when the suction nozzle 18 with the nozzle number N1 sucks the component P and is pushed up to the rising end position is defined as Q1. When the suction nozzle 18 with the nozzle number N1 sucks the component P, the suction port of the suction nozzle 18 is blocked by the component P, and the air flow rate QN1 sucked into the negative pressure source 14a is saturated. This figure shows a state in which the suction nozzle 18 with the nozzle number N1 sucks the component P and the air flow rate Q1 is saturated and constant.

Thereafter, the nozzle holder 17 is rotated by the mounting control unit 511, and the suction nozzle 18 of the next nozzle number N2 is indexed. The air flow rate QN is measured when the suction nozzle 18 with the nozzle number N2 sucks the component P and is pushed up to the rising end position. The air flow rate QN at this time is Q2. Thereafter, in the same manner, the air flow rate QN is sequentially measured up to the suction nozzle 18 that finally sucks the component P. In the figure, a change in the air flow rate QN when the air flow rate QN is measured up to the suction nozzle 18 of the nozzle number N6 is indicated by a curve L1. As shown in the figure, the air flow rate QN sucked into the negative pressure source 14a increases stepwise every time the suction nozzle 18 sucks the component P.

The flow rate calculation unit 512 calculates a change amount ΔQN of the air flow rate QN from when one suction nozzle 18 of the plurality of suction nozzles 18 sucks the component P to when the next suction nozzle 18 sucks the component P. . However, the amount of change ΔQ1 of the suction nozzle 18 with the nozzle number N1 is the air flow rate Q1. For example, the change amount ΔQ2 of the suction nozzle 18 with the nozzle number N2 can be calculated by subtracting the air flow rate Q1 of the suction nozzle 18 with the nozzle number N1 from the air flow rate Q2 of the suction nozzle 18 with the nozzle number N2. The amount of change ΔQ3 of the suction nozzle 18 having the nozzle number N3 can be calculated by subtracting the air flow rate Q2 of the suction nozzle 18 having the nozzle number N2 from the air flow rate Q3 of the suction nozzle 18 having the nozzle number N3. Thereafter, similarly, the change amount ΔQN of the air flow rate QN is calculated up to the suction nozzle 18 that finally sucks the component P.

The adsorption abnormality detection unit 514 determines whether or not the change amount ΔQN of the air flow rate QN of the adsorption nozzle 18 calculated by the flow rate calculation unit 512 exceeds a predetermined threshold value. For example, it is assumed that the change amount ΔQ3 of the air flow rate QN of the nozzle number N3 is not more than a predetermined threshold value. On the other hand, it is assumed that the change amount ΔQ4 of the air flow rate QN of the nozzle number N4 is larger than the change amount ΔQ3 as shown in FIG. In this case, the suction abnormality detection unit 514 determines that the suction nozzle 18 with the nozzle number N4 has a suction abnormality. Similarly, the adsorption abnormality detection unit 514 determines whether or not the amount of change ΔQN in the air flow rate QN exceeds a predetermined threshold for all the adsorption nozzles 18 to detect the presence or absence of an adsorption abnormality. The predetermined threshold is an air leak flow rate that is allowed when the component P is sucked by the suction nozzle 18 in a normal suction posture, and can be derived in advance by simulation, measurement by an actual machine, or the like. The predetermined threshold is stored in the memory of the control device 51.

While the nozzle holder 17 is stopped rotating and the suction nozzle 18 indexed at the work position S1 descends and sucks the component P, the suction nozzle 18 indexed at the preceding position S1 + 1 and the preceding position of the component P The side image 77a is captured by the component recognition camera 21. At the same time, the suction nozzle 18 indexed at the trailing position S1-1 and the trailing position side image 77b of the component P are captured by the component recognition camera 21. The preceding position side image 77a and the following position side image 77b are acquired on one screen 78. The preceding position side image 77a and the following position side image 77b are input to the image recognition unit 513 and recognized.

The suction abnormality detection unit 514 determines whether or not there is a suction abnormality based on the suction state of the component P in the preceding position side image 77a and the succeeding position side image 77b. For example, the suction abnormality detection unit 514 measures the height of the component P sucked to the tip portion 18a of the suction nozzle 18 based on the preceding position side image 77a, and determines whether the front and back of the component P are sucked in the opposite direction. to decide. Further, the suction abnormality detection unit 514 determines whether or not the component P is sucked based on the succeeding position side image 77b. The suction abnormality detection unit 514 can determine that the suction is abnormal when the component P is not sucked in the normal suction posture.

