JP2019117819A - Component mounting device and manufacturing method of mounting substrate - Google Patents

Abstract

To provide a component mounting device and a manufacturing method of a mounting substrate that can easily mount a component on a substrate by allowing a component to be easily adsorbed to a nozzle by a worker's hand.SOLUTION: A component mounting device 1 includes a plurality of nozzles 10b, a mounting head 10 having a nozzle lifting mechanism 10c, a mounting head moving mechanism that moves the mounting head 10, a mounting control unit that controls the mounting head 10 and the mounting head moving mechanism, and a mounting data storage unit that stores component data including a supply mode of a component. Then, when a hand-held component Dh for which the manual supply mode is set is sucked to the nozzle 10b, the mounting control unit moves the mounting head 10 to the hand-held suction position Ph (arrow a) and lowers the nozzle 10b that is caused to suck the hand-held component Dh a position lower than the other nozzles 10b (arrow b).SELECTED DRAWING: Figure 6

Description

  The present invention relates to a component mounting apparatus for mounting a component to be adsorbed by a nozzle on a substrate, and a method of manufacturing the mounting substrate.

  Conventionally, as a form of supply of parts to a component mounting apparatus that manufactures a mounting substrate in which parts are mounted on a substrate, in addition to a form of automatically supplying a component stored in a carrier tape or the like by a feeder, The form supplied by hand is known (for example, refer patent document 1). In the component mounting apparatus described in Patent Document 1, when the components are manually supplied, the nozzle is moved to a predetermined position in advance, and then the operator waits until the components are manually adsorbed. As a result, when manufacturing a small amount of mounting substrate such as a prototype, it is not necessary to set up a small number of components to be mounted only on the prototype on the feeder, and work efficiency can be improved.

JP 2001-217594 A

  However, in the component mounting apparatus of Patent Document 1, when a plurality of nozzles are attached to the mounting head at narrow intervals, it is difficult to identify the nozzle for manually attaching a component, or the adjacent nozzle suctions the component by mistake. And there was room for further improvement.

  Therefore, an object of the present invention is to provide a component mounting apparatus and a method for manufacturing a mounting substrate, which can easily mount components on a substrate by allowing a component to be easily adsorbed to a nozzle by an operator's hand.

  The component mounting apparatus according to the present invention comprises a plurality of nozzles for suctioning components and mounting them on a substrate, a mounting head having a nozzle elevating mechanism for respectively lifting and lowering the plurality of nozzles, and a position for suctioning the components. A component including a mounting head moving mechanism for moving between mounting positions on a substrate, a mounting control unit controlling the mounting head and the mounting head moving mechanism, and supply forms of a plurality of components mounted on the substrate The mounting control unit includes a storage unit for storing data, and the manual control unit is configured to, when suctioning a hand-held component for which a manual supply form for supplying a component to the nozzle is set by the operator's hand, to the nozzle. The mounting head is moved to a predetermined manual suction position where the hand-held component is suctioned to the nozzle, and the nozzle for suctioning the hand-held component is lower than other nozzles. It is lowered to.

  The method for manufacturing a mounting substrate according to the present invention is a method for manufacturing a mounting substrate by a component mounting apparatus including a plurality of mounting heads each having a plurality of nozzles for suctioning components and mounting the components on the substrate The component data including the supply form of each of the plurality of parts to be mounted on the substrate is acquired, and the hand-painted part on which the manual supply form is set is supplied to the nozzle by the operator's hand. In this case, the operator moves the mounting head to a predetermined manual suction position where the hand-held component is sucked by the hand of the operator, and lowers the nozzle for suctioning the manually-painted component to a lower position than the other nozzles. When the user picks up the hand-held component, the mounting head mounts the hand-held component on the substrate.

  According to the present invention, it is possible to easily attach a component to a nozzle by an operator's hand and mount it on a substrate.

The top view which shows the structure of the component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the tray feeder with which the component mounting apparatus of one embodiment of this invention is mounted | worn Block diagram showing a configuration of a control system of a component mounting apparatus according to an embodiment of the present invention Explanatory drawing of the manual attachment component selection screen displayed on the touch panel of the component mounting apparatus of one embodiment of this invention (A) and (b) Process explanatory drawing of the hand-feeding process in the component mounting apparatus of one embodiment of this invention Explanatory drawing of the parts manual attachment processing screen displayed on the touch panel of the components mounting apparatus of one embodiment of this invention. Flow chart of manufacturing method of mounting board in component mounting apparatus according to one embodiment of the present invention Flow chart of manual supply processing in the component mounting apparatus according to one embodiment of the present invention

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configurations, shapes, and the like described below are examples for the purpose of explanation, and can be changed as appropriate according to the specifications of the component mounting apparatus. In the following, the corresponding elements in all the drawings are denoted by the same reference numerals, and redundant description will be omitted. In FIG. 1 and portions to be described later, X directions in the substrate transfer direction (horizontal direction in FIG. 1) and Y directions perpendicular to the substrate transfer direction (vertical direction in FIG. 1) as two axial directions orthogonal to each other in the horizontal plane Is shown. In FIG. 2 and a part described later, the Z direction (vertical direction in FIG. 2) is shown as a height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting device is installed on a horizontal surface.

