JP7040001B2 - Manufacturing method of component mounting equipment and mounting board - Google Patents

Description

The present invention relates to a component mounting device for mounting a component to which a nozzle is attracted on a substrate and a method for manufacturing a mounting substrate.

Conventionally, as a form of supplying parts to a parts mounting device that manufactures a mounting board in which parts are mounted on a board, in addition to a form in which parts stored in a carrier tape or the like are automatically supplied by a feeder, an operator puts parts on a nozzle. Is known to be hand-supplied (see, for example, Patent Document 1). In the component mounting device described in Patent Document 1, when a component is manually supplied, the nozzle is moved to a predetermined position in advance, and then the component is kept on standby until the operator manually adsorbs the component. As a result, when a small amount of mounting board such as a prototype is manufactured, it is not necessary to set up a small amount of parts to be mounted only on the prototype in the feeder, and the work efficiency can be improved.

Japanese Unexamined Patent Publication No. 2001-217594

However, in the component mounting device of Patent Document 1, when a plurality of nozzles are mounted on the mounting head at narrow intervals, it is difficult to identify the nozzle to handle the component, or the adjacent nozzle erroneously adsorbs the component. There was a problem that there was a problem, and there was room for further improvement.

Therefore, it is an object of the present invention to provide a component mounting device and a method for manufacturing a mounting board, which can be easily mounted on a substrate by sucking a component to a nozzle by an operator.

The component mounting device of the present invention has a plurality of nozzles for sucking components and mounting them on a substrate, a mounting head having a nozzle elevating mechanism for raising and lowering the plurality of nozzles, and a position where the mounting head is sucked. A component including a mounting head moving mechanism for moving between a mounting position on a board, a mounting control unit for controlling the mounting head and the mounting head moving mechanism, and a supply form of each of a plurality of components mounted on the board. A manual supply form that includes a storage unit for storing data , an operation input unit, and a suction detection unit for detecting whether or not the nozzle is sucking parts, and the parts are manually supplied to the nozzles by an operator. When the set manual component is attracted to the nozzle, the mounting control unit manually moves the mounting head to a predetermined manual suction position where the manual component is attracted to the nozzle, and the manual attachment is performed. The nozzle for sucking parts is lowered to a position lower than other nozzles , an operation is performed by an operator via the operation input unit, and the manual parts are sucked to the nozzle by the suction detection unit. When the above is detected, the mounting control unit raises the nozzle adsorbing the hand-held component .

The method for manufacturing a mounting board of the present invention is a method for manufacturing a mounting board by a component mounting device having a plurality of nozzles for sucking components and mounting them on the board and having a mounting head capable of raising and lowering the plurality of nozzles. Then, the component data including the supply form of each of the plurality of components to be mounted on the board is acquired, and the manual component for which the manual supply form for supplying the component to the nozzle is manually attracted to the nozzle. In this case, the mounting head is moved to a predetermined manual suction position where the manual component is attracted to the nozzle by the operator's hand, the nozzle for sucking the manual component is lowered to a position lower than the other nozzles, and operation input is performed. When an operation is performed by an operator through the unit and the suction detection unit detects that the hand-held component is sucked on the nozzle, the nozzle sucking the hand-held component is raised to raise the nozzle. The mounting head mounts the hand-held component on the board.

According to the present invention, the component can be easily attached to the nozzle by the operator and mounted on the substrate.

The plan view which shows the structure of the component mounting apparatus of one Embodiment of this invention. Configuration explanatory view of the component mounting apparatus of one embodiment of the present invention Schematic diagram of the structure of the tray feeder mounted on the component mounting device according to the embodiment of the present invention. A block diagram showing a configuration of a control system of a component mounting device according to an embodiment of the present invention. Explanatory drawing of manual component selection screen displayed on touch panel of component mounting apparatus of one Embodiment of this invention (A) (b) Process explanatory view of manual supply processing in the component mounting apparatus according to the embodiment of the present invention. Explanatory drawing of the component manual processing screen displayed on the touch panel of the component mounting apparatus according to the embodiment of the present invention. A flow chart of a method for manufacturing a mounting board in a component mounting device according to an embodiment of the present invention. Flow diagram of manual supply processing in the component mounting apparatus according to the embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting device. In the following, the corresponding elements are designated by the same reference numerals in all the drawings, and duplicate description will be omitted. In FIG. 1 and a part described later, as biaxial directions orthogonal to each other in the horizontal plane, the X direction of the substrate transport direction (horizontal direction in FIG. 1) and the Y direction orthogonal to the substrate transport direction (vertical direction in FIG. 1). Is shown. In FIG. 2 and a part described later, the Z direction (vertical direction in FIG. 2) is shown as a height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting device is installed on a horizontal plane.