FIG. 5A shows a state in which the part P is sucked by the suction nozzle 18 in a normal suction posture. In this case, the adsorption abnormality detection unit 514 determines that there is no adsorption abnormality. FIG. 5B shows a state where the component P is sucked by the suction nozzle 18 in an inclined posture. In this case, the adsorption abnormality detection unit 514 determines that there is an adsorption abnormality. Thereby, the detection accuracy of the adsorption abnormality can be improved. In particular, when the change amount ΔQN of the air flow rate QN is equal to or less than a predetermined threshold value and the suction state of the component P is stable, the suction of the component P to be imaged is performed when the component P is not sucked in a normal suction posture. Absorption abnormality can be detected based on the state, and the detection accuracy of adsorption abnormality can be improved.

The suction abnormality detection unit 514 detects that the component P is normal to the suction nozzle 18 when the change amount ΔQN of the air flow rate QN of the suction nozzle 18 is equal to or less than a predetermined threshold and the suction state of the component P to be imaged is normal. Judged to be adsorbed on the surface. The adsorption abnormality detection unit 514 determines that there is an adsorption abnormality when at least one of the conditions is not satisfied. Similarly, the suction abnormality detection unit 514 determines whether or not all the suction nozzles 18 are suction abnormal. When a suction abnormality is detected by the suction abnormality detection unit 514, the mounting control unit 511 stops mounting the component P using the suction nozzle 18 in which the suction abnormality is detected. Note that the mounting control unit 511 can also reduce the moving speed of the component mounting head 10 and continue mounting the component P using the suction nozzle 18 in which the suction abnormality is detected.

When the parts P are attracted to all the suction nozzles 18, the Y-axis servo motor 11 and the X-axis servo motor are driven, and the Y-axis slider 12 and the X-axis slider 13 are moved. Thereby, the component mounting head 10 is moved onto the CCD camera 75, and the component P sucked and held by the plurality of suction nozzles 18 is imaged by the CCD camera 75. The CCD camera 75 can detect a positional deviation and an angular deviation of the component P with respect to the suction nozzle 18. Thereafter, the component mounting head 10 is moved onto the printed circuit board positioned at a predetermined position by the Y-axis servomotor 11 and the X-axis servomotor. At this time, the movement position of the component mounting head 10 is corrected according to the positional deviation and the angular deviation detected by the CCD camera 75.

Subsequently, the rotation of the θ-axis motor 19 corrects the angular deviation of the component P sucked and held by the suction nozzle 18 indexed at the work position S1, and is controlled to a predetermined posture. Further, the Z-axis motor 20 is rotated forward, the nozzle spindle 33 is pushed downward against the urging force of the compression spring 35 by the nozzle lever 41, and the component P adsorbed by the tip 18a of the adsorption nozzle 18 is removed. It is pushed down until it is mounted on the printed circuit board. At this time, a positive pressure is supplied from the positive / negative pressure supply device 14 to the indexed suction nozzle 18 in the vicinity where the component P reaches the printed board.

Thereby, the negative pressure in the indexed suction nozzle 18 can be eliminated, and the components P can be sequentially released from the suction nozzle 18 and mounted on the printed circuit board. Thereafter, when the Z-axis motor 20 is reversed, the nozzle lever 41 is moved upward, and is pushed up to the state where the suction nozzle 18 is moved to the uppermost end by the urging force of the compression spring 35. When the component mounting head 10 moves to the mounting position, the vertical movement (Z-axis direction) of the suction nozzle 18 is simultaneously performed during the rotation indexing operation of the nozzle holder 17.

The flow rate calculation unit 512 uses the flow rate sensor 101 to measure the air flow rate QP supplied from the positive pressure source 14d to the suction nozzle 18 when each suction nozzle 18 is pushed up to the rising end position. FIG. 8 is a diagram showing an example of the relationship between the nozzle number N of the suction nozzle 18 and the air flow rate QP when components are mounted. The horizontal axis indicates the nozzle number N of the suction nozzle 18, and the vertical axis indicates the air flow rate QP. Of the plurality of suction nozzles 18, the suction nozzle 18 on which the component P is first mounted is defined as a suction nozzle 18 having a nozzle number N1. The air flow rate QP measured when the suction nozzle 18 with the nozzle number N1 is pushed up to the rising end position after mounting the component P is defined as Q11.

When the mounting of the component P is completed at the mounting position of the printed circuit board, the mounting control unit 511 drives the Y-axis servo motor 11 and the X-axis servo motor. Then, the component mounting head 10 moves to the next mounting position on the printed board. Thereafter, the nozzle holder 17 is rotated, and the suction nozzle 18 of the next nozzle number N2 is indexed. The air flow rate QP is measured when the suction nozzle 18 with the nozzle number N2 is pushed up to the rising end position with the component P mounted thereon. The air flow rate QP at this time is Q2. Thereafter, similarly, the air flow rate QP is measured in order up to the suction nozzle 18 to which the component P is finally mounted. In the figure, a change in the air flow rate QP when the air flow rate QP is measured up to the suction nozzle 18 of the nozzle number N5 is indicated by a curve L2. As shown in the figure, the air flow rate QP supplied from the positive pressure source 14d to the suction nozzle 18 increases stepwise each time the suction nozzle 18 mounts the component P.