  First, the configuration of the component mounting apparatus 1 will be described with reference to FIGS. In FIG. 1, a substrate transfer mechanism 2 is installed in the X direction at the center of the base 1 a. The substrate transport mechanism 2 transports the substrate 3 carried in from the upstream side in the X direction, and positions and holds the substrate 3 at the mounting operation position by the mounting head described below. Further, the substrate transfer mechanism 2 unloads the substrate 3 for which the component mounting operation has been completed to the downstream side. A component supply unit 4A and a component supply unit 4B are installed on both sides of the substrate transfer mechanism 2.

  A plurality of tape feeders 5 are mounted in parallel in the X direction on each of the component supply unit 4A and the component supply unit 4B. The tape feeder 5 feeds the carrier tape, in which pockets for storing components are formed, in the direction (tape feeding direction) from the outside of the component supply units 4A and 4B toward the substrate transport mechanism 2 so that the mounting head 10 can Supply the parts to the part removal position to pick up. Further, a tray feeder 7 for supplying the tray 6 for aligning and holding the component D to the component take-out position is attached to the component supply unit 4A on the front side (the lower side in FIG. 1).

  The tray feeder 7 may also be attached to the rear side component supply unit 4B. Further, only the tray feeder 7 may be attached to the component supply unit 4A and the component supply unit 4B. That is, the component supply unit 4A and the component supply unit 4B can be mounted by freely combining the component feeders such as the tape feeder 5 and the tray feeder 7 which automatically supply the component D according to the command from the component mounting apparatus 1. it can. Hereinafter, for the sake of convenience, the component supply unit 4A and the component supply unit 4B will be simply referred to as the "component supply unit 4" unless they need to be distinguished.

  In FIG. 1, a Y-axis table 8 provided with a linear drive mechanism is disposed at both ends in the X direction on the upper surface of the base 1a. A beam 9 similarly provided with a linear mechanism is movably coupled to the Y-axis table 8 in the Y direction. The mounting head 10 is mounted on the beam 9 so as to be movable in the X direction. The mounting head 10 includes a plurality of (here, eight) mounting units 10a.

  In FIG. 2, at the lower end portion of each mounting unit 10a, a nozzle 10b for holding the component D by vacuum suction is mounted. Each mounting unit 10a is provided with a nozzle elevating mechanism 10c that raises and lowers the nozzle 10b. By this, the mounting head 10 can raise and lower the nozzles 10 b individually. Further, the mounting head 10 is provided with a nozzle rotation mechanism (not shown) for rotating the nozzle 10b with the nozzle axis in the Z direction as a rotation axis.

  In addition, each mounting unit 10a is provided with a suction valve 10d that turns on and off vacuum suction of the mounted nozzle 10b. By this, the mounting head 10 can vacuum suction the nozzles 10 b individually. In addition, each mounting unit 10a is an adsorption sensor such as a vacuum sensor or a flow sensor that detects whether the nozzle 10b is adsorbing the component D based on the vacuum pressure in the nozzle 10b or the flow rate of air in the nozzle 10b. The detection unit 10 e is provided. That is, the mounting head 10 includes the suction detection unit 10 e.

  In FIG. 1, the Y-axis table 8 and the beam 9 constitute a mounting head moving mechanism 11 for moving the mounting head 10 in the horizontal direction (X direction, Y direction). The mounting head moving mechanism 11 and the mounting head 10 suck and pick up the component D by the nozzle 10 b from the component take-out position of the tape feeder 5 and the tray feeder 7 mounted on the component supply unit 4 and hold it in the substrate transport mechanism 2 The component mounting operation of transferring and mounting to the mounting position of the printed circuit board 3 is performed.

