WO2024048015A1

WO2024048015A1 - Component mounting device, setup method, and production method

Info

Publication number: WO2024048015A1
Application number: PCT/JP2023/022546
Authority: WO
Inventors: 大樹北澤
Original assignee: パナソニックＩｐマネジメント株式会社
Priority date: 2022-08-31
Filing date: 2023-06-19
Publication date: 2024-03-07

Abstract

Provided is a setup method for a component mounting device that uses a nozzle to suck a component accommodated in a component housing body and mounts same onto a substrate, the setup method comprising detecting a horizontal position of the suction point of the component, moving the nozzle to a position above a height measurement position based on the detected horizontal position, lowering the nozzle, and upon detecting that the tip of the nozzle being lowered has touched a measurement target at the height measurement position, setting a vertical position of the suction point on the basis of the height of the tip of the nozzle at the time when it is detected that the tip of the nozzle being lowered touched the measurement target.

Description

Component mounting equipment, setting method and manufacturing method

The present invention relates to a component mounting device for mounting components on a board, a setting method, and a manufacturing method.

Components housed in component containers such as carrier tapes and trays are supplied to the component mounting apparatus by component supply devices such as tape feeders and tray feeders. The component mounting device uses a nozzle to suck the component supplied by the component supply device at a suction position and mounts the component on the board. By the way, in the process of a parts supply device continuously supplying parts, the supply position of the parts may shift due to machine distortion or stop error, resulting in a suction error in which the nozzle is unable to suction the parts. (For example, see Patent Document 1). Patent Document 1 discloses an automatic recovery operation in which when a suction error occurs, a tape feeder detects the pocket position with a camera while feeding the carrier tape in pitch and corrects the suction position.

Japanese Patent Application Publication No. 2015-211054

However, in the conventional technology including Patent Document 1, although it is possible to automatically correct the positional deviation of parts in the horizontal direction, it is not possible to automatically correct the positional deviation of the parts in the vertical direction. There was room for further improvement in order to accurately measure the adsorption position for adsorption.

Therefore, an object of the present invention is to provide a component mounting apparatus, a setting method, and a manufacturing method that can accurately measure the horizontal and vertical suction positions where a nozzle suctions a component.

The component mounting apparatus of the present invention is a component mounting apparatus that sucks a component housed in a component storage body using a nozzle and mounts it on a board, and includes a horizontal position detection means for detecting the horizontal position of the pickup position of the component. , a nozzle moving means for moving the nozzle above the height measurement position based on the detected horizontal position and lowering the nozzle, and a tip of the descending nozzle comes into contact with the measurement target at the height measurement position. and a vertical position setting unit that sets the vertical position of the suction position based on the height of the tip of the nozzle at the time when contact with the measurement target is detected. Be prepared.

The setting method of the present invention is a setting method for a component mounting apparatus in which components housed in a component storage body are sucked by a nozzle and mounted on a board, and the setting method includes a horizontal position of a pickup position of the component that is detected in a horizontal direction. a position detection step, a height measurement position movement step of moving the nozzle above a height measurement position based on the detected horizontal position, a nozzle lowering step of lowering the nozzle, and a lowering tip of the nozzle. a contact detection step of detecting that the nozzle is in contact with the object to be measured at the height measurement position; and a vertical position setting step of setting the directional position.

According to the present invention, it is possible to accurately measure the horizontal and vertical suction positions where the nozzle suctions parts.

A plan view showing the configuration of main parts of a component mounting apparatus according to an embodiment of the present invention A side view showing the configuration of main parts of a component mounting apparatus according to an embodiment of the present invention (a) An explanatory diagram in which a head camera images a component pitch-fed to a suction position of a tape feeder provided in a component mounting apparatus according to an embodiment of the present invention. (b) An explanatory diagram of the structure of a carrier tape. A block diagram showing the configuration of a control system of a component mounting apparatus according to an embodiment of the present invention A diagram showing an example of an image taken by a head camera of a component supply position of a tape feeder provided in a component mounting apparatus according to an embodiment of the present invention. (a) A diagram showing an example when the component size is large (b) A diagram showing an example when the component size is small Flow diagram of a component mounting method according to an embodiment of the present invention Flow diagram of a suction position teaching method according to an embodiment of the present invention