First, the configuration of the component mounting device 1 will be described with reference to FIGS. 1 and 2. In FIG. 1, a substrate transfer mechanism 2 is installed in the X direction at the center of the base 1a. The board transport mechanism 2 transports the board 3 carried in from the upstream side in the X direction, positions it at the mounting work position by the mounting head described below, and holds it. Further, the board transfer mechanism 2 carries out the board 3 for which the component mounting work has been completed to the downstream side. A component supply unit 4A and a component supply unit 4B are installed on both sides of the board transfer mechanism 2.

A plurality of tape feeders 5 are mounted in parallel in the X direction on the component supply unit 4A and the component supply unit 4B, respectively. In the tape feeder 5, the mounting head 10 is a component by feeding the carrier tape having a pocket for storing the component from the outside of the component supply units 4A and 4B in the direction toward the substrate transfer mechanism 2 (tape feed direction). The parts are supplied to the parts take-out position to be picked up. Further, a tray feeder 7 for supplying a tray 6 for aligning and holding the component D to the component take-out position is mounted on the component supply unit 4A on the front side (lower side in FIG. 1).

The tray feeder 7 may also be mounted on the rear component supply unit 4B. Further, only the tray feeder 7 may be attached to the parts supply unit 4A and the parts supply unit 4B. That is, the component supply unit 4A and the component supply unit 4B can be freely combined and mounted with a tape feeder 5 and a tray feeder 7 that automatically supply the component D according to a command from the component mounting device 1. can. Hereinafter, for convenience, the parts supply unit 4A and the parts supply unit 4B are simply referred to as "parts supply unit 4" unless it is necessary to distinguish them.

In FIG. 1, a Y-axis table 8 provided with a linear drive mechanism is arranged at both ends in the X direction on the upper surface of the base 1a. A beam 9 also provided with a linear mechanism is movably coupled to the Y-axis table 8 in the Y direction. A mounting head 10 is mounted on the beam 9 so as to be movable in the X direction. The mounting head 10 includes a plurality of (here, eight) mounting units 10a.

In FIG. 2, a nozzle 10b that vacuum-sucks and holds the component D is mounted on the lower end of each mounting unit 10a. Each mounting unit 10a includes a nozzle elevating mechanism 10c that elevates and elevates the nozzle 10b. As a result, the mounting head 10 can move the nozzle 10b up and down individually. Further, the mounting head 10 is provided with a nozzle rotation mechanism (not shown) for rotating the nozzle 10b with the nozzle shaft in the Z direction as a rotation axis.

Further, each mounting unit 10a is provided with a suction valve 10d for turning on / off the vacuum suction of the mounted nozzle 10b. As a result, the mounting head 10 can individually evacuate the nozzles 10b. Further, each mounting unit 10a is attracted by a vacuum sensor or a flow rate sensor that detects whether or not the nozzle 10b is adsorbing the component D by the vacuum pressure in the nozzle 10b or the flow rate of the air in the nozzle 10b. It is provided with a detection unit 10e. That is, the mounting head 10 includes a suction detecting unit 10e.

In FIG. 1, the Y-axis table 8 and the beam 9 constitute a mounting head moving mechanism 11 that moves the mounting head 10 in the horizontal direction (X direction, Y direction). The mounting head moving mechanism 11 and the mounting head 10 pick up the component D from the component take-out positions of the tape feeder 5 and the tray feeder 7 mounted on the component supply unit 4 by the nozzle 10b, and hold the component D in the substrate transport mechanism 2. The component mounting work of transferring to the mounting position of the board 3 and mounting is executed.

In the component mounting work, the mounting head 10 moves above the component supply unit 4, picks up a predetermined component D by each nozzle 10b, moves above the substrate 3, and picks up the component D held by each nozzle 10b. A series of mounting turns are repeated in which the components are mounted at the mounting positions of the above and returned to a predetermined position (for example, above the component supply unit 4). As described above, the mounting head 10 has a plurality of nozzles 10b that attract the component D and mount the component D on the substrate 3, and a nozzle raising / lowering mechanism 10c that raises and lowers the plurality of nozzles 10b, respectively. Then, the mounting head moving mechanism 11 moves the mounting head 10 between the position where the component D is attracted and the position where the mounting head 10 is mounted on the substrate 3.