  In the component mounting operation, the mounting head 10 moves above the component supply unit 4, picks up a predetermined component D by each nozzle 10b, moves above the substrate 3, and moves the component D held by each nozzle 10b. A series of mounting turns of mounting at the mounting position and returning to the predetermined position (for example, above the component supply unit 4) are repeated. As described above, the mounting head 10 has the plurality of nozzles 10 b for adsorbing the component D and mounting them on the substrate 3, and the nozzle lifting mechanism 10 c for lifting and lowering the plurality of nozzles 10 b. Then, the mounting head moving mechanism 11 moves the mounting head 10 between the position at which the component D is adsorbed and the position at which the mounting head 10 is mounted on the substrate 3.

  In FIG. 1, mounted on the beam 9 is a head camera 12 positioned on the lower surface side of the beam 9 and integrally moved with the mounting head 10. As the mounting head 10 moves, the head camera 12 moves above the substrate 3 positioned at the mounting operation position of the substrate transfer mechanism 2 to pick up an image of a substrate mark (not shown) provided on the substrate 3. Thus, the position of the substrate 3 is recognized.

  A component recognition camera 13 and a discarding unit 14 are installed between the component supply unit 4A and the substrate transfer mechanism 2. When the mounting head 10 taking out the component D from the component supply unit 4 moves above the component recognition camera 13, the component recognition camera 13 picks up an image of the component D held by the nozzle 10b to recognize the shape. That is, the component recognition camera 13 is a recognition unit that recognizes the shape of the component D absorbed by the nozzle 10 b. In the component mounting operation of the component D on the substrate 3 by the mounting head 10, the mounting position is corrected in consideration of the recognition result of the substrate 3 by the head camera 12 and the recognition result of the component D by the component recognition camera 13. Among the components D held by the mounting head 10, the discarding unit 14 discards components D that are not attached to the substrate 3 due to a bad holding state such as standing suction.

  In FIG. 1, touch panels 15 operated by a worker are installed at positions where the worker works on both sides of the component mounting apparatus 1. The touch panel 15 displays various information on the display unit, and the operator performs data input and operation of the component mounting apparatus 1 using operation buttons and the like displayed on the display unit.

  In FIG. 2, a carriage 16 is coupled to the component supply unit 4A. A plurality of tape feeders 5 are attached side by side in the X direction to a feeder base 16 a provided at the upper part of the carriage 16. An address for specifying the mounting position of the tape feeder 5 is set in the feeder base 16a. On the front side of the carriage 16 is held a reel 18 around which a carrier tape 17 for storing a part D is wound. The tape feeder 5 conveys the carrier tape 17 stored in the reel 18 in the tape feeding direction, and supplies the component D to the component removal position by the mounting head 10. An openable / closable safety cover 19 is provided above the carriage 16 so as to protect a worker from touching a movable mechanism such as the mounting head 10 during component mounting work.

  Next, the configuration of the tray feeder 7 will be described with reference to FIG. A feeder main body 21 is provided on the upper surface of the base 20. The feeder main body 21 is provided with a plurality of pallet storage shelves 22 in upper and lower stages. Each pallet storage rack 22 stores a pallet 23 for holding the tray 6 on the upper surface. In each pallet storage shelf 22, a shelf number for specifying the storage position of the tray 6 is set. On the rear side (the component mounting device 1 side) of the feeder main body 21, a holding unit elevating mechanism 25 that raises and lowers the pallet holding unit 24 and the pallet holding unit 24 is provided.

  The holding unit lifting mechanism 25 raises and lowers the pallet holding unit 24 and positions the pallet holding unit 22 at the height position of each pallet storage shelf 22. The pallet holding unit 24 pulls out and holds the pallet 23 from the pallet storage rack 22 or stores the pallet 23 to be held in the pallet storage rack 22 while being positioned at the height position of the pallet storage rack 22. In addition, the holding unit lifting mechanism 25 raises and lowers the pallet holding unit 24 holding the pallet 23 and positions the pallet holding unit 24 at a component removal position where the component D stored in the tray 6 is removed by the mounting head 10. The movement operation of the pallet 23 in the tray feeder 7 is controlled by a feeder control unit 26 provided in the tray feeder 7.

  Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. The substrate transport mechanism 2, the component supply units 4A and 4B, the mounting head 10, the mounting head moving mechanism 11, the head camera 12, the component recognition camera 13, and the touch panel 15 are connected to the control unit 30 included in the component mounting apparatus 1. . The control unit 30 includes a mounting data storage unit 31, a component data updating unit 32, a mounting control unit 33, and a component supply device management unit 34.

  In FIG. 4, the mounting data storage unit 31 is a storage device, and component data 31a, production data 31b, array data 31c, etc. are stored as mounting data to be referred to when mounting the component D on the substrate 3. The part data 31a includes, for each part D, the part name (type), the size, the shape, the type of the corresponding nozzle 10b, the presence or absence of directionality, and the position of the direction mark with respect to the outer shape of the part D In addition to the direction information, the supply form of the part D described later is included.