The flow rate calculation unit 512 calculates a change amount ΔQP of the air flow rate QP from when one suction nozzle 18 of the plurality of suction nozzles 18 mounts the component P to when the next suction nozzle 18 mounts the component P. . However, the amount of change ΔQ11 of the suction nozzle 18 with the nozzle number N1 is an air flow rate Q11. For example, the change amount ΔQ12 of the suction nozzle 18 with the nozzle number N2 can be calculated by subtracting the air flow rate Q11 of the suction nozzle 18 with the nozzle number N1 from the air flow rate Q12 of the suction nozzle 18 with the nozzle number N2. The amount of change ΔQ13 of the suction nozzle 18 having the nozzle number N3 can be calculated by subtracting the air flow rate Q12 of the suction nozzle 18 having the nozzle number N2 from the air flow rate Q13 of the suction nozzle 18 having the nozzle number N3. Thereafter, similarly, the change amount ΔQP of the air flow rate QP is calculated up to the suction nozzle 18 to which the component P is finally mounted.

The mounting abnormality detection unit 515 determines whether or not the change amount ΔQP of the air flow rate QP of the suction nozzle 18 calculated by the flow rate calculation unit 512 is less than a predetermined threshold value. For example, it is assumed that the change amount ΔQ13 of the air flow rate QP of the nozzle number N3 is equal to or greater than a predetermined threshold value. On the other hand, the change amount ΔQ14 of the air flow rate QP of the nozzle number N4 is smaller than the change amount ΔQ13 as shown in FIG. In this case, the mounting abnormality detection unit 515 determines that the suction nozzle 18 with the nozzle number N4 has a mounting abnormality. Similarly, the mounting abnormality detection unit 515 determines whether or not the change amount ΔQP of the air flow rate QP is less than a predetermined threshold for all the suction nozzles 18 to detect the presence or absence of mounting abnormality.

The predetermined threshold value is an air leak flow rate that is allowed when the component P is mounted on the printed circuit board without mounting abnormality such as take-out of the component P, and can be derived in advance by simulation, measurement by an actual machine, or the like. The predetermined threshold is stored in the memory of the control device 51. When a mounting abnormality is detected by the mounting abnormality detection unit 515, the mounting control unit 511 stops the component mounting head 10. Note that the moving speed of the component mounting head 10 can be reduced to continue mounting other components P.

In the present embodiment, the component mounting head 10 measures the air flow rate QN sucked into the negative pressure source 14a on the negative pressure source 14a side of the negative pressure branch flow path 14b communicating with the negative pressure source 14a and each suction nozzle 18. The flow rate sensor 100 is provided. Then, the adsorption abnormality detection unit 514 detects an adsorption abnormality of the component P from the change amount ΔQN of the air flow rate QN on the negative pressure source 14a side. When the component P is adsorbed by the adsorption nozzle 18 in a stable state, the suction port of the tip end portion 18a of the adsorption nozzle 18 is appropriately blocked by the component P, so that the change amount ΔQN of the air flow rate QN becomes small. Conversely, when the component P is adsorbed in an unstable state with respect to the suction nozzle 18, a gap is generated between the suction port of the tip end portion 18a of the suction nozzle 18 and the component P, and the air flow rate QN The change amount ΔQN increases. That is, since the adsorption abnormality detection unit 514 can detect the adsorption abnormality of the component P from the change amount ΔQN of the air flow rate QN, it is easy to determine whether or not the adsorption state of the component P is stable.

Further, the suction abnormality detection unit 514 has a change amount ΔQN of the air flow rate QN from when one suction nozzle 18 of the plurality of suction nozzles 18 sucks the component P to when the next suction nozzle 18 sucks the component P. Therefore, the suction abnormality can be detected without depending on the air leak state of the suction nozzle 18 that has already sucked the component P. Therefore, the adsorption abnormality of the component P can be detected with high accuracy.

Further, the suction abnormality detection unit 514 determines whether or not there is a suction abnormality based on the suction state of the component P imaged by the component recognition camera 21. Therefore, it can be recognized whether or not the component P is attracted to the suction nozzle 18 in the normal suction posture, and the detection accuracy of the suction abnormality can be improved.