In FIG. 1, the beam 9 is equipped with a head camera 12 that is located on the lower surface side of the beam 9 and moves integrally with the mounting head 10. When the mounting head 10 moves, the head camera 12 moves above the board 3 positioned at the mounting work position of the board transport mechanism 2 and captures a board mark (not shown) provided on the board 3. Recognizes the position of the substrate 3.

A component recognition camera 13 and a disposal section 14 are installed between the component supply unit 4A and the board transfer mechanism 2. When the mounting head 10 from which the component D is taken out from the component supply unit 4 moves above the component recognition camera 13, the component recognition camera 13 captures the component D held by the nozzle 10b and recognizes the shape. That is, the component recognition camera 13 is a recognition unit that recognizes the shape of the component D that is attracted to the nozzle 10b. In the component mounting work of the component D on the substrate 3 by the mounting head 10, the mounting position is corrected in consideration of the recognition result of the substrate 3 by the head camera 12 and the recognition result of the component D by the component recognition camera 13. Among the parts D held by the mounting head 10, the parts D that are not mounted on the substrate 3 due to poor holding state such as standing suction are discarded in the disposal unit 14.

In FIG. 1, touch panels 15 as operation input units operated by the operator are installed at positions where the operator works on both sides of the component mounting device 1. The touch panel 15 displays various information on the display unit, and an operator performs data input and operation of the component mounting device 1 by using an operation button or the like displayed on the display unit.

In FIG. 2, a dolly 16 is coupled to the parts supply unit 4A. A plurality of tape feeders 5 are attached side by side in the X direction to the feeder base 16a provided on the upper portion of the carriage 16. An address for specifying the mounting position of the tape feeder 5 is set in the feeder base 16a. A reel 18 around which a carrier tape 17 for accommodating a component D is wound is held on the front side of the carriage 16. The tape feeder 5 conveys the carrier tape 17 stored in the reel 18 in the tape feed direction and supplies the component D to the component take-out position by the mounting head 10. An openable and closable safety cover 19 is installed above the trolley 16 to protect the operator from touching a movable mechanism such as a mounting head 10 during component mounting work.

Next, the configuration of the tray feeder 7 will be described with reference to FIG. A feeder main body 21 is provided on the upper surface of the base 20. The feeder main body 21 is provided with a plurality of pallet storage shelves 22 in multiple upper and lower stages. Each pallet storage shelf 22 stores a pallet 23 that holds the tray 6 on the upper surface. A shelf number for specifying a storage position of the tray 6 is set in each pallet storage shelf 22. On the rear side (part mounting device 1 side) of the feeder main body portion 21, a holding portion elevating mechanism 25 for raising and lowering the pallet holding portion 24 and the pallet holding portion 24 is provided.

The holding portion elevating mechanism 25 raises and lowers the pallet holding portion 24 so as to be positioned at the height position of each pallet storage shelf 22. The pallet holding unit 24 pulls out the pallet 23 from the pallet storage shelf 22 and holds it in a state of being located at the height position of the pallet storage shelf 22, or stores the pallet 23 to be held in the pallet storage shelf 22. Further, the holding unit elevating mechanism 25 raises and lowers the pallet holding unit 24 that holds the pallet 23, and positions the component D stored in the tray 6 by the mounting head 10 at a component taking-out position. The movement operation of the pallet 23 in the tray feeder 7 is controlled by the feeder control unit 26 included in the tray feeder 7.

Next, the configuration of the control system of the component mounting device 1 will be described with reference to FIG. The board transfer mechanism 2, the component supply units 4A and 4B, the mounting head 10, the mounting head moving mechanism 11, the head camera 12, the component recognition camera 13, and the touch panel 15 are connected to the control unit 30 included in the component mounting device 1. .. The control unit 30 includes a mounting data storage unit 31, a component data update unit 32, a mounting control unit 33, and a component supply device management unit 34.

In FIG. 4, the mounting data storage unit 31 is a storage device, and component data 31a, production data 31b, array data 31c, and the like are stored as mounting data referred to when the component D is mounted on the substrate 3. In the part data 31a, for each part D, the part name (type), size, shape, type of the corresponding nozzle 10b, presence / absence of directionality, and if there is directionality, the position of the direction mark with respect to the outer shape of the part D, etc. In addition to the direction information of, the supply form of the component D, which will be described later, is included.