  The supply form of the part D included in the part data 31a includes an apparatus supply form and a manual supply form. In the apparatus supply mode, the mounting head 10 controlled by the mounting control unit 33 sucks the component D supplied by the component supply apparatus (tape feeder 5 and tray feeder 7) mounted on the component supply unit 4 by the nozzle 10b. In the manual supply mode, the worker sucks the component D with the hand of the worker onto the nozzle 10 b provided in the mounting head 10 and supplies the component D.

  In FIG. 4, in the production data 31b, for each type of mounting board to be produced, the part name (type) of the part D to be mounted on the board 3, the mounting position (XY coordinates), the mounting angle (the nozzle 10b at mounting) Rotation angle) etc. are included. Information (part name) for specifying a plurality of parts D supplied by the parts supply unit 4 to the arrangement position of the parts D in the parts supply unit 4 (address of the tape feeder 5 and shelf number of the tray feeder 7) in the array data 31c , Part serial numbers, etc.) are stored in association with each other.

  The mounting data including the component data 31a, the production data 31b, and the array data 31c is created based on the production plan, the configuration of the component mounting device 1, etc. by a host computer (not shown) previously connected to the component mounting device 1. The data is transferred to the component mounting apparatus 1 and stored in the mounting data storage unit 31.

  In FIG. 4, in the component data 31 a stored in the mounting data storage unit 31, the component data update unit 32 changes the supply form of the component D to the manual supply form or the apparatus supply form and updates the component data update process. Run it. In the component data update process, the component data update unit 32 causes the touch panel 15 to display a manual component selection screen for the operator to select a supply form, and updates the component data 31a based on input information on the manual component selection screen. Do.

  Here, with reference to FIG. 5, an example of the manual attachment component selection screen 40 displayed on the display unit of the touch panel 15 will be described. On the manual component selection screen 40, a "board name" input field 41, a "component name" display field 42, a "manual flag" input field 43, a scroll bar 44, and a "register" button 45 are displayed. In the "board name" input field 41, the type (board name) of the mounting board to be manufactured is input. In the “part name” display column 42, a part name for specifying the part D to be mounted on the substrate 3 is displayed. In the example of FIG. 5, in the "part name" display column 42, the part names are displayed in order.

  In the "manual flag" input field 43, it is specified whether the supply form of the part D is a manual supply form (input "1") or an apparatus supply form (input "blank"). When the scroll bar 44 is operated, the display of the "part name" display column 42 and the "hand-held flag" input column 43 moves up and down. When the “register” button 45 is operated, the supply form included in the component data 31 a is updated based on the information input on the manual component selection screen 40. Hereinafter, the component D for which the manual supply form is set in the component data 31 a is referred to as “hand-held component Dh”.

  In FIG. 4, the mounting control unit 33 controls the components including the mounting head 10 and the mounting head moving mechanism 11 based on the component data 31 a, the production data 31 b, and the array data 31 c stored in the mounting data storage unit 31. , To perform part mounting work. Further, when mounting the component D (hand-held component Dh) whose supply form included in the component data 31a is a hand-held supply type on the substrate 3, the mounting control unit 33 executes the manual supply processing.

  Here, the manual supply process will be described with reference to FIGS. 6 and 7. In FIG. 6A, first, the mounting control unit 33 controls the mounting head moving mechanism 11 to move the mounting head 10 to a predetermined manual suction position Ph where the hand of the user holds the hand-held component Dh with the operator's hand. Let it go (arrow a). For example, the manual suction position Ph is set to a position where the operator can easily access the nozzle 10 b mounted on the mounting head 10 from the front surface of the component mounting device 1 on which the touch panel 15 is installed.

  After moving the mounting head 10 to the manual suction position Ph, the mounting control unit 33 controls the mounting head moving mechanism 11 to restrict the movement of the mounting head 10 by the mounting head moving mechanism 11. This can prevent the mounting head 10 from moving when the operator manually attaches the hand-held component Dh to the nozzle 10 b.

  Next, the mounting control unit 33 controls the nozzle lifting mechanism 10c of the mounting unit 10a to lower the nozzle 10b for adsorbing the hand-held component Dh to a lower position than the other nozzles 10b (arrow b). Next, the mounting control unit 33 controls the suction valve 10d of the mounting unit 10a to bring the nozzle 10b for suctioning the hand-held component Dh into a suction state. As described above, the mounting control unit 33 lowers the nozzle 10 b that sucks the hand-held component Dh, and then brings the nozzle 10 b of the mounting head 10 into a suction state.