An embodiment of the present invention will be described in detail below using the drawings. The configuration, shape, etc. described below are examples for explanation, and can be changed as appropriate depending on the specifications of the component mounting apparatus, mounting head, tape feeder, and tray feeder. Hereinafter, corresponding elements in all drawings will be denoted by the same reference numerals, and redundant explanation will be omitted. In FIG. 1 and some parts described later, the two axes orthogonal to each other in the horizontal plane are the X-axis in the substrate transport direction (left-right direction in FIG. 1) and the Y-axis (vertical direction in FIG. 1) perpendicular to the substrate transport direction. shown. In FIG. 2 and a portion to be described later, a Z-axis (vertical direction in FIG. 2) is shown as a height direction perpendicular to the horizontal plane.

First, the configuration of the component mounting apparatus 1 will be explained with reference to FIGS. 1 and 2. The component mounting apparatus 1 has a function of performing a component mounting operation of manufacturing a mounting board by mounting components supplied from a component supply section onto a board. A substrate transport mechanism 3 is arranged at the center of the base 2 along the X axis. The substrate conveyance mechanism 3 carries the substrate B conveyed from upstream to a mounting work position, positions it, and holds it. Further, the board transport mechanism 3 transports the board B on which the component mounting work has been completed downstream.

Component supply units 4 are arranged on both sides of the substrate transport mechanism 3 (in the front-rear direction of the Y-axis). In each component supply section 4, a plurality of tape feeders 5 are arranged along the X axis. Each tape feeder 5 of the component supply section 4 pitch-feeds a carrier tape 19 in which a pocket for accommodating the component D is formed in a direction (tape feeding direction) from the outside of the component supply section 4 toward the board transport mechanism 3. , supplies the component to a component supply position from which the component D is taken out by a mounting head described below. One component supply section 4 is equipped with a tray feeder 6 that supplies a pallet 8 on which trays 7 for arranging and accommodating components D are placed to a component supply position. Hereinafter, the carrier tape 19, tray 7, etc. that accommodate the components D to be supplied to the mounting head will be referred to as a "component storage body."

In FIGS. 1 and 2, a Y-axis table 9 equipped with a linear drive mechanism is arranged along the Y-axis at both ends of the upper surface of the base 2 along the X-axis. A beam 10 similarly equipped with a linear drive mechanism is coupled to the Y-axis table 9 so as to be movable along the Y-axis. Beam 10 is arranged along the X-axis. A mounting head 11 is attached to the beam 10 via a plate 10a so as to be movable along the X-axis. The mounting head 11 includes a plurality of component mounting sections 16. The component mounting section 16 includes a lifting motor 16a that moves the shaft 16b up and down along the Z-axis. A nozzle 17 for sucking and holding the component D is attached to the lower end of the shaft 16b.

The Y-axis table 9 and the beam 10 constitute a head moving mechanism 12 that moves the mounting head 11 along the X-axis and the Y-axis. The head moving mechanism 12 and the mounting head 11 move the components D accommodated in the component storage bodies of the tape feeder 5 and tray feeder 6 disposed in the component supply section 4 to a suction position P using a nozzle 17 attached to the component mounting section 16. A mounting turn is performed in which the board is sucked and taken out and mounted at the mounting position of the board B positioned on the board transport mechanism 3.

In FIGS. 1 and 2, a component recognition camera 13 is arranged between the component supply section 4 and the board transport mechanism 3. When the mounting head 11 that has taken out the component D from the component supply section 4 moves above the component recognition camera 13, the component recognition camera 13 images the component D held by the mounting head 11 and confirms that the component D is being held. Recognize posture. A head camera 14 is attached to the plate 10a to which the mounting head 11 is attached. The head camera 14 moves integrally with the mounting head 11.