The supply form of the component D included in the component data 31a includes a device supply form and a manual supply form. In the device supply mode, the mounting head 10 controlled by the mounting control unit 33 sucks the component D supplied by the component supply device (tape feeder 5, tray feeder 7) mounted on the component supply unit 4 by the nozzle 10b. In the manual supply mode, the worker manually sucks and supplies the component D to the nozzle 10b provided in the mounting head 10.

In FIG. 4, the production data 31b includes the component name (type), mounting position (XY coordinates), and mounting angle (nozzle 10b at the time of mounting) of the component D mounted on the board 3 for each type of mounted board to be produced. Rotation angle) etc. are included. In the arrangement data 31c, information (part name) that identifies a plurality of parts D supplied by the parts supply unit 4 at the arrangement position of the parts D in the parts supply unit 4 (address of the tape feeder 5, shelf number of the tray feeder 7). , Part serial number, etc.) are associated and stored.

The mounting data including the component data 31a, the production data 31b, and the arrangement data 31c is created by a host computer (not shown) connected to the component mounting device 1 in advance based on the production plan, the configuration of the component mounting device 1, and the like. It is transferred to the component mounting device 1 and stored in the mounting data storage unit 31.

In FIG. 4, the component data update unit 32 performs a component data update process for updating the component data 31a stored in the mounting data storage unit 31 by changing the supply form of the component D to a manual supply form or a device supply form. Let it run. In the component data update process, the component data update unit 32 displays a manual component selection screen for the operator to select a supply form on the touch panel 15, and updates the component data 31a based on the input information on the manual component selection screen. do.

Here, an example of the hand-operated component selection screen 40 displayed on the display unit of the touch panel 15 will be described with reference to FIG. On the manual component selection screen 40, a "board name" input field 41, a "part name" display field 42, a "manual flag" input field 43, a scroll bar 44, and a "registration" button 45 are displayed. In the "board name" input field 41, the type (board name) of the mounting board to be manufactured is input. In the "part name" display field 42, a part name that specifies the part D to be mounted on the board 3 is displayed. In the example of FIG. 5, the part names are displayed side by side in the "part name" display field 42.

In the "manual flag" input field 43, it is specified whether the supply form of the component D is the manual supply form (input "1") or the device supply form (input "blank"). When the scroll bar 44 is operated, the display of the "part name" display field 42 and the "manual flag" input field 43 moves up and down. When the "register" button 45 is operated, the supply form included in the component data 31a is updated based on the information input on the manual component selection screen 40. Hereinafter, the component D for which the manual supply form is set in the component data 31a is referred to as a “manual component Dh”.

In FIG. 4, the mounting control unit 33 controls each unit including the mounting head 10 and the mounting head moving mechanism 11 based on the component data 31a, the production data 31b, and the arrangement data 31c stored in the mounting data storage unit 31. , Perform component mounting work. Further, the mounting control unit 33 executes a manual supply process when the component D (manual component Dh) whose supply form included in the component data 31a is a manual supply form is mounted on the substrate 3.

Here, the manual supply process will be described with reference to FIGS. 6 and 7. In FIG. 6A, first, the mounting control unit 33 controls the mounting head moving mechanism 11 to move the mounting head 10 to a predetermined manual suction position Ph for sucking the manual component Dh to the nozzle 10b by the operator's hand. Let (arrow a). For example, the manual suction position Ph is set to a position where the operator can easily access the nozzle 10b mounted on the mounting head 10 from the front surface of the component mounting device 1 on which the touch panel 15 is installed.

After moving the mounting head 10 to the manual suction position Ph, the mounting control unit 33 controls the mounting head moving mechanism 11 to restrict the movement of the mounting head 10 by the mounting head moving mechanism 11. As a result, it is possible to prevent the mounting head 10 from moving when the operator manually attaches the manual component Dh to the nozzle 10b.

Next, the mounting control unit 33 controls the nozzle elevating mechanism 10c of the mounting unit 10a to lower the nozzle 10b for sucking the hand-mounted component Dh to a position lower than the other nozzles 10b (arrow b). Next, the mounting control unit 33 controls the suction valve 10d of the mounting unit 10a to bring the nozzle 10b for sucking the hand-held component Dh into a suction state. In this way, the mounting control unit 33 lowers the nozzle 10b for sucking the hand-mounted component Dh, and then brings the nozzle 10b of the mounting head 10 into a suction state.