  In the manual supply process, the mounting control unit 33 may lower the nozzle 10b for adsorbing the hand-held component Dh after the nozzle 10b is in the suction state. Further, the mounting control unit 33 may set the other nozzles 10b in the suction state as well as setting only the nozzles 10b that suction the hand-held component Dh in the suction state. That is, in the manual supply process, when the operator manually attaches the manual part Dh to the nozzle 10b, the nozzle 10b for adsorbing the manual part Dh is at a lower position than the other nozzles 10b, and at least the nozzle 10b for adsorbing the manual part Dh. Should be in a suction state. As a result, the operator can easily visually recognize the nozzle 10b for adsorbing the hand-held component Dh, and it is possible to prevent the manual component Dh from being erroneously adsorbed to the other nozzle 10b.

  In FIG. 7, when the worker prepares for the part manual attachment operation of attaching the manual attachment part Dh to the nozzle 10 b, the mounting control unit 33 causes the touch panel 15 close to the manual suction position Ph to display the part manual attachment processing screen 50. On the component hand-painting processing screen 50, a first work instruction 51, a work guide frame 52, a second work instruction 53, and an "end" button 54 are displayed. In the first work instruction 51, the work content until hand-painting the hand-held component Dh on the nozzle 10b is described in text. Specifically, the safety cover 19 is opened (arrow c in FIG. 6B), and the hand part Dh is manually attached to the nozzle 10b lowered to a position lower than the other nozzles 10b shown in the work guide frame 52 (The arrow d in FIG. 6 (b)) describes the work content.

  In the work guide frame 52, a "nozzle number" display field 55, a "part name" display field 56, a "nozzle position" display area 57, and a "component direction" display area 58 are displayed. In the “nozzle number” display field 55, the nozzle number of the nozzle 10b for manually attaching the hand-held component Dh is displayed. In the "part name" display column 56, the part name of the manual part Dh is displayed. In the “nozzle position” display area 57, a diagram showing the position of the nozzle 10b of the nozzle number displayed in the “nozzle number” display field 55 in the mounting head 10 is drawn.

  In FIG. 7, in the “component direction” display area 58, a diagram showing the component direction when hand-attaching to the nozzle 10b is drawn. Specifically, based on the direction information included in the component data 31a, the position (component direction) of the direction mark 58a imprinted on the upper surface of the hand-held component Dh is shown. The second work instruction 53 describes, in text, the work content after handing on the nozzle 10 b the hand-held part Dh. Specifically, the operation contents for closing the safety cover 19 and operating the “end” button 54 are described. When the “end” button 54 is operated, it is transmitted to the mounting control unit 33 that the worker has finished the component hand-handling operation.

  In FIG. 6B, when the “end” button 54 is operated on the component hand-painted processing screen 50, the mounting control unit 33 causes the suction detection unit 10e of the mounting unit 10a to adsorb the hand-held component Dh to the nozzle 10b. It detects whether or not it is present. When the suction detection unit 10 e detects that the hand-held component Dh is suctioned to the nozzle 10 b, the mounting control unit 33 controls the mounting head 10 and the mounting head moving mechanism 11 to mount the hand-held component Dh on the substrate 3. .

  When the suction detection unit 10 e detects that the hand-held component Dh is not suctioned to the nozzle 10 b, the mounting control unit 33 causes the touch panel 15 to display the component hand-painted processing screen 50 again. At that time, the mounting control unit 33 may cause the touch panel 15 to display that "the manually attached component is not normally adsorbed by the nozzle".

  Further, the mounting control unit 33 determines that the shape of the hand-held component Dh absorbed by the nozzle 10b recognized by the component recognition camera 13 (recognition unit) matches the shape of the hand-held component Dh included in the component data 31a. The component Dh may be mounted on the substrate 3. As a result, it is possible to prevent the component D different from the manually designated component Dh being erroneously designated by the operator from being attached to the substrate 3 by hand attachment to the nozzle 10b. The recognition unit is not limited to the component recognition camera 13 as long as the shape of the hand-held component Dh can be grasped. For example, it may be a laser sensor that recognizes the shape by irradiating a laser beam in the side direction of the manual attachment part Dh.

  In FIG. 4, the component supply apparatus management unit 34 determines the number of remaining parts D supplied by the component supply apparatus (tape feeder 5 and tray feeder 7) mounted on the component supply unit 4 at the time of component mounting work. Investigate and manage the condition of the parts supply device. Then, when the number of remaining parts D becomes equal to or less than a predetermined number or when the component supply device is removed, the touch panel 15 displays a component supply instruction and an attachment instruction of the component supply device. Further, the component supply device management unit 34 supplies the component D (hand-held component Dh) when mounting the component D (hand-held component Dh) in the manual supply format included in the component data 31a on the substrate 3. Management of the state of the component supply device is omitted. In other words, the part D in the manual supply form (manual part Dh) does not manage the arrangement position of the part supply device and the remaining number of parts D.