As the mounting head 11 moves, the head camera 14 moves above the board B positioned on the board transport mechanism 3, and images the board mark (not shown) provided on the board B to determine the position of the board B. recognize. Further, during suction position teaching in which the nozzle 17 learns the suction position P where the nozzle 17 suctions the component D, the head camera 14 moves above the component supply position of the tape feeder 5 or the tray feeder 6, and takes an image of the component supply position. (See Figure 3(a)). In the component mounting operation on the board B by the mounting head 11, the mounting position is corrected by taking into account the recognition result of the component D by the component recognition camera 13 and the recognition result of the board position by the head camera 14.

In FIG. 1, a touch panel 15 that is operated by a worker is installed at a position in front of the component mounting apparatus 1 where the worker works. The touch panel 15 displays various information on its display, and allows an operator to input data and operate the component mounting apparatus 1 using operation buttons displayed on the display.

In FIG. 2, a cart 18 on which a plurality of tape feeders 5 are mounted in advance is set in the component supply section 4. The cart 18 holds a reel 20 that stores a carrier tape 19 holding the component D in a wound state. The carrier tape 19 pulled out from the reel 20 is pitch-fed by the tape feeder 5 to a component supply position.

Next, with reference to FIG. 3, the structure of the tape feeder 5 near the component supply position and the structure of the carrier tape 19 will be described. FIG. 3A shows a cross section of the tape feeder 5 near the component supply position. FIG. 3(b) shows the carrier tape 19 near the component supply position viewed from above, and the holding member 21 disposed above the tape feeder 5 is not shown.

In FIG. 3B, the base tape 19a of the carrier tape 19 has a concave pocket 19b for accommodating the component D, and a feed hole that engages with a feed pin (not shown) of a sprocket that feeds the carrier tape 19 in pitch. 19c are formed at equal intervals. A cover tape 19d is adhered to the top surface of the pocket 19b in which the component D is stored.

In FIG. 3(a), a holding member 21 is arranged above the tape feeder 5 to guide the carrier tape 19 from above. The holding member 21 is provided with an opening 21a located at the component supply position. The cover tape 19d stuck to the carrier tape 19 is folded back at the edge 21b (peeling part) of the opening 21a in the opposite direction of tape feeding. As a result, the upper part of the pocket 19b on the downstream side (on the right side in FIG. 3) including the component supply position is opened. When taking out the part D from the pocket 19b, the nozzle 17 is moved above the part supply position and raised and lowered to bring the lower end of the nozzle 17 into contact with the suction position P of the part D, and the part D is taken out by vacuum suction.

Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. 4. The component mounting apparatus 1 includes a control device 30, a substrate transport mechanism 3, a tape feeder 5, a tray feeder 6, a mounting head 11, a head moving mechanism 12, a component recognition camera 13, a head camera 14, and a touch panel 15. The control device 30 includes a control storage section 31 , a horizontal position detection processing section 32 , a nozzle movement processing section 33 , a contact detection processing section 34 , a vertical position setting section 35 , a correction value creation section 36 , and a mounting control section 37 . An example of the control device 30 is a computer including a memory and a processor. At least some of the functions of the control device 30 are realized by a processor executing a program stored in a memory.

The control storage unit 31 is a storage device, and stores mounting data 38, component data 39, correction data 40, etc. In the mounting data 38, various information such as the type of component D to be mounted on the board B and the coordinates of the mounting position on the board B are stored for each board type of the mounted board. The component data 39 includes, for each type of component D, the size of the component, the type of component container (carrier tape 19, tray 7, etc.), the suction position P where the nozzle 17 suctions, and the height at the time of suction position teaching. Contains information on the measurement position (offset value), etc. The correction data 40 includes a correction value for correcting the suction position P at which the nozzle 17 suctions the component D, and the like.