In the manual supply process, the mounting control unit 33 may lower the nozzle 10b for sucking the manual component Dh after the nozzle 10b is brought into the suction state. Further, the mounting control unit 33 may put only the nozzle 10b for sucking the hand-held component Dh into the suction state, and may also put the other nozzles 10b into the suction state. That is, in the manual supply process, when the operator manually attaches the manual component Dh to the nozzle 10b, the nozzle 10b for adsorbing the manual component Dh is at a position lower than the other nozzles 10b, and at least the nozzle 10b for adsorbing the manual component Dh. Should be in a suction state. As a result, the operator can easily visually recognize the nozzle 10b that adsorbs the hand-operated part Dh, and it is possible to prevent the hand-operated part Dh from being accidentally adsorbed on another nozzle 10b.

In FIG. 7, when the operator is ready for the component manual operation of manually attaching the manual component Dh to the nozzle 10b, the mounting control unit 33 causes the touch panel 15 near the manual suction position Ph to display the component manual processing screen 50. On the component manual processing screen 50, a first work instruction 51, a work guide frame 52, a second work instruction 53, and an "end" button 54 are displayed. In the first work instruction 51, the work contents until the manual component Dh is manually attached to the nozzle 10b are described in text. Specifically, the safety cover 19 is opened (arrow c in FIG. 6B), and the nozzle 10b descending to a position lower than the other nozzles 10b shown in the work guide frame 52 is manually touched with the hand component Dh. (Arrow d in FIG. 6B) The work content is described.

The work guide frame 52 displays a "nozzle number" display field 55, a "part name" display field 56, a "nozzle position" display area 57, and a "part direction" display area 58. In the "nozzle number" display field 55, the nozzle number of the nozzle 10b for manually mounting the hand-held component Dh is displayed. In the "part name" display field 56, the part name of the hand-operated part Dh is displayed. In the "nozzle position" display area 57, a diagram showing the position of the nozzle 10b of the nozzle number displayed in the "nozzle number" display field 55 in the mounting head 10 is drawn.

In FIG. 7, a diagram showing the component direction when the nozzle 10b is touched is drawn in the “component direction” display area 58. Specifically, the position (part direction) of the direction mark 58a engraved on the upper surface of the hand-operated part Dh is shown based on the direction information included in the part data 31a. In the second work instruction 53, the work content after the manual component Dh is manually attached to the nozzle 10b is described in text. Specifically, the work content of closing the safety cover 19 and operating the "end" button 54 is described. When the "end" button 54 is operated, it is transmitted to the mounting control unit 33 that the component manual work by the operator has been completed.

In FIG. 6B, when the “end” button 54 is operated on the component manual processing screen 50, the mounting control unit 33 attracts the manual component Dh to the suction detection unit 10e of the mounting unit 10a and the nozzle 10b. Whether or not it is detected. When the suction detection unit 10e detects that the hand-held component Dh is sucked on the nozzle 10b, the mounting control unit 33 controls the mounting head 10 and the mounting head moving mechanism 11 to mount the hand-held component Dh on the substrate 3. ..

When the mounting control unit 33 detects that the hand-operated component Dh is not adsorbed on the nozzle 10b by the suction detection unit 10e, the touch panel 15 displays the component manual processing screen 50 again. At that time, the mounting control unit 33 may display on the touch panel 15 that "the hand-operated parts are not normally attracted to the nozzles".

Further, when the shape of the hand-operated component Dh adsorbed on the nozzle 10b recognized by the component recognition camera 13 (recognition unit) and the shape of the hand-held component Dh included in the component data 31a match, the mounting control unit 33 performs manual operation. The component Dh may be mounted on the substrate 3. As a result, it is possible to prevent the operator from erroneously attaching a component D different from the designated manually attached component Dh to the nozzle 10b and mounting it on the substrate 3. The recognition unit is not limited to the component recognition camera 13, and it is sufficient if the shape of the hand-mounted component Dh can be grasped. For example, a laser sensor that recognizes the shape by irradiating a laser beam in the side surface direction of the hand-held component Dh may be used.

In FIG. 4, the component supply device management unit 34 determines the remaining number of components D supplied by the component supply device (tape feeder 5, tray feeder 7) mounted on the component supply unit 4 during component mounting work. Investigate and manage the condition of parts supply equipment. Then, when the remaining number of parts D becomes less than or equal to a predetermined number or when the parts supply device is removed, the touch panel 15 displays a parts supply instruction and a parts supply device installation instruction. Further, the component supply device management unit 34 supplies the component D (manual component Dh) when the component D (manipulated component Dh) whose supply form included in the component data 31a is the manual supply form is mounted on the substrate 3. The management of the state of the parts supply device to be performed is omitted. In other words, the component D (manual component Dh) in the manual supply form does not manage the arrangement position of the component supply device and the remaining number of the components D.