  That is, when the hand-held component Dh is mounted on the substrate 3, even if the arrangement position of the component supply device for supplying the hand-held component Dh is specified in the array data 31c, the investigation of the state of the component supply device is not performed. As a result, even if the component supply device of the manual component Dh designated by the array data 31c is out of components or is not mounted at the designated arrangement position, array data such as deleting the manual component Dh from the array data 31c The component mounting operation can be continued without correcting 31c.

  Next, according to the flow of FIG. 8, a method of manufacturing a mounting board by the component mounting apparatus 1 will be described. First, the component data 31a, the production data 31b, and the array data 31c necessary for manufacturing the mounting substrate are acquired from the mounting data storage unit 31 (ST1). Next, the part data updating unit 32 displays the hand part selection screen 40 on the touch panel 15, and the operator selects the hand part Dh (ST2). That is, in the part data 31a, the supply form of the part D is changed to the manual supply form or the apparatus supply form and updated.

  Next, the mounting control unit 33 controls the substrate transfer mechanism 2 to transfer the substrate 3 to the mounting operation position (ST3). Next, the mounting control unit 33 determines whether the supply form of the component D to be mounted on the substrate 3 in the mounting turn is a manual supply form or an apparatus supply form (ST4: supply form determination step). When the component D (hand-held component Dh) in the manual supply form is mounted on the substrate 3 (Yes in ST4), the mounting control unit 33 executes the manual supply process (ST5: manual supply processing step). When the hand-held component Dh is attracted to the nozzle 10b in the hand-feeding processing step (ST5), the mounting control unit 33 controls the mounting head 10 and the mounting head moving mechanism 11 to pick up the component D where the nozzle 10b is suctioned (D The hand-held component Dh) is mounted on the mounting position of the substrate 3 (ST6: component mounting process).

  In FIG. 8, when all the components D are not mounted on the substrate 3 (No in ST7), the process returns to the supply form determination step (ST4), and the next component D is mounted on the substrate 3. When the component D of the device supply form is mounted on the substrate 3 (No in ST4), the component supply device management unit 34 investigates the state of the component supply device (tape feeder 5, tray feeder 7) such as the remaining number of components D. Execute (ST8). That is, before the nozzle 10b sucks the component D other than the hand-held component Dh, the investigation of the state of the component supply device is performed.

  As a result of the investigation, when the state of the component supply apparatus is normal (Yes in ST9), the mounting control unit 33 controls the mounting head 10 and the mounting head moving mechanism 11 to supply the component D supplied by the component supply apparatus to the nozzle 10b. Adsorb. Next, the process proceeds to the component mounting step (ST6), and the component D suctioned by the nozzle 10b is mounted at the mounting position of the substrate 3. As a result of the inspection, when the state of the component supply device is not normal (No in ST9), the mounting control unit 33 notifies the touch panel 15 of that effect (ST11).

  In FIG. 8, when all the components D are mounted on the substrate 3 (Yes in ST7), the mounting control unit 33 controls the substrate transfer mechanism 2 to carry out the substrate 3 on which the components D are mounted (ST12). . Next, when a predetermined number of mounting boards are not manufactured (No in ST13), the process returns to (ST3), and the board 3 on which the component D is to be mounted is carried in next. If a predetermined number of mounting boards are manufactured (Yes in ST13), the manufacturing of the mounting boards is completed.

  Next, the details of the hand-feeding process (ST5) will be described with reference to FIG. 6 along the flow of FIG. First, the mounting control unit 33 controls the mounting head moving mechanism 11 to move the mounting head 10 to the manual suction position Ph (ST21) (arrow a in FIG. 6A), and restricts the movement of the mounting head 10. (ST22). Next, the mounting control unit 33 controls the nozzle lifting mechanism 10c to lower the nozzle 10b (target nozzle) for sucking the manually attached component Dh to a lower position than the other nozzles 10b (ST23) (arrow b in FIG. 6A). ). Next, the mounting control unit 33 controls the suction valve 10d to bring the nozzle 10b (target nozzle) for suctioning the manually attached component Dh into a suction state (ST24).