In the present embodiment, the component mounting head 10 measures the air flow rate QP supplied from the positive pressure source 14d to the positive pressure source 14d side of the positive pressure branch flow path 14e that communicates the positive pressure source 14d and each suction nozzle 18. A flow sensor 101 is provided. Then, the mounting abnormality detection unit 515 detects the mounting abnormality of the component P from the change amount ΔQP of the air flow rate QP on the positive pressure source 14d side. When the component P is mounted on the printed circuit board, the suction port 18 of the suction nozzle 18 mounted with the component P does not suck the component P, so the change amount ΔQP of the air flow rate QP on the positive pressure source 14d side becomes large. On the other hand, when a mounting abnormality such as take-back of the part P occurs, the suction port of the suction nozzle 18 is blocked by the part P, so the change amount ΔQP of the air flow rate QP on the positive pressure source 14d side becomes small.

Therefore, the mounting abnormality detection unit 515 can detect the mounting abnormality of the component P from the change amount ΔQP of the air flow rate QP on the positive pressure source 14d side, and is not affected by the air path on the downstream side of the flow sensor 101. An abnormal mounting of the component P can be detected. Therefore, the mounting abnormality of the component P can be detected with high accuracy. Further, since the mounting abnormality is detected using the flow rate sensor 101 provided on the positive pressure source 14d side, the component mounting machine is compared with the case where the front end portion 18a of the suction nozzle 18 is imaged to detect the mounting abnormality of the component P. 1 can be reduced in size and cost.

In this embodiment, the component mounting head 10 is a rotary head in which a plurality of suction nozzles 18 are rotatably held on a circumference concentric with the vertical axis AL. In the rotary head, the suction abnormality detection unit 514 can detect the suction abnormality of the component P from the change amount ΔQN of the air flow rate QN, and can detect the suction abnormality of the component P with high accuracy. Further, in the present embodiment, since one flow sensor 100 is provided on the negative pressure source 14a side of the negative pressure branch flow path 14b, it is compared with the case where the flow sensor 100 is provided at each tip 18a of the suction nozzle 18. Thus, the cost of the component mounter 1 can be reduced.

In addition, the mounting abnormality detection unit 515 detects the air on the positive pressure source 14d side from when one suction nozzle 18 of the plurality of suction nozzles 18 mounts the component P to when the next suction nozzle 18 mounts the component P. When the change amount ΔQP of the flow rate QP is less than the predetermined threshold value, it is determined that the component P is abnormally mounted. Therefore, the abnormal component is detected without depending on the air leak state of the suction nozzle 18 having the component P already mounted. can do. Therefore, in the rotary head, the mounting abnormality of the component P can be detected with high accuracy.

(3) Others The present invention is not limited to the embodiment described above and shown in the drawings, and can be implemented with appropriate modifications within a range not departing from the gist. For example, in the present embodiment, the suction abnormality detection unit 514 detects the suction abnormality of the component P using the two side images of the preceding position side image 77a and the subsequent position side image 77b. Can also detect a suction abnormality of the component P using one side image. Further, the suction abnormality detection unit 514 can detect the suction abnormality of the component P using three or more side images.

1: Component mounter,
10: component mounting head,
100, 101: flow sensor,
14a: negative pressure source, 14b: negative pressure branch flow path,
14d: positive pressure source, 14e: positive pressure branch flow path,
18: suction nozzle,
21: Camera for component recognition
514: Absorption abnormality detection unit,
515: Wearing abnormality detection unit

Claims

A component mounting machine comprising a component mounting head having a plurality of suction nozzles for sucking and mounting a plurality of components on a substrate, and a suction abnormality detection unit for detecting a suction abnormality of the component,
The component mounting head has a flow rate sensor that measures a flow rate of air sucked into the negative pressure source on the negative pressure source side of a branch flow path that communicates the negative pressure source with each of the suction nozzles.
In the suction abnormality detection unit, the amount of change in the air flow rate from when one suction nozzle of the plurality of suction nozzles picks up a component until the next suction nozzle picks up the component exceeds a predetermined threshold. A component mounter characterized in that it is sometimes determined that the adsorption is abnormal.
Further comprising a component recognition camera that images each of the components sucked at the tip portions of the plurality of suction nozzles,
The component mounting machine according to claim 1, wherein the suction abnormality detection unit determines whether or not the suction abnormality is based on a suction state of the imaged component.
A component mounting machine comprising a component mounting head having a plurality of suction nozzles for sucking and mounting a plurality of components on a substrate, and a mounting abnormality detection unit for detecting mounting abnormality of the component,
The component mounting head has a flow sensor that measures the flow rate of air supplied from the positive pressure source to the positive pressure source side of the branch flow path that communicates the positive pressure source and each of the suction nozzles.
When the amount of change in the air flow from when one suction nozzle of the plurality of suction nozzles mounts a component to when the next suction nozzle mounts the component is less than a predetermined threshold, the mounting abnormality detection unit A component mounter that determines that the mounting abnormality has occurred.
4. The component mounting machine according to claim 1, wherein the component mounting head is a rotary head in which the plurality of suction nozzles are rotatably held on a circumference concentric with an axis.