That is, when the manual component Dh is mounted on the substrate 3, even if the arrangement position of the component supply device for supplying the manual component Dh is specified in the arrangement data 31c, the state of the component supply device is not investigated. As a result, even if the component supply device of the manual component Dh specified in the array data 31c is out of parts or is not mounted at the specified arrangement position, the array data such as deleting the manual component Dh from the array data 31c is deleted. The component mounting work can be continued without modifying 31c.

Next, a method of manufacturing a mounting board by the component mounting device 1 will be described along with the flow of FIG. First, the component data 31a, the production data 31b, and the arrangement data 31c necessary for manufacturing the mounting board are acquired from the mounting data storage unit 31 (ST1). Next, the component data update unit 32 displays the manual component selection screen 40 on the touch panel 15, and the operator selects the manual component Dh (ST2). That is, in the component data 31a, the supply form of the component D is changed to the manual supply form or the device supply form and updated.

Next, the mounting control unit 33 controls the board transfer mechanism 2 to transfer the board 3 to the mounting work position (ST3). Next, the mounting control unit 33 determines whether the supply form of the component D to be mounted on the substrate 3 is the manual supply form or the device supply form in the mounting turn (ST4: supply form determination step). When the component D (manual component Dh) in the manual supply form is mounted on the substrate 3 (Yes in ST4), the mounting control unit 33 executes the manual supply process (ST5: manual supply process). When the manual component Dh is attracted to the nozzle 10b by the manual supply processing step (ST5), the mounting control unit 33 controls the mounting head 10 and the mounting head moving mechanism 11 to attract the component D (the component D) to which the nozzle 10b is attracted. The manual component Dh) is mounted at the mounting position of the substrate 3 (ST6: component mounting process).

In FIG. 8, when all the components D are not mounted on the board 3 (No in ST7), the process returns to the supply form determination step (ST4) and the next component D is mounted on the board 3. When the component D in the device supply form is mounted on the substrate 3 (No in ST4), the component supply device management unit 34 investigates the state of the component supply device (tape feeder 5, tray feeder 7) such as the remaining number of components D. Execute (ST8). That is, before the nozzle 10b attracts the component D other than the hand-held component Dh, the state of the component supply device is investigated.

As a result of the investigation, when the state of the component supply device is normal (Yes in ST9), the mounting control unit 33 controls the mounting head 10 and the mounting head moving mechanism 11 to transfer the component D supplied by the component supply device to the nozzle 10b. Adsorb. Next, the process proceeds to the component mounting step (ST6), and the component D to which the nozzle 10b is attracted is mounted at the mounting position of the substrate 3. As a result of the inspection, when the state of the component supply device is not normal (No in ST9), the mounting control unit 33 notifies the touch panel 15 to that effect (ST11).

In FIG. 8, when all the components D are mounted on the board 3 (Yes in ST7), the mounting control unit 33 controls the board transfer mechanism 2 to carry out the board 3 on which the components D are mounted (ST12). .. Next, if a predetermined number of mounting boards have not been manufactured (No in ST13), the process returns to (ST3), and then the board 3 on which the component D is mounted is carried in. When a predetermined number of mounting boards are manufactured (Yes in ST13), the manufacturing of the mounting boards is terminated.

Next, the details of the manual supply processing step (ST5) will be described with reference to FIG. 6 along the flow of FIG. First, the mounting control unit 33 controls the mounting head moving mechanism 11 to move the mounting head 10 to the manual suction position Ph (ST21) (arrow a in FIG. 6A) to regulate the movement of the mounting head 10. (ST22). Next, the mounting control unit 33 controls the nozzle elevating mechanism 10c to lower the nozzle 10b (target nozzle) for sucking the hand-held component Dh to a position lower than the other nozzles 10b (ST23) (arrow b in FIG. 6A). ). Next, the mounting control unit 33 controls the suction valve 10d to bring the nozzle 10b (target nozzle) for sucking the hand-held component Dh into a suction state (ST24).

Next, the mounting control unit 33 causes the touch panel 15 to display the component manual processing screen 50 (ST25). Next, the operator attaches the manual component Dh to the nozzle 10b while referring to the component manual process screen 50 (ST26) (arrow d in FIG. 6B). Next, when the operator operates the "end" button 54 on the component manual processing screen 50 (Yes in ST27), the mounting control unit 33 causes the suction detection unit 10e to inspect whether or not the nozzle 10b is sucking the manual component Dh. (ST28). When the nozzle 10b does not adsorb the hand-held component Dh (No in ST28), the process returns to (ST25) to reattach the hand-held component Dh, and the component manual processing screen 50 is displayed on the touch panel 15.