  Next, the mounting control unit 33 causes the touch panel 15 to display the component hand-painting processing screen 50 (ST25). Next, the operator attaches the hand-held part Dh to the nozzle 10b while referring to the part-hand-made process screen 50 (ST26) (arrow d in FIG. 6 (b)). Next, when the operator operates the "end" button 54 on the component hand-painting process screen 50 (Yes in ST27), the mounting control unit 33 causes the suction detection unit 10e to check whether the nozzle 10b sucks the hand-painted component Dh. (ST28). When the nozzle 10b does not adsorb the hand-held component Dh (No in ST28), the process returns to (ST25) to reattach the hand-held component Dh, and the component hand-handling processing screen 50 is displayed on the touch panel 15.

  In FIG. 9, when the nozzle 10b sucks the hand-held component Dh (Yes in ST28), the mounting control unit 33 controls the nozzle lifting mechanism 10c to pick up the nozzle 10b (target nozzle) sucking the hand-held component Dh. Is raised to the original height (ST 29). Next, the mounting control unit 33 controls the mounting head moving mechanism 11 to move the nozzle 10b holding the hand-held component Dh above the component recognition camera 13, and the component recognition camera 13 (recognition unit) sucks the nozzle 10b. The shape of the hand-held part Dh being recognized is recognized (ST30).

  If the shape of the hand-held component Dh absorbed by the nozzle 10b does not match the shape of the hand-held component Dh included in the component data 31a (No in ST31), the process returns to (ST21) and sets the mounting head 10 to the hand-held suction position Ph. After the movement, the operator performs a process such as replacing the hand-painted part Dh. The mounting head 10 may move to the manual suction position Ph after discarding the erroneous component D suctioned to the nozzle 10 b to the discarding unit 14. If the shape of the hand-held component Dh absorbed by the nozzle 10b matches the shape of the hand-held component Dh included in the component data 31a (Yes in ST31), the manual feeding process (ST5) is completed, and the hand-held component Dh is It is mounted on the substrate 3 (ST6).

  As described above, in the method of manufacturing the mounting board according to the present embodiment, the component data 31a including the supply form of the component D is acquired (ST1), and the hand-held part Dh for which the manual supply form is set is adsorbed to the nozzle 10b. In the case (Yes in ST4), the mounting head 10 is moved to the manual suction position Ph (ST21), the nozzle 10b for suctioning the manual attachment component Dh is lowered to a lower position than the other nozzles 10b (ST23), and the nozzle 10b is a manual attachment component When Dh is absorbed (Yes in ST28), the mounting head 10 mounts the hand-held component Dh on the substrate 3 (ST6). As a result, the component D can be easily adsorbed to the nozzle 10 b by the operator's hand and mounted on the substrate 3.

  As described above, the component mounting apparatus 1 according to the present embodiment includes the mounting head 10 having the plurality of nozzles 10 b and the nozzle lifting mechanism 10 c, the mounting head moving mechanism 11 for moving the mounting head 10, and the mounting head 10. And a storage unit (mounting data storage unit 31) for storing component data 31a including a supply mode of the component D. The mounting control unit 33 controls the mounting head moving mechanism 11. Then, when the hand-held component Dh for which the manual supply mode is set is sucked to the nozzle 10b, the mounting control unit 33 moves the mounting head 10 to the hand-held suction position Ph and sucks the nozzle 10b for sucking the hand-held component Dh. Is lowered to a position lower than the nozzle 10b. As a result, the component D can be easily adsorbed to the nozzle 10 b by the operator's hand and mounted on the substrate 3.

  The above has been described based on the embodiment of the present invention. It is understood by those skilled in the art that this embodiment can be modified in various ways in combination of the respective constituent elements and processing processes, and such modifications are also within the scope of the present invention.

  In the above, as an example of the method of selecting the hand-painted part Dh, an example of specifying using a hand-painted part selection screen 40 capable of inputting hand-painted flags for a plurality of parts D mounted on the target substrate 3 has been described. The selection method is not limited to this. For example, the component data 31 a including the hand-made flag may be created in advance and read into the mounting data storage unit 31.

  The component mounting apparatus and the method for manufacturing a mounting substrate according to the present invention have an effect that components can be easily adsorbed to a nozzle by an operator's hand and mounted on a substrate, which is useful in the field of mounting components on a substrate It is.