In FIG. 4, the mounting head 11 includes a plurality of component mounting sections 16 each including an elevation motor 16a and an elevation control section 16c. The lift control unit 16c controls the lift motor 16a by position control or torque control based on the position (height position) of the shaft 16b in the Z-axis direction detected by the encoder included in the lift motor 16a. In the case of position control, the elevation control section 16c controls the elevation motor 16a so that the height of the shaft 16b (or nozzle 17) becomes a specified height. In the case of torque control, the lift control unit 16c controls the lift motor 16a so that the thrust of the lift motor 16a becomes a specified thrust. Furthermore, in the torque control, the elevation control section 16c controls the load applied to the shaft 16b (or the nozzle 17) so that it does not exceed a predetermined thrust limit value.

The horizontal position detection processing unit 32 controls the head moving mechanism 12 and the head camera 14 during suction position teaching to detect the horizontal position of the suction position P where the nozzle 17 suctions the component D. In the suction position teaching, the horizontal position detection processing unit 32 controls the head moving mechanism 12 based on the component data 39 to move the head camera 14 to the tape feeder 5 or tray feeder to which the component D that the nozzle 17 could not suction is supplied. 6, and the head camera 14 images the component D being supplied to the component supply position.

The suction position teaching is executed when it is determined that a suction error in which the nozzle 17 that took out the component D from the component supply unit 4 does not suction the component D has occurred a predetermined number of times or frequency. A suction error is determined from an image of the nozzle 17 taken by the component recognition camera 13, a measurement result of the flow rate of air sucked by the nozzle 17, and the like.

Here, with reference to FIG. 5, an example of an image captured by the head camera 14 that captures the component supply position of the tape feeder 5 shown in FIG. 3(a) will be described. The horizontal position detection processing unit 32 moves the head camera 14 to a position where the center 14c of the imaging field of view 14a (see FIG. 3(b)) of the head camera 14 is the suction position Ps before correction included in the current correction data 40. move it. In this example, it is assumed that the suction position P of the component D is set at the center Cd of the upper surface of the component D.

In the imaging field of view 14a, a center line 14x in the X-axis direction and a center line 14y in the Y-axis direction are displayed in an overlapping manner. The intersection of the center line 14x in the X-axis direction and the center line 14y in the Y-axis direction is the center 14c of the imaging field of view 14a. The horizontal position detection processing unit 32 performs recognition processing on the captured image and detects the center Cd of the component D as the current suction position Pp of the component D. That is, the head moving mechanism 12, the head camera 14, and the horizontal position detection processing section 32 constitute a horizontal position detection means 41 that detects the horizontal position of the current suction position Pp. Note that instead of recognizing the component D through the recognition process, the horizontal position detection processing unit 32 may recognize the pocket 19b and detect the center of the pocket 19b as the suction position Pp of the component D. Furthermore, the correction value creation unit 36 generates a horizontal correction value (ΔXd , ΔYd).

In FIG. 4, the nozzle movement processing unit 33 controls the head movement mechanism 12 and the mounting head 11 during the suction position teaching, so that the nozzle 17 that failed to suction the component D (hereinafter referred to as the "missed suction nozzle 17S"). ) to the height measurement position. Specifically, the nozzle movement processing unit 33 performs suction based on the horizontal position of the suction position Pp detected by the horizontal position detection means 41 and information (offset value) regarding the height measurement position included in the component data 39. The miss nozzle 17S is moved above the height measurement position. Next, the nozzle movement processing unit 33 lowers the suction error nozzle 17S (shaft 16b) by torque control so that the thrust of the lifting motor 16a does not exceed the estimated limit value. The nozzle movement processing unit 33 stops the lowering of the suction error nozzle 17S when the thrust of the lifting motor 16a reaches the estimated limit value.

In this way, the head moving mechanism 12, the component mounting section 16 having the lifting motor 16a and the lifting control section 16c, and the nozzle movement processing section 33 adjust the height based on the horizontal position of the suction position Pp detected by the horizontal position detecting means 41. A nozzle moving means 42 is configured to move the suction error nozzle 17S (nozzle 17) above the measurement position and lower the suction error nozzle 17S. That is, the nozzle moving means 42 has a shaft 16b to which the nozzle 17 is attached at the lower end, and a lifting motor 16a (motor) that moves the shaft 16b up and down. Note that during suction position teaching, suction by the suction error nozzle 17S is stopped so that the suction error nozzle 17S does not attract the measurement target and interfere with measurement.