In FIG. 9, when the nozzle 10b is sucking the manual component Dh (Yes in ST28), the mounting control unit 33 controls the nozzle elevating mechanism 10c to suck the manual component Dh (target nozzle). To the original height (ST29). Next, the mounting control unit 33 controls the mounting head moving mechanism 11 to move the nozzle 10b adsorbing the hand-held component Dh above the component recognition camera 13, and attracts the nozzle 10b to the nozzle 10b by the component recognition camera 13 (recognition unit). The shape of the hand-held component Dh is recognized (ST30).

If the shape of the manual component Dh attracted to the nozzle 10b and the shape of the manual component Dh included in the component data 31a do not match (No in ST31), the process returns to (ST21) and the mounting head 10 is moved to the manual suction position Ph. After moving, the operator performs a procedure such as replacement of the manual component Dh. The mounting head 10 may be moved to the manual suction position Ph after disposing of the erroneous component D adsorbed on the nozzle 10b to the disposal unit 14. When the shape of the manual component Dh adsorbed on the nozzle 10b and the shape of the manual component Dh included in the component data 31a match (Yes in ST31), the manual supply processing step (ST5) is completed and the manual component Dh is released. It is mounted on the substrate 3 (ST6).

As described above, in the mounting substrate manufacturing method of the present embodiment, the component data 31a including the supply form of the component D is acquired (ST1), and the manual component Dh for which the manual supply form is set is attracted to the nozzle 10b. In the case (Yes in ST4), the mounting head 10 is moved to the manual suction position Ph (ST21), the nozzle 10b for sucking the manual component Dh is lowered to a position lower than the other nozzles 10b (ST23), and the nozzle 10b is the manual component. When Dh is attracted (Yes in ST28), the mounting head 10 mounts the hand-held component Dh on the substrate 3 (ST6). As a result, the component D can be easily attracted to the nozzle 10b by the operator and mounted on the substrate 3.

As described above, the component mounting device 1 of the present embodiment includes a mounting head 10 having a plurality of nozzles 10b, a nozzle raising / lowering mechanism 10c, a mounting head moving mechanism 11 for moving the mounting head 10, and a mounting head 10. A mounting control unit 33 that controls the mounting head moving mechanism 11 and a storage unit (mounting data storage unit 31) that stores component data 31a including a supply form of the component D are provided. Then, when the manual component Dh for which the manual supply form is set is attracted to the nozzle 10b, the mounting control unit 33 moves the mounting head 10 to the manual suction position Ph, and another nozzle 10b for sucking the manual component Dh. It is lowered to a position lower than the nozzle 10b of. As a result, the component D can be easily attracted to the nozzle 10b by the operator and mounted on the substrate 3.

The above description has been made based on the embodiment of the present invention. It will be understood by those skilled in the art that this embodiment allows various modifications to the combination of each of these components and each processing process, and that such modifications are also within the scope of the present invention.

In the above description, as a method of selecting the manual component Dh, an example of designating the manual component Dh by using the manual component selection screen 40 capable of inputting a manual flag for a plurality of component D mounted on the target board 3 has been described. The selection method is not limited to this. For example, the component data 31a including the manual flag may be created in advance and read into the mounting data storage unit 31.

The method for manufacturing a component mounting device and a mounting board of the present invention has an effect that a component can be easily attracted to a nozzle by an operator and mounted on the substrate, and is useful in the field of mounting the component on the substrate. Is.

1 Parts mounting device 3 Board 10 Mounting head 10b Nozzle 10c Nozzle elevating mechanism 10e Adsorption detection unit 11 Mounting head movement mechanism 13 Parts recognition camera (recognition unit)
D parts Dh Manual parts Ph Manual suction position

Claims (17)