DESCRIPTION OF SYMBOLS 1 component mounting apparatus 3 board | substrate 10 mounting head 10b nozzle 10c nozzle raising / lowering mechanism 10e adsorption | suction detection part 11 mounting head moving mechanism 13 component recognition camera (recognition part)
D parts Dh hand parts Ph hand-held suction position

Claims (17)

A plurality of nozzles for suctioning components and mounting them on a substrate, and a mounting head having a nozzle elevating mechanism for respectively moving the plurality of nozzles up and down;
A mounting head moving mechanism for moving the mounting head between a position for suctioning a component and a position for mounting on a substrate;
A mounting control unit that controls the mounting head and the mounting head moving mechanism;
A storage unit storing component data including supply forms of the plurality of components mounted on the substrate;
When suctioning a hand-held part whose manual supply form in which parts are supplied to the nozzle by an operator's hand is set to the nozzle, the mounting control unit causes the nozzle to suction the hand-painted part by the operator's hand. A component mounting apparatus, wherein the mounting head is moved to a predetermined manual suction position, and the nozzle for holding the manual component is lowered to a position lower than other nozzles.   The component mounting apparatus according to claim 1, wherein the mounting control unit brings the nozzle of the mounting head into a suction state after lowering the nozzle that sucks the hand-held component.   The component mounting apparatus according to claim 1, wherein the mounting control unit causes only the nozzle that sucks the hand-held component to be in a suction state.   The component mounting apparatus according to any one of claims 1 to 3, wherein the mounting control unit restricts movement of the mounting head by the mounting head moving mechanism after moving the mounting head to the manual suction position. The apparatus further comprises a recognition unit that recognizes the shape of the part attracted to the nozzle.
The mounting control unit causes the hand-held component to be mounted on the substrate when the shape of the hand-held component attracted to the nozzle matches the shape of the hand-held component included in the component data. The component mounting apparatus according to any one of the above. The mounting head further includes an adsorption detection unit that detects whether the nozzle is adsorbing a component,
The component mounting according to any one of claims 1 to 5, wherein the mounting control unit causes the hand-held component to be mounted on the substrate when the suction detection unit detects that the hand-held component is sucked by the nozzle. apparatus.   The component mounting apparatus according to claim 6, wherein the suction detection unit detects suction of a component based on a vacuum pressure in the nozzle or a flow rate of air in the nozzle. A plurality of component supply devices for supplying components;
A component supply device management unit that manages the state of the component supply device;
The component mounting apparatus according to any one of claims 1 to 7, wherein the component supply apparatus management unit omits management of a state of the component supply apparatus that supplies the hand-held component.   The component mounting according to any one of claims 1 to 8, further comprising a component data updating unit for changing and updating the supply form of the component to the manual supply form in the component data stored in the storage unit. apparatus. A method of manufacturing a mounting substrate by a component mounting apparatus, comprising: a plurality of nozzles for suctioning components and mounting them on a substrate; and a mounting head capable of respectively moving up and down the plurality of nozzles.
Acquiring component data including supply forms of each of a plurality of components to be mounted on the substrate;
When suctioning a hand-painted part for which a hand-feed supply mode for supplying parts to the nozzle with the operator's hand is set to the nozzle,
Moving the mounting head to a predetermined manual suction position for suctioning the hand-held component to the nozzle with an operator's hand;
Lowering the nozzle for suctioning the handpiece to a lower position than the other nozzles;
The method for manufacturing a mounting substrate, wherein the mounting head mounts the hand-held component on the substrate when the nozzle sucks the hand-held component.   The method for manufacturing a mounting board according to claim 10, wherein the nozzle of the mounting head is brought into a suction state after lowering the nozzle for suctioning the hand-held component.   The method for manufacturing a mounting substrate according to claim 10, wherein after the mounting head is moved to the manual suction position, only the nozzle for suctioning the hand-held component is brought into a suction state.   The method for manufacturing a mounting board according to any one of claims 10 to 12, wherein movement of the mounting head is restricted after the mounting head is moved to the manual suction position. After the hand-held component is attracted to the nozzle, the shape of the hand-held component attracted to the nozzle is recognized,
14. The hand-held component according to claim 10, wherein the hand-held component is mounted on the substrate when the shape of the hand-held component attracted to the nozzle matches the shape of the hand-held component included in the component data. Method of manufacturing mounting substrate. After the worker causes the nozzle to adsorb the hand-held component, it is checked whether the nozzle is sucking the hand-mounted component or not.
The method for manufacturing a mounting substrate according to any one of claims 10 to 14, wherein when it is detected that the nozzle adsorbs the hand-held component, the mounting head mounts the hand-held component on the substrate. The component mounting apparatus further comprises a plurality of component supply apparatuses for supplying components;
Before the nozzle picks up a component other than a hand-held component, a survey of the condition of the component supply device is performed,
The method for manufacturing a mounting substrate according to any one of claims 10 to 15, wherein the investigation of the state of the component supply device is omitted before the nozzle sucks a hand-held component.   The method for manufacturing a mounting board according to any one of claims 10 to 16, wherein the supply form of the component is changed to the manual supply form and updated after acquiring the component data.

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