Here, with reference to FIG. 6, the relationship between the suction position P and the height measurement position will be described. The height measurement position that is contacted by the suction error nozzle 17S that descends during suction position teaching is set based on at least one of the type of component container (carrier tape 19, tray 7, etc.) or the size of the component. . FIG. 6A shows an example of a component D1 in which the component container is a carrier tape 19 and the component size is large. FIG. 6(b) shows an example of a component D2 in which the type of component container is a carrier tape 19 and the component size is small. The horizontal position of the suction position P is set at the center Cd of the upper surface of both the large component D1 and the small component D2.

In FIG. 6(a), the height measurement position Q1 of the large component D1 is set at the center Cd of the top surface of the component D1, which is the same horizontal position as the suction position P1. In this way, when the size of the component is equal to or larger than the predetermined value, the height measurement position Q1 is set to the horizontal position of the suction position P1. Even when the type of component container is tray 7, the height measurement value is set to the horizontal position of the suction position P1 (the position of the center Cd of the top surface of the component D1). That is, the object to be measured at the height measurement position Q1 is the upper surface of the component D1.

In FIG. 6(b), the height measurement position Q2 of the small component D2 is set at the edge of the pocket 19b in which the component D2 is accommodated. In this example, the height measurement position Q2 is set at a position offset in the X-axis direction from the suction position P2 by an offset value Lx. The offset value Lx is stored in the component data 39 as information regarding the height measurement position Q2. Note that the offset value may be set not in the X-axis direction but in the Y-axis direction, or in three-dimensional directions such as the X-axis direction, the Y-axis direction, and the Z-axis direction.

In this way, when the type of the component storage body is a tape (carrier tape 19) that stores the component D2 in the pocket 19b, and the size of the component is smaller than a predetermined value, the height measurement position Q2 is determined by the suction error nozzle 17S. is set at a position where the tip thereof contacts both the component D2 and the base tape 19a of the carrier tape 19. That is, the objects to be measured at the height measurement position Q2 are the upper surface of the component D2 and the upper surface of the base tape 19a.

If the size of the tip of the suction error nozzle 17S and the size of the top surface of the component D2 are the same or the size of the component is smaller, set the height measurement position Q2 to the center Cd of the top surface of the component D2 and measure the height position. Then, the component D2 may adhere to the tip of the suction error nozzle 17S due to electrostatic force or the like. In such a case, by making the tip of the suction error nozzle 17S contact the top surface of the component D2 and the base tape 19a at the same rate, the contact area between the tip of the suction error nozzle 17S and the component D2 is reduced, and the component D2 can be prevented from adhering to the tip of the suction nozzle 17S. Here, if the entire tip of the suction error nozzle 17S comes into contact with the base tape 19a, it may be difficult to accurately measure the height of the top surface of the component D2 due to deformation of the relatively soft base tape 19a. Therefore, by bringing a part of the tip of the suction error nozzle 17S into contact with the component D2 that is harder than the base tape 19a, it is possible to suppress adhesion of the component D2 and to accurately measure the height position of the upper surface of the component D2. can. Although it has been described above that the tip of the suction error nozzle 17S contacts the top surface of the component D2 and the base tape 19a at the same rate, this rate does not necessarily have to be the same. The above ratio may be set as appropriate so that the component D2 does not adhere to the tip of the suction error nozzle 17S.

In FIG. 4, the contact detection processing unit 34 determines whether the tip of the suction error nozzle 17S has contacted the object to be measured at the height measurement positions Q1 and Q2 based on the thrust (torque) of the lifting motor 16a that is lowering the suction error nozzle 17S. Detect things. Specifically, the contact detection processing unit 34 determines that the suction error nozzle 17S has contacted the measurement target when the thrust of the lifting motor 16a increases to a predetermined determination value or more while the suction error nozzle 17S is descending. In this way, the component mounting section 16 and the contact detection processing section 34, which have the lifting motor 16a and the lifting control section 16c, detect the suction error nozzle that moves downward based on the change in the thrust of the lifting motor 16a (motor) when the shaft 16b is lowered. A contact detection means 43 is configured to detect that the tip of the 17S has contacted the object to be measured at the height measurement positions Q1 and Q2.