A plurality of nozzles that adsorb parts and mount them on a substrate, and a mounting head having a nozzle elevating mechanism that raises and lowers the plurality of nozzles, respectively.
A mounting head moving mechanism that moves the mounting head between the position where the component is attracted and the position where the component is mounted on the board.
A mounting control unit that controls the mounting head and the mounting head moving mechanism,
A storage unit that stores component data including each supply form of a plurality of components mounted on the board, and a storage unit .
Operation input section and
It is provided with a suction detection unit that detects whether or not the nozzle is suctioning a component .
When the manual component for which the manual supply mode for supplying the component to the nozzle is set by the operator is adsorbed to the nozzle, the mounting control unit sucks the manual component to the nozzle by the operator's hand. The mounting head is moved to a predetermined manual suction position, and the nozzle for sucking the manual component is lowered to a position lower than other nozzles.
When an operation is performed by the operator via the operation input unit and the suction detection unit detects that the hand-held component is sucked on the nozzle, the mounting control unit sucks the hand-held component. A component mounting device that raises the nozzle . The component mounting device according to claim 1, wherein the mounting control unit lowers the nozzle for sucking the hand-mounted component, and then brings the nozzle of the mounting head into a suction state. The component mounting device according to claim 1 or 2, wherein the mounting control unit brings only the nozzle that sucks the hand-held component into a suction state. The component mounting device according to any one of claims 1 to 3, wherein the mounting control unit moves the mounting head to the manual suction position and then restricts the movement of the mounting head by the mounting head moving mechanism. Further provided with a recognition unit that recognizes the shape of the component adsorbed on the nozzle.
Claims 1 to 4 cause the mounting control unit to mount the hand-mounted component on the substrate when the shape of the hand-mounted component adsorbed on the nozzle matches the shape of the hand-mounted component included in the component data. The component mounting device described in any of the above. The mounting head further includes a suction detecting unit that detects whether or not the nozzle is sucking a component.
The component mounting according to any one of claims 1 to 5, wherein the mounting control unit mounts the hand-held component on the substrate when the suction detection unit detects that the hand-held component is sucked on the nozzle. Device. The component mounting device according to claim 6, wherein the adsorption detection unit detects adsorption of components by the vacuum pressure in the nozzle or the flow rate of air in the nozzle. Multiple parts supply equipment that supplies parts,
Further equipped with a parts supply device management unit that manages the state of the parts supply device,
The component mounting device according to any one of claims 1 to 7, wherein the component supply device management unit omits management of a state of the component supply device that supplies the hand-held component. The component mounting according to any one of claims 1 to 8, further comprising a component data update unit that changes the supply form of the component to the manual supply form and updates the component data stored in the storage unit. Device. It is a method of manufacturing a mounting board by a component mounting device having a plurality of nozzles for sucking and mounting components and having a mounting head capable of raising and lowering the plurality of nozzles.
Acquire component data including the supply form of each of the plurality of components to be mounted on the board, and obtain the component data.
When the manual parts for which the manual supply form is set to supply the parts to the nozzle by the operator's hand are adsorbed to the nozzle.
The mounting head is moved to a predetermined manual suction position where the manual component is attracted to the nozzle by the operator's hand.
The nozzle for sucking the hand-held component is lowered to a position lower than the other nozzles, and the nozzle is lowered.
When an operator operates via the operation input unit and the suction detection unit detects that the hand-held component is sucked on the nozzle, the nozzle sucking the hand-held component is raised. ,
The mounting head is a method for manufacturing a mounting board, in which the hand-mounted component is mounted on the board. The method for manufacturing a mounting substrate according to claim 10, wherein the nozzle for sucking the hand-held component is lowered and then the nozzle of the mounting head is brought into a suction state. The method for manufacturing a mounting substrate according to claim 10 or 11, wherein after the mounting head is moved to the manual suction position, only the nozzle that sucks the manual component is brought into a suction state. The method for manufacturing a mounting substrate according to any one of claims 10 to 12, wherein the mounting head is moved to the manual suction position and then the movement of the mounting head is restricted. After the hand-operated part is adsorbed on the nozzle, the shape of the hand-operated part adsorbed on the nozzle is recognized.
13. Manufacturing method of mounting board. After the operator sucks the hand-held part on the nozzle, the operator inspects whether or not the nozzle sucks the hand-held part.
The method for manufacturing a mounting board according to any one of claims 10 to 14, wherein when it is detected that the nozzle is sucking the hand-held component, the mounting head mounts the hand-held component on the board. The component mounting device further includes a plurality of component supply devices for supplying components.
Before the nozzle sucks parts other than the parts to be manually installed, the condition of the parts supply device is investigated.
The method for manufacturing a mounting substrate according to any one of claims 10 to 15, wherein the investigation of the state of the component supply device is omitted before the nozzle sucks the hand-mounted component. The method for manufacturing a mounting board according to any one of claims 10 to 16, wherein after acquiring the component data, the supply form of the component is changed to the manual supply form and updated.

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