The vertical position setting unit 35 determines the height of the tip of the suction error nozzle 17S at the time when contact with the object to be measured at the height measurement positions Q1 and Q2 is detected, and the height measurement positions Q1 and Q2 included in the component data 39. Based on the information (offset value), the vertical position of the suction position Pp is set (calculated).

In FIG. 4, the correction value creation unit 36 uses the horizontal position of the suction position Pp detected by the horizontal position detection means 41 by the suction position teaching and the vertical position of the suction position Pp set by the vertical position setting unit 35. Based on this, correction values (ΔXd, ΔYd, ΔZd) are created to correct the suction position P. The created correction values (ΔXd, ΔYd, ΔZd) are associated with the type of component D whose suction position was taught, the component supply position (position in the component supply section 4 of the tape feeder 5), etc., and are controlled as correction data 40. It is stored in the storage unit 31. That is, the correction data 40 is updated by suction position teaching.

In FIG. 4, the mounting control unit 37 controls each part of the component mounting apparatus 1 based on the mounting data 38 and the component data 39 to remove the component D accommodated in the component container (carrier tape 19, tray 7). The nozzle 17 adsorbs the component at the suction position P, and performs a component mounting operation in which the component is mounted at the mounting position of the board B. The mounting control section 37 includes a suction position correction section 37a as an internal processing section.

The suction position correction unit 37a corrects the suction position P at which the nozzle 17 suctions the component D, based on the correction values (ΔXd, ΔYd, ΔZd) acquired by the suction position teaching included in the correction data 40. That is, the suction position correction section 37a determines the suction position P based on the horizontal position of the suction position Pp detected by the horizontal position detection means 41 and the vertical position of the suction position Pp set by the vertical position setting section 35. This is a suction position correcting means for correcting.

Next, according to the flowcharts of FIGS. 7 and 8, a component mounting method in which the component D accommodated in the component storage body (carrier tape 19, tray 7) is sucked at the suction position P by the nozzle 17 and mounted on the board B. I will explain about it. In the component mounting work, the mounting turn in which the mounting head 11 takes out the component D from the component storage body and mounts it on the board B will be described below, and the process of carrying in the board B, the process of carrying out the board B, etc. will be omitted.

In FIG. 7, first, the suction position correction unit 37a adjusts the position of the component D to be suctioned by each nozzle 17 based on the correction values (ΔXd, ΔYd, ΔZd) included in the correction data 40 of the component D to be suctioned by the nozzle 17 from now on. The suction position P is corrected (ST1: suction position correction step). Next, the mounting control unit 37 controls the head moving mechanism 12 and the mounting head 11 to move the nozzle 17 to the corrected suction position P to suction the component D (ST2: component suction step).

Next, the mounting control unit 37 causes the component recognition camera 13 to take an image of the component D that the nozzle 17 is suctioning, and determines whether the nozzle 17 is holding the component D (ST3: suction error determination step). If a suction error has not occurred (No in ST3), the mounting control unit 37 mounts the component D held by the nozzle 17 at the mounting position of the board B (ST4: component mounting step). If a suction error has occurred (Yes in ST3), suction position teaching is executed (ST5: suction position teaching step).

In FIG. 8, in the suction position teaching step (ST5) (suction position teaching method), the horizontal position detection means 41 first detects the horizontal position of the suction position Pp (ST11: horizontal position detection step). Next, the nozzle moving means 42 moves the suction error nozzle 17S above the height measurement position based on the detected horizontal position and the information (offset value) regarding the height measurement position included in the component data 39 (ST12: height measurement position). measurement position movement process). Next, the nozzle moving means 42 starts lowering the suction error nozzle 17S (shaft 16b) by torque control (ST13: nozzle lowering start step). Next, the contact detection means 43 determines whether the tip of the descending suction error nozzle 17S has contacted the object to be measured at the height measurement position (ST14: contact detection step).

When the contact detection means 43 detects contact with the measurement target (Yes in ST14), the vertical position setting unit 35 determines the height of the tip of the suction error nozzle 17S and the component data 39 at the time when contact with the measurement target is detected. The vertical position of the suction position Pp is set based on the information (offset value) regarding the height measurement position included in (ST15: vertical position setting step). Thereby, the suction position Pp in the horizontal and vertical directions at which the nozzle 17 suctions the component D can be accurately detected.

In FIG. 8, the nozzle moving means 42 then stops the descending of the shaft 16b (ST17) when the thrust of the lifting motor 16a reaches a predetermined thrust limit value (Yes in ST16) when the shaft 16b (suction error nozzle 17S) is descending. : Nozzle lowering stop process). That is, the nozzle lowering start step (ST13) to the nozzle lowering stop step (ST17) is a nozzle lowering step in which the suction error nozzle 17S is lowered.

Next, the nozzle moving means 42 raises the suction error nozzle 17S (shaft 16b) to a predetermined height (standby position) by position control (ST18: nozzle raising step). Next, based on the horizontal position of the suction position Pp detected in the horizontal position detection step (ST11) and the vertical position of the suction position Pp set in the vertical position setting step (ST15), the correction value creation unit 36 performs the following steps. Correction values (ΔXd, ΔYd, ΔZd) for correcting the suction position P are created (ST19: correction value creation step). Next, the correction value creation unit 36 stores the created correction values (ΔXd, ΔYd, ΔZd) in the control storage unit 31 as the correction data 40 (ST20: correction value storage step).

In FIG. 7, when the correction values (ΔXd, ΔYd, ΔZd) are acquired (updated) in the suction position teaching process (ST5), in the subsequent suction position correction process (ST1), new values are acquired (updated) in the suction position teaching process (ST5). The suction position P is corrected based on the correction values (ΔXd, ΔYd, ΔZd) acquired in . Note that the vertical position setting step (ST15) does not need to be completed before the nozzle lowering stop step (ST17), and may be completed before the correction value creation step (ST19).

As described above, the component mounting apparatus 1 of the present embodiment includes the horizontal position detection means 41 that detects the horizontal position of the suction position Pp, and the height measurement positions Q1 and Q2 based on the detected horizontal position. a nozzle moving means 42 for moving the nozzle 17 upward and lowering the nozzle 17; a contact detection means 43 for detecting that the tip of the descending nozzle 17 has contacted the object to be measured at the height measurement positions Q1 and Q2; A vertical position setting unit 35 is provided that sets the vertical position of the suction position Pp based on the height of the tip of the nozzle 17 at the time when contact with the object is detected. Thereby, the suction position P in the horizontal and vertical directions at which the nozzle 17 suctions the component D can be accurately detected. Further, in the manufacturing method of this embodiment, the component D is mounted on the board using the vertical position set above to manufacture a mounting board. Specifically, the vertical position set above is used as the height of the suction position of the component D, and the component D is mounted on the board to manufacture a mounting board. Thereby, mounting errors can be suppressed in manufacturing the mounting board.

Furthermore, another aspect of the component mounting apparatus according to the present embodiment is a component mounting apparatus that attaches components accommodated in a component storage body to a board by sucking them with a nozzle, and includes:
a mounting head to which the nozzle is attached and which lowers the nozzle;
a head moving mechanism that moves the mounting head;
a head camera that is provided on the mounting head and captures an image of the component accommodated in the component storage body;
The mounting head includes the mounting head, the head moving mechanism, and a control device that controls the head camera.

The control device includes:
detecting a horizontal position of a suction position of the component based on an image captured by the head camera;
controlling the head moving mechanism so that the nozzle moves above a measurement position based on the horizontal position of the suction position;
controlling the mounting head so that the nozzle descends;
detecting that the tip of the nozzle has contacted the measurement target at the measurement position;
The vertical position of the suction position is set based on the height of the tip of the nozzle when the tip of the nozzle contacts the measurement target.

With such a configuration as well, it is possible to accurately detect the suction position P in the horizontal and vertical directions at which the nozzle 17 suctions the component D.

INDUSTRIAL APPLICABILITY The component mounting device, setting method, and manufacturing method of the present invention have the effect of being able to accurately measure the horizontal and vertical suction positions where the nozzle attracts components, and are useful in the field of mounting components on a board. Useful.

1 Component mounting device 7 Tray (component storage body)
16a Lifting motor (motor)
16b Shaft 17 Nozzle 19 Carrier tape (components container, tape)
19b Pocket 41 Horizontal position detection means 42 Nozzle moving means 43 Contact detection means B Substrate D, D1, D2 Parts P, P1, P2, Pp, Ps Suction position Q1, Q2 Height measurement position

Claims

A component mounting device that adsorbs components housed in a component storage body with a nozzle and mounts them on a board,
horizontal position detection means for detecting the horizontal position of the suction position of the component;
nozzle moving means for moving the nozzle above a height measurement position based on the detected horizontal position and lowering the nozzle;
contact detection means for detecting that the tip of the descending nozzle has contacted the measurement target at the height measurement position;
A component mounting apparatus, comprising: a vertical position setting unit that sets the vertical position of the suction position based on the height of the tip of the nozzle at the time when contact with the measurement target is detected.
The nozzle moving means includes a shaft to which the nozzle is attached at the lower end, and a motor for raising and lowering the shaft,
2. The component mounting apparatus according to claim 1, wherein the contact detection means detects that the tip of the nozzle has contacted the measurement target based on a change in the thrust of the motor when the shaft is lowered.
3. The component mounting apparatus according to claim 2, wherein the nozzle moving means stops the descending of the shaft when the thrust of the motor reaches a predetermined thrust limit value when the shaft is descending.
The component mounting apparatus according to claim 1, wherein suction by the nozzle is stopped when detecting contact between the tip of the nozzle and the object to be measured.
The component mounting apparatus according to claim 1, wherein the height measurement position is set based on at least one of the type of the component container and the size of the component.
When the type of the component storage body is a tape having a pocket for accommodating the component, and the size of the component is smaller than a predetermined value, the height measurement position is such that the tip of the nozzle is located between the component and the tape. 6. The component mounting apparatus according to claim 5, wherein the component mounting apparatus is set at a position where it contacts both of the base tapes.
6. The component mounting apparatus according to claim 5, wherein when the size of the component is equal to or larger than a predetermined value, the height measurement position is set to a horizontal position of the detected suction position.
The component mounting apparatus according to claim 1, further comprising suction position correction means for correcting the suction position based on the detected horizontal position of the suction position and the set vertical position of the suction position.
If a suction error occurs in which the nozzle cannot suction the components housed in the component storage body,
the horizontal position detection means detects the horizontal position of the suction position;
the nozzle moving means lowers the nozzle at the height measurement position;
When the contact detection means detects that the tip of the nozzle has contacted the measurement object, the vertical position setting section sets the vertical position of the suction position,
9. The component mounting apparatus according to claim 8, wherein the suction position correction means corrects the suction position.
A setting method for a component mounting apparatus that sucks components housed in a component storage body with a nozzle and mounts them on a board, the method comprising:
a horizontal position detection step of detecting the horizontal position of the suction position of the component;
a height measurement position moving step of moving the nozzle above a height measurement position based on the detected horizontal position;
a nozzle lowering step of lowering the nozzle;
a contact detection step of detecting that the tip of the descending nozzle has contacted the measurement target at the height measurement position;
A setting method including a vertical position setting step of setting the vertical position of the suction position based on the height of the tip of the nozzle at the time when contact with the measurement target is detected.
A manufacturing method for manufacturing a mounting board by mounting the component on the board using the vertical position in the setting method according to claim 10.